51st week of 2014 patent applcation highlights part 17 |
Patent application number | Title | Published |
20140367839 | SEMICONDUCTOR PACKAGE - A semiconductor package includes a first semiconductor package, a second semiconductor package, and a package-connecting member. The first semiconductor package includes a first substrate, a chip stacking portion disposed on the first substrate and including a plurality of first semiconductor chips, and a first sealant for surrounding the chip stacking portion on the first substrate. The second semiconductor package includes a second substrate, at least one second semiconductor chip disposed on the second substrate, and a second sealant for surrounding the second semiconductor chip on the second substrate. The package-connecting member electrically connects the first semiconductor package and the second semiconductor package. The plurality of first semiconductor chips include a first chip including through silicon vias (TSVs) and a second chip electrically connected to the first chip via the TSVs, and the chip stacking portion includes an internal sealant for filling a space between the first chip and the second chip and extending to a side of the second chip. | 2014-12-18 |
20140367840 | MOLD CAP FOR SEMICONDUCTOR DEVICE - A semiconductor package has a substrate with a solder mask layer, and upper and lower surfaces. Conductive traces and electrical contacts are formed on the substrate, and vias are formed in the substrate to electrically connect the conductive traces and electrical contacts. A semiconductor die is attached on the upper surface of the substrate. A mold cap is formed on the upper surface of the substrate and covers the die and the conductive traces. The mold cap includes a mold body having clipped corners and extensions that extend from each of the clipped corners. The extensions and clipped corners help prevent package cracking. | 2014-12-18 |
20140367841 | SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS - The present disclosure relates to a semiconductor package structure and semiconductor process. The semiconductor package includes a first substrate, a second substrate, a die, a plurality of interconnection elements and an encapsulation material. Each of the interconnection elements connects the first substrate and the second substrate. The encapsulation material encapsulates the interconnection elements. The encapsulation material defines a plurality of accommodation spaces to accommodate the interconnection elements, and the profile of each accommodation space is defined by the individual interconnection element, whereby the warpage behavior of the first substrate is in compliance with that of the second substrate during reflow. | 2014-12-18 |
20140367842 | POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A power semiconductor element, a high-voltage electrode electrically connected to the power semiconductor element, a heat radiating plate connected to the power semiconductor element and having heat radiation property, a cooling element connected to the heat radiating plate with an insulating film being interposed, and a seal covering the power semiconductor element, a part of the high-voltage electrode, the heat radiating plate, the insulating film, and a part of the cooling element are included. The cooling element includes a base portion of which part is embedded in the seal and a cooling member connected to the base portion. The base portion and the cooling member are separate from each other, and the cooling member is fixed to the base portion exposed through the seal. | 2014-12-18 |
20140367843 | FORMING IN-SITU MICRO-FEATURE STRUCTURES WITH CORELESS PACKAGES - Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, forming dielectric material surrounding the die, forming buildup layers in the dielectric material to form a coreless bumpless buildup package structure, and patterning the carrier material to form microchannel structures on the package structure. | 2014-12-18 |
20140367844 | UNDERFILL-ACCOMMODATING HEAT SPREADERS AND RELATED SEMICONDUCTOR DEVICE ASSEMBLIES AND METHODS - Heat spreaders for dissipating heat from semiconductor devices comprise a contact surface located within a recess on an underside of the heat spreader, the contact surface being configured to physically and thermally attach to a semiconductor device, and a trench extending into the heat spreader adjacent to the contact surface sized and configured to receive underfill material extending from the semiconductor device into the trench. Related semiconductor device assemblies may include these heat spreader and methods may include physically and thermally attaching these heat spreaders to semiconductor devices such that underfill material extends from a semiconductor device into the trench. | 2014-12-18 |
20140367845 | SEMICONDUCTOR DEVICE - Stress relief layers are each provided on each circuit on an insulating substrate in a semiconductor module; a metal base coming into contact with the semiconductor module is divided into a thinned and low stiffened first metal base and a thickened and high stiffened second metal base; and the semiconductor module is bonded to the first metal base and then the first and the second metal bases are bonded to be integrated. | 2014-12-18 |
20140367846 | POWER SEMICONDUCTOR DEVICE - A power semiconductor device includes a plurality of power chips sealed in a package to control power and an IC sealed in the package to control each of the power chips. The IC is disposed at the center part of the package in the plan view. The plurality of power chips are disposed so as to surround the IC in the plan view. | 2014-12-18 |
20140367847 | METHODS FOR ESTABLISHING THERMAL JOINTS BETWEEN HEAT SPREADERS OR LIDS AND HEAT SOURCES - According to various aspects, exemplary embodiments are disclosed of thermal interface materials, electronic devices, and methods for establishing thermal joints between heat spreaders or lids and heat sources. In exemplary embodiments, a method of establishing a thermal joint for conducting heat between a heat spreader and a heat source of an electronic device generally includes positioning a thermal interface material (TIM | 2014-12-18 |
20140367848 | Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer - A semiconductor device has a semiconductor die. The semiconductor die is disposed over a conductive substrate. An encapsulant is deposited over the semiconductor die. A first interconnect structure is formed over the encapsulant. An opening is formed through the substrate to isolate a portion of the substrate electrically connected to the first interconnect structure. A bump is formed over the first interconnect structure. Conductive vias are formed through the encapsulant and electrically connected to the portion of the substrate. A plurality of bumps is formed over the semiconductor die. A first conductive layer is formed over the encapsulant. A first insulating layer is formed over the first conductive layer. A second conductive layer is formed over the first insulating layer and first conductive layer. A second insulating layer is formed over the first insulating layer and second conductive layer. Protrusions extend above the substrate. | 2014-12-18 |
20140367849 | INTERPOSER AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an interposer is provided, including forming a plurality of first openings on one surface side of a substrate, forming a first metal layer in the first openings, forming on the other surface side of the substrate a plurality of second openings that are in communication with the first openings, forming a second metal layer in the second openings, and electrically connecting the first metal layer to the second metal layer, so as to form conductive through holes. The conductive through holes are formed stage by stage, such that the fabrication time in forming the metal layers is reduced, and a metal material will not be accumulated too thick on a surface of the substrate. Therefore, the metal material has a smoother surface, and no overburden will be formed around end surfaces of the through holes. An interposer is also provided. | 2014-12-18 |
20140367850 | STACKED PACKAGE AND METHOD OF FABRICATING THE SAME - A stacked package and a method of fabricating the same are provided. The stacked package includes: a first package, having a first encapsulant, a first electrical connection structure formed on one surface of the first encapsulant, a plurality of first conductive pillars formed in the first encapsulant, and a first semiconductor chip disposed in the first encapsulant are electrically connected to the first electrical connection structure; and a second package stacked on the first package, wherein the second package has a second encapsulant, a second electrical connection structure formed on the second encapsulant, a second semiconductor, a chip disposed in the second encapsulant and electrically connected to the second electrical connection structure, and a plurality of second conductive pillars formed in the second encapsulant and electrically connected to the first electrical conduction pillars. The stacked package can provide a great number of inputs/outputs for electronic applications. | 2014-12-18 |
20140367851 | EMBEDDED PACKAGES, METHODS OF FABRICATING THE SAME, ELECTRONIC SYSTEMS INCLUDING THE SAME, AND MEMORY CARDS INCLUDING THE SAME - Embedded packages are provided. The embedded package includes a chip attached to a first surface of a core layer, a plurality of bumps on a surface of the chip opposite to the core layer, and a first insulation layer surrounding the core layer, the chip and the plurality of bumps. The first insulation layer has a trench disposed in a portion of the first insulation layer to expose the plurality of bumps. | 2014-12-18 |
20140367852 | SUBSTRATE HAVING PILLAR GROUP AND SEMICONDUCTOR PACKAGE HAVING PILLAR GROUP - The present disclosure provides a substrate and a semiconductor package. The substrate includes a body, at least one pad group, a plurality of traces and at least one pillar group. The pad group includes a plurality of pads. Each pad has at least one inner side and at least one outer side. The inner side of a first pad is faced to the inner side of an adjacent second pad with a spaced section between. Each pillar group includes a plurality of pillars disposed on respective ones of the pads. The use of pad groups having multiple pads on which to form pillars allows an increase in the number of the pillars available in a given area so as to increase the amount of I/O connections. Furthermore, for a given number of I/O connections, the area occupied by the pads, pillars and traces can be reduced. | 2014-12-18 |
20140367853 | SOLID-STATE IMAGING DEVICE, IMAGING APPARATUS, SUBSTRATE, SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SOLID-STATE IMAGING DEVICE - A solid-state imaging device is a solid-state imaging device in which a first substrate formed on a first semiconductor wafer and a second substrate formed on a second semiconductor wafer are bonded via connect that electrically connects the substrates, wherein the first substrate includes photoelectric conversion units, the second substrate includes an output circuit that acquires a signal generated by the photoelectric conversion unit via the connector and outputs the signal, and dummy connectors that support the first and second bonded substrates are further arranged in a substrate region in which the connectors are not arranged in a substrate region of at least one of the first substrate and the second substrate. | 2014-12-18 |
20140367854 | INTERCONNECT STRUCTURE FOR MOLDED IC PACKAGES - Various examples are provided for interconnection structures for molded IC packages. In one example, among others, an IC package includes a substrate and an interposer. A plurality of conductive elements provide physical and electrical contact between a surface of the substrate and a surface of the interposer. A standoff element disposed between the surfaces of the substrate and interposer provides a minimum spacing between the surfaces of the substrate and interposer. In some implementations, a standoff element is disposed between an IC die disposed on the surface of the substrate and the surface of the interposer. In another example, a method includes coupling conductive elements to a surface of an interposer, attaching a standoff element, coupling the conductive elements to a surface of a substrate, and forming an embedded layer between the interposer and substrate. The standoff element defines a minimum gap between the interposer and the substrate. | 2014-12-18 |
20140367855 | Self-Aligned Via Interconnect Using Relaxed Patterning Exposure - Self-aligned via interconnects using relaxed patterning exposure. In accordance with a first method embodiment, a method for controlling a computer-aided design (CAD) system for designing physical features of an integrated circuit includes accessing a first pattern for first metal traces on a first metal layer, accessing a second pattern for second metal traces on a second metal layer, vertically adjacent to the first metal layer and accessing a precise pattern of intended interconnections between the first and second metal traces. The precise pattern of intended interconnections is operated on to form an imprecise via pattern that indicates a plurality of general areas in which vias are allowed. The imprecise via pattern is for use in an integrated circuit manufacturing process to form, in conjunction with operations to form the first and second metal layers, a plurality of self-aligned vias for interconnecting the intended interconnections. | 2014-12-18 |
20140367856 | SEMICONDUCTOR MANUFACTURING PROCESS AND STRUCTURE THEREOF - A semiconductor manufacturing process includes the following steps of providing a silicon substrate having at least one connection pad and a protection layer, forming a first seed layer having at least one first section and at least one second section, forming a first photoresist layer, forming a first buffer layer having a coupling portion and a cladding portion, removing the first photoresist layer, removing the second section of the first seed layer to form a first under bump metallurgy layer, forming a support layer on the protection layer and the first buffer layer, the first under bump metallurgy layer has a first ring wall, the first buffer layer has a second ring wall, wherein the first ring wall, the second ring wall and the cladding portion are cladded by the support layer, and forming a connection portion and covering the coupling portion with the connection portion. | 2014-12-18 |
20140367857 | Method and Apparatus for Back End of Line Semiconductor Device Processing - Methods and apparatus are disclosed for the back end of line process for fabrication of integrated circuits (ICs). A barrier layer comprising a bottom part and a side part is formed within an opening for a metal contact, wherein the bottom part comprises a graphene material, the side part comprises an amorphous carbon material and covers a sidewall of the opening, and the bottom part and the side part are formed at a same time. A capping layer comprising a first part and a second part is formed on a dielectric layer and a metal contact, wherein the first part comprises a graphene material, the second part of the capping layer comprises an amorphous carbon material on the dielectric layer, and the first part and the second part are formed at a same time. | 2014-12-18 |
20140367858 | Thin Film Devices and Low Temperature Process To Make Thin Film Devices - A method for preparing a device having a film on a substrate is disclosed. In the method, a film is deposited on a substrate. The film includes a first and a second metal. The first and the second metals in the film are converted to an intermetallic compound using microwave radiation. One example device prepared by the method includes a silicon substrate and a film on the substrate, wherein the film includes semiconducting copper germanide as the intermetallic compound. | 2014-12-18 |
20140367859 | TIN-BASED WIREBOND STRUCTURES - Tin-based wirebond structures and wirebonds formed thereon. In some embodiments, an electronic package includes a semiconductor die located over a substrate and a wire configured to couple a terminal of the semiconductor die to a bond pad on the substrate. A wire bond between the wire and the bond pad may include an amount of tin originated from a layer of tin alloy formed on the bond pad. In other embodiments, a wirebond structure may include a conductive layer and a layer of tin alloy located over a portion of the conductive layer. The layer of tin alloy may provide a wirebonding contact surface configured to receive a bond wire. | 2014-12-18 |
20140367860 | SEMICONDUCTOR PACKAGES INCLUDING HEAT DIFFUSION VIAS AND INTERCONNECTION VIAS - A semiconductor package includes a lower package including a lower semiconductor chip on a lower package substrate, an upper package on the lower package, and a heat interface material between the lower package and the upper package. The upper package includes an upper semiconductor chip on an upper package substrate including a center portion adjacent to the lower semiconductor chip and an edge portion. The heat interface material is in contact with a top surface of the lower semiconductor chip and the upper package substrate. The upper package substrate includes a heat diffusion via penetrating the center portion and an interconnection via penetrating the edge portion. The interconnection via is spaced apart from the heat diffusion via. | 2014-12-18 |
20140367861 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATION METHOD - A multilayer wiring in a semiconductor device includes a first lower wiring formed in a first insulating layer, a via which is formed in a second insulating layer over the first insulating layer and which is connected to the first lower wiring, and an upper wiring connected to the via. The upper wiring has an outer edge at which a nick portion is formed beside a portion of the upper wiring to which the via is connected. The formation of the nick portion at the outer edge of the upper wiring prevents the via from enlarging. | 2014-12-18 |
20140367862 | SEMICONDUCTOR DEVICE WITH INTERNAL SUBSTRATE CONTACT AND METHOD OF PRODUCTION - The semiconductor device comprises a substrate ( | 2014-12-18 |
20140367863 | SEMICONDUCTOR DEVICE - A semiconductor device comprises: a semiconductor element; a support substrate arranged on a surface of the semiconductor element opposite to a surface thereof provided with a pad, the support substrate being wider in area than the semiconductor element; a burying insulating layer on the support substrate for burying the semiconductor element therein; a fan-out interconnection led out from the pad to an area on the burying insulating layer lying more peripherally outwardly than the semiconductor element; and a reinforcement portion arranged in a preset area on top of outer periphery of the semiconductor element for augmenting the mechanical strength of the burying insulating layer and the fan-out interconnection. | 2014-12-18 |
20140367864 | SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SAME - A method for producing a semiconductor device includes: a process for forming a first conductor on a first interlayer insulating film provided on a semiconductor substrate, a process for forming in order a first stopper interlayer film, a second interlayer insulating film, a second stopper interlayer film, and a third interlayer insulating film on the first interlayer insulating film to cover the first conductor, a process for penetrating the third interlayer insulating film, the second stopper interlayer film, and the second interlayer insulating film, and forming a first contact hole having a first inner diameter on a position corresponding to the first conductor, a process for expanding the inner diameter of the first contact hole on the second interlayer insulating film to a second inner diameter larger than the first inner diameter, and a process for forming on the first stopper interlayer film a second contact hole. | 2014-12-18 |
20140367865 | LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DIE ATTACH PAD - A leadless integrated circuit (IC) package comprising an IC chip mounted on a die attach pad and a plurality of electrical contacts electrically connected to the IC chip. The IC chip, the electrical contacts, and the die attach pad are all covered with a molding material, with portions of the electrical contacts and die attach pad protruding from a bottom surface of the molding material. | 2014-12-18 |
20140367866 | MEMORY MODULE IN A PACKAGE - A microelectronic package can include a substrate having first and second opposed surfaces, at least two pairs of microelectronic elements, and a plurality of terminals exposed at the second surface. Each pair of microelectronic elements can include an upper microelectronic element and a lower microelectronic element. The pairs of microelectronic elements can be fully spaced apart from one another in a horizontal direction parallel to the first surface of the substrate. Each lower microelectronic element can have a front surface facing the first surface of the substrate and a plurality of contacts at the front surface. A surface of each of the upper microelectronic elements can at least partially overlie a rear surface of the lower microelectronic element in its pair. The microelectronic package can also include electrical connections extending from at least some of the contacts of each lower microelectronic element to at least some of the terminals. | 2014-12-18 |
20140367867 | Packaging Methods and Packaged Semiconductor Devices - An embodiment is a method including forming a first package and a second package. The first package includes packaging a first die, forming a plurality of solder balls on the first die, and coating the plurality of solder balls with an epoxy flux. The second package includes forming a first electrical connector, attaching a second die adjacent the first electrical connector, forming a interconnect structure over the first die and the first electrical connector, the interconnect structure being a frontside of the second package, forming a second electrical connector over the interconnect structure, and the second electrical connector being coupled to both the first die and the first electrical connector. The method further includes bonding the first package to the backside of the second package with the plurality of solder balls forming a plurality of solder joints, each of the plurality of solder joints being surrounded by the epoxy flux. | 2014-12-18 |
20140367868 | SEALING COMPOSITION FOR SEMICONDUCTOR, SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POLYMER AND METHOD OF PRODUCING THE SAME - In the invention, a sealing composition for a semiconductor is provided which includes a polymer that includes two or more cationic functional groups including at least one of a tertiary nitrogen atom or a quaternary nitrogen atom, that has a weight average molecular weight of from 2,000 to 1,000,000, and that has a branching degree of 48% or more, wherein a content of sodium and a content of potassium in the sealing composition are each 10 ppb by weight or less on an element basis. | 2014-12-18 |
20140367869 | Enhanced FinFET Process Overlay Mark - An overlay mark suitable for use in manufacturing nonplanar circuit devices and a method for forming the overlay mark are disclosed. An exemplary embodiment includes receiving a substrate having an active device region and an overlay region. One or more dielectric layers and a hard mask are formed on the substrate. The hard mask is patterned to form a hard mask layer feature configured to define an overlay mark fin. Spacers are formed on the patterned hard mask layer. The spacers further define the overlay mark fin and an active device fin. The overlay mark fin is cut to form a fin line-end used to define a reference location for overlay metrology. The dielectric layers and the substrate are etched to further define the overlay mark fin. | 2014-12-18 |
20140367870 | CARBURETOR SPACER HAVING AN EMBEDDED FAN - A modified carburetor spacer for providing greater efficiency in the operation of internal combustion engine having an attached carburetor (or “carburetor engine assembly”) comprising a conventional carburetor spacer body and a five-blade fan disposed at least one open section of said carburetor spacer body. The modified carburetor spacer can be attached underneath the carburetor of a carburetor engine assembly by means typical to the carburetor spacer installation, including through the use of two metal rods with accompanying nuts and bolts. When a carburetor engine assembly having an installed modified carburetor spacer is used, the vacuum created by the operation of the motor causes the fan blades in the modified carburetor space to spin. As the stream created by the carburetor passes through the spinning fan blades, the stream is converted to a mist before proceeding to the engine | 2014-12-18 |
20140367871 | Multi-Stage Bubble Column Humidifier - A feed liquid flows into a second-stage humidifier chamber to form a second-stage humidifier bath. A first remnant of the feed liquid from the second-stage humidifier chamber then flows into a first-stage humidifier chamber to form a first-stage humidifier bath having a temperature lower than that of the second-stage bath. A second remnant of the feed liquid is then removed from the first-stage humidifier. Meanwhile, a carrier gas is injected into and bubbled through the first-stage humidifier bath, collecting a vaporizable component in vapor form from the first remnant of the feed liquid to partially humidify the carrier gas. The partially humidified carrier gas is then bubbled through the second-stage humidifier bath, where the carrier gas collects more of the vaporizable component in vapor form from the feed liquid to further humidify the carrier gas before the humidified carrier gas is removed from the second-stage humidifier chamber. | 2014-12-18 |
20140367872 | COOLING TOWER WITH AUTOMATIC HYDRAULIC BALANCING - A cooling tower including a hot-water basin comprising a first cooling cell and a second cooling cell; and at least one means for controlling fluid communication between the first and second cooling cells is provided. A method of maintaining the efficiency of a cooling tower and a method of servicing a cooling tower are also provided. | 2014-12-18 |
20140367873 | Optical substrates having light collimating and diffusion structures - This invention discloses a method of forming an uneven structure on a substrate. Cut a plurality of trenches in an order on a surface of a mold through a control system, wherein the plurality of trenches comprise at least one first trench, wherein for any second trench of the at least one first trench, the second trench overlaps with at least one third trench different from the second trench such that the second trench is cut off by the at least one third trench. Use the surface of the mold to emboss a thin film on the substrate to form the uneven structure. | 2014-12-18 |
20140367874 | IMPRINT APPARATUS, IMPRINT METHOD, AND METHOD OF MANUFACTURING ARTICLE - The present invention provides an imprint apparatus which transfers the pattern of the mold to a target region on the substrate, comprising a control unit configured to align the mold and the target region in a surface direction parallel to a surface of the substrate, and drive at least one of the mold and the substrate so that the mold and an imprint material on the target region are brought into contact with each other, wherein in the alignment in the surface direction before the contact, the control unit shifts a relative position between the mold and the target region based on a shift amount of the pattern of the mold from the target region in the surface direction in the driving which causes the contact, so that the relative position after the contact is set within an allowable range. | 2014-12-18 |
20140367875 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - The present invention provides an imprint apparatus comprising a deforming unit configured to deform a pattern surface by applying a force to a mold, a measuring unit configured to measure a deformation amount of the pattern surface, a control unit configured to control the measuring unit to measure the deformation amount in each of a plurality of states in which a plurality of the forces are applied to the mold, a calculation unit configured to calculate a rate of change in the deformation amount as a function of a change in the force applied to the mold, and a calibration unit configured to calibrate a control profile describing a time in the imprint process, and the force applied to the mold, based on the rate of change in the deformation amount. | 2014-12-18 |
20140367876 | VENTED MOLD AND METHOD FOR PRODUCING MOLDED ARTICLE - The invention relates mold, particularly a mold for producing foam articles. In a preferred embodiment, the mold comprises a lid and a bowl releasingly engageable to define a mold cavity, the lid comprising: (i) a vent having a passageway for gas to escape from the mold cavity, and (ii) a plurality of grooves connected to the vent. The use of a plurality of grooves/slots in the mold cavity surface effectively acts as a siphon to draw gas away from the composition to be molded. The plurality of grooves/slots is connected to one or more vents which then allows for escape of the gas from the mold cavity to the exterior of the mold. | 2014-12-18 |
20140367877 | METHOD FOR MANUFACTURING INSULATING HOUSING - One embodiment of the disclosure provides a method for manufacturing a thermally insulating housing and the method includes the following step. First, a plastic housing is formed by a Gas-Assisted Injection Molding (GAIM) process, and the plastic housing includes at least one air-tight chamber. Therefore, the thermally insulating housing enhances the thermally insulating effect. | 2014-12-18 |
20140367878 | BATCH MIXER WITH PLUNGER - A batch mixer is equipped with a plunger for pushing material from the batch mixer. The batch mixer includes a mixer tank structured to accommodate material. The mixer further includes a mixer head comprising at least one blade structured to blend the material within the mixer tank. The mixer further includes a plunger mechanism structured to push the blended material directly from the mixer tank. | 2014-12-18 |
20140367879 | EXTRUSION METHOD - A method is provided for producing solid cellulose filaments or films from a solution of cellulose, NMMO (N-methylmorpholine-N-oxide) and water, including pressure-extruding the solution by one or more extrusion openings and by solidifying the filaments or films in a precipitation bath. The solution is guided between the extrusion opening and the precipitation bath by an air gap, the temperature of the solution on the extrusion opening being lower than 105° C. and the pressure difference in the air gap between the pressure of the solution immediately prior to extrusion and after extrusion is between 8 and 40 bar. | 2014-12-18 |
20140367880 | DECORATIVE WOOD-BASED BOARD PANEL AND METHOD OF PANEL PRODUCTION - A manufactured wood-based panel for furniture and interior construction. Particle sized foreign materials are irregularly distributed under a protective layer over one or both of the surfaces of the wood-based panel, covering more than 10% of the panel surface. The foreign materials, preferably natural materials such as cork or hemp shives, but also plastics, metal particles, or recycled material are incorporated so that they either protrude from the panel surface to form a relief pattern or are embedded in the wood-based material to form a uniform, smooth panel surface. | 2014-12-18 |
20140367881 | METHOD OF MAKING A PRODUCT WITH A FUNCTIONAL RELIEF SURFACE WITH HIGH RESOLUTION - A method of making products with a functional relief surface ( | 2014-12-18 |
20140367882 | STRAINING DEVICE AND METHOD FOR EXTENDING A FILM WEB - A device and a method for extending a film web along its longitudinal direction are described and claimed,
| 2014-12-18 |
20140367883 | PRODUCING METHOD OF THERMALLY CONDUCTIVE SHEET - A method for producing a thermally conductive sheet includes the steps of preparing a material component containing boron nitride particles in a plate shape and a polymer matrix, forming a long-length sheet from the material component with a calender, and pressing the long-length sheet. | 2014-12-18 |
20140367884 | METHOD FOR FORMING GOLF BALL AND MOLD THEREFOR - A method for forming a golf ball provides a core member comprising a core of a golf ball into a cavity of a mold so that the core member is supported by a movable holding pin disposed in the mold; forming a layer outside the core member by injecting a material of the layer into the cavity; and retracting the pin from the cavity into the mold during the material injection so that a portion projecting from a surface of the layer is formed by a tip of the pin, the projecting portion having a site area of at least 0.2% in relation to an entire area of the tip of the pin and having a height of at least 0.2 mm. This method can be implemented by controlling the retraction of the pin, or alternatively by using the pin having a predetermined indentation portion on the tip. | 2014-12-18 |
20140367885 | INCREMENTALLY STRETCHED FILMS WITH INCREASED TEAR RESISTANCE AND METHODS FOR MAKING THE SAME - Methods of incrementally stretching thermoplastic films in the machine direction include elongating the films in the machine direction without reducing the films' machine-direction tear resistance. In one or more implementations, methods of incrementally stretching thermoplastic films include reducing the gauge of the films without reducing the films' machine-direction tear resistance. The methods can involve cold stretching the films and imparting transverse-direction extending linear rib pattern into the film. The linear ribs can have alternating thick and thin gauges. Incrementally stretched thermoplastic films can have a machine-direction tear resistance that is approximately equal to or greater than the machine-direction tear resistance of the film prior to stretching. | 2014-12-18 |
20140367886 | DEVICE AND METHOD FOR HEATING A MOULD OR TOOL - The present disclosure relates to a tool such as an injection moulding tool or an embossing tool. A heating device including a stack of layers is provided for heating a tool surface. The stack may include a coil carrier layer with a number of wound coils for generating a magnetic field, and a conductive top layer, being adjacent to the tool surface currents are induced in the top layer to heat the surface. Efficient heating may be provided by solutions involving low resistivity layers that lead currents to the top layer without themselves developing heat to any greater extent. A conduction frame device can be provided beneath the top layer and around the perimeter thereof to provide reliable contact with a backing layer. | 2014-12-18 |
20140367887 | METHODS AND APPARATI FOR HANDLING, HEATING AND COOLING A SUBSTRATE UPON WHICH A PATTERN IS MADE BY A TOOL IN HEAT FLOWABLE MATERIAL COATING, INCLUDING SUBSTRATE TRANSPORT, TOOL LAYDOWN, TOOL TENSIONING AND TOOL RETRACTION - A workpiece is transported using a porous belt, which belt delivers a workpiece to a chuck, upon which the workpiece is held by vacuum. The belt can be porous PTFE. A flexible stamp is preheated, before it is applied to a workpiece, by drawing the stamp toward a heated plate, for instance by vacuum. | 2014-12-18 |
20140367888 | RESIN MOLDING DIE, RESIN MOLDING METHOD AND RESIN MOLDED PRODUCT - It is an object of this invention to provide a resin molding die that is capable of suppressing, even when an undercut is provided on a core mold and an embossing process is performed on a cavity mold, generation of burrs attributed to the undercut and the embossing process. A resin molding die ( | 2014-12-18 |
20140367889 | TOOL TEMPERATURE CONTROL | 2014-12-18 |
20140367890 | Damper Assembly - A tether for attachment to a damper device is formed to include a heated, reshaped enlarged bulbous end. | 2014-12-18 |
20140367891 | METHOD AND APPARATUS FOR MANUFACTURING GRAPHENE - A method and apparatus for manufacturing graphene including rotating a continuous surface within an evacuated chamber; coating the surface with a catalyst layer; heating portions of the catalyst layer; coating the heated portions of the catalyst layer with one or more layers of graphene; monitoring grain growth of the graphene layer; if the monitored grain growth indicates unacceptable grain growth, then taking corrective action; and removing the catalyst layer and the layer of graphene from the surface by heating other portions of the catalyst layer. | 2014-12-18 |
20140367892 | MOLDING SYSTEMS AND METHODS - A hot-runner system, comprising: a melt flow modular assembly having a gate melt flow control apparatus; and a Lorentz force actuator assembly being coupled to the gate melt flow control apparatus. A valve gate drive controller for control of the Lorentz force actuator assembly of the hot-runner system. An injection plastic molding apparatus devised to mold plastic articles, and the injection plastic molding apparatus having the hot-runner system. A method comprising operating the Lorentz force actuator assembly of the hot-runner system. A melt flow modular assembly for use with the Lorentz force actuator assembly of the hot-runner system. | 2014-12-18 |
20140367893 | METHOD AND APPARATUS FOR FORMING A POLYCARBONATE PANEL - A method for forming a polycarbonate panel, the method comprising the steps of cutting a flat polycarbonate panel to the desired final dimensions, inserting the panel between the two portions of a die, forming the panel by means of compression between the two portions of the die, overbending the panel between 1-12 degrees to achieve a predetermined angle of bends in the panel and repeating these steps until the panel is fully corrugated. The method further includes the steps of heating the die and/or the panel by means of an electric strip temperature of between 100-110 degrees Fahrenheit. An apparatus is also provided for forming a polycarbonate panel. The apparatus includes a die where the die includes a first portion and a second portion. The die being automatically adjustable in height and width. The first portion and the second portion movable with respect to each other and the first portion and the second portion operable to compress and overbend a panel to form a bend in the panel. | 2014-12-18 |
20140367894 | System And Method For Enhanced Additive Manufacturing - Systems and methods are disclosed for manufacturing a three dimensional (3D) part. In one implementation a system in accordance with the present disclosure may make use of an additive manufacturing (AM) subsystem for performing an AM operation to form the 3D part. The 3D part may be formed using a plurality of distinct material layers layered one on top of another. The system may also involve at least one of a laser peening (LP) subsystem and a High Velocity Laser Accelerated Deposition (HVLAD) subsystem. The LP subsystem may be used for laser peening a selected subquantity of the layers, to impart improved hardness to the selected subquantity of the layers and/or to the overall 3D part. The HVLAD subsystem may be used to bond at least one of the material layers to a previously laid down one of the material layers. | 2014-12-18 |
20140367895 | BLOW MOLDING DEVICE AND A METHOD FOR MANUFACTURING A CONTAINER - To regulate, in blow molding device using liquid, such as beverage, cosmetic product, and pharmaceutical product, filled in final product as pressurized liquid, head space in container which is filled with content liquid during molding to be predetermined volume, provided is blow molding device including blow nozzle configured to tightly communicate with mouth tubular portion of preform. In state where rod is disposed to be inserted into blow nozzle and where tip portion of rod is inserted into preform, pressurized liquid is supplied into preform via tubular introduction path formed by blow nozzle and rod, thereby expandingly shaping container in accordance with cavity of metal mold. When container is shaped and supply of pressurized liquid is stopped, rod is disinserted from container, and according to shape and insert position of tip portion of rod, head space of shaped container that is filled with liquid is regulated to be predetermined volume. | 2014-12-18 |
20140367896 | EXTRUSION METHOD - A method is provided for producing solid material filaments or films from a fluid of the material, by extruding the fluid by one or more extrusion openings and by solidifying the material in a precipitation bath. The formed material is guided between the extrusion openings and the precipitation bath by a lateral gas flow. The gas flow is subdivided into a hot partial flow and a cold partial flow. The material is initially brought into contact with the hot partial flow and subsequently with the cold partial flow prior to it being introduced into the precipitation bath. A device is also provided for extruding and forming materials. | 2014-12-18 |
20140367897 | METHOD OF FABRICATING SILICON CARBIDE POWDER - A method of fabricating silicon carbide powder according to the first embodiment includes preparing a silicon carbide molded member by molding a silicon carbide material; preparing a silicon carbide agglomerate member by pulverizing the silicon carbide molded member; and preparing the silicon carbide powder by heat-treating the silicon carbide agglomerate member. A method of fabricating silicon carbide powder according to the second embodiment includes preparing a primary material having a first grain size and including silicon carbide; preparing a secondary material having a second grain size by agglomerating the primary material; and preparing the silicon carbide powder by heat-treating the secondary material. | 2014-12-18 |
20140367898 | COOLING SYSTEMS FOR HEAT-TREATED PARTS AND METHODS OF USE - Systems and methods for cooling a heat-treated metallic part include a plurality of atomization nozzles disposed on a stage and radially disposed about the part to be cooled; and a fluid in fluid communication with the atomization nozzles. The fluid may gas, liquid, or a combination thereof, e.g., water and gas. During use, the atomization nozzles are generally configured to rapidly cool the thicker sections of the part relative to the thinner section since the thicker sections are generally slower to cool. In some embodiments, the stage can be configured to rotate about the part during cooling. Methods are also disclosed. In one embodiment, the method includes moving a plurality of outlets in a horizontal direction while the heat-treated part is stationary while directing an air and water mixture from the plurality of outlets onto the heat-treated metallic part | 2014-12-18 |
20140367899 | VERTICAL DRAINAGE SYSTEM FOR HEAP LEACH PILES - A vertical drainage system for a heap leaching operation comprising vertical drainage conduits for draining fluid pockets down through the strata of a heap pile. The drainage conduits are spaced in a parallel array throughout the ore heap, and are preferably in fluid communication from a top of said ore heap to said one or more collection pipes for draining trapped and avoiding slope or geotechnical failure. | 2014-12-18 |
20140367900 | AIR SPRING MOUNTING SYSTEM - An air spring attachment system for motor vehicles. The air spring attachment system includes at least one air spring and at least one link for the suspension of a wheel on a chassis. The air spring attachment system also includes a plug-in connection connecting the air spring to the link. | 2014-12-18 |
20140367901 | CABLE FIXING ELEMENT ON A SPRING MAT FOR A VEHICLE SEAT, SPRING MAT, AND VEHICLE SEAT - A fixing element ( | 2014-12-18 |
20140367902 | RING-SHAPED SPRING AND METHOD FOR MANUFACTURING SAME - An inexpensive ring spring having high strength and a method for producing the same, are provided. The ring spring can be obtained, for example, by raw material preparation, bending formation, welding, and disk formation performed in this order. The ring spring is formed to have no edge by welding two edge parts of the raw material, and has a welded metal part that is formed at the interface of the two edge parts of the raw material, and a welded heat-affected zone that is formed around the welded metal part and heated by welding, and exhibits tensile strength of 1000 MPa or more. Since the ring spring has sufficient tensile strength as a disk spring and a wave spring, quenching and tempering are not necessary. Furthermore, since the product can be prevented from being deformed due to quenching and tempering, dimensional accuracy of the product can be improved. | 2014-12-18 |
20140367903 | UNCLAMP FEEDBACK UNIT - The disclosure generally relates to unclamp sensing feedback devices for clamping or holding devices in automatic production lines more specifically to a link clamp assembly. Further, the disclosure also provides the method of achieving feedback to sense fully unclamped condition of the link clamp cylinder. | 2014-12-18 |
20140367904 | AUTOMATIC TRUSS JIG SETTING SYSTEM - A automatic truss jig setting system is disclosed that includes a table including a plurality of segments with a side edge of adjacent segments defining a slot. At least one pin assembly, and optionally a pair of pin assemblies, is movable independently of each other along the slot. Movement apparatus is provided for independently moving the pin assemblies along the slot. Each of the side edges of the segments associated with the slot defines a substantially vertical plane with a zone being defined between the substantially vertical planes of the side edges, and the movement apparatus is located substantially outside of the zone of the slot. The invention may optionally include a system for handling the obstruction of pin assembly movement, and a system for keeping track of the position of the pin assembly when the pin assembly has encountered an obstruction. | 2014-12-18 |
20140367905 | Clamping Devices - A clamping device comprises a clamping base and a cam mechanism. The clamping base has an opening for receiving at least a part of an object to be clamped and a cavity for receiving the cam mechanism. The cam mechanism is rotatable with respect to the clamping base between a first position, in which the clamping device completely locks the object to be clamped, and a second position, in which the clamping device completely releases from the object. The clamping device can achieve clamping/locking of an object without use of additional tools. In some cases, the clamping device can operated among three different positions, i.e., completely released position, pre-locked position, and completely locked position, facilitating the control and handling of the object. | 2014-12-18 |
20140367906 | ELECTRIC CLAMP APPARATUS - An electric clamp apparatus includes a body, a rotary drive unit which is driven rotatably by an electric signal, and a clamp arm disposed rotatably with respect to the body. By driving the rotary drive unit, a drive force is transmitted to the clamp arm through a drive force transmission mechanism, whereby the clamp arm is rotated via a link arm through a predetermined angle with respect to the body, and a workpiece is clamped between the clamp arm and a support member of the body. Further, rotational operation of the clamp arm is regulated by abutment of a sub-roller against an inclined portion of a displacement body. | 2014-12-18 |
20140367907 | IMAGE FORMING APPARATUS, PRINT CONTROL METHOD AND STORAGE MEDIUM STORING PROGRAM - When a job that is set so as to execute binding processing at a first binding position is being executed and this job is then interrupted, a request for changing a position of the binding processing from the first binding position to a second binding position is accepted in a state where the job is interrupted. It is determined whether or not an orientation of a print target image is to be changed in order to change the position of the binding processing from the first binding position to the second binding position in accordance with the accepted request. In a case where it is determined that the orientation of the print target image is to be changed, control is performed so as not to execute the binding processing. | 2014-12-18 |
20140367908 | SHEET FEED CASSETTE - A sheet feed cassette having: a main body to be set in a body of an image forming apparatus; a first press-up member configured to support print media stacked thereon; a first elastic member configured to apply an elastic force to make the first press-up member press up the print media; a second press-up member; a second elastic member configured to apply an elastic force to make the second press-up member press up the first press-up member or the print media; an adjusting mechanism configured to adjust the force of the second press-up member to press up the first press-up member or the print media in accordance with a size of the print media; and a regulatory mechanism configured to prevent the second press-up member from pressing up the first press-up member or the print media when the main body is detached from the body of the image forming apparatus. | 2014-12-18 |
20140367909 | COMPACT SHEET CARRYING DEVICE AND DOCUMENT PROCESSING APPARATUS USING SUCH DEVICE - A compact sheet carrying device comprises a tray, a first supporting arm and a second supporting arm. The tray supports a first portion of a sheet. The first supporting arm is pivotally connected to the tray at one end having a first toothed portion. The second supporting arm is pivotally connected to the tray at one end having a second toothed portion. The two toothed portions mesh with each other. The two supporting arms are concurrently in a deployed state or a retracted state. In the deployed state, the two supporting arms support a second portion of the sheet. A document processing apparatus using such sheet carrying device is also provided. | 2014-12-18 |
20140367910 | MOTOR-DRIVEN ALIGNING AND FORWARDING DEVICE FOR APPARATUS FOR PROCESSING PAPER DOCUMENTS AND THE LIKE, IN PARTICULAR BANK CHEQUES - The device ( | 2014-12-18 |
20140367911 | TOUCH POSITION DETERMINING APPARATUS AND METHOD THEREOF - A touch position determining apparatus and method thereof are provided. The touch position determining apparatus is adapted to a sphere. The touch position determining apparatus includes a pressure sensing array and a processing unit. The pressure sensing array is coupled below the sphere and includes a plurality of pressure sensing nodes. The pressure sensing array generates a pressure deformation area in response to a touch operation performed on a surface of the sphere, and generates a pressure signal set by the pressure sensing nodes corresponding to the pressure deformation area. The processing unit is connected to the pressure sensing array and determines a touch position of the touch operation performed on the surface of the sphere according to the pressure signal set. | 2014-12-18 |
20140367912 | METHOD, ELECTRONIC DEVICE IMPLEMENTABLE APPLICATION AND ELECTRONIC DEVICE FOR PLAYING A MARKER GAME - The present relates to a method, computer program, and electronic device for playing a marker game. A grid having a plurality of cells is displayed. A subset of the plurality of cells is displayed in a first particular visual appearance representing obstacles. Another subset of the plurality of cells is displayed in a second particular visual appearance representing exits. At least two markers are also displayed in cells of the grid. User commands are received for creating a path corresponding to a series of adjacent cells from one of the markers to one of the exit cells. Each user command is verified to ensure the user command respects predetermined rules. When the predetermined rules are respected, a path indicator is displayed in each of the adjacent cells. The predetermined rules include the adjacent cell does not correspond to one of the cells representing obstacles and the adjacent cell does not already display one of the path indicators. | 2014-12-18 |
20140367913 | Educational Board Game with content-based feedback - An educational board game has a plurality of segments positioned in a predetermined order and extending from a starting segment to an ending segment. The educational board game also has a plurality of participant identifiers, wherein each participant identifier represents a single individual playing the game. A random number generator selects a value which determines how many segments a participant is allowed to move on his or her turn. A first feedback stack includes cards describing episodes and which may result in an exchange or loss of points. A second feedback stack includes cards with instructions to read out loud educational content. The educational board game further has a third feedback stack with cards containing questions regarding the subject matter of the game. The educational content read during the game includes answers to the questions presented in the third feedback stack. | 2014-12-18 |
20140367914 | Game Apparatus to Teach Strong Moral Decision - A game apparatus to teach strong moral decision includes a foldable game board that includes a plurality of adjoining path segments. A plurality of colored playing pieces is individually assigned to each team so that each team is able to selectively position the assigned playing piece onto one of the plurality of adjoining path segments. Each team start form a starting segment of the plurality of adjoining path segments, and the first team to reach a winning segment of the plurality of adjoining path segments is recognized as the winning team. The movement of the plurality of colored playing pieces is controlled by a plurality of primary cards and a plurality of secondary cards as each of the plurality of primary cards and each of the plurality of secondary cards respectively relate to a corresponding outcome and a specific outcome within the game apparatus. | 2014-12-18 |
20140367915 | Methods and Devices for On-The-Roll Sports Games - A realistic professional team sports board game, including an On-The-Roll mechanism where, once play begins, real time play continues, generally against a clock, opposing teams continue to roll dice continuing sub-play actions or elements, until a play is completed, as by a touchdown, tackle and a series of rules and charts, based on statistical compilation that maps various combinations of offensive and defensive strategies and dice rolls into realistic game situations and the progression among them. Both teams: secretly choose a strategy, generally by selecting a card placed face down; roll dice; reveal strategy choices by turning cards face up; determine a situation chart to consult, and further determine which result is selected from within the chart, based on some combination of which cards were played and the results of the dice rolls. A variety of play cards affect the overall game momentum of either team. | 2014-12-18 |
20140367916 | Method and Apparatus for Playing a Game - Disclosed herein is a class of games and a method of playing games that are played by manipulating objects on a grid. The objects have defined properties that control how the objects are moved. Objects may optionally be connected to each other which alters how the objects may be moved on the grid. The object of the game is for the player to accumulate points based upon arranging the objects in predetermined patterns according to specific rules. | 2014-12-18 |
20140367917 | Wagering Method - A method for placing a secondary wager on a comparative card game such as blackjack, baccarat or mini-baccarat; in addition to a primary wager. A winner of the secondary wager is determined based on a card total for a dealt player first card and a dealer first card or banker first card if in baccarat or mini-baccarat. The player first card and the dealer first card may be compared to identify a card total, where the combinative hand value of both first cards must equal a predetermined sum, including, without limitation, 8, or 18, or 9, or 19. The player may win or lose the secondary wager based on the card total. A payout ratio may be utilized to determine a payout or loss for the player. After the secondary wager is resolved, the game continues to determine the outcome and winning primary wager for the primary game. | 2014-12-18 |
20140367918 | Mason Target System - The invention relates to a shooting target and method of using the target for electronically determining the shooting position on a shooting target. Said shooting position is determined in a number of ways, including by use of a plurality of accelerometers to determine the impact area and transmit data relating to the impact to a remote receiver for real-time presentation to the shooter. Said method enables the shooting position to be determined by means of relatively economical electronic systems and said shooting target is portable such that the shooter may bring the target to a plurality of firing ranges and locations to convey the same real-time reporting and benefits to the shooter. Said shooting target may be set-up on a standard target stand to wirelessly relay shot impact information to a portable personal computing device to present real-time virtual impact data to the shooter. This data can then be stored and categorized given user-selected inputs and shared with other shooters in an online forum. | 2014-12-18 |
20140367919 | Barrier System for Mechanical Seal - A barrier system for a dual mechanical seal, the system comprising means for controlling barrier fluid pressure relative to product pressure. The pressure control means comprises means for monitoring the volume of barrier fluid in the system and for supplying additional fluid to the system to maintain the volume within a desired range. The system further comprises means for maintaining the barrier fluid pressure at a pre-determined pressure above product pressure. | 2014-12-18 |
20140367920 | PIECE OF ABRADABLE MATERIAL FOR THE MANUFACTURE OF A SEGMENT OF AN ABRADABLE RING SEAL FOR A TURBOMACHINE, AND PROCESS FOR THE MANUFACTURE OF SUCH A PIECE - A molded piece | 2014-12-18 |
20140367921 | SEGMENT OF AN ABRADABLE RING SEAL FOR A TURBOMACHINE, AND PROCESS FOR THE MANUFACTURE OF SUCH A PIECE - A segment of an abradable ring seal for a turbomachine, includes: a reinforcing support; a composite fabric including fibres impregnated with polymerised resin, and a track of abradable material. The composite fabric is interposed between the reinforcing support | 2014-12-18 |
20140367922 | SEALING ELEMENT - A sealing element, e.g., a sealing ring, is adapted to seal between two component sections and to be compressed by the two component sections in a groove that is provided in one of the two component sections and having a groove opening and a groove bottom. The sealing element comprises a profile which, in the non-compressed state, comprises different profile heights and at least two outer surfaces. The profile is deformable in the compressed state such that it extends with at least one of its side sections into the groove opening (NÖ) and thereby possibly partially closes the groove opening. | 2014-12-18 |
20140367923 | SEALING ELEMENT AND A SEALING SYSTEM FOR HOLLOW SECTIONS - The present disclosure relates to a sealing element for hollow sections, including a seal carrier that extends along a longitudinal axis and has two arms each of which has an outer face and an inner face and which are connected together, as one piece, at longitudinal edges that face each other such that they form a corner angle between them seals mounted on or near a free longitudinal edge of each arm and running parallel to the free longitudinal edge, on the outer face of the associated arm, and a securing device, on at least one inner face of an arm, for detachably securing the sealing element onto a corner of a hollow section. A cover cap serves to complete the sealing elements, the cap being provided, on its outer face, with one or more sealing sections designed to connect to ends of the seals of the sealing element. | 2014-12-18 |
20140367924 | SEAL BODY AND GAS SEAL MECHANISM - A seal body that is used for gas seal includes a seal main body in which a recessed groove is formed by arranging a pair of lips so that the lips face each other; an elastic body that is inserted in the recessed groove and expands the lips; and a rigid body that is installed in the elastic body, and restricts deformation of the elastic body, due to narrowing of the recessed groove, within an elastic deformation range. | 2014-12-18 |
20140367925 | HOT GAS SEAL - A hot gas seal for sealing an opening in a heat shield element or between heat shield elements of a heat shield includes a resilient portion for providing a force which is designed such that the hot gas seal can be held in the opening by the force and/or that the sealing efficiency of the hot gas seal is increased by the force. Further, a hot gas seal assembly for sealing an opening in a heat shield element or between heat shield elements of a heat shield against a hot gas is provided, the assembly including a sealing body and a further sealing element which is in a solid state at room temperature and in a high viscosity liquid state at a temperature of the hot gas. | 2014-12-18 |
20140367926 | Foam Gasket and Bonding Tape Based On Polyurethane Dispersions - A polymer sheet includes a polyurethane core. The polyurethane core has a first major surface and a second major surface opposite the first major surface. The polymer sheet can have at least one functional layer overlying a major surface. The polymer sheet has a thickness t | 2014-12-18 |
20140367927 | APPARATUS AND METHOD FOR SEALING A DOCK LEVELER ASSEMBLY - A sealing device for use in sealing a gap formed by the interface between the floor, the dock leveler assembly, and a parked vehicle cargo frame includes a base portion having a bottom surface, an inner vertical surface, and a rear vertical surface. The bottom surface is adapted for sealing engagement with a loading dock floor. The sealing device further includes a first brush portion secured to the rear vertical surface of the base portion. The first brush portion includes a plurality of bristles and is adapted for sealing engagement with a vehicle cargo frame. The sealing device further includes a second brush portion secured to the inner vertical surface of the base portion. The second brush portion includes a plurality of bristles and is adapted for sealing engagement with an underside of the lip of a dock leveler assembly when the lip is in an extended position. | 2014-12-18 |
20140367928 | HANDHELD MACHINE TOOL - A handheld machine tool having an output shaft on which a tool holding fixture is developed, which has a multi-faced inner receptacle and a multi-faced outer receptacle, the multi-faced inner receptacle to connect to a tool insert, which can be locked using a locking device assigned to the tool holding fixture; the locking device having a locking sleeve which is displaceable for unlocking the tool insert against a spring force applied by an associated spring element in an axial direction facing away from the handheld machine tool, from a locking to an unlocking position, the locking sleeve has an operating element and a holding element connected to each other via a threaded connection, the holding element driven by the associated spring element in the direction of the locking position of the locking sleeve and the operating element enables displacement of the locking sleeve from the locking to the unlocking position. | 2014-12-18 |
20140367929 | TOOL HOLDER, COLLET AND METHOD TO CLAMP A TOOL IN A TOOL HOLDER - A tool holder includes a collet clamped with a tool, a collet chuck connected to a power tool, and a clamping nut connecting the collet to the collet chuck. At least two groove-shaped material recesses are created in a body of the collet. The at least two recesses extend in a lengthwise direction of the collet body, and starting from an open circumferential surface of the collet body, extend in a radial direction up to a limit stop. | 2014-12-18 |
20140367930 | PASSIVELY CONTROLLED ADJUSTABLE RIDE HEIGHT SUSPENSION - A suspension system for a vehicle having a vehicle body and a road wheel includes a suspension corner connecting the road wheel to the vehicle body. The suspension corner maintains contact between the road wheel and a road surface. The suspension system includes a bladder arranged at the suspension corner for pumping a fluid in response to forces generated at the wheel and holding a volume of the fluid. The suspension system also includes a reservoir in fluid communication with the bladder for selectively accumulating the fluid pumped by and releasing the fluid to the bladder. The suspension system additionally includes a valve for selectively retaining the accumulated fluid in and releasing thereof from the reservoir. The height of the bladder varies in response to the volume of fluid being held by the bladder to set a ride height of the vehicle at the suspension corner. | 2014-12-18 |
20140367931 | BICYCLE CONVERTIBLE TO A STROLLER - A bicycle convertible to a three-wheeled vehicle comprises a pair of auxiliary wheels mounted on either side of the rear wheel. The auxiliary wheels are movable between a raised position in which the auxiliary wheels are raised from the supporting surface when the bicycle is in a bicycle mode and a lowered position in which the auxiliary wheels contact the supporting surface when the bicycle is in a stroller mode. A locking mechanism is provided for locking the auxiliary wheels in the raised and lowered positions. | 2014-12-18 |
20140367932 | IN-LINE ROLLER SKATE - An in-line roller skate has a boot for accommodating a person's foot, a frame connected to the boot, and at least two wheels connected to the frame at a mutual distance in the skating direction for rideable support of the boot. The frame has a first frame portion and a second frame portion, wherein at least one wheel is connected to each frame portion and wherein the first frame portion and the second frame portion are mutually movable between a riding position and a braking position. | 2014-12-18 |
20140367933 | SNOWBOARD - A snowboard without foot bindings enables a rider to perform skateboard tricks while sliding on snow. A pair of runner boards is connected in a spaced longitudinal relationship by a strut. A pole is attached to the strut by a universal joint enabling a rider to perform maneuvers while holding onto a handle at the end of the pole. The universal joint enables the runner boards to rotate 360° about a longitudinal axis extending along the board and rotate 360° about a vertical axis and other angles therebetween providing the same freedom of movement to the runner boards that a skateboard provides for its rider. The pole is pivotally mounted to the connector enabling the pole to pivot through an arc of at least 180°. | 2014-12-18 |
20140367934 | WHEELBARROW WITH IMPROVED CAPACITY AND EASE OF USE - A wheelbarrow is provided. The wheelbarrow may include a frame, a handle at the rear of the frame for allowing a user to lift the frame and move the wheelbarrow, a bucket for carrying a load, the bucket having a lower surface, a front surface, and a concave recess disposed between the lower surface and the front surface and extending upwardly into the bucket, and a wheel disposed in the recess such that a top of the wheel is located above the bottom surface of the bucket and a back of the wheel is located behind the front surface of the bucket. | 2014-12-18 |
20140367935 | MODULAR VISCOUS FAN CLUTCH SYSTEM - A viscous clutch head may be replaced by selecting a viscous clutch head and a mount adapter. The viscous clutch head and the mount adapter may be selected from a group of universal modular fan drives and from a group of mount adapters. The mount adapter of a threaded type or a flange and bolt type may be selected. Depending on the viscous clutch head to be replaced, a fan adapter and/or a pilot adapter may also be selected from a group of fan adapters and from a group of pilot adapters. Accordingly, a range of models of viscous fan clutch systems may be replaced by using a limited number of parts. These parts may be stored on a tool cart. As different models of viscous fan clutch systems may be replaced using a limited number of parts, the in-stock inventory of replacement parts may be reduced. | 2014-12-18 |
20140367936 | Cabinet With Adjustable Shelf - A cabinet having a deep shelf with limited access is described and includes at least two opposite sides carrying track means to permit easy adjustment of the shelf between two or more levels by a single person maneuvering only the one accessible end of the shelf. The cabinet can be mounted on wheels to form a cart. One or more such adjustable shelves can be provided. The shelves may be positioned just above the bottom of the cart to provide a maximum depth cart for use, in intermediate positions for use with smaller objects and/or at the very top and/or side of the cart and locked in position to provide a secured interior for the cabinet. | 2014-12-18 |
20140367937 | SYSTEM FOR MANIPULATING CONCRETE SPREADING HOSES - A mobile support system for supporting a concrete pouring hose supports ten to sixteen feet of hose while providing sufficient ground clearance to avoid common obstacles. The mobile support system features large castors and conveniently placed hand holds to permit the mobile support system to be moved safely and easily. The system provides for socketed leg attachment, thereby allowing for ease of disassembly and storage. | 2014-12-18 |
20140367938 | Corner Dolly Skate - A heavy duty corner skate dolly is provided. The dolly frames includes a rectangular shaped plate with a L-shaped angle riser welded or permanently screwed to its top surface. The dolly plate's bottom surface includes a hole or a plurality of holes that are routed into the plates surfaces with a depth that is arrange to accept an industrial magnet or a plurality of industrial magnets that are partially incased in a metal plated finish and attached to the bottom surface of the plate by a fastening cap or a plurality of fastening caps that are pressed into or welded to the bottom surface. A plurality of stem fitted swivel caster wheels are mounted to the rectangular shaped plate by inserting each swivel caster wheel into its corresponding caster fastening holes at the frames bottom and bolting each swivel caster wheel at the frames top by a plurality of corresponding spring washers, lock washers, and hexagon shaped nuts. | 2014-12-18 |