50th week of 2008 patent applcation highlights part 14 |
Patent application number | Title | Published |
20080303145 | Printed Circuit Board, Printed Circuit Board Manufacturing Method and Electronic Device - According to one embodiment, there is provided a printed circuit board which comprises a printed wiring board, a semiconductor package having a number of solder bonding members arranged on its back side and mounted on the printed wiring board by the solder bonding members being soldered to the wiring board, and reinforcing members which are formed of a reinforcing material having a solder flux function and locally reinforce the solder bonding members in a number of places on the semiconductor package mounting portion of the printed wiring board. | 2008-12-11 |
20080303146 | PROCESS FOR MANUFACTURING SUBSTRATE WITH BUMPS AND SUBSTRATE STRUCTURE - A process for manufacturing a substrate with bumps is provided. First, a metallic substrate having a body and a plurality of conductive elements is provided. Next, a first dielectric layer is formed on the body, and the conductive elements are covered by the first dielectric layer. Then, a plurality of circuits and a plurality of contacts are formed on a surface of the first dielectric layer, and the contacts are electrically connected to the conductive elements. Next, a second dielectric layer is formed on the surface of the first dielectric layer, and the circuits are covered by the second dielectric layer. Finally, the body is patterned to form a plurality of bumps, and the bumps are electrically connected to the contacts by the conductive elements. The bumps are formed by etching the body, so the connection reliability between bumps and conductive elements is desirable, and the manufacturing cost is reduced. | 2008-12-11 |
20080303147 | HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR - A semiconductor chip is provided with a high-frequency circuit. A multi-layer wiring section is comprised of organic material and formed on the semiconductor chip, an outermost layer of the multi-layer wiring section formed with a bump forming portion. A bump is formed on the bump forming portion. The multi-layer wiring section is provided with a reinforcing means for suppressing a deformation of a bonding portion between the bump and the bump forming portion when the high-frequency circuit device is bonded to a substrate with an ultrasonic vibration applied thereto. | 2008-12-11 |
20080303148 | PAD ARRANGEMENT OF DRIVER IC CHIP FOR LCD AND RELATED CIRCUIT PATTERN STRUCTURE OF TAB PACKAGE - Output pads on an integrated circuit (IC) chip are arranged along a first longer side and are arranged along a second longer side with input pads. The output pads are connected to respective output patterns formed on top and bottom surfaces of a base film. All the output patterns may pass over the first longer side. Alternatively, the output patterns connected to the output pads at the second longer side may pass over a shorter side. These pattern structures establish an effective pad arrangement without increasing the size of a TAB package, yet allowing reduced the chip size. | 2008-12-11 |
20080303149 | Electronic Component - An electronic component including, on one surface of a substrate ( | 2008-12-11 |
20080303150 | High-Density Fine Line Structure And Method Of Manufacturing The Same - A high-density fine line circuit structure mainly includes: a first semiconductor device, an insulated layer on the same surface, an outer circuit layer above the first semiconductor device, and a solder mask formed on the outer circuit layer. The surface which is not covered by the solder mask can be made to be a pad, and electrically connected with a second semiconductor device. The fine line circuit layer, which is exposed, is to be a tin ball pad where a tin ball is filled. Electroplating rather than the etching method is used for forming the fine line circuit layer, and a carrier and a metal barrier layer, which are needed during or at the end of the manufacturing process, are removed to increase the wiring density for realizing the object of high-density. | 2008-12-11 |
20080303151 | Method of Packaging a Microchip - A method of packaging an integrated circuit singulates a wafer to form an integrated circuit, positions the integrated circuit on a carrier, and passivates the integrated circuit after the positioning the integrated circuit on the carrier. At this point, the integrated circuit is secured to the carrier. The method also electrically connects the integrated circuit to a plurality of exposed conductors. | 2008-12-11 |
20080303152 | Contact pad and method of forming a contact pad for an integrated circuit - A contact pad in an integrated circuit is disclosed. The contact pad comprises a flat portion comprising a base of the contact pad; a plurality of projections extending from and substantially perpendicular to the flat portion; and a solder ball attached to the projections and the flat portion. A method of forming a contact pad is also disclosed. | 2008-12-11 |
20080303153 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE PRODUCT - In a semiconductor device, a semiconductor element is built into a resin molded part molded in a flat plate shape. A wiring is electrically connected to the semiconductor element and is disposed on one surface of the resin molded part so that an inner surface side of the wiring is sealed with the resin molded part and an outer surface of the wiring is exposed flush with the one surface of the resin molded part. An electrode is disposed on the wiring in an outside of a plane area of the semiconductor element and extends through the resin molded part in a thickness direction. A tip part of the electrode protrudes from the other surface of the resin molded part. | 2008-12-11 |
20080303154 | Through-silicon via interconnection formed with a cap layer - An integrated circuit structure and methods for forming the same are provided. The method includes providing a substrate; forming a through-silicon via (TSV) opening extending into the substrate; forming an under-bump metallurgy (UBM) in the TSV opening, wherein the UBM extends out of the TSV opening; filling the TSV opening with a metallic material; forming a patterned cap layer on the metallic material; and etching a portion of the UBM outside the TSV opening, wherein the patterned cap layer is used as a mask. | 2008-12-11 |
20080303155 | DIELECTRIC BARRIER FILMS FOR USE AS COPPER BARRIER LAYERS IN SEMICONDUCTOR TRENCH AND VIA STRUCTURES - The present invention is directed to improved dielectric copper barrier layer and related interconnect structures. One structure includes a semiconductor substrate having a copper line. An insulating layer formed of at least one of silicon and carbon is formed on the underlying copper line. An opening is formed in the insulating layer to expose a portion of the copper line. The inner surface of the opening in the insulating layer has a dielectric barrier layer formed thereon to prevent the diffusion of copper into the insulating layer. A copper plug is formed to fill the opening and make electrical contact with the underlying copper interconnect structure. Aspects of the invention also include methods for forming the dielectric copper barrier layers and associate copper interconnects to the underlying copper lines. | 2008-12-11 |
20080303156 | Semiconductor Devices and Methods of Forming Interconnection Lines Therein - An example disclosed semiconductor device includes a semiconductor substrate, a lower interlayer insulating layer formed on the substrate, a lower wire formed on the lower interlayer insulating layer, and an upper interlayer insulating layer which is formed on the lower interlayer insulating layer and has a via hole to expose the lower wire. The lower wire includes a metal layer pattern and a conductive layer pattern, and the metal layer pattern has a protruding portion and the conductive layer pattern is formed on the upper part of the protruding portion of the metal layer pattern and has a hole to expose the protruding portion. | 2008-12-11 |
20080303157 | HIGH THERMAL CONDUCTIVITY SUBSTRATE FOR A SEMICONDUCTOR DEVICE - A method and apparatus for packaging semiconductor dies for increased thermal conductivity and simpler fabrication when compared to conventional semiconductor packaging techniques are provided. The packaging techniques described herein may be suitable for various semiconductor devices, such as light-emitting diodes (LEDs), central processing units (CPUs), graphics processing units (GPUs), microcontroller units (MCUs), and digital signal processors (DSPs). For some embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower cavity with one or more metal layers deposited therein to dissipate heat away from the semiconductor dies. For other embodiments, the package includes a ceramic substrate having an upper cavity with one or more semiconductor dies disposed therein and having a lower surface with one or more metal layers deposited thereon for efficient heat dissipation. | 2008-12-11 |
20080303158 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - In a semiconductor integrated circuit device having plural layers of buried wirings, it is intended to prevent the occurrence of a discontinuity caused by stress migration at an interface between a plug connected at a bottom thereof to a buried wiring and the buried wiring. For example, in the case where the width of a first Cu wiring is not smaller than about 0.9 μm and is smaller than about 1.44 μm, and the width of a second Cu wiring and the diameter of a plug are about 0.18 μm, there are arranged two or more plugs which connect the first wirings and the second Cu wirings electrically with each other. | 2008-12-11 |
20080303159 | Thin Silicon based substrate - Embodiments of the invention provide a device with a die and a substrate having a similar coefficient of thermal expansion to that of the die. The substrate may comprise a silicon base layer. Build up layers may be formed on the side of the base layer further from the die. | 2008-12-11 |
20080303160 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning - The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structured molds. | 2008-12-11 |
20080303161 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method of manufacturing a semiconductor device includes: preparing a semiconductor element having a first metal layer made of first metal on a surface thereof, and a metal substrate made of second metal, the metal substrate having a fourth metal layer made of fourth metal on a surface thereof, and mounting the semiconductor element on the surface thereof; providing metal nanopaste between the first metal layer and the fourth metal layer, the metal nanopaste being formed by dispersing fine particles made of third metal with a mean diameter of 100 nm or less into an organic solvent; and heating, or heating and pressurizing the semiconductor element and the metal substrate between which the metal nanopaste is provided, thereby removing the solvent. Further, each of the first, third and fourth metals is made of any metal of gold, silver, platinum, copper, nickel, chromium, iron, lead, and cobalt, an alloy containing at least one of the metals, or a mixture of the metals or the alloys. By the manufacturing method, it is possible to bond the semiconductor element to the metal substrate favorably. | 2008-12-11 |
20080303162 | SEMICONDUCTOR DEVICE - A semiconductor device includes a layered structure including a first nitride semiconductor layer and a second nitride semiconductor layer that are sequentially formed over a substrate in this order. The second nitride semiconductor layer has a wider bandgap than the first nitride semiconductor layer. A first electrode and a second electrode are formed spaced apart from each other on the layered structure. A first insulating layer with a high breakdown field is formed in a region with electric field concentration between the first electrode and the second electrode over the layered structure. The first insulating layer has a higher breakdown field than air. | 2008-12-11 |
20080303163 | THROUGH SILICON VIA DIES AND PACKAGES - A method for preparing a die for packaging is disclosed. A die having first and second major surfaces is provided. Vias and a mask layer are formed on the first major surface of the die. The mask includes mask openings that expose the vias. The mask openings are filled with a conductive material. The method includes reflowing to at least partially fill the vias and contact openings to form via contacts in the vias and surface contacts in the mask openings. | 2008-12-11 |
20080303164 | STRUCTURE AND METHOD OF REDUCING ELECTROMIGRATION CRACKING AND EXTRUSION EFFECTS IN SEMICONDUCTOR DEVICES - A structure for reducing electromigration cracking and extrusion effects in semiconductor devices includes a first metal line formed in a first dielectric layer; a cap layer formed over the first metal line and first dielectric layer; a second dielectric layer formed over the cap layer; and a void formed in the second dielectric layer, stopping on the cap layer, wherein the void is located in a manner so as to isolate structural damage due to electromigration effects of the first metal line, the effects including one or more of extrusions of metal material from the first metal line and cracks from delamination of the cap layer with respect to the first dielectric layer. | 2008-12-11 |
20080303165 | CIRCUIT ARRANGEMENT AND INTEGRATED CIRCUIT - A circuit arrangement includes a plurality of type-identical and identically operated active components, or separate sections of an active component, and includes a branched wiring structure for the interconnection of component connections. In each case the wiring end portions lie between a branching point and an input of different components or sections, wherein the wiring end portions are formed with predetermined geometrical asymmetry with respect to one another in such a way that there is an electrical symmetry of the interconnection configuration between all the connected type-identical components or sections. More particularly, the impedance values between the branching point and the different inputs and outputs are substantially identical. | 2008-12-11 |
20080303166 | TWO-SIDED SUBSTRATE LEAD CONNECTION FOR MINIMIZING KERF WIDTH ON A SEMICONDUCTOR SUBSTRATE PANEL - A semiconductor die substrate panel is disclosed including a minimum kerf width between adjoining semiconductor package outlines on the panel, while ensuring electrical isolation of plated electrical terminals. By reducing the width of a boundary between adjoining package outlines, additional space is gained on a substrate panel for semiconductor packages. | 2008-12-11 |
20080303167 | DEVICE HAVING HIGH ASPECT-RATIO VIA STRUCTURE IN LOW-DIELECTRIC MATERIAL AND METHOD FOR MANUFACTURING THE SAME - A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar. | 2008-12-11 |
20080303168 | STRUCTURE FOR PREVENTING PAD PEELING - A structure for preventing pad peeling includes a semiconductor substrate, a dielectric layer, a pad, and a protective layer. The semiconductor substrate has an active circuit structure. The dielectric layer is disposed on the semiconductor substrate and has an opening located in the dielectric layer above an edge position of the corresponding active circuit structure. Besides, the opening exposes a part of the surface of the active circuit structure. The pad disposed above the semiconductor substrate covers the dielectric layer above the position of the corresponding active circuit structure and fills up the opening. The protective layer is disposed on the dielectric layer and covers the edge of the pad. | 2008-12-11 |
20080303169 | Integrated Circuit Arrangment Including Vias Having Two Sections, and Method For Producing the Same - An integrated circuit arrangement containing a via is disclosed. The via has an upper section having greatly inclined sidewalls. A lower section of the via has approximately vertical sidewalls. In one embodiment, a liner layer is used as a hard mask in the production of the via and defines the position of the sections of the via. | 2008-12-11 |
20080303170 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - A semiconductor device | 2008-12-11 |
20080303171 | Semiconductor device and a fabrication process thereof - A semiconductor device formed by the steps of forming a contact hole in an insulation film so as to extend therethrough and so as to expose a conductor body at a bottom part of the contact hole, forming a barrier metal film of tungsten nitride on the bottom part and a sidewall surface of the contact hole with a conformal shape to the bottom part and the sidewall surface of the contact hole, forming a tungsten layer so as to fill the contact hole via the barrier metal film, and forming a tungsten plug in the contact hole by the tungsten layer by polishing away a part of the tungsten film on the insulation film until a surface of the insulation film is exposed, wherein there is conducted a step of cleaning a surface of the conductor body prior to the forming step of the barrier metal film. | 2008-12-11 |
20080303172 | METHOD FOR STACKING SEMICONDUCTOR CHIPS AND SEMICONDUCTOR CHIP STACK PRODUCED BY THE METHOD - Apparatus for packaging two chips includes, in some embodiments, a first chip having at least one elevation and at least one cutout on a bottom thereof. It also includes a second chip having at least one elevation and at least one cutout on a top thereof. In some embodiments disclosed, the elevations and cutouts of the first chip and the second chip are configured to allow the elevations to be intermeshed with the cutouts when the chips are stacked with the bottom of the first chip engaging the top of the second chip. | 2008-12-11 |
20080303173 | SEMICONDUCTOR DEVICE, A METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A TESTING METHOD OF THE SAME - A semiconductor device for SiP or PoP for downsizing, a method of manufacturing it, and a testing method suitable for SiP and PoP in which the simplification of a system and the enhancement of its efficiency are achieved are provided. A first semiconductor device including a first memory circuit determined as non-defective and a second semiconductor device including a second memory circuit and a signal processing circuit carrying out signal processing according to a program, determined as non-defective are sorted. The sorted devices are assembled as an integral semiconductor device. On a board for testing, a clock signal equivalent to the actual operation of the semiconductor device is supplied. A test program for conducting a performance test on the first memory circuit is written from a tester to the second memory circuit of the second semiconductor device. In the signal processing circuit, a performance test is conducted on the first memory circuit according to the written test program in correspondence with the clock signal. The result of failure/no-failure determination in this performance test is outputted to the tester. | 2008-12-11 |
20080303174 | CHIP PACKAGE WITHOUT CORE AND STACKED CHIP PACKAGE STRUCTURE - A chip package including a base, a chip, a molding compound and a plurality of outer terminals is provided. The base is essentially consisted of a patterned circuit layer having a first surface and a second surface opposite to each other and a solder mask disposed on the second surface, wherein the solder mask has a plurality of first openings by which part of the patterned circuit layer is exposed. The chip is disposed on the first surface and is electrically connected to the patterned circuit layer. The molding compound covers the pattern circuit layer and fixes the chip onto the patterned circuit layer. The outer terminals are disposed in the first openings and electrically connected to the patterned circuit layer. | 2008-12-11 |
20080303175 | Electronic circuit package - An electronic apparatus which includes a wiring substrate which includes wiring conductors, and a plurality of semiconductor bare chips that are formed on the wiring substrate. The semiconductor bare chips include a processor for processing data and a circuit having a checking function for detecting faults of the processor | 2008-12-11 |
20080303176 | Patterned Die Attach and Packaging Method Using the Same - A semiconductor die is attached to a packaging substrate by a patterned layer of conductive metal that includes voids. The voids provide a space into which the metal may expand when heated in order to avoid placing mechanical stress on the bonds caused by mismatches in the thermal coefficients of thermal expansion of the die, the conductive metal bond layer and the substrate. An additional coating of conductive metal may be flowed over the bond lines to reinforce the bonds. | 2008-12-11 |
20080303177 | BONDING PAD STRUCTURE - A bonding pad structure including a bonding pad and a passivation layer is described. The bonding pad is disposed on a chip. The passivation layer covers the bonding pad. In addition, the passivation layer has a first opening exposing a bonding region of the bonding pad and a second opening exposing a probing region of the bonding pad, respectively. | 2008-12-11 |
20080303178 | Carburettor - The carburettor ( | 2008-12-11 |
20080303179 | METHOD FOR MOLDING AN OPTICAL ELEMENT AND MOLDING APPARATUS THEREFOR - There are provided a molding method and a molding apparatus for an optical element, which are capable of heating or cooling a material in a mold with a symmetrical temperature distribution that corresponds to the shape or the optical performance of an optical element to be molded. | 2008-12-11 |
20080303180 | METHOD OF MANUFACTURING ALL-IN-ONE TYPE LIGHT GUIDE PLATE - Provided is a method of manufacturing an all-in-one type light guide plate. The method includes: fabricating a master including a plurality of inverse-prism shape structures; forming an elastic mold by applying an elastomer on the master; and fabricating the all-in-one type light guide plate, on which a plurality of inverse-prism shape structures are integrally formed, by applying a light transmissive material on the elastic mold. | 2008-12-11 |
20080303181 | Shaded Zirconia Ceramics - The invention relates to compositions based on Ce-stabilized ZrO | 2008-12-11 |
20080303182 | Method for Producing Panels of Thermoplastically Extruded Synthetic Materials - A method for the production of plates of thermoplastically extruded synthetic materials, particularly for TFT screens, wherein the plates are extruded in a conical manner. The conically extruded panels are extruded in a polishing stack, such as a three-roll polishing stack. At least one roll of the stack may have a conical profile. | 2008-12-11 |
20080303183 | MOLDING MACHINE - A mold core includes a forming pin having a hollow interior and an end wall. A passage, preferably in the form of a hollow tube, extends into the hollow interior of the forming pin and has an end sealingly secured at a position spaced from the end wall of the forming pin. A poppet valve is disposed on the end wall of the forming pin. The poppet valve is responsive to air pressure within the passage to open and permit flow of air through the end wall of the forming pin to assist stripping of molded articles from the mold core. The poppet valve includes a valve element having an outer end at the end face of the forming pin and an inner end adjacent to the end of the passage. A spring preferably biases the valve element to a closed position. The spring preferably comprises a coil spring captured in compression between the valve element and the forming pin. | 2008-12-11 |
20080303184 | ELECTROSTATICALLY DISSIPATIVE FLUOROPOLYMERS - A composition of fluoropolymer and dispersed conductive particulate provides an electrically conductive polymeric material resistant to static charge buildup. Radiation curing, especially electron beam radiation curing, is favored for curing fluoroelastomer-based precursor articles into desired electrically conductive articles. | 2008-12-11 |
20080303185 | Molding System and Process for Making Product having Reduced Warpage Susceptibility - Disclosed is a molding-system process. The molding-system process includes a receiving operation, including receiving a polymer unit, a cyclic olefin copolymer unit and a reinforcement unit. The polymer unit and the reinforcement unit are separate from each other prior to the polymer unit and the reinforcement unit being received. Once received, the polymer unit, the cyclic olefin copolymer unit and the reinforcement unit are converted into a molding material. The molding material is to be transferred into a mold. In response the mold forms a product having reduced susceptibility to warpage. | 2008-12-11 |
20080303186 | Method for Manufacturing Cageless Lavatory Dispensing Devices - The present invention relates to a method for the manufacture of a lavatory dispensing device useful for the delivery of at least one treatment composition, preferably a cleaning composition and/or a sanitizing composition to a sanitary appliance. | 2008-12-11 |
20080303187 | Imprint Fluid Control - An imprint lithography template with an active area arranged to receive imprinting material during an imprint lithography process and a non-active area adjacent the active area is described. At least a portion of the non-active area is treated to inhibit flow of the imprinting material from the active area to the non-active area during the imprint lithography process. | 2008-12-11 |
20080303188 | Method and Device for the Preparation of a Template to make a Prototype for Jewelry - A jewelry template made from chemical compounds to form a polyurethane substance that hardens in stages enabling the prototype to be inserted while the mixture is malleable and thereafter removed when the template is hard. A simple and efficient method of removing the prototype from the template. | 2008-12-11 |
20080303189 | Latex Accelerator Composition - Accelerator composition for a rubber latex derived from a conjugated diene and optionally a vinyl aromatic comonomer comprising: (i) a diisopropyl xanthogen polysulphide (DIXP), (ii) an alkyldithiocarbamate wherein the alkyl chain contains from 5 to 20 carbon atoms, and (iii) diphenylguanidine (DPG), a curable aqueous synthetic rubber latex composition comprising said accelerator composition, a process for the water-based solvent-free manufacture of synthetic shaped synthetic elastomeric articles, prepared by using said accelerator composition. | 2008-12-11 |
20080303190 | METHOD OF MANUFACTURING A GOLF BALL - The present invention provides a method of manufacturing golf balls having a rubber core of at least one layer and a cover of at least one layer which encloses the rubber core, which method includes the step of molding at least one layer of the rubber core by directly injecting a rubber composition into a spherical cavity and vulcanizing the injected composition. This process enables the sphericity of the rubber core to be enhanced, the rubber materials to be used without waste, and balls of an excellent scuff resistance to be obtained. | 2008-12-11 |
20080303191 | Methods and systems for preparing gypsum slurry containing a cellulose ether - A method for forming a gypsum slurry comprises the steps of combining gypsum and water to form a slurry, combining cellulose ether with at least a second material configured to delay solubilization of the cellulose ether, and adding the combined cellulose ether and at least a second material to the slurry. | 2008-12-11 |
20080303192 | AQUEOUS AROMATIC POLYURETHANE ELASTOMERIC ARTICLES AND METHOD OF FABRICATING THE SAME - An aqueous aromatic polyurethane elastomeric article is fabricated by an aqueous aromatic polyurethane dispersion, prepared by polyurethane prepolymers comprising wholly aromatic diisocyanates, especially toluene diisocyanate (TDI). And, a method of fabricating the elastomeric article is provided. | 2008-12-11 |
20080303193 | Mold, Method Of Producing The Mold, And Method Of Producing Molded Article Using The Same - The present invention provides a mold which is processed by ion beam irradiation or electron beam irradiation and in which a throughput of the mold is high and a decrease in the throughput or electrostatic discharge due to charging does not occur, a method of producing the mold, and a method of producing a molded article produced using the mold. | 2008-12-11 |
20080303194 | MOLD APPARATUS FOR FORMING POLYMER AND METHOD - Various mold apparatuses and methods for forming a polymer with induction heat energy are provided. In one embodiment of the present invention, a mold apparatus for forming polymer includes a mold having a top mold portion and a top mold surface that is magnetic. The bottom mold portion of the mold includes an induction heating unit that is at least partially embedded in the bottom mold portion that provides induction heat energy to the mold. The mold apparatus is constructed and arranged to dissipate greater than about 50% of the induction heat energy in the top mold portion. The induction heating unit of the bottom portion of the mold provides rapid heating the top mold surface to provide high surface quality polymer parts a shorter molding cycle time while utilizing less energy. | 2008-12-11 |
20080303195 | Molten Metal Holding Furnace - A molten metal holding furnace for supplying a constant quantity of the molten metal to a casting machine is composed of a holding chamber having a melt supply port, and a pressurization chamber having an upward melt outlet port. The holding chamber and the pressurization chamber are communicated with each other via an openable/closable first melt flow passage. The pressurization chamber is composed of a outlet section at which the melt outlet port is positioned and a pressurization section positioned on one side closer to the holding chamber. The holding chamber and the outlet section are juxtaposed with the pressurization section interposed therebetween, where the first melt flow passage is formed at a hearth of the pressurization section, and an openable/closable second melt flow passage communicating with the outlet section is formed at a hearth of the pressurization section. | 2008-12-11 |
20080303196 | UPPER STRUT MOUNT ASSEMBLY - An upper strut mount assembly includes a cylindrical member. The cylindrical member includes a top portion, a bottom portion, and an annular portion. A bottom surface of the annular portion abuts at least a top portion of a rolling member thereby allowing the spring seat to rotate relative to at least the cylindrical member. A first resilient member includes a first annular portion and a second annular portion. A bottom surface of the first annular portion abuts a top surface of the cylindrical member annular portion. A second resilient member includes a first annular portion and a second annular portion. A bottom surface of the first annular potion abuts a top surface of the cylindrical member annular portion. An exposed surface of the second annular portion of the second resilient abuts an exposed surface of the second annular portion of the first resilient member. | 2008-12-11 |
20080303197 | MODULAR WELDING FIXTURE - A tooling fixture is disclosed that includes a weldment having spaced apart lateral members interconnected by opposing side members. Spaced apart trunnions support the side members for rotation about an axis, in one example. A locating pin is arranged between each side member and trunnions to enable quick and accurate location of the tooling fixture relative to the trunnions. The pins are at a right angle relative to the axis, in one example. Tooling plates are removable secured to each of the lateral members. Adjustable brackets are secured to the tooling plates and support tooling that cooperates with a workpiece supported on the tooling fixture. In one example, jack blocks, shims, squaring plates and stops are used to permit precise adjustment and repeatable relocation of the tooling in three directions. | 2008-12-11 |
20080303198 | SHEET METAL GROUND CONDUCTOR CLAMP - A ground conductor clamp has a sheet metal clamp body with overlapped portions. The clamp body may be stamped from sheet metal. The overlapped portions have aligned circular holes in them for receiving a threaded insert nut inserted into them. The insert nut is spin riveted to attach it to the overlapped portions of the clamp body. A flange of the insert nut has a flat face that engages the clamp body to prevent rotation of the insert nut. The overlapped portion includes an inner bent tab that strengthens the sheet metal clamp body. The clamp also includes a threaded fastener, such as a bolt, that is threaded into the insert nut to engage a conductive lead and a ground conductor, such as a ground rod or ground electrode. | 2008-12-11 |
20080303199 | Cutting/chopping board including operator safety means - A cutting board ( | 2008-12-11 |
20080303200 | IMAGE FORMING SYSTEM - In an image forming system including an intermediate conveyance apparatus capable of superimposing plural sheets conveyed from an image forming apparatus, and of conveying the superimposed sheets to a sheet finisher as a set, a controller causes a conveyance interval for sheets in the image forming apparatus to be the first conveyance interval, then, superimposes plural sheets in the intermediate conveyance apparatus, and conveys superimposed sheets to the sheet finisher as a set, when characteristic information of sheets to be conveyed continuously agrees with a prescribed condition. The controller causes a conveyance interval for sheets to be the second conveyance interval greater than the first conveyance interval, and conveys sheets from the intermediate conveyance apparatus to the sheet finisher, without superimposing sheets in the intermediate conveyance apparatus, when the characteristic information of sheets to be conveyed continuously does not agree with the prescribed condition. | 2008-12-11 |
20080303201 | BOOKBINDING APPARATUS, BOOKBINDING SYSTEM AND IMAGE FORMATION PROCESSING SYSTEM - In a bookbinding apparatus, an adhesive applying portion applies an adhesive to an end face of a sheet bundle allowed to stand in the substantially vertical direction, a storage portion that gathers and stores the sheet bundle which is applied with the adhesive and bound in the adhesive applying portion while letting the sheet bundle stand in the substantially vertical direction, transport means for conveying the sheet bundle while letting the sheet bundle stand in the substantially vertical direction from the adhesive applying portion to the storage portion along a substantially vertical transport path, and a cutting portion which is provided on the transport path between the adhesive applying portion and the storage portion, and which cuts an end face of the sheet bundle while letting the sheet bundle stand in the substantially vertical direction. | 2008-12-11 |
20080303202 | SHEET CONVEYING DEVICE AND IMAGE FORMING APPARATUS - A fluctuation detecting unit detects a fluctuation of an endless belt generated when a sheet is brought into contact with a predetermined position of the endless belt at an upstream side in a conveying direction from a nip portion based on fluctuation information acquired by a fluctuation information acquiring unit. An entry timing estimating unit estimates entry timing of the sheet into the nip portion based on a detection of the fluctuation. A correction control unit corrects a speed fluctuation of the endless belt generated when the sheet enters the nip portion by performing a feedforward control of a first driving unit based on the entry timing. | 2008-12-11 |
20080303203 | PAPER FEED MECHANISM FOR A PRINTING STATION - A paper feed mechanism for a printing station. The mechanism includes a primary set of rollers and a secondary set of rollers for feeding a sheet of paper past a printhead, and a pivot rod rotatably driven by a drive means. Also included is a pick-up bar pivotally connected to the pivot rod via swing arms, the pick-up bar having a foot portion to facilitate pick-up of a sheet of paper from a stack. The mechanism further includes a fluid hose attached to the foot portion, said fluid hose operatively delivering pressurised air to the foot portion to facilitate pick-up of a sheet from the stack, wherein the pick-up bar delivers the sheet to the rollers. | 2008-12-11 |
20080303204 | PAPER FEEDING DEVICE - A paper feeding device comprises a supporting frame, a pickup roller assembly, a paper blocking unit, a base and a sensor. The paper blocking unit is placed beside the pickup roller assembly, having a paper blocking element connected to the supporting frame, including a connecting portion, the connecting portion extends downwards to form a paper blocking arm. The sensor is located in the base, having an emitting arm and a receiving arm. The lower portion of the paper blocking arm can be located between the emitting arm and the receiving arm or depart from them for turning off/on the sensor. The paper feeding device decides whether the paper is provided on the base by the turn on/off status of the sensor, so an additional obstructer is avoided. Compared with conventional paper feeding device, the structure of the present invention is simple, and it is convenient to assemble. | 2008-12-11 |
20080303205 | STACKER TRAY ASSEMBLY FOR A PHOTOCOPIER - A stacker tray assembly for a photocopier is easily mounted or removed from the copier, and permits facile handling of large copies. The stacker tray assembly for a photocopier for producing large copies has a main plate which has a copy side for insertion into the copier and a copy receiving end for receiving copies oppositely disposed therefrom. The stacker tray assembly also has a tilt plate at the copy receiving end to support the copies, as they exit the copier. | 2008-12-11 |
20080303206 | Sheet feeding apparatus, image forming apparatus and sheet feeding method - A sheet feeding apparatus includes: a multiple-feed detecting section that detects recording sheets to be transported by plural rolls in a direction; a separating section that separates an uppermost sheet of the recording sheets from the other; a slippage detecting section that detects a slippage of the uppermost recording sheet with respect to a roll; and a transporting-speed reduction suppressing section that suppresses a transporting-speed of the uppermost recording sheet from reducing from a value, the separation section including: a transporting roll that transports recording sheets in a transporting direction; and a separation roll that is placed to be opposed to and to be press-contacted with the transporting roll through a recording sheet, the transporting-speed reduction suppressing section changing a separation torque of the separation roll according based on a result of detection by the multiple-feed detecting section and a result of detection by the slippage detecting section. | 2008-12-11 |
20080303208 | Magnetic dice and magnetic dice games - A game of dice for multiple players comprising, at least two multi-surfaced dice, each of the at least two multi-surfaced dice having game information on at least one surface thereof relating to the initial number of lives for each of the at least two multi-surfaced dice, and having game information on at least one surface thereof for determining the number of lives to be deducted from the then current number of lives on at least one other die, the dice being flicked or thrown by the players to determine the reduction of lives of at least one other die until at least one die no longer has any lives. | 2008-12-11 |
20080303209 | Gaming Console Storage Apparatus - A portable, light-weight storage apparatus for storing a video game console that also allows a user to sit comfortably in a couch or chair and play video games in front of a living room television or the like. The apparatus provides an “all-in-one” control center with multiple accessories, including an “arcade style” player pad, storage for the video game console unit, storage for a hand-held controller and video game media, instruction and code booklet storage, a player privacy shield and a drink holder. When not in use the storage unit can be easily transported away from the television area to an out of the way location. | 2008-12-11 |
20080303211 | Three-dimensional logical cube - A three-dimensional logical cube has 6 faces in the same configuration of Rubik's Cube (trademark). A three-dimensional logical cube has an N×N array of cells on each face. Each cell on a three-dimensional logical cube has a numerical value, solid and hollow dots, solid dots, or shapes, on it. A 2×2×2 cube has four numbers from 1 to 4 on its face; a 2×2×2 cube has two solid dots and two hollow dots with the same color on its face (2×2×2 alternate embodiment); a 2×2×2 cube has 1 dot to 4 dots on its cell (2×2×2 alternate embodiment); a 2×2×2 cube have same kind of shape on its face (2×2×2 alternate embodiment); a 3×3×3 cube has nine combination numbers between 1 to 12 on its face; a 3×3×3 cube has nine numbers from 1 to 9 on its face (3×3×3 alternate embodiment); a 3×3×3 cube has either a blank cell or a dot on its face (3×3×3 alternate embodiment); a 3×3×3 cube have same kind of shape on its face (3×3×3 alternate embodiment); a 4×4×4 cube has sixteen numbers from 1 to 16 on its face; and a 5×5×5 cube has twenty-five numbers from 1 to 25 on its face; The present three-dimensional logical cube when successfully solved, for numerical cell cubes, all six faces, and nine rows (six rows for 3×3×3 cubes) of adjacent cells located on four adjacent faces (two adjacent faces for 2×2×2 cube and three adjacent faces for 3×3×3 alternate embodiment) will have difference numerical numbers on its cell (no two numbers are alike); for shape cube, all six faces will have same shape for each cell on the same face; for solid and hollow dot cube, any faces will have the two solid dots and two hollow dots on its for all six faces; for solid only dot cube (3×3×3), any two opposite faces will have total of seven dots for all six faces; and solid only dot (2×2×2), each cell on the same face has 1 dot, 2 dots, 3 dots and 4 dots for all six faces, and four adjacent cells located around two faces will have 1 dot, 2 dots, 3 dots and 4 dots on its cell. The present three-dimensional logical cube is more challenging than the Rubik's Cube (trademark) with 2×2×2 the simplest logical cube to 3×3×3 challenge, 4×4×4 more challenge, and 5×5×5 which is the most challenge logical cube to solve. | 2008-12-11 |
20080303212 | Three-Dimensional Puzzle Maze - A 3-dimensional puzzle maze structure that can be made by foam pieces that are inter-connected with one another. Castle pieces can fit onto the base pieces. Castle pieces can also fit onto other castle pieces. Second base pieces can fit on top of castle pieces. The users can build this type of 3-dimensional puzzle maze according to individual creativity and imagination. This puzzle maze is stimulating towards children's play activities and good for education purposes. | 2008-12-11 |
20080303213 | Soccer game - The present invention is a novel table top soccer game that provides for variety in game play. Figurines may be manipulated by players in order to direct or block a spherical unit representing a soccer ball. The object of the game is to score a predetermined number of goals and the game may be played with or without cards that provide for variety in game outcome. | 2008-12-11 |
20080303214 | Baccarat bonus feature - A method of playing a game of Baccarat is disclosed. Upon a triggering event, a first card in either the Player or Banker hand is revealed, and the player is permitted to make a second wager based on information gained from knowledge of the rank of the revealed card. If the hand the player wagers on wins, a payout is made on both wagers. | 2008-12-11 |
20080303215 | Modified Baccarat Card Game - There is disclosed a method of playing a modified baccarat card game involving a dealer and a banker, who may be the same person or may be one or more computing devices, and at least one player. At least one player may make a wager on PLAYER, BANKER, or TIE. Two cards may be dealt to each of a PLAYER hand and a BANKER hand, one of the BANKER cards being dealt face down. The PLAYER hand may or may not receive a third card depending on the value of the modulo | 2008-12-11 |
20080303216 | TABLE CARD GAME - A method of playing a table card game is provided. A player makes a first wager as to whether a predetermined number of cards in a hand of cards dealt to the player will add up to a predetermined qualifying value. The player may also optionally make a bonus wager as to whether the predetermined number of cards will be a bonus combination. If the player cannot make the qualifying value the player loses the wagers, otherwise the player is paid according to a pay scale. The player may then optionally make a second chance wager and a second chance bonus wager based on the predetermined number of cards in a hand of community cards dealt. If the qualifying value cannot be made from the community hand, the player loses the wagers, otherwise the player is paid according to a pay scale. | 2008-12-11 |
20080303217 | Long shot progressive side bet and method - A progressive jackpot casino table game is played with a 100% jackpot winning event designed to increase the odds against the winning event to statistically enhance the growth of the progressive jackpot. Probability for the 100% winning event may be lowered to less than one in a million by requiring unique events that may include both order and rank of cards provided, rank of cards plus an additional event occurring outside of a player hand and the like. Typically, mere content of a player hand must be supplemented by an additional qualifying feature to win the 100% progressive jackpot payout. For example, a Royal Flush must be dealt in a predetermined order of 10-J-Q-K-A, not merely be present in the hand dealt to a player to be the 100% winning event. | 2008-12-11 |
20080303218 | FLUID-ACTIVATED SHAFT SEAL - Systems and methods associated with a fluid-activated shaft seal are provided. The systems, which feature multiple components, include a support component defining an exterior surface, a carrier component including an interior surface to slideably engage the exterior surface of the support component, and a seal disposed relative to the carrier component. The seal includes a lip portion and a fluid-responsive gel material that expands when exposed to a fluid to urge the lip portion towards or into contact with a shaft. The gel material contracts in the absence of the fluid to form or increase the size of a gap between the shaft and the lip portion. Methods of assembling and installing such a system are also described. | 2008-12-11 |
20080303219 | METHODS AND APPARATUS FOR A SEAL - Methods and apparatus for a seal according to various aspects of the present invention include a seal operating in conjunction with a housing and a removable cover. A portion of the seal is attached to the housing and another portion of the seal is attached to the removable cover to enclose a joint between the housing and the removable cover. A cutter cuts the seal, which allows the removable cover to be removed. | 2008-12-11 |
20080303220 | PLASTIC PIPE SEALING GASKET AND PROCESS FOR BELLING PLASTIC PIPE - An sealing gasket is shown for use in forming joints of plastic pipe. The gasket has a bulbous region which is bisected by a planar region which forms a pair of oppositely extending wing-like flaps. These features of the gasket allow it to be more reliably seated on the working mandrel used to bell a female, thermoplastic pipe end. The wing-like flap portions of the gasket form wiper surfaces for a subsequently installed male, spigot pipe end as the joint is formed. | 2008-12-11 |
20080303221 | Mechanical Sealing Device - A mechanical sealing device comprises a stationary slide ring | 2008-12-11 |
20080303222 | FACE SEAL AND METHOD OF MAKING - A face seal is provided that includes an annular casing having an annular portion, an inner diameter portion extending axially from the annular portion, an outer diameter portion extending axially from the annular portion, and a generally circular opening defined by the contour of an outer surface of the inner diameter portion. The face seal further includes an inner seal member disposed along an inner surface of the inner diameter portion, and an outer seal member disposed along an inner surface of the outer diameter portion. | 2008-12-11 |
20080303223 | Coupling Device for a Tube - The invention relates to a coupling device for coupling with a tube ( | 2008-12-11 |
20080303224 | Gasket - A gasket is provided that forms a sealing connection between a pair of tubular members. The gasket comprises a first section shaped to fit within a recess of one of a pair of tubular members. The first section includes an anchor portion comprising first and second sides. The gasket further comprises a second section extending from the first section and is configured to make a sealing contact with the other of the tubular members. The gasket also includes at least one self-locating arm in a sealing contact within the recess and extending from one of the first or second sides of the anchor portion of the first section. The self-locating arm biases the first section such that the other of the first or second sides is in contact with the recess to form a sealing connection. | 2008-12-11 |
20080303225 | FAN FLOW SEAL DOCKING COLLAR - A fan docking collar for sealing between a fan housing of a fan and an enclosure wall to improve fan performance by preventing flow recirculation. The docking collar includes a pliable body that defines an opening for air flow. The body has a seal for mating with the fan housing and a rim for sealing against the enclosure wall. | 2008-12-11 |
20080303226 | Sealing Band - The joint-sealing tape of flexible foam material ( | 2008-12-11 |
20080303227 | MODEL VEHICLE CHASSIS - A model vehicle chassis has a main body and a front right suspension connected with the main body. The front right suspension has a lower suspension arm which includes a frontward piece and a mating rearward piece. Both the frontward and rearward pieces include frontward and rearward left connecting arms which extend toward and are connected with the main body. The frontward left connecting arm has a first cup and the rearward left connecting arm has a second cup. A shaft is connected with a front right lower portion of the main body. A pin runs through the shaft so that the forward and rearward ends of the pin extend through opposing ends of the shaft and engages the first and second cups, respectively. | 2008-12-11 |
20080303228 | SNOWMOBILE SKI ASSEMBLY - A snowmobile ski comprises a body having a pair of rails laterally spaced from one another and interconnected at a tip. A mounting on the body secures the ski to a snowmobile. | 2008-12-11 |
20080303229 | SNOWMOBILE SLIDE - A snowmobile slide includes an elongated body having a first end, a second end, opposed sides, an upper sliding surface and a lower mounting surface. The upper sliding surface has more than one guide channel, with each guide channel extending between the first end and the second end. The lower mounting surface has a plurality of depending feet spaced at intervals between the opposed sides and between the first end and the second end. Spacing between the feet define an underlying flow area to allow for drainage and ventilation across the lower mounting surface. | 2008-12-11 |
20080303230 | Shopping cart handle protector - A wrap or cover is shown for a handle to protect against germs or bacteria on the handle. The wrap or cover includes a pair of layers of a soft washable material having a length greater than the width and joined at their periphery by a stitching of the respective materials that comprise the layers so as to form a unitary wrap layer. A set of fasteners is attached respectively to opposite sides of the wrap layer. Each fastener includes a strip of fastener material having a length greater than its width. Each fastener comprises a Velcro material that includes a Velcro loop and a Velcro hook material. | 2008-12-11 |
20080303231 | Trammer - There is provided a trammer in the present invention, comprising a panel and a handspike, with the handspike slots corresponding to the handspike located on both sides of the panel and the locating device connected with the handspike also located on the panel. The locating device comprises the locating hole at the inside bottom of the handspike, the elastic fastener corresponding to the locating hole and the handspike connector. In the present invention, the position of the handspike can be selected according to the demand of users. When the handspike need to be used, the handspike can be turned out, and the handspike and the carrying panel are localized at a certain angle via locating device for operations; when the handspike need not to be used, the handspike can be embedded in the panel to effectively decrease the space volume of the trammer and be advantageous to overlap and stack up the carrying panel of the trammer. At the same time, the effective carrying area of the trammer is increased so that the trammer can furthest steadily carry goods to the larger extent. It is simple and practical that the conversion of the handcart and the flat trammer can be accomplished by the turn of the handspike. | 2008-12-11 |
20080303232 | STROLLER AND SEAT ASSEMBLY MECHANISM FOR A STROLLER - A seat assembly mechanism for a stroller has a seat frame and a main frame. The seat assembly mechanism includes a positioning device and a seat supporting member. The positioning device is disposed on the seat frame and includes a positioning pin movable between a locking position and a releasing position. The seat supporting member is disposed on the main frame, and includes a positioning-device recipient corresponding to the positioning device and a positioning groove located at a side of the positioning-device recipient. Furthermore, the positioning device is detachably assembled to the seat supporting member, and the positioning pin inserts into the positioning groove when the positioning device is disposed in the positioning-device recipient of the seat supporting member for assembling the seat frame to the main frame. | 2008-12-11 |
20080303233 | Caster-camber plate assemblies - A caster-camber plate assembly has a fastener plate including fastening members. A lower adjustment plate has a first side face positioned adjacent a first side face of the fastener plate such that fastening members of the fastening plate extend therethrough. The lower adjustment plate is moveable with respect to the fastener plate along first and second translation axes. An upper adjustment plate has a first side face thereof positioned adjacent a second side face of the lower adjustment plate with the fastening members extending therethrough. The upper adjustment plate and the lower adjustment plate are jointly configured for allowing the upper adjustment plate to be moveable with respect to the fastener plate along the second translation axis. A plate interlocking structure accommodates relative movement between the adjustment plates along the first translation axis and effectively inhibits relative movement between the adjustment plates along the second translation axis. | 2008-12-11 |
20080303234 | Joint for Vehicle Steering and Suspension System - The present invention concerns a steering and suspension system of a vehicle and a translational ball joint for use in a steering and suspension system. The system may include a lower joint assembly that employs the translational ball joint to couple a steering knuckle to a strut extension member. The translational ball joint may include a socket having a ball stud mounted therein, with the ball stud including a ball, mounted in the cavity, and a shank, including a cylindrical portion adjacent to the second end that is slidably received in a central bore of the ball and has a retention flange extending radially outward that has a diameter that is larger than a diameter of the central bore to thereby prevent the retention flange from sliding through the central bore. | 2008-12-11 |
20080303235 | Adjustable Strut Spacer - An adjustable strut spacer includes two complementary strut spacer disks that engage each other and the vehicle suspension to provide adjustable spacing. Each strut spacer disk is flat on one side and stepped on the other side. The steps of the upper strut spacer engage the steps of the lower strut spacer such that when the strut spacer disks are counter rotated the thickness of the adjustable strut spacer changes. | 2008-12-11 |
20080303236 | Blank For an Axle Beam, Wheel Suspension Comprising an Axle and a Method For Manufacturing an Axle - A blank for an axle beam intended to support a wheel axle is formed from a continuous piece and, at its respective ends, has, on the one hand, a bushing constituting a bearing for a kingpin for supporting a wheel spindle and, on the other hand, lug-shaped protrusions on each side of the bushing, and a wheel axle made from such a blank. The invention can provide a blank which is suitable both for steerable and non-steerable wheel axles for vehicles. | 2008-12-11 |
20080303237 | Idividual Wheel Suspension - The invention relates to a wheel suspension for a vehicle, which wheel suspension includes a wheel holder for supporting a vehicle wheel, a leaf spring attached to a vehicle frame at each end and attached between the vehicle and the wheel holder, which leaf spring is arranged with its main axis in the longitudinal direction of the vehicle. The wheel holder is arranged in a substantially transverse, vertical plane relative to a vertical plane through the main axis of the leaf spring, that an outer end of the wheel holder is arrange to support a vehicle wheel, and that an inner end of the wheel holder is rigidly attached to the leaf spring. | 2008-12-11 |
20080303238 | Apparatus for assisting entry into high road clearance vehicles - An apparatus for assisting entry into high road clearance vehicles having a generally cylindrical side bar adapted for attachment to a vehicle chassis, one or more U-shaped cylindrical bars attached to and suspended from said bar comprised of two end portions and a center bar. The U-shaped bars may be of tubular construction and have a flat surface and are preferably angled from the side bar at an angle of approximately 45 degrees and each U-shaped bar has end portions that meet the center bar at an angle of approximately 0 to 45 degrees. The side bar may be attached to any of a variety of chassis designs and may have a plurality of steps at the doors and at or near the back of the vehicle. | 2008-12-11 |
20080303239 | Bicycle Attachment - An attachment ( | 2008-12-11 |
20080303240 | BICYCLE FORK ASSEMBLY WITH INTEGRAL CROWN AND STEER TUBE - A fork assembly for a bicycle that includes a fork crown with an integrally formed steer tube and a pair of fork receiving pockets. The crown and the steer tube are preferably forged of an aluminum material. Each of a pair of fork blades includes a crown end that has a contour that substantially matches a contour of a respective receiving pocket such that each of the pair of fork blades can be bonded to the crown thereby providing a lightweight and robust fork, fork crown, and steer tube assembly. | 2008-12-11 |
20080303241 | Hidden seat tube assembly for a bicycle - A hidden seat tube assembly for a bicycle, comprises: a seat tube; a C ring installed within the seat tube therein; the C ring having an opening so that the C ring has a C cross section; the C ring being welded to an inner wall of the seat tube through at least one welding spot; a retainer arranged at two sides of the opening of the C ring; one side of the retainer having a through hole and another side of the retainer having a threaded hole; a screw unit retained within the through hole and threaded hole of the retainer; by adjusting the engagement position of the screw unit to threaded hole of the retainer, the cross section of the C ring being enlarged or reduced. | 2008-12-11 |
20080303242 | BICYCLE REAR SUSPENSION SYSTEM - A bicycle rear wheel suspension system includes an upper link and a lower link both pivotally attached to the frame and to a rear stay member. An instantaneous center of rotation of the rear stay member is defined at an intersection between an upper axis extending through first and second pivots of the upper link and a lower axis extending through third and fourth pivots of the lower link. Throughout a travel distance of a shock absorber of the suspension system, the instantaneous center of rotation remains below an average chain torque line of the bicycle, the lower axis remains above an axle axis extending through the rear wheel axle, and a portion of the lower axis defined between the third and fourth pivots extends below the average chain torque line. | 2008-12-11 |
20080303243 | Collapsible bicycle frame - Collapsible bicycle frame with an elongate tubular rigid seat post holding member, an elongate tubular rigid front fork holding member and an elongate tubular first rear fork and crank holding member. A slidable clevis joint holding the rear fork holding member to the front fork holding member. A clevis joint holds the seat post holding member to the front fork holding member. A clevis joint holds the lower end of the seat post holding member to a second rear fork member. The first rear fork holding member includes a standard crank holding aperture. The front fork holding member terminates at its top most point in a standard handle bar receiving aperture. The seat post holding member includes a lockable tubular extension member that can slidably retain a standard bicycle seat post. | 2008-12-11 |
20080303244 | Securing device for connecting biycle rack to vehicle - A connection device for connecting a bicycle rack to a connection member on a vehicle includes a clamping unit composed of four quarters and a mounting member is mounted onto the four quarters withinhich the connection member is enclosed. A bolt's head is clamped by four respective protrusions on the four quarters and the shank extends through the top of the clamping unit and the mounting member so as to be connected with a knob. A lock is received in the knob and cooperated with the bolt. The mounting member has a T-shaped slot and two lugs extend from the mounting member. The vertical slot is located between the two lugs and a quick release unit is cooperated with the two lugs so as to control the distance between the two lugs. By using the quick release unit, the four quarters can quickly release the connection member. | 2008-12-11 |
20080303245 | NANO-T diverse application lever guardrail ramp trailer - An improved vertically stow able modular multi-purpose trailer with a levered suspended ramp and detachable lever. The trailer includes a forward angle iron frame section with a platform planar deck covering the interior area of the frame and a rear hinge cross member, all supported by a square tubular composite trailer tongue/backbone which extends from in front of and the entire length of the forward angle iron frame section and connects with the rear hinge cross member. The trailer further includes a ramp rear angle iron frame section with a second platform planer deck, a forward integral hinge, and a rear lip. The trailer further includes a tubular lever section above and the length of the forward angle iron frame outlining the forward angle iron frame silhouette and a knee joint vertical post extending down at the rear. The trailer is adapted to be configured in a deployed configuration, wherein the forward section and rear section are longitudinally positioned and hinged at the hinge cross member, forming a larger platform planar deck with the upper tubular lever section hinged at the posts to the hinge cross member integral hinge and suspending the end of the ramp rear angle iron frame. The trailer is further adapted to be configured in a vertically stowed configuration, wherein the forward angle iron frame section and the tubular lever section and the ramp rear angle iron frame are configured about the hinge cross member, in a manner as a folded hand fan. | 2008-12-11 |
20080303246 | TOW BEHIND MOWER ATTACHMENT SYSTEM - A tow behind mower attachment system is provided comprising a push mower having a mower deck with four wheels including a right front wheel having a right front axle, a left front wheel having a left front axle, a right rear wheel having a right rear axle and a left rear wheel having a left rear axle. The push mower has surface features defined by the mower deck, the four wheels, the right front axle and the left front axle, the right rear axle and the left rear axle. An attachment assembly is provided having a caster mount and a caster wheel connected to the caster mount for pivoting relative to the attachment assembly. A push mower connector is provided engaging one or more of the surface features for connecting the attachment assembly to the push mower. | 2008-12-11 |