50th week of 2020 patent applcation highlights part 53 |
Patent application number | Title | Published |
20200388471 | WAFER PLACEMENT DEVICE | 2020-12-10 |
20200388472 | ELECTROSTATIC CHUCK, SUPPORT PLATFORM, AND PLASMA PROCESSING APPARATUS | 2020-12-10 |
20200388473 | PLASMA ELECTRIC FIELD MONITOR, PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD | 2020-12-10 |
20200388474 | REACTIVE SPUTTERING WITH HIPIMS | 2020-12-10 |
20200388475 | SUBTERAHERTZ MICROFABRICATED SPECTROMETER | 2020-12-10 |
20200388476 | AN AMPLIFICATION SYSTEM FOR CONTINUOUSLY ADJUSTING AMPLIFICATION GAIN OF A HIGH FREQUENCY WEAK SIGNAL FOR MASS SPECTROMETERS | 2020-12-10 |
20200388477 | VALVE | 2020-12-10 |
20200388478 | IONIZATION DEVICE | 2020-12-10 |
20200388479 | METHODS, APPARATUS, AND SYSTEM FOR MASS SPECTROMETRY | 2020-12-10 |
20200388480 | Mass Spectrometer | 2020-12-10 |
20200388481 | Broadband Ultraviolet Illumination Sources | 2020-12-10 |
20200388482 | ELECTRODELESS PLASMA LAMP | 2020-12-10 |
20200388483 | METHODS OF POST TREATING SILICON NITRIDE BASED DIELECTRIC FILMS WITH HIGH ENERGY LOW DOSE PLASMA | 2020-12-10 |
20200388484 | WAFER CLEANING APPARATUS BASED ON LIGHT IRRADIATION AND WAFER CLEANING SYSTEM INCLUDING THE SAME | 2020-12-10 |
20200388485 | Treatment for Adhesion Improvement | 2020-12-10 |
20200388486 | APPARATUS AND METHODS FOR MANUFACTURING SEMICONDUCTOR STRUCTURES USING PROTECTIVE BARRIER LAYER | 2020-12-10 |
20200388487 | METHODS FOR FORMING DOPED SILICON OXIDE THIN FILMS | 2020-12-10 |
20200388488 | BOTTOM-UP CURING OF DIELECTRIC FILMS IN INTEGRATED CIRCUITS | 2020-12-10 |
20200388489 | INTEGRATED EPITAXIAL METAL ELECTRODES FOR MODIFIED DEVICES | 2020-12-10 |
20200388490 | MATERIAL HAVING SINGLE CRYSTAL PEROVSKITE, DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF | 2020-12-10 |
20200388491 | METHOD OF FORMING OXIDE FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND APPARATUS CONFIGURED TO FORM OXIDE FILM | 2020-12-10 |
20200388492 | METHOD FOR MANUFACTURING SiC EPITAXIAL WAFER | 2020-12-10 |
20200388493 | LASER CRYSTALLIZATION SYSTEM AND LASER CRYSTALLIZATION METHOD | 2020-12-10 |
20200388494 | APPARATUS FOR TREATING SUBSTRATE | 2020-12-10 |
20200388495 | LASER IRRADIATION DEVICE, PROJECTION MASK AND LASER IRRADIATION METHOD | 2020-12-10 |
20200388496 | APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING APPARATUS | 2020-12-10 |
20200388497 | Loading Effect Reduction Through Multiple Coat-Etch Processes | 2020-12-10 |
20200388498 | SEMICONDUCTOR STRUCTURE WITH MASK STRUCTURE | 2020-12-10 |
20200388499 | Interconnect Structure Having a Carbon-Containing Barrier Layer | 2020-12-10 |
20200388500 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-12-10 |
20200388501 | METHOD OF REDUCING SEMICONDUCTOR SUBSTRATE SURFACE UNEVENNESS | 2020-12-10 |
20200388502 | METHODS OF FORMING A SEMICONDUCTOR DEVICE INCLUDING ACTIVE PATTERNS ON A BONDING LAYER AND SEMICONDUCTOR DEVICES FORMED BY THE SAME | 2020-12-10 |
20200388503 | PROCESSING STACKED SUBSTRATES | 2020-12-10 |
20200388504 | Metal Contacts on Metal Gates and Methods Thereof | 2020-12-10 |
20200388505 | CONTACTS FOR ELECTRONIC COMPONENT | 2020-12-10 |
20200388506 | METHOD FOR PRODUCING LAMINATE HAVING PATTERNED METAL FOIL, AND LAMINATE HAVING PATTERNED METAL FOIL | 2020-12-10 |
20200388507 | BONDING DEVICE AND BONDING METHOD | 2020-12-10 |
20200388508 | REPASSIVATION APPLICATION FOR WAFER-LEVEL CHIP-SCALE PACKAGE | 2020-12-10 |
20200388509 | MANUFACTURING METHOD OF MOUNTING STRUCTURE | 2020-12-10 |
20200388510 | SUBSTRATE PROCESSING DEVICE | 2020-12-10 |
20200388511 | SUBSTRATE PROCESSING APPARATUS | 2020-12-10 |
20200388512 | SUBSTRATE PROCESSING APPARATUS AND CONTROL METHOD THEREOF | 2020-12-10 |
20200388513 | Apparatus for the Temperature Control of a Substrate and Corresponding Production Method | 2020-12-10 |
20200388514 | THERMAL REGULATOR, SUBSTRATE PROCESSING APPARATUS, AND METHOD OF CONTROLLING TEMPERATURE OF STAGE | 2020-12-10 |
20200388515 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | 2020-12-10 |
20200388516 | ELECTRONIC COMPONENT MOUNTING DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | 2020-12-10 |
20200388517 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING A SUBSTRATE AND OF MANUFACTURING A PROCESSED WORKPIECE | 2020-12-10 |
20200388518 | WAFER PLACEMENT ERROR DETECTION BASED ON MEASURING A CURRENT THROUGH AN ELECTROSTATIC CHUCK AND SOLUTION FOR INTERVENTION | 2020-12-10 |
20200388519 | Transport System | 2020-12-10 |
20200388520 | SHIFTLESS WAFER BLADES | 2020-12-10 |
20200388521 | PICK-UP DEVICE AND PICK-UP METHOD | 2020-12-10 |
20200388522 | BONDING APPARATUS AND SEMICONDUCTOR PACKAGE FABRICATION EQUIPMENT INCLUDING THE SAME | 2020-12-10 |
20200388523 | WAFER ALIGNER | 2020-12-10 |
20200388524 | SURFACE MODIFIED DIELECTRIC REFILL STRUCTURE | 2020-12-10 |
20200388525 | SELECTIVE ILD DEPOSITION FOR FULLY ALIGNED VIA WITH AIRGAP | 2020-12-10 |
20200388526 | Semiconductor Device Structures | 2020-12-10 |
20200388527 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING A DEEP TRENCH ISOLATION STRUCTURE | 2020-12-10 |
20200388528 | PATTERN GENERATION DEVICE, PATTERN GENERATION METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-12-10 |
20200388529 | METHOD OF FORMING SEMICONDUCTOR STRUCTURE HAVING LAYER WITH RE-ENTRANT PROFILE | 2020-12-10 |
20200388530 | VERTICAL EDGE BLOCKING (VEB) TECHNIQUE FOR INCREASING PATTERNING PROCESS MARGIN | 2020-12-10 |
20200388531 | ION IMPLANTATION ASSISTED CURING FOR FLOWABLE POROUS DIELECTRICS | 2020-12-10 |
20200388532 | Low-K Dielectric With Self-Forming Barrier Layer | 2020-12-10 |
20200388533 | PROCESS INTEGRATION APPROACH FOR SELECTIVE METAL VIA FILL | 2020-12-10 |
20200388534 | 1D VERTICAL EDGE BLOCKING (VEB) VIA AND PLUG | 2020-12-10 |
20200388535 | Selective Removal Process To Create High Aspect Ratio Fully Self-Aligned Via | 2020-12-10 |
20200388536 | WAFER PROCESSING METHOD | 2020-12-10 |
20200388537 | WAFER PROCESSING METHOD | 2020-12-10 |
20200388538 | Method for Producing Wafers with Modification Lines of Defined Orientation | 2020-12-10 |
20200388539 | METHOD FOR TRANSFERRING A LAYER BY USING A DETACHABLE STRUCTURE | 2020-12-10 |
20200388540 | SEMICONDUCTOR DEVICES WITH WIDE GATE-TO-GATE SPACING | 2020-12-10 |
20200388541 | ASYMMETRIC GATE SPACER FORMATION USING MULTIPLE ION IMPLANTS | 2020-12-10 |
20200388542 | FIN ISOLATION STRUCTURES OF SEMICONDUCTOR DEVICES | 2020-12-10 |
20200388543 | SEMICONDUCTOR DEVICES AND FORMING METHODS THEREOF | 2020-12-10 |
20200388544 | COMPLEMENTARY METAL OXIDE SEMICONDUCTOR DEVICE HAVING FIN FIELD EFFECT TRANSISTORS WITH A COMMON METAL GATE | 2020-12-10 |
20200388545 | MAINTENANCE SCHEDULING FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT | 2020-12-10 |
20200388546 | METHOD OF MEASURING FILM THICKNESS, METHOD OF MANUFACTURING NITRIDE SEMICONDUCTOR LAMINATE AND NITRIDE SEMICONDUCTOR LAMINATE | 2020-12-10 |
20200388547 | SEMICONDUCTOR MEMORY DEVICE | 2020-12-10 |
20200388548 | ELECTRONIC ASSEMBLY INCLUDING OPTICAL MODULES | 2020-12-10 |
20200388549 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2020-12-10 |
20200388550 | Semiconductor Device | 2020-12-10 |
20200388551 | LAMINATE AND ELECTRONIC DEVICE | 2020-12-10 |
20200388552 | SEMICONDUCTOR PACKAGE CARRIER BOARD, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC PACKAGE HAVING THE SAME | 2020-12-10 |
20200388553 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SAME | 2020-12-10 |
20200388554 | LIDS FOR INTEGRATED CIRCUIT PACKAGES WITH SOLDER THERMAL INTERFACE MATERIALS | 2020-12-10 |
20200388555 | APPARATUS FOR THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS | 2020-12-10 |
20200388556 | POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | 2020-12-10 |
20200388557 | HEAT TRANSFER FOR POWER MODULES | 2020-12-10 |
20200388558 | SEMICONDUCTOR POWER MODULE | 2020-12-10 |
20200388559 | POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREOF | 2020-12-10 |
20200388560 | ELECTRICAL MODULE ASSEMBLY WITH EMBEDDED DIES | 2020-12-10 |
20200388561 | Method for Fabricating a Semiconductor Flip-Chip Package | 2020-12-10 |
20200388562 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-12-10 |
20200388563 | Semiconductor Device and Method of Manufacture | 2020-12-10 |
20200388564 | SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD FOR FABRICATING THE SAME, AND ELECTRONIC PACKAGE HAVING THE SAME | 2020-12-10 |
20200388565 | LOCAL INTERCONNECT WITH AIR GAP | 2020-12-10 |
20200388566 | SEMICONDUCTOR MEMORY DEVICE | 2020-12-10 |
20200388567 | METAL VIA STRUCTURE | 2020-12-10 |
20200388568 | SEMICONDUCTOR DEVICE INCLUDING A POROUS DIELECTRIC LAYER, AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE | 2020-12-10 |
20200388569 | INTEGRATED ELECTRONIC DEVICE WITH A REDISTRIBUTION REGION AND A HIGH RESILIENCE TO MECHANICAL STRESSES AND METHOD FOR ITS PREPARATION | 2020-12-10 |
20200388570 | MULTI-LAYER INDUCTOR | 2020-12-10 |