49th week of 2016 patent applcation highlights part 53 |
Patent application number | Title | Published |
20160358861 | REGISTRATION MARK FORMATION DURING SIDEWALL IMAGE TRANSFER PROCESS | 2016-12-08 |
20160358862 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2016-12-08 |
20160358863 | METHOD OF MANUFACTURING SEMICONDUCTOR CHIP, SEMICONDUCTOR CHIP, AND SEMICONDUCTOR DEVICE | 2016-12-08 |
20160358864 | SEMICONDUCTOR MODULE | 2016-12-08 |
20160358865 | WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF | 2016-12-08 |
20160358866 | PACKAGE SUBSTRATE DIFFERENTIAL IMPEDANCE OPTIMIZATION FOR 25 GBPS AND BEYOND | 2016-12-08 |
20160358867 | Calibration Kits for RF Passive Devices | 2016-12-08 |
20160358868 | CONNECTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2016-12-08 |
20160358869 | SEMICONDUCTOR DEVICE | 2016-12-08 |
20160358870 | MULTI-DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF | 2016-12-08 |
20160358871 | Filter and Capacitor Using Redistribution Layer and Micro Bump Layer | 2016-12-08 |
20160358872 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THEREOF | 2016-12-08 |
20160358873 | SUBSTRATE STRUCTURE, FABRICATION METHOD THEREOF AND CONDUCTIVE STRUCTURE | 2016-12-08 |
20160358874 | SEMICONDUCTOR DEVICE | 2016-12-08 |
20160358875 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-12-08 |
20160358876 | Conical-Shaped or Tier-Shaped Pillar Connections | 2016-12-08 |
20160358877 | SEMICONDUCTOR PACKAGE USING FLIP-CHIP TECHNOLOGY | 2016-12-08 |
20160358878 | Substrate and Package Structure | 2016-12-08 |
20160358879 | DISCHARGE EXAMINATION DEVICE, WIRE-BONDING APPARATUS, AND DISCHARGE EXAMINATION METHOD | 2016-12-08 |
20160358880 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRE BONDING APPARATUS | 2016-12-08 |
20160358881 | METHOD FOR BONDING SUBSTRATES | 2016-12-08 |
20160358882 | Wafer Bonding Process and Structure | 2016-12-08 |
20160358883 | BUMP FORMING METHOD, BUMP FORMING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2016-12-08 |
20160358884 | SEMICONDUCTOR CHIP METAL ALLOY THERMAL INTERFACE MATERIAL | 2016-12-08 |
20160358885 | METHOD OF FABRICATING AN ELECTRONIC PACKAGE | 2016-12-08 |
20160358886 | ARRANGEMENT OF MULTIPLE POWER SEMICONDUCTOR CHIPS AND METHOD OF MANUFACTURING THE SAME | 2016-12-08 |
20160358887 | SEMICONDUCTOR PACKAGE | 2016-12-08 |
20160358888 | 3-D Package Having Plurality of Substrates | 2016-12-08 |
20160358889 | DUAL MOLDED STACK TSV PACKAGE | 2016-12-08 |
20160358890 | DIFFUSION SOLDER BONDING USING SOLDER PREFORMS | 2016-12-08 |
20160358891 | OPOSSUM-DIE PACKAGE-ON-PACKAGE APPARATUS | 2016-12-08 |
20160358892 | SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2016-12-08 |
20160358893 | STACKED SEMICONDUCTOR PACKAGES, METHODS FOR FABRICATING THE SAME, AND/OR SYSTEMS EMPLOYING THE SAME | 2016-12-08 |
20160358894 | Semiconductor Package for Thermal Dissipation | 2016-12-08 |
20160358895 | POWER SEMICONDUCTOR MODULE | 2016-12-08 |
20160358896 | LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE MODULE | 2016-12-08 |
20160358897 | THREE DIMENSIONAL STRUCTURES WITHIN MOLD COMPOUND | 2016-12-08 |
20160358898 | METHODS OF MANUFACTURING MULTI DIE SEMICONDUCTOR DEVICE PACKAGES AND RELATED ASSEMBLIES | 2016-12-08 |
20160358899 | INTERPOSER FOR A PACKAGE-ON-PACKAGE STRUCTURE | 2016-12-08 |
20160358900 | Semiconductor Device and Method of Manufacturing | 2016-12-08 |
20160358901 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, METHOD FOR GENERATING MASK DATA, MASK AND COMPUTER READABLE RECORDING MEDIUM | 2016-12-08 |
20160358902 | Integrated Circuit with Elongated Coupling | 2016-12-08 |
20160358903 | Oversized Contacts and Vias in Layout Defined by Linearly Constrained Topology | 2016-12-08 |
20160358904 | ELECTROSTATIC DISCHARGE PROTECTION DEVICE | 2016-12-08 |
20160358905 | COMPOUND SEMICONDUCTOR DEVICES HAVING BURIED RESISTORS FORMED IN BUFFER LAYER | 2016-12-08 |
20160358906 | SEMICONDUCTOR DEVICE WITH SCHOTTKY DIODE AND MANUFACTURING METHOD THEREOF | 2016-12-08 |
20160358907 | DEVICES RELATED TO BARRIER FOR METALLIZATION OF GALLIUM BASED SEMICONDUCTOR | 2016-12-08 |
20160358908 | METHODS OF FORMING V0 STRUCTURES FOR SEMICONDUCTOR DEVICES BY FORMING A PROTECTION LAYER WITH A NON-UNIFORM THICKNESS | 2016-12-08 |
20160358909 | SYSTEMS AND METHODS FOR INCREASING PACKING DENSITY IN A SEMICONDUCTOR CELL ARRAY | 2016-12-08 |
20160358910 | Double-Sided Vertical Semiconductor Device With Thinned Substrate | 2016-12-08 |
20160358911 | BURIED CHANNEL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-12-08 |
20160358912 | HIGH-IMPLANT CHANNEL SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-12-08 |
20160358913 | SEMICONDUCTOR DEVICE | 2016-12-08 |
20160358914 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2016-12-08 |
20160358915 | FERROELECTRIC FINFET | 2016-12-08 |
20160358916 | SELF-ALIGNED SOURCE/DRAIN CONTACTS | 2016-12-08 |
20160358917 | COMPACT GUARD RING STRUCTURE FOR CMOS INTEGRATED CIRCUITS | 2016-12-08 |
20160358918 | Electronic Devices and Systems, and Methods for Making and Using the Same | 2016-12-08 |
20160358919 | METHOD FOR FORMING HIGH VOLTAGE TRANSISTOR | 2016-12-08 |
20160358920 | SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS HAVING DIFFERENT THRESHOLD VOLTAGES | 2016-12-08 |
20160358921 | SEMICONDUCTOR DEVICE HAVING MULTIWORK FUNCTION GATE PATTERNS | 2016-12-08 |
20160358922 | METHOD AND STRUCTURE TO FORM TENSILE STRAINED SIGE FINS AND COMPRESSIVE STRAINED SIGE FINS ON A SAME SUBSTRATE | 2016-12-08 |
20160358923 | MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-12-08 |
20160358924 | SEMICONDUCTOR MEMORY DEVICE HAVING AN ELECTRICALLY FLOATING BODY TRANSISTOR | 2016-12-08 |
20160358925 | SEMICONDUCTOR DEVICE HAVING STRESSOR AND METHOD OF MANUFACTURING THE SAME | 2016-12-08 |
20160358926 | FinFETs with Different Fin Heights | 2016-12-08 |
20160358927 | MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-12-08 |
20160358928 | SELF-ALIGNED FLASH MEMORY DEVICE WITH WORD LINE HAVING REDUCED HEIGHT AT OUTER EDGE OPPOSITE TO GATE STACK | 2016-12-08 |
20160358929 | MANUFACTURING METHOD OF SEMICONDUCTOR MEMORY DEVICE | 2016-12-08 |
20160358930 | WING-TYPE PROJECTION BETWEEN NEIGHBORING ACCESS TRANSISTORS IN MEMORY DEVICES | 2016-12-08 |
20160358931 | METHODS OF FABRICATING EMBEDDED ELECTRONIC DEVICES INCLUDING CHARGE TRAP MEMORY CELLS | 2016-12-08 |
20160358932 | GATE-ALL-AROUND VERTICAL GATE MEMORY STRUCTURES AND SEMICONDUCTOR DEVICES, AND METHODS OF FABRICATING GATE-ALL-AROUND VERTICAL GATE MEMORY STRUCTURES AND SEMICONDUCTOR DEVICES THEREOF | 2016-12-08 |
20160358933 | METHOD OF MAKING A THREE-DIMENSIONAL MEMORY DEVICE HAVING A HETEROSTRUCTURE QUANTUM WELL CHANNEL | 2016-12-08 |
20160358934 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2016-12-08 |
20160358935 | SEMICONDUCTOR MEMORY DEVICE AND PRODUCTION METHOD THEREOF | 2016-12-08 |
20160358936 | NON-VOLATILE MEMORY DEVICE | 2016-12-08 |
20160358937 | Array Substrate and Manufacturing Method Thereof and Display Panel | 2016-12-08 |
20160358938 | DISPLAY DEVICE AND FABRICATION METHOD THEREOF | 2016-12-08 |
20160358939 | DISPLAY APPARATUS | 2016-12-08 |
20160358940 | Three-Dimensional Transistor and Methods of Manufacturing Thereof | 2016-12-08 |
20160358941 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-12-08 |
20160358942 | Wireless Processor, Wireless Memory, Information System, And Semiconductor Device | 2016-12-08 |
20160358943 | ACTIVE MATRIX SUBSTRATE AND METHOD FOR PRODUCING SAME | 2016-12-08 |
20160358944 | Oxide Semiconductor TFT Array Substrate and Method for Manufacturing the Same | 2016-12-08 |
20160358945 | THIN FILM TRANSISTOR, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE | 2016-12-08 |
20160358946 | ARRAY SUBSTRATE AND MANUFACTURING METHOD THEREOF | 2016-12-08 |
20160358947 | Array Substrate, Display Panel and Method for Manufacturing Array Substrate | 2016-12-08 |
20160358948 | Display Substrate, Manufacturing Method Thereof, and Display Device | 2016-12-08 |
20160358949 | GOA UNIT, METHOD FOR MANUFACTURING GOA UNIT, DISPLAY SUBSTRATE AND DISPLAY DEVICE | 2016-12-08 |
20160358950 | DRIVER CIRCUIT AND SEMICONDUCTOR DEVICE | 2016-12-08 |
20160358951 | TFT DRIVING BACKPLANE AND METHOD OF MANUFACTURING THE SAME | 2016-12-08 |
20160358952 | Thin Film Transistor, Method for Fabricating the Same, and Array Substrate | 2016-12-08 |
20160358953 | MANUFACTURING METHOD OF ARRAY SUBSTRATE | 2016-12-08 |
20160358954 | DEEP TRENCH SIDEWALL ETCH STOP | 2016-12-08 |
20160358955 | DEPTH SENSING PIXEL, COMPOSITE PIXEL IMAGE SENSOR AND METHOD OF MAKING THE COMPOSITE PIXEL IMAGE SENSOR | 2016-12-08 |
20160358956 | LIGHT SENSING CIRCUIT AND CONTROL METHOD THEREOF | 2016-12-08 |
20160358957 | SOLID STATE PHOTOMULTIPLIER | 2016-12-08 |
20160358958 | SOLID-STATE IMAGING DEVICE | 2016-12-08 |
20160358959 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC APPARATUS | 2016-12-08 |
20160358960 | CMOS Image Sensor | 2016-12-08 |