49th week of 2012 patent applcation highlights part 18 |
Patent application number | Title | Published |
20120306057 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device is disclosed. In the method for manufacturing the semiconductor device, a capacitor structure is modified to ensure capacitance of the capacitor, and the height of the capacitor is reduced to prevent defects such as a leaning capacitor or a poor bridge from being generated, such that the fabrication process of semiconductor devices is simplified and therefore the semiconductor devices can be stably manufactured. | 2012-12-06 |
20120306058 | METHOD FOR BLISTER-FREE PASSIVATION OF A SILICON SURFACE - A method of forming a surface passivation layer on a surface of a crystalline silicon substrate is disclosed. In one aspect, the method includes depositing an Al | 2012-12-06 |
20120306059 | SELECTIVE WET ETCHING OF HAFNIUM ALUMINUM OXIDE FILMS - Methods and etchant compositions for wet etching to selectively remove a hafnium aluminum oxide (HfAlO | 2012-12-06 |
20120306060 | Protective Structure - A protective structure is produced by providing a semiconductor substrate having doping of a first conductivity type. A semiconductor layer having doping of a second conductivity type is applied at a surface of the semiconductor substrate. A buried layer with doping of a second conductivity type is formed in a first region of the semiconductor layer, producing a layer at the junction between the semiconductor layer and semiconductor substrate. A first dopant zone having doping of a first conductivity type is formed in the first region of the semiconductor layer above the buried layer. A second dopant zone having doping of a second conductivity type is formed in a second region of the semiconductor layer. An electrical insulation is formed between the first and second regions of the semiconductor layer. A common connection device is formed for the first and second dopant zones. | 2012-12-06 |
20120306061 | Apparatus and Method for Grounding an IC Package Lid for EMI Reduction - Methods and apparatus for improved electromagnetic interference (EMI) shielding and thermal performance in integrated circuit (IC) packages are described. A die-up or die-down package includes a protective lid, a plurality of ground posts, an IC die, and a substrate. The substrate includes a plurality of ground planes. The IC die is mounted to the substrate. Plurality of ground posts is coupled to plurality of ground planes that surround IC die. Protective lid is coupled to plurality of ground posts. The plurality of ground posts and the protective lid from an enclosure structure that substantially encloses the IC die, and shields EMI from and radiating towards the IC die. The enclosure structure also dissipates heat generated by the IC die during operation. | 2012-12-06 |
20120306062 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE - A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure. | 2012-12-06 |
20120306063 | HIGH-FREQUENCY MODULE MANUFACTURING METHOD - In a method of manufacturing a high-frequency module, a resin substrate with a high frequency circuit including an electronic component mounted thereon is placed so that the electronic component faces a resin bath. A resin which is in a non-flowable state in the resin bath is softened until the resin becomes flowable, and air in space formed between the resin substrate and the resin is sucked. The resin substrate is brought into contact with a liquid surface of the resin. The resin is pressurized and allowed to flow into a gap between the resin substrate and the electronic component. The resin is cured so that a resin portion is formed on the resin substrate. A shield metal film is formed on a surface of the resin portion. | 2012-12-06 |
20120306064 | CHIP PACKAGE - A chip package including a lead frame, a heat sink, a chip and a molding compound is provided. The lead frame includes a chip pad and a plurality of leads, wherein the chip pad has a first surface and a second surface opposite thereto. The heat sink has a third surface and a fourth surface opposite thereto, wherein the lead frame is disposed on the third surface of the heat sink through the second surface of the chip pad, and the fourth surface of the heat sink is exposed. The chip is disposed on the first surface of the chip pad and electrically connected to each of the chip pad and the leads. The molding compound encapsulates the chip, the chip pad, the heat sink and a portion of each of the leads. | 2012-12-06 |
20120306065 | SEMICONDUCTOR PACKAGE WITH PRE-SOLDERED GROOVES IN LEADS - A packaged semiconductor device includes a die pad on which a semiconductor die that includes a plurality of bond pads is attached. A plurality of lead terminals surround the die pad, wherein the plurality of bond pads are connected to the plurality of lead terminals, and the plurality of lead terminals include an outer toe-wall and a groove along their length that extends to the toe-wall to provide a lead terminal orifice. An encapsulating material that defines an outer dimension for the packaged semiconductor device is absent from the grooves. Solder fills the grooves. A bottomside of the solder in the grooves provides an exposed solder surface available for bonding. | 2012-12-06 |
20120306066 | ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE HAVING A TRENCH - An electronic device can include a packaging material having a first surface and a second surface opposite the first surface, and leads including die connection surfaces and external connection surfaces. The electronic device can further include a trench extending from an upper surface of the packaging substrate towards a lower surface of the packaging substrate, wherein a set of leads lie immediately adjacent to the trench, and the packaging material is exposed at the bottom of the trench. In an embodiment, an encapsulant is formed over the upper surface of the packaging substrate and within the trench. In a particular embodiment, the trenches may be formed before or after placing a die over the packaging substrate, or before or after forming electrical connections between the die and leads of the packaging substrate. | 2012-12-06 |
20120306067 | Thermally Enhanced Integrated Circuit Package - According to an embodiment, an integrated circuit package comprises a chip, a thermal component, and a molding compound. The chip comprises an active surface and a backside surface opposite the active surface. The thermal component is physically coupled to the backside surface of the chip. The molding compound encapsulates the chip, and an exposed surface of the thermal component is exposed through the molding compound. Another embodiment is a method to form an integrated circuit package. | 2012-12-06 |
20120306068 | SEMICONDUCTOR DEVICE FABRICATION METHOD AND SEMICONDUCTOR DEVICE - A semiconductor device is manufactured by forming a first dielectric film on a substrate, forming an aperture in the first dielectric film, mounting a semiconductor chip in the aperture, forming a second dielectric film on the first dielectric film and the semiconductor chip, and forming an interconnection wiring structure on the second dielectric film. The second dielectric film secures the semiconductor chip without the need to etch the substrate or use an adhesive die attachment film. | 2012-12-06 |
20120306069 | ELECTRONIC MODULE - An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 μm. | 2012-12-06 |
20120306070 | Electrical Connection for Chip Scale Packaging - A system and method for providing a post-passivation and underbump metallization is provided. An embodiment comprises a post-passivation layer that is larger than an overlying underbump metallization. The post-passivation layer extending beyond the underbump metallization shields the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion. | 2012-12-06 |
20120306071 | WAFER-LEVEL PACKAGE DEVICE - Wafer-level package semiconductor devices are described that have a smallest distance between two adjacent attachment bumps smaller than about twenty-five percent (25%) of a pitch between the two adjacent attachment bumps. The smallest distance between the two adjacent attachment bumps allows for an increase in the number of attachment bumps per area without reducing the size of the bumps, which increases solder reliability. The increased solder reliability may reduce stress to the attachment bumps, particularly stress caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests or cyclic bending tests, and so on. | 2012-12-06 |
20120306072 | Semiconductor Wafer with Reduced Thickness Variation and Method for Fabricating Same - According to one embodiment, a semiconductor wafer comprises a plurality of solder bumps for providing device contacts formed over a functional region of the semiconductor wafer, and one or more support rings surrounding the functional region. The one or more support rings and the plurality of solder bumps are formed so as to have substantially matching heights. The presence of the one or more support rings causes the semiconductor wafer to have a substantially uniform thickness in the functional region after a thinning process is performed on the semiconductor wafer. A method for fabricating the semiconductor wafer comprises forming the plurality of solder bumps over the functional region, and forming the one or more support rings surrounding the functional region before performing the thinning process on the semiconductor wafer. | 2012-12-06 |
20120306073 | Connector Design for Packaging Integrated Circuits - A device includes a top dielectric layer having a top surface. A metal pillar has a portion over the top surface of the top dielectric layer. A non-wetting layer is formed on a sidewall of the metal pillar, wherein the non-wetting layer is not wettable to the molten solder. A solder region is disposed over and electrically coupled to the metal pillar. | 2012-12-06 |
20120306074 | SEMICONDUCTOR CHIP HAVING BUMP ELECTRODE, SEMICONDUCTOR DEVICE HAVING THE SEMICONDUCTOR CHIP, AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE - A semiconductor chip includes: a substrate; a first bump electrode formed on one face of the substrate; a second bump electrode formed on other face of the substrate; and a conductive bonding material layer formed on a top face of at least one of the first bump electrode and the second bump electrode. The first bump electrode has a convex top face and the second bump electrode has a concave top face. | 2012-12-06 |
20120306075 | SEMICONDUCTOR PACKAGE APPARATUS - A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball. | 2012-12-06 |
20120306076 | Semiconductor Micro-Connector With Through-Hole Via and a Method for Making the Same - A micro-connector fabricated from a semiconductor material is disclosed. The micro-connector has one or more low resistance regions having a predetermined low resistance through its thickness. Opposing surfaces of the semiconductor layer have one or more complementary and opposing receiving volumes and one or more complementary mating elements defined on each of the respective surfaces within the low resistance regions for the receiving of a solder ball bond from, for instance a stackable microelectronic layer or component. The solder ball bonds of a separately provided electronic element can be inserted through the mating elements and into the volume and mechanically affixed and electrically coupled to the micro-connector on each of the surfaces for the electronic coupling of a first electronic element to a second electronic element. | 2012-12-06 |
20120306077 | SEMICONDUCTOR DEVICE - A semiconductor device includes an electrode pad provided on a semiconductor chip, the electrode pad includes aluminum (Al) of between 50% wt. and 99.9% wt. and further includes copper (Cu), a coupling ball that primarily includes Cu, the coupling ball being coupled to the electrode pad so that a CuAl | 2012-12-06 |
20120306078 | EXPOSED INTERCONNECT FOR A PACKAGE ON PACKAGE SYSTEM - An integrated circuit packaging system includes: providing a substrate; mounting an integrated circuit above the substrate; connecting an interposer to the integrated circuit with a wire-in-film adhesive; connecting an exposed interconnect having an upper surface to the substrate; and encapsulating the integrated circuit with an encapsulation. | 2012-12-06 |
20120306079 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate, a surface electrode of aluminum-containing material formed on the substrate, a metal film of solderable material formed on the surface electrode, and an end-securing film securing an end of the metal film and having a portion on the surface electrode and also having an overlapping portion which is formed integrally with the portion on the surface electrode and which overlaps the end of the metal film. | 2012-12-06 |
20120306080 | Packaging Structures and Methods - A package component is free from active devices therein. The package component includes a substrate, a through-via in the substrate, a top dielectric layer over the substrate, and a metal pillar having a top surface over a top surface of the top dielectric layer. The metal pillar is electrically coupled to the through-via. A diffusion barrier is over the top surface of the metal pillar. A solder cap is disposed over the diffusion barrier. | 2012-12-06 |
20120306081 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD - According to one embodiment, a semiconductor device includes an interconnect provided on a first interlayer insulating film covering a semiconductor substrate in which an element is formed, a cap layer provided on the upper surface of the interconnect, and a barrier film provided between the interconnect and a second interlayer insulating film covering the interconnect. The interconnect includes a high-melting-point conductive layer, and the width of the interconnect is smaller than the width of the cap layer. The barrier film includes a compound of a contained element in the high-melting-point conductive layer. | 2012-12-06 |
20120306082 | SEMICONDUCTOR DEVICE AND STRUCTURE FOR HEAT REMOVAL - A device, including: a first layer of first transistors, overlaid by at least one interconnection layer, wherein the interconnection layer includes metals such as copper or aluminum; a second layer including second transistors, the second layer overlaying the interconnection layer, wherein the second layer is less than about 0.4 micron thick; and a connection path connecting the second transistors to the interconnection layer, wherein the connection path includes at least one through-layer via, and the through-layer via includes material whose co-efficient of thermal expansion is within about 50 percent of the second layer coefficient of thermal expansion. | 2012-12-06 |
20120306083 | SEMICONDUCTOR INTEGRATED CIRCUIT WITH MULTI-CUT VIA AND AUTOMATED LAYOUT METHOD FOR THE SAME - A semiconductor integrated circuit includes a first wiring, a second wiring, a third wiring, a fourth wiring, a first overlap area, a second overlap area, a multi-cut via, the multi-cut via including a first via and a second via formed in the first direction, and a single-cut via formed to connect the third wiring to the fourth wiring in the second overlap area. A width of the second portion of the second wiring corresponding to a first direction is longer than a width of the first portion of the second wiring corresponding to the first direction. A distance between the center of the first via and the center of the second via is longer than the width of the first portion of second wiring. | 2012-12-06 |
20120306084 | Semiconductor Constructions Having Through-Substrate Interconnects, and Methods of Forming Through-Substrate Interconnects - Some embodiments include methods of forming interconnects through semiconductor substrates. An opening may be formed to extend partway through a semiconductor substrate, and part of an interconnect may be formed within the opening. Another opening may be formed to extend from a second side of the substrate to the first part of the interconnect, and another part of the interconnect may be formed within such opening. Some embodiments include semiconductor constructions having a first part of a through-substrate interconnect extending partially through a semiconductor substrate from a first side of the substrate; and having a second part of the through-substrate interconnect extending from a second side of the substrate and having multiple separate electrically conductive fingers that all extend to the first part of the interconnect. | 2012-12-06 |
20120306085 | PROTECTIVE LAYER FOR PROTECTING TSV TIPS DURING THERMO-COMPRESSIVE BONDING - A method of protecting through substrate via (TSV) die from bonding damage includes providing a substrate including a plurality of TSV die having a topside including active circuitry, a bottomside, and a plurality of TSVs that include an inner metal core that reaches from the topside to protruding TSV tips that extend out from the bottomside. A protective layer is formed on or applied to the bottomside of the TSV die including between and over the protruding TSV tips. The TSV die is bonded with its topside down onto a workpiece having a workpiece surface and its bottomside up and in contact with a bond head. The protective layer reduces damage from the bonding process including warpage of the TSV die by preventing the bond head from making direct contact to the protruding TSV tips. | 2012-12-06 |
20120306086 | SEMICONDUCTOR DEVICE AND WIRING SUBSTRATE - A semiconductor device according to an embodiment includes an insulating substrate, a wiring layer formed on a first main surface of the insulating substrate, and a semiconductor element mounted on the wiring layer. In this semiconductor device, the wiring layer includes a first copper-containing material containing copper and a metal having the thermal expansion coefficient smaller than that of copper and the thermal expansion coefficient of the first copper-containing material is smaller than that of copper. | 2012-12-06 |
20120306087 | SEMICONDUCTOR DEVICE INCLUDING EXCESS SOLDER - A semiconductor device includes a substrate including a first metal layer, a first semiconductor chip having sidewalls, and a first solder layer contacting the first semiconductor chip and the first metal layer. The first metal layer includes a groove extending around sidewalls of the first semiconductor chip. The groove is at least partly filled with excess solder from the first solder layer. | 2012-12-06 |
20120306088 | METHOD AND SYSTEM FOR INTERNAL LAYER-LAYER THERMAL ENHANCEMENT - The exemplary embodiments of the present invention provide a method and apparatus for enhancing the cooling of a chip stack of semiconductor chips. The method includes creating a first chip with circuitry on a first side and creating a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The method further includes creating a cavity in a second side of the first chip between the connectors and filling the cavity with a thermal material. The chip stack of semiconductor chips with enhanced cooling apparatus includes a first chip with circuitry on a first side and a second chip electrically and mechanically coupled to the first chip by a grid of connectors. The apparatus further includes wherein portions of a second side of the first chip between the connectors is removed to provide a cavity in which a thermal material is placed. | 2012-12-06 |
20120306089 | APPARATUSES INCLUDING STAIR-STEP STRUCTURES AND METHODS OF FORMING THE SAME - Methods for forming semiconductor structures are disclosed, including a method that involves forming sets of conductive material and insulating material, forming a first mask over the sets, forming a first number of contact regions, forming a second mask over a first region of the sets, and removing material from of the sets in a second, exposed region laterally adjacent the first region to form a second number of contact regions. Another method includes forming first and second contact regions on portions of sets of conductive materials and insulating materials, each of the second contact regions more proximal to an underlying substrate than each of the first contact regions. Apparatuses such as memory devices including laterally adjacent first and second regions each including contact regions of a different portion of a plurality of conductive materials and related methods of forming such devices are also disclosed. | 2012-12-06 |
20120306090 | CONDUCTIVE STRUCTURES, SYSTEMS AND DEVICES INCLUDING CONDUCTIVE STRUCTURES AND RELATED METHODS - Conductive structures include a plurality of conductive steps and a contact extending at least partially therethrough in communication with at least one of the plurality of conductive steps and insulated from at least another one of the conductive steps. Devices may include such conductive structures. Systems may include a semiconductor device and a stair step conductive structure having a plurality of contacts extending through a step of the stair step conductive structure. Methods of forming conductive structures include forming contacts in contact holes formed through at least one conductive step of a conductive structure. Methods of forming electrical connections in stair step conductive structures include forming contacts in contact holes formed through each step of the stair step conductive structure. | 2012-12-06 |
20120306091 | Connecting System for Electrically Connecting Electronic Devices and Method for Connecting an Electrically Conductive First Connector and Electrically Conductive Second Connector - A semiconductor module system includes a substrate, at least one semiconductor chip, and a number of at least two electrically conductive first connecting elements. The substrate has a bottom side and a top side spaced apart from the bottom side in a vertical direction. The at least one semiconductor chip is arranged on the top side. Each one of the first connecting elements has a first end which protrudes away from an insulation carrier of the substrate in a direction perpendicular to the vertical direction. The semiconductor system further includes a connecting system with a number of N≧1 connectors. A first one of the connectors includes at least two electrically conductive second connecting elements. Each one of the second connecting elements has a first end. The first end of each one of the first connecting elements is electrically conductively connectable to the first end of one of the second connecting elements. | 2012-12-06 |
20120306092 | CONDUCTIVE PADS DEFINED BY EMBEDDED TRACES - An assembly and method of making same are provided. The assembly can include a first component including a dielectric region having an exposed surface, a conductive pad at the surface defined by a conductive element having at least a portion extending in an oscillating or spiral path along the surface, and a an electrically conductive bonding material joined to the conductive pad and bridging an exposed portion of the dielectric surface between adjacent segments. The conductive pad can permit electrical interconnection of the first component with a second component having a terminal joined to the pad through the electrically conductive bonding material. The path of the conductive element may or may not overlap or cross itself. | 2012-12-06 |
20120306093 | CONVERTING METAL MASK TO METAL-OXIDE ETCH STOP LAYER AND RELATED SEMICONDUCTOR STRUCTURE - A method includes providing a semiconductor structure including a plurality of devices; depositing a nitride cap over the semiconductor structure; forming an aluminum mask over the nitride cap, the aluminum mask including a plurality of first openings; converting the aluminum mask to an aluminum oxide etch stop layer; and performing middle-of-line fabrication processing, leaving the aluminum oxide etch stop layer in place. A semiconductor structure includes a plurality of devices on a substrate; a nitride cap over the plurality of devices; an aluminum oxide etch stop layer over the nitride cap; an inter-level dielectric (ILD) over the aluminum oxide etch stop layer; and a plurality of contacts extending through the ILD, the aluminum oxide etch stop layer and the nitride cap to the plurality of devices. | 2012-12-06 |
20120306094 | SIGNAL ROUTING USING THROUGH-SUBSTRATE VIAS - The present description relates to the field of microelectronic devices and the fabrication thereof, wherein through-substrate vias are utilized to route signals between microelectronic integrated circuit components, such as transistors, resistors, capacitors, inductors, and the like, within the microelectronic devices. The through-substrate vias may be used for routing critical signals, which may include, but are not limited to, timing sensitive signal, such as clock signals and the like. | 2012-12-06 |
20120306095 | SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME - A semiconductor package and a fabrication method are provided. The semiconductor package includes a first substrate including opposite first and second surfaces, a first through electrode penetrating the first substrate, a second substrate including opposite third and fourth surfaces, a second through electrode penetrating the second substrate, an insulating pattern interposed between the second surface of the first substrate and the third surface of the second substrate to at least partially expose the second surface of the first substrate and the third surface of the second substrate, and a connecting pattern disposed in a space defined by the insulating pattern and the first and second substrates to electrically connect the first through electrode with the second through electrode. | 2012-12-06 |
20120306096 | METHOD AND MODEL OF CARBON NANOTUBE BASED THROUGH SILICON VIAS (TSV) FOR RF APPLICATIONS - A carbon nanotube (CNT) through silicon via (TSV) for three-dimensional (3D) substrate interconnects is described. TSV technologies provide for high performance and high density 3D packages. The CNT-based TSVs provide for integration of analog, RF and mixed-signal integrated circuits. CNT-based TSV provides superior electrical characteristics as compared to conventional TVs filled with conductive metals. | 2012-12-06 |
20120306097 | Semiconductor Device and Method of Forming WLCSP Structure using Protruded MLP - A semiconductor device can include a carrier substrate, and a first semiconductor die disposed on a surface of the carrier substrate. An encapsulant can be disposed over the first semiconductor die and the carrier substrate. The semiconductor device can include first vias disposed through the encapsulant as well as second vias disposed through the encapsulant to expose first contact pads. The first contact pads are on upper surfaces of the first semiconductor die. The semiconductor device can include conductive pillars that fill the first vias, and first conductive metal vias (CMVs) that fill the second vias. The conductive pillar can include a first conductive material, and the first CMVs can be in contact with the first contact pads. The semiconductor device can include a conductive layer disposed over the encapsulant. The conductive layer can electrically connect one of the first CMVs with one of the conductive pillars. | 2012-12-06 |
20120306098 | Curing Low-k Dielectrics for Improving Mechanical Strength - An integrated circuit structure including reflective metal pads is provided. The integrated circuit structure includes a semiconductor substrate; a first low-k dielectric layer overlying the semiconductor substrate, wherein the first low-k dielectric layer is a top low-k dielectric layer; a second low-k dielectric layer immediately underlying the first low-k dielectric layer; and a reflective metal pad in the second low-k dielectric layer. | 2012-12-06 |
20120306099 | MULTILAYERED BOARD SEMICONDUCTOR DEVICE WITH BGA PACKAGE - In a lamination type semiconductor device, in the case where a power source plane is wrapped by a closed area to prevent the needless radiation from being leaked to the outside of the semiconductor package, a planar conductor for shield having an area intersecting with the respective layers is required. However, in a device for manufacturing the lamination type semiconductor device, a process for manufacturing the above-mentioned conductor cannot be realized ordinarily. In order to make the process possible, it is required to modify or replace a manufacturing apparatus of the semiconductor device, and accordingly a manufacturing cost will be considerably increased. In the present invention, a guard ring is arranged in an surrounding area of a power source plane. The guard ring is connected to a GND plane of another layer through a via. Consequently, the RF radiation occurs between the power source plane and the guard ring. | 2012-12-06 |
20120306100 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device, includes temporarily fixing a semiconductor chip to a supporting member to direct a connection electrode toward the supporting member side, forming an insulating layer for preventing resin-permeation covering the semiconductor chip, on the supporting member and the semiconductor chip, forming a resin substrate sealing a periphery and a back surface side of the semiconductor chip, on the insulating layer, and removing the supporting member to expose the connection electrode of the semiconductor chip. A build-up wiring is connected directly to the connection electrode of the semiconductor chip. | 2012-12-06 |
20120306101 | SEMICONDUCTOR DEVICE - A power line structure is implemented which is capable of securing large interconnection resources for signal lines while suppressing a power supply voltage drop. Power supply potential lines and substrate potential lines are formed in a first wiring layer, and power supply strap lines are formed in a wiring layer that is located below the center of the overall height of the wiring layers. Upper via portions are arranged at a lower density in the direction in which the power supply strap lines extend than lower via portions. | 2012-12-06 |
20120306102 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE STACKING AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base package carrier; mounting an interposer over the base package carrier; forming a base package encapsulation over the base package carrier and the interposer with the base package encapsulation having a cavity for exposing the interposer; and forming a support recess in the base package encapsulation between a non-horizontal edge of the base package encapsulation and the cavity. | 2012-12-06 |
20120306103 | STACKED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF - A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer thereon. The second adhesive layer has a two-layer structure formed by a same material and having different modulus of elasticity. The second adhesive layer of the two-layer structure has a first layer disposed at the first electronic component side and a second layer disposed at the second electronic component side. The first layer softens or melts at an adhesive temperature. The second layer maintains a layered shape at the adhesive temperature. According to the stacked electronic component, occurrences of an insulation failure and a short circuiting are prevented, and in addition, a peeling failure between the electronic components, an increase of a manufacturing cost, and so on, can be suppressed. | 2012-12-06 |
20120306104 | Semiconductor Device and Method of Forming Interconnect Structure With Conductive Pads Having Expanded Interconnect Surface Area for Enhanced Interconnection Properties - A semiconductor device has a substrate and first conductive pads formed over the substrate. An interconnect surface area of the first conductive pads is expanded by forming a plurality of recesses into the first conductive pads. The recesses can be an arrangement of concentric rings, arrangement of circular recesses, or arrangement of parallel linear trenches. Alternatively, the interconnect surface area of the first conductive pads is expanded by forming a second conductive pad over the first conductive pad. A semiconductor die has a plurality of interconnect structures formed over a surface of the semiconductor die. The semiconductor die is mounted to the substrate with the interconnect structures contacting the expanded interconnect surface area of the first conductive pads to increase bonding strength of the interconnect structure to the first conductive pads. A mold underfill material is deposited between the semiconductor die and substrate. | 2012-12-06 |
20120306105 | Multi-Component Power Structures and Methods For Forming The Same - In one embodiment, a method for forming a multi-component power structure for use in electrically propelled vehicles may include constraining a parent material system between a power component and a thermal device. The parent material system may include a low temperature material having a relatively low melting point and a high temperature material having a relatively high melting point. The relatively low melting point may be less than the relatively high melting point. The parent material system can be heated to a melting temperature greater than the relatively low melting point and lower than the relatively high melting point to diffuse the low temperature material into the high temperature material. The parent material system can be solidified to form a transient liquid phase bond that is electrically and thermally conductive. | 2012-12-06 |
20120306106 | SEMICONDUCTOR DEVICE HAVING DUMMY PATTERN AND DESIGN METHOD THEREOF - Disclosed herein is the semiconductor substrate, wiring patterns and dummy patterns. A margin region is formed around the wiring pattern. The dummy region is further formed around the margin region. The dummy patterns are formed in the dummy region. The dummy patterns are arranged along the extending direction of the dummy region. Margin regions and dummy regions are allocated alternately with respect to the wiring pattern. | 2012-12-06 |
20120306107 | SILICONE RESIN COMPOSITION, SILICONE RESIN SHEET, OPTICAL SEMICONDUCTOR ELEMENT DEVICE, AND PRODUCING METHOD OF SILICONE RESIN SHEET - A silicone resin composition contains a first organopolysiloxane having, in one molecule, both at least two ethylenically unsaturated hydrocarbon groups and at least two hydrosilyl groups; a second organopolysiloxane having, in one molecule, at least two hydrosilyl groups without containing an ethylenically unsaturated hydrocarbon group; a hydrosilylation catalyst; and a hydrosilylation inhibitor. | 2012-12-06 |
20120306108 | BUBBLE GENERATING DEVICE - A bubble generating device includes a body having a front cover and a rear cover connected to the front cover. The front cover has a nozzle which has a passage defined therein. The rear cover has a space defined therein. A connection tube is connected to the rear cover and has a through hole so as to be connected with a spray gun. A bubble generating unit has a first net member and a second net member, both of which are located in the space. The space is defined into an expansion area, a pressure area and a bubble accumulating area by the first and second net members. The detergent is delivered into the expansion area and generates bubbles in the bubble accumulating area. The bubbles are accumulated into big lump of bubbles and sprayed by the air stream. | 2012-12-06 |
20120306109 | Method For Evenly Preparing Filament By Using High-Shearing Solution of Ultrahigh-Molecular-Weight Polyethylene - A method for evenly preparing filament by using high-shearing solution of ultrahigh-molecular-weight polyethylene is disclosed. The method involves mixing an ultrahigh-molecular-weight polyethylene with a solvent in a predetermined ratio, and processing the mixture through a high-shear method to prepare an ultrahigh-molecular-weight polyethylene emulsion solution that is extruded by a dual-screw extruder and quenched in chilled water into a gel protofilament. The gel protofilament is then cleaned by a hydrocarbon cleaning agent before undergoing extraction drawing, drying and hot drawing multiple times so as to form high-tenacity, high-modulus polyethylene fiber. The resultant fiber has good mechanical properties and less fiber misalignment while its production enjoys advantages of low energy consumption, good production conditions, and short production cycle. | 2012-12-06 |
20120306110 | LOCKING APPARATUS AND CONTROL METHOD OF LOCKING APPARATUS - A locking apparatus includes a stationary platen on which a stationary die is mounted, a movable platen on which a movable die is mounted, a locking drive mechanism that advances or retreats the movable platen, an ejecting member held in the movable platen to remove a molded product from the movable die, a protruding drive mechanism that pushes out the ejecting member from the movable die, and an error detection unit that detects extraneous material based on a state change of the ejecting member or the protruding drive mechanism during a closing operation. | 2012-12-06 |
20120306111 | Method and Apparatus for Moving a Tube Extrusion Line Along - A method and apparatus for moving along a tube extrusion line. An extruded tube is pushed through the extrusion line, by means of pressure generated by an extruder, to a withdrawal unit that takes over further driving of the tube. In a first-moving along phase, in which the tube has not yet passed a sealing of a calibration cooling unit relative to the atmosphere, the latter is under atmospheric pressure. In a second phase, in which the tube has passed the sealing, the calibration and cooling unit is placed under underpressure. In the first phase, the tube is supported either by internal overpressure or by a mechanical inner guide. A support cylinder extends axially from a casing head of the extruder and extends coaxially into a calibration sleeve in a first section of the calibration and cooling unit. A support plate is disposed between the casing head and an inlet of the calibration sleeve and provides external support for a tube exiting the casing head. | 2012-12-06 |
20120306112 | MOLDING MACHINE AND INJECTION MOLDING CONTROLLING METHOD - A molding machine according to an embodiment includes a stationary platen equipped with a stationary die, a movable platen equipped with a movable die, a locking drive mechanism to move the movable platen forward or backward and to lock the movable die against the stationary die, a detecting portion to detect information about a locking state, an injection device, and a control unit to monitor the information obtained by the detecting portion in an injecting process and to control an injection pressure of the injection device based on a value obtained from the information. | 2012-12-06 |
20120306113 | IN AN INJECTION MOLDING MACHINE, A METHOD OF CONTROLLING A MELT ACCUMULATOR - According to embodiments, there is provided a method ( | 2012-12-06 |
20120306114 | PROCESS FOR PREPARING BIOCOMPATIBLE FREE-STANDING NANOFILMS OF CONDUCTIVE POLYMERS THROUGH A SUPPORT LAYER - A process for the preparation of nanofilms of conductive polymers is described. The process comprises forming support layers comprised of various polymers and free-standing nanofilms can be obtained thereby. The nanofilms obtained by the process can have characteristics such as strength, flexibility, ability to adhere to different substrates, and biocompatibility, which can make them suitable for numerous different technological applications, and in particular applications in the biomedical field. | 2012-12-06 |
20120306115 | PROCESS FOR PRODUCTION OF POLYTETRAFLUOROETHYLENE SHEET, AND PROCESS FOR PRODUCTION OF POLYTETRAFLUOROETHYLENE SEAL TAPE - Disclosed is a process for production of a polytetrafluoroethylene (PTFE) sheet, which is superior in productivity compared to conventional processes and can reduce the cost of production. Also disclosed is a process for production of a PTFE seal tape. The processes comprise the following steps (i) to (iii): (i) applying a force to a PTFE particle suspension comprising PTFE particles, a surfactant and water (a dispersion medium) so that the particles can come close to each other or contact with each other, thereby forming a PTFE-containing solid material having the water and the surfactant included therein; (ii) shaping the solid material into a sheet-like form; and (iii) reducing the water content in the sheet-like solid material. | 2012-12-06 |
20120306116 | ELECTRONIC CIRCUIT DEVICE AND METHOD OF MAKING THE SAME - A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing. | 2012-12-06 |
20120306117 | PROCESS FOR MANUFACTURING A PLASTIC HOLLOW BODY FROM A PARISON AND DIE FOR EXTRUDING A PARISON - A process for manufacturing a plastic hollow body including extruding a molten plastic parison through a die. At least one longitudinal cut is made in the parison. The parison is introduced into a mold comprising two cavities. The hollow body is molded by conforming the parison to the mold cavities. The die includes a passage for the molten plastic which gradually modifies the shape of the parison so that it is substantially flattened on exiting. | 2012-12-06 |
20120306118 | JOINT AND METHOD FOR MANUFACTURING JOINT - An inner tubular portion ( | 2012-12-06 |
20120306119 | ELASTIC COUPLING DEVICE, DAMPING ARRANGEMENT AND METHOD FOR MANUFACTURING THE ELASTIC COUPLING PIECE - An elastic coupling device for elastically connecting a damping mass like a gas generator to a motor vehicle part exposed to oscillations and/or vibrations, in particular an airbag module, in one embodiment comprising a rigid support ring facing the vehicle, at least one fixation piece like a rivet head, the fixation piece facing the damping mass and being made of a rigid material, and a spring body coupling the support ring and the fixation piece. The support ring and/or the fixation piece, respectively made of a plastic material, as well as the spring body, which may be made of an elastomer material, may be produced in a single manufacturing step by means of a two-component process, in particular by two-component injection moulding. | 2012-12-06 |
20120306120 | Compression Programming of Shape Memory Polymers Below the Glass Transition Temperature - Compression programming of a shape memory polymer without the requirement of added heat, wherein the programming occurs at a temperature below the glass transition of the shape memory polymer. The shape memory polymer can be either a thermoset or a thermoplastic shape memory polymer. | 2012-12-06 |
20120306121 | CERAMIC METAL COMPOSITE FOR ORTHOPAEDIC IMPLANTS - The invention relates to an orthopaedic implant made of a ceramic metal composite. The composite includes one phase that is a biocompatible metal or metal alloy and a second phase of ceramic particles examples of which include carbides, nitrides and/or oxides. In some embodiments, the implant comprises a homogeneous ceramic layer as part of a multilayered composition. In some embodiments, the multilayered composition comprises a homogeneous metal layer. | 2012-12-06 |
20120306122 | IMPRINTING METHOD - An imprinting method is capable of separating a molding material and a target material rapidly in pattern formation. The imprinting method includes a transferring process for transferring an inverted pattern of a mold | 2012-12-06 |
20120306123 | Honeycomb Body Reactor Plugging Process Improvements - A method is disclosed for plugging selected cells of a honeycomb monolith so as to form a fluidic reactor, the method comprising contacting selected cells of a honeycomb monolith with a melted or softened plug material, the material comprising at least one sinterable particulate and a binder, the binder comprising at least one thermo-setting component and at least one UV-radiation curable polymer, the contacting performed such that a portion of the material remains in contact with the selected cells and plugs the selected cells; cooling the melted or softened plug material such that the thermo-setting component sets; after cooling, irradiating the portion of the material so as to at least partially cure the radiation curable polymer; and after irradiating, debinding or debinding and sintering the portion of the material so as to remove the binder or s as to debind and sinter the at least one sinterable particulate, wherein the step of debinding or debinding and sintereing is performed with the cells of the monolith in a vertical orientation resting on a flat surface with a compatible ceramic or other refractory material felt covering the openings below and above and with a weight resting on the upper face, with optional shims defining the distance between the felt and the end faces. | 2012-12-06 |
20120306124 | UV Curing of Embossed Structures - A system for embossing a pattern on a storage tape component includes a storage tape component having a curable layer, an ultraviolet light source, and an embossing drum. The embossing drum has an exterior drum section and an interior cavity. The exterior drum section is transmissive to ultraviolet light and has an outer surface that contacts the curable layer. The outer surface includes a first pattern that is complementary to a second pattern to be formed on the storage tape component. The exterior drum section is rotatable about a center such that the storage tape component moves in concert with the outer drum section while the curable layer is cured by ultraviolet radiation emanating from the ultraviolet light source. | 2012-12-06 |
20120306125 | Method and Apparatus for Manufacturing Components Used for the Manufacture of Articles - Methods of manufacturing wearable articles include: (a) performing a scan of a body part of a user on which the wearable article will be worn; (b) creating a virtual design of a mold insert configured to mold the wearable article, based on the scan; (c) saving the virtual design in a data file; (d) fabricating the mold insert using a laser sintering, fused deposition modeling, and stereolithography technique; (e) inserting the mold insert into a mold; (f) inserting moldable material into a cavity created at least in part by the mold insert; (g) molding the moldable material to produce the wearable article; and (h) removing the wearable article from the mold. The wearable article may include a portion of an article of footwear, such as a portion of a shoe sole. | 2012-12-06 |
20120306126 | PLASTIC CONTAINERS WITH GAS BARRIER COATING AND OPTIONALLY HYDROPHILIC INSIDE COATING - The invention is directed to a process for producing a plastic container with a barrier coating comprising a) applying at least one coating layer of a first polyvinyl acetal on at least a part of the plastic container; b) applying at least one coating layer of polyvinyl alcohol on the first polyvinyl acetal layer; c) applying at least one top coating layer of a second polyvinyl acetal on the polyvinyl alcohol layer. The surface of the plastic container may be pre-treated before coating. In addition to the barrier coating, the surface energy of at least a part of the inside surface of the plastic container may be increased by applying at least one inner hydrophilic coating layer. | 2012-12-06 |
20120306127 | Apparatus and plant for the stretch blow moulding of plastics material pre-forms and use of a ceramic component - The invention relates to an apparatus ( | 2012-12-06 |
20120306128 | METHODS FOR FORMING FEEDTHROUGHS FOR HERMETICALLY SEALED HOUSINGS USING POWDER INJECTION MOLDING - Methods of forming feedthroughs for hermetically sealed housings using powder injection molding, including positioning a plurality of separate electrically conductive elements in a mold, injecting non-electrically conductive powder injection molding (PIM) feedstock into the mold to form a plurality of insulative bodies around the conductive elements, sintering the insulative bodies to form the plurality of feedthroughs physically connected to one another via the conductive elements; and severing the conductive elements between neighboring insulative bodies. | 2012-12-06 |
20120306129 | REACTION EQUIPMENT FOR PRODUCING SPONGE TITANIUM - The present invention provides a piece of reaction equipment for producing sponge titanium, which includes a reactor and a reactor cover with a stirring device, wherein a sealing ring is arranged between the reactor cover and the reactor, one side of the reactor cover is provided with a lifting device for controlling the lifting of the reactor cover, a resistance furnace is arranged above the reactor cover, a valve is arranged below the resistance furnace, and a vacuum-pumping pipe and an inflation pipe are arranged above the reactor cover. The present invention has the beneficial effects that the production equipment can ensure normal production, and effectively ensures the quality of sponge titanium product; compared with the prior art, the equipment has low cost, environmental protection and harmlessness during production. | 2012-12-06 |
20120306130 | COOLING METHOD AND COOLING DEVICE OF HOT-ROLLED STEEL STRIP - The present invention provides a method of cooling a hot-rolled steel strip which has passed through a finishing rolling, including: cooling the hot-rolled steel strip from a first temperature of not lower than 600° C. and not higher than 650° C. to a second temperature of not higher than 450° C. with cooling water having the water amount density of not lower than 4 m | 2012-12-06 |
20120306131 | DISTILLATION EQUIPMENT FOR PRODUCING SPONGE TITANIUM - The present invention provides a piece of distillation equipment for producing sponge titanium, which includes a heating furnace and a reactor for containing a condensate, wherein a heating furnace cover is arranged above the heating furnace, a reactor cover is arranged above the reactor, the heating furnace cover is connected with the reactor cover by a pipe, a resistance wire is arranged on the pipe, each lifting device is arranged above the heating furnace cover and the reactor cover, a vacuum-pumping pipe is arranged above a heater cover, and a first metal sealing ring is arranged between the reactor cover and the reactor. The present invention has the beneficial effects that the distillation equipment can ensure normal production, and effectively ensure the quality of sponge titanium product. The problem of distillation tube blockage is solved by adopting a metal gasket. | 2012-12-06 |
20120306132 | GAS SPRING EQUIPPED WITH IMPROVED SEALING MEANS - A gas spring is provided that can comprise at least one rod, at least one guide bushing, and at least one dynamic seal. The rod can slide inside at least one cylinder containing gas. The dynamic seal can be interposed between the rod and the cylinder. In some embodiments, the guide bushing can be formed from a first mixture comprising a thermoplastic polymer and a solid lubricant filler. Further, in some embodiments, the dynamic seal can be formed from a second mixture comprising a thermoplastic elastomer and a mineral filler or a powder of thermoplastic polymer. | 2012-12-06 |
20120306133 | LONG TRAVEL SHOCK ABSORBER - One example embodiment includes a fluid based shock absorber. The fluid based shock absorber includes a first assembly. The first assembly includes a first compression chamber. The first assembly also includes a first sliding member. At least a portion of the first sliding member is configured to remain within the first compression chamber and the first sliding member is configured to move in a first direction relative to the first compression chamber. | 2012-12-06 |
20120306134 | FLUID-FILLED TYPE VIBRATION DAMPING DEVICE - A fluid-filled type vibration damping device including: a first mounting member positioned at one axial opening side of a tubular portion of a second mounting member; a main rubber elastic body connecting the two mounting members; a plurality of pocket portions that open onto an axial end face of the main rubber elastic body facing a partition member so that a plurality of pressure-receiving chambers are formed by means of the pocket portions being covered with the partition member; an elastic separating wall that is composed by the main rubber elastic body and separates the pressure-receiving chambers from one another; and a dividing recess that opens onto an axial end face of the elastic separating wall facing the partition member so that a dividing fluid chamber is formed by means of the dividing recess being covered with the partition member. | 2012-12-06 |
20120306135 | LIQUID-FILLED VIBRATION ISOLATING DEVICE - In a liquid-filled vibration isolating device according to a first aspect of the present invention, at least one of a membrane support ( | 2012-12-06 |
20120306136 | STABILIZER AND METHOD FOR MANUFACTURING THE STABILIZER - A torsion portion extending in a vehicle width direction and having a first cross-sectional area, shoulder portions located at both ends of the torsion portion and having a second cross-sectional area larger than the first cross-sectional area and arm portions extending from the shoulder portions in a front and back direction of a vehicle, respectively and having the first cross-sectional area, so that even when a hollow member is used for weight saving, can be realized by design and manufacturing method facilitating making uniform principal stress as in a solid member. | 2012-12-06 |
20120306137 | PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM - A system for fluid processing substrate surfaces arrayed in a fluid having a process section with a frame having a plurality of process elements to process the substrate surfaces without contacting the substrate surfaces. A substrate holder assembly having a holder frame and a number of substrate holders, each of which is coupled to the holder frame and is configured for holding a substrate so that each substrate holder holds a different substrate for transport as a unit with the substrate holder assembly to and from the process section. The substrate holder assembly and each substrate holder are removably coupled to the process section frame, and the substrate holders of the substrate holder assembly are movable relative to the holder frame and positionable in repeatable alignment with respect to a predetermined feature of the process section and independent of positioning of the holder frame with respect to the process section. | 2012-12-06 |
20120306138 | CLAMPING DEVICE - A clamping device includes a supporting base, a frame member, two slidable members, and a bolt. The frame member is mounted on the supporting base and defines a through hole. The frame member further defines two mounting holes on two opposite walls of the through hole. Each slidable member comprises a clamping portion and a matching portion connected to each other, each clamping portion defines a clamping surface. The clamping surface defines clamping grooves. A saw-toothed structure is formed on an inner wall of each clamping groove. Each matching portion is received in the through hole and defines a threaded hole. The bolt is threaded and passes through the threaded holes. The threads of the bolt engage with the threaded holes, two ends of the bolt are respectively received in the mounting holes. The two slidable members slide towards or slide away from each other when the bolt is rotated. | 2012-12-06 |
20120306139 | PARALLEL SINGLE SUBSTRATE PROCESSING SYSTEM HOLDER - A substrate holder adapted to hold and retain a substrate during vertical fluid processing of a surface of the substrate. The wafer holder has a frame. A first leg is coupled to the frame by a first compliant flexure, the first leg having a first contact member configured to engage a first edge of the substrate. A second leg is coupled to the frame by a second compliant flexure, the second leg having a second contact member configured to engage a second edge of the substrate. Upon deflection of the first and second compliant flexures, the first and second legs are moveable in substantially opposite directions disengaging the first and second contact fingers from the first and second edges of the substrate respectively. | 2012-12-06 |
20120306140 | Z-FOLD SIGNATURE FINISHING SYSTEM AND PRINTER - Z-fold signature finishing systems are provided. One z-fold finishing system has a receiver system to receive a signature print; an automatic z-fold system configured to make a z-folded stack of sheets formed from separate portions of a length of a signature print with each sheet being joined to at least one other sheet in the z-folded stack by at least one of the z-folds; a binding system that can bind the z-folded stack proximate to a saddle fold location between the z-folds; a saddle folder having at least two surfaces arranged so that the at least two surfaces and the z-folded stack can move relative to each other to cause the z-folded stack to fold proximate to the saddle fold location to dispose the z-folds along a common face of the saddle folded stack, and, a separation system separating the signature print proximate to at least one of the z-folds. | 2012-12-06 |
20120306141 | Z-FOLD SIGNATURE MEDIA - Signature prints are provided. In one aspect a signature print comprises a receiver medium having a length that extends from a first edge to a second edge to provide a row of page areas along a first side and a second side of the signature print, with the receiver medium being predisposed in a manner that causes the receiver medium to z-fold of across a width of the receiver medium to form a z-folded stack of sheets of portions of the length of the receiver medium and with the z-folds being arranged along the length such that the sheets generally decrease in length. The lengths of the sheets are defined so that when the z-folded stack is saddle folded the z-folds are positioned along a common face to form a determined profile. | 2012-12-06 |
20120306142 | METHOD FOR MAKING A Z-FOLD SIGNATURE - Methods for forming a signature are provided. In one aspect an automatic z-folding system is used to cause a signature print to fold across a width proximate to z-fold locations spaced along a length of the signature print and to form a z-folded stack of sheets of the signature print and the z-folded stack is bound across a width of the stack proximate to a saddle fold location between the z-folds; saddle folding the z-folded stack at the saddle fold location to dispose the z-folds along a common face of the saddle folded stack, and, separating the signature print at at least one of the z-folds. | 2012-12-06 |
20120306143 | Z-FOLD SIGNATURE FINISHING METHOD - Methods for forming a signature are provided. In accordance with one embodiment, a signature print is received that is predisposed to z-fold of the across a width of the signature print to form a z-folded stack of sheets and an automatic z-fold system is used to enable the signature print to form the z-folded stack of sheets of the signature print according to the manner in which the signature print is predisposed. The z-folded stack is bound proximate to a saddle fold location between the z-folds and is saddle folded across a width of the stack proximate to the saddle fold location to dispose the z-folds along a common face of the saddle folded stack, and, the signature print is separated proximate to at least one of the z-folds. | 2012-12-06 |
20120306144 | DISCHARGED SHEET ALIGNING DEVICE AND IMAGE ERASING APPARATUS INCLUDING THE SAME - According to one embodiment, a image erasing apparatus includes a paper feeding section configured to feed a sheet having a erasable image, a erasing section configured to erase the image, a paper discharge section including a paper discharge member configured to discharge, downstream in a conveying path of the erasing section, the sheet from which the image is erased and a paper discharge tray on which the discharged sheet is stacked, and a longitudinal alignment plate pivotably provided above the paper discharge tray and configured to align the leading end of the sheet stacked on the paper discharge tray. | 2012-12-06 |
20120306145 | PAPER-FEEDING APPARATUS FOR PRINTING APPARATUS - A paper-feeding apparatus for a printing apparatus includes a paper input port, a first paper holding tray and a second paper holding tray. The paper input port curves the sheets of paper fed into it so as to increase the rigidity of the stack and the friction between each sheet. The additional rigidity of the stack allows the use of a lightweight paper tray in holding the stack. | 2012-12-06 |
20120306146 | Sheet Feeding Device and Image Forming Apparatus Incorporating Same - A sheet feeding device that can be incorporated in an image forming apparatus includes a sheet feeder including a belt unit including an attraction belt facing a sheet stack and first and second tension rollers to keep the attraction belt taut, and a side holder to rotatably support the belt unit about the first tension roller that serves as a pivot of the sheet feeder being disposed upstream from the second tension roller in the sheet conveyance direction, a contact and separation drive unit to swing the sheet feeder to make the attraction belt contact with and separate from the sheet stack, and a swing range adjuster to adjust a range of swing of the belt unit with respect to the side holder between contact and separation of the attraction belt with respect to the sheet stack, according to a predetermined condition. | 2012-12-06 |
20120306147 | DUAL NIP MULTI-FEED DETECTION AND CONTROL SYSTEM - A paper feed system for use in a printing apparatus that detects multi-feeds and separates all sheets while allowing a single sheet to continue into the machine includes a nip with a drive roller for feeding sheets. A reversible pressure roller downstream of the drive roller is connected to a motor, but idles in the direction of the paper feed in normal operation. When a multi-feed is detected, the motor is turned ON and the reversible pressure roll actuated by a controller. The reversible pressure roller has more friction with the sheet in its contact than the friction between sheets. This drives the sheet in contact backwards. | 2012-12-06 |
20120306148 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feeding device includes a sheet storing portion storing sheets stacked on a stacking surface thereof; a feeding roller feeding each of the sheets by rotating while being in contact with a topmost one of the sheets; a support member having a support surface that supports downstream-side part, in a sheet feeding direction, of the sheets and, at the time of sheet feeding, being movable perpendicularly to the stacking surface while lifting the downstream-side part of the sheets with the topmost sheet kept in contact with the feeding roller; and a stopper member configured to come into contact with leading ends of some sheets to be fed by the feeding roller and to stop sheets other than the topmost sheet. The support surface of the support member slopes upward, with respect to the stacking surface, toward a downstream side in the sheet feeding direction. | 2012-12-06 |
20120306149 | SHEET STORAGE CASSETTE AND IMAGE FORMING APPARATUS - A sheet storage cassette can include a sheet supporting board and a restriction guide. The sheet supporting board can support at least one sheet thereon. The restriction guide can be arranged on the sheet supporting board and include a sheet holding surface that is substantially perpendicular to the sheet support board. The restriction guide can further include a mark indicated part at an upper side thereof, where the mark indicated part can extend at least partly along a plane that intersects a plane of the holding surface and can indicate a maximum storage capacity level of the sheet storage cassette. | 2012-12-06 |
20120306150 | GAME MACHINE - A game machine includes a predetermined number of playing balls; a game board provided with a playfield on which the playing balls cascade downward; a launching device configured to launch the playing balls toward the playfield; a supply part configured to supply the playing balls to the launching device; a collecting part configured to collect the playing balls supplied from the supply part to the launching device and launched to the playfield; and a guide part configured to guide the playing balls collected by the collecting part to return to the supply part without discharging the playing balls outside the game machine. The predetermined number of playing balls circulate through the game board, the collecting part, the guide part and the supply part, and can be repeatedly used. | 2012-12-06 |
20120306151 | GAME MACHINE - A game machine includes a game board provided with a playfield on which a playing ball cascades downward, a ball receiving hole detection part configured to detect whether or not the playing ball enters a ball receiving hole provided in the playfield, a win determination part configured to determine, when the ball receiving hole detection part detects the playing ball, whether or not a special win is acquired, a game value to be provided for the special win not being determined at a time of provision of the game value, a decision part configured to decide, when the win determination part determines that the special win is acquired, a predetermined game value provided by the special win, and a game value providing part configured to provide the predetermined game value decided by the decision part. | 2012-12-06 |
20120306152 | INTELLIGENT TABLE GAME SYSTEM - A card dealing system incorporating playing cards with rank and suit information encoded thereon via micro-dots, and a shoe capable of reading such micro dots as a playing card is drawn from the shoe. A game controller unit determines the location of the micro-dots on the playing card, and determines the rank and suit information therefrom. The game controller thereby monitors the progress and status of a card game. | 2012-12-06 |
20120306153 | CUBE PUZZLE - A puzzle game includes a first and a second group of several pieces each. Several assemblies of pieces may be selected of the two groups. Three pieces of the first group are different from each other by the piece shape. Each of the pieces of the second group of pieces are different in shape from each of the pieces of the first group. Each of the assemblies forms an object, which objects are externally the same. Each of the different assemblies includes at least one piece of the first group and at least one piece of the second group. The formed objects are two or three dimensional objects. Preferably, each of the formed objects consists of identical cells. For example, the first and second groups consist of respectively three and six pieces. Each of three assemblies includes one piece and two pieces of the respective first and second groups. | 2012-12-06 |
20120306154 | Board Game Apparatus - The present invention features a game apparatus having a game board having game spaces and game pieces. The apparatus comprises fabulous five game pieces and blank game pieces with indicia on one side identifying the game piece is a traveler. Only a traveler can move in a forwards and backwards direction on the game board in one or two game spaces. The game pieces move in a diagonal motion two diagonal game spaces or a ricochet motion, which is in a curved motion to one game space in the first column and then to a second game space in the second column. The player who cannot move or the player who has no remaining game pieces on the board loses the game. | 2012-12-06 |
20120306155 | MANAGING ODDS BETS IN A BLACKJACK GAME - A method of managing a blackjack game is provided. A blackjack game bet comprising a bet against a house entity on a blackjack hand is received from a player. A pair of cards is determined for a hand for the house entity, and another pair of cards is determined for a hand for the player. The odds of the occurrence of one or more subsequent events are determined based at least in part on one or more of the pair of cards selected for the house entity's hand and one or more of the pair of cards selected for the player's hand. The odds for an additional bet are determined based at least on the determined odds for the one or more subsequent events, and the additional bet is offered to the player at the determined odds for the additional bet. | 2012-12-06 |
20120306156 | COMPRESSOR SEAL - The present invention is an apparatus for sealing in a compressor having a compressor housing and a rotatable shaft extending through the compressor housing, with a pressure seal having a first sealing member and a first sealing lip abutting and adjacent to, respectively, said housing and rotatable shaft, and a seal guide attached to the compressor housing and extending radially inward toward the rotatable shaft for maintaining alignment of the pressure seal. | 2012-12-06 |