49th week of 2020 patent applcation highlights part 66 |
Patent application number | Title | Published |
20200381601 | OPTOELECTRONIC COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC COMPONENT - An optoelectronic component includes an optoelectronic semiconductor chip including a connection surface; a first potting body; and a second potting body, wherein the first potting body covers all lateral side surfaces and the top surface of the semiconductor chip, the first potting body has a bottom surface flush with the connection surface, the second potting body has a bottom surface flush with the bottom surface, the second potting body completely covers all side surfaces of the first potting body facing away from the semiconductor chip, a top surface of the second potting body on the opposite of the connection surface is convexly curved, the first and second potting bodies have a contour in a lateral plane that is not similar, and the optoelectronic semiconductor chip has exclusively on its connection surface exposed electrical contact surfaces via which the semiconductor chip is electrically connectable and operable. | 2020-12-03 |
20200381602 | LIGHT-EMITTING MODULE AND SURFACE-EMITTING LIGHT SOURCE - A light-emitting module according to an embodiment includes a plurality of light-emitting elements, light-guiding plates each having a light-exiting surface, and a wiring layer connected to electrodes of the plurality of light-emitting elements on a surface opposite to the light-exiting surface. The wiring layer includes a first terminal, a second terminal, a first wiring pattern connecting the first terminal and the second terminal, a second wiring pattern connecting the first terminal and the second terminal, a third wiring pattern disposed between the first wiring pattern and the second wiring pattern to connect the first terminal and the second terminal, a fourth wiring pattern connecting the first to third wiring patterns in parallel, the fourth wiring pattern being connected to the first terminal, and a fifth wiring pattern connecting the first to third wiring patterns in parallel, the fifth wiring pattern being connected to the second terminal. | 2020-12-03 |
20200381603 | LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE ASSEMBLY - A light emitting device includes a light emitting structure, first and second electrodes, and a shielding layer. The light emitting structure includes a first-type semiconductor layer, an active layer, and a second-type semiconductor layer that are stacked along a stacking direction in such order. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer. The shielding layer is connected to aside of the light emitting structure and is adapted to absorb or reflect incident laser light. | 2020-12-03 |
20200381604 | OPTOELECTRONIC SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING AN OPTOELECTRONIC SEMICONDUCTOR COMPONENT - In an embodiment, the optoelectronic semiconductor component ( | 2020-12-03 |
20200381605 | THERMOELECTRIC LEG AND THERMOELECTRIC ELEMENT COMPRISING SAME - According to one embodiment of the present invention, a thermoelectric leg comprises: a thermoelectric material layer comprising Bi and Te; a first metal layer and a second metal layer respectively arranged on one surface of the thermoelectric material layer and on a surface different from the one surface; a first adhesive layer arranged between the thermoelectric material layer and the first metal layer and comprising the Te, and a second adhesive layer arranged between the thermoelectric material layer and the second metal layer and comprising the Te; and a first plating layer arranged between the first metal layer and the first adhesive layer, and a second plating layer arranged between the second metal layer and the second adhesive layer, wherein the thermoelectric material layer is arranged between the first metal layer and the second metal layer, the amount of the Te is higher than the amount of the Bi from the centerline of the thermoelectric material layer to the interface between the thermoelectric material layer and the first adhesive layer, and the amount of the Te is higher than the amount of the Bi from the centerline of the thermoelectric material layer to the interface between the thermoelectric material layer and the second adhesive layer. | 2020-12-03 |
20200381606 | THERMOELECTRIC CONVERSION MATERIAL, THERMOELECTRIC CONVERSION ELEMENT, AND THERMOELECTRIC CONVERSION MODULE - A thermoelectric conversion material is provided, consisting of a sintered body of a compound containing a dopant, in which a calculated standard deviation of a dopant concentration, which is obtained by measuring the dopant concentration for each of a plurality of compound particles observed in a section of the sintered body, is 0.15 or less. Here, the compound is preferably one or more selected from a MgSi-based compound, a MnSi-based compound, a SiGe-based compound, a MgSiSn-based compound, and a MgSn-based compound. | 2020-12-03 |
20200381607 | FLEXIBLE WOVEN THERMOELECTRIC FABRICS FOR THERMAL MANAGEMENT - Woven flexible thermoelectric fabrics are provided. The fabric is a woven material that includes a series of longitudinal threads interwoven with a series of transverse threads. Within the longitudinal series, the threads have a repeating thread pattern of an n-type thermoelectric thread, a p-type thermoelectric thread, and an insulating thread. Within the transverse series, the threads have a repeating thread pattern of a first double-sided thread with conducting side down and insulating side up, a second double-sided thread with conducting side down and insulating side up, and a third double-sided thread with conducting side up and insulating side down. | 2020-12-03 |
20200381608 | VERTICAL DISPERSIVE READOUT OF QUBITS OF A LATTICE SURFACE CODE ARCHITECTURE - Devices and methods that can facilitate vertical dispersive readout of qubits of a lattice surface code architecture are provided. According to an embodiment, a device can comprise a first substrate that can have a first side and a second side that can be opposite the first side. The first substrate can comprise a read pad that can be located on the first side and a readout resonator that can be located on the second side. The device can further comprise a second substrate that can be connected to the first substrate. The second substrate can comprise a qubit. In some embodiments, the device can further comprise a recess that can be located on the first side of the first substrate. The recess can comprise the read pad. | 2020-12-03 |
20200381609 | QUANTUM INFORMATION PROCESSING DEVICE FORMATION - A method for forming at least part of a quantum information processing device is presented. The method includes providing a first electrically-conductive layer formed of a first electrically-conductive material ( | 2020-12-03 |
20200381610 | PIEZOELECTRIC DEVICE AND MANUFACTURING METHOD THEREOF - A piezoelectric device has a layered structure in which at least a first electrode, a plastic layer, an orientation control layer, a piezoelectric layer, and a second electrode are stacked, wherein the orientation control layer is amorphous, and the piezoelectric layer with a thickness of 20 nm to 250 nm is provided over the orientation control layer, the piezoelectric layer having a wurtzite crystal structure, and wherein the orientation control layer and the piezoelectric layer are provided between the first electrode and the second electrode. | 2020-12-03 |
20200381611 | PIEZOELECTRIC SENSOR - The disclosure provides a piezoelectric sensor, including a piezoelectric crystal cylinder including a plurality of crystal layers which are laminated, each crystal layer including two axially opposite end faces, each end face including an electrode film region and a terminal film region, wherein the electrode film region and the terminal film region on the same end face are separated by a crystal exposure region, the electrode film region on one end face of the two end faces in each crystal layer is electrically connected to the terminal film region on the opposite end face of the two end faces, and the electrode film regions on adjacent end faces of adjacent crystal layers are in contact with each other and form an electrical connection while the terminal film regions on the adjacent end faces of the adjacent crystal layers are in contact with each other and form an electrical connection. | 2020-12-03 |
20200381612 | NON-CONTACT FORCE TYPE MICRO-ROTATING MECHANISM AND PREPARATION METHOD THEREOF - A non-contact force type micro-rotating mechanism driven by attractive/repulsive force and a manufacturing method thereof, belongs to the field of intelligent micro devices, and mainly relates to micro electromechanical system technology, precision machining technology, precision assembly and the like. The mechanism adopts the interaction force between magnetic poles to replace the connection mode of a traditional through-hole bearing pressure spring positioning shaft, so that the component part structure of the mechanism can be optimized, and the space utilization rate can be greatly improved. Moreover, the attractive force type structure also has the effect of weakening the radial vibration of the motor, and the coaxiality of the rotor and the stator is improved in the running process of the motor. Meanwhile, the rotating mechanism does not directly output shaft work, a structure can be added on the disc-shaped rotor to realize different functions, an actuator and a control object are integrated. | 2020-12-03 |
20200381613 | PIEZOELECTRIC ELEMENT, PIEZOELECTRIC DEVICE INCLUDING THE SAME, AND VIBRATION MODULE AND DISPLAY APPARATUS INCLUDING THE PIEZOELECTRIC DEVICE - A piezoelectric element comprising a compound represented by Formula 1, a piezoelectric device including the piezoelectric element, a vibration module including the piezoelectric device, and a display apparatus including the piezoelectric device are provided, where | 2020-12-03 |
20200381614 | ELECTRIC FIELD CONTROLLED MAGNETORESISTIVE RANDOM-ACCESS MEMORY - Disclosed is an electric field-controlled magnetoresistive random-access memory (MRAM) including memory cells. The memory cell has a heterogenous double tunnel junction structure including a first tunnel junction and a second tunnel junction. The first tunnel junction includes a magnetic tunnel junction layer having a magnetization direction that changes according to spin transfer torque when an external voltage is applied, and the second tunnel junction includes an electric-field control layer that controls an electric field applied to the magnetic tunnel junction layer to induce a change in magnetic anisotropy within the magnetic tunnel junction layer. The heterogeneous tunnel junction structure combines electric field-controlled magnetic anisotropy and spin transfer torque to enable low power driving of memory cells, thereby enabling a high energy-efficient electric field-controlled MRAM. | 2020-12-03 |
20200381615 | MAGNETORESISTIVE RANDOM ACCESS MEMORY - A semiconductor device includes: a substrate having a magnetic tunneling junction (MTJ) region and a logic region; an inter-metal dielectric (IMD) layer on the substrate; a first metal interconnection in the IMD layer on the logic region; and protrusions adjacent to two sides of the first metal interconnection. Preferably, the first metal interconnection further includes a via conductor and a trench conductor and the protrusions includes a first protrusion on one side of the via conductor and a second protrusion on another side of the via conductor. | 2020-12-03 |
20200381616 | METHOD FOR FORMING MAGNETIC FILM AND METHOD FOR MANUFACTURING MAGNETIC STORAGE ELEMENT - A method includes forming an amorphous magnetic film on a film formation subject by sputtering a target that includes any one selected from a group consisting of Mn | 2020-12-03 |
20200381617 | PHASE-CHANGE MEMORY - The present disclosure concerns a phase-change memory manufacturing method and a phase-change memory device. The method includes forming a first insulating layer in cavities located vertically in line with strips of phase-change material, and anisotropically etching the portions of the first insulating layer located at the bottom of the cavities; and a phase-change memory device including a first insulating layer against lateral walls of cavities located vertically in line with strips of phase-change material. | 2020-12-03 |
20200381618 | MEMORY CELL - A phase-change memory cell is formed by a heater, a crystalline layer disposed above the heater, and an insulating region surrounding sidewalls of the crystalline layer. The phase-change memory cell supports programming with a least three distinct data levels based on a selective amorphization of the crystalline layer. | 2020-12-03 |
20200381619 | SEMICONDUCTOR DEVICE - A semiconductor device includes interlayer insulating layers and horizontal structures alternately and repeatedly disposed on a semiconductor substrate, separation structures extending in a direction perpendicular to an upper surface of the semiconductor substrate on the semiconductor substrate, to extend in a first horizontal direction parallel to the upper surface of the semiconductor substrate, and vertical structures disposed between the separation structures. Each of the horizontal structures includes a plurality of semiconductor regions, and the plurality of semiconductor regions of each of the plurality of semiconductor regions include a first semiconductor region and a second semiconductor region sequentially arranged in a direction away from a side surface of a corresponding one of the vertical structures and having different conductivity types. | 2020-12-03 |
20200381620 | RESISITIVE RANDOM ACCESS MEMORY STRUCTURE AND METHOD FOR FORMING THE SAME - A resistive random access memory structure includes a semiconductor substrate, a transistor, a bottom electrode, a plurality of top electrodes, and a resistive-switching layer. The transistor is disposed over the semiconductor substrate. The bottom electrode is disposed over the semiconductor substrate and is electrically connected to a drain region of the transistor. The plurality of top electrodes is disposed along a sidewall of the bottom electrode. The resistance-switching layer is disposed between the bottom electrode and the plurality of top electrodes. | 2020-12-03 |
20200381621 | FORMING RRAM CELL STRUCTURE WITH FILAMENT CONFINEMENT - A memory device with crossbar array structure includes two sets of parallel bottom electrodes positioned on a substrate. The lower bottom electrodes are located at a lower position relative to higher bottom electrodes. The device includes a first set of corner tips of the lower bottom electrodes, and a second set of corner tips at a top of the higher bottom electrodes. The device also includes a set of parallel top electrodes intersecting the two sets of parallel bottom electrodes. A dielectric is formed as a resistive random-access memory (RRAM) cell under each intersection of each top electrode and each of bottom electrode. The device further includes one set of contacts at one end of an array that contacts the lower bottom electrodes and another set of contacts at the other end of the array that contacts the higher bottom electrodes. | 2020-12-03 |
20200381622 | Logic Compatible RRAM Structure and Process - A memory cell and method including a first electrode formed through a first opening in a first dielectric layer, a resistive layer formed on the first electrode, a spacing layer formed on the resistive layer, a second electrode formed on the resistive layer, and a second dielectric layer formed on the second electrode, the second dielectric layer including a second opening. The first dielectric layer formed on a substrate including a first metal layer. The first electrode and the resistive layer collectively include a first lip region that extends a first distance beyond the first opening. The second electrode and the second dielectric layer collectively include a second lip region that extends a second distance beyond the first opening. The spacing layer extends from the second distance to the first distance. The second electrode is coupled to a second metal layer using a via that extends through the second opening. | 2020-12-03 |
20200381623 | METHODS OF FORMING SILICON NITRIDE ENCAPSULATION LAYERS - Embodiments described herein generally relate to methods of processing a substrate comprising positioning a substrate in a processing volume of a processing chamber. The substrate includes a patterned surface having a plurality of features. Individual ones of the plurality of features are defined by one or more openings formed through a multi-layer stack, and the multi-layer stack includes a chalcogen containing material. The methods further include flowing pulses of a first processing gas into the processing volume. Herein, the first processing gas includes a silicon precursor and a nitrogen precursor. The methods further include igniting and maintaining a plasma of the first processing gas. The methods further include depositing a first silicon nitride layer onto the patterned surface of the substrate. Furthermore, the methods include depositing of a second silicon nitride layer on the first silicon nitride layer. | 2020-12-03 |
20200381624 | METHOD FOR CONTROLLING THE FORMING VOLTAGE IN RESISTIVE RANDOM ACCESS MEMORY DEVICES - A method of controlling the forming voltage of a dielectric film in a resistive random access memory (ReRAM) device. The method includes depositing a dielectric film contains intrinsic defects on a substrate, forming a plasma-excited treatment gas containing H | 2020-12-03 |
20200381625 | COMPOUND, DISPLAY PANEL AND DISPLAY APPARATUS - A compound, having a structure represented by Formula (I), | 2020-12-03 |
20200381626 | P-TYPE SEMICONDUCTOR FILM CONTAINING HETEROFULLERENE, AND ELECTRONIC DEVICE - A p-type semiconductor film including heterofullerene having a further sufficiently high hole mobility is provided. The p-type semiconductor film contains heterofullerene in which n+r number (where n and r are both positive odd numbers) of carbon atoms constituting a fullerene are substituted by n number of boron atom or atoms and r number of nitrogen atom or atoms. | 2020-12-03 |
20200381627 | POLYPHENOLS AND POLYAMINO DERIVATIVES IN ORGANIC OPTOELECTRONIC COMPONENTS - The invention describes the use of polyphenols and polyamino derivatives adjacent to absorber layers on the basis of small molecules in organic optoelectronic components. | 2020-12-03 |
20200381628 | SPECIFIC LADDER TYPE COMPOUNDS FOR ORGANIC LIGHT EMITTING DEVICES - The present invention relates to a compound of formula (I), wherein R | 2020-12-03 |
20200381629 | HETEROCYCLIC COMPOUND AND ORGANIC LIGHT EMITTING ELEMENT COMPRISING SAME - The present specification relates to a heterocyclic compound represented by Chemical Formula 1, and an organic light emitting device comprising the same. | 2020-12-03 |
20200381630 | ORGANIC ELECTROLUMINESCENT COMPOUND AND ORGANIC ELECTROLUMINESCENT DEVICE COMPRISING THE SAME - The present disclosure relates to an organic electroluminescent compound and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound of the present disclosure, an organic electroluminescent device having low driving voltage, high luminous efficiency, and/or improved lifespan characteristics can be provided. | 2020-12-03 |
20200381631 | COMPOUND, DISPLAY PANEL AND DISPLAY APPARATUS - The present disclosure relates to the technical field of OLED, and provides a compound having TADF property. In an embodiment the compound has a structure according to Formula (1), in which X | 2020-12-03 |
20200381632 | THERMALLY ACTIVATED DELAYED FLUORESCENT MOLECULAR MATERIAL, A SYNTHESIZING METHOD THEREFOR, AND AN ELECTROLUMINESCENT DEVICE - A thermally activated delayed fluorescent molecular material, a synthesizing method therefor, and an electroluminescent device are provided. The thermally activated delayed fluorescent molecular containing an indenobenzoselenoheteroaromatic ring donor is synthesized, so that an electron donating ability of the donor is increased, and an non-radiative transition rate is effectively inhibited, thereby increasing photo-luminescence quantum yield (PLQY) of the molecule; and increasing the twist angle between the electron donor and the electron acceptor. Meanwhile, electron cloud overlapping between highest occupied molecular orbital (HOMO) and lowest unoccupied molecular orbital (LUMO) is reduced, thereby obtaining a smaller ΔE | 2020-12-03 |
20200381633 | ORGANIC ELECTROLUMINESCENT MATERIAL AND ORGANIC ELECTROLUMINESCENT DEVICE - The present invention relates to an organic electroluminescent material, an organic electroluminescent device, and a method for preparing the organic electroluminescent device. Due to comprising an organic compound A with 3.0 eV>ET≥2.0 eV and a compound B of M(LA)x(LB)y(LC)z, the organic electroluminescent material of the present invention has the advantages of an increased luminescence lifetime and/or a reduced operating voltage on the basis of maintaining other electronic properties at a certain level. | 2020-12-03 |
20200381634 | ORGANIC ELECTROLUMINESCENCE DEVICE AND FUSED POLYCYCLIC COMPOUND FOR ORGANIC ELECTROLUMINESCENCE DEVICE - An organic electroluminescence device of an embodiment includes oppositely disposed first electrode and second electrode, and a plurality of organic layers disposed between the first electrode and the second electrode, wherein at least one from among the organic layers includes a fused polycyclic compound represented by Formula 1 below, thereby showing improved emission efficiency. | 2020-12-03 |
20200381635 | FLEXIBLE DISPLAY, METHOD FOR MANUFACTURING SAME, AND SUPPORT SUBSTRATE FOR FLEXIBLE DISPLAY - A flexible display supporting substrate of the present disclosure includes: a glass base ( | 2020-12-03 |
20200381636 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel and a display device are provided, which including a folding area configured to bend the display panel. The display panel further comprising a film layer. The film layer is disposed in the folding area, and the film layer includes a metal layer. A stress balance line is provided in the film layer. When the folding area is bent, the stress balance line is a curve having an upper boundary and a lower boundary. A resultant force of tensile stress and compressive stress at any point on the stress balance line is zero. The metal layer is disposed between the upper boundary and the lower boundary of the stress balance line. | 2020-12-03 |
20200381637 | Stretchable Electronic Material and Devices - Devices and methods relating stretchable electronics are disclosed. Some disclosed embodiments relate to a stretchable electronic film comprising an insulating polymer and less than 1 wt % of a semiconducting polymer. Other disclosed embodiments relate to manufacturing a multi-layered, stretchable electronic device characterized by a single peel-off step for integrating all components of the device rather than a multi-peel synthesis of the device. | 2020-12-03 |
20200381638 | DISPLAY DEVICE - A display device includes: a display panel including a plurality of light emitting elements and a plurality of pads electrically connected to the plurality of light emitting elements; and a printed circuit board electrically connected to the plurality of pads. The display panel has first through sixth areas, with the second through sixth areas extending from different sides of the first area. T sixth area has an upper area extending from the fourth area, a bending area extending from the upper area, and a lower area extending from the bending area. The plurality of pads is on the lower area. The bending area of the sixth area is bent such that the lower area of the sixth area and the printed circuit board are parallel to the first area. | 2020-12-03 |
20200381639 | FLEXIBLE SUBSTRATE AND FABRICATION METHOD THEREOF, AND FLEXIBLE DISPLAY APPARATUS - The embodiments of the disclosure disclose a flexible substrate, a fabrication method thereof, and a flexible display apparatus. The flexible substrate includes a first organic layer, an inorganic buffer layer, and a second organic layer. The inorganic buffer layer is between the first organic layer and the second organic layer. The second organic layer includes inorganic nano-particles. The expansion coefficient of the flexible substrate provided by the embodiment of the present disclosure is more matched with that of the rigid auxiliary substrate, so as to reduce the risk of warping of the rigid auxiliary substrate and then improve the process accuracy when fabricating the display device. | 2020-12-03 |
20200381640 | STRETCHABLE FILMS, METHODS OF MANUFACTURING THE SAME AND DISPLAY DEVICES INCLUDING THE SAME - A display device including a flexible base substrate; a pixel circuit and a light emitting structure sequentially disposed on the flexible base substrate; and a stretchable film attached on a bottom of the flexible base substrate. The stretchable film includes a first region and a second region, which are divided according to curvatures of an object, and at least one of different patterns and different disposed structures are arranged in each of the first region and the second region. | 2020-12-03 |
20200381641 | Fabrication Of Corrugated Gate Dielectric Structures Using Atomic Layer Etching - Integrated circuit structures, arrangements, and manufacturing processes are discussed herein. In one example, a method of forming a transistor structure includes forming a dielectric layer onto a gate element and forming a corrugated surface into the dielectric layer using at least an atomic layer etching (ALE) process to remove portions of the dielectric layer. The method also includes forming a semiconductor layer onto the corrugated surface and forming a source element and a drain element onto the semiconductor layer. | 2020-12-03 |
20200381642 | METHOD OF MAKING A PEROVSKITE LAYER AT HIGH SPEED - A method of making a perovskite layer includes providing a flexible substrate; providing a perovskite solution comprising an initial amount of solvent and perovskite precursor materials and a total solids concentration between 30 percent and 70 percent by weight of its saturation concentration; depositing the perovskite solution on the flexible substrate; removing a first portion of the solvent from the deposited perovskite solution and increasing the total solids concentration of the perovskite solution to at least 75 percent of its saturation concentration with a first drying step; and removing a second portion of the solvent from the deposited perovskite solution with a second drying step having a higher rate of solvent evaporation that causes saturation and a conversion reaction in the deposited perovskite solution resulting in perovskite crystal formation or formation of a perovskite intermediate phase, wherein the first drying step dwell time is at least 5 times longer than the second drying step dwell time. | 2020-12-03 |
20200381643 | PHOTOELECTRIC CONVERSION ELEMENT - To improve detectivity of a photoelectric conversion element ( | 2020-12-03 |
20200381644 | ORGANIC PHOTODETECTOR - An organic photodetector comprising an anode ( | 2020-12-03 |
20200381645 | High Efficiency Graphene/Wide Band-Gap Semiconductor Heterojunction Solar Cells - A photovoltaic solar cell apparatus is described herein combining the advantages of several discoveries that address the previously unsolved problem of creating high conversion efficiency solar cells at a low cost. The solar cell designs and underlying principals disclosed herein may be applied in any type of photovoltaic solar power application, such as large scale photovoltaic solar plants, rooftop panels, solar powered electronic devices, and many others. | 2020-12-03 |
20200381646 | ORGANIC LIGHT-EMITTING DEVICE AND ELECTRONIC APPARATUS INCLUDING THE SAME - Provided are an organic light-emitting device and an electronic apparatus including the same. The organic light-emitting device includes: a first electrode; a second electrode facing the first electrode; and an organic layer between the first electrode and the second electrode and including an emission layer, wherein the emission layer includes a first host and a first dopant, and the first host and the first dopant each satisfy Equations 1-1 and 1-2. In Equations 1-1 and 1-2, T1(H1) | 2020-12-03 |
20200381647 | NON-EQUILIBRIUM THERMAL CURING PROCESSES - A method of flash-curing a respective layer in an electronic device stack is provided. The method includes providing a stack of layers including a substrate and one or more electronically-active layers disposed on a surface of the substrate. The method further includes applying, over the stack of layers, a thermally-curable layer of material that includes a polymer or polymerizable material. The method further includes performing a non-equilibrium thermal process that includes raising a temperature of the thermally-curable layer of material, including the polymer or polymerizable material, above a first temperature for a length of time sufficient to cure the thermally-curable layer of material while maintaining the stack of layers below a second temperature that is less than the first temperature. The stack of layers is robust to temperatures below the second temperature. | 2020-12-03 |
20200381648 | DISPLAY DEVICE, METHOD OF MANUFACTURING DISPLAY DEVICE, AND GUIDE STRUCTURE USED THEREIN - A display device including a display panel having a first surface and a second surface opposite to the first surface, a guide structure disposed on the first surface of the display panel, and a window disposed on the second surface of the display panel, in which the guide structure includes a guide film configured to apply a preliminary pressure to the display panel, and a cover panel disposed between the guide film and the display panel, the cover panel including a cushion layer. | 2020-12-03 |
20200381649 | DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME - A display device comprising: a display panel including: a first area having a first transmittance; and a second area having a second transmittance higher than the first transmittance; and a first module under the second area, wherein the display panel comprises: a base layer; a circuit layer on the base layer; a first pixel electrode electrically connected to the circuit layer and in the first area; a second pixel electrode electrically connected to the circuit layer and in the second area; a first stack structure on the circuit layer and adjacent to the first pixel electrode; and a second stack structure which is on the circuit layer, is adjacent to the second pixel electrode, and is different from the first stack structure. | 2020-12-03 |
20200381650 | Organic Light Emitting Display Apparatus - An organic light emitting display apparatus is disclosed, which comprises a substrate, a thin film transistor provided on the substrate, a planarization film provided on the thin film transistor, a light emitting diode provided on the planarization film and electrically connected with the thin film transistor, an encapsulation layer covering the light emitting diode, and an encapsulation substrate provided on the encapsulation layer, wherein the encapsulation substrate may include a first portion that includes a first member and a second portion that includes a second member. | 2020-12-03 |
20200381651 | DISPLAY PANEL AND DISPLAY DEVICE - A display panel and a display device are disclosed. The display panel defines a basic display area and a light transmissive display area connected to the basic display area. The light transmissive display area includes an anode layer, a pixel defining layer, a light-emitting functional layer, and a cathode all sequentially laminated to each other. The anode layer includes a first transparent conductive layer, a metal reflective layer, and a second transparent conductive layer. The metal reflective layer is disposed on the first transparent conductive layer and corresponding to the light-emitting elements. The display device includes the display panel. | 2020-12-03 |
20200381652 | ELECTRODE, METHOD OF MANUFACTURING THE SAME, LIGHT-EMITTING DEVICE AND DISPLAY DEVICE - An electrode, a method of manufacturing the same, a light-emitting device, and a display device are provided, the electrode includes: a reflective layer; and at least one double-layer adjusting unit stacked on the reflective layer, each double-layer adjusting unit comprising an insulating layer and a conductive layer sequentially arranged in a direction away from the reflective layer, a via hole is provided in the insulating layer, an electrode lead formed integrally with the reflective layer is provided in the via hole, and the conductive layer is electrically connected to the reflective layer through the electrode lead, in each double-laver adjusting unit, a difference between a thickness of the conductive layer and a thickness of the insulating layer does not exceed a set threshold, and the set threshold is configured to control the thickness of the insulating layer. | 2020-12-03 |
20200381653 | DISPLAY APPARATUS - A display apparatus includes a substrate, a display area disposed on the substrate and including pixels, a non-display area disposed outside the display area, a first power supply voltage line including a first conductive layer disposed in the non-display area and a second conductive layer disposed on the first conductive layer, a second power supply voltage line disposed in the non-display area and including a third conductive layer spaced apart from the first conductive layer and a fourth conductive layer disposed on the third conductive layer, a first dam portion surrounding the display area and overlapping the second power supply voltage line, a second dam portion disposed adjacent to the first dam portion, and a cladding layer covering a first end portion of the fourth conductive layer formed in a direction intersecting a direction in which the first and second dam portions extend. | 2020-12-03 |
20200381654 | DISPLAY DEVICE - A display device includes a first substrate, a plurality of pixels on the first substrate, a second substrate on the plurality of pixels, a sealing portion surrounding the plurality of pixels and located between the first substrate and the second substrate, a first wiring extending in a first direction outside the plurality of pixels, and a second wiring partially surrounding the plurality of pixels, in a plane view, in which the second wiring comprises an extension portion arranged in parallel to the first direction between the first wiring and an edge of the first substrate, and the sealing portion fills an area between the extension portion and the first wiring. | 2020-12-03 |
20200381655 | DISPLAY DEVICE - A display device includes: multiple layers including a display element layer, the multiple layers including a sealing layer for covering the display element layer; and a polarization plate attached to a first layer and a second layer of the multiple layers with an adhesive layer. The multiple layers includes inorganic films and organic films. All of the inorganic films are disposed to avoid an edge area that is at least a part of a peripheral portion of the resin substrate. The polarization plate has an edge above the edge area of the resin substrate. The first layer is disposed to avoid the edge area of the resin substrate. The first layer at an edge has an upper surface sloping downward toward the edge area. The second layer has a portion in the edge area of the resin substrate and between the resin substrate and the adhesive layer. | 2020-12-03 |
20200381656 | BARRIER FILM LAMINATE, METHOD OF MANUFACTURE, AND DISPLAYS COMPRISING THE BARRIER FILM LAMINATE - A barrier film laminate for a touch-sensing display includes a barrier layer, an optically clear adhesive layer, an optically clear polymer film, and a touch-sensing layer. The optically clear adhesive is disposed on a first surface of the barrier layer, and the optically clear polymer film is disposed on the adhesive layer on a side opposite the glass layer. The touch-sensing layer is disposed on the polymer film on a side opposite the adhesive layer. A method for the manufacture of the barrier film laminates is also described. The barrier film laminates can be particularly useful as a component in a touch-sensing display. | 2020-12-03 |
20200381657 | DISPLAY BACK PLATE AND DISPLAY DEVICE - The present disclosure relates to a display back plate and a display device. The display back plate includes a display area and a non-display area surrounding the display area, wherein the non-display area is provided with at least one circle of first cofferdam surrounding the display area, a first thin film encapsulation layer is arranged on the first cofferdam, and the non-display area is provided with a fan-out area, a second cofferdam is arranged on one side of the first cofferdam close to the fan-out area, the second cofferdam is provided with a first bonding pattern including a plurality of protrusions, and the first thin film encapsulation layer at least partially covers the protrusions. | 2020-12-03 |
20200381658 | ORGANIC EL DEVICE AND PRODUCTION METHOD THEREFOR - According to an embodiment of the invention, the organic EL device ( | 2020-12-03 |
20200381659 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A display apparatus includes a substrate, a display layer disposed on the substrate, and a thin film encapsulation layer that covers the display layer. The display layer includes a plurality of emission portions and a non-emission portion around each of the plurality of emission portions. The thin film encapsulation layer includes a first organic film that covers the emission portions, a second organic film that covers the non-emission portion and is spaced apart from the first organic film, and a first inorganic film interposed between the first organic film and the second organic film. | 2020-12-03 |
20200381660 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A display device is provided. The display device includes a substrate including a display area, an opening area disposed in the display area, a first non-display area at least partially surrounding the display area, and a second non-display area at least partially surrounding the opening area. A display layer is disposed in the display area. An encapsulating substrate covers the display layer and has an opening corresponding to the opening area. A sealing portion is disposed between the encapsulating substrate and the substrate. The sealing portion is disposed in the opening area and connects the encapsulating substrate to the substrate. A partition wall is disposed between the substrate and the sealing portion. | 2020-12-03 |
20200381661 | DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME - A display device includes a display panel, a first protective member, and a second protective member. The display panel includes a front part, a first side part extending from the front part, and a pad portion extending from the first side part. A pad is on the pad portion, the first side part is bent, and each of the front part and the first side part displays an image. The first protective member is below the display panel and overlaps the front part and the first side part. The second protective member is below the display panel, in a same layer as the first protective layer, and overlaps the pad portion. The second protective member has a bending stiffness greater than a bending stiffness of the first protective member. | 2020-12-03 |
20200381662 | DISPLAY DEVICE - A display device comprises an organic EL substrate including an organic EL layer formed on a flexible substrate and a first main surface of the flexible substrate; a film covering a display region of the organic | 2020-12-03 |
20200381663 | DISPLAY DEVICE - A display device according to an embodiment of the present invention includes: a substrate having a display region for displaying an image; a plurality of pixels located in the display region of the substrate; and a sealing layer covering the plurality of pixels, wherein the sealing layer includes a first inorganic material film, a second inorganic material film, a resin material layer, and a third inorganic material film in this order from the side where the pixels are arranged, and the second inorganic material film is in contact with the resin material layer, has a composition different from that of the first inorganic material film, and has a higher oxygen content than the first inorganic material film. | 2020-12-03 |
20200381664 | ENCAPSULATION FILM - The present application provides an encapsulation film comprising an encapsulation layer, a metal layer, and a protective layer. The encapsulation film provides a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, minimizes the appearance change of the film due to excellent handling properties and processability, and prevents physical and chemical damage during encapsulation process. | 2020-12-03 |
20200381665 | DISPLAY DEVICE INCLUDING AN ENCAPSULATION STRUCTURE - A display device includes a substrate. A display element is disposed over the substrate. A first inorganic encapsulation layer is disposed on the display element. An organic encapsulation layer is disposed on the first inorganic encapsulation layer. An auxiliary layer is disposed between the first inorganic encapsulation layer and the organic encapsulation layer. The auxiliary layer has a thickness less than about 100 nm, and includes an inorganic insulating material. A second inorganic encapsulation layer is disposed on the organic encapsulation layer. | 2020-12-03 |
20200381666 | ORGANIC OPTOELECTRONIC COMPONENT - An organic optoelectronic component includes an organic functional layer stack between a first electrode and a second electrode including a light-emitting layer formed to emit radiation during operation of the component; a coupling-out layer arranged above the first electrode and/or the second electrode which is in a beam path of the radiation of the light-emitting layer; and a protective layer above the coupling-out layer, wherein the coupling-out layer includes a structured layer and a planarization layer arranged thereabove and the structured layer has a structured surface structured at least in places, the planarization layer planarizes the structured surface of the structured layer, the protective layer cannot be removed without at least partially destroying the coupling-out layer, and adhesion of the structured layer to the planarization layer is smaller than adhesion of the protective layer to the planarization layer. | 2020-12-03 |
20200381667 | Organic Light Emitting Display Device and Method for Manufacturing the Same - An organic light-emitting display device capable of improving luminance and light extraction efficiency thereof while preventing image blur, and a method for manufacturing the same is disclosed. In accordance with the device and the method, image blur is suppressed and luminance and light-emitting efficiency are improved by forming micro-lenses on an encapsulating layer for protecting organic light-emitting elements at precise positions corresponding to the elements in a self-aligned and self-assembled manner. | 2020-12-03 |
20200381668 | OPTICAL DEVICE - An object of the present invention is to provide an optical device that can accomplish both the effect of preventing external light reflection and the improvement of utilization efficiency of light emitted from an organic electroluminescent element. The object is achieved by an optical device having an organic electroluminescent substrate, a circularly polarized light-separating layer that has a liquid crystal alignment pattern, in which the direction of an optical axis derived from a liquid crystal compound changes while continuously rotating in one direction in a plane, and separates light into right-handed circularly polarized light and left-handed circularly polarized light, a patterned retardation layer that converts circularly polarized light into linearly polarized light and has a plurality of regions among which the direction of a slow axis varies in the same plane, and a polarizer. | 2020-12-03 |
20200381669 | DISPLAY DEVICE, METHOD FOR PRODUCING DISPLAY DEVICE, AND APPARATUS FOR PRODUCING DISPLAY DEVICE - A display device, to provide compensation for change in color level due to different viewing directions of a display surface and compensation for other optical characteristics of the display surface in a compatible manner, includes a light-emitting element layer including a light-emitting layer including a light-emitting element, a first electrode disposed below the light-emitting layer, and a second electrode disposed above the light-emitting layer, wherein an optical compensation layer is disposed above the light-emitting element layer, the optical compensation layer being configured to compensate for prevention of external light reflection on a display surface and compensate for change in color level of the display surface due to different viewing directions of the display surface. | 2020-12-03 |
20200381670 | DISPLAY PANEL - The display panel includes an upper display substrate including a display area and a non-display area adjacent to the display area and a lower display substrate that faces the upper display substrate to emit first color light, the lower display substrate including a plurality of display elements respectively overlapping the pixel areas. The display area includes a plurality of pixel areas and a light blocking area adjacent to the pixel areas. The upper display substrate includes a base substrate, a first light control layer on the base substrate to control the first color light, a capping layer including an absorption part overlapping the display area and on the first light control layer and a barrier part overlapping the light blocking area and protruding from the absorption part in a thickness direction of the base substrate, and a second light control layer on the barrier part. | 2020-12-03 |
20200381671 | DISPLAY DEVICE - A display device includes an electronic panel, a window, an optical sheet, and a stress control member. The electronic panel includes a first non-bending area having a first area overlapping the optical sheet and a second area overlapping at least part of the recessed area, a bending area configured to be bent relative to the first non-bending area, and a second non-bending area extending from the bending area and movable to a position opposing the first non-bending area. The optical sheet is disposed between the electronic panel and the window and having a recessed area defined therein extending toward a center of the optical sheet. The stress control member overlaps with at least a portion of the second area, at least a portion of the bending area, and at least a portion of the second non-bending area, respectively. | 2020-12-03 |
20200381672 | METHOD AND APPARATUS FOR PRODUCING FLEXIBLE OLED DEVICE - According to a flexible OLED device production method of the present disclosure, after an intermediate region ( | 2020-12-03 |
20200381673 | ORGANIC DEVICE MANUFACTURING METHOD - A method for producing an organic device includes a first forming step and a second forming step, and wherein an upper limit value of an integrated illuminance of light in an environment until formation of a second electrode layer ( | 2020-12-03 |
20200381674 | FLEXIBLE OLED DEVICE, METHOD FOR MANUFACTURING SAME, AND SUPPORT SUBSTRATE - According to a flexible OLED device production method of the present disclosure, a multilayer stack ( | 2020-12-03 |
20200381675 | NOZZLE-DROPLET COMBINATION TECHNIQUES TO DEPOSIT FLUIDS IN SUBSTRATE LOCATIONS WITHIN PRECISE TOLERANCES - An ink printing process employs per-nozzle droplet volume measurement and processing software that plans droplet combinations to reach specific aggregate ink fills per target region, guaranteeing compliance with minimum and maximum ink fills set by specification. In various embodiments, different droplet combinations are produced through different print head/substrate scan offsets, offsets between print heads, the use of different nozzle drive waveforms, and/or other techniques. Optionally, patterns of fill variation can be introduced so as to mitigate observable line effects in a finished display device. The disclosed techniques have many other possible applications. | 2020-12-03 |
20200381676 | PACKAGE METHOD OF OLED ELEMENT AND OLED PACKAGE STRUCTURE - The present invention provides a package method of an OLED element and an OLED package structure. In the package method of the OLED element, according to the present invention, by manufacturing a circle of the retaining wall at the periphery of the OLED element, and then forming the laminated film covering the OLED element in the region surrounded by the retaining wall, and the laminated film comprises the few first barrier layers and the few buffer layers which are alternately stacking, and ultimately, forming the second barrier layer which completely covers the buffer layer and the top of the retaining wall on the outermost buffer layer of the laminated film, the OLED package structure of extremely strong sealing can be obtained. In the package method, a protective shield of extremely strong sealing for the OLED element is formed with the retaining wall and the outermost second barrier layer. | 2020-12-03 |
20200381677 | ORGANIC LIGHT EMITTING DIODES WITH SILVER CONTACTS - A method of depositing a cathode on an organic light emitting diode (OLED) stack is provided. The method includes providing a substrate having at least a partial organic light emitting diode (OLED) stack disposed on a surface of the substrate. The method further includes depositing, on top of the partial OLED stack, a solution comprising a metal compound. The method further includes forming a conductive solid layer from the metal compound in the solution to form a cathode for the partial OLED stack. | 2020-12-03 |
20200381678 | POUCH-TYPE SECONDARY BATTERY AND BATTERY MODULE COMPRISING THE SAME - A pouch-type secondary battery includes an electrode assembly; and a pouch member comprising an accommodating portion configured to accommodate the electrode assembly therein, a sealing portion formed at an edge of the accommodating portion, and an indent portion formed of a cutting edge cut at a plurality of angles and a rounded edge cut to connect the cutting edges adjacent to each other in a portion of the sealing portion corresponding to a vertex of the accommodating portion. | 2020-12-03 |
20200381679 | PACKAGING MATERIAL FOR BATTERIES, METHOD FOR PRODUCING SAME, POLYBUTYLENE TEREPHTHALATE FILM FOR PACKAGING MATERIAL FOR BATTERIES, AND BATTERY - A packaging material for batteries, which is not susceptible to warping, while having excellent formability. A packaging material for batteries is configured from a laminate that is sequentially provided at least with one or more substrate layers, a barrier layer, a cured resin layer and a thermally fusible resin layer in this order. At least one of the substrate layers is formed of a polybutylene terephthalate film; and the value (X/Y) which is obtained by dividing the puncture strength X (N) of the laminate by the thickness Y (μm) of the polybutylene terephthalate film, the puncture strength X (N) being determined by piercing the laminate from the substrate layer side by a method that complies with the prescription of JIS Z1707 (1997), is 1.02 N/μm or more. | 2020-12-03 |
20200381680 | Top Cap for Secondary Battery, Secondary Battery, and Method for Manufacturing the Secondary Battery - A top cap for a secondary battery includes a circumferential area which defines an outer circumferential surface of the top cap, a central area which defines a central portion of the top cap, a connection area which connects the circumferential area to the central area, and a protrusion area which protrudes downward from the circumferential area, the central area, or the connection area. The top cap is assembled with a battery case, an electrode assembly positioned therein, and a through-hole formation member to form a secondary battery, in which at least a portion of the protrusion area of the top cap is positioned within a through-hole of the through-hole formation member. | 2020-12-03 |
20200381681 | SECONDARY BATTERY - The present disclosure relates to a secondary battery, which can improve the sealing efficiency of a can (or case). The secondary battery includes an electrode assembly; a case configured to accommodate the electrode assembly, the case including a bottom portion, long side portions and short side portions, at least one of which includes a welding portion that is configured to be bent and welded, and a cap plate coupled to the case, wherein a portion of the welding portion is overlap-welded. | 2020-12-03 |
20200381682 | BATTERY PACK AND PRODUCTION METHOD FOR SAME - A battery pack includes: a connector holder that is fixed to an exterior case and has two main surfaces that include a first main surface exposed through an opening of the exterior case; a floating connector connected with a center of the connector holder in such a manner that the floating connector floats in such a manner that an orientation or a position of the floating connector is variable upward, downward, leftward, and rightward; a lead wire fixed to an inner surface of the floating connector, the lead wire extending through an inside of the exterior case, and the lead wire connecting floating connector with a circuit board; and a positioning buffer that pushes the floating connector, and positions the floating connector at a predetermined original state when an external force is not applied to the floating connector. | 2020-12-03 |
20200381683 | ASSEMBLED BATTERY - A battery pack includes a lower case having a rectangular box shape with a top opened, and including a bottom part, a plurality of first walls, and second walls; an upper case having a rectangular box shape with a bottom opened, and including a top part opposing the lower case; and a plurality of secondary batteries each including a top face provided with a positive-electrode terminal and a negative-electrode terminal, principal faces, a pair of lateral faces extending between the principal faces, and a bottom face, and deformable ribs. | 2020-12-03 |
20200381684 | BATTERY MODULE AND BATTERY PACK CONTAINING SAME - A battery module which includes a battery cell stack in which a plurality of battery cells are stacked; and a housing configured to accommodate the battery cell stack, wherein a disassembling guide for disassembling the housing is formed at the housing. | 2020-12-03 |
20200381685 | SPACER, BATTERY PACK, AND METHOD FOR MANUFACTURING BATTERY PACK - A spacer (first spacer | 2020-12-03 |
20200381686 | BATTERY UNIT MOUNTING STRUCTURE OF ELECTRIC VEHICLE - A battery unit comprises plural battery modules and a battery case storing the plural battery modules, and is arranged over a range from a first storage area located below a front seat to second and third storage areas located in back of the front seat. The number of front-side fastening portions of the battery modules corresponding to the first storage area is set to be smaller than the number of rear-side fastening portions of the battery modules corresponding to the first storage area. The fastening portion is arranged on an inward side, in a vehicle width direction, of the fastening portion provided at an outward side in the vehicle width direction. | 2020-12-03 |
20200381687 | POWER STORAGE APPARATUS - A power storage apparatus is configured such that a region surrounded by a plane connecting the outline of a pressure release valve and the outline of a tab-side end face in an electrode assembly in the shortest distance is defined as a three-dimensional region. The power storage apparatus is provided with a covering portion that covers the entire cross section of the three-dimensional region along the tab-side end face in a space between the tab-side end face and the inner surface of a lid body. | 2020-12-03 |
20200381688 | Negative Electrode for Lithium Secondary Battery and Lithium Secondary Battery Comprising the Same - Provided are a negative electrode for a lithium secondary battery having reinforced insulating properties, which comprises a negative electrode active material layer; and a ceramic separating layer formed on the negative electrode active material layer, wherein the negative electrode active material layer has an arithmetic average surface roughness (Ra) of 0.01 μm to 0.3 μm, and the ceramic separating layer has a thickness of 1 μm to 30 μm, and a lithium secondary battery comprising the same. | 2020-12-03 |
20200381689 | SEPARATOR FOR POWER STORAGE DEVICE AND POWER STORAGE DEVICE - The present invention provides a separator for power storage devices which has excellent permeability of ions such as lithium ions; can constitute power storage devices such as high performance lithium ion batteries, capacitors, and condensers; and is less likely to cause a short circuit between a positive electrode and a negative electrode as well as rapid decrease in discharge capacity due to a dendrite even when used in high power applications. The separator for power storage devices of the present invention includes a synthetic resin film having minute pore portions, the separator having an air resistance of 30 sec/100 mL/16 μm or more and 100 sec/100 mL/16 μm or less, and a first scattering peak in the stretching direction measured by small-angle X-ray scattering measurement (SAXS) present in a range where the scattering vector q is 0.0030 nm | 2020-12-03 |
20200381690 | ION SELECTIVE MEMBRANE FOR SELECTIVE ION PENETRATION IN ALKALINE BATTERIES - An alkaline battery comprises an anode, a cathode, a separator disposed between the anode and the cathode, and an electrolyte in fluid communication with the anode, the cathode, and the separator. The separator comprises at least one ion selective layer that can include at least one of graphene, graphene oxide, reduced graphene oxide, functionalized graphene, or combinations thereof. This can allow the ion selective layer to be configured to selectively block zincate ions. | 2020-12-03 |
20200381691 | BATTERY MODULE AND BATTERY PACK INCLUDING THE SAME - A battery module includes a battery cell stack having a plurality of stacked battery cells and a plurality of bus bars respectively coupled to electrode leads provided at the plurality of battery cells. Each bus bar includes a frame on which the electrode lead of the battery cell is placed and a conductive member coupled to the frame and electrically coupled to the electrode lead. | 2020-12-03 |
20200381692 | BATTERY WIRING MODULE - A battery wiring module has a novel structure with which workability of a wire routing process can be improved and is able to prevent or reduce the occurrence of misrouting. A battery wiring module includes a plurality of busbars that electrically connect adjacent battery cells of a plurality of battery cells arranged in a row, a plurality of coated wires connected at one end to an external connection terminal and a connecting part provided at the other end being connected to one of the busbars, a wire routing body in which a busbar housing frame that houses the busbars and a wire routing passage that routes the coated wires are provided, and a sub-assembly protector that is mounted to the wire routing body, the sub-assembly protector holding a plurality of coated wires. | 2020-12-03 |
20200381693 | BATTERY ASSEMBLY FOR MEDICAL DEVICE - In some examples, a battery assembly for an implantable medical device may include an electrode stack comprising a plurality of electrode plates. The plurality of electrode plates may comprise a first electrode plate including a first tab extending from the first electrode plate and a second electrode plate including a second tab extending from the second electrode plate, an alignment member extending through the first tab and the second tab, and a weld on a side of the electrode stack extending from the first tab to the second tab, wherein the weld penetrates into the alignment member. | 2020-12-03 |
20200381694 | BATTERY MODULE INCLUDING A HOUSING WITH INTEGRATED BUS BAR - The present invention refers to a battery module comprising a plurality of battery cells, each battery cell including a first terminal and a second terminal spaced apart and electrically isolated from one another, a housing including an upper housing part and a lower housing part assembled together to completely surround the plurality of battery cells, and a plurality of bus bars integrated in the upper housing part, wherein each of the plurality of bus bars is connected to one of the first and second terminals of at least two battery cells. The present invention further refers to a method of manufacturing the battery module, which is fast and easy and has a high tolerance for fluctuations in the battery cells height. | 2020-12-03 |
20200381695 | CONNECTION MEMBER AND RECHARGEABLE BATTERY - This application provides embodiments including a connection member and a rechargeable battery. The connection member includes a guide plate and a first connecting plate integrally formed on the guide plate, where the first connecting plate is disposed in a bendable manner relative to the guide plate, and at least one indentation is present between the first connecting plate and the guide plate. In the embodiments, a bending position is more accurate when the first connecting plate is bent relative to the guide plate. This is conducive to an accurate size of the connection member being bent, and is also helpful for the rechargeable battery to successfully assemble a battery core, the connection member, and a housing. | 2020-12-03 |
20200381696 | BATTERY PACK - A battery pack including a protective circuit module including a circuit board extending in a first direction, an electrode tab coupling part on the circuit board, and a protection layer between the electrode tab coupling part and the circuit board; and a battery cell including an electrode tab protruding at one end and having a polarity, the electrode tab being coupled to a top surface of the electrode tab coupling part, wherein the electrode tab of the battery cell, the electrode tab coupling part, and the protection layer of the protective circuit module are stacked and coupled in a second direction perpendicular to the first direction. | 2020-12-03 |
20200381697 | SYSTEMS AND METHODS FOR PROVIDING INDIVIDUAL BATTERY CELL CIRCUIT PROTECTION - This disclosure details exemplary battery pack designs for use in electrified vehicles. Exemplary battery packs may include a sense lead assembly having a circuit board that is centrally mounted between first and second wiring members (e.g., flat flexibles cables or flat printed circuits). The circuit board establishes a suitable mounting surface for incorporating sense lead fuses into the sense lead assembly. The centralized sense lead fuses provide for simple and reliable servicing of the battery array in response to battery overcurrent conditions. | 2020-12-03 |
20200381698 | METHOD FOR MANUFACTURING ELECTRODE FOR SECONDARY BATTERY AND METHOD FOR MANUFACTURING SECONDARY BATTERY - A method for manufacturing an electrode for a secondary battery includes: applying a first layer slurry containing a first binder to a surface of a current collector, applying a second layer slurry containing a second binder on the first layer slurry before the first layer slurry is dried, and drying the first layer slurry and the second layer slurry after applying the first layer slurry and the second layer slurry to obtain a laminated structure in which a first layer and a second layer are laminated in this order on the current collector. The second layer slurry has a solid content ratio of more than 50% by mass and a composition ratio of the second binder of more than 2% by mass. | 2020-12-03 |
20200381699 | DIRECT COATING OF ELECTRODES IN SILICON-DOMINANT ANODE CELLS - Systems and methods are provided for high volume roll-to-roll direct coating of electrodes for silicon-dominant anode cells. | 2020-12-03 |
20200381700 | ELECTRODE PLATE AND SURFACE TREATMENT METHOD THEREOF - The disclosure provides an electrode plate and a surface treatment method thereof. The surface treatment method firstly adopts a special annealing process to process the electrode plate to form a Mg film on the surface of the MgAl alloy material layer, and then make the Mg film chemically react with the fluoride ion to form a MgF | 2020-12-03 |