49th week of 2015 patent applcation highlights part 72 |
Patent application number | Title | Published |
20150349216 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode package structure includes an encapsulation case, a phosphor layer, a substrate, and a light emitting diode chip. The encapsulation case has an accommodating space. The phosphor layer is coated on a side of the encapsulation case. The substrate is disposed in the accommodating space. The light emitting diode chip is disposed on a first surface of the substrate. A surface of the light emitting diode chip is devoid of being directly covered by a colloid, and the light emitting diode chip and the package housing are separated from each other by a distance. | 2015-12-03 |
20150349217 | PROCESS FOR PREPARING A SEMICONDUCTOR STRUCTURE FOR MOUNTING - A process for preparing a semiconductor structure for mounting to a carrier is disclosed. The process involves causing a support material to substantially fill a void defined by surfaces formed in the semiconductor structure and causing the support material to solidify sufficiently to support the semiconductor structure when mounted to the carrier. | 2015-12-03 |
20150349218 | SUBMOUNT BASED LIGHT EMITTER COMPONENTS AND METHODS - Submount based light emitter components and related methods are disclosed. In some aspects, light emitter components include a ceramic submount, at least a first pair of electrical traces disposed on a first side of the submount, at least a first pair of electrical contacts disposed on a second side of the submount, at least one light emitter chip disposed on the first side of the submount, and a non-ceramic reflector disposed about the at least one light emitter chip. The first pair of electrical contacts is configured to electrical communicate with the first pair of electrical traces. The at least one chip is configured to electrically communicate with the first pair of electrical traces. At least a portion of the reflector is configured to conceal a portion of each trace of the first pair of electrical traces. | 2015-12-03 |
20150349219 | LIGHT EMITTING DEVICE MODULE - Embodiments provide a light emitting device module including a circuit board, a light emitting device bonded to a conductive layer on the circuit board via a conductive adhesive, a phosphor layer disposed on a side surface and an upper surface of the light emitting device, and a lens on the circuit board and the phosphor layer. A void is generated between the light emitting device and the circuit board. | 2015-12-03 |
20150349220 | LIGHT EMITTING DEVICE - Disclosed is a light emitting device including a light emitting structure including a first conductive semiconductor layer, an active layer under the first conductive semiconductor layer, and a second conductive semiconductor layer under the active layer, a first electrode electrically connected with the first conductive semiconductor layer, a mirror layer under the light emitting structure, a window semiconductor layer between the mirror layer and the light emitting structure, a reflective layer under the mirror layer, a conductive contact layer between the reflective layer and the window semiconductor layer and in contact with the second conductive semiconductor layer, and a conductive support substrate under the reflective layer. The window semiconductor layer includes a C-doped P-based semiconductor doped with a higher dopant concentration. The conductive contact layer includes material different from that of the mirror layer with a thickness thinner than that of the window semiconductor layer. | 2015-12-03 |
20150349221 | LIGHT-EMITTING DEVICE PACKAGE - One aspect of a light-emitting apparatus is disclosed. The light-emitting apparatus may include a substrate having a reflective surface. The light emitting apparatus may include a reflector and conductor arranged with the surface of the substrate. The reflector has a higher reflectivity than the conductor and covers a substantially greater area of the surface than the conductor. The light emitting device may include a flip-chip LED arranged with the surface of the substrate and electrically coupled to the conductor. | 2015-12-03 |
20150349222 | Reflector Trough for an Optoelectronic Semiconductor Component - An optoelectronic semiconductor component includes a lead frame with two lead frame parts and an optoelectronic semiconductor chip. The semiconductor chip is fitted to a first of the lead frame parts. A radiation-transmissive potting body of the semiconductor component mechanically connects the lead frame parts to one another. The potting body is set up for beam shaping. The first lead frame part has a reflector trough with a base surface on which the semiconductor chip is mounted. The reflector trough has a lateral surface with three sections. When seen in a plan view of the base surface, the sections revolve around the base surface and follow one another in a direction away from the base surface. In the first section, closest to the base surface, the lateral surface is oriented perpendicular to the base surface. | 2015-12-03 |
20150349223 | LIGHT EMITTING DEVICE AND LIGHT UNIT HAVING THE SAME - A light emitting device includes a support member having a body, first and second pads spaced apart from each other on the body and a depression in the body; a light emitting chip having a light emitting structure and third and fourth pads under the light emitting structure; and an adhesive member between the support member and the light emitting chip, wherein the third pad is electrically connected to the first pad, the fourth pad is electrically connected to the second pad, the light emitting structure includes a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, and a portion of the adhesive member is disposed in the depression. | 2015-12-03 |
20150349224 | LIGHT EMITTING DEVICE - A package for a light emitting device includes a resin molding and first to third leads. The first lead is disposed near a first corner of a substantially rectangular shape of the resin molding, and has a first exposed part exposed from one of two side surfaces that share the first corner while the first lead is not exposed from the resin molding on the other of the two side surfaces. The second lead is disposed near a second corner, and has a second exposed part exposed from one of two side surfaces that share the second corner while the second lead is not exposed from the resin molding on the other of the two side surfaces. The third lead has a plurality of lower surface exposed parts that are exposed from a lower surface of the resin molding. | 2015-12-03 |
20150349225 | LIGHT EMITTING DEVICE PACKAGE - Embodiments provide light emitting device package including a package body, a first lead frame and a second lead frame disposed on the package body, and a light emitting device electrically connected to the first lead frame and the second lead frame via respective conductive adhesives. At least one of the conductive adhesives has the smallest width at a central region thereof. | 2015-12-03 |
20150349226 | LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING THE SAME - A light-emitting element includes a bonding pad for connecting a bonding wire, and a coating film covering upper and side surfaces of the bonding pad. The coating film includes a mixture material including Au and one metal of Ta, Ti, Pt, Mo, Ni and W. A method of manufacturing a light-emitting element includes simultaneously sputtering Au and one metal of Ta, Ti, Pt, Mo, Ni and W on upper and side surfaces of a bonding pad by using the Au and the metal as a sputtering target so as to form thereon a coating film including a mixture material including Au and the metal. | 2015-12-03 |
20150349227 | LEAD FRAME FOR MOUNTING LED ELEMENTS, LEAD FRAME WITH RESIN, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES, AND LEAD FRAME FOR MOUNTING SEMICONDUCTOR ELEMENTS - A lead frame for mounting LED elements includes a frame body region and a large number of package regions arranged in multiple rows and columns in the frame body region. The package regions each include a die pad on which an LED element is to be mounted and a lead section adjacent to the die pad, the package regions being further constructed to be interconnected via a dicing region. The die pad in one package region and the lead section in another package region upward or downward adjacent to the package region of interest are connected to each other by an inclined reinforcement piece positioned in the dicing region. | 2015-12-03 |
20150349228 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A step of forming a connecting member configured to electrically connect a first conductive line and a second conductive line includes a phase of perforating a laminate from a first semiconductor wafer to form a plurality of connection holes that reach the second conductive line and a phase of filling the plurality of penetrating connection holes with a conductive material to form conductive sections in contact with the second conductive line. | 2015-12-03 |
20150349229 | LIGHT EMITTING DEVICE - A light-emitting diode comprises a substrate; a semiconductor stack on the substrate, wherein the semiconductor stack comprises a first semiconductor layer, an active layer for emitting a light, and a second semiconductor layer; a first oxide layer on the semiconductor stack, wherein the first oxide layer has a top surface opposite to the semiconductor stack, and the top surface comprises a first region and a second region; and a first pad on the second region; wherein the first region is rougher than the second region, wherein the first oxide layer comprises an impurity, and a concentration of the impurity of the first oxide layer in the first region is higher than that of the impurity of the first oxide layer in the second region. | 2015-12-03 |
20150349230 | HEAT RADIATION SHEET FOR BOARD, MANUFACTURING METHOD THEREOF, AND HEAT RADIATION BOARD - A heat radiation sheet for a board including: composite fillers including metal particles and ceramic particles disposed on surfaces of the metal particles; and a base resin, and a manufacturing method of a heat radiation sheet for a board may include: preparing metal particles and ceramic particles; disposing the ceramic particles on surfaces of the metal particles by mixing the metal particles and the ceramic particles with each other; forming oxidized layers on exposed surfaces of the metal particles; and forming a prepreg by mixing composite fillers including the metal particles and the ceramic particles and a base resin with each other. | 2015-12-03 |
20150349231 | LIGHT-EMITTING DEVICE - This disclosure discloses a light-emitting device. The light-emitting device includes: a heat-dissipating structure having a first part and a second part separated from the first part; a light-emitting unit including a light-emitting element with a first pad formed on the first part; and a first transparent enclosing the light-emitting element and having a sidewall; and an adhesive material covering a portion of the sidewall. | 2015-12-03 |
20150349232 | LIGHT EMITTING DIODE AND LIGHT EMITTING DEVICE INCLUDING THE SAME - Exemplary embodiments provide a light emitting diode and a method for manufacturing the same. The light emitting diode includes a light emitting structure, a plurality of holes formed through a second conductive type semiconductor layer and an active layer such that a first conductive type semiconductor layer is partially exposed therethrough, and a first electrode and a second electrode electrically connected to the first conductive type semiconductor layer and the second conductive type semiconductor layer, respectively, while being insulated from each other. The second electrode includes openings corresponding to the plurality of holes, a plurality of unit electrode layers separated from each other, and at least one connection layer electrically connecting at least two unit electrode layers to each other. The first electrode forms ohmic contact with the first conductive type semiconductor layer through the plurality of holes and partially covers the light emitting structure. | 2015-12-03 |
20150349233 | CARRIER ELEMENT AND MODULE - A carrier element includes a coupling to a heat source, a coupling to a heat sink, and a thermoelectric thin-layer element with a hot side and a cold side, arranged on the carrier element between the coupling to the heat source and the coupling to the heat sink. The hot side is in thermally conductive contact with the coupling to the heat source, and the cold side is in thermally conductive contact with the coupling to the heat sink. To avoid damaging tensile and shear stresses in the thermoelectric thin-layer element, especially in the thermoelectrically active material, while ensuring good thermal coupling at the same time, at least one elastic and/or flexible compensating section of the carrier element is set up between the coupling to the heat source and the coupling to the heat sink in such a way that it compensates for the difference between the expansions of the heat source and those of the heat sink by a change of shape of the compensating section. | 2015-12-03 |
20150349234 | Methods Of Making A Specialty Junction Thermocouple For Use In High Temperature And Corrosive Environments - A method of manufacturing a thermocouple includes forming a hot junction between the distal end portions of first and second thermocouple wires. The hot junction defines a splice such that the first thermocouple wire and the second thermocouple wire are in direct contact at their distal end portions. A refractory coating is applied over the hot junction. | 2015-12-03 |
20150349235 | WAVEFORM GENERATING APPARATUS, SIGNAL GENERATING CIRCUIT, PIEZOELECTRIC DRIVING APPARATUS AND METHOD, AND ELECTRONIC DEVICE USING THE SAME - A piezoelectric driving apparatus may include a waveform synthesizing unit outputting a digital value, a digital-to-analog converting unit converting the digital value to an analog signal, and an output unit adding a direct current (DC) voltage to the analog signal to generate an asymmetrical driving signal. | 2015-12-03 |
20150349236 | VIBRATION WAVE DRIVING DEVICE, IMAGE PICKUP DEVICE, OPTICAL APPARATUS, LIQUID DISCHARGE DEVICE, AND ELECTRONIC APPARATUS - A vibration wave driving device including a lead-free piezoelectric material that can be driven with high reliability over a wide operating temperature range, an image pickup device including the vibration wave driving device, and an optical apparatus including the vibration wave driving device are provided. The vibration wave driving device generates a vibration wave by applying an AC voltage to a piezoelectric element, and includes the piezoelectric element and a capacitor that satisfy 20[° C.]≦T∈(Cmax)−T∈(Pmax)≦75[° C.] and 0.50≦∈(Cc)/∈(Cmax)≦0.80. | 2015-12-03 |
20150349237 | DRIVER FOR OPTICAL DEFLECTOR USING COMBINED SAW-TOOTH DRIVE VOLTAGE AND METHOD FOR CONTROLLING THE SAME - In a driver for driving an optical deflector including a mirror, a piezoelectric actuator and a piezoelectric sensor adapted to sense vibrations of the piezoelectric actuator, a saw-tooth voltage generating unit; a combined saw-tooth voltage generating unit; and a control unit, the control unit applies a saw-tooth voltage and its inverted voltage to the piezoelectric actuator; performs a low-pass filtering process using a cut-off frequency upon a sense voltage; calculates a half period of fluctuations included in a low-pass-filtered saw-tooth voltage; combines the low-pass-filtered saw-tooth voltage with a delayed low-pass-filtered saw-tooth voltage; and to applies a combined saw-tooth voltage and its inverted voltage to the piezoelectric actuator. | 2015-12-03 |
20150349238 | PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT, AND ELECTRONIC DEVICE - The present invention can provide a lead-free piezoelectric material having a high piezoelectric constant in the room temperature range. The present invention for this purpose is a piezoelectric material including a main component containing a perovskite metal oxide represented by following general formula (1), | 2015-12-03 |
20150349239 | PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, AND ELECTRONIC DEVICE - A piezoelectric material that does not contain lead and has excellent piezoelectric constant and mechanical quality factor in a device driving temperature range (−30° C. to 50° C.) is provided. A piezoelectric material includes a main component containing a perovskite metal oxide represented by following general formula (1), and a first auxiliary component containing Mn, wherein an amount of the contained Mn is 0.002 moles or more and 0.015 moles or less relative to 1 mole of the metal oxide. | 2015-12-03 |
20150349240 | ELECTRO-MECHANICAL TRANSDUCTION ELEMENT, MANUFACTURING METHOD OF MANUFACTURING ELECTRO-MECHANICAL TRANSDUCTION ELEMENT, DROPLET DISCHARGE HEAD, AND DROPLET DISCHARGE DEVICE - An electro-mechanical transduction element includes a lower electrode formed above a substrate; an electro-mechanical transduction film which is formed on the lower electrode and includes a perovskite-type crystal containing lead zirconate titanate (PZT); and an upper electrode formed on the electro-mechanical transduction film, wherein, in a state where the electro-mechanical transduction film is not bound by the substrate, a peak position of X-ray diffraction caused by a plane (200) of the electro-mechanical transduction film is 2θ=44.45° or greater and 44.75° or smaller, and a peak of diffraction caused by the plane (200) or a plane (400) of the electro-mechanical transduction film has an asymmetry property. | 2015-12-03 |
20150349241 | PIEZOELECTRIC MATERIAL, PIEZOELECTRIC ELEMENT, METHOD FOR MANUFACTURING PIEZOELECTRIC ELEMENT, AND ELECTRONIC DEVICE - A piezoelectric material that does not contain lead and has excellent and stable piezoelectric properties in a device operating temperature range is provided. The present invention for this purpose is a piezoelectric material including a main component containing a perovskite metal oxide represented by following general formula (1), a first auxiliary component containing Mn, and a second auxiliary component containing Bi charge-disproportionated into trivalent and pentavalent, wherein an amount of the contained Mn is 0.0020 moles or more and 0.0150 moles or less relative to 1 mole of the metal oxide, and an amount of the contained Bi is 0.0004 moles or more and 0.0085 moles or less relative to 1 mole of the metal oxide. | 2015-12-03 |
20150349242 | CONDUCTIVE PAD STRUCTURE AND METHOD OF FABRICATING THE SAME - A structure of a conductive pad is provided. The structure includes a first conductive layer. A first dielectric layer covers the first conductive layer. A first contact hole is disposed within the first dielectric layer. A second conductive layer fills in the first conductive hole and extends from the first conductive hole to a top surface of the first dielectric layer so that the second conductive layer forms a step profile. A second dielectric layer covers the first dielectric layer and the second conductive layer. A third conductive layer contacts and covers the step profile. | 2015-12-03 |
20150349243 | MAGNETORESISTIVE SENSOR, RELATED MANUFACTURING METHOD, AND RELATED ELECTRONIC DEVICE - A method for manufacturing a magnetoresistive sensor may include the following steps: forming a trench structure in a substrate, wherein the step of forming the trench structure comprises performing a wet etching process on a substrate material member, wherein the trench structure has a first side, a second side, and a third side, wherein the second side is connected through the first side to the third side, wherein the second side is at a first obtuse angle with respect to a side of the substrate, and wherein the third side is at a second obtuse angle with respect to the side of the substrate; forming a first magnetic element on the first side of the trench structure; forming a second magnetic element on the second side of the trench structure; and forming a third magnetic element on the third side of the trench structure. | 2015-12-03 |
20150349244 | REDUCING SOURCE LOADING EFFECT IN SPIN TORQUE TRANSFER MAGNETORESISTIVE RANDOM ACCESS MEMORY (STT-MRAM) - A memory cell includes a magnetic tunnel junction (MTJ) structure that includes a free layer coupled to a bit line and a pinned layer. A magnetic moment of the free layer is substantially parallel to a magnetic moment of the pinned layer in a first state and substantially antiparallel to the magnetic moment of the pinned layer in a second state. The pinned layer has a physical dimension to produce an offset magnetic field corresponding to a first switching current of the MTJ structure to enable switching between the first state and the second state when a first voltage is applied from the bit line to a source line coupled to an access transistor and a second switching current to enable switching between the second state and the first state when the first voltage is applied from the source line to the bit line. | 2015-12-03 |
20150349245 | PLASMA PROCESSING METHOD - In a plasma processing method for plasma-etching magnetic layer by using a plasma processing device including a processing chamber in which a sample is plasma-processed, a dielectric window to seal an upper part of the processing chamber hermetically, an inductive coupling antenna disposed above the dielectric window, a radio-frequency power source to supply radio-frequency electric power to the inductive coupling antenna and a Faraday shield disposed between the inductive coupling antenna and the dielectric window, a deposit layer is formed on the plasma-etched magnetic layer by plasma processing while applying radio-frequency voltage to the Faraday shield after the magnetic layer is plasma-etched. | 2015-12-03 |
20150349246 | METHOD FOR ETCHING MTJ USING CO PROCESS CHEMISTIRES - A method for fabricating a magnetic film structure is provided. The method comprises forming a magnetic structure on a bottom electrode layer, the magnetic structure comprising at least one pinned bottom magnetic film layer having a fixed magnetic orientation; at least one top magnetic film layer whose magnetic orientation can be manipulated by a current; and a tunneling layer between the bottom magnetic film layer and the top magnetic film layer; forming a metallic hard mask atop the magnetic structure; patterning and etching the metallic hard mask to define exposed areas of the magnetic structure; selectively etching the exposed areas of the magnetic structure by a chemical etch process based on a CO etch chemistry to form discrete magnetic bits. | 2015-12-03 |
20150349247 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device according to an embodiment comprises a base layer. A material layer is provided on the base layer. A lower layer portion is provided in lower parts of trenches or holes formed in the material layer and has a crystal structure in a direction not perpendicular to a surface of the base layer. An upper layer portion is provided on the lower layer portion in the trenches or the holes and has a crystal structure in a direction substantially perpendicular to the surface of the base layer. | 2015-12-03 |
20150349248 | PHASE CHANGE MEMORY STRUCTURES AND METHODS - A method of forming a phase change material memory cell includes forming a number of memory structure regions, wherein the memory structure regions include a bottom electrode material and a sacrificial material, forming a number of insulator regions between the number of memory structure regions, forming a number of openings between the number of insulator regions and forming a contoured surface on the number of insulator regions by removing the sacrificial material and a portion of the number of insulator regions, forming a number of dielectric spacers on the number of insulator regions, forming a contoured opening between the number of insulator regions and exposing the bottom electrode material by removing a portion of the number of dielectric spacers, and forming a phase change material in the opening between the number of insulator regions. | 2015-12-03 |
20150349249 | MEMORY CELLS HAVING A NUMBER OF CONDUCTIVE DIFFUSION BARRIER MATERIALS AND MANUFACTURING METHODS - Memory cells having a select device material located between a first electrode and a second electrode, a memory element located between the second electrode and a third electrode, and a number of conductive diffusion barrier materials located between a first portion of the memory element and a second portion of the memory element. Memory cells having a select device comprising a select device material located between a first electrode and a second electrode, a memory element located between the second electrode and a third electrode, and a number of conductive diffusion barrier materials located between a first portion of the select device and a second portion of the select device. Manufacturing methods are also described. | 2015-12-03 |
20150349250 | RESISTIVE RANDOM-ACCESS MEMORY (RRAM) WITH MULTI-LAYER DEVICE STRUCTURE - A resistive memory cell is disclosed. The resistive memory cell comprises a pair of electrodes and a multi-layer resistance-switching network disposed between the pair of electrodes. The multi-layer resistance-switching network comprises a pair of carbon doping layers and a group-IV element doping layer disposed between the pair of carbon doping layers. Each carbon doping layer comprises silicon oxide doped with carbon. The group-IV doping layer comprises silicon oxide doped with a group-IV element. A method of fabricating a resistive memory cell is also disclosed. The method comprises forming a first carbon doping layer on a first electrode using sputtering, forming a group-IV element doping layer on the first carbon doping layer using sputtering, forming a second carbon doping layer on the group-IV element doping layer using sputtering, and forming a second electrode on the second carbon doping layer using sputtering. | 2015-12-03 |
20150349251 | RESISTIVE RANDOM-ACCESS MEMORY (RRAM) WITH A LOW-K POROUS LAYER - A resistive memory cell is disclosed. The resistive memory cell comprises a pair of electrodes and a resistance-switching network disposed between the pair of electrodes. The resistance-switching network comprises a group-IV element doping layer and a porous low-k layer. The group-IV doping layer comprises silicon oxide doped with a group-IV element. The porous low-k layer comprises porous silicon oxide or porous hafnium oxide. The group-IV element may comprise zirconium, titanium, or hafnium. The porous low-k layer may be prepared by inductively coupled plasma (ICP) treatment. A method of fabricating a resistive memory is disclosed. The method comprises forming a resistance-switching network on a first electrode using sputtering and forming a second electrode on the resistance-switching network using sputtering. The resistance-switching network comprises a group-IV element doping layer and a porous low-k layer. | 2015-12-03 |
20150349252 | INTEGRATED CIRCUIT DEVICE - An integrated circuit device according to an embodiment includes an electrode extending in a first direction, two semiconductor members spaced from each other in the first direction and extending in a second direction crossing the first direction, an insulating film placed between each of the two semiconductor members and the electrode and made of a first insulating material, and a first dielectric member placed between the two semiconductor members and made of a second insulating material having a higher permittivity than the first insulating material. | 2015-12-03 |
20150349253 | Highly Reliable Nonvolatile Memory and Manufacturing Method Thereof - The present invention relates to a highly reliable nonvolatile memory and a manufacturing method thereof. The nonvolatile memory comprises top electrodes, bottom electrodes and a resistive material layer disposed therebetween, wherein the top electrodes are positioned on top in the memory; the bottom electrodes are positioned on a substrate; metal oxide for forming the resistive material layer is doped with metal; and a metal oxygen storage layer is further disposed between the top electrodes and the resistive material layer. The manufacturing method adopts a method in which a doping method and a double-layer forming method are combined, so that the highly reliable and highly uniform resistive random access memory can be fabricated and accordingly the performance of the memory can be increased. | 2015-12-03 |
20150349254 | BUFFER CAP LAYER TO IMPROVE MIM STRUCTURE PERFORMANCE - The present disclosure relates to method of forming a MIM (metal-insulator-metal) structure having a buffer cap layer that reduces stress induced by an overlying stress-inducing protective layer, and an associated apparatus. The method is performed by forming a lower conductive layer over a semiconductor substrate, forming a dielectric layer over the lower conductive layer, and forming an upper conductive layer over the dielectric layer. A buffer cap layer is formed over the upper conductive layer and a stress-inducing protective layer is formed onto the buffer cap layer. The buffer cap layer reduces a stress induced onto the upper conductive layer by the stress-inducing protective layer, thereby reducing leakage current between the lower and upper conductive layers. | 2015-12-03 |
20150349255 | Array Of Cross Point Memory Cells And Methods Of Forming An Array Of Cross Point Memory Cells - An array of cross point memory cells comprises spaced elevationally inner first lines, spaced elevationally outer second lines which cross the first lines, and a multi-resistive state region elevationally between the first and second lines where such cross. Individual of the multi-resistive state regions comprise elevationally outer multi-resistive state material and elevationally inner multi-resistive state material that are electrically coupled to one another. The inner multi-resistive state material has opposing edges in a vertical cross-section. The outer multi-resistive state material has opposing edges in the vertical cross-section that are laterally offset relative to the opposing edges of the inner multi-resistive state material in the vertical cross-section. Methods are also disclosed. | 2015-12-03 |
20150349256 | CONJUGATED POLYMERS - The invention relates to novel conjugated polymers containing one or more thieno[3,2-b]thiophene based polycyclic repeating units, to methods for their preparation and educts or intermediates used therein, to polymer blends, mixtures and formulations containing them, to the use of the polymers, polymer blends, mixtures and formulations as organic semiconductors in organic electronic (OE) devices, especially in organic photovoltaic (OPV) devices and organic photodetectors (OPD), and to OE, OPV and OPD devices comprising these polymers, polymer blends, mixtures or formulations. | 2015-12-03 |
20150349257 | P-TYPE SEMICONDUCTING POLYMERS AND RELATED METHODS - There is provided p-type organic polymers of general formula I. The polymers may be useful as semi-conducting material. Thus, thin films and devices comprising such polymers are also provided. | 2015-12-03 |
20150349258 | COMPOSITIONS AND APPLICATIONS OF THREE COMPONENT BENZO[1,2-B:4,5-B] DITHIOPHENE-THIENOTHIOPHENE RANDOMLY SUBSTITUTED POLYMERS FOR ORGANIC SOLAR CELLS - A polymer having two different sets of repeat units consisting essentially of: | 2015-12-03 |
20150349259 | PROCESS OF PRODUCING AND APPLICATIONS OF THREE COMPONENT BENZO[1,2-B:4,5-B] DITHIOPHENE-THIENOTHIOPHENE RANDOMLY SUBSTITUTED POLYMERS FOR ORGANIC SOLAR CELLS - A process of polymerizing | 2015-12-03 |
20150349260 | COMPOSITIONS AND APPLICATIONS OF A MULTI-COMPONENT BENZO[1,2-B:4,5-B] DITHIOPHENE-THIENOTHIOPHENE RANDOMLY SUBSTITUTED POLYMERS FOR ORGANIC SOLAR CELLS - A polymer having at least four different repeat units comprising: | 2015-12-03 |
20150349261 | DIFLUOROTHIENOTHIOPHENE BASED CONJUGATED POLYMERS - A polymer having a monomer repeat unit comprising | 2015-12-03 |
20150349262 | Charge Transporting Semi-Conducting Material and Semi-Conducting Device - The present invention relates to a charge transporting semi-conducting material comprising: a) optionally at least one electrical dopant, and b) at least one cross-linked charge-transporting polymer comprising 1,2,3-triazole cross-linking units, a method for its preparation and a semiconducting device comprising the charge transporting semi-conducting material. | 2015-12-03 |
20150349263 | INTERLAYER FOR ELECTRONIC DEVICES - Embodiments in accordance with the present invention provide for the use of polycycloolefins in electronic devices and more specifically to the use of such polycycloolefins as interlayers applied to fluoropolymer layers used in the fabrication of electronic devices, the electronic devices that encompass such polycycloolefin interlayers and processes for preparing such polycycloolefin interlayers and electronic devices. | 2015-12-03 |
20150349264 | Carbon Nanotube-Graphene Hybrid Transparent Conductor and Field Effect Transistor - A nanotube-graphene hybrid film and method for forming a cleaned nanotube-graphene hybrid film. A method includes depositing nanotube film over a metal foil to produce a layer of nanotube film, placing the metal foil with as-deposited nanotube film in a chemical vapor deposition furnace to grow graphene on the nanotube film to form a nanotube-graphene hybrid film, and transferring the nanotube-graphene hybrid film over a substrate. | 2015-12-03 |
20150349265 | AMINE-BASED COMPOUND AND ORGANIC LIGHT- EMITTING DEVICE INCLUDING THE SAME - A compound and an organic light-emitting device including the same, the compound being represented by Formula 1 below: | 2015-12-03 |
20150349266 | ORGANIC LIGHT-EMITTING DEVICE - An organic light-emitting device includes a first electrode; a second electrode; and an organic layer between the first electrode and the first electrode and including an emission layer (EML); a hole transport region between including an electron blocking layer (EBL) and at least one selected from a hole injection layer (HIL), a hole transport layer (HTL), and a buffer layer; and an electron transport region and including a hole blocking layer (HBL) and at least one selected from an electron transport layer and electron injection layer (EIL). A triplet energy of a material for the electron blocking layer (EBL T1), a triplet energy of a material for the hole blocking layer (HBL T1), and a triplet energy of a host in the emission layer (Host T1) satisfy Equation (1) and Equation (2): | 2015-12-03 |
20150349267 | BLUE LUMINESCENT COMPOUNDS - There is provided a compound having Formula II | 2015-12-03 |
20150349268 | Organic Electroluminescent Materials and Devices - Novel organic compounds containing triphenylene and triazine moieties are described. These compounds are expected to improve device performance when they are used in organic electroluminescent devices. | 2015-12-03 |
20150349269 | LUMINESCENT MATERIAL FOR ORGANIC OPTOELECTRIC DEVICE AND ORGANIC OPTOELECTRIC DEVICE AND DISPLAY DEVICE - Disclosed are an organic compound represented by the Chemical Formula 1, an organic optoelectric device including the organic compound, and a display device including the organic optoelectric device. | 2015-12-03 |
20150349270 | ORGANIC COMPOUND, ORGANIC OPTOELECTRONIC DEVICE AND DISPLAY DEVICE - An organic compound represented by Chemical Formula 1, an organic optoelectric device including the organic compound, and a display device are disclosed. | 2015-12-03 |
20150349271 | Novel Compound, Light-Emitting Element Comprising same and Electronic Device Comprising the Light-Emitting Element - The present invention relates to a compound, and a light-emitting element and an electronic device including the same, and, more particularly, to a compound for an organic light-emitting element, and a light-emitting element and an electronic device including the same. The compound according to the present invention can improve hole injection and/or transport abilities. | 2015-12-03 |
20150349272 | COMPOUND FOR ORGANIC ELECTRIC ELEMENT, ORGANIC ELECTRIC ELEMENT COMPRISING THE SAME AND ELECTRONIC DEVICE THEREOF - A compound represented by Formula 1. An organic electric element includes a first electrode, a second electrode, and an organic material layer between the first electrode and the second electrode. The organic material layer includes the compound represented by Formula 1. When the organic electric element includes the compound in the organic material layer, driving voltage, luminous efficiency, color purity, stability, and life span can be improved. | 2015-12-03 |
20150349273 | ORGANIC ELECTROLUMINESCENT MATERIALS AND DEVICES - A luminescent materials including donor-acceptor compounds with a nitrogen containing donor connected to the 1-position of a carbazole and triazene acceptor connected at the 9-position is disclosed. | 2015-12-03 |
20150349274 | BICARBAZOLE DERIVATIVE, PREPARATION PROCESS AND USE THEREOF, AND ORGANIC LUMINESCENT DEVICE - The invention provides a bicarbazole derivative represented by formula (I), wherein A is a group represented by formula (II), and wherein X, Y and Z represent a carbon atom or a nitrogen atom, and at least one of X, Y and Z represent a nitrogen atom. The invention further provides a process for preparing the compound. The invention further provides an organic electroluminescent device comprising the compound. This compound can be used as a phosphorescence host material, a hole-injecting material or a hole-transporting material in an organic electroluminescent device. | 2015-12-03 |
20150349275 | CONDENSED CYCLIC COMPOUNDS AND ORGANIC LIGHT-EMITTING DEVICES INCLUDING THE SAME - A condensed cyclic compound and an organic light-emitting device including the same, the condensed cyclic compound being represented by Formula 1 below: | 2015-12-03 |
20150349276 | COMPOUND FOR ORGANIC ELECTRIC ELEMENT, ORGANIC ELECTRIC ELEMENT COMPRISING THE SAME AND ELECTRONIC DEVICE THEREOF - Provided herein are a compound capable of improving light emitting efficiency, stability, and lifespan of the element, an organic element using the same, and an electric device for the same. | 2015-12-03 |
20150349277 | METAL COMPLEXES - The present invention relates to metal complexes and to electronic devices, in particular organic electroluminescent devices, comprising these metal complexes. | 2015-12-03 |
20150349278 | Organometallic Iridium Complex, Light-Emitting Element, Light-Emitting Device, Electronic Device, and Lighting Device - To provide a long-lifetime organometallic iridium complex exhibiting yellow light emission with high emission efficiency as a novel substance. The organometallic iridium complex includes a ligand in which an unsubstituted phenyl group is bonded to each of the 2-position and the 5-position of pyrimidine. The organometallic iridium complex has a structure represented by General Formula (G1). | 2015-12-03 |
20150349279 | Tetradentate Cyclometalated Platinum Complexes Containing 9,10-Dihydroacridine And Its Analogues - Platinum complexes suitable for use as phosphorescent emitters or as delayed fluorescent and phosphorescent emitters having the following structure: | 2015-12-03 |
20150349280 | GLASS SUBSTRATE FOR ORGANIC EL DEVICE, AND ORGANIC EL DEVICE USING SAME - Provided is a glass substrate for an OLED device, including a roughened surface having a surface roughness Rt of 50 to 10,000 nm as at least one surface thereof, the glass substrate for an OLED device having a refractive index nd of 1.55 or more. | 2015-12-03 |
20150349281 | ORGANIC SCHOTTKY DIODES - An organic diode has a substrate, a first conductor layer on the substrate, an organic semiconductor layer on the first conductor layer, and a second conductor layer on the organic substrate layer, wherein one of the conductor layers has an injection enhancement. | 2015-12-03 |
20150349282 | METHOD FOR MANUFACTURING HIGH-EFFICIENCY INORGANIC-ORGANIC HYBRID SOLAR CELL - Provided is a method for manufacturing a solar cell including: a) forming an electron transport layer on a first electrode; b) forming a light absorber by applying a light absorber solution as a solution for forming a light absorber containing an organic-metal halide having a perovskite structure, the light absorber solution containing an organic halide and a metal halide dissolved therein so as to have a non-stoichiometric ratio based on the organic-metal halide; c) forming a hole conduction layer by applying and drying a hole transport solution in which an organic hole transport material is dissolved; and d) forming a second electrode, which is a counter electrode of the first electrode, on the hole conduction layer. | 2015-12-03 |
20150349283 | HYBRID PLANAR-MIXED HETEROJUNCTION FOR ORGANIC PHOTOVOLTAICS - Disclosed herein are organic photosensitive optoelectronic devices comprising two electrodes in superposed relation; a mixed photoactive layer located between the two electrodes, wherein the mixed photoactive layer comprises at least one donor material having a HOMO energy and at least one acceptor material having a LUMO energy, wherein the at least one donor material and the at least one acceptor material form a mixed donor-acceptor heterojunction; a photoactive layer adjacent to and interfacing with the mixed photoactive layer, wherein the photoactive layer comprises a material having a LUMO energy within 0.3 eV of the LUMO energy of the at least one acceptor material or a HOMO energy within 0.3 eV of the HOMO energy of the at least one donor material; and a buffer layer adjacent to and interfacing with the mixed photoactive layer. | 2015-12-03 |
20150349284 | LIGHT-EMITTING ELEMENT, LIGHT-EMITTING DEVICE, ELECTRONIC DEVICE, AND LIGHTING DEVICE - Emission efficiency of a light-emitting element is improved. The light-emitting element has a pair of electrodes and an EL layer between the pair of electrodes. The EL layer includes a first light-emitting layer and a second light-emitting layer. The first light-emitting layer includes a fluorescent material and a host material. The second light-emitting layer includes a phosphorescent material, a first organic compound, and a second organic compound. An emission spectrum of the second light-emitting layer has a peak in a yellow wavelength region. The first organic compound and the second organic compound form an exciplex. | 2015-12-03 |
20150349285 | LIGHT-EMITTING DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE - A light-emitting device, an electronic device, and a display device each consume less power are provided. The light-emitting device includes a first light-emitting element, a second light-emitting element, and a third light-emitting element that share an EL layer. The EL layer includes a layer containing a light-emitting material that emits blue fluorescence and a layer containing a light-emitting material that emits yellow or green phosphorescence. Light emitted from the second light-emitting element enters a color filter layer or a second color conversion layer, and light emitted from the third light-emitting element enters a first color conversion layer. | 2015-12-03 |
20150349286 | EXCITED STATE MANAGEMENT - Arrangements and techniques for providing organic emissive layers are provided, in which the emissive layer includes a first dopant having a dissociative energy level. A second dopant in the emissive layer provides a solid state sink energy level, to which doubly excited excitons and/or polarons may transition instead of to the dissociative energy level, thereby decreasing the undesirable effects of transitions to the dissociative energy level. | 2015-12-03 |
20150349287 | ORGANIC LIGHT-EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - An organic light-emitting display apparatus includes a transistor on a substrate. The transistor includes a gate electrode, a first electrode, and a second electrode. The apparatus also includes a protective layer over the first electrode and including a first portion that contacts the second electrode, and an organic light-emitting device having a pixel electrode electrically connected to the second electrode. | 2015-12-03 |
20150349288 | LIGHT EMITTING DISPLAY PANEL AND MANUFACTURING METHOD THEREOF - Embodiments of the invention disclose a light emitting display panel. The light emitting display panel comprises a cover plate, a substrate disposed opposite to each other, a plurality of light emitting devices located between the cover plate and the substrate, and a packaging structure surrounding the light emitting devices. The packaging structure comprises at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, wherein four sides of each of the protruded frames are looped and the at least three rows of protruded frames are adjacent to and embedded in each other in an inward and outward direction. Adjacent ones of the at least three rows of protruded frames are alternately disposed on the cover plate and the substrate and protrude in opposite directions, and non-adjacent ones of the at least three rows of protruded frames are disposed on the same one of the cover plate and the substrate and protrude in the same direction. In the above light emitting display panel, resin adhesive or desiccant is filled in gaps between the frames so as to prolong an invasion path of water vapor and oxygen gas spatially, an effect of preventing water vapor and oxygen gas is thus increased. The light emitting display panel has advantages of good sealing property, simple manufacturing process and the like. | 2015-12-03 |
20150349289 | Organic Light Emitting Diode Display Device - An organic light emitting display assembly includes a body frame and a cap frame that assembly to secure an organic light emitting diode panel with the assembled frame. A gap is present between a perimeter edge of the organic light emitting diode panel and the body frame to allow for convenient placement of the panel in the frame. The cap frame, attached over the body frame via an insertion groove, includes a cap horizontal portion that covers a top surface of the body vertical portion. One side surface of the cap horizontal portion of the cap frame covers the gap between the organic light emitting diode panel and the body frame. | 2015-12-03 |
20150349290 | FUNCTIONAL FILM - A functional film has a support which has a value of retardation of equal to or less than 50 nm; a protective inorganic film which is formed on the support; one or more combinations, each of which is composed of an organic film as an underlayer and an inorganic film, formed on the protective inorganic film; and a sealant layer which adheres onto the inorganic film as an uppermost layer by an adhesive layer, has a value of retardation of equal to or less than 300 nm, and has a glass transition temperature lower than that of the support. | 2015-12-03 |
20150349291 | ORGANIC ELECTROLUMINESCENT DISPLAY PANEL AND DISPLAY APPARATUS - The present invention discloses an organic electroluminescent display panel, comprising: a base substrate; a top-emitting type organic electroluminescent structure located on the base substrate, the organic electroluminescent structure comprising an anode, a light emitting layer and a cathode arranged in this order from the base substrate; and a packaging film covering the organic electroluminescent structure; the organic electroluminescent display panel further comprises a secondary electrode provided on the packaging film and electrically connected with the cathode through a via hole penetrating through the packaging film. Since the secondary electrode is additionally provided on the packaging film and is electrically connected with the cathode through the via hole penetrating through the packaging film, the secondary electrode electrically connected with the cathode can increase an equivalent thickness of the cathode and thus reduce the resistance of the cathode, which can avoid the problem of large voltage drop due to large resistance of the cathode when a thinner metal is used as the cathode, thereby can avoid damage of the organic electroluminescent display panel due to the larger voltage drop. | 2015-12-03 |
20150349292 | IMPACT RESISTANT OLED DEVICES - A system and method for the fabrication of high efficiency OLED devices and more specifically, the fabrication of OLED panels optically coupled with impact resistant, transparent structures which permit operation of the OLED panel while providing impact resistance. The OLED device can be built directly on an impact resistant transparent structure, or attached to an impact resistant transparent structure after it is built on other types of substrate. The impact resistant transparent structure can be a toughened layer, such as a glass layer, an energy absorption layer, such as Polycarbonate (PC), or a combination of both. The OLED device is configured to transmit light through the impact resistant transparent structure to the viewer, and the impact resistant transparent structure provides impact resistance for the OLED from the force of any impacting object. | 2015-12-03 |
20150349293 | ORGANIC LIGHT EMITTING DISPLAY PANEL AND METHOD OF MANUFACTURING THE SAME - An apparatus can include a first electrode on a planarization layer, an organic emission layer on the first electrode, a first bank and a second bank on the planarization layer and configured to surround the organic emission layer, and an anti-moisture unit on a portion of the planarization layer and a portion of the second bank, wherein the anti-moisture unit is configured to suppress moisture permeation through the second bank and the planarization layer. | 2015-12-03 |
20150349294 | ORGANIC LIGHT EMITTING DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME - A flexible organic light emitting display apparatus comprising a flexible encapsulation layer comprising at least one aluminum oxide layer configured to cover an area having a plurality of pixels, a flexible barrier film comprising a flexible barrier film body and a pressure sensitive adhesive layer on the flexible encapsulation layer and an adhesion supporter directly contacting the aluminum oxide layer and the pressure sensitive adhesive layer. | 2015-12-03 |
20150349295 | GAS PERMEATION MULTILAYER BARRIER WITH TUNABLE INDEX DECOUPLING LAYERS - Barrier stacks according to embodiments of the present invention achieve good optical properties by including a decoupling layer with a tunable refractive index. In some embodiments, the barrier stack includes one or more dyads, each of which includes a first layer comprising an organic-inorganic hybrid material, and a second layer comprising a barrier material. The first layer has a refractive index at an interface between the first layer and the second layer that is substantially matched to a refractive index of the second layer. | 2015-12-03 |
20150349296 | Optical-Member Adhesive Composition, Optical-Member Adhesive Layer, and Surface Light Source Device - An optical-member adhesive composition, including an adhesive material, reactive modified metal oxide particles having a volume average particle diameter of 1 to 500 nm, and organic light diffusing particles, and optionally including a silane coupling agent and a plasticizer; an optical-member adhesive layer formed from the optical-member adhesive composition; and a surface light source device including the specific light diffusion layer. | 2015-12-03 |
20150349297 | OLED DISPLAY PANEL - An OLED display panel and manufacturing method of the panel are provided in which a terminal electrode is exposed by performing etching with fixed etching conditions without performing step processing. A terminal region comprised from a plurality of metal electrodes | 2015-12-03 |
20150349298 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a display device is disclosed. In one aspect, a display device comprises a lower substrate, a light-emitting element formed on the lower substrate and comprising a plurality of pixels, an upper substrate disposed on the light-emitting element with a gap therebetween sealed with a sealant. In addition, the device includes a filler filling the gap between the light-emitting element and the upper substrate, and a light-absorbing material formed between the lower substrate and the upper substrate and selectively absorbing light of a certain wavelength range. | 2015-12-03 |
20150349299 | RECTANGULAR SECONDARY BATTERY - An insulation sheet is disposed between a rectangular housing and an electrode body. A first side wall of the insulation sheet is disposed between a large-area side surface of the rectangular housing and the electrode body. The first side wall includes a first folded portion that is folded along an edge of the first side wall near a sealing plate. The first folded portion extends from an edge of the first side wall near the sealing plate toward a bottom surface of the rectangular housing and is disposed between the large-area side surface and the electrode body in such a way that the first folded portion overlaps the first side wall. | 2015-12-03 |
20150349300 | SHAPE-ADAPTED ELECTROCHEMICAL STORAGE DEVICE FOR UNIFORM TEMPERATURE DISTRIBUTION - An electrochemical storage device is provided including an anode chamber filled with anode material, and a cathode chamber filled with cathode material. The anode chamber is separated from the cathode chamber by ion-conducting solid body electrolyte, and is limited on one side at least partially by the solid body electrolyte, and to the other side at least partially by a wall surrounding at least partially the solid body electrolytes. The electrochemical storage device has a head part where electric energy is guided to and/or taken away from, a base part arranged opposite the head part, and at least one lateral part including at least one wall arranged between the head and base part. At least one first area and second area are formed between the wall and the solid body electrolyte, both areas being different with respect to the respective distance between the wall and solid body electrolyte. | 2015-12-03 |
20150349301 | THIN FILM ENCAPSULATION FOR THIN FILM BATTERIES AND OTHER DEVICES - An electrochemical device is claimed and disclosed, including a method of manufacturing the same, comprising an environmentally sensitive material, such as, for example, a lithium anode; and a plurality of alternating thin metallic and ceramic, blocking sub-layers. The multiple metallic and ceramic, blocking sub-layers encapsulate the environmentally sensitive material. The device may include a stress modulating layer, such as for example, a Lipon layer between the environmentally sensitive material and the encapsulation layer. | 2015-12-03 |
20150349302 | BATTERY CELL SHRINK-WRAP METHOD AND ASSEMBLY - An example battery cell shrink-wrapping method includes covering a side of a battery cell with a section of a shrink-wrap material. The side interfaces with a cold plate when the battery cell is within a battery pack. | 2015-12-03 |
20150349303 | SECONDARY BATTERY AND METHOD FOR MANUFACTURING THE SAME - Provided is a secondary battery in which a battery lid is fixed to a battery case by inserting the battery lid into an opening of the battery case having the opening, and emitting laser beams to a butting portion between the battery case and the battery lid to perform butt welding, wherein, when a battery lid-side welding mark formed in the battery lid has a distance from a surface of the battery lid to a lower end of the battery lid-side welding mark which is defined as a battery lid-side welding depth, and a battery case-side welding mark formed in the battery case has a distance from the surface of the battery lid to a lower end of the battery case-side welding mark which is defined as a battery case-side welding depth, the battery lid-side welding depth is deeper than the battery case-side welding depth. | 2015-12-03 |
20150349304 | ASSEMBLED BATTERY - The present specification discloses a technology for protecting a portion where corrosion may occur in the assembled battery. An assembled battery includes a plurality of battery packs. Each of the battery packs includes a housing with an opening at a top thereof, a cover plate, and a relief valve. The cover plate is welded at the opening which seals the housing. The relief valve is provided on the cover plate. The assembled battery hardier includes an exhaust cover and an insulating sheet. The exhaust cover covers the relief valve of each of the battery packs, and guides, toward the outside of the assembled battery, an internal gas that comes out of the relief valves. The insulating sheet may cover a portion of a welded line between the housing and the cover plate of each battery pack, and the portion faces the exhaust cover. | 2015-12-03 |
20150349305 | THERMALLY INSULATING APPARATUS FOR ACCOMMODATING AT LEAST ONE COMPONENT OF AN SOFC FUEL CELL SYSTEM, AND METHOD FOR PRODUCING AN APPARATUS OF THIS KIND - An apparatus for accommodating at least one component of a SOFC fuel cell system includes a thermally insulating inner box and an outer box that surrounds the inner box. The inner box includes a base, a cover, and side panels. The outer box bears against the base, the cover, and the side panels of the inner box and presses them together, and wherein the at least one component can be arranged in the interior of the inner box. The base, the cover, and the side panels are at least partly over-dimensioned so that the inner box can be assembled with a press-fit. | 2015-12-03 |
20150349306 | BATTERY MODULE - A battery module is provided and includes a plurality of rechargeable batteries and a battery cover, wherein the rechargeable batteries are disposed adjacent to each other, each of the rechargeable batteries has a battery case having a wall portion equipped with an open valve that is constructed so as to open when the inner pressure of the battery case rises up to a threshold value, and the battery cover faces the wall portion. The battery cover has a plurality of cover members provided side by side in a direction toward which the rechargeable batteries are disposed adjacent to each other. The cover members include at least adjacent first and second cover members. The first cover member has a first edge portion and the second cover member has a second edge portion overlapped with the first edge portion. | 2015-12-03 |
20150349307 | METHOD FOR PREPARING A COATED LITHIUM BATTERY COMPONENT - In an example of a method for preparing a coated lithium battery component, the lithium battery component is selected from the group consisting of a porous membrane, a positive electrode, and a negative electrode. The lithium battery component is coated with a precursor. The precursor includes a mixture of an electrolyte solvent, a lithium compound, and a monomer. Coating the lithium battery component forms a precursor coating on the lithium battery component. The precursor coating on the lithium battery component is exposed to a plasma jet, which causes the polymerization of the precursor to form a polymer coating on the lithium battery component. | 2015-12-03 |
20150349308 | Lithium Secondary Battery - Provided is a lithium secondary battery in which a separator is not provided. The lithium secondary battery includes a cathode in which a cathode active material layer is formed on a cathode current collector; an anode in which an anode active material layer is formed on an anode current collector; and an inorganic layer positioned between the cathode and the anode facing each other and containing inorganic particles and a binder. The inorganic layer is in a state in which the inorganic layer is bound to both of the cathode active material layer and the anode active material layer. | 2015-12-03 |
20150349309 | DENSE FLUOROPOLYMER FILM - The present invention pertains to a process for the manufacture of a dense film, said process comprising, preferably consisting of the following steps: a) providing a solid composition [composition (C)] comprising, preferably consisting of: at least one vinylidene fluoride (VDF) fluoropolymer comprising one or more carboxylic acid functional end groups [polymer (F)], at least one poly(alkylene oxide) (PAO) of formula (I): HO—(CH | 2015-12-03 |
20150349310 | POLYMER FOR USE AS PROTECTIVE LAYERS AND OTHER COMPONENTS IN ELECTROCHEMICAL CELLS - Polymers for use as protective layers and other components in electrochemical cells are provided. In some embodiments, the electrochemical cell is a lithium-based electrochemical cell. | 2015-12-03 |
20150349311 | CONVEYING APPARATUS AND A CONVEYING METHOD OF SEPARATOR OF ELECTRIC DEVICE - A conveying apparatus for a separator of an electrical device alternately laminates a first electrode and a second electrode of different polarity from the first electrode, with a separator interposed therebetween to form a laminated body for conveyance. The separator includes a melt material representing a substrate and a heat-resistant material laminated on one surface of the melt material and having a higher melting point than the melt material. The separator conveying apparatus includes a drive member which makes contact with the separator and conveys the separator; and a pressure member which, while urging the drive member via the separator, is driven by the drive member. The drive member makes contact with the melt material portion of the separator. With this separator conveying apparatus, it is possible to maintain constant feed size or dimension of the separator assembly. | 2015-12-03 |
20150349312 | SEPARATOR, METHOD FOR PRODUCING THE SAME AND ELECTROCHEMICAL DEVICE INCLUDING THE SAME - A separator includes a porous substrate, a porous organic-inorganic coating layer formed on at least one surface of the porous substrate, and an organic coating layer formed on the surface of the organic-inorganic coating layer. The porous organic-inorganic coating layer includes a mixture of inorganic particles and a first binder polymer. The first binder polymer contains a copolymer including (a) a first monomer unit including either at least one amine group or at least one amide group or both in the side chain thereof and (b) a (meth)acrylate having a C | 2015-12-03 |
20150349313 | Electrochemical Device and Method of Making the Same - Electrochemical device (e.g., a capacitive device, a battery, or hybrid device) comprising a configuration of layers comprising at least one combination, wherein each combination comprises a porous particulate separator layer disposed between a first porous electrode layer and a second porous electrode layer, and optionally at least one particulate current collector layer, and a liquid electrolyte, wherein all the combinations, optional particulate current collector layers, and liquid electrolyte are encased in a package, and wherein essentially all the liquid electrolyte is confined within the configuration of layers. Capacitive electrochemical device comprising a first combination comprising a porous particulate separator layer disposed between a first porous electrode layer and a second porous electrode layer, optionally at least one particulate current collector layer, and a liquid electrolyte. | 2015-12-03 |
20150349314 | BATTERY PACK - Disclosed herein is a battery pack which includes a plurality of battery modules housed in a housing. The battery modules are connected in series to each other via connecting members that connects external terminals of the battery modules to each other. The battery modules are classified into groups, each being comprised of at least two of the battery modules, two terminal ones of which have a potential difference of at most V or less between themselves. A first connecting member connects the external terminals of the battery modules to each other between two adjacent ones of the groups. A second connecting member connects the external terminals of the battery modules to each other within an identical one of the groups. If water penetrates into the housing, the first connecting member is electrically cut off, preferentially relative to the second connecting member. | 2015-12-03 |
20150349315 | BATTERY POST TERMINAL CONNECTOR - A battery terminal connector and process of manufacture. The battery terminal includes a connector body formed of an alloy comprising up to about 8.8 percent aluminum, up to 0.06 about percent magnesium, up to about 0.075 percent iron, up to about 0.006 percent lead, up to about 0.006 percent cadmium, up to 0.003 percent tin, up to 1.3 percent copper, the balance being zinc, all of said percentages being by weight of the composition. The connector is gravity molded or pressure cast, resulting in a battery terminal connector having high strength and electrical conductivity and good corrosion resistance. | 2015-12-03 |