49th week of 2009 patent applcation highlights part 19 |
Patent application number | Title | Published |
20090294969 | SEMICONDUCTOR CONTACT FORMATION SYSTEM AND METHOD - The present invention is a semiconductor contact formation system and method. Contact insulation regions are formed with multiple etch stop sublayers that facilitate formation of contacts. This contact formation process provides relatively small substrate connections while addressing critical lithographic printing limitation concerns in forming contact holes with small dimensions. In one embodiment, a multiple etch stop insulation layer comprising multiple etch stop layers is deposited. A contact region is formed in the multiple etch stop insulation layer by selectively removing (e.g., etching) some of the multiple etch stop insulation layer. In one embodiment, a larger portion of the multiple etch stop insulation layer is removed close to the metal layer and a smaller portion is removed closer to the substrate. The different contact region widths are achieved by performing multiple etching processes controlled by the multiple etch stop layers in the multiple etch stop insulation layer and spacer formation to shrink contact size at a bottom portion. Electrical conducting material (e.g., tungsten) is deposited in the contact region. | 2009-12-03 |
20090294970 | HIGH FREQUENCY INTERCONNECT PAD STRUCTURE - An integrated circuit includes a high speed circuit, an interconnect pad, a passivation layer under the interconnect pad, a first patterned metal layer, and a first via. The high speed circuit is for a high speed signal at a terminal of the high speed circuit. The interconnect pad is on a top surface of the integrated circuit structure. The first patterned metal layer is under the passivation layer having a first portion and a second portion. The first portion of the first patterned metal layer is connected to the terminal of the high speed circuit. The second portion of the first patterned metal layer is under the interconnect pad and is electrically floating when the high frequency signal is present on the interconnect pad portion. The result is reduced capacitive loading on the high speed signal which improves performance. | 2009-12-03 |
20090294971 | ELECTROLESS NICKEL LEVELING OF LGA PAD SITES FOR HIGH PERFORMANCE ORGANIC LGA - A structure comprises: a substrate; at least one conductor on the substrate; at least one contact pad on the substrate; a mask over the conductor (wherein the mask comprises an opening over the contact pad and wherein the mask comprises a bottom surface contacting the substrate and a top surface opposite the bottom surface); and a contact pad plating layer on the contact pad and within the opening of the mask. The contact pad plating layer comprises a bottom surface contacting the contact pad and a top surface opposite the bottom surface, and the top surface of the contact pad plating layer is coplanar with the top surface of the mask. | 2009-12-03 |
20090294972 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE, METHOD FOR MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE HAVING THE SAME - A method for manufacturing a substrate for a semiconductor package includes the steps of attaching first and second insulation layers which have first surfaces and second surfaces and are formed with conductive layers on the first surfaces, by the medium of a release film which has adhesives attached to both surfaces thereof, such that the second surfaces of the first and second insulation layers face each other; forming first conductive patterns on the first surfaces of the first and second insulation layers by patterning the conductive layers; forming solder masks on the first surfaces of the first and second insulation layers including the first conductive patterns to open portions of the first conductive patterns; and separating the first and second insulation layers from each other by removing the release film. | 2009-12-03 |
20090294973 | INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS HAVING IMPROVED ELECTROMIGRATION CHARACTERISTICS - An interconnect structure for an integrated circuit (IC) device includes an elongated, electrically conductive line comprising one or more segments formed at a first width, w | 2009-12-03 |
20090294974 | BONDING METHOD FOR THROUGH-SILICON-VIA BASED 3D WAFER STACKING - There is described a bonding method for through-silicon-via bonding of a wafer stack in which the wafers are formed with through-silicon-vias and lateral microchannels that are filled with solder. To fill the vias and channels the wafer stack is placed in a soldering chamber and molten solder is drawn through the vias and channels by vacuum. The wafers are held together by layers of adhesive during the assembly of the wafer stack. Means are provided for local reheating of the solder after it has cooled to soften the solder to enable it to be removed from the soldering chamber. | 2009-12-03 |
20090294975 | Package for a Die - A package for a die comprising
| 2009-12-03 |
20090294976 | Method of Manufacuturing Semiconductor Memory Apparatus and Semiconductor Memory Apparatus Manufactured Thereby - A method of manufacturing a semiconductor memory apparatus includes fabricating a cell array to reduce parasite capacitance generated between a bit line and a gate pattern. The method may include determining a plug region by a storage-node plug contact mask and a bit line plug mask. The method may further include: forming a gate pattern of a cell transistor and depositing an insulation layer over a structure including the gate pattern; and forming a hard mask layer over the insulation layer. | 2009-12-03 |
20090294977 | SEMICONDUCTOR DIE AND BOND PAD ARRANGEMENT METHOD THEREOF - A bond pad arrangement method of a semiconductor die is provided. The bond pad arrangement method includes: determining a bond pad architecture including a plurality of bond pads at a peripheral region of the semiconductor die, where each of the bond pads is defined to have a predetermined connection region; controlling an orientation of each bond pad at the peripheral region of the semiconductor die, thereby selectively configuring the predetermined connection region thereof to be electrically connected to one of a plurality of conductive structures included in at least one metal interconnect layer of the semiconductor die; and storing a bond pad design of the bond pads at the peripheral region of the semiconductor die. | 2009-12-03 |
20090294978 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD THEREFOR - To provide a semiconductor device with improved reliability. The semiconductor device includes a wiring board, a microcomputer chip flip-chip bonded over the wiring board via gold bumps, a first memory chip laminated over the microcomputer chip, wires for coupling the first memory chip to the wiring board, an underfill material with which a flip-chip coupling portion of the microcomputer chip is filled, and a sealing member for sealing the microcomputer chip and the first memory chip with resin. Further, the corner of a second opening portion of a solder resist film of the wiring board corresponding to the corner of the chip on the air vent side in charging the underfill material is made close to the microcomputer chip, which can improve the wettability and spread of the underfill material at the second opening portion, thus reducing the exposure of leads to the second opening portion, thereby improving the reliability of the semiconductor device. | 2009-12-03 |
20090294979 | SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - There is provided a method of manufacturing a semiconductor substrate. The method includes: (a) forming a wiring pattern on a substrate; (b) covering the wiring pattern with an insulating resin, thereby forming a first insulating layer; (c) forming a second insulating layer on the first insulating layer; (d) forming a plurality of grooves through the second insulating layer; (e) forming at least one via hole through the first and second insulating layers by irradiating at least one of the grooves with a laser beam; (f) forming a seed metal layer on an inner surface of the at least one via hole, inner surfaces of the grooves, and a surface of the second insulating layer; and (g) forming a plating layer in the at least one via hole and the grooves, by an electrolytic plating using the seed metal layer as a power feeding layer. | 2009-12-03 |
20090294980 | SEMICONDUCTOR DEVICE HAVING WIRING LAYER - Provided is a semiconductor device having a wiring layer formed of damascene wiring. The semiconductor device includes: a first wiring having a width equal to or larger than 0.5 μm; a second wiring adjacent to the first wiring and arranged with a space less than 0.5 μm from the first wiring; and a third wiring adjacent to the second wiring and arranged with a space equal to or smaller than 0.5 μm from the first wiring. In the semiconductor device, the second wiring and the third wiring are structured to have the same electric potential. | 2009-12-03 |
20090294981 | Methods for Defining and Using Co-Optimized Nanopatterns for Integrated Circuit Design and Apparatus Implementing Same - A set of layout nanopatterns is defined. Each layout nanopattern is defined by relative placements of a particular type of layout feature within a lithographic window of influence. A design space is defined as a set of layout parameters and corresponding value ranges that affect manufacturability of a layout. Layouts are created for the set of layout nanopatterns such that the created layouts cover the design space. The layouts for the set of layout nanopatterns are then optimized for manufacturability. A point in the design space is selected where the set of layout nanopatterns are co-optimized for manufacturability. A circuit layout is created based on the selected point in design space using the corresponding set of co-optimized layout nanopatterns. The optimized layouts for the set of layout nanopatterns and the associated circuit layout can be recorded in a digital format on a computer readable storage medium. | 2009-12-03 |
20090294982 | INTERCONNECT STRUCTURES WITH TERNARY PATTERNED FEATURES GENERATED FROM TWO LITHOGRAPHIC PROCESSES - A method for fabricating an interconnect structure for interconnecting a semiconductor substrate to have three distinct patterned structures such that the interconnect structure provides both a low k and high structural integrity. The method includes depositing an interlayer dielectric onto the semiconductor substrate, forming a first pattern within the interlayer dielectric material by a first lithographic process that results in both via features and ternary features being formed in the interconnect structure. The method further includes forming a second pattern within the interlayer dielectric material by a second lithographic process to form line features within the interconnect structure. Hence the method forms the three separate distinct patterned structures using only two lithographic processes for each interconnect level. | 2009-12-03 |
20090294983 | HYBRID CONDUCTIVE VIAS INCLUDING SMALL DIMENSION ACTIVE SURFACE ENDS AND LARGER DIMENSION BACK SIDE ENDS, SEMICONDUCTOR DEVICES INCLUDING THE SAME, AND ASSOCIATED METHODS - A conductive via of a semiconductor device includes a relatively small diameter portion extending into an active surface of a fabrication substrate and a corresponding, relatively large diameter portion that extends into a back side of the fabrication substrate. This type of conductive via may be fabricated by forming the relatively small diameter portion before or during BEOL processing, while the large diameter portion of each conductive via may be fabricated after BEOL processing is complete. Electronic devices that include one or more semiconductor devices with such conductive vias are also disclosed. | 2009-12-03 |
20090294984 | THREE-DIMENSIONAL INTEGRATED HETEROGENEOUS SEMICONDUCTOR STRUCTURE - A first set of semiconductor devices is formed on a first semiconductor substrate comprising a first semiconductor material having a first melting point. A first via-level dielectric layer containing first contact vias is formed on the first semiconductor substrate. A second semiconductor substrate comprising a second semiconductor material having a second melting point lower than the first melting point is formed either by bonding or deposition. A second set of semiconductor devices is formed on the second semiconductor substrate. A second via-level dielectric layer, second contact vias contacting the second set of semiconductor devices, and inter-substrate vias electrically connecting the first contact vias are thereafter formed. A metal interconnect layer containing a metal interconnect structure is formed over the second via-level dielectric layer to electrically connect the first and second set of semiconductor devices through the second contact vias and the inter-substrate vias. | 2009-12-03 |
20090294985 | THIN CHIP SCALE SEMICONDUCTOR PACKAGE - Chip scale semiconductor packages and methods for making and using such semiconductor packages are described. The chip scale packages include multiple terminals that are each disposed on a die back surface that is located opposite to an active area of a semiconductor substrate in the package. The active area can be electrically connected to a plurality of terminals by using traces that may be electrically isolated from the die substrate. In some designs, the terminals can comprise a gate terminal that electrically connected with a gate region of the active area, a source terminal electrically connected with a source region of the active area, and a drain terminal may electrically connected with the die substrate. Other embodiments are also described. | 2009-12-03 |
20090294986 | Methods of Forming Conductive Features and Structures Thereof - Methods of forming features and structures thereof are disclosed. In one embodiment, a method of forming a feature includes forming a first material over a workpiece, forming a first pattern for a lower portion of the feature in the first material, and filling the first pattern with a sacrificial material. A second material is formed over the first material and the sacrificial material, and a second pattern for an upper portion of the feature is formed in the second material. The sacrificial material is removed. The first pattern and the second pattern are filled with a third material. | 2009-12-03 |
20090294987 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - To improve connection reliability of a through electrode in a semiconductor device, and prevent deterioration of electrical characteristics due to a residue generated from a pad at the time of forming the through electrode. A contact area between a pad | 2009-12-03 |
20090294988 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - In a pad forming region electrically connecting an element forming region to the outside, in which a low dielectric constant insulating film is formed in association with in the element forming region, a Cu film serving as a via formed in the low dielectric constant insulating film in the pad forming region is disposed in higher density than that of a Cu film serving as a via in the element forming region. Hereby, when an internal stress occurs, the stress is prevented from disproportionately concentrating on the via, and deterioration of a function of a wiring caused thereby can be avoided. | 2009-12-03 |
20090294989 | FORMATION OF VERTICAL DEVICES BY ELECTROPLATING - The present invention is related to a method for forming vertical conductive structures by electroplating. Specifically, a template structure is first formed, which includes a substrate, a discrete metal contact pad located on the substrate surface, an inter-level dielectric (ILD) layer over both the discrete metal contact pad and the substrate, and a metal via structure extending through the ILD layer onto the discrete metal contact pad. Next, a vertical via is formed in the template structure, which extends through the ILD layer onto the discrete metal contact pad. A vertical conductive structure is then formed in the vertical via by electroplating, which is conducted by applying an electroplating current to the discrete metal contact pad through the metal via structure. Preferably, the template structure comprises multiple discrete metal contact pads, multiple metal via structures, and multiple vertical vias for formation of multiple vertical conductive structures. | 2009-12-03 |
20090294990 | SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor memory device has a plurality of core chips and an interface chip, whose specification can be easily changed, while suppressing the degradation of its reliability. The device has an interposer chip. First internal electrodes connected to core chips are formed on the first surface of the interposer chip. Second internal electrodes connected to an interface chip and third internal electrodes connected to external electrodes are formed on the second surface of the interposer chip. The interface chip can be mounted on the second surface of the interposer chip whenever desired. Therefore, the memory device can have any specification desirable to a customer, only if an appropriate interface chip is mounted on the interposer chip, as is demanded by the customer. Thus, the core chips do not need to be stocked in great quantities in the form of bare chips. | 2009-12-03 |
20090294991 | FLIP-CHIP INTERCONNECTION WITH FORMED COUPLINGS - A flip-chip electrical coupling between first and second electrical components ( | 2009-12-03 |
20090294992 | EMBEDDING DEVICE IN SUBSTRATE CAVITY - An embodiment of the present invention is a technique to reduce interconnect length between devices. A cavity is formed in a substrate having a substrate surface. The cavity has a depth. A first device having a device surface and a thickness is placed into the cavity. The thickness matches the depth such that the device surface is approximately planar with the substrate surface. The first device is attached to a second device via bumps on the second device. | 2009-12-03 |
20090294993 | Packaging substrate structure - A packaging substrate structure is disclosed, which comprises a dielectric material with Young's Modulus less than 1 Gpa and moisture absorption ratio less than 1.0% in a solder mask, an outer dielectric layer or the combination. The package substrate structure improves the stability and the integration of the product. | 2009-12-03 |
20090294994 | BOND PAD STRUCTURE - A bond pad structure located over an active circuit structure is disclosed. The bond pad structure includes a bond pad, a passivation layer and a topmost metal layer in the active circuit structure. The passivation layer covers the bond pad and has an opening, and the opening exposes a part of the bond pad. The part of the topmost metal layer located under the opening serves as a supporting layer. The supporting layer has at least a slot, and the topmost metal layer is electrically connected to the bond pad through a plurality of via plugs. | 2009-12-03 |
20090294995 | OVERLAY MARK - An overlay mark applicable in a non-volatile memory includes two first X-direction isolation structures, two first Y-direction isolation structures, two second X-direction isolation structures, two second Y-direction isolation structures, a first dielectric layer, and a conductive layer. The first X-direction isolation structures, the first Y-direction isolation structures, the second X-direction isolation structures, and the second Y-direction isolation structures are disposed in a substrate. The first X-direction isolation structures and the first Y-direction isolation structures are arranged to a first rectangle, the second X-direction isolation structures and the second Y-direction isolation structures are arranged to a second rectangle, and the second rectangle is located in the first rectangle. The first dielectric layer is disposed on a surface of the substrate. The conductive layer is disposed on the first dielectric layer. | 2009-12-03 |
20090294996 | Gas and Liquid Mixture Generation Apparatus - An object of the present invention is to provide an air bubble generation apparatus constructed in a simple structure and capable of generating fine air bubbles. | 2009-12-03 |
20090294997 | DISTRIBUTOR FOR A GAS-LIQUID CONTACTING VESSEL - One exemplary embodiment can be a distributor for a liquid in a gas-liquid contacting vessel. The distributor can include: | 2009-12-03 |
20090294998 | Method and Apparatus for Producing Embossed Sheet - A method of producing an embossed sheet includes the steps of allowing a flexible strip-shaped sheet to continuously travel, forming a coating layer by coating the surface of the sheet with a radiation curable resin, transferring a pattern of concavities and convexities on the surface of the emboss roller to the coating layer by winding the sheet around the rotating emboss roller, curing the coating layer by irradiating the sheet which is wound around the roller with radiation, releasing the sheet from the emboss roller, laminating a protective film on one or both sides of the continuously traveling sheet after releasing, and taking up the continuously traveling sheet after lamination in the form of a roll. According to the method, a high quality, defect-free embossed sheet having a fine regular pattern of concavities and convexities on the surface can be produced at high line speed with high productivity. | 2009-12-03 |
20090294999 | Method and Apparatus for Modifying an Index of Refraction Within a Material - A method includes: providing an element having mutually exclusive first and second portions with an initial index of refraction; and applying energy to the first portion in a manner causing the index of refraction thereof to change by at least 0.05 in relation to the index of refraction of the second portion. According to one specific approach, the applied energy is laser energy. | 2009-12-03 |
20090295000 | Biaxial-optical polynorbornene-based film and method of manufacturing the same, integrated optical compensation polarizer having the film and method of manufacturing the polarizer, and liquid crystal display panel containing the film and/or polarizer - Disclosed is a method of manufacturing a biaxial polynorbornene-film having a compensation film which has good light transmittance and a uniform in-plane retardation value and can function as both a negative C-plate and an A-plate. | 2009-12-03 |
20090295001 | Systems and Methods for Producing Silicone Hydrogel Contact Lenses From a Polymerizable Composition - Systems and methods of manufacturing ophthalmic lenses, for example, silicone hydrogel contact lenses, are provided. The present systems and methods provide certain amounts of ultraviolet light to contact lens mold assemblies that comprise a silicone hydrogel precursor composition. For example, the systems and methods may provide ultraviolet light at an intensity from 20 μW/cm | 2009-12-03 |
20090295002 | Process for the manufacture of an ophthalmic lens - A process for the manufacture of an ophthalmic lens, e.g. a contact lens, comprises the steps of: | 2009-12-03 |
20090295003 | RESIN COMPOSITION FOR OPTICAL COMPONENTS, OPTICAL COMPONENT USING THE SAME AND PRODUCTION METHOD OF OPTICAL LENS - The present invention relates to a resin composition for optical components, which is an ultraviolet-curable transparent resin composition used as a material for an optical component, in which the resin composition includes (A) an epoxy resin having two or more epoxy groups in one molecule thereof, (B) an oxetane compound having one or more oxetanyl groups in one molecule thereof and (C) a photo-acid generator, and in which the component (C) is contained in an amount of 0.01 to 2.0 parts by weight based on 100 parts by weight of a total amount of the components (A) and (B). The present invention also relates to an optical component obtained by using the resin composition for optical components, and a production method thereof. | 2009-12-03 |
20090295004 | SILICONE HYDROGEL CONTACT LENSES DISPLAYING REDUCED PROTEIN UPTAKE - The present invention relates to silicone hydrogel contact lenses formed from a reactive mixture comprising at least one silicone containing compound and a protein uptake reducing amount of at least protein uptake reducing compound. | 2009-12-03 |
20090295005 | PROCESS FOR THE SYNTHESIS OF NANOSIZE METAL-CONTAINING NANOPARTICLES AND NANOPARTICLE DISPERSIONS - The invention relates to a process for producing morphologically uniform and virtually monodisperse metal-containing nanoparticles, characterized in that the separation both in time and space of the nucleation and growth processes is achieved by regulation of the temperature and volume flows, with the reaction and particle formation preferably being initiated and carried out in a suitable microstructured modular reactor system. Modularization of the microreaction plant (micro heat exchanger, residence reactor, micromixer, etc.) allows optimal setting of the respective chemical and process-engineering process parameters and thus the preparation of virtually monodisperse and morphologically uniform nanoparticles. | 2009-12-03 |
20090295006 | TRANSFER APPARATUS AND METHOD OF MANUFACTURING DEVICE - A transfer apparatus, for molding a resin on a substrate using a mold on which a pattern is formed and releasing the mold from the resin to transfer the pattern onto the substrate, includes a charge removing device configured to remove a charge of the mold, and a detector configured to detect an electric potential of the mold. The charge removing device is configured to remove the charge of the mold if the electric potential of the mold detected by the detector is not less than a predetermined value. | 2009-12-03 |
20090295007 | High Porosity Cordierite Honeycomb Articles - Methods of making a porous cordierite ceramic honeycomb article are provided. In example methods, a batch composition includes a quantity of non-crosslinked pore former provided as a superaddition of about 20% or less of a dry weight of a quantity of inorganic components. Batch compositions are also provided that include a quantity of clay and other substantially nonfibrous inorganic components sufficient to yield an article including cordierite. Example batch compositions can include clay having a median particle size of about 7 μm or less and/or provided in an amount that is 10% or less of the dry weight of the quantity of inorganic components. | 2009-12-03 |
20090295008 | Use of thermoplastic composing polyethlene glycol as additive - The present invention discloses the use in rotomolding or slush molding applications of a composition comprising a polyolefin, a processing aid and optionally a UV-stabilizer. | 2009-12-03 |
20090295009 | METHOD FOR MANUFACTURING CERAMIC FILTER - Honeycomb ceramic wall flow filters exhibiting reduced plug depth variability, produced by introducing flowable ceramic plugging cements into the ends of selected channels in the honeycombs and wherein the ceramic plugging cements consist of shear-conditioned mixtures exhibiting reduced viscosity differentials. | 2009-12-03 |
20090295010 | DIRECT APPLICATION OF SURFACE TREATMENT TO A MOLTEN PARISON - A system for forming a molded object out of a plastic material includes an extrusion die assembly for forming a molten parison, a molding assembly for molding the molten parison into a molded article and a surface treatment assembly for changing the surface energy of at least a portion of a molten parison while the parison is in a molten state. The surface treatment assembly is interposed between the extrusion die assembly and the molding assembly to permit a surface energy of the parison to be changed prior to molding. This facilitates printing on the molded article while the molded article is still in the mold assembly. A method of making a molded object out of a plastic material is also disclosed. | 2009-12-03 |
20090295011 | Vehicle component and method for making a vehicle component - The invention is also directed to a method for forming a component for a vehicle. The method comprises forming a substrate in a mold by injecting a first resin into a first cavity, reconfiguring a portion of the mold to form a second cavity, and injecting a second resin into a second cavity; providing a flexible member adjacent at least a portion of the substrate to form a cavity between the substrate and the flexible member; coupling at least a portion of the flexible member to the substrate; and introducing a material into the cavity after securing at least a portion of the flexible member to the substrate. The flexible member and the material introduced into the cavity form a cushioned region for the vehicle component | 2009-12-03 |
20090295012 | SEPARATING PLATE FOR POLYMER ELECTROLYTE MEMBRANE FUEL CELL AND METHOD FOR MANUFACTURING THE SAME - A separating plate for polymer electrolyte membrane fuel cell and a method for manufacturing the same is provided. Preferred separating plates for polymer electrolyte membrane fuel cell are capable of being light weight and corrosion resistant, as well as being economical to produce and exhibit good physical properties. Preferred separating plates are produced with compositions comprising graphite and phenolic resin. | 2009-12-03 |
20090295013 | METHOD AND APPARATUS FOR MANUFACTURING PLASTIC PRODUCTS - A method for manufacturing plastic products, wherein a mold is used having at least one mold cavity with internally moving parts, which moving parts are brought at least partly in a retracted position, wherein plastic granules, in particular powder or a mixture of powder and granules, are introduced into the mold and at least one said moving part is moved in the mold cavity, preferably subsequently, such that the granules, in particular the powder or mixture, are compressed at least partly and melt at least partly. | 2009-12-03 |
20090295014 | SPINNING APPARATUS, AND APPARATUS AND PROCESS FOR MANUFACTURING NONWOVEN FABRIC - A spinning apparatus comprising one or more exits for extruding liquid, and an exit for ejecting gas, located upstream of the exits for extruding liquid, wherein the apparatus comprises a columnar hollow for liquid, in which the exit for extruding liquid forms one end of the columnar hollow; the apparatus comprises a columnar hollow for gas having the exit for ejecting gas; a virtual column for liquid, extended from the columnar hollow for liquid, is adjacent to a virtual column for gas, extended from the columnar hollow for gas; the central axis of the columnar hollow for liquid is parallel to the central axis of the columnar hollow for gas; and there exists only one straight line having the shortest distance between an outer boundary of the cross-section of the columnar hollow for gas and an outer boundary of the cross-section of the columnar hollow for liquid, is disclosed. | 2009-12-03 |
20090295015 | FLEXIBLE TOOLING METHOD AND APPARATUS - A molding apparatus comprises an upper molding box, a lower mold box, an upper flexible membrane covering an opening of the upper mold box, a lower flexible membrane covering an opening of the lower mold box, a heating system located in the upper mold box, a set of ports located between the upper flexible membrane and the lower flexible membrane capable of being used to draw a vacuum between the upper flexible membrane and the lower flexible membrane, and a displacement system located in the lower mold box under the lower flexible membrane. | 2009-12-03 |
20090295016 | PROCESS AND APPARATUS FOR PRODUCING THERMOPLASTIC RESIN PELLETS - An object of the present invention is to provide a process for producing thermoplastic resin pellets, which realizes production of pellets of uniform shape. Another object of the present invention is to provide an apparatus for producing the thermoplastic resin pellets. The invention provides a process for producing thermoplastic resin pellets, including pressurizing the interior of a vessel holding a molten thermoplastic resin, thereby discharging the resin; forming pellets through solidification and cutting of the resin; and transferring the pellets to a storage container via a pipe by a pneumatic transportation or a suction transportation, wherein the amount of the resin discharged is regulated by controlling the pressure in the vessel so that variation in the difference pressure between the inlet and the outlet of the pipe for transferring the pellets is 10% or less. | 2009-12-03 |
20090295017 | SHEET FORMING APPARATUS AND SHEET FORMING METHOD - A sheet forming apparatus includes a first roll | 2009-12-03 |
20090295018 | OIL-REMOVING JIG AND METHOD FOR MANUFACTURING FORMED BODY USING THE SAME - There is provided an oil-removing jig for removing oil applied on an outer peripheral face of kneaded clay extruded from a kneader to have a cylindrical shape for the purpose of inhibiting drying prior to feeding the kneaded clay into an extrusion-forming apparatus. The jig includes a tabular rubber plate having a through-hole having a diameter 5 to 30 mm smaller than that of the kneaded clay, and two support plate each having a through-hole having a diameter 25 to 95 larger than that of the kneaded clay and 40 to 100 mm larger than that of the through-hole of the aforementioned rubber plate; and the rubber plate is held between the two support plates and fixed in a state that centers of the through-holes coincide with one another. | 2009-12-03 |
20090295019 | Polymer gel-processing techniques and high modulus products - The present invention provides polymer gel-processing techniques and polymer articles of high modulus. | 2009-12-03 |
20090295020 | Apparatus and Die Cartridge Assembly Adapted for Use Therewith, and Process for Producing Fibrous Materials - Apparatus ( | 2009-12-03 |
20090295021 | EXTRUSION OF POLYURETHANE COMPOSITE MATERIALS - Methods of extruding polyurethane composite materials are described. One method includes introducing at least one polyol and organic and/or inorganic filler to a first conveying section of the extruder, transferring the at least one polyol and organic and/or inorganic filler to a first mixing section of an extruder, mixing the at least one polyol and the organic and/or inorganic filler in the first mixing section, transferring the mixed at least one polyol and organic and/or inorganic filler to a second conveying section of the extruder, introducing a di- or poly-isocyanate to the second conveying section, transferring the mixed at least one polyol and organic and/or inorganic filler and the di- or poly-isocyanate to a second mixing section, mixing the mixed at least one polyol and organic and/or inorganic filler with the di- or poly-isocyanate in the second mixing section of the extruder to provide a composite mixture, and transferring the composite mixture to an output end of the extruder. In some embodiments, the method may include pre-mixing a combination of an isocyanate and a polyol before introducing the mixture into the extruder. Some embodiments provide a method of forming a reinforced polymeric composite material in an extruder by pre-heating reinforcing fibers before introducing them to the extruders. Some embodiments provide a method of forming a polymeric composite material in an extruder, wherein the extruder die rotates while its inner surface in movable contact with a fixed solid component to reduce the amount of composite material that accumumlates on the inner surface of the die. Other related methods are also described. | 2009-12-03 |
20090295022 | Composites of repeat sequence proteins and their preparation - A composite of one or more repeat sequence protein polymers and either one or more metal oxides or one or more plasticizers alters material properties of the repeat sequence protein polymers, including the morphology of the polymers as well as the elastic modulus and tensile strength. The morphology of the composite is aligned, generally parallel nanofibers. | 2009-12-03 |
20090295023 | INJECTION MOLDING METHOD AND MOLD FOR INJECTION MOLDING - There is provided a mold for injection molding for manufacturing a resin injection-molded product. A provisional rib portion corresponding to a provisional rib which is to be formed to project from a portion, of the molded product, not serving as a design surface is formed at a predetermined position of a cavity so as to extend along the provisional rib, wherein resin is injected for molding to the provisional rib portion via a gate. The gate is formed as a submarine gate or a nose gate. | 2009-12-03 |
20090295024 | NANOIMPRINT MOLD - The nanoimprint mold of the invention comprises a liquid crystal substance and has an indentation surface on which a relief structure is formed by orientation of the liquid crystal substance. The nanoimprint mold can be easily produced without providing joints, even when the area of the transfer indentation surface is large. | 2009-12-03 |
20090295025 | Plastic object for use in personal hygiene - A unitary two component article for personal hygiene, such as a toothbrush, wherein the same is formed by injection molding of two differing plastic materials. The plastics do not adhesively or chemically bond to each other. The two differing plastic parts of the toothbrush are mechanically connected, such as by interfitting portions of the two plastic components or by shrinking one plastic component about the other. | 2009-12-03 |
20090295026 | SYSTEM FOR SUPPLYING AN INTERNAL COMBUSTION ENGINE AND METHOD OF MANUFACTURING A TANK COMPRISED IN THE SYSTEM - System for supplying an internal combustion engine with a liquid fuel, comprising a tank, a pipe for the circulation of hot fuel between the engine and the tank and at least one sealed composite junction conduit for joining the pipe to the tank. The composite junction conduit comprises at least two hollow components each based on a different plastic, the said components being mechanically attached to each other and in communication with each other and include, between them, an overmoulded seal. | 2009-12-03 |
20090295027 | SYSTEM AND METHOD OF SEALING ELECTRICAL COMPONENTS IN A FRAME TRAY - Electrical components mounted onto a circuit board may be sealed within a frame tray upon the addition of a curable material that encapsulates the circuit board. The electrical components of the circuit board are positioned and sealed within the frame tray such that the cured material does not affect an airflow path which dissipates heat produced by the electrical components during use. The curing of the curable material shields the circuit board from moisture, dust and other environmental contaminates. | 2009-12-03 |
20090295028 | Process and apparatus for making multi-layered, multi-component filaments - The present invention is directed to a process for forming a plurality of multi-layered filaments from multiple thermoplastic synthetic polymers and an apparatus containing a melt spinning beam which comprises multiple polymer inlet passages each communicating with separate multiple coat hanger distribution manifolds, separate filters connected downstream of each coat hanger distribution manifold, a combining manifold connected downstream of the filters and containing channels to retard polymer flow across planar molten polymer flow streams and a spinneret comprising a plurality of spinneret exit orifices connected downstream of the combining manifold for spinning of the multi-layered filaments. | 2009-12-03 |
20090295029 | SYSTEM AND METHOD OF MOULDING AND ASSEMBLING A FLUID PRODUCT SPRAY DEVICE - A system for molding and assembling a fluid spray device, said system comprising two multi-cavity molds (B, C; B′; C′) for molding two different parts ( | 2009-12-03 |
20090295030 | METHOD AND APPARATUS FOR STRETCHING AND CRYSTALLIZING THE NECK FINISH OF A MOLDED PLASTIC ARTICLE - Apparatus and method for making a molded plastic article having a stretched and crystallized neck finish. In one embodiment, a series of platforms are carried by a conveying apparatus for transporting a series of molded plastic articles along a predetermined path of travel through one or more treatment stations. At a finish widening station, the molded article, having a relatively wide and thin-walled blow-molded body portion, and a relatively narrow and thick-walled unexpanded neck finish portion, is positioned to enable insertion of a mandrel into an open top aperture of the finish portion to widen the finish. The mandrel may include a lower heated tapered portion for expanding the finish, and an upper cooled body portion on which the expanded finish may be cooled. The article may then be sent to a finish crystallizing station having a heating device that heats the widened finish portion for a time and temperature selected to crystallize at least a portion of the widened finish. A sizing mechanism positionable in the widened finish supports the finish during crystallization. | 2009-12-03 |
20090295031 | METHOD AND APPARATUS FOR CASTING A CONCRETE PRODUCT - Method and apparatus for casting a concrete product with a substantially horizontal slipform casting process, concrete mix in said method being fed by means of at least one feed screw ( | 2009-12-03 |
20090295032 | Method of building three-dimensional object with modified ABS materials - A method for building a 3D object with an extrusion-based layered deposition system comprising feeding a modified ABS material to an extrusion head of the extrusion-based layered deposition system, melting the fed modified ABS material in the extrusion head under conditions that improve a response time of the extrusion head, and depositing the molten thermoplastic material in a layer-by-layer manner to form the 3D object. | 2009-12-03 |
20090295033 | METHOD OF MANUFACTURING FORMED ARTICLE, SUPPORT MEMBER, AND FORMING APPARATUS - The present invention relates to a method of manufacturing a formed article comprising forming an upper surface of a forming material comprised of a thermosoftening substance into a desired shape by positioning the forming material on a forming surface of a mold and heating the forming material to a temperature permitting deformation to bring an entire surface of a lower surface of the forming material into tight contact with the forming surface. The positioning of the forming material is conducted by supporting the forming material with a support member so that at least a portion of a lower surface rim portion of the forming material is in tight contact with the forming surface and a center portion of the lower surface of the forming material is separated from the forming surface, and the support with the support member is conducted so that a lower portion of a lateral surface of the forming material is separated from the support member and at least a portion of an upper edge portion of the lateral surface of the forming material is supported by the support member. According to the present invention, a formed article with a desired shape can be manufactured with high precision by hot sag forming method. | 2009-12-03 |
20090295034 | METHOD OF MAKING ACTIVATED CARBON MONOLITH - A process for making activated carbon monolith using PTFE as binder is disclosed and described. The process includes carbon-PTFE paste preparation, shearing the paste in a calender with hot rollers, and forming carbon monoliths using compression shaping equipment. | 2009-12-03 |
20090295035 | TOTAL KNEE JOINT MOLD AND METHODS - In one embodiment, a method for treating an infected implant area of a knee joint comprises surgically accessing the implant area, and inserting a tibial component into the tibia using an antibiotic-impregnated material. A femoral component is formed that is configured to interact with the tibial component by stable knee joint articulation and motion. The femoral component is formed of an antibiotic-impregnated material using a mold. The femoral component is attached to the femur using an antibiotic-impregnated material, and the tibial component is interfaced with the femoral component to form a stable temporary knee joint capable of reducing the spread of infection while permitting movement of the knee joint. | 2009-12-03 |
20090295036 | Ultra high-temperature plastic package and method of manufacture - A package for microelectronic circuits includes a frame made of a high molecular weight plastic material, such as a liquid crystal polymer (LCP), attached to a flange, or leadframe. The plastic material is injection molded to the flange. Initial polymerization of the plastic material can occur in a liquid state and results in an intermediate material having an initial melting temperature. After the frame is injection molded, the frame is heated and undergoes further (secondary) polymerization, thereby lengthening polymer chains in the plastic material. These longer polymer chains have higher molecular weight, and the resulting final material has a higher melting temperature, than the intermediate material. The resulting ultra-high molecular weight polymer can withstand high temperatures, such as those encountered during soldering. Thus, after the further (secondary) polymerization, a die can be soldered to the flange, without damaging the plastic frame. | 2009-12-03 |
20090295037 | SYSTEM AND PROCESS FOR IN-MOLD DECORATION OF AN ARTICLE - A system for making a decorated plastic article includes a mold assembly for forming the plastic article. The mold assembly includes at least one internal molding surface. A print head is provided in order to print a decoration on the article while the article is still in the mold. The printhead may be integrated into the wall of the mold assembly, or it may be used to print an ink pattern on the internal molding surface that is subsequently transferred to the article during the molding process. | 2009-12-03 |
20090295038 | Vinylidene fluoride resin monofilament and process for producing the same - A monofilament obtained by smelt-spinning and stretching of a vinylidene fluoride resin is subjected to a high-temperature relaxation treatment for an extremely short period of 0.05-0.5 sec. within a high-temperature heating oil bath at a temperature of 140-175° C., thereby producing a vinylidene fluoride resin monofilament, which comprises a vinylidene fluoride resin having an inherent viscosity of at least 1.40 dl/g, and has a knot strength (JIS L1013) of at least 600 MPa and excellent anti-twist property represented by a twist index of at least 0.90 when measured after the monofilament being subjected to application for 1 minute of a tensile load equal to approximately 50% of a maximum tensile load (JIS K7113), removal of the load, and standing for 3 hours. | 2009-12-03 |
20090295039 | Device for layerwise manufacturing of a three-dimensional object - An apparatus for layerwise manufacturing of a three-dimensional object ( | 2009-12-03 |
20090295040 | Workpiece forming - A method of forming a workpiece ( | 2009-12-03 |
20090295041 | PRINTING FORM PRECURSOR AND PROCESS FOR PREPARING A STAMP FROM THE PRECURSOR - The invention pertains to a printing form precursor and a method for preparing a stamp from the precursor for use in soft lithographic applications. The printing form precursor includes a composition layer of a fluorinated compound capable of polymerization upon exposure to actinic radiation and a flexible support transparent to the actinic radiation adjacent the composition layer. | 2009-12-03 |
20090295042 | Selective sintering of structurally modified polymers - A three-dimensional object is manufactured by selective sintering by means of electromagnetic radiation, wherein the powder comprises a polymer or copolymer having at least one of the following structural characteristics:
| 2009-12-03 |
20090295043 | IN-MOLD PUNCH APPARATUS AND METHODS - A mold is provided for forming a continuously-extruded parison into a corrugated pipe. The mold includes a mold housing having a plurality of bores, a mold cavity having a plurality of annular corrugations, and a plurality of punches. Each punch is disposed in one of the bores and aligned with one of the annular corrugations of the mold cavity. Each punch is also configured to form an aperture in a corrugation of a corrugated pipe in the mold. A continuous extrusion blow molding system and a method are also provided for forming a hollow plastic product and punching a continuously-extruded, blow molded product before it is released from a mold. | 2009-12-03 |
20090295044 | Method For Marking Ceramic Structures - A method is provided for marking a structure containing an ceramic-forming component by applying onto a green body a high temperature ink that has a metal-containing species and a metal complexing agent, wherein the metal in the metal-containing species reacts with the ceramic-forming component during firing of the green body to produce a compound that forms a contrasting mark on the resulting ceramic structure. A method is also provided for marking a ceramic-forming green body by applying a two-dimensional dot matrix mark formed of a high temperature ink onto a surface of the ceramic-forming green body, wherein each dot of the two-dimensional dot matrix is formed of a single drop of the high temperature ink. | 2009-12-03 |
20090295045 | PROCESS FOR MAKING CERAMIC INSULATION - A method is provided for producing insulation materials and insulation for high temperature applications using novel castable and powder-based ceramics. The ceramic components produced using the proposed process offers (i) a fine porosity (from nano-to micro scale); (ii) a superior strength-to-weight ratio; and (iii) flexibility in designing multilayered features offering multifunctionality which will increase the service lifetime of insulation and refractory components used in the solid oxide fuel cell, direct carbon fuel cell, furnace, metal melting, glass, chemical, paper/pulp, automobile, industrial heating, coal, and power generation industries. Further, the ceramic components made using this method may have net-shape and/or net-size advantages with minimum post machining requirements. | 2009-12-03 |
20090295046 | ALUMINUM NITRIDE POWDER AND ALUMINUM NITRIDE SINTERED COMPACT - The present invention relates to a process of producing an aluminum nitride sintered body which satisfies both high thermal conductivity and reduction in the shrinkage factor at the time of sintering. The aluminum nitride sintered body is a sintered body of a powder mixture containing an aluminum nitride powder and a sintering aid, characterized by having a thermal conductivity of at least 190 W/m·K and a shrinkage factor represented by the percentage of {(dimensions of the molded body before sintering)−(dimensions of the sintered body after sintering)}/(dimensions of the molded body before sintering) of at most 15%. | 2009-12-03 |
20090295047 | METHOD FOR MANUFACTURING SINTERED COMPACT, SINTERED COMPACT MANUFACTURED BY THE METHOD AND CELL CULTURE BASE FORMED FROM THE SINTERED COMPACT - A method for manufacturing a sintered compact having high density, and a sintered compact manufactured by the manufacturing method are provided. The manufacturing method comprises the steps of preparing hydroxyapatite powder, molding a green compact, shaping the green compact, and sintering the green compact. Further, a method for manufacturing a sintered compact having high light permeability, and a sintered compact manufactured by the manufacturing method are provided. The manufacturing method comprises the steps of preparing hydroxyapatite powder, molding a green compact, shaping the green compact, primary sintering, and secondary sintering. Furthermore, a cell culture base formed from the sintered compact described above is provided, by which affinity of various cells with bone can be properly determined. Moreover, a cell culture base by which affinity of various cells with bone can be properly determined is provided. The cell culture base is mainly composed of a calcium phosphate based compound, and is highly compacted. | 2009-12-03 |
20090295048 | Composite material and method of manufacturing the same - A composite material according to the invention includes X parts by volume of boron carbide, Y parts by volume of silicon carbide, and Z parts by volume of silicon as main components, wherein 102009-12-03 | |
20090295049 | Filter - A filter includes a crucible, a filtering container, and a receiving tank. The crucible has a heater for heating a pre-filtered object to comprise a primary material in liquid and at least one other material in solid. The filtering container has a body, a sieve, and a press rod. The body connects with the crucible for receiving the heated pre-filtered object in a channel and provides a guide-out member; the sieve is disposed in said channel; and the press rod movably received in the channel for pressing the primary material of the pre-filtered object to flow through the sieve and to the guide-out member. The receiving tank has an entrance facing the guide-out member of the filtering container to receive the filtered primary material. | 2009-12-03 |
20090295050 | Electromagnetic Active Engine Mount Apparatus - An electromagnetic active engine mount apparatus includes a sub-channel through which working fluid flows is formed in the central portion of an electromagnetic drive so as to be able to cool heat generated from the coil of a solenoid section of the electromagnetic drive by repetitive operation of a vibrating member. Thus, the electromagnetic active engine mount apparatus can inhibit the heat generated from the coil to thus prevent thermal damage to various components formed of rubber, and provide improvement of its durability, reduction of its size, and simplification of its structure. | 2009-12-03 |
20090295051 | INSULATOR FOR BUSHING - An insulator for a bushing may include a plurality of insulator bodies, a center hole formed to each insulator body for coupling the insulator bodies of the bushing to a bushing bracket, and operation slot being formed on each insulator body, wherein the insulator bodies are separately and relatively-rotatably coupled each other. | 2009-12-03 |
20090295052 | Device For Displacing Jaws Of A Clamp - A mechanical device for displacing jaws of a spring biased clamp includes a housing for receiving handles of the spring biased clamp. The housing has a platform moveable toward and away from a wall to move the handles of the clamp toward and away from one another, to move the jaws of the clamp away from and toward one another, respectively. A control member activates and deactivates a force applying member operationally connected to the platform, wherein activating the force applying member moves the platform toward the wall and deactivating the force applying member moves the platform away from the wall of the housing. The device is used to apply clamps to marginal edge portions of a stack of two one or more sheets to provide a clamped subassembly. The clamped subassembly in one embodiment is laminated to provide an aircraft transparency. | 2009-12-03 |
20090295053 | ADJUSTABLE SUPPORT TOOLING APPARATUS - A system and method for manufacturing that provides for adjustable support of work pieces such as printed circuit boards includes an edge rail system having first and second edge rails, with at least one of the edge rails being adjustable, allowing the width of the system to be adjusted to accommodate various widths of work pieces. It also includes a set of support strips for supporting a lower side of the work pieces and a means for dynamically adjusting spacing of support strips to adjust to the width of the edge rail system. | 2009-12-03 |
20090295054 | SUPPORT DEVICE FOR SPUTTERING MACHINE - A support device used in sputtering machine includes a chamber housing, a frame, at least one holding device, a first and second driving assemblies. The frame is rotatably mounted in the chamber housing. The holding device is rotatably mounted on the frame. The first driving assembly is received in the chamber housing and includes a first motor mounted on the chamber housing and a first shaft installed on the first motor. The first driving assembly is configured for driving the frame rotating in a plane by the first shaft. The second driving assembly is received in the chamber housing and includes a second motor mounted on the chamber housing and second shaft installed on the second motor. The second shaft adjacently parallels to the first shaft. The second driving assembly is configured for driving the at least one holding device rotating in a plane perpendicular to the rotating plane of the frame. | 2009-12-03 |
20090295055 | ADAPTER FOR A MAGNETIC CLAMP - An adapter ( | 2009-12-03 |
20090295056 | JIG - A jig intended to in use hold a set of blanks ( | 2009-12-03 |
20090295057 | SHEET MONITOR FOR FOLDING MACHINE - A folding machine includes: pairs of upper and lower downstream-side conveying belts ( | 2009-12-03 |
20090295058 | SPLITTING DEVICE - A device for distributing successive products of a product flow, particularly the successive folding products produced by a cross cutting device by dividing a material web, to two branch flows, with a wedge arrangement which is arranged in a stationary manner in the transporting plane of the product flow and which engages between two cam rollers which flank it and which are arranged symmetrically with respect to the center working plane. The device is characterized in that the wedge arrangement engages between two guide plates which flank it and which, together with the wedge arrangement, define a path fork. The guide plates have slots through which they are alternately penetrated by cams of the respective adjacent cam roller which are associated with the slots, so that the penetrating cams and the guide plate which is not penetrated form a feed for a belt guide associated with a branch flow. | 2009-12-03 |
20090295059 | Saddle stitcher with individual stitcher drives - A saddle stitching device including a saddle-back conveyor having a first printed product location and a second printed product location adjacent the first printed product location, a first stitcher adjacent the conveyor and driven by a first motor, and a second stitcher adjacent the conveyor and driven by a second motor. | 2009-12-03 |
20090295060 | TRANSPORT DEVICE FOR IMAGE RECORDING APPARATUS AND METHOD OF CORRECTING TRANSPORT SPEED IN TRANSPORT DEVICE FOR IMAGE RECORDING APPARATUS - A transport device is provided which uses a linear motor mechanism ( | 2009-12-03 |
20090295061 | Sheet discharge device and image forming apparatus - A sheet discharge device discharges a sheet to a sheet discharge tray. The sheet discharge device includes a rotary shaft, two inside drive rollers, two outside drive rollers, two inside driven rollers, two outside driven rollers, two end retainers, and two inside retainers. The drive rollers are rotatably attached to the rotary shaft. Each of the driven rollers opposes a corresponding one of the drive rollers to be driven by the drive roller. The end retainers and the inside retainers rotatably extend from the rotary shaft across a common tangent of the driven rollers and the drive rollers. The end retainers are longer than the inside rollers and constructed so as to rest on the stacked sheets. | 2009-12-03 |
20090295062 | AUTOMATIC SHEET FEEDER AND SCAN APPARATUS WITH ASSEMBLIES FOR TRANSPORTING SHEET AT DIFFERENT SPEEDS - An automatic sheet feeder includes a sheet passageway, an opening formed in the sheet passageway and a sheet transporting mechanism. The sheet transporting mechanism transports a sheet through the sheet passageway. The sheet transporting mechanism includes a first transporting assembly and a second transporting assembly, which is disposed downstream of the first transporting assembly. The first transporting assembly transports the sheet to the opening at a first speed, and the second transporting assembly transports the sheet away from the opening at a second speed higher than the first speed. A scan apparatus using the automatic sheet feeder is also disclosed. | 2009-12-03 |
20090295063 | SHEET FEEDING DEVICE - A sheet feeding device includes a sheet support, a restricting portion, a displacement section, and a link section. The restricting portion slides along a line passing through restricting points. The restricting portion restricts the position of the sheet when the restricting portion is positioned at each of the restricting points. The link section interlinks the restricting portion and the displacement section. The position of the displacement section is detected. The link section, which interlinks the restricting section and the displacement section, is configured to change a ratio of a distance that the displacement section travels as the restricting section travels a fixed distance, wherein the ratio of the distance between those restricting points which define a relatively large spacing therebetween becomes longer than the ratio of the distance between those restricting points which define a relatively small spacing therebetween. | 2009-12-03 |
20090295064 | SHEET CONVEYING APPARATUS - To provide a sheet conveying apparatus capable of preventing meandering of a belt. A flange roller arranged at an entrance of sheets is used for a conveying roller immediately before a flange roller for feeding conveying rollers to a first conveying path for conveying the sheets. Namely, the flange roller is arranged just closely to an upstream side of the conveying belts arranged on the flange roller in a rotational direction. Further, a flange roller arranged at an exit of the sheets is used for a conveying roller immediately after a flange roller for feeding the conveying rollers finishing conveyance of the sheets on a second conveying path for discharging the sheets. Namely, the flange roller is arranged just closely to a downstream side of the conveying belts arranged on the flange roller in the rotational direction. | 2009-12-03 |
20090295065 | SHEET FEEDING DEVICE, AND DOCUMENT FEEDING APPARATUS AND IMAGE FORMING APPARATUS EQUIPPED THEREWITH - A sheet feeding device for a document feeding apparatus includes: a sheet containing section; a lift plate for lifting sheets stacked in the sheet containing section between a sheet feeding position and a sheet loading position; a sheet feeding section for separating and feeding the sheets in the sheet feeding position one after another; and a lifting mechanism for lifting up and down the lift plate, the lifting mechanism including: a biasing member for biasing the lift plate toward the sheet feeding section; a cam, having an outer peripheral surface with a cam curve, coupled with a driving force source and being rotated thereby; and an operating lever so provided independently of and between the lift plate and the cam as to abut the outer peripheral surface of the cam and to simultaneously press the lift plate against a biasing force of the biasing member, thereby to change a posture of the lift plate between the sheet feeding position and the sheet loading position. | 2009-12-03 |
20090295066 | FEEDING DEVICE AND PRINTING APPARATUS - A feeding device includes a pickup roller that picks up a loaded feeding medium and sends the feeding medium to a downstream side of a feeding direction and a regulator that is provided at a location different from the pickup roller in a widthwise direction of the feeding medium and regulates the posture of the feeding medium by moving relative to the pickup roller so as to contact with or separate from the feeding medium and being urged in a direction of approaching the feeding medium. | 2009-12-03 |
20090295067 | MEDIUM FEEDING DEVICE AND RECORDING APPARATUS - A medium feeding device includes a feed roller pair, a transport roller, a medium guiding path section, and a controller. The feed roller pair includes a feed driving roller driven by power and a feed driven roller to be rotationally driven, and feeds a medium to be fed toward the downstream side in a feed direction. The feed driving roller and the feed driven roller are separated from each other. The transport roller pair transports the medium, which is fed by the feed roller pair, toward the downstream side in the feed direction. The transport roller pair includes a transport driving roller that is disposed on the downstream side of the feed roller pair in the feed direction and is driven by power and a transport driven roller that is rotationally driven. | 2009-12-03 |
20090295068 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A holding mechanism which holds a rear end restricting plate at the restricting position in accordance with the sheet size is configured with a first rack tooth row and a second rack tooth row. The first rack tooth row and the second rack tooth row are arranged at the bottom surface of a cassette body to be the same height along the sheet restricting direction and a first tooth row and a second tooth row are arranged at a restricting member to be the same height along the sheet restricting direction. | 2009-12-03 |