48th week of 2019 patent applcation highlights part 57 |
Patent application number | Title | Published |
20190363025 | STRUCTURE FOR IMPROVING DIELECTRIC RELIABILITY OF CMOS DEVICE | 2019-11-28 |
20190363026 | Channel Strain Formation in Vertical Transport FETS with Dummy Stressor Materials | 2019-11-28 |
20190363027 | ASSESSMENT METHOD, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2019-11-28 |
20190363028 | DISPLAY SUBSTRATE, METHOD FOR FORMING DISPLAY SUBSTRATE AND METHOD FOR DETECTING THE SAME | 2019-11-28 |
20190363029 | POWER SEMICONDUCTOR MODULE | 2019-11-28 |
20190363030 | ELECTRONIC COMPONENT WITH SHIELD PLATE AND SHIELD PLATE OF ELECTRONIC COMPONENT | 2019-11-28 |
20190363031 | MODULE COMPONENT | 2019-11-28 |
20190363032 | CHIP ON FILM PACKAGE | 2019-11-28 |
20190363033 | IGBT HEAT DISSIPATION STRUCTURE | 2019-11-28 |
20190363034 | SUBSTRATE | 2019-11-28 |
20190363035 | BOILING COOLING DEVICE | 2019-11-28 |
20190363036 | COOLING APPARATUS, SEMICONDUCTOR MODULE, VEHICLE, AND MANUFACTURING METHOD | 2019-11-28 |
20190363037 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-11-28 |
20190363038 | LDMOS Transistor and Method | 2019-11-28 |
20190363039 | SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS | 2019-11-28 |
20190363040 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2019-11-28 |
20190363041 | DEVICE WITH PILLAR-SHAPED COMPONENTS | 2019-11-28 |
20190363042 | SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363043 | Power electronic metal-ceramic module and printed circuit board module with integrated power electronic metal-ceramic module and process for their making | 2019-11-28 |
20190363044 | PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME | 2019-11-28 |
20190363045 | Packages with Si-Substrate-Free Interposer and Method Forming Same | 2019-11-28 |
20190363046 | INTEGRATED CIRCUIT PACKAGE SUPPORTS | 2019-11-28 |
20190363047 | FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY | 2019-11-28 |
20190363048 | VIA PREFILL IN A FULLY ALIGNED VIA | 2019-11-28 |
20190363049 | MULTIPLE DIE PACKAGE USING AN EMBEDDED BRIDGE CONNECTING DIES | 2019-11-28 |
20190363050 | SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363051 | FILM PACKAGE AND PACKAGE MODULE INCLUDING THE SAME | 2019-11-28 |
20190363052 | INTEGRATED CIRCUIT PACKAGES | 2019-11-28 |
20190363053 | ASYMMETRIC OVERLAY MARK FOR OVERLAY MEASUREMENT | 2019-11-28 |
20190363054 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363055 | ELECTRONIC COMPONENT WITH THIN-FILM SHIELD LAYER | 2019-11-28 |
20190363056 | SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE STRUCTURE INCLUDING THE SAME | 2019-11-28 |
20190363057 | Method for Processing a Semiconductor Wafer, Semiconductor Composite Structure and Support Structure for Semiconductor Wafer | 2019-11-28 |
20190363058 | INDUCTOR STRUCTURE MOUNTED ON PCB BOARD AND VOLTAGE REGULATOR MODULE HAVING THE SAME | 2019-11-28 |
20190363059 | POLARIZATION DEFINED ZERO MISALIGNMENT VIAS FOR SEMICONDUCTOR PACKAGING | 2019-11-28 |
20190363060 | APPARATUSES AND METHODS FOR PIN CAPACITANCE REDUCTION INCLUDING BOND PADS AND CIRCUITS IN A SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363061 | DISPLAY DEVICE | 2019-11-28 |
20190363062 | Package with Passive Devices and Method of Forming the Same | 2019-11-28 |
20190363063 | PACKAGE SUBSTRATE WITH HIGH-DENSITY INTERCONNECT LAYER HAVING PILLAR AND VIA CONNECTIONS FOR FAN OUT SCALING | 2019-11-28 |
20190363064 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2019-11-28 |
20190363065 | SEMICONDUCTOR SWITCHING DEVICE | 2019-11-28 |
20190363066 | SEMICONDUCTOR PACKAGE STRUCTURE | 2019-11-28 |
20190363067 | MULTILAYER SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2019-11-28 |
20190363068 | STACKED DEVICE, STACKED STRUCTURE, AND METHOD OF MANUFACTURING STACKED DEVICE | 2019-11-28 |
20190363069 | MICRO LIGHT-EMITTING DIODE DISPLAY FABRICATION AND ASSEMBLY | 2019-11-28 |
20190363070 | LIGHT EMITTING DIODE SURFACE LIGHTING SOURCE, AND MANUFACTURING METHOD AND DISPLAY PANEL THEREOF | 2019-11-28 |
20190363071 | LIGHT-EMITTING DEVICE PACKAGE | 2019-11-28 |
20190363072 | SEMICONDUCTOR MODULE AND POWER CONVERSION APPARATUS | 2019-11-28 |
20190363073 | PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME | 2019-11-28 |
20190363074 | SEMICONDUCTOR MEMORY DEVICE HAVING PLURAL CHIPS CONNECTED BY HYBRID BONDING METHOD | 2019-11-28 |
20190363075 | CIRCUIT LAYOUT METHOD | 2019-11-28 |
20190363076 | ELECTROSTATIC DISCHARGE PROTECTION SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363077 | ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT | 2019-11-28 |
20190363078 | DOPING AND FABRICATION OF DIAMOND AND C-BN BASED DEVICE STRUCTURES | 2019-11-28 |
20190363079 | THROUGH SILICON VIA DESIGN FOR STACKING INTEGRATED CIRCUITS | 2019-11-28 |
20190363080 | PACKAGED SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363081 | SELF-HEATING TEST STRUCTURE | 2019-11-28 |
20190363082 | METHOD AND STRUCTURE OF FORMING STRAINED CHANNELS FOR CMOS DEVICE FABRICATION | 2019-11-28 |
20190363083 | HYBRID HIGH MOBILITY CHANNEL TRANSISTORS | 2019-11-28 |
20190363084 | SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363085 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-11-28 |
20190363086 | SEMICONDUCTOR DEVICES AND METHOD OF MANUFACTURING THE SAME | 2019-11-28 |
20190363087 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-11-28 |
20190363088 | SEMICONDUCTOR DEVICES | 2019-11-28 |
20190363089 | SEMICONDUCTOR MEMORY DEVICE | 2019-11-28 |
20190363090 | VERTICAL TRANSISTOR WITH EDRAM | 2019-11-28 |
20190363091 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME | 2019-11-28 |
20190363092 | VERTICAL TRANSISTOR WITH EDRAM | 2019-11-28 |
20190363093 | FABRICATING METHOD OF OXIDE LAYER WITHIN PERIPHERAL CIRCUIT REGION | 2019-11-28 |
20190363094 | SEMICONDUCTOR DEVICE HAVING STRAP CELL | 2019-11-28 |
20190363095 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363096 | FLOATING GATE FABRICATION METHOD | 2019-11-28 |
20190363097 | FLASH MEMORY DEVICE AND MANUFACTURE THEREOF | 2019-11-28 |
20190363098 | PITCH SCALABLE 3D NAND | 2019-11-28 |
20190363099 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF OPERATING THE SAME | 2019-11-28 |
20190363100 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-11-28 |
20190363101 | SEMICONDUCTOR MEMORY DEVICE | 2019-11-28 |
20190363102 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363103 | IRREGULAR SHAPE DISPLAY PANEL | 2019-11-28 |
20190363104 | ARRAY SUBSTRATE, DISPLAY APPARATUS, PIXEL DRIVING CIRCUIT, METHOD FOR DRIVING IMAGE DISPLAY IN DISPLAY APPARATUS, AND METHOD OF FABRICATING ARRAY SUBSTRATE | 2019-11-28 |
20190363105 | THIN-FILM TRANSISTOR ARRAY AND METHOD FOR PRODUCING THE SAME | 2019-11-28 |
20190363106 | DISPLAY DEVICE | 2019-11-28 |
20190363107 | DISPLAY DEVICE, ELECTRONIC DEVICE, AND METHOD OF MANUFACTURING DISPLAY DEVICE | 2019-11-28 |
20190363108 | SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363109 | ARRAY SUBSTRATE, PREPARATION METHOD THEREOF, AND DISPLAY DEVICE | 2019-11-28 |
20190363110 | DISPLAY DEVICE | 2019-11-28 |
20190363111 | METHOD FOR FABRICATING ARRAY SUBSTRATE MOTHERBOARD, ARRAY SUBSTRATE MOTHERBOARD AND DETECTION METHOD | 2019-11-28 |
20190363112 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-11-28 |
20190363113 | OPTICAL SENSOR HAVING TWO TAPS FOR PHOTON-GENERATED ELECTRONS OF VISIBLE AND IR LIGHT | 2019-11-28 |
20190363114 | Near Ultraviolet Photocell | 2019-11-28 |
20190363115 | PIXEL STRUCTURE TO IMPROVE BSI GLOBAL SHUTTER EFFICIENCY | 2019-11-28 |
20190363116 | MULTI-BAND IMAGING SYSTEMS | 2019-11-28 |
20190363117 | DISPLAY SUBSTRATE AND DISPLAY DEVICE | 2019-11-28 |
20190363118 | PROGRAMMABLE PIXEL ARRAY | 2019-11-28 |
20190363119 | IMAGE SENSOR INCLUDING UNIT PIXEL BLOCK HAVING COMMON SELECTION TRANSISTOR | 2019-11-28 |
20190363120 | ENERGY HARVESTING CONFIGURABLE IMAGE SENSOR | 2019-11-28 |
20190363121 | METHODS OF FORMING IMAGE SENSOR INTEGRATED CIRCUIT PACKAGES | 2019-11-28 |
20190363122 | STACKED IMAGE SENSOR PACKAGE | 2019-11-28 |
20190363123 | IMAGE SENSING DEVICE WITH CAP AND RELATED METHODS | 2019-11-28 |
20190363124 | EDGE SEALS FOR SEMICONDUCTOR PACKAGES | 2019-11-28 |