48th week of 2020 patent applcation highlights part 58 |
Patent application number | Title | Published |
20200373133 | STAGE DEVICE AND PROCESSING APPARATUS | 2020-11-26 |
20200373134 | ALIGNMENT MODULE WITH A CLEANING CHAMBER | 2020-11-26 |
20200373135 | ETCHING METHOD AND ETCHING PROCESSING APPARATUS | 2020-11-26 |
20200373136 | ION DETECTOR | 2020-11-26 |
20200373137 | CLEANING ION OPTIC MULTIPOLE DEVICES | 2020-11-26 |
20200373138 | Electrode Arrangement | 2020-11-26 |
20200373139 | Voltage Control for Ion Mobility Separation | 2020-11-26 |
20200373140 | Coupling of Ion Mobility Spectrometer with Mass Spectrometer | 2020-11-26 |
20200373141 | APPARATUS FOR ELECTROSPRAY EMISSION | 2020-11-26 |
20200373142 | PRINTED CIRCUIT ION MIRROR WITH COMPENSATION | 2020-11-26 |
20200373143 | ION MIRROR FOR MULTI-REFLECTING MASS SPECTROMETERS | 2020-11-26 |
20200373144 | ION INJECTION INTO MULTI-PASS MASS SPECTROMETERS | 2020-11-26 |
20200373145 | ACCELERATOR FOR MULTI-PASS MASS SPECTROMETERS | 2020-11-26 |
20200373146 | Ion Trap with Elongated Electrodes | 2020-11-26 |
20200373147 | METHOD, APPARATUS AND SYSTEM FOR PROVIDING VOLTAGE SUPPLY FOR PHOTOIONIZATION DETECTOR LAMP | 2020-11-26 |
20200373148 | ULTRA-LOW TEMPERATURE ALD TO FORM HIGH-QUALITY SI-CONTAINING FILM | 2020-11-26 |
20200373149 | IN-SITU ATOMIC LAYER DEPOSITION PROCESS | 2020-11-26 |
20200373150 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2020-11-26 |
20200373151 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2020-11-26 |
20200373152 | METHOD FOR DEPOSITING SILICON-FREE CARBON-CONTAINING FILM AS GAP-FILL LAYER BY PULSE PLASMA-ASSISTED DEPOSITION | 2020-11-26 |
20200373153 | SEMICONDUCTOR STRUCTURE HAVING A Si SUBSTRATE HETEROINTEGRATED WITH GaN AND METHOD FOR FABRICATING THE SAME | 2020-11-26 |
20200373154 | Semiconductor Device and Method | 2020-11-26 |
20200373155 | METHOD OF MAKING GRAPHENE AND GRAPHENE DEVICES | 2020-11-26 |
20200373156 | DEPOSITION METHOD | 2020-11-26 |
20200373157 | ULTRA-THIN DIELECTRIC FILMS USING PHOTO UP-CONVERSION FOR APPLICATIONS IN SUBSTRATE MANUFACTURING AND INTEGRATING PASSIVES | 2020-11-26 |
20200373158 | METHOD OF PRODUCING SEMICONDUCTOR EPITAXIAL WAFER AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373159 | METHOD FOR FORMING AND PATTERNING A LAYER AND/OR SUBSTRATE | 2020-11-26 |
20200373160 | METHOD FOR FORMING SEMICONDUCTOR STRUCTURE | 2020-11-26 |
20200373161 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2020-11-26 |
20200373162 | DIFFUSING AGENT COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR SUBSTRATE | 2020-11-26 |
20200373163 | Method of Implanting an Implant Species into a Substrate at Different Depths | 2020-11-26 |
20200373164 | METHOD OF FABRICATING A FLASH MEMORY | 2020-11-26 |
20200373165 | SEMICONDUCTOR DEVICE WITH IMPROVED CONTACT RESISTANCE AND VIA CONNECTIVITY | 2020-11-26 |
20200373166 | SUBSTRATE PROCESSING METHOD | 2020-11-26 |
20200373167 | KIT, COMPOSITION FOR FORMING UNDERLAYER FILM FOR IMPRINTING, PATTERN FORMING METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373168 | FORMATION OF BOTTOM ISOLATION | 2020-11-26 |
20200373169 | METHODS AND CIRCUITS FOR ASYMMETRIC DISTRIBUTION OF CHANNEL EQUALIZATION BETWEEN DEVICES | 2020-11-26 |
20200373170 | Phosphorus Fugitive Emission Control | 2020-11-26 |
20200373171 | INTERCONNECT STRUCTURE | 2020-11-26 |
20200373172 | METHOD OF MANUFACTURING MOLDED CHIP | 2020-11-26 |
20200373173 | INTEGRATED FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF | 2020-11-26 |
20200373174 | APPARATUS FOR REMOVING A PHOTORESIST AND APPARATUS FOR MANUFACTURING A SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373175 | SUBSTRATE PROCESSING APPARATUS | 2020-11-26 |
20200373176 | PROTECTIVE SHEET FOR USE IN PROCESSING WAFER, HANDLING SYSTEM FOR WAFER, AND COMBINATION OF WAFER AND PROTECTIVE SHEETING | 2020-11-26 |
20200373177 | METHOD FOR DETERMINING A SURFACE TEMPERATURE | 2020-11-26 |
20200373178 | Wafer Out Of Pocket Detection | 2020-11-26 |
20200373179 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2020-11-26 |
20200373180 | Substrate Storage Container and Method of Manufacturing the Same | 2020-11-26 |
20200373181 | SYSTEMS AND METHODS FOR WAFER POD ALIGNMENT | 2020-11-26 |
20200373182 | Single Cell In-Die Metrology Targets and Measurement Methods | 2020-11-26 |
20200373183 | SYSTEM AND METHOD FOR ALIGNING A MASK WITH A SUBSTRATE | 2020-11-26 |
20200373184 | SUBSTRATE SUPPORT CARRIER WITH IMPROVED BOND LAYER PROTECTION | 2020-11-26 |
20200373185 | Method and Apparatus for Bonding Semiconductor Devices | 2020-11-26 |
20200373186 | WAFER BONDING APPARATUSES | 2020-11-26 |
20200373187 | SUBSTRATE SUSCEPTOR USING EDGE PURGING | 2020-11-26 |
20200373188 | PATTERNED VACUUM CHUCK FOR DOUBLE-SIDED PROCESSING | 2020-11-26 |
20200373189 | APPARATUS AND METHOD FOR MANUFACTURING DISPLAY DEVICE | 2020-11-26 |
20200373190 | PROCESS KIT ENCLOSURE SYSTEM | 2020-11-26 |
20200373191 | Asymmetric Dual End Effector Robot Arm | 2020-11-26 |
20200373192 | High-Precision, Short Travel Two Degree of Freedom Robot Arm | 2020-11-26 |
20200373193 | SYSTEM AND METHOD FOR EDGE RING WEAR COMPENSATION | 2020-11-26 |
20200373194 | PROCESS KIT RING ADAPTOR | 2020-11-26 |
20200373195 | PROCESSING CHAMBER FOR THERMAL PROCESSES | 2020-11-26 |
20200373196 | FORMING SINGLE AND DOUBLE DIFFUSION BREAKS FOR FIN FIELD-EFFECT TRANSISTOR STRUCTURES | 2020-11-26 |
20200373197 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2020-11-26 |
20200373198 | METAL INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING THE SAME | 2020-11-26 |
20200373199 | INTERCONNECTS WITH TIGHT PITCH AND REDUCED RESISTANCE | 2020-11-26 |
20200373200 | METAL BASED HYDROGEN BARRIER | 2020-11-26 |
20200373201 | METHOD TO REPAIR EDGE PLACEMENT ERRORS IN A SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373202 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM | 2020-11-26 |
20200373203 | SELF-ALIGNED CONTACTS FOR 3D LOGIC AND MEMORY | 2020-11-26 |
20200373204 | FORMATION OF AN AIR GAP SPACER USING SACRIFICIAL SPACER LAYER | 2020-11-26 |
20200373205 | DIRECTIONAL SPACER REMOVAL FOR INTEGRATED CIRCUIT STRUCTURES | 2020-11-26 |
20200373206 | GATE STRUCTURES FOR SEMICONDUCTOR DEVICES | 2020-11-26 |
20200373207 | TEST CIRCUIT AND TEST METHOD | 2020-11-26 |
20200373208 | METHOD OF MEASURING CONCENTRATION OF FE IN P-TYPE SILICON WAFER AND SPV MEASUREMENT APPARATUS | 2020-11-26 |
20200373209 | INSPECTION SYSTEM AND METHOD FOR INSPECTING SEMICONDUCTOR PACKAGE, AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE | 2020-11-26 |
20200373210 | Optical Diagnostics of Semiconductor Process Using Hyperspectral Imaging | 2020-11-26 |
20200373211 | Assembly and Method for Performing In-Situ Endpoint Detection When Backside Milling Silicon Based Devices | 2020-11-26 |
20200373212 | SYSTEM FOR NON RADIAL TEMPERATURE CONTROL FOR ROTATING SUBSTRATES | 2020-11-26 |
20200373213 | PACKAGE STRUCTURE | 2020-11-26 |
20200373214 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373215 | Die-on-Interposer Assembly with Dam Structure and Method of Manufacturing the Same | 2020-11-26 |
20200373216 | SEMICONDUCTOR PACKAGE INCLUDING HEAT REDISTRIBUTION LAYERS | 2020-11-26 |
20200373217 | Combined Inductor And Heat Transfer Device | 2020-11-26 |
20200373218 | HEAT DISSIPATION DEVICE AND ELECTRONIC DEVICE | 2020-11-26 |
20200373219 | SEMICONDUCTOR PACKAGES HAVING THERMAL THROUGH VIAS (TTV) | 2020-11-26 |
20200373220 | INTEGRATED CIRCUIT PACKAGES WITH THERMAL INTERFACE MATERIALS WITH DIFFERENT MATERIAL COMPOSITIONS | 2020-11-26 |
20200373221 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING AN ELECTRONIC DEVICE | 2020-11-26 |
20200373222 | IINTEGRATED CIRCUIT WITH A RING-SHAPED HOT SPOT AREA AND MULTIDIRECTIONAL COOLING | 2020-11-26 |
20200373223 | WATER BLOCK ASSEMBLY | 2020-11-26 |
20200373224 | THROUGH-SILICON VIAS AND DECOUPLING CAPACITANCE | 2020-11-26 |
20200373225 | SEMICONDUCTOR INTEGRATED CIRCUIT AND CIRCUIT LAYOUT METHOD THEREOF | 2020-11-26 |
20200373226 | BONDING WIRE FOR SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373227 | SEMICONDUCTOR DEVICE | 2020-11-26 |
20200373228 | Semiconductor Package with Space Efficient Lead and Die Pad Design | 2020-11-26 |
20200373229 | LEAD FRAME AND METHOD OF FABRICATING THE SAME | 2020-11-26 |
20200373230 | LEADFRAME PACKAGE USING SELECTIVELY PRE-PLATED LEADFRAME | 2020-11-26 |
20200373231 | SEMICONDUCTOR PACKAGE WITH GUIDE PIN | 2020-11-26 |
20200373232 | PACKAGE SUBSTRATES WITH MAGNETIC BUILD-UP LAYERS | 2020-11-26 |