47th week of 2015 patent applcation highlights part 75 |
Patent application number | Title | Published |
20150334840 | RESISTANCE ASSEMBLY FOR MOBILE DEVICE AND MANUFACTURING METHOD THEREOF - A resistance assembly for a mobile device and a manufacturing method thereof are disclosed. The resistance assembly for a mobile device in accordance with an aspect of the present invention includes: a substrate having a circuit formed thereon; first to fourth pads laminated and separated from one another on the substrate; first to fourth terminals connected to the first to fourth pads, respectively, by being formed in a longitudinal direction along edges of lateral surfaces of a resistance body that are opposite to each other; and first and second resistors formed in between the first to fourth terminals along the opposite lateral and connected in parallel to each other on the resistance body and configured to adjust electric current flowed into the circuit. | 2015-11-19 |
20150334841 | Printed Circuit Board - A multilayer printed circuit board comprising conductive layers separated by dielectric insulation layers, at least one conductive layer being patterned and parts of conducting layers being interconnected by means of vias traversing insulation layers, and at least one component having terminals electrically connected with conducting layers is countersunk at least partly in a cavity having a floor and side walls, whereby a first component is completely countersunk in the cavity with its terminals connected face-down directly with contacts on the floor of the cavity and at least one further component is stacked above the first component, whereby an edge of the lower surface of the second component projecting over the upper surface area of the at least one further component is provided with terminals being connected directly face-down with contacts of the circuit board arranged on a level higher than the floor of the cavity. | 2015-11-19 |
20150334842 | PRINTED WIRING BOARD - A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T | 2015-11-19 |
20150334843 | PRINTED CIRCUIT BOARD, AND METHOD FOR MANUFACTURING SAME - Provided are a printed circuit board and a method of manufacturing the printed circuit board, the printed circuit board including: a first element and a second element a first base substrate including an embedding part in which the first element is embedded and a cavity into which the second element is mounted; and a second base substrate bonded to one surface of the first base substrate and including a first via for the second element. | 2015-11-19 |
20150334844 | PRINTED WIRING BOARD - A printed wiring board includes a substrate having first and second cavities, first electronic components accommodated in the first cavity, second electronic components accommodated in the second cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the first and second cavities. The substrate has a first projection structure partitioning the first components in the first cavity and a second projection structure partitioning the second components in the second cavity, and the first and second cavities and the first and second projection structures are formed in the substrate such that T | 2015-11-19 |
20150334845 | PACKAGE FOR HOUSING ELECTRONIC COMPONENT AND ELECTRONIC DEVICE | 2015-11-19 |
20150334846 | ELECTRONIC COMPONENT MODULE - An electronic component module includes a substrate, an electronic component mounted on the substrate, and a resin sealing portion that seals the electronic component and covers a principal surface of the substrate. The resin sealing portion includes a film-shaped resin layer that covers upper and side surfaces of the electronic component and the principal surface of the substrate, and an embedding resin layer that covers the film-shaped resin layer. The embedding resin layer has a smaller coefficient of linear expansion than that of the film-shaped resin layer. A portion of the film-shaped resin layer covering the side surfaces has a smaller thickness than either of a thickness of a portion of the film-shaped resin layer covering the upper surface and a thickness of a portion of the film-shaped resin layer covering the principal surface. | 2015-11-19 |
20150334847 | TWO-STAGE POWER DELIVERY ARCHITECTURE - A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator. | 2015-11-19 |
20150334848 | ENCLOSURE FOR A MULTI-CHANNEL MODULATOR DRIVER - Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed. | 2015-11-19 |
20150334849 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM - Manufacturing quality of a semiconductor device can be improved, and manufacturing throughput can be improved. A method of manufacturing a semiconductor device includes (a) placing a substrate on a substrate supporting unit installed in a processing chamber, the substrate having thereon a solder with an oxygen-containing film on a surface thereof, (b) reducing the oxygen-containing film by supplying a reducing gas into the processing chamber while maintaining a thermal conductivity of an inner atmosphere of the processing chamber at a first thermal conductivity, and (c) melting the solder by supplying a thermally conductive gas into the processing chamber while maintaining the thermal conductivity of the inner atmosphere of the processing chamber at a second thermal conductivity higher than the first thermal conductivity. | 2015-11-19 |
20150334850 | METHOD OF MANUFACTURING WIRING SUBSTRATE, AND WIRING SUBSTRATE - A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer. | 2015-11-19 |
20150334851 | THREE-DIMENSIONAL LIQUID CRYSTAL POLYMER MULTILAYER CIRCUIT BOARD INCLUDING MEMBRANE SWITCH AND RELATED METHODS - An electronic device includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess. | 2015-11-19 |
20150334852 | Packaging Box for an Electronic Device - The invention discloses a packaging box for an electronic device, wherein an opening is formed in one surface of a box body of the packaging box, and a detachable cover plate is mounted on the opening; the remaining part of the box body is composed of box plates with an integrated groove-shaped structure; the electronic device is placed in the box body, and an input-output and control module connected with the electronic device is arranged on the cover plate. According to the packaging box for an electronic device disclosed by the invention, by arranging the detachable cover plate on the opening in the one surface of the box body of the packaging box, and forming the remaining part into the integrated groove-shaped structure, the box body has better overall sealing performance, and moreover, disassembling one cover plate can reduce the workload of disassembly and assembly. | 2015-11-19 |
20150334853 | ELECTRONIC MODULE AND METHOD FOR MANUFACTURING ELECTRONIC MODULE - The Electronic Module includes body case | 2015-11-19 |
20150334854 | VEHICLE-MOUNTED ELECTRONIC CONTROL DEVICE - Provided is a vehicle-mounted electronic control device including a control unit reduced in size, weight, and costs with improved contact reliability between electric components included in the control unit. In the vehicle-mounted electronic control device according to the present invention, a connector has a locking hole formed in a side surface relative to an upper surface that is an upward oriented surface, a fitting opening formed in a lower surface, and a waterway for preventing flowing down water from entering the locking hole and the fitting opening, which is formed on a surface of the connector. | 2015-11-19 |
20150334855 | PROTECTIVE CASE FOR ELECTRONIC DEVICE AND METHOD FOR ACOUSTIC TRANSMISSION IN AIRTIGHT ENVIRONMENT - A protective case for an electronic device and a method for acoustic transmission in airtight environment are disclosed. The protective case includes a case body defining a sealed accommodating space. The accommodating space is configured to receive the electronic device that has a screen and an audio generating section and/or an audio receiving section. The case body has a protective film disposed corresponding to the screen so that when the electronic device is received in the accommodating space, an air chamber is formed between the film and the electronic device. The protective film has a PET layer and a thickness of 0.05 mm to 0.25 mm. The film is spaced from the electronic device by an interval of substantially 0.25 mm. Thereby the protective film acts as a diaphragm for transmitting sound to the audio receiving section and/or for transmitting a sound generated by the audio generating section outside. | 2015-11-19 |
20150334856 | TEAR-AWAY ARC FAULT RELIEF PANEL FOR ELECTRICAL CABINET - In one aspect, an arc fault relief panel is provided for mounting to a cabinet for enclosing medium- or high-voltage electrical equipment. The panel includes bend relief cuts or slots to allow the panel to fail in a predictable manner during an explosive arc fault. That is, the cuts or slots provide weakened locations or segments along the panel that permit a main portion of the panel to bend outwardly during an explosive arc fault. The main portion of the panel may be secured to other components of the cabinet with tear-away fasteners. During an explosive arc fault, the panel tears away from the fasteners, allowing the panel to bend outwardly along its weakened segments to provide an opening for venting pressurized air. A lanyard cable may be used to restrict outward movement of the main portion of the panel to help protect adjacent equipment or nearby personnel. | 2015-11-19 |
20150334857 | MOTOR DRIVE UNIT PROVIDED WITH HOUSING FORMED WITH OPENING - A motor drive unit which improves the cooling ability. The motor drive unit comprises electronic components and a housing which surrounds the electronic components. The housing has a back plate to which the electronic components are fixed, a front plate which faces the back plate, and a first side plate and second side plate which face each other and extend from the back plate to the front plate. The first side plate has openings which pass through the first side plate and slants with respect to the back plate so as to approach the second side plate or separate from the second side plate the further from the back plate toward the front plate. | 2015-11-19 |
20150334858 | BRACKET APPARATUS APPLICABLE TO KEYBOARD AND KEYBOARD COMPRISING THE BRACKET APPARATUS - Disclosed are a bracket apparatus applicable to a keyboard, and a keyboard comprising the bracket apparatus. The bracket apparatus comprises a shell, wherein: a support plate is hinged to the shell through a hinge shaft, a releasably-connected support shaft being disposed between a free end of the support plate and the shell, a torsion spring being sleeved onto the hinge shaft, two ends of the torsion spring being respectively connected to the shell and the support plate; and the shell is further provided with a push switch with a built-in spring apparatus, a locking bump being disposed on the push switch, a locking mating bump mating with the locking bump being disposed on a side portion of the support plate. The bracket apparatus has the advantages of simple operations and convenient in use. | 2015-11-19 |
20150334859 | MOBILE TERMINAL - The present disclosure relates to a mobile terminal, and there is provided a mobile terminal including a terminal body having a front surface and a rear surface, a rear input unit comprising a first button portion externally exposed from the rear surface to receive a push input with a first function and a second button portion provided with keys disposed at both sides, respectively, around the first button portion to receive a push input with a second function different from the first function, and a sensor disposed at a lower portion of the first button portion, wherein the second button portion is provided with a through hole accommodating the first button portion to dispose the first button portion between the keys, and the sensor is disposed to overlap with an inner region of the through hole, and at least part thereof is formed to overlap with a first switch for activating the first button portion. | 2015-11-19 |
20150334860 | SYSTEMS AND METHODS FOR COUPLING ELECTRICALLY ISOLATED SECTIONS OF AN ELECTRONIC DEVICE - Each knuckle is molded in and/or around a coupling structure that is either welded to or is an integral part of the section. The coupling structure can be a bracket that is welded to an inner surface of a section, and the bracket is constructed to have a cross-section that minimizes capacitance. In one embodiment, a first bracket can be welded to a first conductive section, and a second bracket can be welded to a second conductive section. A knuckle constructed from an insulating material that is overmolded within and around the first and second brackets such that the first and second conductive sections are coupled together. The first and second conductive sections and their respective brackets are spaced a predetermined distanced apart, thereby ensuring the conductive sections are electrically isolated. | 2015-11-19 |
20150334861 | COVER AND INFORMATION PROCESSING APPARATUS WITH COVER - An upper cover attaching concavity and a lower cover attaching concavity are respectively formed on rear surfaces of an upper housing and a lower housing of a non-limiting example portable game apparatus, and hook recesses each having a portion existing beneath an area are formed on a flat surface of the upper cover attaching concavity and fitting recesses are formed on side surfaces. Hook recesses each having a portion existing beneath an area are formed on a flat surface of the lower cover attaching concavity and fitting recesses are formed on side surfaces. Hooks are inserted into the hook recesses and fitting projections fit into the fitting recesses, whereby an upper cover is attached to the upper cover attaching concavity. Hooks are inserted into the hook recesses and fitting projections fit into the fitting recesses, whereby a lower cover is attached to the lower cover attaching concavity. | 2015-11-19 |
20150334862 | PROTECTIVE SHEET AND ELECTRONIC DEVICE WITH PROTECTIVE SHEET - According to one embodiment, a protective sheet to be attached to an outer surface of a housing of an electronic device is provided. The protective sheet comprises a sheet body formed of a material more flexible than that of the housing and having an external form defined by sides extending along edges of the electronic device, an adhesive layer applied to one entire surface of the sheet body, a notch comprising a closing end positioned in the sheet body and an opening end positioned at the side and extending along an extending direction connecting the closing end and the opening end, and a tab formed on the sheet body at least one side of the extending direction of the notch portion and easily peelable off from the outer surface. | 2015-11-19 |
20150334863 | Arrangement for compensating pressure in a housing - A configuration compensates for the pressure in a housing, in which at least one housing wall has a pressure compensation opening which is sealed with a semi-permeable membrane. The membrane is fixed, at least in a material fit to the housing wall and is covered by a protective element. Accordingly, the housing wall has, in the region of the pressure compensation opening, an indentation and/or recess for receiving the membrane. The respective periphery thereof corresponds to a periphery of the membrane and the height thereof corresponds at least to the thickness of the membrane. | 2015-11-19 |
20150334864 | Indicia-Reading Module with an Integrated Flexible Circuit - An indicia-reading module suitable for integration within a host mobile computing device that has an integrated flexible circuit is disclosed. The indicia-reading module includes a plurality of subassemblies, each supported and electrically connected by a discrete, rigid, multilayer printed-circuit-board (PCB). A unitary flexible circuit electrically connects the subassemblies and is physically integrated between two inner layers of each subassembly's discrete, rigid, multilayer printed-circuit-board. The use of the integrated flexible circuit aids in reducing module size, signal loss, and interference with the host mobile computing device. | 2015-11-19 |
20150334865 | CASE UNIT - A sliding member that is provided in a front panel of a case so as to be movable in the vertical direction and is placed at a down position due to the own weight is provided with a window portion which covers and hides a screw insertion hole for fixing a unit when the sliding member is located at the down position and exposes the screw insertion hole when the sliding member is lifted to an up position. Further, the front panel is provided with an interlocking switch that controls the operation of the case unit in a manner such that the interlocking switch is turned on while being pressed by the sliding member lifted to the up position and is turned off while the pressing operation is released when the sliding member is located at the down position. | 2015-11-19 |
20150334866 | Modular Data Center Cabinet Rack Guide and Retention Mechanism - A modular data center includes a first alignment component, and a second alignment component. The first alignment component is mounted at a first location on a floor of the modular data center, and is configured to align a cabinet rack within a rack slot of the modular data center. The second alignment component is mounted at a second location on the floor, and is configured be placed in physical communication with the cabinet rack in response to the cabinet rack being fully inserted in the rack slot | 2015-11-19 |
20150334867 | A RACK ASSEMBLY STRUCTURE - Embodiments of the present disclosure provide techniques and configurations for a rack assembly. In one embodiment, a tray to be disposed in a rack assembly may comprise a plurality of sleds with individual sleds including one or more compute nodes; and a networking element coupled with a sled of the plurality of sleds and configured to communicatively connect the sled to one or more other components of the rack assembly via an optical communication system. The optical communication system may include an external optical cable configured to communicatively connect the networking element with the rack assembly. Other embodiments may be described and/or claimed. | 2015-11-19 |
20150334868 | APPARATUS TO FACILITATE ORTHOGONAL COUPLING OF A SERVER SLED WITH A SERVER BACKPLANE - An orthogonal coupling mechanism includes a threaded rod, a pair of travelers engaging the threaded rod, and an actuator. The actuator is disposed on the threaded rod, such that the actuator translates a first axial force along the axis of the threaded rod into a rotational movement of the threaded rod about its axis. The rotational movement created by the actuator causes the pair of travelers to travel along the axis of the threaded rod, moving a sliding board into engagement with a first connector in a direction orthogonal to a direction of the first axial force. | 2015-11-19 |
20150334869 | FREQUENCY UP CONVERTER HAVING COMPACT SIZE AND ENHANCED HEAT EMISSION CHARACTERISTICS - A frequency up converter having a compact size and enhanced heat emission characteristics by improving an arrangement structure of circuit boards is provided. The frequency up converter can enhance the heat emission characteristics and also reduce an entire volume and weight by classifying the devices according to their heat emission characteristics, separately arranging boards in a multi-step structure, and installing a heat sink. | 2015-11-19 |
20150334870 | HEAT-DISSIPATION STRUCTURE FOR AN INDICIA READING MODULE - Small mobile computing devices place stringent requirements on the electronic modules integrated within. High temperatures inside these mobile computing devices are unavoidable; therefore good thermal management is important to insure proper module operation. Here a heat-dissipation structure for an indicia-reading module integrated within a mobile computing device is disclosed. | 2015-11-19 |
20150334871 | THERMAL INTERFACE MATERIALS WITH THIN FILM SEALANTS - According to various aspects, exemplary embodiments are provided of thermal interface material assemblies. In an exemplary embodiment, a thermal interface material assembly generally includes a thermal interface material having a first side and a second side. A dry material is along at least a portion of the first side of the thermal interface material. The dry material has a thickness less than 0.005 millimeters. At least one edge of the thermal interface material is sealed at least partially by the dry material. | 2015-11-19 |
20150334872 | COLLAPSIBLE ENCLOSURE COVER FOR FACILITATING AIR FLOW FOR AN ENCLOSURE - A collapsible enclosure cover for facilitating air flow for an enclosure having a collapsible frame with a first guide rail having a mounting bracket and an elongated member. The collapsible frame also has a second guide rail having a mounting bracket and an elongated member. The collapsible frame also has a plurality of poles extending from the first guide rail to the second guide rail that swivel around the elongated members. The collapsible enclosure cover also has a fabric portion connected to and disposed over the plurality of poles. | 2015-11-19 |
20150334873 | HEAT SHUTTER DEVICE - A heat shutter device provided in a rack | 2015-11-19 |
20150334874 | Coldplate with Integrated Electrical Components for Cooling Thereof - A coldplate for use in cooling electrical components may include first and second coldplate members, each having a pocket and a secondary portion. The pocket of each member is configured to receive an electrical component and sized to substantially surround the component when received in the pocket to provide physical integration of the component in the coldplate member. The first and second coldplate members are adapted to be joined together to form a manifold therebetween for receiving a fluid for use in cooling the electrical components. The secondary portion of each coldplate member is arranged substantially opposite the pocket of the other coldplate member when the coldplate members are joined together. | 2015-11-19 |
20150334875 | Coldplate with Integrated DC Link Capacitor for Cooling Thereof - A coldplate for use with an inverter of an electric vehicle includes a coldplate member. The coldplate member includes a pocket configured to receive a DC link capacitor of the inverter therein. The pocket is sized to surround the DC link capacitor when the DC link capacitor is received within the pocket to thereby provide physical integration of the DC link capacitor in the coldplate member. | 2015-11-19 |
20150334876 | EVAPORATOR, COOLING DEVICE, AND ELECTRONIC DEVICE - An evaporator includes a housing in which an evaporator chamber configured to evaporate a refrigerant is formed; a heat transfer surface provided on an inner wall of the housing and having a hot area which is a part that becomes hot due to heat transferred from a heating element to the housing; and a supply port formed in the housing, opposed to the hot area and configured to eject the refrigerant supplied from a supply pipe to the hot area, wherein a narrow groove is formed in the heat transfer surface. | 2015-11-19 |
20150334877 | WIRING BOARD AND ELECTRONIC DEVICE - To improve the operation characteristics of an electronic component housed in a recess of an insulating substrate. A wiring board comprises an insulating substrate; and a heat-transfer member disposed inside the insulating substrate. The insulating substrate comprises an upper surface and a recess formed in the upper surface, the upper surface including a first mounting region for a first electronic component, and a second mounting region for a second electronic component which is provided in the recess. The heat-transfer member is disposed inside the insulating substrate so as to overlap the first mounting region and the second mounting region as seen in a plan view, and, part of the heat-transfer member is exposed in the recess. | 2015-11-19 |
20150334878 | COOLING UNIT AND METHOD - A cooling unit including at least one heat exchanger is provided. The heat exchanger comprises an inlet for receiving coolant from a coolant supply and an outlet to exhaust coolant to a coolant return, an input line in fluid communication with the coolant supply and the inlet of the heat exchanger, an output line in fluid communication with the outlet of the heat exchanger and the coolant return, a transfer line comprising a component configured to allow fluid communication from the output line to the input line, and a controller configured to control a flow rate of coolant delivered by the transfer line. | 2015-11-19 |
20150334879 | BIMODAL COOLING IN MODULAR SERVER SYSTEM - A server system includes a plurality of stacked modular computing structures. Each modular computing structure includes a circuit board comprising a computing resource, an air-fluid heat exchange structure comprising a first set of pipe segments, and a cold plate structure attached to a second set of pipe segments of the modular computing structure. The first set of pipe segments of each modular computing structure interfaces with the first set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a first fluid circulation loop. The second set of pipe segments of each modular computing structure interfaces with the second set of pipe segments of at least one adjacent modular computing structure to form a corresponding section of a second fluid circulation loop. | 2015-11-19 |
20150334880 | SYSTEM AND METHOD FOR AIR-COOLING HARD DRIVES IN LIQUID-COOLED SERVER RACK - Embodiments that allow for the air cooling of disk drives associated with liquid cooled nodes are disclosed. A node for performing computing operations includes a frame, a power supply coupled to the |frame| | 2015-11-19 |
20150334881 | COMPUTER COOLING SYSTEM AND METHOD FOR COOLING - Server cooling system comprising: a condenser | 2015-11-19 |
20150334882 | SHIELDED CONDUCTIVE PATH - A shielded conductive path capable of being easily managed in terms of a length of a portion of a single core wire protruding from a shield pipe includes a shield pipe electromagnetically shielding a plurality of single core wires inserted therein and a spacer having insertion holes individually receiving the single core wires. Each single core is made of a single conductor as a core wire. The spacer is fitted inside of the shield pipe while being restricted from displacement in directions perpendicular to an axial direction of the shield pipe. | 2015-11-19 |
20150334883 | ELECTROMAGNETIC INTERFERENCE SUPPRESSOR - The present invention relates to an electromagnetic interference suppression sheet comprising a conductive layer comprising a conductive metal filler and having a surface electrical resistance of 100 to 5000 Ω/□, and a magnetic layer comprising a magnetic material mixed therein and having a real part μ′ of a magnetic permeability of 3 to 45 as measured at 100 MHz which is laminated on the conductive layer. The electromagnetic interference suppression sheet of the present invention is suitable for high-density packaging of electronic devices, and has an excellent low-pass filter characteristic in a near electromagnetic field in a wide frequency band ranging from a low frequency to a high frequency. | 2015-11-19 |
20150334884 | PARASITIC CIRCUIT FOR DEVICE PROTECTION - Exemplary embodiments are directed to a device include a parasitic coil for protection of the device. A device may include a first circuit configured to receive a first transmitted signal at an operational frequency. The device may also include a second circuit a second circuit configured to generate a field that opposes at least one of an undesirable portion of a wireless power field of the first transmitted signal and a portion of another wireless power field proximate the first circuit, the another wireless power field generated by a second transmitted signal at a non-operational frequency of the first circuit. | 2015-11-19 |
20150334885 | MAGNETISM SUPPRESSING SHEET AND MANUFACTURING METHOD THEREOF - A magnetism suppressing sheet is provided with a metallic foil formed by plating and a magnetic film formed by applying magnetic metal powder-containing resin paste to one main surface of the metallic foil. A manufacturing method of a magnetism suppressing sheet includes the steps of preparing a support film on which a metallic foil has been formed, and forming a magnetic film by applying a magnetic metal powder-containing paste to one main surface of the metallic foil. | 2015-11-19 |
20150334886 | MAGNETIC FIELD SHIELDING SHEET, METHOD OF MANUFACTURING THE SAME AND PORTABLE TERMINAL DEVICE USING THE SAME - Provided is a magnetic field shielding sheet including: an amorphous ribbon which is formed into a plurality of pieces; a cover layer which is bonded on one surface of the amorphous ribbon; a double-sided tape which is adhered on the other surface of the amorphous ribbon; and an adhesive film which is filled in gaps between the plurality of pieces, to prevent water from penetrating into the gaps. Accordingly, the amorphous ribbon is prevented from being oxidized with no result of causing an appearance problem and lowering shielding performance, due to oxidizing of the amorphous ribbon. | 2015-11-19 |
20150334887 | COVER ASSEMBLIES, KITS AND METHODS FOR COVERING ELECTRICAL CABLES AND CONNECTIONS - A cover assembly for covering and electrically insulating an electrical connection includes a joint body including a tubular inner sleeve and an integral semiconductor layer. The inner sleeve is formed of an elastically expandable, electrically insulating material and having an outer surface and opposed first and second terminal ends. The inner sleeve defines a through passage extending axially from a first end opening at the first terminal end of the inner sleeve to a second terminal end opening at the second end of the inner sleeve. The semiconductor layer is disposed on the outer surface of the inner sleeve and is formed of an electrically semiconductive material. The semiconductor layer extends axially from a first terminal end of the semiconductor layer to an opposing second terminal end of the semiconductor layer. The first terminal end of the semiconductor layer is spaced apart from the first terminal end of the inner sleeve a prescribed semiconductor truncation distance to define a tubular band of the outer surface that is not covered by the semiconductor layer. | 2015-11-19 |
20150334888 | PROCESS APPARATUS CAPABLE OF PUSHING PANEL-SHAPED OBJECT AND PROCESS METHOD THEREOF - A process apparatus capable of pushing a panel-shaped object includes a process apparatus and at least one panel-shaped object. The process apparatus includes a carrying fixture and a separating fixture. The carrying fixture has a top surface and a bottom surface opposite to each other and has at least one positioning pillar. The separating fixture has a pushing portion. The panel-shaped object has at least one positioning hole and is carried on the top surface. The positioning pillar is inserted into the positioning hole to position the panel-shaped object. The pushing portion is adapted to move from the bottom surface toward the top surface and protrude out of the top surface, such that the panel-shaped object is pushed up by the pushing portion to be separated from the carrying fixture. In addition, a process method adapted to the process apparatus capable of pushing a panel-shaped object is also provided. | 2015-11-19 |
20150334889 | ELECTRONIC-COMPONENT MOUNTING SYSTEM - An electronic-component mounting system includes: mounting lines each including an electronic-component mounting apparatus; an operation information processor which collects operation information of the electronic-component mounting apparatus, applies a statistical process on the operation information, and produces operation quality information of the mounting lines; and a portable information terminal accessible to the operation information processor by wireless communication. An identification information transmission section which transmits identification information for identifying each of the mounting lines is disposed in each mounting line, and a reception section which receives the identification information is disposed in the portable information terminal. The portable information terminal displays on a display section thereof the operation quality information of one of the mounting lines located near the portable information terminal based on the identification information transmitted from the mounting lines. | 2015-11-19 |
20150334890 | Blueberry plant named 'Pinnacle' - ‘Pinnacle’ is a new and distinct variety of blueberry plant that has the following unique combination of desirable features outstanding in a new variety.
| 2015-11-19 |
20150334891 | Thuja hybrid Plant Named 'BFC68' - ‘BFC68’ is a distinctive variety of | 2015-11-19 |
20150334892 | Veronica Plant Named 'TNVERA' - A new and distinct form of | 2015-11-19 |
20150334893 | Ipomoea plant named 'DAYBREAK' - A new and distinct | 2015-11-19 |
20150334894 | Dianthus plant named 'KLEDP13122' | 2015-11-19 |
20150334895 | Dianthus Plant Named 'KLEDP14205' | 2015-11-19 |
20150334896 | Dianthus plant named 'KLEDP13155' | 2015-11-19 |
20150334897 | Fuchsia plant named 'FWURB19-0' - A new and distinct | 2015-11-19 |
20150334898 | Fuchsia plant named 'FWURW18-0' - A new and distinct | 2015-11-19 |
20150334899 | Dahlia plant named 'KLEDH13037' | 2015-11-19 |
20150334900 | Dahlia plant named 'KLEDH13033' | 2015-11-19 |
20150334901 | Begonia plant named 'KLEBG13465' | 2015-11-19 |
20150334902 | Begonia Plant Named 'KLEBG14477' | 2015-11-19 |
20150334903 | Eryngium Plant Named 'Neptunes Gold' - A new and distinct | 2015-11-19 |
20150334904 | Agastache plant named 'KUDOS GOLD' - A new and distinct form of | 2015-11-19 |
20150334905 | Bergenia plant named 'Spring Fling' - A new and distinct | 2015-11-19 |
20150334906 | Bergenia plant named 'Flirt' - A new and distinct | 2015-11-19 |
20150334907 | Coreopsis plant named 'FIREFLY' - A new and distinct | 2015-11-19 |
20150334908 | Salvia plant named 'KILLER CRANBERRY' - A new and distinct | 2015-11-19 |
20150334909 | ZANTEDESCHIA PLANT NAMED 'CAPTAIN SOLO' - A new and distinct | 2015-11-19 |