45th week of 2012 patent applcation highlights part 15 |
Patent application number | Title | Published |
20120280365 | DEVICE HAVING AND METHOD FOR FORMING FINS WITH MULTIPLE WIDTHS - A structure for a semiconductor device is disclosed. The structure includes a first feature and a second feature. The first feature and the second feature are formed simultaneously in a single etch process from a same monolithic substrate layer and are integrally and continuously connected to each other. The first feature has a width dimension of less than a minimum feature size achievable by lithography and the second feature has a width dimension of at least equal to a minimum feature size achievable by lithography. | 2012-11-08 |
20120280366 | RADIO- AND ELECTROMAGNETIC INTERFERENCE THROUGH-SILICON VIAS FOR STACKED- DIE PACKAGES, AND METHODS OF MAKING SAME - An apparatus includes a radio-frequency die with shielding through-silicon vias and a die backside lattice lid that shield a sector in the RF die from radio - and electromagnetic interference. | 2012-11-08 |
20120280367 | METHOD FOR MANUFACTURING A SEMICONDUCTOR SUBSTRATE - The invention relates to a method for manufacturing a semiconductor substrate by providing a seed support layer and a handle support layer, forming at least one semiconductor layer, in particular of a Group III/V-semiconductor material, over the seed support layer, wherein the at least one semiconductor layer is in a strained state, forming a bonding layer over the at least one semiconductor layer, forming a bonding layer over the handle support layer, and bonding the seed and handle substrates together to obtain a donor-handle compound, by direct bonding between the bonding layer of the seed substrate and the bonding layer of the handle substrate. At least one of the bonding layer of the seed substrate and the bonding layer of the handle substrate includes a silicon nitride. | 2012-11-08 |
20120280368 | LAMINATED STRUCTURE FOR SEMICONDUCTOR DEVICES - Articles are described utilizing laminated glass substrates, for example, ion-exchanged glass substrates, with flexible glass or polymers and with semiconductor devices which may be sensitive to alkali migration are described along with methods for making the articles. | 2012-11-08 |
20120280369 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND SEMICONDUCTOR DEVICE - There is provided a method for manufacturing a semiconductor device, comprising simultaneously or alternately exposing a substrate, which has two or more kinds of thin films having different elemental components laminated or exposed; and performing different modification treatments to the thin films respectively. | 2012-11-08 |
20120280370 | SEMICONDUCTOR DEVICE DEVOID OF AN INTERFACIAL LAYER AND METHODS OF MANUFACTURE - A method of forming a dielectric stack devoid of an interfacial layer includes subjecting an exposed interfacial layer provided on a semiconductor material to a low pressure thermal anneal process for a predetermined time period at a temperature of about 900° C. to about 1000° C. with an inert gas purge. A semiconductor structure is also disclosed, with a dielectric stack devoid of an interfacial layer. | 2012-11-08 |
20120280371 | CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer. | 2012-11-08 |
20120280372 | Method for Reducing Thickness of Interfacial Layer, Method for Forming High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Insulating Film, High Dielectric Constant Gate Oxide Film, and Transistor Having High Dielectric Constant Gate Oxide Film - To provide a method for reducing a thickness of an interfacial layer, which contains: (a) forming a film of an oxide of a first metal on a semiconductor layer via an oxide film of a semiconducdor serving as an interfacial layer; and (b) forming a film of an oxide of a second metal on the film of the oxide of the first metal, where the second metal has higher valency than that of the first metal. | 2012-11-08 |
20120280373 | ACTIVE ELECTRONICS ON STRENGTHENED GLASS WITH ALKALI BARRIER - Articles are described utilizing strengthened glass substrates, for example, ion-exchanged glass substrates, with oxide or nitride containing alkali barrier layers and with semiconductor devices which may be sensitive to alkali migration are described along with methods for making the articles. | 2012-11-08 |
20120280374 | Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material - A semiconductor device has an interposer with a die attach area interior to the interposer and cover attach area outside the die attach area. A channel is formed into a surface of the interposer within the cover attach area. A dam material is formed over the surface of the interposer within the cover attach area between the channel and edge of the interposer. A semiconductor die is mounted to the die attach area of the interposer. An adhesive material is deposited in the cover attach area away from the channel and dam material. A cover, such as a heat spreader or shielding layer, is mounted to the die and interposer within the cover attach area. The cover presses the adhesive material into the channel and against the dam material to control outward flow of the adhesive material. Alternatively, ACF can be formed over the interposer to mount the cover. | 2012-11-08 |
20120280375 | SEMICONDUCTOR PACKAGE AND RADIATION LEAD FRAME - In a package wherein a lead part coupled to a semiconductor element by wire bonding, an element retention member to retain the semiconductor element on the top face side and radiate heat on the bottom face side, and an insulative partition part to partition the lead part from the element retention member with an insulative resin appear, a creeping route ranging from the top face to retain the semiconductor element to a package bottom face on a boundary plane between the element retention member and an insulative partition part includes a bent route having a plurality of turns. Consequently, it is possible to inhibit an encapsulation resin to seal a region retaining the semiconductor element from exuding toward the bottom face side of the package. | 2012-11-08 |
20120280376 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a central lead adjacent to the peripheral lead; forming a first top distribution layer on the peripheral lead top side; connecting an integrated circuit to the first top distribution layer; applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge; and attaching a heatsink to the central lead under the integrated circuit. | 2012-11-08 |
20120280377 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PAD CONNECTION AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a peripheral lead having a peripheral lead bottom side, a peripheral lead top side, a peripheral lead non-horizontal side, a peripheral lead horizontal ridge, and a peripheral lead conductive plate, the peripheral lead horizontal ridge protruding from the peripheral lead non-horizontal side; forming a first top distribution layer on the peripheral lead top side, the first top distribution layer having a first top terminal; connecting an integrated circuit to the first top distribution layer, the integrated circuit having a central portion directly over a plurality of the first top terminal; and applying an insulation layer directly on a bottom extent of the first top distribution layer and a peripheral lead ridge lower side of the peripheral lead horizontal ridge. | 2012-11-08 |
20120280378 | COL-BASED SEMICONDUCTOR PACKAGE INCLUDING ELECTRICAL CONNECTIONS THROUGH A SINGLE LAYER LEADFRAME - A semiconductor package is disclosed including a leadframe, memory die and controller die, one or more of which are customized to facilitate electrical connection of the memory and controller die bond pads to the contact pads of the host device via the leadframe. By customizing one or more of the leadframe, memory die and controller die, an interposer layer normally required to connect the die in the semiconductor package with a host device may be omitted. | 2012-11-08 |
20120280379 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME - A semiconductor device has a die pad, a heat dissipating plate in the form of a frame arranged between the die pad and leads so as to surround the die pad, members that connect the die pad and the inner edge of the heat dissipating plate, and a suspension lead linked to the outer extension of the heat dissipating plate. A semiconductor chip larger than the die pad is mounted over the die pad and the members. Top surfaces of the die pad and the members in opposition to the back surface of the chip are bonded to the back surface of the chip with silver paste. Heat is conducted from the back surface of the chip to the heat dissipating plate via the silver paste, the die pad, and the members, and dissipated to the outside of the semiconductor device via the leads. | 2012-11-08 |
20120280380 | HIGH PERFORMANCE GLASS-BASED 60 GHZ / MM-WAVE PHASED ARRAY ANTENNAS AND METHODS OF MAKING SAME - A glass-based, high-performance 60 GHz/mm-wave antenna includes cavities disposed in a phased-array antenna (PAA) substrate. The cavities are disposed below planar antenna elements. Emitter traces are disposed on the PAA substrate opposite the planar antenna elements and the emitter traces, the cavities, and the planar antenna elements are vertically aligned. | 2012-11-08 |
20120280381 | Window Interposed Die Packaging - A semiconductor device is described advantageously making use of the interposer principle. The semiconductor device comprises at least one semiconductor die, a window substrate being an inorganic substrate comprising at least one window-shaped cavity for mounting the at least one semiconductor die, the window substrate having interconnect structures. Furthermore, the at least one semiconductor die is positioned inside the at least one cavity and is connected to the interconnect structures, providing connections to another level of assembly or packaging of the semiconductor device. The invention also relates to a method of manufacturing such a semiconductor device. | 2012-11-08 |
20120280382 | SEMICONDUCTOR PACKAGES - Semiconductor package are provided. In one embodiment, the semiconductor package may include a substrate such as a circuit substrate, a semiconductor chip mounted on the circuit substrate, a molding (or an encapsulant) covering the semiconductor chip and the circuit substrate and including a first temperature control member, and a heat dissipation member covering the molding. | 2012-11-08 |
20120280383 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SAME - A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining layer. The semiconductor device comprises a joined member and a joining member which is joined to the joined member by means of brazing. The joined member is provided with a through hole which is open on the joining surface with the joining member, and a path communicating with the through hole is provided on at least one of the joining surface of the joining member with the joined member or the joining surface of the member with the joining member. | 2012-11-08 |
20120280384 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF - A fabrication method of a semiconductor structure includes providing a chip having at least an electrode pad, forming a titanium layer on the electrode pad, forming a dielectric layer on the chip and a portion of the titanium layer, forming a copper layer on the dielectric layer and the titanium layer, forming a conductive pillar on the copper layer corresponding in position to the titanium layer, and removing a portion of the copper layer that is not covered by the conductive pillar. When the portion of the copper layer is removed by etching, undercutting of the titanium layer is avoided since the titanium layer is covered by the dielectric layer, thereby providing an improved support for the conductive pillar to increase product reliability. | 2012-11-08 |
20120280385 | ELECTRONIC DEVICE PACKAGING STRUCTURE - An electronic device packaging structure is provided. The semiconductor device includes a semiconductor base, an emitter, a collector, and a gate. The emitter and the gate are disposed on a first surface of the semiconductor base. The collector is disposed on a second surface of the semiconductor base. A first passivation layer is located on the first surface of the semiconductor base surrounding the gate. A first conductive pad is disposed on the first passivation layer. A second conductive pad is disposed on the collector on the second surface. At least one conductive through via structure penetrates the first passivation layer, the first and second surfaces of the semiconductor base, and the collector to electrically connect the first and second conductive pads. | 2012-11-08 |
20120280386 | PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BONDS TO ENCAPSULATION SURFACE - A microelectronic assembly includes a substrate having a first surface and a second surface remote from the first surface. A microelectronic element overlies the first surface and first electrically conductive elements are exposed at one of the first surface and the second surface. Some of the first conductive elements are electrically connected to the microelectronic element. Wire bonds have bases joined to the conductive elements and end surfaces remote from the substrate and the bases, each wire bond defining an edge surface extending between the base and the end surface. An encapsulation layer extends from the first surface and fills spaces between the wire bonds such that the wire bonds are separated by the encapsulation layer. Unencapsulated portions of the wire bonds are defined by at least portions of the end surfaces of the wire bonds that are uncovered by the encapsulation layer. | 2012-11-08 |
20120280387 | THREE-DIMENSIONAL STACKED SUBSTRATE ARRANGEMENTS - Three-dimensional stacked substrate arrangements with reliable bonding and inter-substrate protection. | 2012-11-08 |
20120280388 | COPPER PILLAR BUMP WITH NON-METAL SIDEWALL PROTECTION STRUCTURE AND METHOD OF MAKING THE SAME - This description relates to an integrated circuit device including a conductive pillar formed over a substrate. The conductive pillar has a sidewall surface and a top surface. The integrated circuit device further includes an under-bump-metallurgy (UBM) layer between the substrate and the conductive pillar. The UBM layer has a surface region. The integrated circuit device further includes a protection structure on the sidewall surface of the conductive pillar and the surface region of the UBM layer. The protection structure is formed of a non-metal material. | 2012-11-08 |
20120280389 | CHIP PACKAGE AND FABRICATION METHOD THEREOF - The invention provides A chip package, comprising: a semiconductor substrate having opposite first and second surfaces, at least one bond pad region, and at least one device region; a plurality of conductive pad structures disposed on the bond pad region at the first surface of the semiconductor substrate; and a plurality of heavily doped regions isolated from one another, underlying and electrically connected to the conductive pad structures, wherein the heavily doped regions are disposed in a carrier substrate which is bonded to the first surface of the semiconductor substrate. | 2012-11-08 |
20120280390 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ROUTED CIRCUIT LEAD ARRAY AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace. | 2012-11-08 |
20120280391 | SEMICONDUCTOR DEVICE CONDUCTIVE PATTERN STRUCTURES AND METHODS OF MANUFACTURING THE SAME - A conductive pattern structure includes a first insulating interlayer on a substrate, metal wiring on the first insulating interlayer, a second insulating interlayer on the metal wiring, and first and second metal contacts extending through the second insulating interlayer. The first metal contacts contact the metal wiring in a cell region and the second metal contact contacts the metal wiring in a peripheral region. A third insulating interlayer is disposed on the second insulating interlayer. Conductive segments extend through the third insulating interlayer in the cell region and contact the first metal contacts. Another conductive segment extends through the third insulating interlayer in the peripheral region and contacts the second metal contact. The structure facilitates the forming of uniformly thick wiring in the cell region using an electroplating process. | 2012-11-08 |
20120280392 | Semiconductor Component Havin a Plated Through-Hole and method for the Production Thereof - A connection contact layer ( | 2012-11-08 |
20120280393 | Electromechanical Microswitch for Switching an Electrical Signal, Microelectromechanical System, Integrated Circuit, and Method for Producing an Integrated Circuit - The invention relates to a microelectromechanical system with an electromechanical microswitch for switching an electrical signal in particular a radio frequency signal, in particular in a GHz range, comprising a multi-level conductive path layer stack arranged on a substrate, wherein conductive paths of the multi-level conductive path layer stack arranged in different conductive levels are insulated from one another through electrically insulating layers and electrically connected with one another through via contacts, an electromechanical switch which is integrated in a recess of the multi-level conductive path layer stack and which includes a contact pivot, an opposite contact and at least one drive electrode for the contact pivot, wherein the contact pivot, the opposite contact and the at least one drive electrode respectively form a portion of a conductive level of the multi-level layer stack. | 2012-11-08 |
20120280394 | SEMICONDUCTOR DEVICE WITH SEG FILM ACTIVE REGION - A semiconductor device and a method for manufacturing the same are provided. A barrier film is formed in a device separating structure, and the device separating structure is etched at a predetermined thickness to expose a semiconductor substrate. Then, a SEG film is grown to form an active region whose area is increased. As a result, a current driving power of a transistor located at a cell region and peripheral circuit regions is improved. | 2012-11-08 |
20120280395 | 3-D Integration using Multi Stage Vias - A TSV can be formed having a top section via formed through the top substrate surface and a bottom section via formed through the bottom substrate surface. The top section cross section can have a minimum cross section corresponding to design rules, and the top section depth can correspond to a workable aspect ratio. The top section via can be filled or plugged so that top side processing can be continued. The bottom section via can have a larger cross section for ease of forming a conductive path therethrough. The bottom section via extends from the back side to the bottom of the top section via and is formed after the substrate has been thinned. The TSV is can be completed by forming a conductive path after removing sacrificial fill materials from the joined top and bottom section vias. | 2012-11-08 |
20120280396 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2012-11-08 |
20120280397 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device includes forming an interlayer dielectric layer, forming trenches by etching the interlayer dielectric layer, forming a copper (Cu) layer to fill the trenches, and implanting at least one of an inert element, a nonmetallic element, and a metallic element onto a surface of the Cu layer. | 2012-11-08 |
20120280398 | METHOD FOR AIR GAP INTERCONNECT INTEGRATION USING PHOTO-PATTERNABLE LOW K MATERIAL - Methods for producing air gap-containing metal-insulator interconnect structures for VLSI and ULSI devices using a photo-patternable low k material as well as the air gap-containing interconnect structure that is formed are disclosed. More particularly, the methods described herein provide interconnect structures built in a photo-patternable low k material in which air gaps are defined by photolithography in the photo-patternable low k material. In the methods of the present invention, no etch step is required to form the air gaps. Since no etch step is required in forming the air gaps within the photo-patternable low k material, the methods disclosed in this invention provide highly reliable interconnect structures. | 2012-11-08 |
20120280399 | BUFFER PAD IN SOLDER BUMP CONNECTIONS AND METHODS OF MANUFACTURE - Structures are provided with raised buffer pads for solder bumps. Methods are also provided for forming the raised buffer pads for solder bumps. The method includes forming a raised localized buffer pad structure on a tensile side of a last metal layer of a solder bump connection. The raised localized buffer pad structure increases a height of a portion of a pad structure of the solder bump connection with respect to a compressive side of the last metal layer. | 2012-11-08 |
20120280400 | ELECTRONIC CIRCUITS INCLUDING PLANAR ELECTRONIC DEVICES - A method for use in the manufacture of an electronic circuit comprising at least one substantially planar electronic device is disclosed. The method comprises:
| 2012-11-08 |
20120280401 | SEMICONDUCTOR DEVICE - A seal ring structure is formed through a multilayer structure of a plurality of dielectric films in a peripheral part of a chip region to surround the chip region. A dual damascene interconnect in which an interconnect and a plug connected to the interconnect are integrated is formed in at least one of the dielectric films in the chip region. Part of the seal ring structure formed in the dielectric film in which the dual damascene interconnect is formed is continuous. A protection film formed on the multilayer structure has an opening on the seal ring. A cap layer connected to the seal ring is formed in the opening. | 2012-11-08 |
20120280402 | Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die - A plurality of semiconductor die is mounted to a carrier separated by a peripheral region. An insulating material is deposited in the peripheral region. A first opening is formed in the insulating material of the peripheral region to a first depth. A second opening is formed in the insulating material of the peripheral region centered over the first opening to a second depth less than the first depth. The first and second openings constitute a composite through organic via (TOV) having a first width in a vertical region of the first opening and a second width in a vertical region of the second opening. The second width is different than the first width. A conductive material is deposited in the composite TOV to form a conductive TOV. An organic solderability preservative (OSP) coating is formed over a contact surface of the conductive TOV. | 2012-11-08 |
20120280403 | Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die - A plurality of semiconductor die is mounted to a carrier separated by a peripheral region. An insulating material is deposited in the peripheral region. A first opening is formed in the insulating material of the peripheral region to a first depth. A second opening is formed in the insulating material of the peripheral region centered over the first opening to a second depth less than the first depth. The first and second openings constitute a composite through organic via (TOV) having a first width in a vertical region of the first opening and a second width in a vertical region of the second opening. The second width is different than the first width. A conductive material is deposited in the composite TOV to form a conductive TOV. An organic solderability preservative (OSP) coating is formed over a contact surface of the conductive TOV. | 2012-11-08 |
20120280404 | STACK PACKAGES HAVING FASTENING ELEMENT AND HALOGEN-FREE INTER-PACKAGE CONNECTOR - A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate. | 2012-11-08 |
20120280405 | SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACURING THE SAME - Provided are semiconductor devices and methods of manufacturing the same. The semiconductor package includes a substrate, a first semiconductor chip mounted on the circuit substrate and having a first width, a second semiconductor chip overlying the first semiconductor chip and having a second width greater than the first width, and a first under filler disposed between the first and second semiconductor chips, covering a side surface of the first semiconductor chip and having an inclined side surface. | 2012-11-08 |
20120280406 | SEMICONDUCTOR DEVICE - A semiconductor device has a three dimensional multi-chip structure including a plurality of chips stacked one on another. The three dimensional multi-chip structure includes a first chip, and a second chip being adjacent to the first chip on an upper or lower side of the first chip, and larger than the first chip. A through electrode is formed in at least one of the first chip or the second chip. The first chip is electrically connected to the second chip via the through electrode. A resin is provided on a surface of the second chip closer to the first chip in a portion of the second chip located outside the first chip. | 2012-11-08 |
20120280407 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ELECTRICAL INTERFACE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming an isolated contact having a contact protrusion, the contact protrusion having a lower protrusion surface, an upper protrusion surface, and a protrusion sidewall; forming a die paddle, adjacent to the isolated contact, having a die paddle protrusion, the die paddle protrusion having a lower die protrusion surface, an upper die protrusion surface, and a die protrusion sidewall; depositing a contact pad on the contact protrusion; depositing a die paddle pad on the die paddle protrusion; coupling an integrated circuit die to the contact protrusion; and molding an encapsulation on the integrated circuit die. | 2012-11-08 |
20120280408 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FORMED INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a die paddle having an internal portion with a trench along a perimeter of the die paddle; forming an interconnect having a concave indentation and an upper portion, the upper portion, opposite the concave indentation, aligned horizontally to the internal portion; | 2012-11-08 |
20120280409 | Micromechanical Method and Corresponding Assembly for Bonding Semiconductor Substrates and Correspondingly Bonded Semiconductor Chip - A micromechanical assembly for bonding semiconductor substrates includes a semiconductor substrate having a chip pattern having a plurality of semiconductor chips, each having a functional region and an edge region surrounding the functional region. There is a bonding frame made of a bonding alloy made from at least two alloy components in the edge region, spaced apart from the functional region. Within the part of the edge region surrounding the bonding frame between the bonding frame and the functional region, there is at least one stop frame made of at least one of the alloy components, which is configured such that when a melt of the bond alloy contacts the stop frame during bonding, the bonding alloy solidifies. | 2012-11-08 |
20120280410 | FLUID AERATOR - A fluid aerator connectable to the neck of a container holding a fluid, the fluid aerator having a tubular body having one end adapted to sealingly connect to the neck of the container, a plurality of mixing elements disposed within the tubular body, and wherein when the fluid aerator is attached to the neck of the container and fluid is dispensed from the container, ambient air is drawn into the tubular body and mixes with fluid as it passes over the plurality of mixing elements to aerate the fluid. | 2012-11-08 |
20120280411 | Liquid Distribution Trough For Use In Towers in Sulphuric Acid And Carbon Capture Plants - A liquid distribution trough contained within a tower for the purpose of mass or thermal exchange between at least a first liquid and a second fluid; the trough having an upper section and a lower section; the lower section for receiving the first liquid; a horizontal dividing member separating the upper section from the lower section and having at least one dividing member portion defining an aperture to allow for passage of the liquid fluid from the lower section to the upper section; a feed conduit means in communication with the lower section to provide feed first liquid flow to the lower section; the lower section having at least one inlet portion defining a liquid inlet in communication with the feed conduit means; and a first baffle adjacent the inlet portion operably impacted by the first liquid flow and to hinder preferential flow along the walls of the trough and the dividing member. The trough and tower are of particular value in a sulphuric acid plant and a carbon dioxide capture plant. | 2012-11-08 |
20120280412 | FIBERS FOR PRODUCING COMPOSITE MATERIALS AND METHODS OF PRODUCING CARBON FIBER PRECURSOR FIBERS AND CARBON FIBERS - A method for producing carbon-containing fibers, in particular carbon fibers and/or the precursor fibers thereof, contains the following steps: a) providing one or more starting material fibers; b) bringing the one or more starting material fibers in contact with at least one treatment fluid, wherein a treatment fluid has at least one silicon compound and has a content of 0-25 wt. % water, in relation to the total weight of the treatment fluid; c) treating the one or more starting material fibers with the treatment fluid during a treatment time having a duration of at least three minutes at a treatment temperature ranging from 126 C to 450 C. | 2012-11-08 |
20120280413 | REFRACTORY CARBON-BONDED MAGNESIA BRICK AND PROCESS FOR PRODUCING IT - The disclosure relates to a process for producing a refractory, ceramically fired, carbon-bonded magnesia brick whose matrix is more than 70% by weight, in particular from 80 to 98% by weight, of MgO grains and also a carbon framework binder matrix resulting from carbonization, and pores, wherein the MgO grains are fixed by means of carbon bonding of the carbon framework and at least 30%, in particular from 50 to 100%, of the MgO grains have at least one sintering bridge resulting from the ceramic firing. | 2012-11-08 |
20120280414 | In-Process Monitoring for Composite Parts Quality Control Using Piezoelectric Wafer Active Sensors (PWAS) Technologies - Methods of forming a molded composite material are generally provided. A composite forming precursor (e.g., fibers and/or a resin material) can be applied onto a mold that includes a plurality of piezoelectric sensors embedded into the mold. The composite forming precursor can then be cured adjacent to the mold to form a molded composite material. During curing, the molded composite material can be monitored, using the piezoelectric sensors to detect any defects formed during curing. | 2012-11-08 |
20120280415 | CONTROL SYSTEM FOR TOOLING - A tooling system for moulding a work piece is provided The tooling system comprises a mould tool ( | 2012-11-08 |
20120280416 | METHOD FOR MAKING A COMPOSITE ARTICLE - A composite includes a first preform and a second preform spaced from and in overlying relationship to the first preform. The second preform defines at least one first opening extending therethrough along an axis transverse to the first preform. A first surface layer is disposed adjacent to the second preform and on an opposite side of the second preform from the first preform. A polymeric composition including the reaction product of an isocyanate component and an isocyanate-reactive component is disposed between the first preform and the second preform. The polymeric composition adheres the first surface layer to the second preform through the at least one first opening. The surface layer is adhered to the second preform during molding of the composite article and in the absence of additional adhesive, thereby reducing production time and cost of the composite article. | 2012-11-08 |
20120280417 | LEAD-FREE PIEZOELECTRIC CERAMIC FILMS AND A METHOD FOR MAKING THEREOF - This invention relates to a method of making lead-free piezoelectric ceramic films. Specifically, the invention is directed to a method for fabricating lead-free piezoelectric free standing films having enhanced piezoelectric properties. The films may be used for a number of applications including incorporation in microelectronic devices such as energy harvesting devices and sensor technologies. | 2012-11-08 |
20120280418 | THERMOELECTRIC CONVERSION MATERIAL AND METHOD OF PRODUCING THE SAME - A thermoelectric conversion material wherein at least a part of the insulating material contained in the thermoelectric conversion material has a particle size not larger than a mean free path of the phonons in the insulating material or wherein a dispersion gap of the insulating material is not larger than a mean free path of the phonons in the thermoelectric conversion material, and a method of producing the thermoelectric conversion material comprising the steps of forming composite nano particles by reducing and precipitating starting particles of a thermoelectric conversion material on the nano particles constituted by an insulating material, followed by a heat treatment to coat the nano particles with the thermoelectric conversion material; and packing and sintering the composite nano particles. | 2012-11-08 |
20120280419 | METHOD AND APPARATUS FOR FLUIDIC PELLETIZATION, TRANSPORT, AND PROCESSING OF MATERIALS - A continuous process wherein a material is melt processed and subsequently pelletized, transported, optionally chemically and/or physically modified, and subsequently optionally defluidized utilizing fluidic processing. The transport fluids and fluid combinations utilize a wide range of process temperatures facilitating enhancement of conditioning, improvement of moisture content, pelletization of hygroscopic, water-sensitive, and water-soluble materials, pelletization of non-polymeric and rheologically non-shear sensitive and marginally shear-sensitive polymeric materials, modification of pellet components through extraction, pelletization of low melting materials, tacky materials, pellet coating, and pellet impregnation otherwise difficult and challenging using conventional technologies. | 2012-11-08 |
20120280420 | ENVIRONMENTALLY FRIENDLY ANIMAL LITTER - A method of making an animal litter that includes geopolymerized ash is described herein. Generally, the animal litter is made from a quantity of a pozzolanic ash mixed with a sufficient quantity of water and an alkaline activator to initiate a geopolymerization reaction that forms geopolymerized ash. After the geopolymerized ash is formed, it is dried, broken into particulates, and sieved to a desired size. These geopolymerized ash particulates are used to make a non-clumping or clumping animal litter. Odor control may accomplished with the addition of a urease inhibitor, pH buffer, an odor eliminating agent, and/or fragrance. | 2012-11-08 |
20120280421 | Jamming Methods and Apparatus - In exemplary implementations of this invention, a reconfigurable device comprises flexible bladder that encloses a jammable material. The geometry of the device can be altered by unjamming the jammable material (making it flexible), changing the shape of the device while it is flexible, and then jamming the jammable material (making it rigid). In some applications of this invention, a joint connects rigid arms. The ends of the rigid arms are enclosed in the bladder. By varying the stiffness of the jammable material in the bladder, the stiffness of the joint can be controlled. | 2012-11-08 |
20120280422 | METHOD OF FABRICATING SHAPE MEMORY POLYMER-BASED THREE-DIMENSIONAL DEVICES - A method of fabricating a three-dimensional geometrically complex device is provided, based on a shape memory polymer. The method includes selecting a substrate composed of a shape memory polymer. A filling material is deposited in or on a planar surface of the substrate, thereby forming the device. The planar surface of the substrate may be in either a temporary or original shape of the substrate. Prior to the deposition of the filling material, the substrate is transformed into a first shape having a planar surface if the original shape of the substrate does not have a planar surface. The device is configured to be thermo-mechanically tunable to display a plurality of geometrically complex shapes, under a series of temperature changes and stress. | 2012-11-08 |
20120280423 | RECYCLING COMPOUND TUBE MEMBER FABRICATION METHOD - A recycling compound tube member fabrication method includes the steps of a) covering a core tube member with a strippable layer; b) wrapping a glass fiber cloth about the strippable layer; c) putting the core tube member with the wrapped glass fiber cloth in the cavity of a hot press mold and evenly covering the glass fiber cloth with a thermoplastic material in the cavity of the hot press; d) closing the hot press mold and heating the hot press mold to fuse the thermoplastic material and the glass fiber cloth; and e) cooling down the hot press mold and then removing the molded tube member from the hot press mold and removing the core tube member from the molded tube member. | 2012-11-08 |
20120280424 | COIL WINDING SYSTEM AND METHOD FOR FABRICATING MOLDED COIL - There is provided a system for readily and efficiently fabricating a wound coil composed of a bobbinless coil. The system includes a coil winding device having an upper jig to which an upper plate is attached and a lower jig to which a lower plate is attached which are provided so as to be relatively displaceable and a tension device for applying predetermined tension to a wire rod fed from a wire rod supplying source. The coil winding device is provided with a claw section having first through third split claws that function as a winding section around which the wire rod is wound between the upper and lower plates and that slide in a radial direction when the upper jig is assembled coaxially with the lower jig. | 2012-11-08 |
20120280425 | MOLD FOR MEASURING FLOW CHARACTERISTICS, METHOD FOR MEASURING FLOW CHARACTERISTICS, RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS - According to the invention, a mold for measuring flow characteristics which is used to measure the flow characteristics of a resin composition, which is a measurement subject, by injecting the resin composition into a flow path provided in the mold, in which the minimum distance from the cross-sectional center of gravity to the outline in the cross-sectional shape of the flow path is equal to or more than 0.02 mm and equal to or less than 0.4 mm, and a method for measuring flow characteristics in which a resin composition, which is a measurement subject, is injected into the flow path of the mold for measuring flow characteristics, and made to flow in a single direction, and the flow distance from the start point to the end point of the flow of the resin composition is obtained as the flow length are provided. | 2012-11-08 |
20120280426 | MANUFACTURING METHOD OF DECORATING MOLDING - A manufacturing method of a decorative molding having uneven pattern by a film injection molding process with a decorative sheet comprising a thermoplastic surface layer having uneven structure and a thermoplastic substrate layer comprising a step of producing a pre-decorative sheet by preparing a thermoplastic surface-protection-layer having uneven structure, producing a thermoplastic surface layer by coating thermoplastic resin on the uneven structured surface of the thermoplastic surface-protection-layer, and producing a substrate layer on the opposite side of the thermoplastic surface layer from the thermoplastic surface-protection-layer. | 2012-11-08 |
20120280427 | METHOD AND DEVICE FOR PRODUCING COILS FROM WIRES - The invention relates to a method and a device for producing coils ( | 2012-11-08 |
20120280428 | METHOD OF MOLDING A MICRONEEDLE - A method of molding a microneedle including providing a mold apparatus having a mold insert having the negative image of at least one microneedle, a compression core, a mold housing configured to allow a reciprocal motion between the mold insert and the compression core. The method includes placing the mold apparatus in a closed position, injecting polymeric material into the closed mold apparatus, compressing the injected polymeric material between the mold insert and the compression core by a reciprocal motion between the compression core and the mold insert, opening the mold, and removing a molded microneedle from the mold. The mold insert has a mold insert height and the molded microneedle has a height that is from about 90% of the mold insert height to about 115% of the mold insert height. | 2012-11-08 |
20120280429 | APPARATUS AND METHOD FOR PRODUCING A MULTICRYSTALLINE MATERIAL HAVING LARGE GRAIN SIZES - A crystal growth apparatus is disclosed comprising a crucible, optionally contained within a crucible box, on a crucible support block, wherein the bottom of the crucible, the bottom plate of the crucible box, if used, and/or the crucible support block comprise at least one cavity configured to circulate at least one coolant therein. Also disclosed is a method of preparing a crystalline material using the disclosed crystal growth apparatus as well as the resulting crystalline material, having larger overall grain sizes. | 2012-11-08 |
20120280430 | COMPOSITE TOOLING CONTAINING CARBON NANOTUBES AND PRODUCTION OF PARTS THEREFROM - Toolings containing a composite having a coefficient of thermal expansion of less than about 5 ppm/° C. are described. The composites contain a matrix material and a carbon nanotube material and are operable for forming a part thereon. Methods for forming such toolings and use of such toolings to form parts thereon are also described. The carbon nanotube material can be a carbon nanotube-infused fiber material. Use of the carbon nanotube material in the tooling allows decreased curing and consolidation process times of the part to be realized. | 2012-11-08 |
20120280431 | DEVICE AND METHOD FOR ETCHING A PATTERN - An apparatus for etching a pattern in an etching zone laid out on a substrate includes a pen that can be freely moved manually relative to the etching zone, the pen being equipped with an etching head able to etch the substrate at an etching point when etching is triggered, a measuring unit for measuring position and orientation of the etching head relative to the substrate, a control unit configured to calculate coordinates of the etching point as a function of the measured position and orientation of the etching head relative to the substrate, to trigger etching at the etching point if the calculated coordinates of the etching point correspond to coordinates of a point to be etched, the coordinates of the point to be etched being encoded in a prerecorded drawing of the pattern, and to automatically prevent etching otherwise. | 2012-11-08 |
20120280432 | METHOD FOR MANUFACTURING BIOABSORBABLE STENTS - A method for manufacturing a bioabsorbable stent and an apparatus for doing the same are disclosed. The method includes providing a polymer resin, melting the polymer resin to form a molten hollow parison, cooling the molten hollow parison to form a hot hollow parison, elongating the hot hollow parison, expanding the hot hollow parison by feeding a compressed gas into the hot hollow parison to form a stent preform, and patterning the stent preform to form a bioabsorbable stent. | 2012-11-08 |
20120280433 | METHOD FOR MANUFACTURING PLANT FIBER FOAM MATERIAL - A method for manufacturing a foam material containing natural plant fibers includes: providing a plurality of plant fibers, a foaming agent, a thickening agent, a filler, and a flame retardant in a mixing tank for mixing and stirring, so as to form a homogeneous mixture; filling or injecting the homogeneous mixture into a forming container or a forming mold; utilizing a pressurizing device for applying a predetermined pressure; and heating the homogeneous mixture to a temperature higher than the foaming temperature of the foaming agent, such that foaming of the foaming agent takes place, and consequently a large amount of gas is generated, the homogeneous mixture being transformed to a plant fiber foam material having a porous foam structure. The manufacturing method can be easily carried out through existing equipments, and the plant fiber foam material is made from the natural plant fibers capable of being decomposed naturally. | 2012-11-08 |
20120280434 | MANUFACTURING DEVICE FOR ABSORBENT BODY AND MANUFACTURING METHOD THEREFOR - A manufacturing device for an absorption body including an accumulation portion that is to have accumulated thereto liquid absorbent fiber in a first gas flowing through a duct and a polymer discharge tube that is introduced into the duct and that discharges from a discharge hole a second gas having high-absorbent polymer mixed therein toward the accumulation portion, wherein a flow path of the second gas formed in the polymer discharge tube has at a location on the discharge hole side of the flow path a distribution change area where a distribution state of high-absorbent polymer is changed, and a sectional area of the flow path at the distribution change area is narrower than a sectional area of a flow path at a part adjacent on an upstream side as well as a downstream side of the distribution change area. | 2012-11-08 |
20120280435 | ACTIVE MATERIALS FOR LITHIUM-ION BATTERIES - Methods for forming a cathode active material comprise sintering flakes formed from a nickel, manganese, cobalt and lithium-containing slurry to form the cathode material having the formula Li | 2012-11-08 |
20120280436 | Method of integrating a blast furnace with an air gas separation unit - The invention relates to a method of integrating a plurality of blast furnaces with a plurality of air gas separation units, in which the replacement blower available on the blast furnace site is used to feed compressed air into an air gas separation unit making it possible to enrich the blast-furnace blast with oxygen, this unit being stopped when one of the blowers of the blast furnaces has to be replaced with the blower used by the air gas separation unit. | 2012-11-08 |
20120280437 | Slit Lance Burner For Flash Smelter - A burner for a flash smelting furnace. The burner includes an injector having a sleeve for delivering pulverous feed material to the furnace and having a central lance within the sleeve to supply compressed air for dispersing the pulverous feed material in the reaction shaft of the furnace. The central lance has an annular slot at its tip for creating a substantially continuous air curtain. | 2012-11-08 |
20120280438 | Burner and Feed Apparatus For Flash Smelter - A burner for a flash smelting furnace. The burner includes a distributor for receiving pulverous feed material from a plurality of feed pipes. The distributor has at least one curved deflector that directs the feed stream in an evenly distributed annulus into the sleeve of the burner. | 2012-11-08 |
20120280439 | Burner With Velocity Adjustment For Flash Smelter - A burner for a flash smelting furnace. The burner has an adjustable nozzle to control the velocity of the combustion gas supply to the reaction shaft. The nozzle is defined by the burner injector and a surrounding structure that extends from the burner wind box through an opening in the burner block that integrates the burner with the furnace. The nozzle is adjusted by control means that is exterior of the wind box. | 2012-11-08 |
20120280440 | Log Splitter Hydraulic Cylinder Reset Spring Device - A reset spring device for a one-log splitter single-action hydraulic cylinder comprises a spring guide, reset spring, bearing, curved transmission lever, and guide seal. The spring guide has a first end and second end, the reset spring housed within the spring guide, the bearing housed within a portion at the first end, the spring abutting the bearing, the guide seal disposed at the first end of the guide, the transmission lever positioned outside the spring guide and engaged with the bearing. The transmission lever having a curved protrusion operably engaged through a longitudinal opening on the spring guide and through a groove on the bearing. A piston rod pin is connected to the lever. During operation, when a cylinder is pushing forward, the lever compresses the spring through the bearing; and when a handle is released, the log splitter ceases operating, the cylinder is reset by each reset spring device. | 2012-11-08 |
20120280441 | STRUT MOUNT - Disclosed is a strut mount wherein an inclination of an outer circumferential surface of an outer cylinder ( | 2012-11-08 |
20120280442 | MEDIA CARRIER - A media carrier, adapted to hold a plurality of pieces of magnetic media, is disclosed. This media carrier can be placed on the workpiece support, or platen, allowing the magnetic media to be processed. In some embodiments, the media carrier is designed such that only one side of the magnetic media is exposed, requiring a robot or other equipment to invert each piece of media in the carrier to process the second side. In other embodiments, the media carrier is designed such that both sides of the magnetic media are exposed. In this scenario, the media carrier is inverted on the platen to allow processing of the second side. | 2012-11-08 |
20120280443 | HANGING DEVICE FOR ANODIZING - A device for hanging a workpiece for anodizing includes a hanging member for fixing the workpiece, a positioning assembly, a latching assembly mounted on the positioning assembly, and a connecting rod assembly. The hanging member includes a latching end. The positioning assembly and the latching assembly cooperatively defines a latching space for positioning the hanging member. The connecting rod assembly includes a cam pivoted with the latching assembly, and a rod fixed with the cam. The cam includes a resisting end. The latching end of the hanging member is latched in the latching space. The cam is rotatable by means of the rod, such that the rod is capable of driving the resisting end of the cam to resist on the latching end to fix the hanging member, or to move away from the latching end to release the hanging member. | 2012-11-08 |
20120280444 | HIGH SPEED INTERFOLDER SEPARATOR - An interfolder separator apparatus and method utilize a pair of count fingers that are movable longitudinally along and transversely to a stream of folded sheets, for temporarily supporting each successive pack formed by the separator and then releasing each successive pack when partly completed to alternating build fingers, so that the operation of separating successive packs from one another is performed separately from the operations of completing the build of each pack and transporting the completed packs to downstream operations. The count fingers may be mounted to pivot about axes that are movable longitudinally along and transversely to the stream of sheets. A first or last panel of the completed pack may also be folded back partly upon itself, after the partly completed pack is released by the count fingers. Some or all of the fingers may be spring loaded and automatically resettable for clearing jams. | 2012-11-08 |
20120280445 | METHOD AND APPARATUS FOR FEEDING MEDIA SHEETS IN AN IMAGE PRODUCTION DEVICE - A method and apparatus for feeding media sheets in an image production device is disclosed. The method may include applying a downward airflow to a top of a leading edge of a media sheet located at a top of a media stack that is to be fed to an image production section of the image production device, and applying a vacuum airflow to the top of the leading edge of the media sheet located at the top of the media stack that is to be fed to the image production section of the image production device, the applied downward airflow and the applied vacuum airflow causing the top media sheet to separate from the media stack, and feeding the separated top media sheet to the image production section. | 2012-11-08 |
20120280446 | PAPER TRANSMITTING APPARATUS FOR PRINTER - A paper transmitting apparatus for a printer, comprises a bracket comprising a paper tray mounted thereon, the paper tray is adapted to receive a piece of paper in the paper tray; and a driving mechanism comprising a roller rotatablely mounted on the driving mechanism, a sleeve fitted around the roller, a plurality of grains located on an outer surface of the sleeve to increase a surface roughness of the outer surface of the sleeve, the outer surface of the sleeve rests on the piece of paper, and the driving mechanism is adapted to rotate the roller to move the piece of paper on the paper tray. | 2012-11-08 |
20120280447 | CLAMPING DEVICE AND PRINTER | 2012-11-08 |
20120280448 | METHOD AND DEVICE FOR DETERMINING THE SECONDARY ATTRIBUTES OF A SYMBOL BY CHANCE - A method and device for determining the secondary attributes of a symbol by chance comprising a holder having a partition, relatively short magnets, and an elongated magnet. The relatively short magnets have a smaller length than the elongated magnet. The I-Ching is consulted by placing two relatively short magnets in a random position on a first compartment of the holder and the elongated magnet is retained on a retaining surface in the second compartment of the holder. The sides of each of the relatively short magnets adjacent the elongated magnet and the sides of each of the relatively short magnets adjacent each other form three pairs of interacting magnetic poles. The user assigns a predetermined state to each of the eight magnetic interactions, records the state represented by the magnetic interaction, and repeats these steps until one or more I-Ching hexagrams are constructed. | 2012-11-08 |
20120280449 | THREE DIMENSIONAL GAME DEVICE - A three-dimensional game device may include selection units that are located at the corners, edges and sides of a body member, thereby creating strategic lines of selectable positions extending in three dimensions across the junction of at least two surfaces of the device. | 2012-11-08 |
20120280450 | SELF-STABILIZING JIGSAW PUZZLE - The disclosure relates to a jigsaw puzzle having at least two puzzle parts wherein each of the mutually facing circumferential edge sections on both sides of the connecting region and remote from the latter is provided with at least one circumferential edge piece, along which the course of the circumferential edge is defined by the bisector of a two-dimensional angle which is formed between two straight lines which intersect on the bisector and by an upper end point of the associated one of the mutually facing circumferential edge sections of the two puzzle parts to an upper end point of an opposite circumferential edge of the same puzzle part such that when puzzle parts are joined together along mutually facing circumferential edge sections, contact between the two puzzle parts occurs exclusively on said circumferential edge pieces and in the region of the undercut. | 2012-11-08 |
20120280451 | METHODS AND APPARATUS FOR EDUCATING - A method of educating includes providing a collectible trading card game with a plurality of trading cards. Each card may contain educational information including a consonant, vowel, number or mathematical operator and the cards are used to form a properly spelled word or to form a mathematically correct equation. In some forms, the method includes providing a game with a playing field and a set of game components with game component types having a predetermined power for affecting play of the game by affecting a power, effect, or value of the game component. The level of skill necessary to play the game may be varied by selectively implementing or disregarding the predetermined power of the game components. An educational game includes first and second game components with different expressions, powers, point values, and identifiers for distinguishing game components and facilitating game play. | 2012-11-08 |
20120280452 | BLACKJACK SIDE-BET - A game of Blackjack may include a mid-game side-bet that the dealer will go bust. The side-bet offered may be placed against any dealer face-up card—Ace, 2, 3, 4, 5, 6, 7, 8, 9, 10, Jack, Queen, or King. The payoff may vary depending upon the dealer face-up card and paid in accordance with a pay table. The bet may be paid when the dealer hits their hand and exceeds the total of 21, therefore going bust. The bet may lose when the dealer receives a standing hand of 17, 18, 19, 20 or 21. The side-bet may be made once the dealer's face-up card has been determined. The side-bet may be asked for at one time similar to an insurance bet or as each player acts on their individual hands. | 2012-11-08 |
20120280454 | METHODS FOR CONDUCTING PLAY OF A WAGERING GAME - A variant game of Hold 'Em poker allows for rules of play of one or all of players being allowed to remain in game with an option of checking or making specific wagering amounts in first play wagers, being limited in the size of subsequent available play wagers or prohibited from making additional play wagers if a first play wager has been made, being limited in the size of available later play wagers if a first or earlier play wager has been made, and having the opportunity for at least two and as many as three or four distinct opportunities in the stages in the play of a hand to be able to make one or more play wagers. | 2012-11-08 |
20120280455 | SPRING SEAL ASSEMBLY AND METHOD OF SEALING A GAP - A spring seal assembly includes a first plate and a second plate. One or more spring elements are located between the first plate and the second plate and compressible therebetween. The spring seal assembly is insertable into a gap between two adjacent components such that at least one of the first plate and the second plate at least partially block a flow between the two adjacent components while exerting a force on the two adjacent components to prevent vibration of the seal in the gap. A method of sealing between adjacent components includes at least partially compressing a spring seal assembly. The spring seal assembly is inserted into the gap and allowed to expand in the gap thereby at least partially blocking a flow between the two adjacent components while exerting a force on the two adjacent components to prevent vibration of the seal in the gap. | 2012-11-08 |
20120280456 | Tapered Channel Macro/Micro Feature for Mechanical Face Seals - A mechanical face seal includes a pair of relatively rotatable seal rings having opposing seal faces which define a sealing region therebetween. The sealing region extends radially between the inside and outside diameters of the seal rings to seal a fluid in a sealing chamber near one diameter thereof. The seal faces are provided with tapered channel macro/micro features which generate hydrodynamic lift during relative rotation of the seal rings. The tapered channel macro/micro feature shows significant improvement in seal performance when compared to an untextured face. Low contact and hence low wear are attributed to a more distributed hydrodynamic load support function. Likewise, low leakage is believed to be the result of optimized cavitation function, and no debris was discovered in the micro-features at the conclusion of any testing. | 2012-11-08 |
20120280457 | HYDRODYNAMIC SEAL WITH INCREASED FLEXIBILITY SEALING ELEMENT - A hydrodynamic shaft seal assembly includes a PTFE seal member having outer and inner sections. The outer section is affixed to an annular carrier. The inner section is free and includes at least one hydrodynamic groove in direct running contact with a rotating shaft or wear sleeve. A mid-portion of the seal member is formed between the inner and outer sections. The mid-portion is thinned and includes one or more annular undulations formed therein to improve flexibility of the inner section relative to the outer section. The seal assembly may include one or more excluder features. A rubber casing is molded about portions of the carrier. Preferably, one or more annular undulations are formed in a coining operation during the rubber molding process. | 2012-11-08 |
20120280458 | HYDRODYNAMIC NON-CONTACTING SEAL - A hydrodynamic non-contacting seal wherein the sealing surface of a rotatable sealing member is grooved in a spiral pattern such that the depth of the grooves decreases in a direction opposite to the direction of rotation of the rotatable sealing member. | 2012-11-08 |
20120280459 | STAINFREE PLUMBER'S PUTTY - A stainfree plumber's putty comprises at least one particulate filler and an organic binder comprising a liquid polyester and a low density wax, the putty being formulated to pass ASTM-D-2203—Staining of Oil and Resin-Base Caulking Compounds. | 2012-11-08 |
20120280460 | TWO-PIECE SIDE SEAL WITH COVERS - A side seal assembly is provided for sealing gaps between adjacent transition ducts in a gas turbine combustor arrangement. The side seal assembly includes a first elongated plate mounting an outer seal and a first fastening element at one end thereof; a second elongated plate mounting a second fastening element at one end thereof and an inner seal at an opposite end thereof. The first and second elongated plates are adapted to be joined in back-to-back relationship by means of the first and second fastening elements, such that in use, the outer and inner seals extend substantially parallel to, but offset from, the first and second elongated plates. The first elongated plate and the inner and outer seals substantially cover three radial gaps between the adjacent transition ducts. | 2012-11-08 |
20120280461 | Quick-Release Bit Adapter - A quick-release bit adapter includes a body having a driving hole extending from a driving section towards a connecting section of the body. The driving section includes a sliding hole extending at a non-parallel angle to and in communication with the driving hole. A resilient positioning member is mounted in the driving section. A releasing device is slideably mounted in the sliding hole. When the releasing device is in a first position, the resilient positioning member is engaged in cuts in an outer periphery of a bit in an engagement position received in the driving hole. When the releasing device is moved to a second position, the bit is disengaged from the resilient positioning member to allow easy removal of the bit. | 2012-11-08 |
20120280462 | HAND TRUCK BRAKE - The hand truck brake provides automatic braking for a hand truck as it negotiates a stairway or other uneven surface. The brake is adaptable to various types of hand trucks, including powered stair-climbing trucks. The brake includes two major assemblies. The first is a reciprocating plunger having a distal roller that travels along the surface. When the roller travels over the nose of a stairway tread, the plunger extends to actuate the brake. The second major assembly is a rotary cam rotated by the plunger as it extends. The cam has an extension and a brake shoe, the brake shoe engaging the underlying surface to stop the hand truck when the cam is rotated to its brake-engaging position. The assembly automatically retracts when the hand truck is oriented vertically. Additional controls are provided for the operator to extend or retract the brake mechanism. | 2012-11-08 |
20120280463 | FOLDABLE WALKER APPARATUS - There is provided a walker apparatus having a brake, a braking handle, a brake wire, a brake rod, and a brake rod assembly. A gripping member connects to the brake wire. The gripping member includes a plate having a first end, a second end and an aperture near the second end. The plate connects to the brake wire near the first end and the plate slidably receives the brake rod through the aperture near the second end. The gripping member includes a clamp that engages the brake wire via a set screw. The gripping member is spring-biased to remain free of the brake rod in a non-actuated mode. When the braking handle actuates the brake wire, the plate tilts with the first end elevating relative to the second end, thereby causing the plate to engage with and abut the brake rod for thereby actuating the brake rod to brake. | 2012-11-08 |
20120280464 | ADJUSTABLE LOAD-BEARING WHEELS AND KITS FOR PATIENT LIFTERS - Embodiments of the present disclosure include adjustable wheel assemblies for patient lifts. Actuation of a wheel assembly results in the wheel exerting an increased force on the surface supporting the patient lift, which may decrease the pressure of the remaining patient lift wheels on the support surface. Alternate embodiments include one or more adjustable wheel assemblies in a kit for attachment to a patient lift. A user input component may also be included to provide a single device a user can use to simultaneously actuate the wheel assemblies. Alternate embodiments utilize wedges, hinges, cams, and/or threaded members to increase the force exerted by the wheel on the support surface. | 2012-11-08 |
20120280465 | WHEEL SUSPENSION FOR MOTOR VEHICLES - A wheel suspension for motor vehicles includes at least one wheel guide element which is articulated both on an auxiliary frame that can be connected to the body of the motor vehicle and on a wheel carrier, a suspension and damping system as well as a steering system for the wheel. To achieve a universally applicable wheel suspension using identical parts, the auxiliary frame for each wheel suspension is designed as an independent modular frame, on which the a wheel guide element(s) is/are articulated, on which the suspension and damping system is supported, and on which at least one actuator is arranged directly or indirectly for actuating the suspension and damping system and/or the steering system and thus for setting predetermined wheel-specific wheel guidance and/or steering parameters. | 2012-11-08 |