44th week of 2018 patent applcation highlights part 53 |
Patent application number | Title | Published |
20180315675 | RESIN MOLDED BODY | 2018-11-01 |
20180315676 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315677 | EXTERNAL CONNECTION MECHANISM, SEMICONDUCTOR DEVICE, AND STACKED PACKAGE | 2018-11-01 |
20180315678 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2018-11-01 |
20180315679 | Circuit cooled on two-sides | 2018-11-01 |
20180315680 | LAMINATE AND METHOD OF MANUFACTURING LAMINATE | 2018-11-01 |
20180315681 | INTEGRATED CIRCUIT DIRECT COOLING SYSTEMS AND RELATED METHODS | 2018-11-01 |
20180315682 | SYSTEMS AND METHODS FOR REINFORCED ADHESIVE BONDING USING TEXTURED SOLDER ELEMENTS | 2018-11-01 |
20180315683 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315684 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-11-01 |
20180315685 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-11-01 |
20180315686 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315687 | BOARD AND METHOD OF MANUFACTURING BOARD | 2018-11-01 |
20180315688 | GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION | 2018-11-01 |
20180315689 | PACKAGE-ON-PACKAGE SEMICONDUCTOR ASSEMBLIES AND METHODS OF MANUFACTURING THE SAME | 2018-11-01 |
20180315690 | HIGH PERFORMANCE INTEGRATED RF PASSIVES USING DUAL LITHOGRAPHY PROCESS | 2018-11-01 |
20180315691 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315692 | SUBSTRATE AND METHOD FOR FABRICATION THEREOF | 2018-11-01 |
20180315693 | FLIP-CHIP DEVICE AND METHOD FOR PRODUCING A FLIP-CHIP DEVICE | 2018-11-01 |
20180315694 | TRACE/VIA HYBRID STRUCTURE WITH THERMALLY AND ELECTRICALLY CONDUCTIVE SUPPORT MATERIAL FOR INCREASED THERMAL AND ELECTRICAL PERFORMANCE | 2018-11-01 |
20180315695 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE | 2018-11-01 |
20180315696 | CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVERSAL PORTION THEREOF | 2018-11-01 |
20180315697 | CIRCUITIZED SUBSTRATE WITH ELECTRONIC COMPONENTS MOUNTED ON TRANSVERSAL PORTION THEREOF | 2018-11-01 |
20180315698 | PACKAGE SUBSTRATES | 2018-11-01 |
20180315699 | POST-GRIND DIE BACKSIDE POWER DELIVERY | 2018-11-01 |
20180315700 | SELF-ENCLOSED ASYMMETRIC INTERCONNECT STRUCTURES | 2018-11-01 |
20180315701 | METHOD FOR MAKING SEMICONDUCTOR DEVICE WITH STACKED ANALOG COMPONENTS IN BACK END OF LINE (BEOL) REGIONS | 2018-11-01 |
20180315702 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-11-01 |
20180315703 | SURFACE NITRIDATION IN METAL INTERCONNECTS | 2018-11-01 |
20180315704 | Semiconductor Structure | 2018-11-01 |
20180315705 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315706 | Integrated Fan-Out Package with 3D Magnetic Core Inductor | 2018-11-01 |
20180315707 | CRACK STOP WITH OVERLAPPING VIAS | 2018-11-01 |
20180315708 | POWER RAIL AND MOL CONSTRUCTS FOR FDSOI | 2018-11-01 |
20180315709 | STANDARD CELL LAYOUT ARCHITECTURES AND DRAWING STYLES FOR 5NM AND BEYOND | 2018-11-01 |
20180315710 | METHOD OF FORMING STACKED TRENCH CONTACTS AND STRUCTURES FORMED THEREBY | 2018-11-01 |
20180315711 | METAL GATE TRANSISTOR | 2018-11-01 |
20180315712 | EMBEDDED SUBSTRATE PACKAGE STRUCTURE | 2018-11-01 |
20180315713 | Integrated Circuit Substrate and Method for Manufacturing the Same | 2018-11-01 |
20180315714 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-11-01 |
20180315715 | ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME | 2018-11-01 |
20180315716 | METHODS AND MODULES RELATED TO SHIELDED LEAD FRAME PACKAGES | 2018-11-01 |
20180315717 | SHIELDED MODULE HAVING COMPRESSION OVERMOLD | 2018-11-01 |
20180315718 | SEMICONDUCTOR PACKAGES AND DEVICES | 2018-11-01 |
20180315719 | SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-11-01 |
20180315720 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2018-11-01 |
20180315721 | RADIO FREQUENCY CIRCUIT, WIRELESS COMMUNICATION DEVICE, AND METHOD OF MANUFACTURING RADIO FREQUENCY CIRCUIT | 2018-11-01 |
20180315722 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-11-01 |
20180315723 | SEMICONDUCTOR DEVICE WITH POST PASSIVATION STRUCTURE AND FABRICATION METHOD THEREFOR | 2018-11-01 |
20180315724 | METHOD FOR MAKING NANOSCALE DEVICES | 2018-11-01 |
20180315725 | PACKAGE STRUCTURE HAVING BUMP WITH PROTECTIVE ANTI-OXIDATION COATING | 2018-11-01 |
20180315726 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2018-11-01 |
20180315727 | SOLID-STATE IMAGING DEVICE | 2018-11-01 |
20180315728 | STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE | 2018-11-01 |
20180315729 | Thermal Bonding Sheet and Thermal Bonding Sheet with Dicing Tape | 2018-11-01 |
20180315730 | BACKSIDE METALIZATION WITH THROUGH-WAFER-VIA PROCESSING TO ALLOW USE OF HIGH Q BONDWIRE INDUCTANCES | 2018-11-01 |
20180315731 | INKJET PRINTABLE MASK APPARATUS AND METHOD FOR SOLDER ON DIE TECHNOLOGY | 2018-11-01 |
20180315732 | CAPILLARY TRANSPORT DEVICE, CAPILLARY MOUNTING DEVICE, CAPILLARY REPLACEMENT DEVICE, CAPILLARY TRANSPORT METHOD, CAPILLARY MOUNTING METHOD, AND CAPILLARY REPLACEMENT METHOD | 2018-11-01 |
20180315733 | SEMICONDCUTOR PACKAGE | 2018-11-01 |
20180315734 | METHOD FOR MAKING AN ELECTRONIC COMPONENT PACKAGE | 2018-11-01 |
20180315735 | Embedded Organic Interposers for High Bandwidth | 2018-11-01 |
20180315736 | SEMICONDUCTOR DEVICES INCLUDING A CONTROLLER AND METHODS OF FORMING SUCH DEVICES | 2018-11-01 |
20180315737 | INTEGRATED CIRCUIT PACKAGE HAVING WIREBONDED MULTI-DIE STACK | 2018-11-01 |
20180315738 | MICROELECTRONIC DIODE WITH OPTIMISED ACTIVE SURFACE | 2018-11-01 |
20180315739 | DIE-BONDING SUBSTRATE, HIGH-DENSITY INTEGRATED COB WHITE LIGHT SOURCE AND METHOD FOR MANUFACTURING THE SAME | 2018-11-01 |
20180315740 | SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME | 2018-11-01 |
20180315741 | LIGHT-EMITTING DIODE (LED) DISPLAY ARRAY, MANUFACTURING METHOD THEREOF, AND WEARABLE DEVICE | 2018-11-01 |
20180315742 | PROJECTION DISPLAY SYSTEM | 2018-11-01 |
20180315743 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315744 | Power Semiconductor Devices and a Method for Forming a Power Semiconductor Device | 2018-11-01 |
20180315745 | Semiconductor Device | 2018-11-01 |
20180315746 | POWER MOS DEVICE HAVING AN INTEGRATED CURRENT SENSOR AND MANUFACTURING PROCESS THEREOF | 2018-11-01 |
20180315747 | SEMICONDUCTOR DEVICE HAVING BIASING STRUCTURE FOR SELF-ISOLATING BURIED LAYER AND METHOD THEREFOR | 2018-11-01 |
20180315748 | ESD PROTECTION OF MEMS FOR RF APPLICATIONS | 2018-11-01 |
20180315749 | COMPACT SOURCE BALLAST TRENCH MOSFET AND METHOD OF MANUFACTURING | 2018-11-01 |
20180315750 | GRAPHENE FET DEVICES, SYSTEMS, AND METHODS OF USING THE SAME FOR SEQUENCING NUCLEIC ACIDS | 2018-11-01 |
20180315751 | VERTICAL GATE ALL AROUND LIBRARY ARCHITECTURE | 2018-11-01 |
20180315752 | SEMICONDUCTOR DEVICE AND METHOD | 2018-11-01 |
20180315753 | VERY NARROW ASPECT RATIO TRAPPING TRENCH STRUCTURE WITH SMOOTH TRENCH SIDEWALLS | 2018-11-01 |
20180315754 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315755 | VERTICAL TRANSPORT TRANSISTORS WITH EQUAL GATE STACK THICKNESSES | 2018-11-01 |
20180315756 | VERTICAL TRANSPORT TRANSISTORS WITH EQUAL GATE STACK THICKNESSES | 2018-11-01 |
20180315757 | FIN-BASED III-V/SI OR GE CMOS SAGE INTEGRATION | 2018-11-01 |
20180315758 | SUBSTRATE PROCESSING METHOD AND DEVICE MANUFACTURED USING THE SAME | 2018-11-01 |
20180315759 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2018-11-01 |
20180315760 | SEMICONDUCTOR ARRANGEMENT WITH CAPACITOR | 2018-11-01 |
20180315761 | LASER SPIKE ANNEALING FOR SOLID PHASE EPITAXY AND LOW CONTACT RESISTANCE IN AN SRAM WITH A SHARED PFET AND NFET TRENCH | 2018-11-01 |
20180315762 | SEMICONDUCTOR DEVICES | 2018-11-01 |
20180315763 | METHOD OF FORMING STATIC RANDOM-ACCESS MEMORY (SRAM) CELL ARRAY | 2018-11-01 |
20180315764 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2018-11-01 |
20180315765 | Integrated Circuit and Manufacturing Method Thereof | 2018-11-01 |
20180315766 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION | 2018-11-01 |
20180315767 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND A METHOD OF MANUFACTURING THE SAME | 2018-11-01 |
20180315768 | SEMICONDUCTOR DEVICE | 2018-11-01 |
20180315769 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2018-11-01 |
20180315770 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2018-11-01 |
20180315771 | Arrays Of Elevationally-Extending Strings Of Memory Cells And Methods Of Forming Memory Arrays | 2018-11-01 |
20180315772 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE | 2018-11-01 |
20180315773 | Cascode Radio Frequency (RF) Power Amplifier On Single Diffusion | 2018-11-01 |
20180315774 | ARRAY SUBSTRATE AND DISPLAY APPARATUS | 2018-11-01 |