44th week of 2019 patent applcation highlights part 60 |
Patent application number | Title | Published |
20190333789 | ASSEMBLING APPARATUS AND ASSEMBLING METHOD FOR SEMICONDUCTOR MANUFACTURING APPARATUS | 2019-10-31 |
20190333790 | APPARATUS FOR UV FLOWABLE DIELECTRIC | 2019-10-31 |
20190333791 | APPARATUS AND METHODS FOR MASS TRANSFER OF ELECTRONIC DIE | 2019-10-31 |
20190333792 | COMPONENT MOUNTING LINE, COMPONENT MOUNTING METHOD, AND QUALITY CONTROL SYSTEM | 2019-10-31 |
20190333793 | PRE-CLEAN CHAMBER AND PROCESS WITH SUBSTRATE TRAY FOR CHANGING SUBSTRATE TEMPERATURE | 2019-10-31 |
20190333794 | Process-Induced Displacement Characterization During Semiconductor Production | 2019-10-31 |
20190333795 | SYSTEM FOR AND METHOD OF MANUFACTURE USING MULTIMODAL ANALYSIS | 2019-10-31 |
20190333796 | TESTING SEMICONDUCTOR DEVICES BASED ON WARPAGE AND ASSOCIATED METHODS | 2019-10-31 |
20190333797 | APPARATUS AND METHOD FOR OPENING SNAP-SHOT CASES | 2019-10-31 |
20190333798 | ALIGNMENT MECHANISM, CHUCK DEVICE, AND BONDER | 2019-10-31 |
20190333799 | WAFER THINNING SYSTEMS AND RELATED METHODS | 2019-10-31 |
20190333800 | SUBSTRATE SUPPORT UNIT | 2019-10-31 |
20190333801 | DUAL AIRGAP STRUCTURE | 2019-10-31 |
20190333802 | ELECTRONIC DEVICE COMPRISING AN INSULATING TRENCH AND METHOD FOR THE PRODUCTION OF SAME | 2019-10-31 |
20190333803 | APPARATUS WITH MULTI-WAFER BASED DEVICE AND METHOD FOR FORMING SUCH | 2019-10-31 |
20190333804 | MANUFACTURING METHOD OF SMOOTHING A SEMICONDUCTOR SURFACE | 2019-10-31 |
20190333805 | INTERCONNECT FORMATION WITH CHAMFERLESS VIA, AND RELATED INTERCONNECT | 2019-10-31 |
20190333806 | Method of Forming Contacts in a Semiconductor Device | 2019-10-31 |
20190333807 | Metal-Based Etch-Stop Layer | 2019-10-31 |
20190333808 | Semiconductor Device and Method | 2019-10-31 |
20190333809 | METHOD FOR PRODUCING SEMICONDUCTOR PACKAGE | 2019-10-31 |
20190333810 | METHODS FOR WORDLINE SEPARATION IN 3D-NAND DEVICES | 2019-10-31 |
20190333811 | INTEGRATED FAN-OUT PACKAGES AND METHODS OF FORMING THE SAME | 2019-10-31 |
20190333812 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-10-31 |
20190333813 | CHAMFERLESS VIA STRUCTURES | 2019-10-31 |
20190333814 | CHAMFERLESS VIA STRUCTURES | 2019-10-31 |
20190333815 | METHOD OF REDUCING CROSS CONTAMINATION DURING MANUFACTURE OF COPPER-CONTACT AND GOLD-CONTACT GAAS WAFERS USING SHARED EQUIPMENT | 2019-10-31 |
20190333816 | METHOD OF MANUFACTURING GAAS INTEGRATED CIRCUITS WITH ALTERNATIVE BACKSIDE CONDUCTIVE MATERIAL | 2019-10-31 |
20190333817 | PROCESSING METHOD OF WORKPIECE | 2019-10-31 |
20190333818 | SEMICONDUCTOR SUBSTRATE DIE SAWING SINGULATION SYSTEMS AND METHODS | 2019-10-31 |
20190333819 | TUNNEL MAGNETORESISTIVE EFFECT ELEMENT AND MAGNETIC MEMORY | 2019-10-31 |
20190333820 | SELECTIVE NFET/PFET RECESS OF SOURCE/DRAIN REGIONS | 2019-10-31 |
20190333821 | SYSTEM AND METHOD FOR WIDENING FIN WIDTHS FOR SMALL PITCH FINFET DEVICES | 2019-10-31 |
20190333822 | Gate Structure and Method | 2019-10-31 |
20190333823 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-10-31 |
20190333824 | HOMOGENEOUS DENSIFICATION OF FILL LAYERS FOR CONTROLLED REVEAL OF VERTICAL FINS | 2019-10-31 |
20190333825 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-10-31 |
20190333826 | Methods of Forming Metal Gates | 2019-10-31 |
20190333827 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-10-31 |
20190333828 | SEMICONDUCTOR SUBSTRATE CRACK MITIGATION SYSTEMS AND RELATED METHODS | 2019-10-31 |
20190333829 | METHOD OF DETECTING DELAMINATION IN AN INTEGRATED CIRCUIT PACKAGE STRUCTURE | 2019-10-31 |
20190333830 | APPARATUSES AND METHODS FOR COUPLING CONTACT PADS TO A CIRCUIT IN A SEMICONDUCTOR DEVICE | 2019-10-31 |
20190333831 | ELECTRONIC COMPONENT HOUSING PACKAGE, MULTI-PIECE WIRING SUBSTRATE, ELECTRONIC APPARATUS, AND ELECTRONIC MODULE | 2019-10-31 |
20190333832 | BI-LAYER PREPREG FOR REDUCED DIELECTRIC THICKNESS | 2019-10-31 |
20190333833 | METHOD FOR INTEGRATING POWER CHIPS AND POWER ELECTRONICS MODULES | 2019-10-31 |
20190333834 | SEMICONDUCTOR PACKAGES INCLUDING BRIDGE DIE SPACED APART FROM SEMICONDUCTOR DIE | 2019-10-31 |
20190333835 | METHODS OF COPPER PLATING THROUGH WAFER VIA | 2019-10-31 |
20190333836 | SEMICONDUCTOR PACKAGES | 2019-10-31 |
20190333837 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-10-31 |
20190333838 | Semiconductor Power Module Comprising Graphene | 2019-10-31 |
20190333839 | TEMPERATURE MANAGEMENT OF ELECTRONIC CIRCUITRY OF ELECTRONIC DEVICES, MEMORY DEVICES, AND COMPUTING DEVICES | 2019-10-31 |
20190333840 | SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-MOLD COOLING CHANNEL FORMED IN ENCAPSULANT | 2019-10-31 |
20190333841 | Barrier Structures Between External Electrical Connectors | 2019-10-31 |
20190333842 | Semiconductor Device Packaging Assembly, Lead Frame Strip and Unit Lead Frame with Trenches or Grooves for Guiding Liquefied Molding Material | 2019-10-31 |
20190333843 | SEMICONDUCTOR DEVICE | 2019-10-31 |
20190333844 | ELECTRONIC DEVICE AND WIRING BOARD | 2019-10-31 |
20190333845 | Molding Compound Structure | 2019-10-31 |
20190333846 | PLANARIZING RDLS IN RDL-FIRST PROCESSES THROUGH CMP PROCESS | 2019-10-31 |
20190333847 | WIRING SUBSTRATE | 2019-10-31 |
20190333848 | GROUND VIA CLUSTERING FOR CROSSTALK MITIGATION | 2019-10-31 |
20190333849 | WIRING SUBSTRATE AND SEMICONDUCTOR DEVICE | 2019-10-31 |
20190333850 | WIRING BOARD HAVING BRIDGING ELEMENT STRADDLING OVER INTERFACES | 2019-10-31 |
20190333851 | FAN-OUT PACKAGE WITH MULTI-LAYER REDISTRIBUTION LAYER STRUCTURE | 2019-10-31 |
20190333852 | RESISTOR STRUCTURE OF SERIES RESISTOR OF ESD DEVICE | 2019-10-31 |
20190333853 | STRUCTURE AND METHOD FOR FLEXIBLE POWER STAPLE INSERTION | 2019-10-31 |
20190333854 | ELECTRONIC CHIP WITH UNDER-SIDE POWER BLOCK | 2019-10-31 |
20190333855 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2019-10-31 |
20190333856 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2019-10-31 |
20190333857 | METAL INTERCONNECTS | 2019-10-31 |
20190333858 | DIELECTRIC LAYER, SEMICONDUCTOR MEMORY DEVICE INCLUDING THE DIELECTRIC LAYER, AND METHODS OF MANUFACTURING THE DIELECTRIC LAYER AND THE SEMICONDUCTOR MEMORY DEVICE | 2019-10-31 |
20190333859 | CONDUCTIVE VIAS | 2019-10-31 |
20190333860 | POWER ELECTRONIC SWITCHING DEVICE | 2019-10-31 |
20190333861 | EMBEDDED DIE MICROELECTRONIC DEVICE WITH MOLDED COMPONENT | 2019-10-31 |
20190333862 | Alignment Mark with Grating Patterns and Method Forming Same | 2019-10-31 |
20190333863 | ELASTIC WAVE DEVICE | 2019-10-31 |
20190333864 | METHOD OF MANUFACTURING AN ELECTROMAGNETIC SHIELD | 2019-10-31 |
20190333865 | SEMICONDUCTOR PACKAGES HAVING EMI SHIELDING LAYERS | 2019-10-31 |
20190333866 | ELECTRONIC DEVICE | 2019-10-31 |
20190333867 | PACKAGE AND MANUFACTURING METHOD THEREOF | 2019-10-31 |
20190333868 | CHIP WITH CIRCUIT FOR DETECTING AN ATTACK ON THE CHIP | 2019-10-31 |
20190333869 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2019-10-31 |
20190333870 | PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME | 2019-10-31 |
20190333871 | MIXING ORGANIC MATERIALS INTO HYBRID PACKAGES | 2019-10-31 |
20190333872 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-10-31 |
20190333873 | ENHANCED BONDING BETWEEN III-V MATERIAL AND OXIDE MATERIAL | 2019-10-31 |
20190333874 | SEMICONDUCTOR DEVICE COMPRISING A COMPOSITE MATERIAL CLIP | 2019-10-31 |
20190333875 | SEMICONDUCTOR PACKAGE DEVICE WITH INTEGRATED INDUCTOR AND MANUFACTURING METHOD THEREOF | 2019-10-31 |
20190333876 | METHOD AND APPARATUS FOR POWER DELIVERY TO A DIE STACK VIA A HEAT SPREADER | 2019-10-31 |
20190333877 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-10-31 |
20190333878 | AMPLIFIERS AND AMPLIFIER MODULES WITH GROUND PLANE HEIGHT VARIATION STRUCTURES | 2019-10-31 |
20190333879 | FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF | 2019-10-31 |
20190333880 | FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF | 2019-10-31 |
20190333881 | FAN-OUT ANTENNA PACKAGING STRUCTURE AND PREPARATION METHOD THEREOF | 2019-10-31 |
20190333882 | SEMICONDUCTOR PACKAGES WITH ANTENNAS | 2019-10-31 |
20190333883 | METHOD FOR MANUFACTURING A MULTI-BAND ANTENNA PACKAGE STRUCTURE | 2019-10-31 |
20190333884 | CONTACT HOLE STRUCTURE AND FABRICATING METHOD OF CONTACT HOLE AND FUSE HOLE | 2019-10-31 |
20190333885 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-10-31 |
20190333886 | INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE | 2019-10-31 |
20190333887 | SEMICONDUCTOR DEVICE | 2019-10-31 |
20190333888 | RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-10-31 |