42nd week of 2010 patent applcation highlights part 15 |
Patent application number | Title | Published |
20100264502 | METHODS AND SYSTEMS OF CURVED RADIATION DETECTOR FABRICATION - Gray tone lithography is used to form curved silicon topographies for semiconductor based solid-state imaging devices. The imagers are curved to a specific curvature and shaped directly for the specific application; such as curved focal planes. The curvature of the backside is independent from the front surface, which allows thinning of the detector using standard semiconductor processing. | 2010-10-21 |
20100264503 | SOLID-STATE IMAGING DEVICE COMPRISING THROUGH-ELECTRODE - A solid-state imaging device includes an imaging element, an external terminal, an insulating film, a through-electrode and a first electrode. The imaging element is formed on a first major surface of a semiconductor substrate. The external terminal is formed on a second major surface opposing the first major surface of the semiconductor substrate. The insulating film is formed in a through-hole formed in the semiconductor substrate. The through-electrode is formed on the insulating film in the through-hole and electrically connected to the external terminal. The first electrode is formed on the through-electrode on the first major surface of the semiconductor substrate. When viewed from a direction perpendicular to the first major surface of the semiconductor substrate, an outer shape with which the insulating film and the semiconductor substrate are in contact is larger than an outer shape of the first electrode. | 2010-10-21 |
20100264504 | IMAGE SENSOR HAVING WAVE GUIDE AND METHOD FOR MANUFACTURING THE SAME - An image sensor having a wave guide includes a semiconductor substrate formed with a photodiode and a peripheral circuit region; an anti-reflective layer formed on the semiconductor substrate; an insulation layer formed on the anti-reflective layer; a wiring layer formed on the insulation layer and connected to the semiconductor substrate; at least one interlayer dielectric stacked on the wiring layer; and a wave guide connected to the insulation layer by passing through the interlayer dielectric and the wiring layer which are formed over the photodiode. | 2010-10-21 |
20100264505 | Photodiodes with PN Junction on Both Front and Back Sides - The present invention is directed toward a dual junction photodiode semiconductor device. The photodiode has a semiconductor substrate of a first conductivity type, a first impurity region of a second conductivity type shallowly diffused on the front side of the semiconductor substrate, a second impurity region of the second conductivity type shallowly diffused on the back side of the semiconductor substrate, a first PN junction formed between the first impurity region and the semiconductor substrate, and a second PN junction formed between the second impurity region and the semiconductor substrate. Since light beams of a shorter wavelength are absorbed near the surface of a semiconductor, while light beams of a longer wavelength reach deeper sections, the two PN junctions at front and back sides of the photodiode allow the device to be used as an adjustable low pass or high pass wavelength filter detector. | 2010-10-21 |
20100264506 | Light-Tight Silicon Radiation Detector - A light-tight silicon detector. The detector utilizes a silicon substrate having a sensitive volume for the detection of ionizing radiation and a rectifying contact or electrode through which the ionizing radiation may enter. A diffused or boron-implanted p+ layer may act at the rectifying electrode. A first layer of titanium nitride is deposited on the entrance window to prevent light from being admitted to the sensitive volume and to increase the abrasion and corrosion resistance of the detector. Alternatively a titanium nitride layer may be deposited directly on the silicon substrate, said layer acting as a surface barrier or Schottky barrier rectifying contact. A layer of titanium nitride may be deposited on the backside contact wherein this titanium nitride layer serves as an ohmic contact. The second layer may be further utilized as a conductive contact for surface mount connections. | 2010-10-21 |
20100264507 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a semiconductor substrate having a main surface having an element formation region, a guard ring, a guard ring electrode, a channel stopper region, a channel stopper electrode, and a field plate disposed over and insulated from the semiconductor substrate. The field plate includes a first portion located between the main surface of the semiconductor substrate and the guard ring electrode, and a second portion located between the main surface of the semiconductor substrate and the channel stopper electrode. The first portion has a portion overlapping with the guard ring electrode when viewed in a plan view. The second portion has a portion overlapping with the channel stopper electrode when viewed in the plan view. In this way, a semiconductor device allowing for stabilized breakdown voltage can be obtained. | 2010-10-21 |
20100264508 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD - A semiconductor device and manufacturing method is disclosed. One embodiment provides a common substrate of a first conductivity type and at least two wells of a second conductivity type. A buried high Ohmic region and at least an insulating structure is provided insulating the first well from the second well. The insulating structure extends through the buried high Ohmic region and includes a conductive plug in Ohmic contact with the first semiconductor region. A method for forming an integrated semiconductor device is also provided. | 2010-10-21 |
20100264509 | Enhanced Transmission Lines for Radio Frequency Applications - An integrated circuit structure includes a semiconductor substrate of a first conductivity type; a depletion region in the semiconductor substrate; and a deep well region substantially enclosed by the depletion region. The deep well region is of a second conductivity type opposite the first conductivity type, and includes a first portion directly over the deep well region and a second portion directly under the deep well region. A transmission line is directly over the depletion region. | 2010-10-21 |
20100264510 | SOI (SILICON ON INSULATOR) STRUCTURE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - In a SOI structure semiconductor device using a SOI substrate, a lattice distortion layer is formed by implanting Ar ions into a silicon substrate as an active layer. The lattice distortion layer is capable of serving as a gettering site. The dose amount of Ar ions is adjusted in such a manner that tensile stress in the lattice distortion layer is equal to or greater than 11 MPa and equal to or less than 27 MPa. Thus, the lattice distortion layer can prevent occurrence of a leakage current while serving as the gettering site. | 2010-10-21 |
20100264511 | PROVIDING CURRENT CONTROL OVER WAFER BORNE SEMICONDUCTOR DEVICES USING TRENCHES - Disclosed are methods for providing wafer parasitic current control to a semiconductor wafer ( | 2010-10-21 |
20100264512 | Semiconductor Device and Method of Forming High-Frequency Circuit Structure and Method Thereof - A semiconductor device is made by providing an integrated passive device (IPD). Through-silicon vias (TSVs) are formed in the IPD. A capacitor is formed over a surface of the IPD by depositing a first metal layer over the IPD, depositing a resistive layer over the first metal layer, depositing a dielectric layer over the first metal layer, and depositing a second metal layer over the resistive and dielectric layers. The first metal layer and the resistive layer are electrically connected to form a resistor and the first metal layer forms a first inductor. A wafer supporter is mounted over the IPD using an adhesive material and a third metal layer is deposited over the IPD. The third metal layer forms a second inductor that is electrically connected to the capacitor and the resistor by the TSVs of the IPD. An interconnect structure is connected to the IPD. | 2010-10-21 |
20100264513 | INTEGRATED CIRCUIT DEVICES INCLUDING PASSIVE DEVICE SHIELDING STRUCTURES - Integrated circuit devices include a semiconductor substrate and a flux line generating passive electronic element on the semiconductor substrate. A dummy gate structure is arranged on the semiconductor substrate in a region below the passive electronic element. The dummy gate includes a plurality of segments, each segment including a first longitudinally extending part and a second longitudinally extending part. The second longitudinally extending part extends at an angle from an end of the first longitudinally extending part. Ones of the segments extend at a substantially same angle and are arranged displaced from each other in an adjacent nested relationship. | 2010-10-21 |
20100264514 | SEMICONDUCTOR DEVICE AND A METHOD OF INCREASING A RESISTANCE VALUE OF AN ELECTRIC FUSE - Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the supply of an electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers. | 2010-10-21 |
20100264515 | Semiconductor device - An interconnect substrate is placed over a first inductor of a semiconductor chip and a second inductor of another semiconductor chip. The interconnect substrate includes a third inductor and a fourth inductor. The third inductor is located above the first inductor. The distance from the first inductor to the third inductor is longer than the distance from the second inductor to the fourth inductor. | 2010-10-21 |
20100264516 | Method of Forming an Inductor on a Semiconductor Wafer - A semiconductor device has a substrate with an inductor formed on its surface. First and second contact pads are formed on the substrate. A passivation layer is formed over the substrate and first and second contact pads. A protective layer is formed over the passivation layer. The protective layer is removed over the first contact pad, but not from the second contact pad. A conductive layer is formed over the first contact pad. The conductive layer is coiled on the surface of the substrate to produce inductive properties. The formation of the conductive layer involves use of a wet etchant. The second contact pad is protected from the wet etchant by the protective layer. The protective layer is removed from the second contact pad after forming the conductive layer over the first contact pad. An external connection is formed on the second contact pad. | 2010-10-21 |
20100264517 | NITRIDE SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - It is an object of the present invention to provide a nitride semiconductor device with low parasitic resistance by lowering barrier height to reduce contact resistance at an interface of semiconductor and metal. The nitride semiconductor device includes a GaN layer, a device isolation layer, an ohmic electrode, an n-type Al | 2010-10-21 |
20100264518 | WAFER AND METHOD FOR CONSTRUCTION, STRENGTHENING AND HOMOGENIZATION THEREOF - The present invention provides a water and a method for strengthening, homogenization and construction thereof. The concave and convex portions are processed by laser or etching, and then formed at intervals on the grinding surface of the wafer. The concave and convex portions are round or polygonal shapes. With the alternated arrangement of the concave and convex portions, a mesh structure of consistent construction is formed on the grinding surface of the wafer, making it possible to cut down greatly the interference and influence generated by the texture of grinding surface, and improve substantially the structural strength of the grinding surface for a consistent quality of wafer with better applicability and industrial benefits. | 2010-10-21 |
20100264519 | GATE TRIM PROCESS USING EITHER WET ETCH OR DRY ETCH APPRAOCH TO TARGET CD FOR SELECTED TRANSISTORS - Disclosed are methods and devices for targeting CD of selected transistors in a semiconductor device. Varying CD is done by forming hard mask lines in a hard mask layer that have varying amounts of spacer material associated therewith. Hard mask lines corresponding to selected transistors are either left covered or uncovered by a resist applied over the hard mask layer. Then, spacer material is selectively removed from the hard mask lines to vary the width of hard mask lines and associated side wall spacers. A gate layer is then etched through the spaces in the hard mask lines to form gate lines having varying widths and targeted CD. | 2010-10-21 |
20100264520 | SEMICONDUCTOR MODULE - Provided is a semiconductor module wherein a stress relaxing layer is arranged between a ceramic substrate, upon which semiconductor elements are mounted, and a cooling device on the rear side of the ceramic substrate; and the ceramic substrate, the cooling device and the stress relaxing layer are integrally formed. Furthermore, the stress relaxing layer is separated into a plurality of separated sections by two slits. Furthermore, the slits are positioned between the semiconductor elements when viewed from the thickness direction of the stress relaxing layer and not in a projection region of the semiconductor element. | 2010-10-21 |
20100264521 | Semiconductor Component Having Through Wire Interconnect (TWI) With Compressed Wire - A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect (TWI) bonded to the substrate contact. The through wire interconnect (TWI) includes a via through the substrate contact and the substrate, a wire in the via bonded to the substrate contact, and a contact on the wire. A stacked semiconductor component includes the semiconductor substrate, and a second semiconductor substrate stacked on the substrate and bonded to a through wire interconnect on the substrate. A method for fabricating a semiconductor component with a through wire interconnect includes the steps of providing a semiconductor substrate with a substrate contact, forming a via through the substrate contact and part way through the substrate, placing the wire in the via, bonding the wire to the substrate contact, and then thinning the substrate from a second side to expose a contact on the wire. A system for fabricating the semiconductor component includes a bonding capillary configured to place the wire in the via, and to form a bonded connection between the wire and the substrate contact. | 2010-10-21 |
20100264522 | SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING SPECIFIC PAD OR DIRECTLY CONTACTING SPECIFIC PAD - A semiconductor device includes a semiconductor chip, a plurality of bumps and at least one electrically conductive component. The semiconductor chip includes an active area having electronic circuits formed therein and a plurality of pads. The plurality of bumps is placed on the semiconductor chip, wherein a location where at least one of the bumps is located on the semiconductor chip does not overlap a location where a specific pad of the pads is located on the semiconductor chip. The electrically conductive component connects a top surface of at least the bump and the specific pad. | 2010-10-21 |
20100264523 | Panel, Semiconductor Device and Method for the Production Thereof - A panel has a baseplate with an upper first metallic layer and a multiplicity of a vertical semiconductor components. The vertical semiconductor components in each case have a first side with a first load electrode and a control electrode and an opposite second side with a second load electrode. The second side of the semiconductor components is in each case mounted on the metallic layer of the baseplate. The semiconductor components are arranged in such a way that edge sides of adjacent semiconductor components are separated from one another. A second metallic layer is arranged in separating regions between the semiconductor components. | 2010-10-21 |
20100264524 | SUBSTRATE FOR SEMICONDUCTOR PACKAGE - A substrate for a semiconductor package includes a dielectric substrate, a circuit pattern formed on a first surface of the dielectric substrate, and an electromagnetic band gap (EGB) pattern. The EGB pattern includes multiple unit structures formed on a second surface of the dielectric substrate, where each unit structure includes a flat conductor electrically connected to the circuit pattern through a ground connection, and multiple spiral-patterned conductors electrically connected to the flat conductor. The second surface is formed on an opposite side of the dielectric substrate from the first surface. Each flat conductor is electrically connected to a flat conductor of another one of the unit structures. At least one of the spiral-patterned conductors in each one of the unit structures is electrically connected to another one of the spiral-patterned conductors. | 2010-10-21 |
20100264525 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame. | 2010-10-21 |
20100264526 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - A semiconductor package and a manufacturing method thereof are provided. The package element has a first insulating layer, and a plurality of holes are disposed on the first surface of the first insulating layer. Besides, a plurality of package traces are embedded in the insulating layer and connected to the other end of the holes. The holes function as a positioning setting for connecting the solder balls to the package traces, such that the signal of the semiconductor chip is connected to the package trace via conductor of the chip, and further transmitted externally via solder ball. The elastic modulus of the material of the first insulating layer is preferably larger than 1.0 GPa. | 2010-10-21 |
20100264527 | Stacked Chip Package Structure with Leadframe Having Bus Bar - The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad. | 2010-10-21 |
20100264528 | QUAD FLAT PACK IN QUAD FLAT PACK INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF - A method for manufacturing an integrated circuit package system includes: providing a base package having a first integrated circuit with an inner lead on a periphery thereof and connected thereto with interconnects, and the inner lead partially encapsulated by an inner encapsulation; mounting an outer lead on the periphery of the base package; mounting a second integrated circuit above the base package and connected to the outer lead with the interconnects; and partially encapsulating, the base package and the outer leads with an outer encapsulation leaving a bottom surface of the inner lead and a bottom surface of the outer lead exposed. | 2010-10-21 |
20100264529 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTEGRAL INNER LEAD AND PADDLE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: forming a paddle, an outer lead, and an inner lead between the paddle and the outer lead; forming a non-vertical paddle edge of the paddle and a non-vertical lead edge of the inner lead facing the non-vertical paddle edge; and encapsulating an integrated circuit die over the paddle. | 2010-10-21 |
20100264530 | Stacked Chip Package Structure with Leadframe Having Bus Bar - The present invention provides a chip-stacked package structure with leadframe having bus bar, comprising: a leadframe composed of a plurality of inner leads arranged in rows facing each other, a plurality of outer leads, and a die pad, wherein the die pad is provided between the plurality of inner leads and is vertically distant from the plurality of inner leads; a chip-stacked structure formed with a plurality of chips that stacked together and set on the die pad, the plurality of chips and the plurality of inner leads being electrically connected with each other; and an encapsulant covering over the chip-stacked package structure and the leadframe, in which the leadframe comprises at least a bus bar, which is provided between the plurality of inner leads arranged in rows facing each other and the die pad. | 2010-10-21 |
20100264531 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, ADHESIVE SHEET USED THEREIN, AND SEMICONDUCTOR DEVICE OBTAINED THEREBY - The present invention includes a temporary fixing step of temporarily fixing a semiconductor element on an adherend interposing an adhesive sheet therebetween, a wire-bonding step of bonding wires to the semiconductor element, and a step of sealing the semiconductor element with a sealing resin, and in which the loss elastic modulus of the adhesive sheet at 175° C. is 2000 Pa or more. | 2010-10-21 |
20100264532 | ELECTRONIC DEVICE PACKAGE - Various embodiments for molding tools for moisture-resistant image sensor packaging structures and methods of assembly are disclosed. Image sensor packages of the present invention include an interposer, a housing structure formed on the interposer for surrounding an image sensor chip, and a transparent cover. The housing structure may cover substantially all of the interposer chip surface. In another embodiment, the housing structure also covers substantially all of the interposer edge surfaces. The housing structure may also cover substantially all of the interposer attachment surface. An image sensor chip is electrically connected to the interposer with sealed wire bond connections or with sealed flip-chip connections. The housing structure may include runners that enable simultaneous sealing of the interior of the image sensor package and of the transparent cover. | 2010-10-21 |
20100264533 | SEMICONDUCTOR CHIP PACKAGE - A semiconductor chip package is provided. The semiconductor chip package includes a lead frame having a chip carrier. A semiconductor chip is mounted on the chip carrier, having a plurality of bonding pads thereon. A package substrate has a cavity therein to accommodate the chip carrier and the semiconductor chip, wherein at least one of the bonding pads of the semiconductor chip is electrically coupled to the package substrate. | 2010-10-21 |
20100264534 | CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A chip package structure includes a circuit substrate, a chip, at least one bonding wire, and an adhesive layer. The circuit substrate has a bonding surface and at least one pad disposed on the bonding surface. The chip is disposed on the bonding surface of the circuit substrate and has an active surface away from the circuit substrate and at least one contact pad disposed on the active surface. The bonding wire is connected between the contact pad and the pad, such that the chip is electrically connected to the circuit substrate through the bonding wire. The bonding wire includes a copper layer, a nickel layer covering the copper layer, and a gold layer covering the nickel layer. The adhesive layer is disposed between the pad and the bonding wire and between the contact pad and the bonding wire and respectively covers two terminals of the bonding wire. | 2010-10-21 |
20100264535 | INTEGRATED CIRCUIT PACKAGE ASSEMBLY AND SUBSTRATE PROCESSING METHOD - An integrated circuit (IC) package assembly includes a substrate and an IC. The substrate defines a plurality of vias. Inner walls of the plurality of vias and surfaces of the substrate are coated with copper. The plurality of vias are filled with an adhesive. The copper coated on surfaces of the substrate among the plurality of vias are etched. The IC is fixed on the substrate by cohesion between the adhesive and the etched surfaces of the substrate. | 2010-10-21 |
20100264536 | SELF-HEALING THERMAL INTERFACE MATERIALS FOR SEMICONDUCTOR PACKAGES - A semiconductor package is described. The semiconductor package includes an internal housing and a semiconductor die coupled with the internal housing by a layer of self-healing thermal interface material. | 2010-10-21 |
20100264537 | Semiconductor Arrangement - A semiconductor arrangement, in particular a power semiconductor arrangement, in which a semiconductor having a top side provided with contacts is connected to an electrical connection device formed from a film assembly wherein an underfill is provided between the connection device and the top side of the semiconductor. The underfill has a matrix formed from a preceramic polymer. | 2010-10-21 |
20100264538 | METHOD FOR PRODUCING ELECTRICAL INTERCONNECTS AND DEVICES MADE THEREOF - A method for the fabrication of electrical interconnects in a substrate is disclosed. In one aspect, the method includes providing a substrate having a first main surface. The method may further include producing a ring structure in the substrate from the first main surface, which surrounds an inner pillar structure and has a bottom surface. The method may further include filling the ring structure with a dielectric material. The method may further include providing a conductive inner pillar structure, thereby forming an interconnect structure, which forms an electrical path from the bottom surface up until the first main surface. This conductive inner pillar structure can for example be provided by removing the inner pillar structure leaving a pillar vacancy and partially filling the vacancy with a conductive material. The dielectric material may be applied in liquid phase. | 2010-10-21 |
20100264539 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The semiconductor device includes a wiring substrate having connection pads and a semiconductor chip having electrode pads. The semiconductor chip is mounted on the wiring substrate, and the electrode pads are connected to the connection pads via solder bumps. An underfill resin formed of a cured thermosetting resin is filled in a gap between the wiring substrate and the semiconductor chip. The underfill resin has a glass transition temperature which increases accompanying growth of crystal grains of the solder bumps. | 2010-10-21 |
20100264540 | IC Package Reducing Wiring Layers on Substrate and Its Carrier - An IC package primarily comprises a substrate, a die-attaching layer, a chip, at least a bonding wire, and a plurality of electrical connecting components. The substrate has a top surface and a bottom surface where the top surface includes a die-attaching area for disposing the die-attaching layer. The chip is attached to the die-attaching area by the die-attaching layer and is electrically connected to the substrate by the electrical connecting components. Both ends of the bonding wire are bonded to two interconnecting fingers on the top surface of the substrate where at least a portion of the bonding wire is encapsulated in the die-attaching layer to replace some wirings or vias inside a conventional substrate. Therefore, the substrate has simple and reduced wiring layers, i.e., to reduce the substrate cost. A chip carrier of the corresponding IC package is also revealed. | 2010-10-21 |
20100264541 | METHODS OF FLUXLESS MICRO-PIERCING OF SOLDER BALLS, AND RESULTING DEVICES - A method is disclosed which includes forming a layer of conductive material above a substrate, forming a masking layer above the layer of conductive material, performing a first etching process on the layer of conductive material with the masking layer in place, removing the masking layer and, after removing the masking layer, performing an isotropic etching process on the layer of conductive material to thereby define a plurality of piercing bond structures positioned on the substrate. | 2010-10-21 |
20100264542 | DYNAMIC PAD SIZE TO REDUCE SOLDER FATIGUE - A semiconductor device is provided which comprises a substrate ( | 2010-10-21 |
20100264543 | INTERCONNECT STRUCTURE - An interconnect structure and methods for forming semiconductor interconnect structures are disclosed. In one embodiment, the interconnect structure includes: a substrate including a first liner layer and a first metal layer thereover; a dielectric barrier layer over the first metal layer and the substrate; an inter-level dielectric layer over the dielectric barrier layer; a via extending between the inter-level dielectric layer, the dielectric barrier layer, and the first metal layer, the via including a second liner layer and a second metal layer thereover; and a diffusion barrier layer located between the second liner layer and the first metal layer, wherein a portion of the diffusion barrier layer is located under the dielectric barrier layer. | 2010-10-21 |
20100264544 | Device including contact structure and method of forming the same - A device includes an insulating layer on a substrate having a lower conductive pattern, the insulating layer having a contact hole that penetrates the insulating layer and exposes a portion of the lower conductive pattern, a catalytic pattern having a first portion on the exposed portion of the lower conductive pattern and a second portion on a sidewall of the contact hole, a spacer on the sidewall of the contact hole, wherein the second portion of the catalytic pattern is disposed between the spacer and the sidewall, and a contact plug in the contact hole and contacting the catalytic pattern, the contact plug being a carbon nanotube material. | 2010-10-21 |
20100264545 | Metal Fill Structures for Reducing Parasitic Capacitance - Vertically-staggered-level metal fill structures include inner contiguous metal fill structures and outer contiguous metal fill structures. A dielectric material portion is provided between each contiguous metal fill structure. Vertical extent of each contiguous metal fill structure is limited up to three vertically adjoining metal interconnect levels, thereby limiting the capacitance of each contiguous metal fill structure. Capacitive coupling between the contiguous metal fill structures and the metal interconnect structures is minimized due to the fragmented structure of contiguous metal fill structures. | 2010-10-21 |
20100264546 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - The present invention provides a semiconductor device and manufacturing method of the semiconductor device which can prevent breaks in an interlayer insulation film ( | 2010-10-21 |
20100264547 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING - A first region having a first metal wiring, the first metal wiring being buried into an insulation film with a first minimum dimension, and a second region having a second metal wiring, the second metal wiring being buried in the insulation film with a second minimum dimension which is larger than the first minimum dimension, the second region being arranged adjacent to the first region, wherein a thickness of the first metal wiring and a thickness of the second metal wiring are different. | 2010-10-21 |
20100264548 | THROUGH SUBSTRATE VIAS - Through substrate vias (TSVs) are provided after substantially all high temperature operations needed to form a device region ( | 2010-10-21 |
20100264549 | Trench Substrate and Method Of Manufacturing The Same - Disclosed herein are a trench substrate and a method of manufacturing the same. The trench substrate includes a base substrate, an insulating layer formed on one side or both sides of the base substrate and including trenches formed in a circuit region and a dummy region positioned at a peripheral edge of the trench substrate, and a circuit layer formed in the trenches of the circuit region through a plating process and including a circuit pattern and vias. Thanks to formation of the trenches in the dummy region and the cutting region, deviation in thickness of a plating layer formed on the insulating layer in a plating process is improved upon. | 2010-10-21 |
20100264550 | SELF-ALIGNED CONTACT - A self-aligned contact includes a lower contact disposed in a dielectric layer of a substrate and an upper contact disposed in the dielectric layer and directly on the lower contact, and electrically connected to the lower contact. The profile of the upper contact and the lower contact is zigzag. | 2010-10-21 |
20100264551 | THREE DIMENSIONAL INTEGRATED CIRCUIT INTEGRATION USING DIELECTRIC BONDING FIRST AND THROUGH VIA FORMATION LAST - A method of implementing three-dimensional (3D) integration of multiple integrated circuit (IC) devices includes forming a first insulating layer over a first IC device; forming a second insulating layer over a second IC device; forming a 3D, bonded IC device by aligning and bonding the first insulating layer to the second insulating layer so as to define a bonding interface therebetween, defining a first set of vias within the 3D bonded IC device, the first set of vias landing on conductive pads located within the first IC device, and defining a second set of vias within the 3D bonded IC device, the second set of vias landing on conductive pads located within the second device, such that the second set of vias passes through the bonding interface; and filling the first and second sets of vias with a conductive material. | 2010-10-21 |
20100264552 | CIRCUIT DEVICE, METHOD OF MANUFACTURING THE CIRCUIT DEVICE, DEVICE MOUNTING BOARD AND SEMICONDUCTOR MODULE - A circuit device includes an insulating base provided with a resin layer mixed with a fibrous filler, bumps provided in the insulating base and functioning as electrodes for connection, a semiconductor device that is flip-chip mounted, and an underfill filling a gap between the semiconductor device and the insulating base. By allowing the fibrous filler projecting through the top surface of the resin layer to be in contact with the underfill, strength of adhesion between the underfill and the insulating base is improved. | 2010-10-21 |
20100264553 | PACKAGED ELECTRONIC DEVICE HAVING METAL COMPRISING SELF-HEALING DIE ATTACH MATERIAL - A method of assembling an electronic device and electronic packages therefrom. A die attach adhesive precursor is placed between a top surface of a workpiece and an IC die. The die attach adhesive precursor includes metal particles, a first plurality of first microcapsules having a polymerizable material inside, and a second plurality of second microcapsules having a polymerization agent inside to form a first polymer upon rupture of first and second microcapsules. A force sufficient to rupture at least a portion of the first plurality of first microcapsules and at least a portion of the second plurality of second microcapsules is applied to form a self-healing die attach adhesive wherein the first polymer binds the plurality of metal particles and the remaining microcapsules and secures the IC die to the top surface of the workpiece. The self-healing die attach adhesive generally includes at least 90 vol. % metal. | 2010-10-21 |
20100264554 | METHOD AND APPARATUS FOR HUMIDIFYING GAS AND FOR CONDENSING STEAM ON CONDENSATION NUCLET - For the reliable condensation of steam on condensation nuclei in an aerosol flow and therefore for enlarging the particles in the aerosol, the invention provides a method which is characterized in that condensation nuclei are passed through an inner area of an evaporating zone forming a flow area, the liquid to be evaporated is contacted with the flow area and evaporated therein and the thus produced steam is condensed on the condensation nuclei. the invention also provides an apparatus for condensing steam on condensation nuclei with an inlet for condensation nuclei and an evaporating zone constructed in such a way that a flow area for the condensation nuclei has a heated liquid duct open thereto and that a condensation flue is connected to the flow area. The invention also provides methods and apparatuses for counting particles, for producing monodisperse aerosols using the aforementioned method or the aforementioned apparatus. | 2010-10-21 |
20100264555 | OPTICAL DIFFUSION MODULE - An optical diffusion structure includes an optical diffusion structure comprising a plurality of convex portions and a plurality of concave portions. Each convex portion is adjacent to a plurality of concave portions and each concave portion is adjacent to a plurality of convex portions. The convex portions, the concave portions and each junction of the convex and concave portions have a curvature different from 0. The optical diffusion structure further includes a diffusion plate having a first surface, wherein the optical diffusion structure is formed on the first surface, and the convex portions are arranged in a two dimensional array along a first direction and a second direction, and the concave portions are arranged in a two dimensional array along a third direction and a fourth direction. | 2010-10-21 |
20100264556 | DELENSING OF OPHTHALMIC LENSES USING GAS - Contact lens delensing methods are described, and the present delensing methods include using a gas to facilitate separation of a polymerized contact lens product from a contact lens mold member. The contact lens mold member is compressed to deform a portion of the mold member, and gas, such as air, is directed toward the polymerized contact lens product in contact with the portion. The contact lens mold member can be compressed as the mold member and lens product rotate. A vacuum device can be used to separate the polymerized contact lens product from the contact lens mold member after compressing the portion of the mold member and directing the gas towards the mold member. Delensing systems used to practice the present methods are also described. | 2010-10-21 |
20100264557 | MOLD FOR INJECTION MOLDING - A mold for injection molding includes a first mold core, a base, a mold core base, a second mold core, and a plurality of first screws. The mold core base is disposed at the base. The second mold core is disposed at the mold core base. When the first mold core approaches the second mold core, the first mold core and the second mold core form a mold cavity. The first screws pass through the mold core base from a side of the mold core base away from the base to be screwed into the base. | 2010-10-21 |
20100264558 | INJECTION-MOLDING METHOD AND APPARATUS - An injection-molding method made up of a step of preparing a first die ( | 2010-10-21 |
20100264559 | FILLED POLYMER COMPOSITE AND SYNTHETIC BUILDING MATERIAL COMPOSITIONS - The invention relates to composite compositions having a matrix of polymer networks and dispersed phases of particulate or fibrous materials. The polymer matrix contains a polyurethane network formed by the reaction of a poly- or di-isocyanate and one or more saturated polyether or polyester polyols, and an optional polyisocyanurate network formed by the reaction of optionally added water and isocyanate. The matrix is filled with a particulate phase, which can be selected from one or more of a variety of components, such as fly ash particles, axially oriented fibers, fabrics, chopped random fibers, mineral fibers, ground waste glass, granite dust, or other solid waste materials. The addition of water can also serve to provide a blowing agent to the reaction mixture, resulting in a foamed structure, if such is desired. | 2010-10-21 |
20100264560 | IMPRINT LITHOGRAPHY APPARATUS AND METHOD - An imprint lithography stamp ( | 2010-10-21 |
20100264561 | Multilayer polymeric product based on polyethylene terephthalate and polycarbonate and its use as a building material - A multilayer polymeric product is described, which consists of a co-extruded internal central layer of polyethylene terephthalate (PET) copolymer, in a quantity ranging from 80 to 90% by weight with respect to the total weight of the internal layer, mixed with polycarbonate (PC), in a quantity ranging from 10 to 20% by weight with respect to the total weight of the layer, and outer, side layers, of a blend of PET, in a quantity ranging from 15 to 25% by weight with respect to the total weight of the outer layers, and PC, in a quantity ranging from 75 to 85% by weight with respect to the total weight of said outer layers, in particular for use as a building material. | 2010-10-21 |
20100264562 | High Density Carbon Foam Composite Tooling - Tools for the forming of composite parts from composite forming materials, having tool bodies that comprise, at least in part, high density carbon foam where a surface of the high density carbon foam may comprise a tool face or support tool face materials. The tools of the present invention may be lighter, more durable, and less costly to produce and/or use than conventional tools used for the production of composite parts, particularly those tools used for the production of carbon composites. Additionally, such tools may be reusable, repairable, and more readily modifiable. | 2010-10-21 |
20100264563 | ENCAPSULATION METHOD AND ENCAPSULATION APPARATUS FOR A FIELD CIRCUIT PROVIDED WITHIN A ROTOR BODY - The invention relates to a potting method and a device ( | 2010-10-21 |
20100264564 | METHOD FOR SOCKET-FORMING AN END OF A THERMOPLASTIC MATERIAL TUBE, IN PARTICULAR OF A POLYOLEFINIC MATERIAL, TUBE FOR PRESSURIZED FLUIDS - A method for socket-forming an end of a thermoplastic material tube, according to which the end is firstly widened without forming the socket and is then stabilised; the widened and stabilised end being finally socket-formed. | 2010-10-21 |
20100264565 | METHOD AND DEVICE FOR FEEDING MOLTEN RESIN, AND METHOD FOR MANUFACTURING MOLDED ARTICLE BY USING THE FED MOLTEN RESIN - A method and a device for feeding a molten resin capable of accurately feeding the molten resin without the delay of feed timing by preventing the molten resin from adhering to route members before it seats on a mold to increase the positioning accuracy of the molten metal in the mold, and a method of manufacturing a molded part by using the fed molten resin. Vibration is provided to the route members such as molten resin guide pins ( | 2010-10-21 |
20100264566 | RAPID FABRICATION OF A MICROELECTRONIC TEMPORARY SUPPORT FOR INORGANIC SUBSTRATES - A method for fabricating a rigid temporary support used for supporting inorganic substrates during processing includes providing an inorganic substrate comprising a first surface to be processed and a second surface opposite to the first surface. Next, applying a liquid layer to the second surface of the inorganic substrate and then curing the applied liquid layer and thereby forming a rigid temporary support attached to the second surface of the inorganic substrate. Next, processing the first surface of the inorganic substrate while supporting the inorganic substrate upon the rigid temporary support. The curing includes first exposing the applied liquid layer to ultraviolet (UV) radiation and then performing a post exposure bake (PEB) at a temperature sufficient to complete the curing of the applied liquid layer and to promote outgassing of substances. | 2010-10-21 |
20100264567 | APPARATUS FOR FIXING PLASTIC SHEET AND METHOD OF FABRICATING NANO PATTERN ON PLASTIC SHEET USING THE SAME - There are provided an apparatus for fixing a plastic sheet which fixes a plastic sheet to fabricate a nano pattern and a method of fabricating a nano pattern on a plastic sheet using the same. The apparatus for fixing a plastic sheet includes: a pair of planar metal guide rings interposingly fixing a plastic sheet from above and below, respectively; and a sheet fixing chuck including: a ring fixer sucking the pair of planar metal guide rings through a vacuum groove to be fixed thereto; and a sheet fixer having a plurality of vacuum pin holes formed therein, the vacuum pin holes sucking a bottom of the plastic sheet fixed by the planar metal guide rings. The apparatus allows fabrication of the nano pattern on the plastic sheet having less roughness than that of a semiconductor substrate or a glass substrate. | 2010-10-21 |
20100264568 | SYSTEM AND METHOD FOR FORMING CERAMIC PRECURSOR MATERIAL FOR THIN-WALLED CERAMIC HONEYCOMB STRUCTURES - A method for forming a ceramic precursor material for use in extruding ceramic honeycomb green bodies is provided. First, a plurality of dry particulate ceramic precursor ingredients are mixed to achieve an initial particulate precursor mixture. This mixture includes a percentage of particles and agglomerates with the agglomerates exhibiting a size greater than the threshold size. Following mixing, the agglomerates in the initial particulate mixture are pulverized to reduce a maximum size of at least some of the agglomerates below the threshold size to form pulverized agglomerates. Finally, a portion of the ceramic precursor ingredients are separated from the initial mixture with that portion comprising at least some of the pulverized agglomerates and at least some of the particles. The method is particularly adapted for use in the fabrication of ceramic honeycomb green bodies having thin webs between 2 and 5 mils in thickness. | 2010-10-21 |
20100264569 | LIQUID SEALED-IN TYPE VIBRATION DAMPER - The present invention provides a liquid sealed-in type vibration damper in which a flange-shaped stopper is integrally formed on a core-shaped mounting member in advance so that mounting of a stopper thereon at a later stage is rendered unnecessary. A liquid sealed-in type vibration damper having: a core-shaped mounting member and a sleeve-shaped mounting member connected to the vibration generation side and the vibration-transferred side via brackets, respectively; and a rubber elastic body for connecting the sleeve-shaped mounting member around the core-like mounting member so that relative vibration in the axial direction of the respective mounting members and relative vibration along a direction orthogonal to the axial direction are absorbed, respectively, includes: a flange-shaped stopper formed integral with a portion protruding from the rubber elastic body, of the core-shaped mounting member, for limiting excess displacement of the core-shaped mounting member relative to the sleeve-shaped mounting member in a direction of pulling the core-shaped mounting member out of the sleeve-shaped mounting member by abutment of the stopper on the bracket of the sleeve-shaped mounting member, wherein a surface on the rubber elastic body side of the stopper is designed to be a surface of a truncated cone protruding toward the rubber elastic body side at the center portion of the stopper. | 2010-10-21 |
20100264570 | Anti-Vibration Device - An anti-vibration device comprising first and second strength members interlinked by an elastomer body adapted to work in compression mode along a main vibration axis is disclosed. The first strength member is fitted in a slider of a support, in a direction of fitting perpendicular to the main vibration axis. The first strength member is blocked in the slider by snap-fitting. | 2010-10-21 |
20100264571 | SYSTEM FOR MANUFACTURING PRESSURE OR IMPACT RECEIVING BODIES DESIGNED TO ACHIEVE DIRECTABLE CUSHIONING - The system is based on the combination of two parts ( | 2010-10-21 |
20100264572 | SHOCK MOUNT ASSEMBLY AND DETECTOR INCLUDING THE SAME - A shock mount assembly includes a base member, a top member, and an isolator disposed between the base member and the top member, the isolator providing a dynamic stiffness in three different directions to limit the movement, deflection, and/or acceleration of a detector array with respect to a casing surrounding the detector array in three dimensions. A detector array including the shock mount assembly is also described herein. | 2010-10-21 |
20100264573 | WING POSITIONING AND MOUNTING SYSTEM - A positioning system is provided for mounting a wing of an aircraft to a fuselage of the aircraft. The positioning system includes, but is not limited to a programmable mounting unit that can perform a final adjustment and alignment of the wing with respect to the fuselage without user interaction. | 2010-10-21 |
20100264574 | MODULAR PRINTING SYSTEM HAVING A MODULE WITH A BYPASS PATH - Disclosed are embodiments of a modular printing system with one or more modules having one or more bypass paths and comprise a modular printing system with a module (e.g., a stacker or feeder module) having a main compartment and at least one additional compartment. Contained within the main compartment is a main sheet transport path and a functional component (e.g., a sheet stacking device or a sheet feeding device) connected to the main sheet transport path. Contained with the additional compartment is a bypass path. The bypass path allows sheets to be routed through the module in the event of a print media sheet jam in the main sheet transport path. Because the bypass path is contained within a separate compartment, the jam can be cleared from the main compartment without cycling down the printing system, thereby allowing for continued productivity. | 2010-10-21 |
20100264575 | BOOKLET FEEDER SYSTEMS AND METHODS - The present subject matter relates to systems and methods for advancing booklets from a group of booklets are provided. In particular, a booklet feeder can include a conveying path for supporting a group of booklets with each booklet comprising a stack of bound sheet articles, and a grip remover configured for engaging booklets in a seriatim manner in the conveying path. The grip remover can be movable to remove an engaged booklet from the conveying path and advance the removed booklet to an exit path. | 2010-10-21 |
20100264576 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS - A sheet feeding device according to this invention includes a bearing support member and a lever member. The bearing support member is supported in the sheet feeding device for movement between a sheet feeding position and a separated position. The lever member is pivotally movable about a bearing portion between a first position which causes the bearing support member to be positioned in the sheet feeding position while causing the bearing portion to be supported by the bearing support member, a second position which causes the bearing support member to be positioned in the separated position while causing the bearing portion to be supported by the bearing support member and a third position which causes the bearing support member to be positioned in the separated position while allowing the bearing portion to be detached from the bearing support member. | 2010-10-21 |
20100264577 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus which includes a sheet loading tray for stacking sheets; a suction and conveyance section which is placed above stacked sheets on the sheet loading tray and sucks and conveys a sheet in the sheet conveying direction; an air blowing section which blows air at the stacked sheets on the sheet loading tray and causes the sheet to float up; and a skew correction section which corrects a skew of the sheet conveyed by the suction and conveyance section. | 2010-10-21 |
20100264578 | Media Sheet Exit Baffle - An apparatus for directing media sheets from a media tray to a feed roller may be coupled to a feeder module. The apparatus includes a support member, a coupler, and a media director. The support member extends across a portion of a media tray width. The coupler extends from the support member and is configured to engage a feeder module to install the support member in a printer. The media director extends from the support member, and is configured to direct a leading edge of a media sheet moving from the media tray towards a feeder nip in the feeder module. The media director is vertically displaced from the support member and the coupler. | 2010-10-21 |
20100264579 | SHEET CARRYING APPARATUS HAVING SHEET PRESSING MECHANISM, AND SHEET CARRYING METHOD USING SHEET CARRYING MECHANISM - A sheet carrying apparatus having a sheet pressing mechanism according to an embodiment of the invention includes: a paper supply tray in which sheets for printing an image thereon are stacked; a pickup roller which is abutted from above against a sheet on a top layer of the sheets stacked in the paper supply tray, then rotates and move the sheet on the top side; and a holding plate which presses the top layer sheet from above in a part where the pickup roller is abutted against the top layer sheet. | 2010-10-21 |
20100264580 | DRIVE FOR BANKNOTE CENTERING MECHANISM - An improved drive arrangement for side engaging members of a banknote centering mechanism uses a rack and pinion combination. A low torque motor drives a spur gear that engages opposed rack gears of the side engaging members. This power transfer from the motor to the side engaging member is cost effective and provides good precision. | 2010-10-21 |
20100264581 | SHEET PROCESSING APPARATUS AND IMAGE FORMING APPARATUS PROVIDED WITH THE SAME - A sheet processing apparatus comprises: an first stack portion which temporarily stacks a sheet thereon; a first stack portion which is disposed under the first stack portion and stacks thereon a sheet discharged from the first stack portion; a second stack portion which is disposed above the first stack portion and stacks a sheet thereon; a stack reference wall which serves as an abutment reference at an end of the sheet on the second stack portion; and an alignment reference wall which is disposed more upstream in the sheet conveyance direction than the stack reference wall and serves as an abutment reference at an end of the sheet on the first stack portion; wherein the second stack portion has such a length that an end of the sheet stacked on the first stack portion cannot project from the second stack portion, as viewed from above in a vertical direction. | 2010-10-21 |
20100264582 | CARD SHUFFLING DEVICE AND METHOD - A device for shuffling a deck of playing cards is described. The cards are placed in a compartment having a shape of a rectangular parallelepiped, and dimensioned so that the cards are constrained in rotation in two of the three axes. The device is oriented so that a thickness dimension of the deck is horizontal, and groups of cards of the deck of cards are ejected in a vertical direction so as to provide a spacing of between a top edge of cards at rest and a bottom edge of the cards being ejected. The time duration of the ejection process is sufficient to effectively randomize the deck of cards. The ejection of cards may be by a plurality of pistons, and the pistons may be actuated by a motor, a solenoid or by air pressure. | 2010-10-21 |
20100264583 | THREE DIMENSIONAL AND SPHERICAL SLIDING PUZZLE - Invention relates to a game, where parts of a ball surface are moved for solving a figure existing in the same. The parts are not removable and moving of one part affects to the other parts. In the known solutions, sections of the ball, forming for example a half of a ball, is turned at a time in relation to different axles, or circumferential parts on a surface of a ball, forming for example “equator”, are slided as the whole circle at a time. This demands all fingers of two hands and accuracy, so that mechanism functions. In the three-dimensional spherical ball surface segment slide-jigsaw according to the invention, square pieces ( | 2010-10-21 |
20100264584 | Toy block cube filling puzzle - Toy block cube filling puzzle using transparent cube containers and using 8 tetrahedron blocks as a first group and 32 one eighth of octahedron blocks as a second group. When the blocks from the first group are assembled with one vertex of each block meeting at the center of the cube the second group can be used to completely fill the cube without voids. When 8 blocks from the second group each share a vertex at the said center the remaining 32 blocks can completely fill the cube again. When using a cube filled with one block from the first group and four from the second and each having different colors and paired up with a mirrored adjacent copy of this assembly, 2 blocks are given color change to give 7 colors. Additional pairs can be arranged to form infinite sized shapes in perfect order in three dimension and color. | 2010-10-21 |
20100264585 | Identity Guessing Game and Methods of Playing - A method of playing an identity guessing game for multiple players has multiple identities to be guessed. The identities and a corresponding set of clues for each are provided on a media. Each player obtains an identity and retains and conceals their obtained identity. The players mingle during a round of play. One player presents another player with at least one clue of the one player's clue set. The other player determines whether to guess the identity and move to a next step, or be presented with another clue. The other player guesses the one player's obtained identity either when all or fewer of the one player's clue set have been presented. The players perform the mingling, presenting, determining, guessing, and repeating steps with each other until concluding the round when the players reveal their identities. | 2010-10-21 |
20100264586 | SEARCH PUZZLE WITH VARIED SYMBOL ORIENTATIONS - An improved search puzzle and an improved method for making a search puzzle are disclosed, in which letters or other symbols in a search field are oriented at a plurality of angles, thereby increasing the challenge of finding search strings embedded therein. In preferred embodiments, the symbols are arranged in an array that can be rectangular or square. The puzzle can include an answer bank that lists the hidden search strings or gives indications thereof. In some embodiments, each symbol is oriented at an angle that is a multiple of 45 or 90 degrees. In other embodiments, the symbols are either upright or inverted. The orientations of the symbols in the search strings can be irrelevant, or necessary to the search. The search strings can be words, and/or can include rebus symbol strings. | 2010-10-21 |
20100264587 | Memory game and method of playing memory game - A memory game kit including groups of playing tiles and chip boards marked with a color for each player. The tiles of each colored group are numbered from 1 to 7. The object is to pick up all seven game tiles sequentially from 1 to 7 and place them in order on his chip board. Players uncover one game tile. If the tile sought is not uncovered, play passes to the next player. If the game tile turned is the tile bearing the 1 of that player's color, the tile is placed into the chip board in the 1 position. If the tile is not correct, it is turned back over, and the next player plays. Once a player has placed the number 1 tile in his chip board, the player attempts to locate the 2 tile. Play ends when one player finds tiles bearing the numbers 1 through 7. | 2010-10-21 |
20100264589 | STACKING BLOCK TOWER BUILDING GAME - A multi-player, multi-level stacking block game is formed from cubes of non-uniform size and is scored in such a fashion as to reward bold play but penalize the player that causes the stacked tower to fall down. The game includes 72 pieces which comprise six (6) sets of 12 pieces each. A player is selected to begin and rolls a die to determine which piece he or she plays. The piece is placed on a 3×3 grid having 9 squares. Players ultimately take turns placing a piece on the grid, and above it, until the tower either falls down or, if all 72 pieces are used, the player with the highest score wins. The playing pieces are uniquely structured so that at least one dimension of the subset of player pieces is not a multiple of another piece in that subset in order to enhance the instability factor of the game. The score that the player receives is an accumulation of the scores based upon piece location and how many levels a player piece occupies as well as if the player can occupy all 9 cubes on a particular level. | 2010-10-21 |
20100264590 | SOCCER BOARD GAME - A soccer board game and a method for playing it by first and second contestants is disclosed. The game board included a board comprising a grid of distinctly marked squares with soccer field markings. The soccer field markings include a half line dividing the field into two half fields, a kick-off circle on the half line, two opposite goal boxes located on opposite ends of the field, a five-zone and a sixteen-zone areas adjacent each of the goal boxes. The board game includes at least one die; a ball; and opponent first and second teams of players, each team pertaining to one of the contestants. | 2010-10-21 |
20100264591 | NAPKIN WITH PRINTED IMAGE PROMOTING INTERACTIVITY - A paper napkin having an image extending across more than one quadrant thereof motivates a user to interact with the napkin. A portion of the image is visible when the napkin is in a first folded condition, which portion of the image appears to be a complete image. When the napkin is unfolded from the first condition to a second condition, one or more further portions of the image is revealed. The image may include indicia to prompt the user to write or draw on the napkin. | 2010-10-21 |
20100264593 | Triple aces card game - A card game has three card hands in a round. A player may change a single card in the three-card hand. A player compares three card hands for hand strength first categorizing hands into classes; wherein the highest special hand is the three of a kind. The second highest special class is the three face card hand. A standard hand class is below two special hand classes. | 2010-10-21 |
20100264594 | Triple Aces Card Game - A card game has three card hands in a round. A player compares three card hands for hand strength first categorizing hands into classes; wherein the highest special hand is the three of a kind. The second highest special class is the three face card hand. A standard hand class is below two special hand classes. | 2010-10-21 |
20100264595 | MILITARY CARD GAME - Disclosed is a game for at least one player that includes a set of skill cards, each of which represent a particular skill. A set of mission cards, each representing a particular mission, may also be included. The game further includes an administration means that awards promotion points to each player in accordance to the player's set of obtained skill cards, completed games that each player plays, games won by the player, other completed activities, missions completed based on the mission cards, and playing time. The game is ongoing, with players achieving higher and higher ranks as they are awarded promotion points. | 2010-10-21 |
20100264596 | DOCK LEVELER SEALS AND ASSOCIATED METHODS AND SYSTEMS - Dock leveler seals and associated methods and systems are described herein. A dock leveler having a rear hinge seal configured in accordance with one embodiment of the disclosure includes a rear support frame and a movable deck. The rear support frame includes a plurality of first support members extending therefrom, and the aft edge portion of the deck includes a plurality of second support members pivotally coupled to the first support members along an axis. The seal of this embodiment includes a first edge portion extending outwardly from a medial portion in a first direction, and a second edge portion extending outwardly from the medial portion in a second direction. The medial portion urges the first edge portion against the support frame and the second edge portion against the aft edge portion of the deck as the deck pivots about the axis in operation. | 2010-10-21 |
20100264597 | SPLIT MECHANICAL SEAL - Provided is a split mechanical seal split along the circumferential direction of the seal, wherein the accuracy of assembling the mechanical seal and the accuracy of the assembling at each split contact surface are enhanced, assembling workability in a site is drastically enhanced by providing each part of the seal with a temporary fitting function, and leakage is eliminated. A split mechanical seal has split ring fitting holes into which split rings having a rectangular cross-section are fitted. The split ring fitting holes are formed over the entire length in the circumferential direction of the seal between split sealing rings and split flanges. The split rings are mounted in the split ring fitting holes with the phases of the split sealing rings and the split flanges shifted from each other such that one end of each split ring projects from a split contact surface. | 2010-10-21 |
20100264598 | APPARATUS OF BILGE PREVENTION FOR A SHIP - Disclosed is an apparatus ( | 2010-10-21 |
20100264599 | SEAL - A seal for sealing together first and second tubular members ( | 2010-10-21 |
20100264600 | Pneumatic mechanical seal - A mechanical seal device that creates a positive seal between a shaft and machine while allowing a cylinder to move its full motion and at the same time allowing movement in additional directions to maintain a seal due to operational movement or wear of the machine. The subject seal secures a housing/shaft area of a low or non-pressurized unit containing solid media where the shaft penetrates the machine housing and does not rotate but moves in multiple directions during normal operation. | 2010-10-21 |
20100264601 | SHROUDED FACE SEAL AND COMPONENTS THEREOF - One embodiment of the face seal described herein includes a seal seat and a seal element carried by a seal housing. The seal element cooperates with the seal seat to establish a seal. The housing includes a seal element support and a shroud. The seal housing is made of a parent material and the shroud has a tip impregnated with a second material. | 2010-10-21 |
20100264602 | SEAL DEVICE AND METHOD FOR ASSEMBLING A GUIDE BLOCK IN A GLAND OF THE SEAL DEVICE - A seal device for a rotary shaft includes a sleeve, a gland, a ring, a guide block, and a fixing member. The guide block has an outer block surface extending circumferentially and abutting against a portion of an inner gland surface of the gland, and an inner block surface extending circumferentially and opposite to the outer block surface. The outer block surface has two circumferentially opposite outer ends. The inner block surface has two circumferentially opposite inner ends. The guide block further has two opposite end faces each of which connects one of the outer ends to one of the inner ends. The inner ends subtend an angle of not larger than 90° at a center line of the gland. At least one of the end faces lies in a plane line that is substantially tangent to an outer peripheral face of the ring. | 2010-10-21 |
20100264603 | ROTARY SEAL WITH TRUNCATED WAVE FORM - The present invention is a generally circular rotary seal that establishes sealing between relatively rotatable machine components for lubricant retention and environmental exclusion, and incorporates seal geometry that interacts with the lubricant during relative rotation to distribute a lubricant film within the dynamic sealing interface. A preferably curved elevated contact pressure zone serves to maximize interfacial lubrication in critical areas during severe operating conditions by utilizing lubricant that would otherwise escape at the trailing edge of the hydrodynamic waves. The zones are produced by geometry that serves to minimize lubricant shear area, seal torque, seal volume, and wear, while ensuring retrofitability into the seal grooves of existing equipment. | 2010-10-21 |