42nd week of 2011 patent applcation highlights part 17 |
Patent application number | Title | Published |
20110254137 | MULTI-DIRECTIONAL TRENCHING OF A DIE IN MANUFACTURING SUPERJUNCTION DEVICES - A method of manufacturing a superjunction device includes providing a semiconductor wafer having at least one die. At least one first trench having a first orientation is formed in the at least one die. At least one second trench having a second orientation that is different from the first orientation is formed in the at least one die. | 2011-10-20 |
20110254138 | LOW-TEMPERATURE ABSORBER FILM AND METHOD OF FABRICATION - An improved low-temperature absorber, amorphous carbonitride (ACN) with an extinction coefficient (k) of greater than 0.15, and an emissivity of greater than 0.8 is disclosed. The ACN film can also be characterized as having a minimum of hydrocarbon content as observed by FTIR. The ACN film can be used as an effective absorbing layer that absorbs a wide range of electromagnetic radiation from different sources including lasers or flash lamps. A method of forming such an ACN film at a deposition temperature of less than, or equal to, 450° C. is also provided. | 2011-10-20 |
20110254139 | CMP-FIRST DAMASCENE PROCESS SCHEME - An improved metal interconnect is formed with reduced metal voids and dendrites. An embodiment includes forming a mask layer on a dielectric layer, forming openings in the mask and dielectric layers, depositing a planarization layer over the mask layer and filling the openings, planarizing to remove the mask layer, removing the planarization layer from the openings, and filling the openings with metal. The planarization step prior to depositing the metal removes the etch undercut that occurs during formation of the openings and reduces the aspect ratio in the openings, thereby improving metal fill uniformity. | 2011-10-20 |
20110254140 | PHOTORESISTS AND METHODS FOR USE THEREOF - New photoresists are provided that comprise preferably as distinct components: a resin, a photoactive component and a phenolic component Preferred photoresists of the invention are can be useful for ion implant lithography protocols. | 2011-10-20 |
20110254141 | PHYSICAL STRUCTURE FOR USE IN A PHYSICAL UNCLONABLE - The invention relates to a semiconductor device comprising a physical structure ( | 2011-10-20 |
20110254142 | STACKED STRUCTURE - A stacked structure for patterning a material layer to form an opening pattern with a predetermined opening width in the layer is provided. The stacked structure includes an underlayer, a silicon rich organic layer, and a photoresist layer. The underlayer is on the material layer. The silicon rich organic layer is between the underlayer and the photoresist layer. The thickness of the photoresist layer is smaller than that of the underlayer and larger than two times of the thickness of the silicon rich organic layer. The thickness of the underlayer is smaller than three times of the predetermined opening width. | 2011-10-20 |
20110254143 | Chip package structure and method of making the same - Methods and structures related to packaging a chip are disclosed. In one embodiment, a chip package structure includes: (i) a chip having a plurality of first and second contact pads thereon; (ii) a lead frame having a plurality of pins for external connection to the package structure, where the chip is disposed on the lead frame; (iii) a plurality of first bonding wires for connecting the first contact pads to the lead frame; and (iv) a plurality of second bonding wires for connecting the second contact pads to the plurality of pins on the lead frame. | 2011-10-20 |
20110254144 | PACKAGED MICROELECTRONIC DEVICES AND METHODS FOR MANUFACTURING PACKAGED MICROELECTRONIC DEVICES - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed herein. In one embodiment, a packaged microelectronic device can include a support member and at least one die in a stacked configuration attached to the support member. The support member may include a leadframe disposed longitudinally between first and second ends and latitudinally between first and second sides. The leadframe includes a lead extending between the first end and the first side. | 2011-10-20 |
20110254145 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor package provides an enhanced data storage capacity along with an improved data processing speed. The stacked semiconductor package includes a substrate having chip selection pads and a connection pad; a semiconductor chip module including a plurality of semiconductor chips including data bonding pads, a chip selection bonding pad, and data redistributions electrically connected with the data bonding pads and a data through electrode passing through the data bonding pad and connected with the data redistribution, the semiconductor chips being stacked so as to expose the chip selection bonding pad; and a conductive wire for connecting electrically the chip selection pad and the chip selection bonding pads. | 2011-10-20 |
20110254146 | Semiconductor Device and Method of Forming Electrical Interconnection Between Semiconductor Die and Substrate with Continuous Body of Solder Tape - A semiconductor device has a flipchip type semiconductor die with contact pads and substrate with contact pads. A flux material is deposited over the contact pads of the semiconductor die and contact pads of the substrate. A solder tape formed as a continuous body of solder material with a plurality of recesses is disposed between the contact pads of the semiconductor die and substrate. The solder tape is brought to a liquidus state to separate a portion of the solder tape outside a footprint of the contact pads of the semiconductor die and substrate under surface tension and coalesce the solder material as an electrical interconnect substantially within the footprint of the contact pads of the semiconductor die and substrate. The contact pads on the semiconductor die and substrate can be formed with an extension or recess to increase surface area of the contact pads. | 2011-10-20 |
20110254147 | SEMICONDUCTOR EQUIPMENT AND METHOD OF MANUFACTURING THE SAME - To provide a semiconductor equipment having high heat-transfer effect and breakdown voltage, and a method of manufacturing the same. The semiconductor equipment includes: a sealed container; a stem connected to the sealed container via a stem peripheral portion; and a semiconductor chip mounted on a top surface of the stem, inside the sealed container. The semiconductor chip is electrically connected to a lead provided to the stem, the stem peripheral portion, which is of a material that is different from the material of stem and the same as the material of the sealed container, is bonded along a periphery of the stem, and the sealed container is filled with a working fluid including at least one of ethanol, a perfluorocarbon, and a fluoroether. | 2011-10-20 |
20110254148 | SEMICONDUCTOR APPARATUS - The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy. | 2011-10-20 |
20110254149 | SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD OF SEMICONDUCTOR COMPONENT - A semiconductor component includes a semiconductor element that has a plurality of signals, a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element, a heat conduction member that dissipates heat generated by the semiconductor element, a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element, a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member, a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member. | 2011-10-20 |
20110254150 | Method of Manufacturing a Semiconductor Device - The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements | 2011-10-20 |
20110254151 | METHOD FOR FABRICATING BUMP STRUCTURE WITHOUT UBM UNDERCUT - A method for fabricating bump structure without UBM undercut uses an electroless Cu plating process to selectively form a Cu UBM layer on a Ti UBM layer within an opening of a photoresist layer. After stripping the photoresist layer, there is no need to perform a wet etching process on the Cu UBM layer, and thereby the UBM structure has a non-undercut profile. | 2011-10-20 |
20110254152 | CHIP STRUCTURE, CHIP BONDING STRUCTURE USING THE SAME, AND MANUFACTURING METHOD THEREOF - An IC chip and an IC chip manufacturing method thereof are provided. The IC chip has a chip body and at least one bump. The chip body has at least one conducting area on its surface. The bump is formed on the conducting area of the chip body. The bump includes a plurality of protrusions and at least one conducting material. The protrusions protrude out of the conducting area and are spaced apart from each other. The conducting material covers the protrusions and electrically connects the conducting area. The method includes: (A) providing a chip body having a conducting area on its surface; (B) forming a plurality of protrusions on the chip body, wherein the protrusions protrude out of the conducting area and are spaced apart from each other; and (C) forming at least one conducting material, wherein the conducting material covers the protrusions and electrically connects the conducting area. | 2011-10-20 |
20110254153 | DIE STRUCTURE AND DIE CONNECTING METHOD - A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block. | 2011-10-20 |
20110254154 | ROUTING LAYER FOR MITIGATING STRESS IN A SEMICONDUCTOR DIE - A routing layer for a semiconductor die is disclosed. The routing layer includes traces interconnecting integrated circuit bond-pads to UBMs. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces arranged underneath the UBMs as to absorb stress from solder bumps attached to the UMBs. Traces beneath the UBMs protect parts of the underlying dielectric material proximate the solder bumps, from the stress. | 2011-10-20 |
20110254155 | Wafer Level Die Integration and Method Therefor - A method of manufacturing a semiconductor device includes providing a wafer for supporting the semiconductor device. An insulation layer is disposed over a top surface of the wafer. The method includes forming a first interconnect structure over the top surface of the wafer with temperatures in excess of 200° C., forming a metal pillar over the wafer in electrical contact with the first interconnect structure, connecting a semiconductor component to the first interconnect structure, and forming encapsulant over the semiconductor component. The encapsulant is etched to expose a portion of the metal pillar. A buffer layer is optionally formed over the encapsulant. The method includes forming a second interconnect structure over the encapsulant in electrical contact with the metal pillar with temperatures below 200° C., and removing a portion of a backside of the wafer opposite the top surface of the wafer. | 2011-10-20 |
20110254156 | Semiconductor Device and Method of Wafer Level Package Integration - A method of making a wafer level chip scale package includes providing a temporary substrate, and forming a wafer level interconnect structure over the temporary substrate using wafer level processes. The wafer level processes include forming a first insulating layer in contact with an upper surface of the temporary substrate, and forming a first conductive layer in contact with an upper surface of the first passivation layer. A first semiconductor die is mounted over the wafer level interconnect structure such that an active surface of the first semiconductor die is in electrical contact with the first conductive layer, and a first encapsulant is deposited over the first semiconductor die. A second encapsulant is deposited over the first encapsulant, and the first and second encapsulants are cured simultaneously. The temporary substrate is removed to expose the first passivation layer. | 2011-10-20 |
20110254157 | Semiconductor Package and Method of Forming Z-Direction Conductive Posts Embedded in Structurally Protective Encapsulant - A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier and around the conductive posts. A semiconductor die is mounted to a temporary carrier. The post carrier and temporary carrier are pressed together to embed the semiconductor die in the film encapsulant. The semiconductor die is disposed between the conductive posts in the film encapsulant. The temporary carrier and base plate of the post carrier are removed. A first circuit build-up layer is formed over a first side of the film encapsulant. The first circuit build-up layer is electrically connected to the conductive posts. A second circuit build-up layer is formed over a second side of the film encapsulant opposite the first side. The second circuit build-up layer is electrically connected to the conductive posts. | 2011-10-20 |
20110254158 | Mask Programmable Interface Selection - According to one exemplary embodiment, a semiconductor die with on-die preferred interface selection includes at least two groups of pads situated on an active surface of the semiconductor die, where each of the at least two groups of pads is coupled to its associated interface in the die. A set of bumps is mask-programmably routed to one of the at least two groups of pads, thereby selecting the preferred interface for the semiconductor die. A non-preferred interface is not routed to any bumps on the active surface of the semiconductor die, thereby reducing bump count on the die. Each of the at least two groups of pads can be situated in a corresponding pad ring on the active surface of said semiconductor die. The at least two groups of pads can be laid out substantially inline. | 2011-10-20 |
20110254159 | CONDUCTIVE FEATURE FOR SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURE - An embodiment of the disclosure includes a conductive feature on a semiconductor die. A substrate is provided. A bond pad is formed over the substrate. The bond pad has a first width. A polyimide layer is formed over the substrate and the bond pad. The polyimide layer has a first opening over the bond pad with a second width. A silicon-based protection layer overlies the polyimide layer. The silicon-based protection layer has a second opening over the bond pad with a third width. The first opening and the second opening form a combined opening having sidewalls to expose a portion of the bond pad. A UBM layer is formed over the sidewalls of combined opening to contact the exposed portion of the bond pad. A conductive feature overlies the UBM layer. | 2011-10-20 |
20110254160 | TSVs with Different Sizes in Interposers for Bonding Dies - A device includes an interposer including a substrate having a top surface and a bottom surface. A plurality of through-substrate vias (TSVs) penetrates through the substrate. The plurality of TSVs includes a first TSV having a first length and a first horizontal dimension, and a second TSV having a second length different from the first length, and a second horizontal dimension different from the first horizontal dimension. An interconnect structure is formed overlying the top surface of the substrate and electrically coupled to the plurality of TSVs. | 2011-10-20 |
20110254161 | Integrated Circuit Package Having Under-Bump Metallization - An integrated circuit (IC) device uses a simple structure having X/Cu/Sn metal layers (X can be Ti or Ti/W etc.) without extra barrier layer. Thus, number of layers is reduced for a simple fabrication with good production and low cost. | 2011-10-20 |
20110254162 | High Speed, High Density, Low Power Die Interconnect System - A system for interconnecting at least two die each die having a plurality of conducting layers and dielectric layers disposed upon a substrate which may include active and passive elements. In one embodiment there is at least one interconnect coupling at least one conducting layer on a side of one die to at least one conducting layer on a side of the other die. Another interconnect embodiment is a slug having conducting and dielectric layers disposed between two or more die to interconnect between the die. Other interconnect techniques include direct coupling such as rod, ball, dual balls, bar, cylinder, bump, slug, and carbon nanotube, as well as indirect coupling such as inductive coupling, capacitive coupling, and wireless communications. The die may have features to facilitate placement of the interconnects such as dogleg cuts, grooves, notches, enlarged contact pads, tapered side edges and stepped vias. | 2011-10-20 |
20110254163 | SLEEVE INSULATORS AND SEMICONDUCTOR DEVICE INCLUDING THE SAME - A method and structure are disclosed that are advantageous for aligning a contact plug within a bit line contact corridor (BLCC) to an active area of a DRAM that utilizes an insulated sleeve structure. A sleeve insulator layer is deposited in an opening to protect one or more conductor layers from conductive contacts formed in the opening. The sleeve insulator layer electrically insulates a conductive plug from the conductor layer and self-aligns the BLCC so as to improve contact plug alignment tolerances between the BLCC and the capacitor or conductive components. | 2011-10-20 |
20110254164 | SELF-ALIGNED BARRIER LAYERS FOR INTERCONNECTS - An interconnect structure for integrated circuits incorporates manganese silicate and manganese silicon nitride layers that completely surrounds copper wires in integrated circuits and methods for making the same are provided. The manganese silicate forms a barrier against copper diffusing out of the wires, thereby protecting the insulator from premature breakdown, and protecting transistors from degradation by copper. The manganese silicate and manganese silicon nitride also promote strong adhesion between copper and insulators, thus preserving the mechanical integrity of the devices during manufacture and use. The strong adhesion at the copper-manganese silicate and manganese silicon nitride interfaces also protect against failure by electromigration of the copper during use of the devices. The manganese-containing sheath also protects the copper from corrosion by oxygen or water from its surroundings. | 2011-10-20 |
20110254165 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND PRODUCTION METHOD THEREOF - In processes after a TSV is formed, occasionally, cracks appear in an insulation film after the insulation film that is a film for preventing Cu from diffusing is formed and the exposed Cu discolors at a succeeding process of pattern forming such as etching or asking. It is estimated that the problems occur because the volume of Cu expands by heat history at the process of forming a diffusion preventive film. When such film cracking occurs, various problems such as the destruction of the function of a Cu diffusion preventive film and conduction fault with upper wiring caused by the oxidation of Cu at the upper part of a TSV are induced. In the invention of the present application, in a semiconductor integrated circuit device having a through electrode, when a through via is formed after a pre-metal wiring layer is formed, an insulation film of a kind of silicon nitride is used as a metal diffusion preventive insulation film at the interface of an interlayer insulation film touching the top end of the through electrode and an insulation film of kind of silicon carbide is used as a metal diffusion preventive insulation film at the interfaces of the other interlayer insulation films. | 2011-10-20 |
20110254166 | Chip Area Optimized Pads - An optimized semiconductor chip pad configuration. The pad includes a pad circuit area Ap, a first dimension x and a second dimension y, in a chip having N number of pins on each side. The pins include a longitudinal axis, and the chip includes a chip core of length Lc. The method includes determining the first dimension x by dividing the length Lc by the N, determining the second dimension y by dividing the pad circuit area Ap by a result of a division of the length Lc by the N, and creating a semiconductor area pad that includes pins with the longitudinal axis positioned parallel to the chip core. A stack of circuits is designed in the chip to fit in the pad based on the first dimension x and the second dimension y. | 2011-10-20 |
20110254167 | STACK PACKAGE HAVING FLEXIBLE CONDUCTORS - A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package. | 2011-10-20 |
20110254168 | INTEGRATED CIRCUIT INTERCONNECT STRUCTURE - An integrated circuit (IC) interconnect structure that includes a first via positioned in a dielectric and coupled to a high current device at one end, and a buffer metal segment positioned in a dielectric and coupled to the first via at an opposite end thereof. The buffer metal segment includes a plurality of electrically insulating inter-dielectric (ILD) pads forming an ILD cheesing pattern thereon, to direct current. The IC interconnect structure further includes a second via positioned in a dielectric formed over the buffer metal segment and coupled to the buffer metal segment at one end and a metal power line formed in a dielectric and coupled to the second via at an opposite end thereof. The use of the ILD pads on the buffer metal segment enables a more even distribution of current along the metal power line. | 2011-10-20 |
20110254169 | SEMICONDUCTOR DEVICE WITH THROUGH SUBSTRATE VIA - A through substrate via having a low stress is provided. The through substrate via is positioned in a substrate. The through substrate via includes: an outer tube penetrating the substrate; at least one inner tube disposed within the outer tube; a dielectric layer lining on a side wall of the outer tube, and a side wall of the inner tube; a strength-enhanced material filling the inner tube; and a conductive layer filling the outer tube. | 2011-10-20 |
20110254170 | SEMICONDUCTOR DEVICE - According to one embodiment, a semiconductor device includes a base layer on which a revision signal transmission circuit is formed, three or more interconnect layers laminated on the base layer, a power source interconnect or a ground interconnect on an uppermost interconnect layer, and a revision signal line which connects the revision control circuit only to the power source interconnect or the ground interconnect of the uppermost interconnect layer. | 2011-10-20 |
20110254171 | Integrated Method for High-Density Interconnection of Electronic Components through Stretchable Interconnects - Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer electronics such as elastic displays, skin-like electronic sensors, etc. In particular, stretchable neural implants provide improved performances as to cause less mechanical stress and thus fewer traumas to surrounding soft tissues. Such SMCMs usually comprise of various electronic components attached to or embedded in a polydimethylsiloxane (PDMS) substrate and wired through stretchable interconnects. However, reliably and compactly connecting the electronic components to PDMS-based stretchable interconnects is very challenging. This invention describes an integrated method for high-density interconnection of electronic components through stretchable interconnects in an SMCM. This invention has applications in high-density SMCMs, as well as high-density stretchable/conformable neural interfaces. | 2011-10-20 |
20110254172 | PACKAGE-ON-PACKAGE SYSTEM WITH THROUGH VIAS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of a package-on-package system includes: providing a package substrate; attaching a semiconductor die to the package substrate; forming an encapsulant around the semiconductor die to have a bottom exposed surface coplanar with a bottom surface of the package substrate and to have a top exposed surface with through openings extending therefrom through the bottom exposed surface; and creating through vias by applying solder into the through openings, the through vias coplanar with the bottom exposed surface of the encapsulant and coplanar with the top exposed surface of the encapsulant. | 2011-10-20 |
20110254173 | Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street - A semiconductor wafer has a plurality of semiconductor die separated by a peripheral region. A trench is formed in the peripheral region of the wafer. A via is formed on the die. The trench extends to and is continuous with the via. A first conductive layer is deposited in the trench and via to form conductive TSV. The first conductive layer is conformally applied or completely fills the trench and via. The trench has a larger area than the vias which accelerates formation of the first conductive layer. A second conductive layer is deposited over a front surface of the die. The second conductive layer is electrically connected to the first conductive layer. The first and second conductive layers can be formed simultaneously. A portion of a back surface of the wafer is removed to expose the first conductive layer. The die can be stacked and electrically interconnected through the TSVs. | 2011-10-20 |
20110254174 | Semiconductor device - A semiconductor device having a via chain circuit including a plurality of fine interconnections and an extension interconnection wider than the fine interconnections, having a first end connected to one or more of the fine interconnections and a second end located in an area of the semiconductor device external to the via chain circuit. One or more of the fine interconnections becomes wider gradually towards the connection to the extension interconnection. The extension interconnection is formed in a same layer as the one or more of the fine interconnections connected to the extension interconnection. The one or more of the fine interconnections connected to the extension interconnection is connected to the extension interconnections at a position where the fine interconnections become wider. | 2011-10-20 |
20110254175 | SEMICONDUCTOR MEMORY DEVICE - A semiconductor memory device includes: a wiring board including an element mounting portion and connection pads; a first element group including a plurality of semiconductor elements each having electrode pads arranged along one of outer sides of the semiconductor element, the plurality of semiconductor elements being layered stepwise on the element mounting portion of the wiring board in a way that pad arrangement sides of the semiconductor elements face in the same direction, and that the electrode pads are exposed; a second element group including a plurality of semiconductor elements each having electrode pads arranged along one of outer sides of the semiconductor element, the plurality of semiconductor elements being layered stepwise on the first element group in a way that pad arrangement sides of the semiconductor elements face in the same direction as that of the first element group, and that the electrode pads are exposed, the second element group being disposed to be offset from the first element group in an arrangement direction of the electrode pads; | 2011-10-20 |
20110254176 | DICING TAPE-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE - The present invention provides a dicing tape-integrated film for semiconductor back surface including: a dicing tape including a base material and a pressure-sensitive adhesive layer on the base material; and a film for flip chip type semiconductor back surface, which is provided on the pressure-sensitive adhesive layer, in which at least a part of the pressure-sensitive adhesive layer has been cured beforehand by irradiation with a radiation ray. | 2011-10-20 |
20110254177 | POWER ELECTRONIC PACKAGE HAVING TWO SUBSTRATES WITH MULTIPLE SEMICONDUCTOR CHIPS AND ELECTRONIC COMPONENTS - A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and multiple semiconductor chips and electronic components between the substrates. Each substrate includes multiple electrical insulator layers and patterned electrical conductor layers connecting to the electronic components, and further includes multiple raised regions or posts, which are bonded together so that the substrates are mechanically and electrically connected. The number, arrangement, and shape of the raised regions or posts are adjusted to have mechanical separation between the substrates. The electrical conductor layers are separated and isolated one another so that multiple electric circuits are provided on at least one of the substrates. | 2011-10-20 |
20110254178 | POSITIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE - The positive tone photosensitive composition of the invention comprises an alkali-soluble resin having a phenolic hydroxyl group, a compound producing an acid by light, a thermal crosslinking agent and an acrylic resin. It is possible to provide a positive tone photosensitive composition that can be developed with an aqueous alkali solution, has sufficiently high sensitivity and resolution, and can form a resist pattern with excellent adhesiveness and thermal shock resistance. | 2011-10-20 |
20110254179 | Paddle Wheel Water Pusher - The present invention uses paddle wheel to push water through a trough raising water above the level of surrounding water to the outlet of the trough from which the water flows across an outlet tray into a conduit protruding above surrounding water surface, containing the water falling from the outlet tray in the conduit as it travels to the outlet of the conduit. | 2011-10-20 |
20110254180 | Method for producing a rotationally symmetric lens from a ceramic green body and moulding tool for performing the method - The method for producing at least one rotationally symmetrical lens consisting of an opto-ceramic includes the step of moulding a ceramic green body for the lens, wherein the mould has a shaping surface, which is described by the following equation B: | 2011-10-20 |
20110254181 | Composite Ceramic Material Comprising Zirconia - The invention relates to a composite ceramic material which comprises:
| 2011-10-20 |
20110254182 | METHOD FOR REDUCING VARIABILITY IN CARBON-CARBON COMPOSITES - Method for producing carbon-carbon composite brake discs by: (a) providing annular nonwoven carbon fiber brake disc preforms; (b) carbonizing the brake disc preforms; (c) densifying the carbonized preforms by CVD/CVI (chemical vapor deposition/chemical vapor infiltration); (d) densifying the products of step (c) with isotropic or mesophase pitch by VPI (vacuum pitch infiltration) or RTM (resin transfer molding) processing; (e) carbonizing the preforms to remove non-carbon volatiles from the pitch and to open porosity in the pitch-infused preforms; (f) densifying the products of step (e) with isotropic or mesophase pitch by VPI or RTM processing; (g) carbonizing the preforms to remove non-carbon volatiles from pitch and to open porosity in the pitch-infused preforms; and (h) heat-treating the resulting pitch-densified carbon-carbon composite brake disc preforms. This manufacturing approach reduces lot-to-lot variability in friction performance of the resulting carbon-carbon composite brake discs. | 2011-10-20 |
20110254183 | MEASURING DEVICE AND MEASURING METHOD FOR AN INJECTION MOLDING MACHINE FOR ASCERTAINING A BATCH-SPECIFIC CHARACTERISTIC NUMBER - A measuring device for an injection molding system for ascertaining a batch-specific characteristic number of a plasticized plastic includes a flow channel which is situated between a plasticizing unit of an injection molding machine and an injection molding tool, a first pressure sensor and a second pressure sensor and a first temperature sensor and a second temperature sensor being situated along the flow channel. The flow channel has a taper between the first pressure sensor and the second pressure sensor. | 2011-10-20 |
20110254184 | METHOD AND APPARATUS FOR THE INJECTION MOLDING OF A MOLDED PART - The invention relates to a method for injection moulding of a moulded part ( | 2011-10-20 |
20110254185 | MOULD SEGMENTS WITH INDEXING MEANS AND METHOD OF ALIGNING MOULD SEGMENTS - This invention relates generally to a mould segment used in the production of premoulded and precured tyre thread in a flat moulding process wherein the mould segment ( | 2011-10-20 |
20110254186 | PTFE MEMBRANE - A method for improving the dimensional stability of PTFE membranes by the application of elevated temperature and elevated pressure to a PTFE membrane. The process reduces and/or eliminates the relaxation stress normally associated with PTFE membranes made using previously existing methods. | 2011-10-20 |
20110254187 | MOLDING METHOD AND MOLD THEREFOR - Molding methods and molds for making a synthetic resin molded product include disposing a curable liquid resin mixture in a recess of a female mold. The curable liquid resin mixture is then simultaneously agitated and degassed by a mixer while under a partial vacuum. More specifically, at least the female mold is orbited around an orbital axis while being rotated about a rotational axis that is eccentric to the orbital axis. After being thoroughly mixed and degassed, the liquid mixture is then cured in the mold unit. | 2011-10-20 |
20110254188 | Composite moulding systems - A method of producing composite mouldings in which a seal ( | 2011-10-20 |
20110254189 | HEATED MOULD FOR MOULDING POLYMERIC COMPOSITES - A method of making a mould for moulding polymeric composites comprises embedding at least one layer | 2011-10-20 |
20110254190 | PHOSPHATE BONDED COMPOSITES AND METHODS - Inorganic-organic composite articles and methods for producing them using inorganic acidic/alkaline precursor components as inorganic adhesives is provided. Articles prepared therefrom provide improved flexibility, zero flame spread, no release of volatile organic compounds, and low carbon foot print. | 2011-10-20 |
20110254191 | FILM-FORMING COMPOSITION FOR IMPRINTING, METHOD OF MANUFACTURING A STRUCTURE, AND STRUCTURE - A film-forming composition for imprinting that enables a structure to be obtained after coating the composition on a substrate and pressing a mold thereto with low compression pressure, a method of manufacturing a structure using the film-forming composition for imprinting, and a structure obtained thereby. The film-forming composition for imprinting according to the present invention contains a resin and an organic solvent, in which the organic solvent includes a particular solvent having a boiling point of 100 to 200° C. at ambient pressure. When the structure is manufactured, the film-forming composition for imprinting according to the present invention is coated on a substrate to form a resin layer, and after a mold is pressed against the resin layer, the mold is released from the resin layer. | 2011-10-20 |
20110254192 | Structural Components fabricated from waste materials and method of making same - The structural component and fabrication to form a cable, cords or other structural component may be formed by mechanically cutting, waste-reinforced used tires, waste-reinforced used fan belts, waste-reinforced used conveyor belts into strips and attaching them end to end with metal staples or a bonding agent to create a reinforced rubber cable or cord. To be used as structural strength when encapsulated with virgin and or recycled thermoplastics, or rubber. Said strips would be used as reinforcement in concrete, cement, adobe or asphalt. The process when used with thermoplastics or rubber will incorporate an extruder to obtain a molten state of the thermoplastics or rubber to form the structural component thru a crosshead die or molds for injection molding. The process when using concrete, cement, adobe or asphalt to create a structural component will use the waste-reinforced rubber strips placed into forms, or molds for reinforcement when drying has occurred. The strips from the sidewalls of reinforced tires can be used as tie-down cords with “S” hooks or other attachment devices. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a search or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. | 2011-10-20 |
20110254193 | Method for manufacturing thermoplastic resin pre-impregnated fiber structure - A process of manufacturing a fibrous article includes submerging a fiber substrate in a bath of first thermoplastic resin to impregnate the fiber substrate with the first thermoplastic resin; heating the fiber substrate until the fiber substrate becomes a thick continuous fiber substrate; cutting the thick continuous fiber substrate into units; stacking the fiber substrate units; pressing and heating the stacked fibrous structure units until a stacked fibrous structure is formed; heating a mold; conveying the stacked fibrous structure to the mold to melt; cooling the mold to shape the molten fibrous structure into a half-finished article; removing the half-finished article out of the mold; eliminating burrs and sharp edges of the half-finished article; conveying the half-finished article to the mold; and uniformly applying a molten second thermoplastic resin on an inner surface of the half-finished article by injection molding to produce the finished fibrous article. | 2011-10-20 |
20110254194 | METHOD AND ASSEMBLY FOR EXTRUDING A RUBBER COMPOUND - The invention relates to the extrusion of tire components with a large change of gauge across their cross-sectional area. It is provided a method and an assembly for extruding such a tire component with an extruder feeding a flow channel with a downstream die opening, whereby a deflector is provided in the flow channel upstream the die opening such that a flow of rubber is slowed down in front of broad portions of the cross-sectional area of the downstream die, avoiding distortion or bending of the extruded tire component. | 2011-10-20 |
20110254195 | METHOD FOR MANUFACTURING MICRO STRUCTURE USING X-RAY EXPOSURE - Provided is a method for fabricating a microstructure. The method includes disposing an X-ray mask on photosensitive material and exposing the photosensitive material by radiating X-rays to the photosensitive material using a side exposure scheme, etching the exposed photosensitive material, forming a mold having a micro-pattern by filing the etched photosensitive material with metal, forming a mold module by combining a plurality of molds, and forming a microstructure using the mold module. | 2011-10-20 |
20110254196 | METHOD FOR MAKING AN ACOUSTIC ATTENTUATION PANEL, IN PARTICULAR FOR AERONAUTICS - The invention relates to a method for making an acoustic attenuation panel, comprising using at least one foam block ( | 2011-10-20 |
20110254197 | COLD SHRINK ASSEMBLY - A cold shrink assembly includes a first member, a second member and insulating material disposed over the first and second members. The first member may include first and second portions that are coupled together and configured to be separable from each other, where the first and second portions forming a main body having curved portions extending from the main body. The second member may include third and fourth portions that are coupled together and configured to be separable from each other, where the third and fourth portions form a receiving portion located at a second end of the second member. The receiving portion may be configured to secure the curved portions of the first member to the receiving portion when the first and second members are in a first position, and release the curved portions from the receiving portion when the first and second members are in a second position. | 2011-10-20 |
20110254198 | FUEL CELLS COMPRISING MOLDABLE GASKETS, AND METHODS OF MAKING - Devices comprising an electrochemical conversion assembly comprise a plurality of electrochemical conversion cells, and a plurality of electrically conductive bipolar plates, wherein the electrochemical conversion cells are disposed between the adjacent bipolar plates. The electrochemical conversion assembly further comprises a plurality of conversion assembly gaskets, wherein the respective conversion assembly gaskets are molded onto corresponding ones of the plurality of bipolar plates. The conversion assembly gaskets comprise a mixture including polyvinylidene fluoride (PVDF). | 2011-10-20 |
20110254199 | FAST CURABLE LIQUID RESIN PROCEDURE FOR THE MANUFACTURE OF MICRO/NANO FEATURED PARTS - A method of forming micro-based devices is provided that includes dispensing a liquid curable resin into a mold set with a reservoir section. Also, the method includes spinning the reservoir section and mold set so as to completely fill the patterning portion of the mold set with the liquid curable resin. The mold set is placed in a heating and cooling station that produces a cured part e. Also, the method includes moving the mold set and the cured part to a parting station, where the cured part is removed from the mold set. | 2011-10-20 |
20110254200 | Carrier Mold - A carrier mold having prongs that produces shaped tampons is provided. A carrier mold comprising an outer surface, an inner surface, a first end, a second end opposite the first end, a body, and two or more prongs, each prong having a proximal base and a distal end; wherein at least one prong is in partial contact with at least one other prong; wherein the inner surface defines an inner cavity for producing a shaped tampon; wherein the inner cavity is structured to define or mirror the desired shape of the shaped tampon; and wherein the shaped tampon has a length and comprises various perimeters along its length. A method of forming a shaped tampon using the carrier mold is also provided. | 2011-10-20 |
20110254201 | RELEASE FILM AND PROCESS FOR PRODUCING LIGHT EMITTING DIODE - Provided is a release film for producing a light emitting diode having desired concaves and convexes accurately transferred directly to the surface of a resin-sealed portion, at a low cost and in high yield, and a process for producing a light emitting diode. | 2011-10-20 |
20110254202 | MOULDING CANNULAE AND SMALL DEEP HOLES - The present invention provides apparatus and methods for injection moulding polymeric articles. The method includes injecting pressurised liquid polymer into a mould cavity, the cavity incorporating a core pin and a pressure distribution means. Preferably the article is a cannula. | 2011-10-20 |
20110254203 | DEVICE AND METHOD FOR THE INJECTION MOLDING OF A MOLDED PART COMPRISING AT LEAST ONE VOID - The invention relates to a device for the injection moulding of a moulded part ( | 2011-10-20 |
20110254204 | METHOD OF MODIFYING GLOSS WITH MODIFIED POLYMERS AND RELATED PRODUCTS AND USES - The present invention relates to methods of modulating the gloss of plastics materials and products made from them, such as articles in the automotive industry e.g. for the interior of automobiles, as well as the use of certain additives for that purpose and related invention embodiments. The modulating comprises adding a modified polymer as matting agent to a polymer composition used as polymer substrate for the articles. | 2011-10-20 |
20110254205 | METHOD FOR FORMING CONCAVE-CONVEX PATTERN AND APPARATUS FOR PREPARING CONCAVE-CONVEX PATTERN - The present invention provides a method for forming concave-convex pattern corresponding to a nanoimprint method which is advantageously utilized in the preparation of electronic devices, optical parts and recording media, and enabling the preparation of the product having the fine pattern mentioned above in cheapness and high speed. The method for forming a concave-convex pattern comprises of the steps: a step of placing and depressing a stamper having a fine concave-convex pattern surface thereon on a photo-curable transfer layer of a photo-curable transfer sheet to form a laminate; a step of exposing the photo-curable transfer layer of the laminate having the stamper to ultraviolet rays to cure the photo-curable transfer layer, and removing the stamper from the laminate to form the inverted fine concave-convex pattern on a surface of the photo-curable transfer layer; a step of placing and depressing the intermediate stamper on a photo-curable transfer layer of another photo-curable transfer sheet to form a laminate; and a step of exposing the photo-curable transfer layer of the laminate having the intermediate stamper to ultraviolet rays to cure the photo-curable transfer layer, and removing the intermediate stamper, whereby the photo-curable transfer sheet having the fine concave-convex pattern surface is obtained. | 2011-10-20 |
20110254206 | PROCESS OF GRAINING THERMOPLASTIC SHEETS - A method of providing a coated and grained surface to a thermoplastic sheet for a vehicle interior panel. One step includes imparting a first grain to a show surface of a thermoplastic sheet. Another step includes applying a coating to a portion or more of the show surface. And another step includes imparting a second grain to the coated portion by bringing the coated portion into direct contact with a graining surface of a tool of a thermoforming machine. | 2011-10-20 |
20110254207 | HOT DRAPE FORMING BY MEANS OF A STIFFNESS CONTROLLED VACUUM BAG - An apparatus and a method of conforming a blank onto forming surface sections of a forming tool by drawing a first vacuum against an elastic forming medium for transmitting forming forces from the elastic forming medium to the blank. The elastic forming medium is evacuated with the first vacuum for allowing the elastic forming medium to stretch and conform the blank to the forming surface sections. The elastic forming medium includes at least one void. A second vacuum is applied to the void for achieving a stiffened section of the elastic forming medium corresponding with the location of the void and corresponding with, when the elastic forming medium after the completion lies against the forming tool having the blank in between, a forming surface section of the forming tool where the blank requires a forming force being larger than that of surrounding sections of the elastic forming medium. | 2011-10-20 |
20110254208 | HEAT TREATMENT FURNACE - A furnace heats through both infrared radiation and convective air utilizing an infrared/purge gas design that enables improved temperature control to enable more uniform treatment of workpieces. The furnace utilizes lamps, the electrical end connections of which are located in an enclosure outside the furnace chamber, with the lamps extending into the furnace chamber through openings in the wall of the chamber. The enclosure is purged with gas, which gas flows from the enclosure into the furnace chamber via the openings in the wall of the chamber so that the gas flows above and around the lamps and is heated to form a convective mechanism in heating parts. | 2011-10-20 |
20110254209 | STRUT ASSEMBLY WITH AIR SPRING - A strut assembly includes a damper having a housing and a rod moveable relative to the housing along a longitudinal axis. The strut assembly includes a flexible membrane configured to receive a pressurized gas to form an air spring. A coil spring defines an inner diameter with the housing disposed within the inner diameter to permit relative movement between the coil spring and the housing. The coil spring is at least partially disposed outside the flexible membrane relative to the longitudinal axis. | 2011-10-20 |
20110254210 | SPRING - A spring, provided between a first member and a second member, includes a main body portion having a hole portion; a cylindrical portion provided at the radially inner circumference and the radially outer circumference of the main body portion; and a corner portion formed at a boundary portion between the main body portion and the cylindrical portion; in which the main body portion is extended to a crossing direction with respect to a direction along suppress strength provided from the first member and the second member, the cylindrical portion has an abutting portion protruding from each circumference of the main body portion toward one of the first member and the second member and abutting thereat, the corner portions can be elastically deformed while varying angles thereof according to the suppression strength, and the corner portion defines a tangent line along the main body portion, and at least one of tangent lines of the corner portions makes a predetermined angle with respect to a straight line between the radially inner circumference and the radially outer circumference of the main body portion. | 2011-10-20 |
20110254211 | Fender Assembly and a Method for Manufacturing the Same - A fender assembly is disclosed. The fender assembly comprises an elongate support adapted to be attached to a surface of a support structure, the elongate support defining surfaces both inwardly and outwardly directed relative to the support surface, a resilient elongate fender mounted on the outer surface of the support and guided there along for vertical sliding movement relative thereto, and the inner surfaces defining a housing for a spring loaded fender restraining means co-acting with and adapted to resist downwardly directed sliding movement of the resilient elongate fender relative to the elongate support. An associated method for fabricating a fender assembly is also disclosed. | 2011-10-20 |
20110254212 | Wood kindling hand tool - A wood kindling hand tool has a handle and a head. The head includes spikes that may be driven into a piece of wood to securely hold the wood steady while a user chops the wood. | 2011-10-20 |
20110254213 | PORTABLE SAW TABLE ASSEMBLY - The subject invention provides a portable saw table assembly for cutting a material longitudinally, laterally, and at various angles thereto. The assembly includes a first and a second table rail being parallel and spaced from each other and each extending between a proximal end and a distal end. A saw rail is moveably supported by the first and the second table rails for moving longitudinally along the table rails between the proximal and the distal ends and a mounting plate is moveably supported by the saw rails to allow movement of the mounting plate laterally along the saw rail between the first table rail and the second table rail. A saw plate is rotatably supported by the mounting plate for carrying a saw to cut the material. A guide bar is disposed diagonally relative to the first and the second table rails and engages the saw plate to guide the saw plate diagonally in response to simultaneous movement of the saw rail longitudinally and the mounting plate laterally. | 2011-10-20 |
20110254214 | SEPARATOR BELT FINGER COUNT APPARATUS AND METHOD - The invention provides a method and apparatus for separating a stack of folded sheets by inserting a first, second, third and fourth count fingers into four successive openings in the stack, and separating the stack between the second and third count fingers. Where separation is carried out after a desired number of folded sheets have passed the third count finger, a completed pack having the desired number of sheets may be formed downstream from the third count finger. The count fingers may be operatively mounted in count finger cassettes. | 2011-10-20 |
20110254215 | MEDIUM TRANSFER APPARATUS FOR AN AUTOMATED TELLER MACHINE - The present invention relates to a medium transfer apparatus for an automated teller machine, wherein a portion of medium transfer apparatus is opened and shut by a simple operation, thereby conveniently and quickly solving the problem of jams occurring when the medium transfer apparatus transfers a paper medium. | 2011-10-20 |
20110254216 | AUTO DOCUMENT FEEDER AND A DOCUMENT READER WITH THE AUTO DOCUMENT FEEDER - An auto document feeder includes a lead path, a first reverse path, a second reverse path, and a both surfaces eject path. The lead path guides a document from a left side to a right side of a read position. The first reverse path and the second reverse path are connected to the lead path, and reverse the document to guide the document from the right side to the left side of the read position. A both surfaces eject path is connected to the first reverse path and the second reverse path and guides the document whose image information of a second surface has been read so as to eject further to the right side than the read position. Further, the lead path includes a lead curve path which protrudes to the left side and is arranged more to the left side than the read position. A shared curve path shared by the lead path and the both surfaces eject path includes a portion between the read position and a portion in which the lead curve path protrudes the most. | 2011-10-20 |
20110254217 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A sheet feeding apparatus includes: a loading platen on which sheets are loaded, an air blowing section which blows air to sides of a loaded sheet bundle loaded on the loading platen, and an adsorption/conveyance mechanism which adsorbs and conveys a sheet, a driving section moving the loading platen up and down, wherein the air blowing section includes a plurality of air blowing openings facing both sides of the loaded sheet bundle and blowing air to the both sides, wherein each of the plurality of air blowing openings is formed so that a first air flow flows above the loading platen and a second air flow flows below the loading platen when the loading platen reaches a highest position by the driving section, and wherein the loading platen is provided with a penetration thorough which the second air flow flows from below to above the loading platen. | 2011-10-20 |
20110254218 | SHEET CONVEYANCE APPARATUS AND IMAGE FORMING APPARATUS - A sheet conveyance apparatus includes a conveyance unit configured to convey a sheet and a pair of roller units, provided on a downstream of the conveyance unit in the conveyance direction, wherein the pair of roller units forms a plurality of nipping portions, arranged along a width direction orthogonal to the conveyance direction, a downstream end of the sheet to be conveyed is caused to abut against abutting positions of the plurality of nipping portion, and wherein the abutting position of the nipping portion nearer to a center in the width direction is positioned on a more downstream in the conveyance direction than the abutting position of the nipping portion at end side in the width direction. | 2011-10-20 |
20110254219 | Feeder for Feeding Document to Document Imaging System and Method for Feeding Documents - A method and apparatus for processing documents are provided. The apparatus includes a feeder for receiving a packet of a plurality of documents and separating the documents to serially feed the documents to a scanner. A retard adjacent the feeder is operable in first and second positions. In the first position the retard forms a nip with the feeder so that the retard is operable to impede the progress of one or more documents in the packet while the feeder feeds one of the documents in the packet. In the second position, the retard is spaced apart from the feeder to form a gap between the feeder and the retard. The system further includes a sensor for detecting a characteristic of the documents in a packet indicative of whether the number of documents in the packet exceeds a predetermined threshold. A drive mechanism automatically drives the retard pad between the first and second positions in response to the detected characteristic. | 2011-10-20 |
20110254220 | SHEET HANDLING APPARATUS - According to one embodiment, a pickup device includes a separation mechanism for applying, to a to-be-subsequently-fed mail item picked up from accumulated mail items, a separation force exerting in a direction opposite to a mail item pickup direction. The separation mechanism comprises an outer drum with suction holes that face the to-be-subsequently-fed mail item during rotation, an inner drum provided inside and concentric with the outer drum and having air holes that overlap with the suction holes during rotation, a pump for drawing air through the suction holes facing the to-be-subsequently-fed mail item and the air holes overlapping with them to attach the to-be-subsequently-fed mail item to the outer peripheral surface of the outer drum. A controller rotates the inner and outer drums in association with each other to apply a sufficient separation force to the to-be-subsequently-fed mail item. | 2011-10-20 |
20110254221 | Gotit dice game - A method of playing a dice game which includes a plurality of multi-sided dice and a means for keeping score. A set up rules (method) is applied by the players in determining the manner in which the dice are used and how the means for keeping score is utilized. In the preferred embodiment of the invention, six (6) dice each having six (6) sides are thrown by a player onto a playing surface. A writing utensil is used by to keep score on a score card. To aid in the throwing of the dice, a dice-throwing cup may be used. The game includes rounds of each player taking turns rolling the dice up to three times to determine a best score for that turn and placing that turn's score into a scoring box for either sets, combinations, or sequences. Optionally, a player may elect to use up to three available strikes to extend a turn by taking up to three additional rolls for each strike used in an attempt to achieve a combination of six of a kind, referred to here as a “GOTIT.” | 2011-10-20 |
20110254222 | CARD SHUFFLER WITH GRAVITY FEED SYSTEM FOR PLAYING CARDS - A card feed system for feeding cards into a card handling system is disclosed. The system includes a card input department with a playing card support surface, a front wall, a rear wall and two side walls. The playing card support surface slopes towards the front wall at an angle between 12 and 22 degrees. A slot is provided in the front wall to allow single cards to pass into the card handling system. The card feed system also includes a card moving system to advance cards through the slot. | 2011-10-20 |
20110254224 | Gaming apparatus comprising balls for a game of chance - Gaming apparatus comprising balls for a game of chance consists of a housing ( | 2011-10-20 |
20110254225 | Fashion Accessories and Entertainment Instruments with Personalized Appearances - Fashion accessories and entertainment instruments where accessory pieces can be rearranged instantly on a support. Exemplary embodiments include a game board that can be curled up and wrapped around a wrist. | 2011-10-20 |
20110254226 | Killer dart tossing game apparatus and games - A dart throwing game apparatus including a flat, vertical planar scoring board, a plurality of score enhancing scoring areas and score detracting scoring areas with multiple score values arranged around a central bulls-eye on the scoring board with two neutral areas for receiving darts thrown by two or more players. Several dart throwing games are described utilizing a plurality of color-coded darts and a specially color-coded dart for individual or team play. The scoring areas are arranged on the game board so that some of the positions are more difficult to achieve than others. Throwing games are described in which two individual players may compete against each other, a team consisting of one or two players may compete against another team of one or two players, or three players may individually compete against each of the other two players. | 2011-10-20 |
20110254227 | Seal - A device to provide a seal between a housing for a moving element such as a drill chain, piston or the like and the moving element. The device comprising a storage well to retain seal material, the block having an outlet connecting with an aperture in a housing enabling seal material to flow into the space between a housing and the moving element and form a seal, the device further including an inlet port enabling seal material precursor to be added into the block, and pressurising means to pressurise the seal material precursor and force it out of the aperture. | 2011-10-20 |
20110254228 | Thermal Chamber - A process chamber that provides an interior surface and an exterior surface is confined within a containment chamber. Secured to the containment chamber is a collar that communicates with the process chamber. A seal formed between the process chamber and the collar, includes at least an adjustable backing ring encircling the exterior surface of the process chamber, a preload ring secured to the collar, and a sealing structure encircling the process chamber and positioned between the adjustable backing ring and the preload ring. The adjustable backing ring is adjustably secured a predetermined distance from the preload ring, based on a perimeter dimension of the process chamber, to form the seal between the process chamber and the collar. | 2011-10-20 |
20110254229 | SEAL ASSEMBLY - Seal assemblies are provided. In one embodiment, an example shaft seal assembly comprises an immiscible fluid and a reservoir structure. The immiscible fluid is immiscible with respect to a contained internal fluid in an enclosure with a penetrating shaft. The reservoir structure is disposed in close proximity to the shaft, and the reservoir structure contains the immiscible fluid. The immiscible fluid of the seal assembly provides a fluid barrier to the internal fluid to limit loss of the internal fluid over time. | 2011-10-20 |
20110254230 | COATINGS AND POWDERS, METHODS OF MAKING SAME, AND USES THEREOF - This invention relates to thermal spray coatings, powders useful in deposition of the thermal spray coatings, methods of producing the powders, and uses of the thermal spray coatings, for example, coating of piston rings and cylinder liners of internal combustion engines. The coatings of this invention are applied by thermal spray deposition of a powder. The powder contains bimetallic carbides of chromium and molybdenum dispersed in a matrix metal. The matrix metal contains nickel/chromium/molybdenum. | 2011-10-20 |
20110254231 | Clean-In-Place Seal Assembly - A seal assembly is provided that can be automatically cleaned in place, without requiring manual cleaning by a technician, and that can be used with food processing equipment. The seal assembly has a back plate that is attached to a wall of the food processing equipment and a seal cover that connects to the back plate. A cavity is defined between the seal cover and a rotating shaft that extends into the seal assembly, and a cleaning fluid may be introduced into the cavity. The cavity may house a pair of seals that are longitudinally spaced from each other and a hub collar between the seals and which may influence a fluid flow path of the cleaning fluid through the cavity. | 2011-10-20 |
20110254232 | SEAL STRUCTURE FOR OIL DROP HOLE IN CYLINDER HEAD GASKET - A cylinder head gasket | 2011-10-20 |
20110254233 | SIDE SEAL FOR LINEAR MOTION GUIDE UNIT - The need for a related-art nipple | 2011-10-20 |
20110254234 | Gland Seals - A gland seal designed according to the joint's factors m and y and the seal-designing rule refined from ASME Code to result in its minimum necessary seating stress y at no fluid pressure being so small to be ignorable that its sealing maintenance factor or disturbance resistance index m, equal to the joint's sealing actuation force divided by the joint's unseating actuation force, can be used to indicate its sealing safety at a fluid pressure: when m=1, its sealing actuation force equals its unseating actuation force or equals its “seating area×fluid pressure” and so it can be kept leak-free under no upset disturbance condition and may leak at an upset moment, and when m>1, it can be resistant to an upset disturbance and be the greater, the more resistant. The factor m for a self-energizing tight joint is equal to its fluid's sealing actuation area divided by its fluid's unseating actuation area. | 2011-10-20 |
20110254235 | Metal gasket material plate and method for manufacturing the same - A laminated-type metal gasket material plate includes a metal plate having two sides, a rubber layer, a layer of a surface preparation agent free from hexavalent chromium, and an adhesive layer. The layer of the surface preparation agent is coated on at least one side of the plate. The adhesive layer attaches the rubber layer and is provided on the layer of the surface preparation agent. Both the adhesive layer and the rubber layer contain a rust-resistant pigment. | 2011-10-20 |
20110254236 | GROUNDED CHUCK - Improved reduction of static charge in spin chucks is achieved by providing one or more pin assemblies which are formed from chemically inert material and which include an electrically conductive inlay. | 2011-10-20 |
20110254237 | Wheelchair Stair Assist Apparatus - An apparatus is disclosed for use on standard or customized wheelchairs for moving the wheelchair and wheelchair occupant up or down a stairway or stairway-like structure (e.g., a curb) with greater confidence and stability to the occupant of the wheelchair and its handler(s). The apparatus includes a motorized assembly that interacts with stair steps when the apparatus and wheelchair are tilted backwardly. The motorized assembly allows the wheelchair to glide or move up or down the steps without experiencing the bumps commonly associated with rolling a wheelchair up or down a set of stairs. The apparatus includes a headrest to provide comfort to the occupant during operation and includes pivoting handlebars to allow the operator of the wheelchair to control the movement of the wheelchair. The apparatus is mountable to, and removable from (when not in use), the wheelchair. The apparatus can he considered as a retrofit. | 2011-10-20 |