42nd week of 2012 patent applcation highlights part 15 |
Patent application number | Title | Published |
20120261789 | Wafer with Spacer Including Horizontal Member - In one embodiment, a method of forming an insulating spacer includes providing a base layer, providing an intermediate layer above an upper surface of the base layer, etching a first trench in the intermediate layer, depositing a first insulating material portion within the first trench, depositing a second insulating material portion above an upper surface of the intermediate layer, forming an upper layer above an upper surface of the second insulating material portion, etching a second trench in the upper layer, and depositing a third insulating material portion within the second trench and on the upper surface of the second insulating material portion. | 2012-10-18 |
20120261790 | SUBSTRATE STRUCTURE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME - The present invention provides a substrate structure, a semiconductor device, and a manufacturing method thereof. The substrate structure comprises: a semiconductor substrate; and a first isolation region, wherein the first isolation region comprises: a first trench extending through the semiconductor substrate; and a first dielectric layer filling the first trench. Due to the isolation region extending through the substrate, it is possible to make device structures on both surfaces of the substrate, so as to increase the utilization of the substrate and the integration degree of the devices. | 2012-10-18 |
20120261791 | Wide and Deep Oxide Trench in A Semiconductor Substrate with Interspersed Vertical Oxide Ribs - A semiconductor device structure with an oxide-filled large deep trench (OFLDT) portion having trench size TCS and trench depth TCD is disclosed. A bulk semiconductor layer (BSL) is provided with a thickness BSLT>TCD. A large trench top area (LTTA) is mapped out atop BSL with its geometry equal to OFLDT. The LTTA is partitioned into interspersed, complementary interim areas ITA-A and ITA-B. Numerous interim vertical trenches of depth TCD are created into the top BSL surface by removing bulk semiconductor materials corresponding to ITA-B. The remaining bulk semiconductor materials corresponding to ITA-A are converted into oxide. If any residual space is still left between the so-converted ITA-A, the residual space is filled up with oxide deposition. Importantly, the geometry of all ITA-A and ITA-B should be configured simple and small enough to facilitate fast and efficient processes of oxide conversion and oxide filling. | 2012-10-18 |
20120261792 | SOI DEVICE WITH DTI AND STI - An SOI structure including a semiconductor on insulator (SOI) substrate including a top silicon layer, an intermediate buried oxide (BOX) layer and a bottom substrate; at least two wells in the bottom substrate; a deep trench isolation (DTI) separating the two wells, the DTI having a top portion extending through the BOX layer and top silicon layer and a bottom portion within the bottom substrate wherein the bottom portion has a width that is larger than a width of the top portion; and at least two semiconductor devices in the silicon layer located over one of the wells, the at least two semiconductor devices being separated by a shallow trench isolation within the top silicon layer. | 2012-10-18 |
20120261793 | ELECTRICAL FUSE AND METHOD OF MAKING THE SAME - An improved electrical-fuse (e-fuse) device including a dielectric layer having a first top surface, two conductive features embedded in the dielectric layer and a fuse element. Each conductive feature has a second top surface and a metal cap directly on the second top surface. Each metal cap has a third top surface that is above the first top surface of the dielectric layer. The fuse element is on the third top surface of each metal cap and on the first top surface of the dielectric layer. A method of forming the e-fuse device is also provided. | 2012-10-18 |
20120261794 | DESIGN STRUCTURE FOR INTERCONNECT STRUCTURE CONTAINING VARIOUS CAPPING MATERIALS FOR ELECTRICAL FUSE AND OTHER RELATED APPLICATIONS - A design structure is provided for interconnect structures containing various capping materials for electrical fuses and other related applications. The structure includes a first interconnect structure having a first interfacial structure and a second interconnect structure adjacent to the first structure. The second interconnect structure has second interfacial structure different from the first interfacial structure. | 2012-10-18 |
20120261795 | ANTI-FUSE DEVICE STRUCTURE AND ELECTROPLATING CIRCUIT STRUCTURE AND METHOD - Disclosed are embodiments of a circuit and method for electroplating a feature (e.g., a BEOL anti-fuse device) onto a wafer. The embodiments eliminate the use of a seed layer and, thereby, minimize subsequent processing steps (e.g., etching or chemical mechanical polishing (CMP)). Specifically, the embodiments allow for selective electroplating metal or alloy materials onto an exposed portion of a metal layer in a trench on the front side of a substrate. This is accomplished by providing a unique wafer structure that allows a current path to be established from a power supply through a back side contact and in-substrate electrical connector to the metal layer. During electrodeposition, current flow through the current path can be selectively controlled. Additionally, if the electroplated feature is an anti-fuse device, current flow through this current path can also be selectively controlled in order to program the anti-fuse device. | 2012-10-18 |
20120261796 | DIE ARRANGEMENTS AND METHODS OF MANUFACTURING A DIE ARRANGEMENT - In various embodiments, a die arrangement may be provided. The die arrangement may include a die, at least one bond pad, at least one redistribution trace electrically connecting the die with the at least one bond, and at least one inductor enclosing the at least one bond pad and the at least one redistribution trace. | 2012-10-18 |
20120261797 | LATERAL EPITAXIAL GROWN SOI IN DEEP TRENCH STRUCTURES AND METHODS OF MANUFACTURE - Deep trench capacitor structures and methods of manufacture are disclosed. The method includes forming a deep trench structure in a wafer comprising a substrate, buried oxide layer (BOX) and silicon (SOI) film. The structure includes a wafer comprising a substrate, buried insulator layer and a layer of silicon on insulator layer (SOI) having a single crystalline structure throughout the layer. The structure further includes a first plate in the substrate and an insulator layer in direct contact with the first plate. A doped polysilicon is in direct contact with the insulator layer and also in direct contact with the single crystalline structure of the SOI. | 2012-10-18 |
20120261798 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a wiring configured to be formed in a surface portion of a first interlayer insulating layer in a first region, a common upper electrode configured to be formed in a surface portion of the first interlayer insulating layer in a second region, a plurality of capacitance portions configured to have the common upper electrode as an upper electrode and be extended below, wherein an upper surface of the first interlayer insulating layer and an upper surface of the common upper electrode approximately lie in the same plane. | 2012-10-18 |
20120261799 | SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION DEVICE - A technology which allows a reduction in the thermal resistance of a semiconductor device used in a radio communication device, and the miniaturization thereof is provided. For example, the semiconductor device can include a plurality of unit transistors Q, transistor formation regions | 2012-10-18 |
20120261800 | WAFER WITH RECESSED PLUG - In one embodiment, a method of forming a plug includes providing a base layer, providing an intermediate oxide layer above an upper surface of the base layer, providing an upper layer above an upper surface of the intermediate oxide layer, etching a trench including a first trench portion extending through the upper layer, a second trench portion extending through the oxide layer, and a third trench portion extending into the base layer, depositing a first material portion within the third trench portion, depositing a second material portion within the second trench portion, and depositing a third material portion within the first trench portion. | 2012-10-18 |
20120261801 | Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board - A wiring board includes a silicon substrate with a through hole communicating with first and second substrate surfaces. A capacitor includes a capacitor part mounted on an insulating film covering the substrate first surface and including a first electrode on the insulating film, a first dielectric layer on the first electrode, and a second electrode on the first dielectric layer. A multilayer structure arranged on a wall surface defining the through hole includes the insulating film on the through hole wall surface, a first metal layer on the insulating film formed from the same material as the first electrode, a second dielectric layer on the first metal layer formed from the same material as the first dielectric layer, and a second metal layer on the second dielectric layer formed from the same material as the second electrode. The multilayer structure covers a penetration electrode in the through hole. | 2012-10-18 |
20120261802 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - As a substrate for a semiconductor device, a metal substrate is used, and the metal substrate is composed of a metal base body made of a first metal and a connecting metal layer made of a second metal for covering the metal base body. The substrate has a structure wherein a diffusion preventing layer for preventing diffusion of the first metal is provided on the connecting metal layer. | 2012-10-18 |
20120261803 | HIGH-K GATE DIELECTRIC MATERIAL AND METHOD FOR PREPARING THE SAME - The present invention forms Hf | 2012-10-18 |
20120261804 | VERTICAL SUBSTRATE DIODE, METHOD OF MANUFACTURE AND DESIGN STRUCTURE - A diode structure, formed under a buried dielectric layer of a silicon on insulator (SOI), method of manufacturing the same and design structure thereof are provided. In an embodiment the p-n junction of the diode structure can be advantageously arranged in a vertical orientation. The cathode comprises an N+ epitaxial layer formed upon a P-type substrate. The anode comprises an active region of the P-substrate. Contacts to the cathode and anode are formed through the buried dielectric layer. Contact to the anode is accomplished via a deep trench filled with a conductive plug. The deep trench also provides electrical isolation for the cathode (as well as p-n junction). Advantageously, embodiments of the present invention may be formed during formation of other structures which also include trenches (for example, deep trench capacitors) in order to reduce process steps required to form the diode structure under the buried dielectric layer of the SOI substrate. | 2012-10-18 |
20120261805 | THROUGH PACKAGE VIA STRUCTURES IN PANEL-BASED SILICON SUBSTRATES AND METHODS OF MAKING THE SAME - The various embodiments of the present invention provide a low cost, low electrical loss, and low stress panel-based silicon interposer with TPVs. The interposer of the present invention has a thickness of about 100 microns to 200 microns and such thickness is achieved without utilizing a carrier and further wherein no grinding, bonding, or debonding methods are utilized, therefore distinguishing the interposer of the present invention from prior art embodiments. | 2012-10-18 |
20120261806 | LEAD FRAME STRIP FOR REDUCED MOLD STICKING DURING DEGATING - A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length. | 2012-10-18 |
20120261807 | EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, CURED PRODUCT THEREOF, AND SEMICONDUCTOR DEVICE - An epoxy resin composition for semiconductor encapsulation of the present invention contains an epoxy resin (A) and a curing agent (B) and is used to encapsulate a copper wire ( | 2012-10-18 |
20120261808 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REMOVABLE BACKING ELEMENT HAVING PLATED TERMINAL LEADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit package system includes: attaching a first die to a first die pad; connecting electrically a second die to the first die through a die interconnect positioned between the first die and the second die; connecting a first lead adjacent the first die pad to the first die; connecting a second lead to the second die, the second lead opposing the first lead and adjacent the second die; and providing a molding material around the first die, the second die, the die interconnect, the first lead and the second lead, with a portion of the first lead exposed. | 2012-10-18 |
20120261809 | CHIP PACKAGE AND MANUFACTURING METHOD THEREOF - An embodiment of the invention provides a manufacturing method of a chip package including: providing a semiconductor wafer having a plurality of device regions separated by a plurality of scribe lines; bonding a package substrate to the semiconductor wafer wherein a spacer layer is disposed therebetween and defines a plurality of cavities respectively exposing the device regions and the spacer layer has a plurality of through holes neighboring the edge of the semiconductor wafer; filling an adhesive material in the through holes wherein the material of the spacer layer is adhesive and different from the adhesive material; and dicing the semiconductor wafer, the package substrate and the spacer layer along the scribe lines to form a plurality of chip packages separated from each other. | 2012-10-18 |
20120261810 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH WAFERSCALE SPACER - An integrated circuit packaging system is provided including: a first device having a first backside and a first active side; and a waferscale spacer having an exact fit at all four corners adjacent to an edge of the first device and a recess along the edge of the first device. | 2012-10-18 |
20120261811 | SEMICONDUCTOR DEVICE - A semiconductor device includes an insulating substrate, a metal pattern formed on the insulating substrate, a power terminal bonded onto the metal pattern, and a plurality of power chips bonded onto the metal pattern. The plurality of power chips are all separated from the power terminal by a distance sufficient to thermally isolate the plurality of power chips from the power terminal. | 2012-10-18 |
20120261812 | SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION - Various semiconductor chip solder bump and underbump metallization (UBM) structures and methods of making the same are disclosed. In one aspect, a method is provided that includes providing a semiconductor chip that has a conductor pad and a passivation structure over the conductor pad. A first metallic layer is applied on the passivation structure and in electrical contact with the conductor pad. The first metallic layer covers a first portion but not a second portion of the passivation structure. A second metallic layer is applied to the first metallic layer. A polymer layer is applied to the second metallic layer. The polymer layer includes a first opening in alignment with the first metallic layer that exposes a portion of the second layer. A conducting solder barrier layer is applied to the exposed portion of the second metallic layer. | 2012-10-18 |
20120261813 | REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A REINFORCED VIA FARM INTERCONNECT STRUCTURE AND A METHOD OF REDESIGNING AN INTEGRATED CIRCUIT CHIP TO INCLUDE SUCH A REINFORCED VIA FARM INTERCONNECT STRUCTURE - Disclosed is reinforced via farm interconnect structure for an integrated circuit chip that minimizes delamination caused by tensile stresses applied to the chip through lead-free C4 connections during thermal cycling. The reinforced via farm interconnect structure includes a plurality of vias electrically connecting metal wires within different wiring levels and, for reinforcement, further incorporates dielectric columns into the lower metal wire so that the areas around the metal-to-metal interface between the vias and the lower metal wire contain a relatively strong dielectric-to-dielectric interface. The reinforced via farm interconnect structure can be located in an area of the chip at risk for delamination and, for added strength, can have a reduced via density relative to conventional via farm interconnect structures located elsewhere on the chip. Also disclosed are a method of forming the reinforced via farm interconnect structure and a method of redesigning an integrated circuit chip to include reinforced via farm interconnect structure(s). | 2012-10-18 |
20120261814 | Packaging an Electronic Device - An electronic device comprises a plurality of integrated circuit dies mounted on different areas of a carrier. The carrier is folded into a plurality of layers, each layer comprising one of the different areas of the carrier and one of the integrated circuit dies, such that the plurality of integrated circuit dies form a stack. Adjacent surfaces of neighbouring layers are fixed together, for example by an adhesive layer, and the folded carrier and the integrated circuit dies are embedded in a moulded material. | 2012-10-18 |
20120261815 | SEALED SURFACE ACOUSTIC WAVE ELEMENT PACKAGE - An electronic component includes: a semiconductor substrate having a first surface and a second surface opposing to the first surface; a trans-substrate conductive plug that penetrates the semiconductor substrate from the first surface to the second surface; an electronic element provided in the vicinity of the first surface of the semiconductor; and a sealing member that seals the electronic element between the sealing member and the first surface, wherein the electronic element is electrically connected to the trans-substrate conductive plug. | 2012-10-18 |
20120261816 | DEVICE PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A device package substrate includes: a substrate having a cavity formed on a top surface thereof, the cavity having a chip mounting region; a first interconnection layer formed to extend to the inside of the cavity; a second interconnection layer formed to be spaced apart from the first interconnection layer; a chip positioned in the chip mounting region so as to be connected to the first and second interconnection layers; an insulating layer formed to cover the first and second interconnection layers and the chip and having a contact hole exposing a part of the second interconnection layer; and a bump pad formed in the contact hole so as to be connected to external elements. | 2012-10-18 |
20120261817 | Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution - A semiconductor wafer contains a plurality of semiconductor die. The wafer has contact pads formed over its surface. A passivation layer is formed over the wafer. A stress buffer layer is formed over the passivation layer. The stress buffer layer is patterned to expose the contact pads. A metal layer is deposited over the stress buffer layer. The metal layer is a common voltage bus for the semiconductor device in electrical contact with the contact pads. An adhesion layer, barrier layer, and seed layer is formed over the wafer in electrical contact with the contact pads. The metal layer is mounted to the seed layer. Solder bumps or other interconnect structures are formed over the metal layer. A second passivation layer is formed over the metal layer. In an alternate embodiment, a wirebondable layer can be deposited over the metal layer and wirebonds connected to the metal layer. | 2012-10-18 |
20120261818 | Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation - A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the first semiconductor die. A penetrable adhesive layer is formed over a temporary carrier. The adhesive layer can include a plurality of slots. The semiconductor die is mounted to the carrier by embedding the bumps into the penetrable adhesive layer. The semiconductor die and interconnect structure can be separated by a gap. An encapsulant is deposited over the first semiconductor die. The bumps embedded into the penetrable adhesive layer reduce shifting of the first semiconductor die while depositing the encapsulant. The carrier is removed. An interconnect structure is formed over the semiconductor die. The interconnect structure is electrically connected to the bumps. A thermally conductive bump is formed over the semiconductor die, and a heat sink is mounted to the interconnect structure and thermally connected to the thermally conductive bump. | 2012-10-18 |
20120261819 | BRIDGING ARRANGEMENT AND METHOD FOR MANUFACTURING A BRIDGING ARRANGEMENT - A bridging arrangement for coupling a first terminal to a second terminal includes a plurality of particles of a first type forming at least one path between the first terminal and the second terminal, wherein the particles of the first type are attached to each other; a plurality of particles of a second type arranged in a vicinity of a contact region between a first particle of the first type and a second particle of the first type, wherein at least a portion of the plurality of particles of the second type is attached to the first particle of the first type and the second particle of the first type. | 2012-10-18 |
20120261820 | ASSEMBLY OF STACKED DEVICES WITH SEMICONDUCTOR COMPONENTS - A method for forming an assembly including, stacked on each other, first and second devices with semiconductor components including opposite conductive balls, this method including the steps of: a) forming, on the first device, at least one resin pattern, close to at least some of the conductive balls by a distance smaller than or equal to half the ball diameter, and of a height greater than the ball height; and b) bonding the second device to the first device, by using said at least one pattern to guide the balls of the second device towards the corresponding balls of the first device. | 2012-10-18 |
20120261821 | WAFER LEVEL PACKAGE HAVING A STRESS RELIEF SPACER AND MANUFACTURING METHOD THEREOF - In a semiconductor device package having a stress relief spacer, and a manufacturing method thereof, metal interconnect fingers extend from the body of a chip provide for chip interconnection. The metal fingers are isolated from the body of the chip by a stress-relief spacer. In one example, such isolation takes the form of an air gap. In another example, such isolation takes the form of an elastomer material. In either case, mismatch in coefficient of thermal expansion between the metal interconnect fingers and the body of the chip is avoided, alleviating the problems associated with cracking and delamination, and leading to improved device yield and device reliability. | 2012-10-18 |
20120261822 | Out-of-Plane Spacer Defined Electrode - In one embodiment, a method of forming an out-of-plane electrode includes providing an oxide layer above an upper surface of a device layer, providing a first cap layer portion above an upper surface of the oxide layer, etching a first electrode perimeter defining trench extending through the first cap layer portion and stopping at the oxide layer, depositing a first material portion within the first electrode perimeter defining trench, depositing a second cap layer portion above the first material portion, vapor releasing a portion of the oxide layer, depositing a third cap layer portion above the second cap layer portion, etching a second electrode perimeter defining trench extending through the second cap layer portion and the third cap layer portion, and depositing a second material portion within the second electrode perimeter defining trench, such that a spacer including the first material portion and the second material portion define out-of-plane electrode. | 2012-10-18 |
20120261823 | INTERCONNECT STRUCTURES WITH ENGINEERED DIELECTRICS WITH NANOCOLUMNAR POROSITY - A method for forming an interconnect structure with nanocolumnar intermetal dielectric is described involving the construction of an interconnect structure using a solid dielectric, and introducing a regular array of vertically aligned nanoscale pores through stencil formation and etching to form a hole array and subsequently pinching off the tops of the hole array with a cap dielectric. Variations of the method and means to construct a multilevel nanocolumnar interconnect structure are also described. | 2012-10-18 |
20120261824 | METAL DENSITY AWARE SIGNAL ROUTING - Methods and apparatus for routing signal paths in an integrated circuit. One or more signal routing paths for transferring signals of the integrated circuit may be determined. A dummy fill pattern for the integrated circuit may be determined based on the one or more metal density specifications and at least one design rule for reducing cross coupling capacitance between the dummy fill pattern and the routing paths. The signal routing paths and/or the dummy fill pattern may be incrementally optimized to meet one or more timing requirements of the integrated circuit. | 2012-10-18 |
20120261825 | SEMICONDUCTOR DEVICE - It is made for the layout of the mounting wiring at the time of mounting to become efficient by changing the structure of a semiconductor device. | 2012-10-18 |
20120261826 | TSV STRUCTURE AND METHOD FOR FORMING THE SAME - A TSV structure includes a through via connecting a first side and a second side of a wafer, a conductive layer which fills up the through via, a through via dielectric ring surrounding and directly contacting the conductive layer, a first conductive ring surrounding and directly contacting the through via dielectric ring as well as a first dielectric ring surrounding and directly contacting the first conductive ring and surrounded by the wafer. | 2012-10-18 |
20120261827 | THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANUFACTURE - A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening. | 2012-10-18 |
20120261828 | INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING ON-CHIP INTERCONNECT STRUCTURES BY IMAGE REVERSAL - An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region. | 2012-10-18 |
20120261829 | MIDDLE OF LINE STRUCTURES AND METHODS FOR FABRICATION - A contact structure includes a permanent antireflection coating formed on a substrate having contact pads. A patterned dielectric layer is formed on the antireflective coating. The patterned dielectric layer and the permanent antireflective coating form openings. The openings correspond with locations of the contact pads. Contact structures are formed in the openings to make electrical contact with the contacts pads such that the patterned dielectric layer and the permanent antireflective coating each have a conductively filled region forming the contact structures. | 2012-10-18 |
20120261830 | MEMS DEVICE ETCH STOP - The present disclosure provides a micro-electro-mechanical systems (MEMS) device and a method for fabricating such a device. In an embodiment, a MEMS device includes a substrate, a dielectric layer above the substrate, an etch stop layer above the dielectric layer, and two anchor plugs above the dielectric layer, the two anchor plugs each contacting the etch stop layer or a top metal layer disposed above the dielectric layer. The device further comprises a MEMS structure layer disposed above a cavity formed between the two anchor plugs and above the etch stop layer from release of a sacrificial layer. | 2012-10-18 |
20120261831 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, an integrated circuit device includes a plurality of interconnects and a contact via. The plurality of interconnects are arranged parallel to each other. The contact via is connected to the each of the interconnects. A protrusion is formed at a portion of each of the interconnects connected to the contact via to protrude in a direction of the arrangement. A recess is formed at a portion of the each of the interconnects separated from the portion having the protrusion to recede in the direction. The protrusion formed on one interconnect of two mutually-adjacent interconnects among the plurality of interconnects is opposed to the recess formed in one other interconnect of the two mutually-adjacent interconnects. The portion having the recess is separated from portions on two sides thereof and is separated also from the portion having the protrusion. | 2012-10-18 |
20120261832 | Wiring Board, Semiconductor Device, and Method for Manufacturing Wiring Board - A wiring board provided with a silicon substrate including a through hole that communicates a first surface and a second surface of the silicon substrate. A capacitor is formed on an insulating film, which is applied to the silicon substrate, on the first surface and a wall surface defining the through hole. A capacitor part of the capacitor includes a first electrode, a dielectric layer, and a second electrode that are sequentially deposited on the insulating film on the first surface and the wall surface of the through hole. A penetration electrode is formed in the through hole covered by the first electrode, the dielectric layer, and the second electrode of the capacitor part. | 2012-10-18 |
20120261833 | SEMICONDUCTOR DEVICE HAVING A MULTILAYER INTERCONNECTION STRUCTURE - A semiconductor device includes first and second conductor patterns embedded in a first interlayer insulation film and a third conductor pattern embedded in a second interlayer insulation film, the third conductor pattern including a main part and an extension part, the extension part being electrically connected to the first conductor pattern by a first via-plug, the extension part having a branched pattern closer to the main part compared with the first conductor pattern, the branched pattern making a contact with the second conductor pattern via a second via-plug, each of the main part, extension part including the branched pattern, first via-plug and second via-plug forming a damascene structure. | 2012-10-18 |
20120261834 | SEMICONDUCTOR DEVICE - A semiconductor device with a TSV and a shelter is provided. The semiconductor device includes a substrate, a circuit area, at least a TSV and a shelter. The circuit area and the TSV are disposed on the substrate, and the TSV penetrates through the substrate. The shelter is disposed on the substrate and at least one part thereof is between the circuit area and the TSV in order to shelter EMI between the TSV and the circuit area. The novel structure prevents the circuits in the circuit area being affected by noise caused by TSV when TSV acts as a power pin. | 2012-10-18 |
20120261835 | SEMICONDUCTOR DEVICE - The present invention provides a technique for improving the reliability of a semiconductor device where spreading of cracking that occurs at the time of dicing to a seal ring can be restricted even in a semiconductor device with a low-k film used as an interlayer insulating film. Dummy vias are formed in each layer on a dicing region side. The dummy vias are formed at the same intervals in a matrix as viewed in a top view. Even in the case where cracking occurs at the time of dicing, the cracking can be prevented from spreading to a seal ring by the dummy vias. As a result, resistance to moisture absorbed in a circuit formation region can be improved, and deterioration in reliability can be prevented. | 2012-10-18 |
20120261836 | ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES - A semiconductor structure comprises a top metal layer, a bond pad formed on the top metal layer, a conductor formed below the top metal layer, and an insulation layer separating the conductor from the top metal layer. The top metal layer includes a sub-layer of relatively stiff material compared to the remaining portion of the top metal layer. The sub-layer of relatively stiff material is configured to distribute stresses over the insulation layer to reduce cracking in the insulation layer. | 2012-10-18 |
20120261837 | SEMICONDUCTOR DEVICE - A semiconductor device may include, but is not limited to: a wiring hoard; and first and second chips stacked over the wiring board. The wiring board includes a plurality of first data terminals and a plurality of second data terminals. One of the first and second chips is sandwiched between the wiring board and the other of the first and second chips. The first chip includes a plurality of first data pads. The second chip includes a plurality of second data pads and a plurality of third data pads. The first data terminals of the wiring board are electrically connected respectively to the first data pads of the first chip and further respectively to the second data pads of the second chip. The second data terminals are electrically connected respectively to the third data pads of the second chip and electrically disconnected from the first chip. | 2012-10-18 |
20120261838 | MULTI-CHIP PACKAGE AND METHOD OF PROVIDING DIE-TO-DIE INTERCONNECTS IN SAME - A multi-chip package includes a substrate ( | 2012-10-18 |
20120261839 | DICING TAPE-INTEGRATED WAFER BACK SURFACE PROTECTIVE FILM - The present invention provides a dicing tape-integrated wafer back surface protective film including: a dicing tape including a base material and a pressure-sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on the pressure-sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored. It is preferable that the colored wafer back surface protective film has a laser marking ability. The dicing tape-integrated wafer back surface protective film can be suitably used for a flip chip-mounted semiconductor device. | 2012-10-18 |
20120261840 | SEMICONDUCTOR DEVICE - A semiconductor device includes an interposer, a semiconductor chip mounted on the interposer, a first wiring pattern formed on the interposer, the first wiring pattern including a first contact coupled to a bonding wire from the semiconductor chip and a second contact coupled to an external terminal of the interposer, and a second wiring pattern formed adjacent to the first wiring pattern on the interposer, the second wiring pattern including a third contact coupled to another bonding wire from the semiconductor chip and a fourth contact coupled to another external terminal of the interposer. The first contact is closer to the semiconductor chip than the third contact. | 2012-10-18 |
20120261841 | Article and Panel Comprising Semiconductor Chips, Casting Mold and Methods of Producing the Same - A panel with a reconfigured wafer including semiconductor chips arranged in rows and columns on semiconductor device positions includes: at least one semiconductor chip having a front, a rear and edge sides provided per semiconductor device position. The reconfigured wafer includes: a front side that forms a coplanar area with the front sides of the at least one semiconductor chip and a plastic housing composition embedding the edge sides and the rear side of the at least one semiconductor chip. The reconfigured wafer includes, on a rear side of the wafer, structures configured to stabilize the panel. The structures are composed of the plastic housing composition and are formed as thickenings of the reconfigured wafer. | 2012-10-18 |
20120261842 | Manual misting fan - There is disclosed a non-electric portable manually operated misting fan assembly which is formed by a handle for allowing the user to grasp and manipulate the fan assembly, the handle formed by a container adapted to function as a reservoir for a supply of fluid and having an upper end which includes a pump assembly including a pump head extending upwardly therefrom for pumping fluid from the handle container through a fluid nozzle located in the pump head. The fan means are fixedly mounted on the handle and positioned above the pump head, the fan means bounded by an upper end and a lower end, the lower end being accurately formed over the pump head in order to allow the user to position his finger on the pump head to manipulate the pump in order to eject a fluid from the fluid reservoir incident to the fanning procedure. | 2012-10-18 |
20120261843 | Manual misting fan - There is disclosed a non-electric portable manually operated misting fan assembly which is formed by a handle for allowing the user to grasp and manipulate the fan assembly, the handle formed by a container adapted to function as a reservoir for a supply of fluid and having an upper end which includes a pump assembly including a pump head extending upwardly therefrom for pumping fluid from the handle container through a fluid nozzle located in the pump head. The fan means are fixedly mounted on the handle and positioned above the pump head, the fan means bounded by an upper end and a lower end, the lower end being accurately formed over the pump head in order to allow the user to position his finger on the pump head to manipulate the pump in order to eject a fluid from the fluid reservoir incident to the fanning procedure. | 2012-10-18 |
20120261844 | Multi Stream Wine Aerating Device - A wine aerating device that can be inexpensively manufactured and produced that aerates wine leaving a wine container, such as a long neck bottle, by separating the flow of wine into multiple streams of wine that retain the individual streams, whereby each stream of wine increases the surface area of wine exposed to the atmosphere, without injecting air into the wine. The device of the present invention also produces an esthetically pleasing pour while at the same time aerating the liquid by the use of multiple bi-directional tubes formed in a stopper that do not inject air into the wine. | 2012-10-18 |
20120261845 | Resin Molded Article For Optical Element Manufacturing Apparatus And Method Of The Same - Disclosed is an apparatus for manufacturing a resin molded article having a hollow section inside for an optical element, by injecting a molten resin into a cavity. The apparatus has: a pressurized fluid injection device, which forms the hollow section by injecting a pressurized fluid into the molten resin injected into the cavity; and a bias device which biases a movable part in the same direction as a mold clamping direction. The movable part is moved with respect to a first mold or a second mold, in an opposite direction to the mold clamping direction against the bias force applied by the bias device, with a pressure increased in the mold by the injecting the pressurized fluid into the cavity. The moving is moved, in the same direction as the mold clamping direction, by discharge of the pressurized fluid. | 2012-10-18 |
20120261846 | LIQUID CRYSTAL DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - A polymerizable compound in a liquid crystal composition is polymerized in a state that liquid crystal molecules present in a gap between a pixel electrode and at least either one of signal electrodes and scanning electrodes are tilted in a direction from the at least either one of the signal electrodes and the scanning electrodes toward the pixel electrode. Preferably, the amount of the polymerizable compound remaining in the liquid crystal phase after the polymerization is not more than 0.05 parts by weight per 100 parts by weight of the liquid crystal. In a seal section surrounding the liquid crystal layer, a second seal wall is preferably provided at a position opposite to the liquid crystal injection inlet in the non-display section. | 2012-10-18 |
20120261847 | METHODS AND SYSTEMS FOR THERMAL FORMING AN OBJECT - A method and system for thermal forming an object. A mold is provided, a shape of which corresponds to a desired shape of the object. A material is inserted into a heating area, and the material is heated using a plurality of independently controllable heat sources that heat different areas of the material. The heated material is then disposed over or into at least a portion of the mold so as to deform the material. The deformed material may then be trimmed so as to form the object. | 2012-10-18 |
20120261848 | METHOD TO CREATE REMOVABLE DENTAL PROSTHESIS, AND THE DENTAL PROSTHESIS MAKING THEREOF - The subject of the invention is a method to create removable dental prosthesis, and the dental prosthesis making thereof, which solution is suitable for quick and efficient production of removable dental prostheses. | 2012-10-18 |
20120261849 | IMPRINT APPARATUS, AND ARTICLE MANUFACTURING METHOD USING SAME - The imprint apparatus of the present invention molds and cures a resin on a substrate using a mold to thereby form a pattern of the cured resin on the substrate. In this case, the resin is a mixture of an ultraviolet curable resin that is cured by receiving ultraviolet light and a luminescent material that fluoresces or phosphoresces by receiving ultraviolet light. The imprint apparatus further includes a light-emission detecting unit configured to detect light emitted from the luminescent material. After the mold is released from the ultraviolet curable resin, which is mixed with the luminescent material, on the substrate, the light-emission detecting unit detects light emitted from a residual resin that remains in a concave and convex portion of the pattern formed on the mold. | 2012-10-18 |
20120261850 | Closed Loop Blank Mold Temperature Control System And Method - A closed loop blank mold temperature control system and method for use in the operation of an I.S. machine is disclosed for automatically adjusting machine timing to maintain desired blank mold temperature/heat extraction. The closed loop blank mold temperature control system uses measured blank mold temperatures to automatically control the supply of coolant air to the blank molds, which may be done independently to each blank mold half as well as independently to the plunger for each blank mold. The closed loop blank mold temperature control system can provide temperature setpoint commands, balance left and right parison temperatures, and maintain parison temperatures as a setpoint, all of which contribute to enhanced final glass container quality. | 2012-10-18 |
20120261851 | Process to Manufacture a Composite Foam - Process to manufacture a composite foam including at least two foams with cellular structure, at least one of them being a latex foam. The present process avails itself of the steps of preparing separately the forming mixtures of the foams of cellular structure; mixing independently the one from the other forming mixtures; foaming separately each of the forming mixture; sending separately the foams obtained into a single mixing installation; mixing the foams until to manufacture the composite foam. Preferably the composite foam is deposited on a laying surface to form rest articles for example mattresses provided with recesses. | 2012-10-18 |
20120261852 | WINDOW COVERING COMPONENT MANUFACTURING SYSTEMS, METHODS, AND APPARATUSES - Exemplary window covering component manufacturing systems, methods, and apparatuses are described herein. An exemplary window covering component manufacturing method includes 1) feeding two separate opposing surface sheets through a sizing channel space formed between opposing sizing elements, 2) depositing foam forming chemicals between the two separate opposing surface sheets before entry of the two separate opposing surface sheets into the sizing channel space, and 3) facilitating at least one reaction of the foam forming chemicals to form a foam material that expands in volume within the sizing channel space to press the two separate opposing surface sheets against the opposing sizing elements and then cures to form a rigid core disposed between and bonded to the two separate opposing surface sheets. Other exemplary window covering component manufacturing systems, methods, and apparatuses are also described herein. | 2012-10-18 |
20120261853 | VACCUM FORMING REGULATOR BAG - A vacuum-forming system for deforming a forming blank is disclosed. The system includes a tool and at least one regulator bag disposed adjacent to the tool. The regulator bag includes a sealed bag having an exterior and an interior and a first volume and a defined passage from the interior to the exterior of the regulator bag. The passage is configured such that the regulator bag has a rate of deflation wherein the sealed bag will deflate from the first volume to a second volume over a determined period of time while the exterior of the sealed bag is at a determined reduced pressure. The system also includes a vacuum membrane coupled to the tool, the membrane configured to form a vacuum space enclosing the forming blank and the at least one regulator bag. | 2012-10-18 |
20120261854 | BUNDLE OF ROVING YARNS, METHOD OF MANUFACTURING A BUNDLE OF ROVING YARNS AND METHOD FOR MANUFACTURING A WORK PIECE - A method of manufacturing a bundle of roving yarns is described. The method is characterised in assembling a number of roving yarns of longitudinal unidirectional fibres and an additional component in a bundle. For example, at least one resin distribution means or a thermoplastic material may be placed as the additional component in the bundle. | 2012-10-18 |
20120261855 | APPARATUS AND METHODS FOR PROCESSING DOSES OF FLOWABLE MATERIAL - An apparatus comprises an extruding device having a dispensing opening for extruding a flowable material along an exit direction through the dispensing opening, and a cutting arrangement for separating a dose from the flowable material, the cutting arrangement being movable with a motion component that is parallel to the exit direction. | 2012-10-18 |
20120261856 | METHOD FOR MANUFACTURING PRODUCTS MADE OF COMPOSITE MATERIAL WITH A CLOSED-SECTION SANDWICH STRUCTURE - A matched mold curing apparatus defining a molding cavity has two sets of layers of curable, fiber-reinforced, thermosetting composite material laminated on a lower forming tool and upper forming tool. Closed-cell foam core segments are provided and placed adjacent to each other on the layers. The core segments are oversized with respect to the nominal size determined by the molding cavity in the closed condition, minus the thickness of the layers of composite material. A controlled temperature is applied firstly to allow plastic deformation of the core segments, but without closing completely the matched mold. The temperature and pressure are then applied to cause complete closure of the matched mold and curing of the laminated layers. | 2012-10-18 |
20120261857 | CATHETER HAVING A COEXTRUDED FLUOROPOLYMER LAYER - A catheter shaft including an elongate tubular member including a first polymeric layer and a second polymeric layer bonded to the first polymeric layer. The first polymeric layer is formed of a polymer generally not bondable to fluoropolymers, and the second polymeric layer is formed of a fluoropolymer bonded to the polymer of the first polymeric layer. The fluoropolymer of the second polymeric layer is a functionalized polyvinylidene fluoride which has a bonding affinity to the polymer of the first polymeric layer. The functionalized polyvinylidene fluoride includes reactive functional groups chemically bonded to a polymer chain of a polyvinylidene fluoride which readily bond to the polymer chain of the polymer of the first polymeric layer. | 2012-10-18 |
20120261858 | Methods for Increasing a Retention Force Between a Polymeric Scaffold and a Delivery Balloon - A medical device-includes a scaffold crimped to a catheter having an expansion balloon. The scaffold is crimped to the balloon by a process that includes inflating the delivery balloon during a diameter reduction to improve scaffold retention and maintaining an inflated balloon during the diameter reduction and prior and subsequent dwell periods. | 2012-10-18 |
20120261859 | PROCESS FOR MANUFACTURING GOLF BALLS HAVING A MULTI-LAYERED COVERS - The invention is directed to a process for making a golf ball having a multi-layered cover including a very thin outermost cover layer, the process comprising for example: forming first and second substantially hemispherical half shells having a thickness and comprising a thermoplastic composition, each half shell further having an outer surface and an inner surface, the inner surface forming an hemispherical cavity; securing the first half shell in a golf ball mold; securing a core subassembly in a subassembly holder; dispensing an uncured liquid thermoset composition into the hemispherical cavity of the first half shell; inserting a first half of the core subassembly into the hemispherical cavity of the first half shell and displacing an amount of the uncured liquid thermoset composition such that the uncured liquid thermoset composition forms an inner cover layer having a thickness; disengaging the core subassembly from the subassembly holder when the thermoset composition has gelled to a point of rigidity; securing the second half shell in a golf ball mold; dispensing the uncured liquid thermoset composition into the hemispherical cavity of the second half shell; inserting a second half of the core subassembly into the hemispherical cavity of the second half shell and displacing an amount of the uncured liquid thermoset composition such that the uncured liquid thermoset composition forms an inner cover layer having a thickness and thereby mating the first and second half shells; and curing the thermoset inner cover layer to complete the golf ball and then removing the resulting golf ball from the golf ball mold. | 2012-10-18 |
20120261860 | PROCESS FOR MANUFACTURING GOLF BALLS HAVING A MULTI-LAYERED COVERS - The invention is directed to a process for making a golf ball having a multi-layered cover including a very thin outermost cover layer, the process comprising for example: forming first and second substantially hemispherical half shells having a thickness and comprising a thermoplastic composition, each half shell further having an outer surface and an inner surface, the inner surface forming an hemispherical cavity; securing the first half shell in a golf ball mold; securing a core subassembly in a subassembly holder; dispensing an uncured liquid thermoset composition into the hemispherical cavity of the first half shell; inserting a first half of the core subassembly into the hemispherical cavity of the first half shell and displacing an amount of the uncured liquid thermoset composition such that the uncured liquid thermoset composition forms an inner cover layer having a thickness; disengaging the core subassembly from the subassembly holder when the thermoset composition has gelled to a point of rigidity; securing the second half shell in a golf ball mold; dispensing the uncured liquid thermoset composition into the hemispherical cavity of the second half shell; inserting a second half of the core subassembly into the hemispherical cavity of the second half shell and displacing an amount of the uncured liquid thermoset composition such that the uncured liquid thermoset composition forms an inner cover layer having a thickness and thereby mating the first and second half shells; and curing the thermoset inner cover layer to complete the golf ball and then removing the resulting golf ball from the golf ball mold. | 2012-10-18 |
20120261861 | Nano-Steel Reinforcing Fibers in Concrete, Asphalt and Plastic Compositions and the Associated Method of Fabrication - A metal fiber reinforced composition and its method of fabrication. Metal fibers are created by broaching or shaving metal wool from stock material. The wool is straightened and cut into short lengths. Each of the metal fibers has an average maximum diameter of between 0.005 millimeters and 0.2 millimeters, and a cut length no greater than two-hundred times the average maximum diameter. A volume of a curable composition is provided. The metal fibers are mixed into the curable composition to create a fiber reinforced composition. The fiber reinforced composition is then formed into a selected shape, such as a construction element. The selected shape is then cured. Since the metal fibers are dispersed uniformly throughout the selected shape, curing or re-heating of the selected shape can be facilitated using an induction coil that heats the various metal fibers within the selected shape. | 2012-10-18 |
20120261862 | IN-MOLD INDICIA MARKING OF ROTATIONAL MOLDED PRODUCTS - This invention comprises a self-supporting, temperature-stable, indicia-bearing laminate of at least one layer of a non-oriented polyolefin film having an indicia array and a layer of a non-oriented polyolefin support film. The indicia layer laminate is formed by printing a carrier sheet with at least one layer of a printing ink comprising a mixture of particulate polyolefin, indicia material and a polyolefin-compatible resin. The polyolefin support film is printed as a layer over the indicia layer with a mixture of a polyolefin and a polyolefin-compatible resin. The printed layers are cured into non-oriented films, forming an indicia transfer. The transfer is used by removing the indicia-bearing laminate from the carrier sheet and applying the laminate to the inside surface of a rotational mold where it melts and fuses into the outer wall of a polyolefin product during the formation of the product in the rotational molding cycle. | 2012-10-18 |
20120261863 | BUILDING BRICKS INCLUDING PLASTICS - A brick includes a thermoplastic material, such as high density polyethylene (HDPE), and a cement-containing material. The brick may be made by mixing thermoplastic material and dry, uncured cement-containing material. This mixture is placed in a mold. The mold is heated while the mixture is compressed to melt or soften the thermoplastic material and to bind the particulate material in the mold into the shape of a brick. After the hardened brick is removed from the mold, the surface of the brick may be sprayed with water to cure cement-containing material on the surface of the brick. | 2012-10-18 |
20120261864 | METHOD OF PRODUCING A FIBRE REINFORCED STRUCTURE - A method in which a fibre material is laid on a mould surface resembling a negative image of a fibre reinforced structure to be produced. Layering the fibre material on the mould surface includes laying rovings of the fibre material on the mould surface or on a fibre material already laid on the mould surface and applying an low pressure to a space between the rovings and the mould surface. | 2012-10-18 |
20120261865 | Apparatus and Method for Transforming Plastic Preforms into Plastic Containers, with Coupled Pivoting and Locking Movements - Apparatus for transforming plastic preforms into containers includes a blow moulding station on a movable carrier. The station includes a carrier for holding a blow mould, and the carrier includes a first part and a second part, pivotable with respect to the first part relative to a predefined first pivot axis. The station includes a lock mechanism for locking the first part with respect to the second part. Lock mechanism includes a first element arranged on the first part and a second element arranged on the second part. At least the first element is movable with respect to the carrier relative to a second predefined axis. Pivoting movement of the first part and movement of the first element are coupled to one another by a coupling device such that the second axis moves with respect to the carrier in a direction perpendicular to the second axis. | 2012-10-18 |
20120261866 | USE OF THERMOPLASTIC MOLDING MATERIALS FOR GID/WIT - Use of thermoplastic molding compositions comprising
| 2012-10-18 |
20120261867 | Protective Device for Sports Equipment - Safety or protective devices for use in preventing or limiting injury to players impacting against sports equipment use compression coil springs, gas springs, foam or combinations thereof to absorb force during the impact. Particular embodiments are configured for use at the edge of a glass viewing and shielding panel disposed atop the boards of a hockey rink, for example such edges typically found at the team bench of a conventional hockey rink. | 2012-10-18 |
20120261868 | REBOUND STOPPER OF STRUT ASSEMBLY FOR SUSPENSION IN VEHICLE - A rebound stopper of a strut assembly for a suspension in a vehicle, may include a steel plate combined with a strut and being fitted over an upper end of the strut which has passed into a car body, a rubber plate fitted around an outer circumferential edge of the steel plate, and a mass damper combined with the rubber plate and functioning as a damper by resiliently moving relative to the rubber plate during a rebounding motion of the strut assembly. | 2012-10-18 |
20120261869 | Variable-Elastomer Semi-Active Damping Apparatus - A variable semi-active damping assembly comprising a shock body defining a fluid-filled chamber; a piston tube having a first end slidably disposed within the shock body; an inner rod slidably disposed within the piston tube and the shock body, the inner rod having a first end connected to a lower piston mount and a second end extending outward from the piston tube and engaging an adjustment mechanism that is configured to move the inner rod with respect to the shock body; an upper piston mount slidably disposed within the shock body and connected to the piston tube; and a deformable member disposed between the lower piston mount and the upper piston mount, the deformable member being configured to transition between a compressed state and a non-compressed state in response to movement by the lower piston mount. | 2012-10-18 |
20120261870 | PRINTED CIRCUIT BOARD, A SUPPORTING JIG AND A POSITIONING METHOD - A printed circuit board, a supporting jig, and a positioning method are disclosed, wherein the supporting jig is used for positioning a printed circuit board to facilitate surface mount technology (SMT) procedures. The printed circuit board includes a circuit board locating hole, and a first magnet, wherein the first magnet is accommodated in the circuit board locating hole. The supporting jig has a jig locating hole and a second magnet. The jig locating hole is beneath the circuit board locating hole. The second magnet is accommodated in the jig locating hole so that the printed circuit board can be fixed on the supporting jig by the magnetic attraction between the first magnet and the second magnet. | 2012-10-18 |
20120261871 | Cutting Board Device Integrally Supported By Countertop - A cutting board device integrally supported by a countertop, the device having a platform detachably connected to a base. The cutting board device includes a means for removably attaching a plurality of implements to the cutting board device, and a lifting means for allowing the cutting board device to move between settable raised and lowered positions about an opening in the countertop. | 2012-10-18 |
20120261872 | SHEET STACKING DEVICE AND SHEET FOLDING DEVICE - According to the present invention, a stacking face ( | 2012-10-18 |
20120261873 | SHEET PROCESSING APPARATUS THAT CARRIES OUT POST-PROCESSING ON FOLD OF SHEET BUNDLE - A sheet processing apparatus which is capable of enhancing productivity in flattening a fold top of a sheet bundle. The sheet processing apparatus has a conveying unit that conveys a folded sheet bundle to a processing position, and a holding unit that holds the sheet bundle conveyed by the conveying unit. When the folded sheet bundle has been conveyed by a predetermined distance after a leading end of the sheet bundle has been detected and before the sheet bundle reaches a processing position, the holding unit starts holding the sheet bundle, and then the conveying units stops conveyance of the sheet bundle. | 2012-10-18 |
20120261874 | PAPER SHEET HANDLING APPARATUS - A paper sheet handling apparatus includes: a transport path including a pair of a first transport surface and a second transport surface; at least one storage module configured to store the paper sheets transported through the transport path; and a body including the transport path and the storage module. The storage module is attachable and detachable to and from the body by moving the storage module in a predetermined direction, a part of an outer surface of the storage module attached to the body forms the first transport surface, and the second transport surface is exposed when the storage module is detached from the body so that the second transport surface is visible from the predetermined direction. | 2012-10-18 |
20120261875 | IMAGE FORMING APPARATUS AND CONTROL METHOD FOR THE SAME - An image forming apparatus is provided. Sheets, a plurality of which form a set, are contained in each of containers, and sheets are fed from the corresponding containers. If a first sheet to be fed is in the same layer as a second sheet that was fed from the containers last time, the first sheet is fed from a set that included the second sheet in the containers is fed. If the layer of the first sheet is higher than the layer of the second sheet that was fed from the containers last time, all remaining sheets in the set that included the second sheet are discharged from the containers. | 2012-10-18 |
20120261876 | DEVICE FOR HANDLING BANKNOTES - The invention relates to a device for handling notes of value, comprising at least one cash box for receiving notes of value and at least one separating and/or stacking module for removing notes of value and/or for supplying notes of value to the cash box. Here, the separating and/or stacking module and the cash box are arranged separately from each other. The cash box comprises a retraction element which in a swiveled-away position is arranged such that the notes of value are suppliable to the cash box by means of the separating and/or stacking module through an opening of the cash box and/or are removable from the cash box. In a retaining position, the retraction element is arranged such that no notes of value are suppliable to and no notes of value are removable from the cash box | 2012-10-18 |
20120261877 | System For Directing Sheet Articles In Arrival From An Input Line Towards Two Output Lines | 2012-10-18 |
20120261878 | PAPER DELIVERING DEVICE - A paper delivering device includes a delivering module and a detecting module. The delivering module includes a paper tray for supporting at least one paper, at least one roller attached on the paper tray for delivering the at least one paper, and a blocking member pivotably attached to the paper tray. The detecting module detects whether the at least one paper is placed in a position predetermined as correct. The blocking member is locked at a first position to prevent the sliding movement of the at least one paper when the at least one paper is not placed at the predetermined position, or may be rotated to a second position to allow the forward movement of the at least one paper when the at least one paper is correctly placed. | 2012-10-18 |
20120261879 | PAPER INPUTTING APPARATUS - A paper inputting apparatus comprises a release soft roller shaft comprising an elastic member; a first soft roller shaft rotatably attached to the release soft roller shaft, the first soft roller shaft comprising an idler sleeve; wherein the elastic member abuts the first soft roller shaft; a second soft roller shaft comprising a soft roller; and a driving device attached to the release soft roller shaft; wherein the driving device rotates the release soft roller shaft and the first soft roller shaft between a first and a second positions relative to the second soft roller shaft; when in the first position, the idler sleeve abuts the soft roller, and the paper inputting apparatus grips a sheet of paper; when in the second position, a gap is defined between the idler sleeve and the soft roller, and the paper inputting apparatus releases the sheet of paper. | 2012-10-18 |
20120261880 | SHEET CONVEYER DEVICE - A sheet conveyer device, including a main housing and a cover member, is provided. The cover member has a plane section made of a transparent material and is attachable to the main housing with a predetermined facing surface of the plane section set to face a predetermined plane of the main housing. An ornamental sheet can be detachably attached to the sheet conveyer device in a position between the predetermined plane and the cover member. The cover member includes an engaging piece, which is formed on a same side as the predetermined facing surface of the plane section and is engageable with an engageable section in the main housing. The engaging piece has a sheet holding rib and a clearance in between the predetermined facing surface and the sheet holding rib and holds a lateral end of the ornamental sheet in the clearance. | 2012-10-18 |
20120261881 | MODIFIED ROULETTE TABLE LAYOUT - The invention provides for a modified roulette table layout comprising at least one additional betting position, wherein the additional betting position provides a wager equivalent to an existing betting position. | 2012-10-18 |
20120261882 | EMERGENCY STOPPING SYSTEM FOR TRACK MOUNTED MOVABLE BULLET TARGETS AND TARGET TROLLEYS - An emergency stopping system for track mounted movable targets used divergent cables to stop a target trolley which has not been otherwise stopped before coming to the end of a track. As the trolley passes over the diverging cables, the cables are forced together, causing the trolley to dissipate kinetic energy. | 2012-10-18 |
20120261883 | Clay target magazine - A clay target magazine comprising a wall of cylindrical shape, said wall having at least one sight window provided therein, said magazine having slots provided in said wall proximate to said walls lower end to accept a retaining means therein, said magazine sized to hold a plurality of clay targets, said magazine further sized in order to be loaded into the carousel of a clay target trap. | 2012-10-18 |
20120261884 | SHAFT SEAL DEVICE AND ROTARY MACHINE INCLUDING SHAFT SEAL DEVICE - There is provided a shaft seal device comprising a seal piece-laminated body ( | 2012-10-18 |
20120261885 | SEAL ARRANGEMENT - A sealing arrangement for a bearing assembly. The sealing arrangement can include a static seal carrier coupled to a static component of the bearing assembly and including a first plurality of rings, a rotating seal carrier coupled to a rotating component of the bearing assembly and including a second plurality of rings, the first plurality of rings and the second plurality of rings disposed in an interdigitated arrangement so as to define a tortuous passageway therebetween, the tortuous passageway having one end in communication with a high pressure area of the bearing assembly and a second end in communication with a low pressure area of the bearing assembly, and a scraper seal coupled to the rotating seal carrier and disposed over the second end of the tortuous passageway. | 2012-10-18 |
20120261886 | MULTI-PIECE OIL RING - A multi-piece oil ring includes an oil ring main member in which two rails are connected together by a columnar part and which has a roughly I-shaped cross section; and a coil expander disposed in an inner circumferential groove formed on the inner circumferential surface of the columnar. Each rail in the oil ring main member possesses a sliding section protuberance whose tip possesses a jutting portion. The axial length of the jutting portion is 0.02-0.18 mm. The change rate of the axial length of the individual jutting portion is in the range of 0 to 80% at least in a region of from its sliding surface to be faced to a cylinder, which is positioned at the tip of the jutting portion, to a position of 0.03 mm away from the aforementioned sliding surface in the radial direction of the oil ring main member. | 2012-10-18 |
20120261887 | Segmented Intershaft Seal Assembly - A segmented intershaft seal assembly for counter-rotating and co-rotating turbine engines is described. The assembly includes a pair of end rings, an annular seal element, and at least one resilient element. At least one end ring has a flange that extends from one side thereof. The flange has a lower annular surface. The seal element includes at least two seal segments. Each seal segment includes a ring segment and a ring flange segment. The ring segment has an upper radial surface. The ring flange segment directly contacts and extends from the upper radial surface forming either a substantially âTâ-shaped or âLâ-shaped cross section. The seal segments are disposed between the end rings. At least one resilient element biases each seal segment away from the inner shaft so that the upper radial surface contacts the lower annular surface and a portion of the ring flange segment extends beyond the flanges. | 2012-10-18 |
20120261888 | ELASTOMERIC SEAL FOR ROTATING HEADS - An all-elastomeric sealing element for a rotating control device includes a base portion, a conical portion and has a central pipe opening through both the base portion and the conical section. The conical section has an elastomeric core layer and an elastomeric surface sealing layer which encases the core layer. The surface sealing layer is softer than the core layer, as measured on a standard durometer scale. | 2012-10-18 |