42nd week of 2019 patent applcation highlights part 55 |
Patent application number | Title | Published |
20190318974 | CIRCUIT MODULE AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190318975 | CHIP SCALE PACKAGE (CSP) INCLUDING SHIM DIE | 2019-10-17 |
20190318976 | COOLING TECHNIQUES FOR SEMICONDUCTOR PACKAGE | 2019-10-17 |
20190318977 | POWER SEMICONDUCTOR DEVICE AND POWER MODULE | 2019-10-17 |
20190318978 | FLEXIBLE HEAT SINK FOR THERMOELECTRIC DEVICE AND FLEXIBLE THERMOELECTRIC DEVICE CONTAINING IT | 2019-10-17 |
20190318979 | CHARGER | 2019-10-17 |
20190318980 | METHOD OF MANUFACTURING ELECTRONIC DEVICE | 2019-10-17 |
20190318981 | SEMICONDUCTOR DEVICE | 2019-10-17 |
20190318982 | ELECTRONIC DEVICE AND CONNECTOR | 2019-10-17 |
20190318983 | Spot-Solderable Leads for Semiconductor Device Packages | 2019-10-17 |
20190318984 | Semiconductor Device and Method of Forming Conductive Vias to Have Enhanced Contact to Shielding Layer | 2019-10-17 |
20190318985 | PACKAGE STRUCTURE FOR ELECTRONIC ASSEMBLIES | 2019-10-17 |
20190318986 | Semiconductor Device Having Via Sidewall Adhesion With Encapsulant | 2019-10-17 |
20190318987 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-10-17 |
20190318988 | MOUNTING SUBSTRATE WAFER, MULTILAYER CERAMIC SUBSTRATE, MOUNTING SUBSTRATE, CHIP MODULE, AND MOUNTING SUBSTRATE WAFER MANUFACTURING METHOD | 2019-10-17 |
20190318989 | TIGHT PITCH VIA STRUCTURES ENABLED BY ORTHOGONAL AND NON-ORTHOGONAL MERGED VIAS | 2019-10-17 |
20190318990 | SEMICONDUCTOR DEVICE | 2019-10-17 |
20190318991 | Output Driver Circuit Configurable with Via Layer to Support Multiple Standards | 2019-10-17 |
20190318992 | SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME | 2019-10-17 |
20190318993 | ENABLING LONG INTERCONNECT BRIDGES | 2019-10-17 |
20190318994 | SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS | 2019-10-17 |
20190318995 | Semiconductor Wafer, Semiconductor Chip and Method of Fabricating a Semiconductor Wafer | 2019-10-17 |
20190318996 | Molding Compound and Semiconductor Package with a Molding Compound | 2019-10-17 |
20190318997 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190318998 | METHOD AND SYSTEM FOR PROVIDING A REVERSE-ENGINEERING RESISTANT HARDWARE EMBEDDED SECURITY MODULE | 2019-10-17 |
20190318999 | SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319000 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-10-17 |
20190319001 | SEMICONDUCTOR MEMORY DEVICE STRUCTURE | 2019-10-17 |
20190319002 | DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2019-10-17 |
20190319003 | ANISOTROPIC CONDUCTIVE FILM | 2019-10-17 |
20190319004 | WIRING WITH EXTERNAL TERMINAL | 2019-10-17 |
20190319005 | ULTRASONIC TRANSDUCER SYSTEMS INCLUDING TUNED RESONATORS, EQUIPMENT INCLUDING SUCH SYSTEMS, AND METHODS OF PROVIDING THE SAME | 2019-10-17 |
20190319006 | NANOWIRE ENABLED SUBSTRATE BONDING AND ELECTRICAL CONTACT FORMATION | 2019-10-17 |
20190319007 | LOW TEMPERATURE BONDED STRUCTURES | 2019-10-17 |
20190319008 | PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190319009 | CHIP STACK PACKAGES | 2019-10-17 |
20190319010 | SEMICONDUCTOR PACKAGING STRUCTURE AND METHOD OF FORMING THE SAME | 2019-10-17 |
20190319011 | MOUNTING STRUCTURES FOR INTEGRATED DEVICE PACKAGES | 2019-10-17 |
20190319012 | STACKED SEMICONDUCTOR PACKAGES, METHODS OF FABRICATING THE SAME, AND/OR SYSTEMS EMPLOYING THE SAME | 2019-10-17 |
20190319013 | SEMICONDUCTOR DEVICES WITH DUPLICATED DIE BOND PADS AND ASSOCIATED DEVICE PACKAGES AND METHODS OF MANUFACTURE | 2019-10-17 |
20190319014 | PANEL FOR DISPLAY BY MICRO LED AND METHOD FOR MAKING SAME | 2019-10-17 |
20190319015 | Emissive Display Substrate for Surface Mount Micro-LED Fluidic Assembly | 2019-10-17 |
20190319016 | LED PACKAGE STRUCTURE | 2019-10-17 |
20190319017 | DISPLAY DEVICE AND EPITAXIAL WAFER | 2019-10-17 |
20190319018 | WHITE LIGHT SOURCE AND METHOD OF PRODUCING A WHITE LIGHT SOURCE | 2019-10-17 |
20190319019 | LED ARRAY MODULE | 2019-10-17 |
20190319020 | INTEGRATED MULTI-COLOR LIGHT-EMITTING PIXEL ARRAYS BASED DEVICES BY BONDING | 2019-10-17 |
20190319021 | PERPENDICULAR STACKED FIELD-EFFECT TRANSISTOR DEVICE | 2019-10-17 |
20190319022 | CELL CIRCUITS FORMED IN CIRCUIT CELLS EMPLOYING OFFSET GATE CUT AREAS IN A NON-ACTIVE AREA FOR ROUTING TRANSISTOR GATE CROSS-CONNECTIONS | 2019-10-17 |
20190319023 | Symmetric FET for RF Nonlinearity Improvement | 2019-10-17 |
20190319024 | ESD PROTECTION SILICON CONTROLLED RECTIFIER DEVICE | 2019-10-17 |
20190319025 | ESD PROTECTION ELEMENT | 2019-10-17 |
20190319026 | SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319027 | INTEGRATED CIRCUIT DEVICE | 2019-10-17 |
20190319028 | SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319029 | MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME | 2019-10-17 |
20190319030 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2019-10-17 |
20190319031 | BIT LINE GATE AND MANUFACTURING METHOD THEREOF | 2019-10-17 |
20190319032 | VERTICAL TRANSPORT DEVICES WITH GREATER DENSITY THROUGH MODIFIED WELL SHAPES | 2019-10-17 |
20190319033 | 3D MEMORY HAVING PLURAL LOWER SELECT GATES | 2019-10-17 |
20190319034 | MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-10-17 |
20190319035 | GATE FRINGING EFFECT BASED CHANNEL FORMATION FOR SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319036 | Method and system for object reconstruction | 2019-10-17 |
20190319037 | METHOD OF MANUFACTURING MEMORY DEVICE | 2019-10-17 |
20190319038 | SEMICONDUCTOR DEVICES | 2019-10-17 |
20190319039 | VERTICAL SEMICONDUCTOR MEMORY DEVICE STRUCTURES INCLUDING VERTICAL CHANNEL STRUCTURES AND VERTICAL DUMMY STRUCTURES | 2019-10-17 |
20190319040 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING BIDIRECTIONAL TAPER STAIRCASES AND METHODS OF MAKING THE SAME | 2019-10-17 |
20190319041 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319042 | THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICES | 2019-10-17 |
20190319043 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-10-17 |
20190319044 | Three-dimensional vertical NOR Flash Thin-Film Transistor Strings | 2019-10-17 |
20190319045 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319046 | ACTIVE MATRIX SUBSTRATE, DISPLAY DEVICE, AND METHOD FOR REPAIRING DEFECT OF ACTIVE MATRIX SUBSTRATE | 2019-10-17 |
20190319047 | SEMICONDUCTOR DEVICE | 2019-10-17 |
20190319048 | HIGH-VOLTAGE TRANSISTOR DEVICE WITH THICK GATE INSULATION LAYERS | 2019-10-17 |
20190319049 | ALTERNATIVE DESIGNS FOR ADDRESSING CONTACTS THAT ENHANCE BENDABILITY OF TFT BACKPLANES | 2019-10-17 |
20190319050 | DISPLAY APPARATUS HAVING A SUBSTRATE INCLUDING A POLYMER RESIN AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190319051 | TOUCH DISPLAY DEVICE WITH MESH UNITS AND ANTI-STATIC ELECTRICITY CONNECTING PARTS | 2019-10-17 |
20190319052 | WIRING BOARD AND DISPLAY DEVICE | 2019-10-17 |
20190319053 | OPTICAL ELEMENT, IMAGE SENSOR PACKAGE, IMAGING DEVICE AND ELECTRONIC DEVICE | 2019-10-17 |
20190319054 | BACKSIDE ILLUMINATED IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190319055 | LIGHT-RECEIVING DEVICE, METHOD OF MANUFACTURING LIGHT-RECEIVING DEVICE, AND ELECTRONIC APPARATUS | 2019-10-17 |
20190319056 | IMAGE SENSOR, IMAGE CAPTURING APPARATUS AND IMAGE PROCESSING APPARATUS | 2019-10-17 |
20190319057 | MANUFACTURE OF SEMICONDUCTOR MODULE WITH TRANSPARENT MOLDING COMPONENT | 2019-10-17 |
20190319058 | SOLID-STATE IMAGE SENSOR AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190319059 | OPTICAL SENSORS AND METHODS FOR FORMING THE SAME | 2019-10-17 |
20190319060 | IMAGE SENSOR INCLUDING TRANSMITTING LAYERS HAVING LOW REFRACTIVE INDEX | 2019-10-17 |
20190319061 | MULTI-PHOTODIODE PIXEL CELL | 2019-10-17 |
20190319062 | IMAGE SENSORS AND ELECTRONIC DEVICES | 2019-10-17 |
20190319063 | BENDABLE X-RAY DETECTOR WITH TFT BACKPLANE IN THE NEUTRAL PLANE | 2019-10-17 |
20190319064 | MICRO LED DISPLAY AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |
20190319065 | METHOD OF MANUFACTURING LIGHT EMITTING DEVICE | 2019-10-17 |
20190319066 | OPTOELECTRONIC DEVICE WITH LIGHT-EMITTING DIODES | 2019-10-17 |
20190319067 | Athletic Activity Monitoring Device with Energy Capture | 2019-10-17 |
20190319068 | Hall Sensor With Buried Hall Plate | 2019-10-17 |
20190319069 | MAGNETIC DEVICES WITH MAGNETIC AND GETTER REGIONS | 2019-10-17 |
20190319070 | SWITCH AND METHOD FOR FABRICATING THE SAME, AND RESISTIVE MEMORY CELL AND ELECTRONIC DEVICE, INCLUDING THE SAME | 2019-10-17 |
20190319071 | SOLID-STATE IMAGING ELEMENT AND SOLID-STATE IMAGING APPARATUS | 2019-10-17 |
20190319072 | PHOTO-ELECTRIC CONVERSION ELEMENT, SOLID-STATE IMAGING ELEMENT, AND ELECTRONIC APPARATUS | 2019-10-17 |
20190319073 | MICRO LED DISPLAY AND METHOD OF MANUFACTURING THE SAME | 2019-10-17 |