41st week of 2017 patent applcation highlights part 42 |
Patent application number | Title | Published |
20170294376 | Reliable packaging and interconnect structures | 2017-10-12 |
20170294377 | MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICES INCLUDING VERTICALLY SHARED SOURCE LINES AND METHOD OF MAKING THEREOF | 2017-10-12 |
20170294378 | METHOD TO FABRICATE A HIGH PERFORMANCE CAPACITOR IN A BACK END OF LINE (BEOL) | 2017-10-12 |
20170294379 | METHOD FOR FORMING AN ELECTRICAL CONTACT BETWEEN A SEMICONDUCTOR FILM AND A BULK HANDLE WAFER, AND RESULTING STRUCTURE | 2017-10-12 |
20170294380 | SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME | 2017-10-12 |
20170294381 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS | 2017-10-12 |
20170294382 | SEMICONDUCTOR INTERCONNECT STRUCTURE WITH DOUBLE CONDUCTORS | 2017-10-12 |
20170294383 | SEMICONDUCTOR DEVICE STRUCTURES INCLUDING STAIRCASE STRUCTURES, AND RELATED METHODS AND ELECTRONIC SYSTEMS | 2017-10-12 |
20170294384 | SEMICONDUCTOR STRUCTURE HAVING ETCHING STOP LAYER AND MANUFACTURING METHOD OF THE SAME | 2017-10-12 |
20170294385 | SEMICONDUCTOR STRUCTURES WITH FIELD EFFECT TRANSISTOR(S) HAVING LOW-RESISTANCE SOURCE/DRAIN CONTACT(S) | 2017-10-12 |
20170294386 | FIELD-EFFECT TRANSISTOR, METHOD OF MANUFACTURING THE SAME, AND RADIO-FREQUENCY DEVICE | 2017-10-12 |
20170294387 | ELECTRONIC CIRCUIT PACKAGE | 2017-10-12 |
20170294388 | VERTICAL MEMORY DEVICES AND METHODS OF MANUFACTURING THE SAME | 2017-10-12 |
20170294389 | SEMICONDUCTOR PACKAGE STRUCTURE, PACKAGE ON PACKAGE STRUCTURE AND PACKAGING METHOD | 2017-10-12 |
20170294390 | LENS CAP FOR A TRANSISTOR OUTLINE PACKAGE | 2017-10-12 |
20170294391 | DICING TECHNIQUES FOR POWER TRANSISTORS | 2017-10-12 |
20170294392 | SEMICONDUCTOR STRUCTURES AND FABRICATION METHODS THEREOF | 2017-10-12 |
20170294393 | PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT | 2017-10-12 |
20170294394 | SEMICONDUCTOR DEVICE HAVING A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS | 2017-10-12 |
20170294395 | SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS | 2017-10-12 |
20170294396 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | 2017-10-12 |
20170294397 | DIE AND SUBSTRATE ASSEMBLY WITH GRADED DENSITY BONDING LAYER | 2017-10-12 |
20170294398 | SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING OF ELEMENTS | 2017-10-12 |
20170294399 | POWER MODULE SUBSTRATE WITH Ag UNDERLAYER AND POWER MODULE | 2017-10-12 |
20170294400 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2017-10-12 |
20170294401 | SEMICONDUCTOR PACKAGES AND METHODS FOR FORMING SEMICONDUCTOR PACKAGE | 2017-10-12 |
20170294402 | Bonding Package Components Through Plating | 2017-10-12 |
20170294403 | Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate | 2017-10-12 |
20170294404 | SINTERABLE BONDING MATERIAL AND SEMICONDUCTOR DEVICE USING THE SAME | 2017-10-12 |
20170294405 | METHOD OF FORMING A PLURALITY OF ELECTRONIC COMPONENT PACKAGES | 2017-10-12 |
20170294406 | Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages | 2017-10-12 |
20170294407 | PASSIVE ELEMENT PACKAGE AND SEMICONDUCTOR MODULE COMPRISING THE SAME | 2017-10-12 |
20170294408 | SEMICONDUCTOR DEVICE THAT INCLUDES A MOLECULAR BONDING LAYER FOR BONDING ELEMENTS | 2017-10-12 |
20170294409 | Multi-Chip Fan Out Package and Methods of Forming the Same | 2017-10-12 |
20170294410 | MICROELECTRONIC PACKAGES HAVING STACKED DIE AND WIRE BOND INTERCONNECTS | 2017-10-12 |
20170294411 | SEMICONDUCTOR PACKAGES INCLUDING CHIP ENABLEMENT PADS | 2017-10-12 |
20170294412 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2017-10-12 |
20170294413 | STACK-TYPE SEMICONDUCTOR PACKAGE | 2017-10-12 |
20170294414 | COMPUTER MODULES WITH SMALL THICKNESSES AND ASSOCIATED METHODS OF MANUFACTURING | 2017-10-12 |
20170294415 | SEMICONDUCTOR DEVICE AND STRUCTURE | 2017-10-12 |
20170294416 | LIGHT-EMITTING APPARATUS AND FABRICATING METHOD THEREOF | 2017-10-12 |
20170294417 | HIGH DENSITY PIXELATED LED AND DEVICES AND METHODS THEREOF | 2017-10-12 |
20170294418 | HIGH DENSITY PIXELATED LED AND DEVICES AND METHODS THEREOF | 2017-10-12 |
20170294419 | LIGHT EMITTING DEVICE | 2017-10-12 |
20170294420 | A METHOD OF APPLYING A LIGHTING ARRANGEMENT TO A SURFACE AND A LIGHTING SURFACE | 2017-10-12 |
20170294421 | FABRICATING METHOD OF A SEMICONDUCTOR LIGHT EMITTING DEVICE | 2017-10-12 |
20170294422 | PACKAGE ON PACKAGE (PoP) DEVICE COMPRISING THERMAL INTERFACE MATERIAL (TIM) IN CAVITY OF AN ENCAPSULATION LAYER | 2017-10-12 |
20170294423 | INTERPOSER FRAME AND METHOD OF MANUFACTURING THE SAME | 2017-10-12 |
20170294424 | DISPLAY APPARATUS AND METHOD OF MANUFACTURING THE SAME | 2017-10-12 |
20170294425 | FLEXIBLE DISPLAY APPARATUS | 2017-10-12 |
20170294426 | LIGHT-EMITTING-AND-RECEIVING ELEMENT MODULE AND SENSOR DEVICE USING THE SAME | 2017-10-12 |
20170294427 | LIGHT EMITTING MODULE | 2017-10-12 |
20170294428 | METHOD OF PRODUCING OPTOELECTRONIC MODULES AND AN ASSEMBLY HAVING A MODULE | 2017-10-12 |
20170294429 | SEMICONDUCTOR LAYOUT STRUCTURE | 2017-10-12 |
20170294430 | STANDARD CELL FOR REMOVING ROUTING INTERFERENCE BETWEEN ADJACENT PINS AND DEVICE INCLUDING THE SAME | 2017-10-12 |
20170294431 | SEMICONDUCTOR DEVICE IN A LEVEL SHIFTER WITH ELECTROSTATIC DISCHARGE (ESD) PROTECTION CIRCUIT AND SEMICONDUCTOR CHIP | 2017-10-12 |
20170294432 | SEMICONDUCTOR DEVICE HAVING MULTIPLE GATE PADS | 2017-10-12 |
20170294433 | ARRAY SUBSTATE AND DISPLAY DEVICE | 2017-10-12 |
20170294434 | METHOD AND SYSTEM FOR A SEMICONDUCTOR DEVICE WITH INTEGRATED TRANSIENT VOLTAGE SUPPRESSION | 2017-10-12 |
20170294435 | BIDIRECTIONAL POWER SEMICONDUCTOR | 2017-10-12 |
20170294436 | FIN FIELD EFFECT TRANSISTOR AND SEMICONDUCTOR DEVICE | 2017-10-12 |
20170294437 | Semiconductor Devices and Methods of Fabricating the Same | 2017-10-12 |
20170294438 | NAND String Utilizing Floating Body Memory Cell | 2017-10-12 |
20170294439 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | 2017-10-12 |
20170294440 | METHOD OF FORMING SEMICONDUCTOR DEVICE INCLUDING EDGE CHIP AND RELATED DEVICE | 2017-10-12 |
20170294441 | STATIC RANDOM ACCESS MEMORY (SRAM) CELLS INCLUDING VERTICAL CHANNEL TRANSISTORS AND METHODS OF FORMING THE SAME | 2017-10-12 |
20170294442 | SELF-ALIGNED MULTIPLE PATTERNING SEMICONDUCTOR DEVICE FABRICATION | 2017-10-12 |
20170294443 | VERTICAL MEMORY DEVICES HAVING DUMMY CHANNEL REGIONS | 2017-10-12 |
20170294444 | SEMICONDUCTOR STRUCTURE HAVING GATE REPLACEMENT AND METHOD FOR MANUFACTURING THE SAME | 2017-10-12 |
20170294445 | NONVOLATILE SEMICONDUCTOR DEVICES INCLUDING NON-CIRCULAR SHAPED CHANNEL PATTERNS AND METHODS OF MANUFACTURING THE SAME | 2017-10-12 |
20170294446 | SEMICONDUCTOR MEMORY DEVICE | 2017-10-12 |
20170294447 | THREE-DIMENSIONAL STRUCTURED MEMORY DEVICES | 2017-10-12 |
20170294448 | INTEGRATED CIRCUIT POWER DISTRIBUTION NETWORK | 2017-10-12 |
20170294449 | DISPLAY SUBSTRATE, DISPLAY DEVICE CONTAINING THE SAME, AND METHOD FOR FABRICATING THE SAME | 2017-10-12 |
20170294450 | DISPLAY DEVICE | 2017-10-12 |
20170294451 | DISPLAY DEVICE | 2017-10-12 |
20170294452 | SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND ELECTRONIC DEVICE | 2017-10-12 |
20170294453 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2017-10-12 |
20170294454 | ARRAY SUBSTRATE AND FABRICATING METHOD THEREOF, DISPLAY PANEL, AND DISPLAY APPARATUS | 2017-10-12 |
20170294455 | OXIDE SEMICONDUCTOR-BASED TRANSISTOR AND METHOD OF MANUFACTURING THE SAME | 2017-10-12 |
20170294456 | HYBRID THIN FILM TRANSISTOR STRUCTURE, DISPLAY DEVICE, AND METHOD OF MAKING THE SAME | 2017-10-12 |
20170294457 | TRANSISTOR AND DISPLAY DEVICE | 2017-10-12 |
20170294458 | Semiconductor Device, Display Module, and Electronic Appliance | 2017-10-12 |
20170294459 | DISPLAY DEVICE | 2017-10-12 |
20170294460 | DISPLAY DEVICE | 2017-10-12 |
20170294461 | MANUFACTURING METHOD OF ARRAY SUBSTRATE, ARRAY SUBSTRATE AND DISPLAY DEVICE | 2017-10-12 |
20170294462 | PEELING METHOD AND MANUFACTURING METHOD OF FLEXIBLE DEVICE | 2017-10-12 |
20170294463 | PEELING METHOD AND MANUFACTURING METHOD OF FLEXIBLE DEVICE | 2017-10-12 |
20170294464 | TRANSISTOR DISPLAY PANEL, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE INCLUDING THE SAME | 2017-10-12 |
20170294465 | Film Patterning Method | 2017-10-12 |
20170294466 | IMAGING DEVICE | 2017-10-12 |
20170294467 | SOLID-STATE IMAGING DEVICE | 2017-10-12 |
20170294468 | IMAGE SENSOR AND METHOD FOR FABRICATING THE SAME | 2017-10-12 |
20170294469 | SUBSTRATE FOR CAMERA MODULE AND CAMERA MODULE HAVING THE SAME | 2017-10-12 |
20170294470 | SOLID-STATE IMAGE PICKUP APPARATUS AND METHOD OF MANUFACTURING THE SAME | 2017-10-12 |
20170294471 | Trenched Device Wafer, Stepped-Sidewall Device Die, And Associated Method | 2017-10-12 |
20170294472 | PHOTOELECTRIC CONVERSION DEVICE, MANUFACTURING METHOD OF PHOTOELECTRIC CONVERSION DEVICE, AND IMAGING SYSTEM | 2017-10-12 |
20170294473 | IMAGE SENSING DEVICE AND MANUFACTURING METHOD THEREOF | 2017-10-12 |
20170294474 | OPTICAL RECEIVER, PORTABLE ELECTRONIC DEVICE, AND METHOD OF PRODUCING OPTICAL RECEIVER | 2017-10-12 |
20170294475 | SOLID-STATE IMAGE PICKUP ELEMENT AND IMAGE PICKUP APPARATUS | 2017-10-12 |