41st week of 2017 patent applcation highlights part 41 |
Patent application number | Title | Published |
20170294273 | Hybrid capacitor and method of manufacturing a capacitor | 2017-10-12 |
20170294274 | METHOD OF MANUFACTURING A SWITCH | 2017-10-12 |
20170294275 | CONTROLLING AN ELECTRICAL APPARATUS | 2017-10-12 |
20170294276 | KEY STRUCTURE | 2017-10-12 |
20170294277 | KEY STRUCTURE | 2017-10-12 |
20170294278 | KEYSWITCH DEVICE, KEYBOARD, AND MEMBRANE CIRCUIT BOARD | 2017-10-12 |
20170294279 | KEYPAD WITH REPLACEABLE KEY LABELS | 2017-10-12 |
20170294280 | ARRANGEMENT AND A METHOD FOR SWITCHING AN OPEN CONTACT GAP BY A SWITCHING DEVICE | 2017-10-12 |
20170294281 | TEMPERATURE SWITCH | 2017-10-12 |
20170294282 | SELF-RESETTING BIASING DEVICES FOR CURRENT LIMITING CIRCUIT BREAKER TRIP SYSTEMS | 2017-10-12 |
20170294283 | ELECTRICAL BREAKER REAR SIDE ACTUATOR | 2017-10-12 |
20170294284 | SEMICONDUCTOR DEVICE AND RELATED MANUFACTURING METHOD | 2017-10-12 |
20170294285 | CHARGED PARTICLE BEAM SYSTEM | 2017-10-12 |
20170294286 | PERMANENT-MAGNET PARTICLE BEAM APPARATUS AND METHOD INCORPORATING A NON-MAGNETIC METAL PORTION FOR TUNABILITY | 2017-10-12 |
20170294287 | OBJECTIVE LENS ARRANGEMENT USABLE IN PARTICLE-OPTICAL SYSTEMS | 2017-10-12 |
20170294288 | METHOD AND DEVICE FOR CHARACTERIZING AN ELECTRON BEAM | 2017-10-12 |
20170294289 | BORON COMPOSITIONS SUITABLE FOR ION IMPLANTATION TO PRODUCE A BORON-CONTAINING ION BEAM CURRENT | 2017-10-12 |
20170294290 | PLASMA SOURCE ENHANCED WITH BOOSTER CHAMBER AND LOW COST PLASMA STRENGTH SENSOR | 2017-10-12 |
20170294291 | APPLICATION OF eBIP TO INSPECTION, TEST, DEBUG AND SURFACE MODIFICATIONS | 2017-10-12 |
20170294292 | PLASMA-ENHANCED ANNEAL CHAMBER FOR WAFER OUTGASSING | 2017-10-12 |
20170294293 | SYSTEMS AND METHODS FOR TUNING AN IMPEDANCE MATCHING NETWORK IN A STEP-WISE FASHION FOR MULTIPLE STATES OF AN RF GENERATOR | 2017-10-12 |
20170294294 | DC Magnetron Sputtering | 2017-10-12 |
20170294295 | METHODS AND DEVICES FOR PARALLEL ANALYSIS OF ION MOBILITY SPECTRUM AND MASS SPECTRUM | 2017-10-12 |
20170294296 | Probe Adaptor Assembly | 2017-10-12 |
20170294297 | SAMPLE PREPARATION METHOD AND SAMPLE PREPARATION DEVICE FOR MALDI INCLUDING DEPOSITING MATRIX SUBSTANCE ON SAMPLE SUBSTRATE IN TWO STEPS | 2017-10-12 |
20170294298 | TIME-OF-FLIGHT MASS SPECTROMETER | 2017-10-12 |
20170294299 | METHOD FOR PRODUCING A SELF-ALIGNING MASKING LAYER | 2017-10-12 |
20170294300 | METHOD OF PROCESSING BONDED WAFER | 2017-10-12 |
20170294301 | METHOD OF GROWING A HIGH QUALITY III-V COMPOUND LAYER ON A SILICON SUBSTRATE | 2017-10-12 |
20170294302 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2017-10-12 |
20170294303 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM | 2017-10-12 |
20170294304 | OXIDIZING FILLER MATERIAL LINES TO INCREASE WIDTH OF HARD MASK LINES | 2017-10-12 |
20170294305 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2017-10-12 |
20170294307 | FABRICATION OF SEMICONDUCTOR STRUCTURES | 2017-10-12 |
20170294308 | PROTECTING, OXIDIZING, AND ETCHING OF MATERIAL LINES FOR USE IN INCREASING OR DECREASING CRITICAL DIMENSIONS OF HARD MASK LINES | 2017-10-12 |
20170294309 | OXIDIZING AND ETCHING OF MATERIAL LINES FOR USE IN INCREASING OR DECREASING CRITICAL DIMENSIONS OF HARD MASK LINES | 2017-10-12 |
20170294310 | SELF-ALIGNED SPACER FORMATION | 2017-10-12 |
20170294311 | CUT FIRST SELF-ALIGNED LITHO-ETCH PATTERNING | 2017-10-12 |
20170294312 | METHOD FOR BOTTOM-UP FORMATION OF A FILM IN A RECESSED FEATURE | 2017-10-12 |
20170294313 | DEVICE FOR CONNECTING AT LEAST ONE NANO-OBJECT AND METHOD OF MANUFACTURING IT | 2017-10-12 |
20170294314 | GERMANIUM COMPOSITIONS SUITABLE FOR ION IMPLANTATION TO PRODUCE A GERMANIUM-CONTAINING ION BEAM CURRENT | 2017-10-12 |
20170294315 | SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF | 2017-10-12 |
20170294316 | HYDROGENATION ANNEALING METHOD USING MICROWAVE | 2017-10-12 |
20170294317 | PATTERNS FORMING METHOD | 2017-10-12 |
20170294318 | SUBSTRATE PROCESSING DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND REACTION TUBE | 2017-10-12 |
20170294319 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2017-10-12 |
20170294320 | HKMG INTEGRATION | 2017-10-12 |
20170294321 | Carrier-Less Silicon Interposer Using Photo Patterned Polymer as Substrate | 2017-10-12 |
20170294322 | WIRING BOARD, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | 2017-10-12 |
20170294323 | CHEMICAL LIQUID PREPARATION METHOD OF PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, CHEMICAL LIQUID PREPARATION UNIT PREPARING A CHEMICAL LIQUID FOR SUBSTRATE PROCESSING, AND SUBSTRATE PROCESSING SYSTEM | 2017-10-12 |
20170294324 | COLLECTION CHAMBER APPARATUS TO SEPARATE MULTIPLE FLUIDS DURING THE SEMICONDUCTOR WAFER PROCESSING CYCLE | 2017-10-12 |
20170294325 | SEMICONDUCTOR PROCESSING CHAMBER | 2017-10-12 |
20170294326 | SUBSTRATE CONTAINER WITH WINDOW RETENTION SPRING | 2017-10-12 |
20170294327 | SUBSTRATE CONTAINER | 2017-10-12 |
20170294328 | SUBSTRATE CONTAINER, LOAD PORT APPARATUS, AND SUBSTRATE TREATING APPARATUS | 2017-10-12 |
20170294329 | WAFER SHIPPER WITH PURGE CAPABILITY | 2017-10-12 |
20170294330 | ACTIVE SUBSTRATE ALIGNMENT SYSTEM AND METHOD | 2017-10-12 |
20170294331 | CORROSION-RESISTANT MEMBER, MEMBER FOR ELECTROSTATIC CHUCK, AND PROCESS FOR PRODUCING CORROSION-RESISTANT MEMBER | 2017-10-12 |
20170294332 | CHUCK FOR EDGE BEVEL REMOVAL AND METHOD FOR CENTERING A WAFER PRIOR TO EDGE BEVEL REMOVAL | 2017-10-12 |
20170294333 | VACUUM CHUCK PRESSURE CONTROL SYSTEM | 2017-10-12 |
20170294334 | CONVEYANCE SYSTEM, ROBOT, AND METHOD FOR CONTROLLING ROBOT | 2017-10-12 |
20170294335 | SUBSTRATE CONVEYING ROBOT AND METHOD OF OPERATING THE SAME | 2017-10-12 |
20170294336 | DEVICES AND METHODS FOR DYNAMICALLY TUNABLE BIASING TO BACKPLATES AND WELLS | 2017-10-12 |
20170294337 | SEMICONDUCTOR DEVICES | 2017-10-12 |
20170294338 | METHODS, APPARATUS AND SYSTEM FOR LOCAL ISOLATION FORMATION FOR FINFET DEVICES | 2017-10-12 |
20170294340 | BULK TO SILICON ON INSULATOR DEVICE | 2017-10-12 |
20170294341 | HIGH-CHI BLOCK COPOLYMERS FOR INTERCONNECT STRUCTURES BY DIRECTED SELF-ASSEMBLY | 2017-10-12 |
20170294342 | Structure and Method for Interconnection | 2017-10-12 |
20170294343 | ETCHING METHOD AND FABRICATION METHOD OF SEMICONDUCTOR STRUCTURES | 2017-10-12 |
20170294344 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, COATING FORMATION METHOD, AND COATING FORMATION DEVICE | 2017-10-12 |
20170294345 | METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2017-10-12 |
20170294346 | METHOD FOR REDUCING CONTACT RESISTANCE | 2017-10-12 |
20170294347 | TWO-DIMENSIONAL SELF-ALIGNED SUPER VIA INTEGRATION ON SELF-ALIGNED GATE CONTACT | 2017-10-12 |
20170294348 | METHODS FOR FORMING 2-DIMENSIONAL SELF-ALIGNED VIAS | 2017-10-12 |
20170294350 | GATE ALIGNED CONTACT AND METHOD TO FABRICATE SAME | 2017-10-12 |
20170294351 | ELECTRICAL CONDUCTIVE VIAS IN A SEMICONDUCTOR SUBSTRATE AND A CORRESPONDING MANUFACTURING METHOD | 2017-10-12 |
20170294352 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-10-12 |
20170294353 | METHOD OF MANUFACTURING PACKAGED WAFER | 2017-10-12 |
20170294354 | INTEGRATION OF NOMINAL GATE WIDTH FINFETS AND DEVICES HAVING LARGER GATE WIDTH | 2017-10-12 |
20170294355 | SEMICONDUCTOR DEVICES INCLUDING ACTIVE FINS AND METHODS OF MANUFACTURING THE SAME | 2017-10-12 |
20170294356 | FIN FIELD EFFECT TRANSISTOR AND MANUFACTURING METHOD THEREOF | 2017-10-12 |
20170294357 | CO-INTEGRATION OF SILICON AND SILICON-GERMANIUM CHANNELS FOR NANOSHEET DEVICES | 2017-10-12 |
20170294358 | STACKED NANOWIRE DEVICES | 2017-10-12 |
20170294359 | SEMICONDUCTOR DEVICE INCLUDING A FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | 2017-10-12 |
20170294360 | SEMICONDUCTOR DEVICE | 2017-10-12 |
20170294361 | LID ARRAY PANEL, PACKAGE WITH LID AND METHOD OF MAKING THE SAME | 2017-10-12 |
20170294362 | SEMICONDUCTOR PACKAGE WITH ELASTIC COUPLER AND RELATED METHODS | 2017-10-12 |
20170294363 | FORMATION OF GETTER LAYER FOR MEMORY DEVICE | 2017-10-12 |
20170294364 | PACKAGED WAFER MANUFACTURING METHOD AND DEVICE CHIP MANUFACTURING METHOD | 2017-10-12 |
20170294365 | SEMICONDUCTOR DEVICE | 2017-10-12 |
20170294366 | METHOD FOR MONITORING A HEAT EXCHANGER UNIT | 2017-10-12 |
20170294367 | Flat No-Leads Package With Improved Contact Pins | 2017-10-12 |
20170294368 | SEMICONDUCTOR DEVICE | 2017-10-12 |
20170294369 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2017-10-12 |
20170294370 | METHOD OF PRODUCING LEAD FRAMES FOR ELECTRONIC COMPONENTS, CORRESPONDING COMPONENT AND COMPUTER PROGRAM PRODUCT | 2017-10-12 |
20170294371 | SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING | 2017-10-12 |
20170294372 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | 2017-10-12 |
20170294373 | ROBUST LOW INDUCTANCE POWER MODULE PACKAGE | 2017-10-12 |
20170294374 | ELECTRONIC PART MOUNTING HEAT-DISSIPATING SUBSTRATE | 2017-10-12 |
20170294375 | MEMORY CELL UNIT ARRAY | 2017-10-12 |