41st week of 2012 patent applcation highlights part 13 |
Patent application number | Title | Published |
20120256295 | MULTILAYER SELECT DEVICES AND METHODS RELATED THERETO - Methods of forming and tuning a multilayer select device are provided, along with apparatus and systems which include them. As is broadly disclosed in the specification, one such method can include forming a first region having a first conductivity type; forming a second region having a second conductivity type and located adjacent to the first region; and forming a third region having the first conductivity type and located adjacent to the second region and, such that the first, second and third regions form a structure located between a first electrode and a second electrode, wherein each of the regions have a thickness configured to achieve a current density in a range from about 1×e | 2012-10-11 |
20120256296 | SEMICONDUCTOR MATERIALS, APPARATUSES AND METHODS - Various methods and apparatuses involving salt-based compounds and related doping are provided. In accordance with one or more embodiments, a salt-based material is introduced to a semiconductor material, is heated to generate a neutral compound that dopes the semiconductor material. Other embodiments are directed to semiconductor materials with such a neutral compound as an impurity that affects electrical characteristics therein. | 2012-10-11 |
20120256297 | METHOD FOR PRODUCING NITRIDE COMPOUND SEMICONDUCTOR SUBSTRATE, AND NITRIDE COMPOUND SEMICONDUCTOR FREE-STANDING SUBSTRATE - Disclosed is a technique capable of preventing occurrence of warping in a nitride compound semiconductor layer, and by which a nitride compound semiconductor layer having small variations in the in-plane off angle can be grown with good reproducibility. Specifically disclosed is a method for producing a nitride compound semiconductor substrate using an HVPE process, wherein a low-temperature protective layer is formed on a rare earth perovskite substrate at a first growth temperature (a first step), and a thick layer composed of a nitride compound semiconductor is formed on the low-temperature protective layer at a second growth temperature that is higher than the first growth temperature (a second step). In the first step, the supply amounts of HCl and NH | 2012-10-11 |
20120256298 | MONITORING PATTERN, AND PATTERN STITCH MONITORING METHOD AND WAFER THEREWITH - A monitoring pattern for pattern stitch in double patterning is provided with a plurality of pattern cuts that include at least one line-ended cut and at least one non-line-ended cut, wherein every pattern cut has a stitching critical dimension (CD). A semiconductor wafer having at least one target pattern corresponding to the monitoring pattern is also provided. A method for monitoring pattern stitch can be preformed to check for pattern cut displacement in stitching areas and to increase reliability and printability of layouts, by comparing corresponding stitching critical dimensions of the target pattern and the monitoring pattern. | 2012-10-11 |
20120256299 | ARC RESIDUE-FREE ETCHING - Antireflective residues during pattern transfer and consequential short circuiting are eliminated by employing an underlying sacrificial layer to ensure complete removal of the antireflective layer. Embodiments include forming a hard mask layer over a conductive layer, e.g., a silicon substrate, forming the sacrificial layer over the hard mask layer, forming an optical dispersive layer over the sacrificial layer, forming a silicon anti-reflective coating layer over the optical dispersive layer, forming a photoresist layer over the silicon anti-reflective coating layer, where the photoresist layer defines a pattern, etching to transfer the pattern to the hard mask layer, and stripping at least the optical dispersive layer and the sacrificial layer. | 2012-10-11 |
20120256300 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A semiconductor device includes: a plurality of semiconductor chips stacked on each other, each of the plurality of semiconductor chips having a semiconductor substrate and a wiring layer; a through electrode penetrating the semiconductor substrate in a thickness direction and electrically connected to each other between the semiconductor chips adjacent to each other; a conductor penetrating the semiconductor substrate in the thickness direction and not electrically connected between the other semiconductor chips; and an insulating separator penetrating the semiconductor substrate in the thickness direction and formed in a shape of a ring surrounding the conductor. | 2012-10-11 |
20120256301 | SELF-ALIGNED NANO-STRUCTURES - A method for creating structures in a semiconductor assembly is provided. The method includes etching apertures into a dielectric layer and applying a polymer layer over the dielectric layer. The polymer layer is applied uniformly and fills the apertures at different rates depending on the geometry of the apertures, or on the presence or absence of growth accelerating material. The polymer creates spacers for the etching of additional structure in between the spacers. The method is capable of achieving structures smaller than current lithography techniques. | 2012-10-11 |
20120256302 | METHOD FOR PRODUCING A THIN FILM TRANSISTOR AND A DEVICE OF THE SAME - A method for producing a thin film transistor and including the following steps for preparing a glass substrate; having a positive photosensitive coating on the glass substrate; providing a transparent mold plate, having a plurality of ladder opaque protrusions in accordance with a predetermined pattern having different depth; controlling the transparent mold plate downwardly to press into the positive photosensitive coating and non-contacting to the glass substrate; exposing a part of the positive photosensitive coating via an explosion by a UV light; remaining the other part of the positive photosensitive coating, which is shielded by the protrusions and shaped corresponding to the predetermined pattern; separating the transparent mold plate from the glass substrate, and removing the other parts of the photosensitive coating unshielded via a chemical solvent. Thereby, after the positive photosensitive coating is pressed, cured, and cleaned the thin film transistor is formed. | 2012-10-11 |
20120256303 | METHOD OF PREPARING A PATTERNED FILM WITH A DEVELOPING SOLVENT - A method of preparing a patterned film on a substrate includes applying a silicone composition onto a substrate to form a film of the silicone composition. A portion of the film is exposed to radiation to produce a partially exposed film having an exposed region and a non-exposed region. The partially exposed film is heated for a sufficient amount of time and at a sufficient temperature to substantially insolubilize the exposed region in a developing solvent that includes a siloxane component. The non-exposed region of the partially exposed film is removed with the developing solvent to reveal a film-free region on the substrate and to form the patterned film including the exposed region that remains on the substrate. The film-free regions is substantially free of residual silicone due to the presence of the siloxane component in the developing solvent. | 2012-10-11 |
20120256304 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME - This semiconductor device includes: a substrate; and a plurality of thin-film diodes which are supported by the substrate and electrically connected in parallel with each other. The thin-film diodes include at least one thin-film diode of a first type ( | 2012-10-11 |
20120256305 | Integrated Circuit Package Security Fence - Embodiments of an integrated circuit package security fence are provided. The integrated circuit package includes a substrate, a die, and a security fence coupled to the substrate such that the die is located between the security fence and the substrate. The security fence includes a first signal net having a plurality of bonding wires and a second signal net having a second plurality of bonding wires. The bonding wires of the first signal net and second signal net are arranged in a pattern to overlap the top surface of die. The die may include tamper detection logic to detect attempt to access the die through the security fence. | 2012-10-11 |
20120256306 | EXPOSED DIE PACKAGE FOR DIRECT SURFACE MOUNTING - A packaged semiconductor device includes a semiconductor die including a substrate having a topside including active circuitry and a bottomside with at least one backside metal layer directly attached. A package including a molding material having a die pad and a plurality of leads is encapsulated within the molding material, wherein the leads include an exposed portion that includes a bonding portion. The topside of the semiconductor die is attached to the die pad, and the package includes a gap that exposes the backside metal layer along a bottom surface of the package. Bond wires couple pads on the topside of the semiconductor die to the leads. The bonding portions, the molding material along the bottom surface of the package, and the backside metal layer are all substantially planar to one another. | 2012-10-11 |
20120256307 | SENSOR MODULE, SENSOR DEVICE, MANUFACTURING METHOD OF SENSOR DEVICE, AND ELECTRONIC APPARATUS - A sensor module includes a support member having a first flat surface, a second flat surface orthogonally connected to the first flat surface, a third flat surface orthogonally connected to the first flat surface and the second flat surface, and a fourth flat surface opposed to the first flat surface as an attachment surface to an external member, the first flat surface having a support surface depressed from the first flat surface, IC chips having connection terminals on active surface sides with inactive surface sides along the active surfaces respectively attached to the respective surfaces of the support member, and vibration gyro elements having connection electrodes, and the vibration gyro elements are provided on the active surface sides of the IC chips and the connection electrodes are attached to the connection terminals of the IC chips so that principal surfaces are respectively along the respective surfaces of the support member. | 2012-10-11 |
20120256308 | Method for Sealing a Micro-Cavity - A method for sealing a cavity is disclosed. The method includes depositing a membrane layer on top of a sacrificial layer, etching release holes into the membrane layer, and removing at least a portion of the sacrificial layer through the release holes to form a cavity. Prior to removing the sacrificial layer portion, the method includes producing a narrowing layer on the side walls of the release holes. The narrowing layer can be a sealing layer that seals off the release holes after a reflow step. Alternatively, the narrowing layer can be a layer that does not have a sealing function and is used to narrow the holes, allowing the holes to be sealed without a sealing or other material entering the cavity. The narrowing layer may be deposited by conformal deposition followed by an anisotropic etch or by direct deposition on the side walls of the release holes. | 2012-10-11 |
20120256309 | Integrated Circuit Having Pitch Reduced Patterns Relative To Photolithography Features - An integrated circuit having differently-sized features wherein the smaller features have a pitch multiplied relationship with the larger features, which are of such size as to be formed by conventional lithography. | 2012-10-11 |
20120256310 | SEMICONDUCTOR DEVICE - A semiconductor device includes a multi-level wiring structure that includes a first wring layer, a plurality of first patterns, and a first mark. The first wring layer is disposed at a first wiring level of the multi-level wiring structure. The plurality of first patterns is disposed over the first wring layer. The plurality of first patterns is disposed at a second wiring level of the multi-level wiring structure. The second wiring level is above the first wiring level. The plurality of first patterns is disposed over the first wring layer. The plurality of first patterns is disposed at a second wiring level of the multi-level wiring structure. The second wiring level is above the first wiring level. | 2012-10-11 |
20120256311 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A bump electrode, a dummy bump, and a heat-resistant polymer film, whose upper-surface heights are uniformed, are formed on each of a first silicon substrate and a second silicon substrate, and then, the first silicon substrate and the second silicon substrate are bonded to each other so that the bump electrodes formed on the respective substrates are electrically connected to each other. At this time, the dummy bump is arranged so as to be bonded to the heat-resistant polymer film on the silicon substrate opposed thereto, so that a semiconductor device having both of good electrical connection between the bump electrodes and bump protection performance obtained by a polymer film with high heat resistance and without voids can be achieved. | 2012-10-11 |
20120256312 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a semiconductor chip, an electrode pad formed on the semiconductor chip, an underlying barrier metal formed on the electrode pad, a solder bump formed on the underlying barrier metal, and an underfill material surrounding the underlying barrier metal and the solder bump. A junction interface of the solder bump with the underlying barrier metal corresponds to an upper surface of the underlying barrier metal, and a portion of the underfill material bonded to a side surface of the solder bump and an end surface of the underlying barrier metal forms a right angle or an obtuse angle. | 2012-10-11 |
20120256313 | SOLDER BALL CONTACT SUSCEPTIBLE TO LOWER STRESS - A solder ball contact and a method of making a solder ball contact includes: a first insulating layer with a via formed on an integrated circuit (IC) chip and a metal pad; an under bump metallurgy (UBM) structure disposed within the via and on a portion of the first insulating layer, surrounding the via; a second insulating layer formed on an upper surface of an outer portion of the UBM structure that is centered on the via; and a solder ball that fills the via and is disposed above an upper surface of an inner portion of the UBM structure that contacts the via, in which the UBM structure that underlies the solder ball is of a greater diameter than the solder ball. | 2012-10-11 |
20120256314 | SHORT AND LOW LOOP WIRE BONDING - A multi-die package includes a first semiconductor die and a second semiconductor die each having an upper surface with a plurality of bond pads disposed thereon. The upper surface of the second semiconductor die may be substantially coextensive with the upper surface of the first semiconductor die and extend substantially along a plane. The multi-die package also includes a plurality of bonding wires each coupling one of the bond pads on the upper surface of the first semiconductor die to a corresponding one of the bond pads on the upper surface of the second semiconductor die. A bonding wire of the plurality of bonding wires has a kink disposed at a height above the plane, a first hump disposed between the first semiconductor die and the kink, and a second hump disposed between the second semiconductor die and the kink. | 2012-10-11 |
20120256315 | SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE - A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A material is applied on the at least one semiconductor chip and on the at least one element. | 2012-10-11 |
20120256316 | SIGNAL LINE STRUCTURE OF A FLAT DISPLAY - The signal line structure is disposed between a gate driver and a display area of a display. The signal line structure includes a substrate, first metal layers, a first insulation layer, second metal layers, a second insulation layer and third metal layers. The first metal layers are arranged in parallel and toward a first direction in the substrate. The first insulation layer is disposed in the substrate and covers the first metal layers. The second metal layers are disposed on the positions of the first insulation layer corresponding to the first metal layers. The second insulation layer is disposed on the second metal layers and the first insulation layer. The third metal layers are disposed on the positions corresponding to the second metal layers in the second insulation layer. The distance between two adjacent second metal layers is less than that between two adjacent first metal layers. | 2012-10-11 |
20120256317 | Barrier Layer for Integrated Circuit Contacts - Plug contacts may be formed with barrier layers having thicknesses of less than 50 Å in some embodiments. In one embodiment, the barrier layer may be formed by the chemical vapor deposition of diborane, forming a boron layer between a metallic contact and the surrounding dielectric and between a metallic contact and the substrate and/or substrate contact. This boron layer may be substantially pure boron and boron silicide. | 2012-10-11 |
20120256318 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor substrate and a second semiconductor substrate laminated with an insulating layer, a first transmission line formed on the first semiconductor substrate, the first transmission line including a signal line and a ground, a second transmission line formed on the second semiconductor substrate, the second transmission line including a signal line and a ground, a first via layer for the signal lines, the first via layer for the signal lines being formed of a conductor layer formed within a via hole, a first via layer for the grounds, the first via layer for the grounds being formed of a conductor layer formed within a via hole, and a second via layer for the grounds, the second via layer for the grounds being formed of a conductor layer formed within a via hole. | 2012-10-11 |
20120256319 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC APPARATUS - A method of manufacturing a semiconductor device, includes: forming a first circuit substrate having a first interconnection; forming a second circuit substrate having a second interconnection; bonding the first circuit substrate to the top surface of the second circuit substrate so as to be stacked facing each other; and performing an etching process of simultaneously removing parts formed on the first interconnection and the second interconnection in a stacked body of the first circuit substrate and the second circuit substrate so as to form a first opening in the top surface of the first interconnection and to form a second opening in the top surface of the second interconnection. The forming of the first circuit substrate includes forming an etching stopper layer on the surface of the first interconnection out of a material having an etching rate lower than that of the first interconnection in the etching process. | 2012-10-11 |
20120256320 | WIRING BOARD MANUFACTURING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND WIRING BOARD - A semiconductor device | 2012-10-11 |
20120256321 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and wiring. The main body includes a main part including a plurality of stacked layer portions, and a plurality of terminals disposed on the top and bottom surfaces of the main part. The wiring includes a plurality of lines electrically connected to the plurality of terminals. The plurality of lines include a plurality of common lines and a plurality of layer-dependent lines. Each of the plurality of layer portions includes: a plurality of common electrodes electrically connected to the plurality of common lines; a plurality of non-contact electrodes that are electrically connected to the layer-dependent lines and are not in contact with the semiconductor chip in the layer portion; and a selective connection electrode selectively electrically connected to only the layer-dependent line that the layer portion uses among the plurality of layer-dependent lines. The layer-dependent lines are greater than the common lines in maximum width. | 2012-10-11 |
20120256322 | SEMICONDUCTOR DEVICE - A semiconductor device includes a first semiconductor chip provided with a first semiconductor element including a plurality of element electrodes; and a first substrate having an element mounting surface on which the first semiconductor chip is mounted. The first substrate includes a plurality of first electrodes, each formed on the element mounting surface; a plurality of first interconnects connected to the first electrodes; a plurality of second electrodes formed on a surface opposite to the element mounting surface; a plurality of second interconnects connected to the second electrodes; a plurality of through-hole interconnects penetrating the first substrate and connecting the first interconnects to the second interconnects; and a third semiconductor element. The first side of the first substrate is shorter than the first side of the first semiconductor chip. | 2012-10-11 |
20120256323 | METHOD FOR PROCESSING A SEMICONDUCTOR WAFER OR DIE, AND PARTICLE DEPOSITION DEVICE - According to various embodiments, a method for processing a semiconductor wafer or die is provided including supplying particles to a plasma such that the particles are activated by the plasma and spraying the activated particles on the semiconductor wafer or die to generate a particle layer on the semiconductor wafer or die. | 2012-10-11 |
20120256324 | Method for Improving Performance of Etch Stop Layer - A method of forming an interconnect structure includes providing a dielectric layer; forming a metal line in the dielectric layer; and forming a composite etch stop layer (ESL), which includes forming a lower ESL over the metal line and the dielectric layer; and forming an upper ESL over the lower ESL. The upper ESL and the lower ESL have different compositions. The step of forming the lower ESL and the step of forming the upper ESL are in-situ performed. | 2012-10-11 |
20120256325 | SILICONE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR DEVICE USING THE COMPOSITION - A silicone resin composition that exhibits low gas permeability and is suitable for encapsulating optical semiconductors. The composition includes: (A) an organopolysiloxane having a specific structure containing two or more alkenyl groups, (B) an organohydrogenpolysiloxane composed of two organohydrogenpolysiloxanes having specific structures, in which the mass ratio between the two organohydrogenpolysiloxanes is within a range from 10:90 to 90:10, in an amount that provides 0.4 to 4.0 mols of silicon atom-bonded hydrogen atoms within the component (B) per 1 mol of alkenyl groups within the component (A), and (C) an addition reaction catalyst. | 2012-10-11 |
20120256326 | ADHESIVE COMPOSITION, SEMICONDUCTOR DEVICE MAKING USE THEREOF, AND PRODUCTION METHOD THEREOF - Disclosed is an adhesive composition used for adhesion of a semiconductor chip which contains a radiation polymerizable compound, a photoinitiator, and a thermosetting resin. When the adhesive composition forming an adhesive layer is brought to a B-stage by irradiation with light, the surface of the adhesive layer has a tack force of 200 gf/cm | 2012-10-11 |
20120256327 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A semiconductor device and a manufacturing method therefor, wherein, during lift-off, no cracks due to internal stresses occur in the compound semiconductor layer. A method for manufacturing a semiconductor device having a structure in which a semiconductor layer is bonded on a supporting substrate, including: a device region formation step of forming a device region including the semiconductor layer on a growth substrate through a lift-off layer; a columnar member formation step of forming a columnar member on the growth substrate; a bonding step of bonding the tops of the semiconductor layer and the columnar member to a supporting substrate; a lift-off step of separating the bottom face of the semiconductor layer from the growth substrate by removing the lift-off layer, and not separating the columnar member from the growth substrate; and a step of separating the columnar member from the supporting substrate. | 2012-10-11 |
20120256328 | Pressure-Reducing Oxygen Dissolving Apparatus - A pressure-reduction oxygen dissolving apparatus includes a container, at least one wave-shaped layer in the container for exchanging gases, at least one oxygen storage/exchange tank on each wave-shaped layer for exchanging gases, a water inlet at the top of the container for filling water into the container, a water outlet installed at the bottom of the container for discharging water out from the container, and a gas inlet for filling oxygen into the container. The oxygen enters into the container through the gas inlet to fill up each oxygen storage/exchange tank. After the oxygen has reached a specific pressure, water enters into the container from the water inlet and flows through chambers of the oxygen storage/exchange tank, and oxygen is dissolved in water naturally. Since the pressure increases the dissolved oxygen content significantly, the water outlet can be opened to obtain water with higher oxygen content. | 2012-10-11 |
20120256329 | PROCESSING APPARATUS FOR DISPERSION, DISSOLUTION, SOLUBILIZATION, OR EMULSIFICATION OF GAS/LIQUID OR LIQUID/LIQUID - It is an object of the present invention to provide a processing apparatus which is capable of performing uniform dispersion, dissolution, solubilization, emulsification of gas into liquid, and uniform dispersion, dissolution, solubilization, and emulsification of liquid to heterogeneous liquid by a large capacity and in a short time. | 2012-10-11 |
20120256330 | HEAT EXCHANGER HAVING DEHUMIDIFYING LIQUID AND DEHUMIDIFIER HAVING THE SAME - A heat exchanger having an extended surface plate includes a plurality of heat exchanging bodies having therein flow paths along which a heat transfer medium flows, and extended surface plates each disposed between the heat exchanging bodies and having inclined surfaces in horizontal and vertical directions. Also disclosed is a dehumidifier having the heat exchanger. Moisture in the air may be effectively absorbed by a dehumidifying liquid, and the heat exchanger may have enhanced structural strength. | 2012-10-11 |
20120256331 | COLUMN WITH CARRYING DEVICES FOR COLUMN INTERNALS - The invention relates to a column ( | 2012-10-11 |
20120256332 | SYSTEM AND METHOD FOR IMPLEMENTING ENHANCED OPTICS FABRICATION - A system and method are provided for implementing enhanced optics fabrication for making a concave focusing optical lens with a selected material of a crystal or an amorphous material and a support member. A cut-out is formed in the support member with a depth based upon the final, desired curvature of the concave focusing optical lens. The cut-out is partially filled with an epoxy and the selected crystal or amorphous material is placed on top thereby creating a quasi-vacuum seal. A vacuum pump is connected to the support member, providing a set vacuum level until the epoxy has hardened and the selected crystal or amorphous material has achieved its final curvature. Vacuum pressure is substantially uniformly applied to the crystal, providing substantially uniform stresses on the surface of the final concave focusing optical lens. | 2012-10-11 |
20120256333 | PROCESS FOR MANUFACTURING A STAND-ALONE MULTILAYER THIN FILM - A process for manufacturing stand-alone multilayer thin films is provided. The process includes providing a substrate, depositing a sacrificial layer onto the substrate and the depositing multilayer thin film onto the sacrificial layer. Thereafter, the substrate, sacrificial layer and thin film structure are exposed to chemical solutions. The chemical solution selectively reacts with the sacrificial layer to remove the sacrificial layer, thereby affording for an intact multilayer stand-alone thin film to separate from the substrate. The color and optical properties of the multilayer thin film are not affected by the removal of the sacrificial layer. | 2012-10-11 |
20120256334 | METHOD FOR DETERMINING RECORDING EXPOSURE FOR HOLOGRAPHIC RECORDING MEDIUM AND METHOD FOR RECORDING THEREON - An optimal recording exposure is determined by varying in the first to nth stages the recording exposure with a write laser beam to record a bright pattern image and a dark pattern image in each stage as the first to nth bright pattern images and the first to nth dark pattern images, respectively; irradiating the respective pattern images with a read beam to detect the intensity of a diffracted beam from the central portion of each image of the bright and dark patterns; calculating Sa | 2012-10-11 |
20120256335 | SCINTILLATOR PANEL AND METHOD FOR MANUFACTURING THE SAME - Provided is a scintillator panel having excellent sharpness and graininess. In the scintillator panel, the scintillator panel and a surface of a planar light receiving element can be brought into uniform contact with each other within the surface, and deterioration of sharpness between the scintillator panel surface and the surface of the planar light receiving element is reduced. Furthermore, a method for manufacturing such scintillator panel is also provided. The scintillator panel is provided by arranging a phosphor layer composed of phosphor columnar crystal on a polymer film substrate. A leading end portion of the phosphor columnar crystal is flattened by pressurized thermal processing. | 2012-10-11 |
20120256336 | METHOD FOR PRODUCING MESOPOROUS SILICA PARTICLES - The present invention relates to a method for producing mesoporous silica particles including a silica-containing outer shell portion with a mesoporous structure. The method includes the steps of: (I) pressurizing a mixed solution containing a hydrophobic organic compound, a surfactant, and an aqueous solvent by a high-pressure emulsification method so as to form an emulsion that includes emulsion droplets containing the hydrophobic organic compound; (II) adding a silica source to the emulsion so as to form a silica-containing outer shell portion with a mesoporous structure on a surface of the emulsion droplets, and precipitating composite silica particles including the outer shell portion and the emulsion droplets on an inner side relative to the outer shell portion; and (III) removing the emulsion droplets from the composite silica particles. | 2012-10-11 |
20120256337 | CATHODE ACTIVE MATERIAL PRECURSOR PARTICLE, METHOD FOR PRODUCING THEREOF AND METHOD FOR PRODUCING CATHODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY - The cathode active material precursor particle, which forms, through incorporation of lithium thereinto, a cathode active material particle for use in a lithium secondary battery, the cathode active material particle containing a lithium complex oxide having a layered rock salt structure, is characterized in that the precursor particle has an aspect ratio, which is a ratio of long axis diameter to short axis diameter, of 1.0 or more and less than 2 and is formed so that the (003) planes of the lithium-incorporated cathode active material particle are substantially uniaxially oriented. | 2012-10-11 |
20120256338 | NEW RESIN SYSTEMS FOR DENTAL RESTORATIVE MATERIALS - The disclosure provides a new photopolymerizable resin system for dental restorative materials. The resin system utilizes a thiol-ene component as the reactive diluent in dimethacrylate systems. The ternary resin system comprises a thiol monomer, an ene monomer and a dimethacrylate monomer. Use of an off-stoichiometric ratio of thiol:ene functional groups in favor of excess thiols results in enhanced overall functional group conversion, improved polymer mechanical properties, and reduced shrinkage stress of the ternary system when compared to either traditional dimethacrylate or thiol-ene resin systems. | 2012-10-11 |
20120256339 | FLAME RETARDANT COMPOSITE MATERIALS - Composite materials of the type with fibres embedded in a matrix, with flame/fire retardant (FR) capabilities are prepared by applying an FR substance to the surfaces of fibres, combining the fibres with molten thermoplastic material so that the fibres are embedded in the thermoplastic material, and manufacturing a product from the combined thermoplastic material and embedded fibres. | 2012-10-11 |
20120256340 | ANTHROPIC STONE MATERIALS AND MIXES AND METHODS FOR MAKING SAME - Disclosed is an anthropic stone material made by the introduction of water to a particulate casting mix comprising a lightweight component comprising a mixture of exfoliated vermiculite and a volcanic component selected from the group consisting of exfoliated perlite, pumice, and mixtures thereof, said exfoliated vermiculite and volcanic component mixed in a ratio range of 2:1 to 1:2 by volume, a cementitious component, and wherein said lightweight component and cementitious component are mixed in a ratio range of from about 3:2 to 2:3 by volume. | 2012-10-11 |
20120256341 | METHOD FOR GRANULATING PLASTIC HAVING A HIGH SOFTENING TEMPERATURE - The invention relates to a method for granulating plastic having a high softening temperature, in particular of above 120° C., using a perforated plate for producing strands of molten plastic and a subsequent process chamber containing a process fluid and including a chopping device, from which a mixture of process fluid and granulate is then discharged into a cooling section for cooling said granulate. The process chamber is filled with a process fluid, in particular water, at a temperature of more than 120° C. and at a pressure of over 2 bar, and the mixture of process fluid and granulate, whose pressure will be maintained as it passes through the cooling section, will then be supplied to a separator in which the granulate, which has first been directed through a pressure lock for bringing it down to ambient pressure, will then be separated from the process fluid and discharged. | 2012-10-11 |
20120256342 | METHOD OF PRODUCING SEAL MEMBER - A method of producing a seal member includes: a mixing step of mixing an elastic material and fine particles using a kneading device, so as to form a mixed material; a molding step of charging the mixed material into a molding die, and forming an elastic molded piece having a shape corresponding to that of a molded seal of the seal member; and a particle removing step of removing the fine particles present on a surface of the elastic molded piece, so as to form the molded seal. | 2012-10-11 |
20120256343 | PROCESS FOR INJECTION MOLDING OF HOLLOW PRODUCT HAVING IRREGULAR SHAPE WITH PLASTIC MATERIAL INSTEAD OF METAL MATERIAL - The disclosure relates to a process of injection molding of hollow product with plastic material includes steps of (1) molding upper and lower half parts with a same mold including first and second mold halves, a convex-concave structure is respectively disposed in matching surfaces of the upper and lower half parts, two grooves are respectively defined in two opposite outer sides of the combination of the upper and lower half parts; (2) opening the mold, the upper half part is left with the first mold half, the lower half part is left with the second mold half; (3) moving the second mold half or rotating the second mold half 180 degrees to make the lower half part align with the upper half part; (4) injecting plastic material into the grooves to form two connecting strips; (5) having the mold cooled, opening the mold and having the hollow product pushed out. | 2012-10-11 |
20120256344 | DISPOSABLE ORTHOPEDIC PROSTHESIS MOLD - An orthopedic prosthesis mold, including a first housing defining a first cavity therein shaped to form a portion of an orthopedic prosthesis; a second housing coupled to the first housing, the second housing defining a second cavity therein shaped to form a portion of an orthopedic prosthesis; and a reinforcement element attached to at least one of the first or second housings, the reinforcement element resisting deformation of the first and second housings. The reinforcement element may include a member exterior to the first and second cavities, the member spanning across a substantial width of the prosthesis mold. | 2012-10-11 |
20120256345 | Vehicle Trim Panel With Multiple Decorative Characteristics - A panel for use in a vehicle interior is disclosed. The panel includes a unitary integral one-piece flexible member (e.g., coverstock) having a first portion with a first ornamental appearance and a second portion with a second ornamental appearance, and a substrate at least partially molded behind the flexible member. A border between the first portion and the second portion is located in a recess formed when the substrate is molded. A method of forming a panel also is disclosed. The method includes moving a first mold section toward a second mold section so that a projection of the mold pushes a portion of the flexible member at least partially into a recess of the mold, and injecting a polymer resin between the flexible member and the first mold section so that the border is located in the recess. | 2012-10-11 |
20120256346 | MOLD STRUCTURES, AND METHOD OF TRANSFER OF FINE STRUCTURES - A mold and a pattern transfer method using the same for a nanoprinting technology. The mold can be released from a substrate accurately and easily. The mold, which is used for forming a fine pattern on a substrate using a press machine, comprises a release mechanism. | 2012-10-11 |
20120256347 | INJECTION MOLDING - In an injection molding process, the mold parts can be moved relative to each other (separation of the mold parts shown as line | 2012-10-11 |
20120256348 | METHOD AND BLADDER APPARATUS FOR FORMING COMPOSITE PARTS - A material forming apparatus and method for shaping a material to a forming tool having complex contours. The material forming apparatus may comprise a bladder sealed to a support structure, cooperatively forming a hollow space therebetween into which air or another gas may be pumped to inflate the bladder. The forming tool may comprise a protrusion of any shape to which the material may conform. The material may be placed between the bladder and the protrusion and the support structure may be actuated toward the forming tool. As the support structure progresses toward the forming tool, an area of material pressed against the protrusion by the bladder increases in an outward direction. A pressure regulator may regulate an amount of pressure applied to the material by the bladder as the bladder presses the material against the forming tool. | 2012-10-11 |
20120256349 | TIRE MOLD, MANUFACTURING METHOD OF PNEUMATIC TIRE, AND PNEUMATIC TIRE - A tire mold has a tire molding surface. The tire molding surface is pressed against an outer surface of an uncured tire. A vent hole is provided in the tire molding surface. A surface of an outer edge region surrounding an opening of the vent hole is formed by a smooth surface. The smooth surface is smoother than a surface in a peripheral region of the outer edge region. | 2012-10-11 |
20120256350 | INJECTION MOLD FOR WASHING MACHINE DIAPHRAGMS - Disclosed is an injection mold for washing machine diaphragms wherein the operations of an uppermost first slide core to support the upper part of a first step of a diaphragm manufactured in a cavity and a cam core to support the lower part of a second step of the manufactured diaphragm are controlled to automatically separate the manufactured diaphragm from the cavity. | 2012-10-11 |
20120256351 | METHOD FOR MANUFACTURING HOLLOW BRICKS - A method for manufacturing hollow bricks comprises following steps: providing a frame-shape mold with at least a cavity and placing it on a flat surface; inserting at least one mold insert transversely through the cavity of the frame-shape mold and loading material into the cavity; and forming a billet of a hollow brick by moving an upper die downward to press the material. Besides, the frame-shape mold and the billets of hollow bricks can be separated from each other by lifting the upper die, moving the mold insert out of the cavity, and moving the frame-shape mold. The billet of the hollow brick that is taken out is dried to form a hollow brick having a certain height and can be used in hollow-brick wall construction. | 2012-10-11 |
20120256352 | SELF-PROPELLING SPRUE BAR SHUTOFF DEVICE - An injection molding shutoff assembly includes a chamber containing a movable body that is biased to a rear position in the chamber by a magnet in the movable body. In the rear position, the movable body provides a seal and prevents flow of molten plastic through the assembly. When the movable body is in a forward position, one or more passages permit flow of the molten plastic around the movable body and to an exit in the chamber, leading to one or more molds. An injection molding machine nozzle tip has a beveled front end which, when in an engaged position, seals with an exterior seat of the assembly block defining the chamber and protrudes into the chamber to prop the movable body to the forward position. A portion of the assembly block proximate the opening for the nozzle tip is made of ferromagnetic material, while the rest is not. | 2012-10-11 |
20120256353 | PATTERN TRANSFER APPARATUS AND PATTERN TRANSFER METHOD - A pattern transfer apparatus for pressing a mold having a fine concave/convex pattern onto a transferred material, peeling off the mold from the transferred material, and transferring the concave/convex pattern onto a surface of the transferred material includes: a pretreatment mechanism configured to perform a predetermined surface treatment to at least one of the mold and the transferred material before the concave/convex pattern is transferred; an information recording mechanism configured to record information of the surface treatment performed by the pretreatment mechanism at a position associated with an area of the transferred material where the concave/convex pattern is transferred onto the area; an interpretation mechanism configured to read the recorded information; and an after-treatment mechanism configured to perform a predetermined after-treatment to the area where the concave/convex pattern is transferred, based on the information interpreted by the interpretation mechanism. | 2012-10-11 |
20120256354 | METHODS AND MATERIALS FOR FABRICATING MICROFLUIDIC DEVICES - Materials and Methods are provided for fabricating microfluidic devices. The materials include low surface energy fluoropolymer compositions having multiple cure functional groups. The materials can include multiple photocurable and/or thermal-curable functional groups such that laminate devices can be fabricated. The materials also substantially do not swell in the presence of hydrocarbon solvents. | 2012-10-11 |
20120256355 | MANUFACTURING DEVICE AND THE METHOD OF PREPARING FOR THE NANOFIBERS VIA ELECTRO-BLOWN SPINNING PROCESS - The invention relates to a nanofiber web preparing apparatus and method via electro-blown spinning. The nanofiber web preparing method includes feeding a polymer solution, which is a polymer dissolved into a given solvent, toward a spinning nozzle, discharging the polymer solution via the spinning nozzle, which is charged with a high voltage, while injecting compressed air via the lower end of the spinning nozzle, and collecting fiber spun in the form of a web on a grounded suction collector under the spinning nozzle, in which both of thermoplastic and thermosetting resins are applicable, the solution does not need to be heated and electrical insulation is readily realized. | 2012-10-11 |
20120256356 | LAMINATED AND MOLDED BODY AND MANUFACTURING METHOD THEREFOR - A laminated and molded body obtained by coextruding and molding at least two kinds of resin materials is preferable as a blow-molding aimed preform, a direct-blow molded bottle, a tube, or a blow molded tube, and has at least one layer constituted of a colored layer having a thickness continuously or intermittently varied in a direction parallel to the extruding direction of the at least one layer and/or in another direction intersecting the extruding direction, thereby enhancing the gradation effect. | 2012-10-11 |
20120256357 | USE OF COANDA EFFECT DEVICES TO PRODUCE MELTBLOWN WEBS WITH IMPROVED SIDE-TO-SIDE UNIFORMITY - An apparatus for producing meltblown webs includes a meltblowing die having a plurality of filament outlets, a collector for receiving filaments of polymeric material expelled from the filament outlets, and a first Coanda effect device positioned adjacent to the path of the filaments adjacent to the last filament outlet at an end of the meltblowing die. Methods of forming meltblown webs using such an apparatus are also disclosed. | 2012-10-11 |
20120256358 | BLOWN FILM EXTRUSION PLANT - In a blown film extrusion plant comprising a blow head and an air cooling ring, between the blow head and the air cooling ring at least one cooling device should be provided. | 2012-10-11 |
20120256359 | METHOD OF SETTING TEMPERATURE OF CONTINUOUS HEATING FURNACE AND METHOD OF CONTROLLING FURNACE TEMPERATURE - A space from a charging hole to a discharge hole of a continuous heating furnace is divided into zones. A furnace temperature is assumed for each zone and a plurality of furnace temperature patterns are set. A metallization rate α | 2012-10-11 |
20120256360 | METALLURGICAL FURNACE - The invention relates to a metallurgical furnace, comprising a furnace body ( | 2012-10-11 |
20120256361 | STEEL FOR LEAF SPRING WITH HIGH FATIGUE STRENGTH, AND LEAF SPRING PARTS - Disclosed is steel for a leaf spring with high fatigue strength containing, in mass percentage, C: 0.40 to 0.54%, Si: 0.40 to 0.90%, Mn: 0.40 to 1.20%, Cr: 0.70 to 1.50%, Ti: 0.070 to 0.150%, B: 0.0005 to 0.0050%, N: 0.0100% or less, and a remainder composed of Fe and impurity elements. Also disclosed is a high fatigue-strength leaf spring part obtained by forming the steel. The steel for a leaf spring is prepared to have a Ti content and a N content to satisfy a relation of Ti/N≧10. Preferably, the leaf spring part is subjected to a shot peening treatment in a temperature range of the room temperature through 400° C. with a bending stress of 650 to 1900 MPa being applied to it. | 2012-10-11 |
20120256362 | QUICK CHANGE VISE JAW SYSTEM - A master jaw assembly used in a vise including a locking jaw, a detachable jaw and a clamping device disposed in the locking jaw, securely clamping the detachable jaw to the locking jaw. The locking jaw has a groove extending along an inner surface of the locking jaw defined by a first and second edge. The second edge is tapered inward and downward toward the base. The detachable jaw has a dovetail protrusion along one side surface thereof. The clamping device includes a plurality of specially-shaped nuts having a downwardly tapered edge, said nuts designed to receive one end of a double-ended threaded stud. The detachable jaw becomes fixed to the locking jaw by inserting the protrusion into the groove and torquing the studs to tighten the nuts downward against the protrusion such that the protrusion is clamped between the taper of the second edge and the nuts. | 2012-10-11 |
20120256363 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - A tray for a dry etching apparatus includes substrate accommodation holes penetrating a thickness direction and a substrate support portion supporting an outer peripheral edge portion of a lower surface of a substrate. An upper portion includes a tray support surface supporting a lower surface of the tray, substrate placement portions on each of which a lower surface of the substrate to be placed, and a concave portion for accommodating the substrate support portion. A dc voltage applying mechanism applies a dc voltage to an electrostatic attraction electrode. A heat conduction gas supply mechanism supplies a heat conduction gas between the substrate and substrate placement portion. During carrying of the substrate, the outer peripheral edge of the lower surface of the substrate is supported by the substrate accommodation hole. During processing of the substrate, the substrate support portion is accommodated in the concave portion. | 2012-10-11 |
20120256364 | METHOD FOR FEEDING SHEETS - A method for feeding a plurality of sheets from a stack of sheets into a sheet processing machine includes picking up a first sheet from the stack of sheets using a first feeding device. The sheet is conveyed to a first transfer point of the processing machine. A second sheet is picked up from the stack of sheets using a second feeding device and conveyed to a second transfer point. The first and second transfer points are spatially separated. The sheets alternately move into a sheet conveyor device of the sheet processing machine. A single transfer point can also be used. | 2012-10-11 |
20120256365 | PAPER FEEDER - A paper feeder includes a resist roller configured to convey a sheet to an image formation unit, a paper feed roller configured to convey a sheet to the resist roller, and a controller configured to control the paper feed roller such that the paper feed roller first conveys a sheet at a first conveying speed and then conveys the sheet while decelerating from the first conveying speed to a second conveying speed slower than the first conveying speed. The controller sets the first and second conveying speeds in advance to speeds which allow the paper feed roller to convey a single sheet by a predetermined conveying amount in a predetermined driving time period. The controller determines a time point to start a deceleration from the first conveying speed to the second conveying speed to allow a sheet to hit the resist roller at the second conveying speed. | 2012-10-11 |
20120256366 | PAPER FEEDING MECHANISM - A paper feeding mechanism mounted to a shell includes a pickup mechanism, a transporting mechanism, a separation mechanism and a one-way clutch mechanism. The pickup mechanism includes a pickup motor having a rotating roller, a pickup roller and a pickup wheel. The transporting mechanism includes a transporting motor, a transporting roller, a transporting wheel and a transporting gear. The separation mechanism includes a separation roller, a separation gear and a separation wheel. The one-way clutch mechanism includes a one-way axle, a wiggling arm, a restoration elastic element fastened between the wiggling arm and the shell, and a releasing gear. The one-way axle passes through one end of the wiggling arm. The rotating roller of the pickup motor passes through the one-way axle. The releasing gear mounted to the other end of the wiggling arm is engaged with the transporting gear and the separation gear. | 2012-10-11 |
20120256367 | SHEET FEEDING APPARATUS AND IMAGE FORMING APPARATUS - The present invention relates a sheet feeding apparatus with a lifting and lowering mechanism in a sheet deck | 2012-10-11 |
20120256368 | SHEET CONVEYANCE APPARATUS AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet conveyance apparatus includes a reference surface extending along a sheet conveyance direction and configured to regulate the position of a side edge of a sheet to be conveyed, a skew conveyance mechanism configured to convey the sheet obliquely so that the side edge of the sheet collides against the reference surface, and a sheet deforming unit configured to deform the side edge of the sheet when the sheet is conveyed toward the reference surface by the skew conveyance mechanism. | 2012-10-11 |
20120256369 | MAGNETIC COUPLED INTERMEDIATE IDLER - An improved rotator/translator apparatus includes a set of drive rolls driven by a pair of rotator discs. Idler rolls are positioned above each drive roll and spring loaded to provide the required normal force to drive sheets in any direction required. A pair of magnetic couplings couple the drive rolls with the idler rolls. The magnetic couplings are spaced with about a 5 mm gap to allow sheets to pass therethrough. The couplings allow the idlers and the drive rolls to stay aligned. Thus, driving media, registering media and rotating media in a transport is obtained, but with no relative motion or slip between the drive rolls/idler rolls and the media and a larger nip surface area, thereby eliminating marking of certain media. | 2012-10-11 |
20120256370 | Sheet Transport Apparatus - A sheet transport apparatus including two or more covers is described. The two or more covers are disposed relative to a sheet transport path. In one example, the two covers include two stacked covers that are movable relative to each other. In another example, the two covers include two side-by-side covers in which one pivots, permitting movement of the other side-by-side cover. | 2012-10-11 |
20120256371 | APPARATUS AND METHOD FOR DETECTING THE THICKNESS OF A SHEET DOCUMENT - A sheet thickness detection apparatus is provided for detecting the thickness of a sheet document on a document transport path. The apparatus comprises: a first detector unit having a sheet document contact point adjacent the document transport path, the detector unit comprising a piezoelectric element, a first portion of the piezoelectric element being fixed relative to the document transport path, and the piezoelectric element being arranged such that contact between a sheet document and the sheet document contact point as a sheet document passes the detector unit along the document transport path causes flexing of a second portion of the piezoelectric element relative to its first portion; and a sensing circuit connected to the piezoelectric element for outputting an electric signal based on the charge generated by the piezoelectric element upon flexing, the outputted signal being related to the thickness of the sheet document. A corresponding method is also provided. | 2012-10-11 |
20120256372 | Bifacial Targets, Methods of Making and Methods of Use - Targets including bifacial target areas adjoining four planar extension arms that meet at a center and are set at angles of 109.5 degrees between adjacent arms. A method including providing a pair of symmetrical target portions each having two bifacial target areas adjoining extension arms that meet along a centerline. Slits are provided at centerline apexes, and the slits the two portions are merged. The two target portions are welded together along the merged slits. A method including positioning a target on a surface, with one extension arm projecting upward. A firearm is aimed at a face of the bifacial target area adjoined to the upwardly projecting arm. The firearm is fired to impact the face, the impact causing the target to flip into a new position The firearm is then aimed at a face of the bifacial target area adjoined to the new upwardly projecting extension arm. | 2012-10-11 |
20120256373 | Portable electronic scoreboard for officiating a sporting game - A portable scoreboard system comprising of a microcontroller running a software algorithm that keeps score of a sports game and officiates the game to ensure fair play according to the rules of the sport. The official rules of all the sports are stored in the device memory. The updating of the score is carried out with wireless remote control modules worn by the players and/or users. The score is only updated when the algorithm has confirmed no game rule violations. The real time score information is then displayed on the scoreboard panel plus appropriate audio sounds are played. Game related scores and user settings are stored into memory on a real time basis and can be retrieved externally for post-game analysis. | 2012-10-11 |
20120256374 | Game of Sabotage and Rescue - A game including sabotage and rescue mechanics. Sabotage occurs when a second player's primary piece lands on the same space as a first player's primary piece. In this situation, the first player's primary piece is the piece being sabotaged. Sabotage can happen on any space on the board except for the secure spaces. The first player may be sabotaged in the following ways; (A) the first player's primary piece is stalled by giving the first player a sabotage card, resulting in an unknown number of lost turns, (B) a first player's collectible card is stolen, or (C) a first player's assignment is stolen. | 2012-10-11 |
20120256375 | Board game apparatus and method of play - The present invention comprises a board game for teaching basic arithmetic and mathematical operations (such as addition and subtraction) to children in need of such skills. The game board includes a continuous playing path having a series of playing positions there along, with each of the positions requiring a player to roll combinations of polyhedral dice and using mathematical operations to achieve a score for each turn along the playing path. Play proceeds as described above until a predetermined total amount of points is achieved. | 2012-10-11 |
20120256376 | PLAY EQUIPMENT - There is provided play equipment which includes a game board | 2012-10-11 |
20120256377 | METHODS FOR PLAYING GAMES - The invention provides methods for playing games wherein players may select other players to make their playing decisions for them. The invention provides methods for playing games wherein primary players are playing a primary game, and derivative players are playing a derivative game, wherein the play of the game at said derivative table is identical to the play of the game at said primary table, and the players at the derivative table have selected a corresponding primary player to make their playing decisions for them. The present invention is especially well suited for playing the game of poker. | 2012-10-11 |
20120256378 | Portable Point/Beer Pong Table - This invention will provide a portable point/beer pong game for individual or team use. The invention is portable where it can be broken down, carried or stored in a bag, or other suitable container. The invention can be used as a ‘Beer Pong’ game as is common or it can be used as a game where points are scored. The invention top can also be used as a floating game in a swimming pool. | 2012-10-11 |
20120256379 | APPARATUS AND METHODS FOR TEMPORARILY SEALING A PIPE - Apparatus and methods for temporarily sealing a pipe including apparatus and methods for creating a temporary airtight seal at the open end of a pipe in a plumbing or refrigeration system. One such apparatus includes a body, grommet, washer, and a nut. Multiple airtight seals are created including a first primary seal between an exterior of the pipe and the grommet and a secondary seal between the open end of the pipe and the washer. The grommet does not require teeth and the apparatus does not require adhesive, sealant, or any other type of similar materials. Use of the apparatus and methods greatly minimizes and/or eliminates the potential for marring or otherwise distorting the open end of the pipe, thereby facilitating reuse of same. | 2012-10-11 |
20120256380 | AUTO SIZING CHUCK - A chuck includes a chuck body extending along a longitudinal axis, the chuck body including a plurality of slots each arranged at an oblique angle with respect to the longitudinal axis. A plurality of jaws each includes a first engagement portion, a jaw end, and a drive end. Each of the jaws is disposed within one of the plurality of slots and is movable between a close position and an open position. A biasing member is coupled to the plurality of jaws and is operable to bias the plurality of jaws toward the close position and a rotating assembly is selectively engageable with the plurality of jaws such that when engaged, the plurality of jaws are movable in response to rotation of the rotating assembly. | 2012-10-11 |
20120256381 | EXOSKELETON AND FOOTWEAR ATTACHMENT SYSTEM - An exoskeleton (E) for connecting footwear to sporting equipment. The exoskeleton has an underfoot base ( | 2012-10-11 |
20120256382 | Snow Machine Ski - A ski for a snowmobile is provided with a pair of lateral wings and a central channel for increasing the flow of snow under a gliding surface at the bottom of the ski. The increased flow of snow enhances flotation of the ski. The channel may be formed by two downwardly extending keels. The wings are defined between the keels and outer edges of the ski. The keels may be asymmetric with a shorter keel being positioned toward an outer edge of the snowmobile to improve handling characteristics of a snowmobile. | 2012-10-11 |
20120256383 | WHEEL FOR WHEELBARROWS AND CARTS - A wheel for a wheelbarrow wherein the wheel body forms wide spokes is provided. The spokes are formed by openings between the hub and the rim in the bodies that form the wheel. While such spokes are known, the openings that create the spokes provide additional points of entry for debris and water into the enclosed space. Thus, a sealed, fragmented seam coupling the wheel bodies is further provided. | 2012-10-11 |
20120256384 | ROLLATOR WHEELCHAIR - A rollator wheelchair is provided comprising a frame provided with at least two wheels, a first chair section mounted to the frame and a second chair section mounted to the frame, the first chair section comprising a back support and a first seat portion, and the second chair section comprising a second seat portion, wherein the first and second chair sections provide a seating arrangement, wherein the first chair section is detachable and wherein the second chair is arranged such that when the first chair section is detached a free walking space is present between the at least two wheels. | 2012-10-11 |
20120256385 | Traffic Cone Dolly - The invention is a dolly that may assist a user in moving one or more cones from one location to another. The cone dolly is stackable when it is not in use and may contain handles. Users can utilize the wheels on the bottom of the dolly to push one or more cones from one location to another or utilize the handles within the body of the dolly to carry the dolly when it is not in use. | 2012-10-11 |
20120256386 | THREE-PIECE FOLDING SCOOTER - The present invention relates to a three-piece folding scooter whereof the front and rear wheels are fixed on two side bases (b) and (c). Each wheel is hinged to a central base formed from two oblong openings in which the wheels retract respectively when the side bases are folded down flat against the central base. | 2012-10-11 |
20120256387 | SUSPENSION ARRANGEMENT FOR A WHEEL SUSPENSION OF A MOTOR VEHICLE - A suspension arrangement for a wheel suspension of a motor vehicle includes an output lever hinged directly or indirectly to a wheel control element and configured as a flexible spring of defined spring rate. A transverse torsion-bar spring acts on the output lever, with an actuator adjusting a pretension of the torsion-bar spring. | 2012-10-11 |
20120256388 | METHODS OF VEHICLE SUSPENSION - Suspension systems must tradeoff multiple purposes including contributing to the vehicle's road holding/handling and braking for good active safety and driving pleasure as well as keeping vehicle's user(s) comfortable and reasonably well isolated from road noise, bumps, and vibrations, etc. Over the past 100 years many suspension systems have evolved but have in common the disposition of the hock absorber between the wheel and the fulcrum point of the wheel mounting to the vehicle. It would be, however, be beneficial to provide a suspension exploiting a dual-shock system wherein the two shock absorbers are in opposite states so that even under absorption of the vertical shock from the road surface there was still applied additional force for road contact to be maintained. It can also be shown to be beneficial in single-shock systems to place the shock the opposite side of the fulcrum point of the suspension system, counter to previous prior art solutions. | 2012-10-11 |
20120256389 | SPARKING DEVICE FOR A PERSONAL MOBILITY VEHICLE - A spark generating device that is supported by a tricycle is movable to a position in which the spark generating device contacts the riding surface. The spark generating device includes a handle actuation portion and a spark portion that creates sparks on the riding surface as a result of frictional contact with the riding surface. The spark generating device can also include a handle actuation portion which is accessible to the user and allows the user to move the spark generating device to the second position without having to manipulate the wheels or pedals of the tricycle. | 2012-10-11 |
20120256390 | BICYCLE - The technical result of the claimed design consists in maintaining the physiological curvatures in the neck and lumbar parts of the spine, under the “healthy back” principle. The technical result is achieved in a bicycle that comprises a frame provided with handlebars pivoted thereon, wheels, a pedal mechanism, and a seat with a backrest, the seat backrest being provided with vertically movable pads and having a variable angle of inclination to the seat, the pads having a constant or variable volume, and the handlebars having a position that can be varied vertically and horizontally and a variable angle of inclination to the seat. | 2012-10-11 |
20120256391 | Load transfer device for seed distribution systems in seeders and fertilizer machines - A load transfer device for seed and fertilizer distribution systems in seeders and fertilizers improving adaptation of seed distribution systems to the different ground irregularities, comprising
| 2012-10-11 |
20120256392 | LOWRIDER AERODYNAMIC TRUCK - A truck for towing a trailer includes a vehicle frame spine, a pair of suspension assemblies extending from either side of the vehicle frame spine and each supports a drive assembly at an end distal to the vehicle frame spine. Extensible struts are positioned between the vehicle frame spine and the drive assemblies allowing selection of vehicle drive height from a driving surface. A fifth wheel assembly is supported from the vehicle frame spine located above the drive assemblies. The fifth wheel assembly includes a fifth wheel and a fifth wheel lift which varies spacing of the fifth wheel from the vehicle frame spine. Control system selects strut extension based on a selected vehicle drive height and operates the lift assembly to counteract changes in vehicle drive height and maintain a constant fifth wheel drive height relative to the driving surface. | 2012-10-11 |
20120256393 | Self-Locking Hitch Pin - Disclosed is a self-locking hitch pin for joining a hitch device to a receiver hitch in a quick and easy manner using a single, self-contained mechanism. The hitch pin is comprised of shaft with a locking member on one end and a handle and weight on the other end and a spring and retainers to keep the hitch pin in place. The self-locking hitch pin allows for single-handed installation and securing of a hitch device to a receiver hitch with no pin or locking mechanism to be lost or dropped. The self-locking hitch pin can be inserted into the hitch orifice, have pressure applied to the spring, rotate the hitch pin allowing gravity to engage the locking member and then release pressure on the spring coupling both devices together. | 2012-10-11 |
20120256394 | SNOWBOARD AND SKIS FOR USE IN LOOSE SNOW - A snowboard or ski for use in loose snow, the snowboard or ski having inwardly curved edge portions where the snowboard or ski has greater width at both ends at the transition to the tips than at the middle of the snowboard or ski with upwardly curved tips. The base is divided into a right running surface and a left running surface which two running surfaces together form a downwardly directed apex in the entire length of the snowboard or ski along a partition line between the two running surfaces when seen in a cross direction of the snowboard or ski. Each of the running surfaces forms an angle with the ground, where the sum total of the two angles is less than 90 degrees everywhere along the length of the snowboard or ski. | 2012-10-11 |