41st week of 2014 patent applcation highlights part 15 |
Patent application number | Title | Published |
20140299956 | LAYERS FOR INCREASING PERFORMANCE IN IMAGE SENSORS - An imaging device includes a semiconductor substrate having a photosensitive element for accumulating charge in response to incident image light. The semiconductor substrate includes a light-receiving surface positioned to receive the image light. The imaging device also includes a negative charge layer and a charge sinking layer. The negative charge layer is disposed proximate to the light-receiving surface of the semiconductor substrate to induce holes in an accumulation zone in the semiconductor substrate along the light-receiving surface. The charge sinking layer is disposed proximate to the negative charge layer and is configured to conserve or increase an amount of negative charge in the negative charge layer. The negative charge layer is disposed between the semiconductor substrate and the charge sinking layer. | 2014-10-09 |
20140299957 | IMAGE SENSOR HAVING METAL CONTACT COUPLED THROUGH A CONTACT ETCH STOP LAYER WITH AN ISOLATION REGION - An image sensor pixel includes one or more photodiodes disposed in a semiconductor layer. Pixel circuitry is disposed in the semiconductor layer coupled to the one or more photodiodes. A passivation layer is disposed proximate to the semiconductor layer over the pixel circuitry and the one or more photodiodes. A contact etch stop layer is disposed over the passivation layer. One or more metal contacts are coupled to the pixel circuitry through the contact etch stop layer. One or more isolation regions are defined in the contact etch stop layer that isolate contact etch stop layer material through which the one or more metal contacts are coupled are coupled to the pixel circuitry from the one or more photodiodes. | 2014-10-09 |
20140299958 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a semiconductor device, includes forming a trench in a semiconductor substrate having a first face and a second face by processing the first face of the semiconductor substrate, the trench including a first portion and a second portion located between the first portion and a plane including a first face, filling an insulator in the second portion such that a space remains in the first portion and the trench is closed, and forming a plurality of elements between the first face and the second face, wherein the space and the insulator form element isolation. | 2014-10-09 |
20140299960 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-09 |
20140299961 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device which solves the following problem of a super junction structure: due to a relatively high concentration in the body cell region (active region), in peripheral areas (peripheral regions or junction end regions), it is difficult to achieve a breakdown voltage equivalent to or higher than in the cell region through a conventional junction edge terminal structure or resurf structure. The semiconductor device includes a power MOSFET having a super junction structure formed in the cell region by a trench fill technique. Also, super junction structures having orientations parallel to the sides of the cell region are provided in a drift region around the cell region. | 2014-10-09 |
20140299962 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes: a layer of a first conductivity type; a well of a second conductivity type on the layer of the first conductivity type in an active region; and a flat RESURF layer of the second conductivity type on the layer of the first conductivity type on an outer circumference of the well as a termination structure. The RESURF layer includes a low concentration layer arranged at an inner end on the well side and an outer end on the outer circumferential side, and a high concentration layer arranged between the inner end and the outer end and having a higher impurity concentration than the low concentration layer. | 2014-10-09 |
20140299963 | INTERPOSER DEVICE - An interposer device The invention relates to an interposer device comprising a doped silicon substrate ( | 2014-10-09 |
20140299964 | ON-CHIP INDUCTOR USING REDISTRIBUTION LAYER AND DUAL-LAYER PASSIVIATION - A system and method utilize a redistribution layer in a flip-chip or wirebond package, which is also used to route signals to bumps, as a layer for the construction of an on-chip inductor or a layer of a multiple-layer on-chip inductor. In one example, the redistribution layer is surrounded by dual-layer passivation to protect it, and the inductor formed thereby, from the environment and isolate it, and the inductor formed thereby, from the metal layer beneath it. | 2014-10-09 |
20140299965 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - After the formation of a first interlayer insulating, an etching stopper film made of SiON is formed thereon. Subsequently, a contact hole extending from the upper surface of the etching stopper film and reaching a high concentration impurity region is formed, and a first plug is formed by filling W into the contact hole. Next, a ferroelectric capacitor, a second interlayer insulating film, and the like are formed. Thereafter, a contact hole extending from the upper surface of the interlayer insulating film and reaching the first plug is formed. Then, the contact hole is filled with W to form a second plug. With this, even when misalignment occurs, the interlayer insulating film is prevented from being etched. | 2014-10-09 |
20140299966 | HERMETIC PACKAGING OF INTEGRATED CIRCUIT COMPONENTS - A method for forming an integrated circuit includes transforming at least a portion of a first substrate layer to form a conductive region within the first substrate layer. An integrated circuit device is provided proximate an outer surface of the first substrate layer. The integrated circuit device transmits or receives electrical signals through the conductive region. A second substrate layer is disposed proximate to the outer surface of the first substrate layer to enclose the integrated circuit device in a hermetic environment. | 2014-10-09 |
20140299967 | ELECTRONIC DEVICE STRUCTURE AND METHOD OF MAKING ELECTRONIC DEVICES AND INTEGRATED CIRCUITS USING GRAYSCALE TECHNOLOGY AND MULTILAYER THIN-FILM COMPOSITES - A physical structure and a method for forming a electronic devices on a substrate comprising: providing a substrate; forming a plurality of layers on the substrate, the layers comprising at least two layers of conducting material and a layer of insulating material therebetween; depositing photoresist material onto predetermined regions of the plurality of layers, the photoresist material varying in thickness; utilizing gray scale illumination on the photoresist material; removing a portion of the layers using physical etching to expose predetermined portions of the conducting layers. Optionally, the photoresist may be utilized on a plurality of discrete electronic devices concurrently, such that the gray scale illumination is conducted on a plurality of discrete electronic devices concurrently. Similarly, the physical etching may be conducted on the discrete electronic devices concurrently; removing different thicknesses of material concurrently. Also claimed is a product made by the claimed method. | 2014-10-09 |
20140299968 | SEMICONDUCTOR DEVICES AND FABRICATION METHODS - A method of making a semiconductor device comprises : providing a semiconductor wafer having a semiconductor layer; forming a first mask layer over the semiconductor layer; forming a second mask layer over the first mask layer; annealing the second mask layer to form islands; etching through the first mask layer and the semiconductor layer using the islands as a mask to form an array of pillars; and growing semiconductor material between the pillars and then over the tops of the pillars. | 2014-10-09 |
20140299969 | HIGHLY ETCH-RESISTANT POLYMER BLOCK FOR USE IN BLOCK COPOLYMERS FOR DIRECTED SELF-ASSEMBLY - Compositions for directed self-assembly (DSA) patterning techniques are provided. Methods for directed self-assembly are also provided in which a DSA composition comprising a block copolymer is applied to a substrate and then self-assembled to form the desired pattern. The block copolymer includes at least two blocks of differing etch rates, so that one block (e.g., polymethylmethacrylate) is selectively removed during etching. Because the slower etching block (e.g., polystyrene) is modified with an additive to further slow the etch rate of that block, more of the slow etching block remains behind to fully transfer the pattern to underlying layers. | 2014-10-09 |
20140299970 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A semiconductor integrated circuit device includes: a rectangular shaped semiconductor substrate; a metal wiring layer formed on or over the semiconductor substrate; and a passivation layer covering the metal wiring layer. A corner non-wiring region where no portion of the metal wiring layer is formed is disposed in a corner of the semiconductor substrate. A slit is formed in a portion of the metal wiring layer which is close to the corner of the semiconductor substrate. The passivation layer includes a first passivation layer which is formed on the metal wiring layer and a second passivation layer which is formed on the first passivation layer. The first passivation layer is formed of a material that is softer than a material of the second passivation layer. | 2014-10-09 |
20140299971 | METHODS OF FORMING A REVERSED PATTERN IN A SUBSTRATE, AND RELATED SEMICONDUCTOR DEVICE STRUCTURES - A method of forming a reversed pattern in a substrate. A resist on a substrate is exposed and developed to form a pattern therein, the patterned resist having a first polarity. The polarity of the patterned resist is reversed to a second polarity, and a reversal film is formed over the patterned resist having the second polarity. The patterned resist having the second polarity is removed, forming a pattern in the reversal film. The pattern in the reversal film is then transferred to the substrate. Additional methods of forming a reversed pattern in a substrate are disclosed, as is a semiconductor structure formed during the methods. | 2014-10-09 |
20140299972 | SEMICONDUCTOR DEVICE HAVING A THROUGH CONTACT - A semiconductor device includes a semiconductor substrate having a first side and a second side opposite the first side, an active area and a through contact area, the active area including a transistor structure having a control electrode, the through contact area including a semiconductor mesa having insulated sidewalls. The semiconductor device further includes a first metallization on the first side in the active area and a recess extending from the first side into the semiconductor substrate and between the active area and the through contact area and including in the through contact area a horizontally widening portion, the recess being at least partly filled with a conductive material forming a first conductive region in ohmic contact with the semiconductor mesa and the transistor structure. The semiconductor device also includes a control metallization on the second side and in ohmic contact with the semiconductor mesa. | 2014-10-09 |
20140299973 | Multilayer line trimming - Substantially simultaneous plasma etching of polysilicon and oxide layers in multilayer lines in semiconductors allows for enhanced critical dimensions and aspect ratios of the multilayer lines. Increasing multilayer line aspect ratios may be possible, allowing for increased efficiency, greater storage capacity, and smaller critical dimensions in semiconductor technologies. | 2014-10-09 |
20140299974 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a substrate, an electrode and a light emitting region is provided. The substrate may have protruding portions formed in a repeating pattern on substantially an entire surface of the substrate while the rest of the surface may be substantially flat. The cross sections of the protruding portions taken along planes orthogonal to the surface of the substrate may be semi-circular in shape. The cross sections of the protruding portions may in alternative be convex in shape. A buffer layer and a GaN layer may be formed on the substrate. | 2014-10-09 |
20140299975 | Method and Board for Growing High-Quality Graphene Layer Using High Pressure Annealing - This invention relates to a method and board for forming a graphene layer, and more particularly, to a method of forming a high-quality graphene layer using high pressure annealing and to a board used therein. The method of forming the graphene layer includes forming a reaction barrier layer on a substrate layer, forming a metal catalyst layer which functions as a catalyst for forming the graphene layer on the reaction barrier layer, subjecting a board including a stack of the layers to high pressure annealing, and growing the graphene layer on the metal catalyst layer. This board is subjected to high pressure annealing before growth of the graphene layer, and the reaction barrier layer is formed using a material having high adhesion energy to the metal catalyst layer so as to suppress migration of metal catalyst atoms. | 2014-10-09 |
20140299976 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF - There are provided a semiconductor package and a manufacturing method thereof, capable of increasing integration by mounting electronic devices on both surfaces of a substrate. The semiconductor package includes a first substrate having mounting electrodes on both surfaces thereof; a plurality of electronic devices mounted on both surfaces of the first substrate; and a second substrate exposed in cavities and bonded to a bottom surface of the first substrate so as to accommodate the electronic devices mounted on the bottom surface of the first substrate in the cavities. | 2014-10-09 |
20140299977 | Semiconductor Device - A semiconductor device includes: a lead frame; an IC element mounted on a main face of the lead frame; an inductor mounted on a back face of the lead frame; and a resin body configured to seal the lead frame, the IC element and the inductor, wherein the inductor and the lead frame are closely contacted with each other, wherein the IC element is disposed at a position corresponding to an center axis of the inductor, wherein the inductor and the IC element are electrically connected to each other, and wherein wiring of main current flowing through the IC element is disposed between terminals of the inductor. | 2014-10-09 |
20140299978 | QUAD FLAT NON-LEAD PACKAGE - A quad flat non-lead package includes a chip, a chip carrier including a bearing surface adapted for the mounting of the chip, a plurality of leads mounted around the chip carrier and electrically connected to the chip, each lead having an opening located in an outer edge of a rear end thereof, and a molding compound formed on the chip, the chip carrier and the leads by compression molding to let the opening of each lead be exposed to the outside. The design of the openings of the leads can provide more tin-climbing area to improve soldering quality and yield, thereby lowering the manufacturing cost and facilitating testing after the soldering process. The invention also provides a lead frame for quad flat non-lead package. | 2014-10-09 |
20140299979 | SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE - The reliability of a semiconductor device is improved. A semiconductor device has a first metal plate and a second metal plate electrically isolated from the first metal plate. Over the first metal plate, a first semiconductor chip including a transistor element formed thereover is mounted. Whereas, over the second metal plate, a second semiconductor chip including a diode element formed thereover is mounted. Further, the semiconductor device has a lead group including a plurality of leads electrically coupled with the first semiconductor chip or the second semiconductor chip. The first and second metal plates are arranged along the X direction in which the leads are arrayed. Herein, the area of the peripheral region of the first semiconductor chip in the first metal plate is set larger than the area of the peripheral region of the second semiconductor chip in the second metal plate. | 2014-10-09 |
20140299980 | SEMICONDUCTOR PACKAGES INCLUDING A HEAT SPREADER AND METHODS OF FORMING THE SAME - Semiconductor packages including a heat spreader and methods of forming the same are provided. The semiconductor packages may include a first semiconductor chip, a second semiconductor chip, and a heat spreader stacked sequentially. The semiconductor packages may also include a thermal interface material (TIM) layer surrounding the second semiconductor chip and directly contacting a sidewall of the second semiconductor chip. An upper surface of the TIM layer may directly contact a lower surface of the heat spreader, and a sidewall of the TIM layer may be substantially coplanar with a sidewall of the heat spreader. In some embodiments, a sidewall of the first semiconductor chip may be substantially coplanar with the sidewall of the TIM layer. | 2014-10-09 |
20140299981 | High Power Single-Die Semiconductor Package - A semiconductor package includes a single semiconductor die and an electrically and thermally conductive base. The single semiconductor die includes a semiconductor body having opposing first and second surfaces and insulated sides between the first and second surfaces. The single semiconductor die further includes a first electrode at the first surface and a second electrode at the second surface. The single semiconductor die has a defined thickness measured between the first and second surfaces, a defined width measured along one of the insulated sides, and a defined length measured along another one of the insulated sides. The base is attached to the second electrode at the second surface of the single semiconductor die and has the same length and width as the single semiconductor die. | 2014-10-09 |
20140299982 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes a package | 2014-10-09 |
20140299983 | JOINT STRUCTURE AND SEMICONDUCTOR DEVICE STORAGE PACKAGE - A joint structure includes: a ceramic member; a metallized layer formed on a surface of the ceramic member; and a metal member joined to the metallized layer via a brazing material. The metal member includes a base part erected on the metallized layer, and an extended part extended from the base part to define a predetermined gap with respect to the metallized layer. The base part includes an end joined to the metallized layer by a brazing material layer including the brazing material, and a side joined to the metallized layer around the base part by a fillet including the brazing material formed on the metallized layer around the base part. The extended part defines a recess at a position facing the metallized layer on which the fillet is formed. | 2014-10-09 |
20140299984 | CHIP AND MANUFACTURING METHOD THEREOF - A semiconductor device and a manufacturing method thereof are provided. The semiconductor device has an active surface. The semiconductor device includes at least a connecting element and at least a bump. The connecting element is disposed on the activate surface and has a minimum dimension smaller than 100 microns. The bump is disposed on the connecting element and is electrically connected to the active surface by the connecting element. The bump includes a pillar part disposed on the connecting element and a top part disposed at the top of the pillar part. The pillar part has a first dimension and a second dimension both parallel to the active surface. The first dimension is longer than 1.2 times the second dimension. The top part is composed of solder and will melt under the determined temperature. The pillar part will not melt under a determined temperature. | 2014-10-09 |
20140299985 | BUMP STRUCTURES FOR MULTI-CHIP PACKAGING - A multi-chip package includes a substrate having a plurality of first bump structures. A pitch between first bump structures of the plurality of first bump structures is uniform across a surface of the substrate. The multi-chip package includes a first chip bonded to the substrate and a second chip bonded to the substrate. The first chip includes a plurality of second bump structures, and the plurality of second bump structures are bonded to a first set of first bump structures of the plurality of first bump structures. The second chip includes a plurality of third bump structures, and the plurality of third bump structures are bonded to a second set of first bump structures of the plurality of first bump structures. A pitch between second bump structures of the plurality of second bump structures is different from a pitch between third bump structures of the plurality of third bump structures. | 2014-10-09 |
20140299986 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE - A plurality of protruding electrodes of a semiconductor chip are in contact with a plurality of electrodes formed on a semiconductor substrate, via a plurality of solder sections. In this state, the solder sections are melted so as to form a plurality of solder bonding sections joined to the protruding electrodes of the semiconductor chip and the electrodes of the semiconductor substrate. Moreover, a distance between a part of the semiconductor chip and the semiconductor substrate is larger than a distance between the other part of the semiconductor chip and the semiconductor substrate, extending at least some of the solder bonding sections. Thus, the solder bonding sections vary in height. Holes are then formed at least in a solder bonding section having a maximum height out of the solder bonding sections. After that, the solder bonding sections are solidified. | 2014-10-09 |
20140299987 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-09 |
20140299988 | SELF-FORMING EMBEDDED DIFFUSION BARRIERS - Interconnect structures containing metal oxide embedded diffusion barriers and methods of forming the same. Interconnect structures may include an M | 2014-10-09 |
20140299989 | SEMICONDUCTOR DEVICE WITH AIR GAP AND METHOD FOR FABRICATING THE SAME - A semiconductor device includes a first conductive structure including a first conductive pattern that is formed over a substrate, a second conductive structure formed adjacent to a sidewall of the first conductive structure, and an insulation structure including an air gap that is formed between the first conductive structure and the second conductive structure, wherein the second conductive structure includes a second conductive pattern, an ohmic contact layer that is formed over the second conductive pattern, and a third conductive pattern that is formed over the ohmic contact layer and is separated from the first conductive pattern through the air gap. | 2014-10-09 |
20140299990 | SEMICONDUCTOR DEVICE - The semiconductor device of the present invention includes an insulating layer, a copper wiring for wire connection formed on the insulating layer, a shock absorbing layer formed on an upper surface of the copper wiring, the shock absorbing layer being made of a metallic material with a hardness higher than copper, a bonding layer formed on the shock absorbing layer, the bonding layer having a connection surface for a wire, and a side protecting layer covering a side surface of the copper wiring, wherein the side protecting layer has a thickness thinner than a distance from the upper surface of the copper wiring to the connection surface of the bonding layer. | 2014-10-09 |
20140299991 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF - It is an object of the present invention to prevent an influence of voltage drop due to wiring resistance, trouble in writing of a signal into a pixel, and trouble in gray scales, and provide a display device with higher definition, represented by an EL display device and a liquid crystal display device. | 2014-10-09 |
20140299992 | FILLING CAVITIES IN SEMICONDUCTOR STRUCTURES HAVING ADHESION PROMOTING LAYER IN THE CAVITIES - High aspect ratio trenches may be filled with metal that grows more from the bottom than the top of the trench. As a result, the tendency to form seams or to close of the trench at the top during filling may be reduced in sonic embodiments. Material that encourages the growth of metal may be formed in the trench at the bottom, while leaving the region of the trench near the top free of such material to encourage growth upwardly from the bottom. | 2014-10-09 |
20140299993 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-09 |
20140299994 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-09 |
20140299995 | WIRING DEVICE FOR SEMICONDUCTOR DEVICE, COMPOSITE WIRING DEVICE FOR SEMICONDUCTOR DEVICE, AND RESIN-SEALED SEMICONDUCTOR DEVICE - A wiring device for a semiconductor device, a composite wiring device for a semiconductor device and a resin-sealed semiconductor device are provided, each of which is capable of mounting thereon a semiconductor chip smaller than conventional chips and being manufactured at lower cost. The wiring device connects an electrode on a semiconductor chip with an external wiring device, and has an insulating layer, a metal substrate and a copper wiring layer. The wiring device has a semiconductor chip support portion provided on the side of the copper wiring layer with respect to the insulating layer. The copper wiring layer includes a first terminal, a second terminal and a wiring portion. The first terminal is connected with the electrode. The second terminal is connected with the external wiring device. The wiring portion connects the first terminal with the second terminal. | 2014-10-09 |
20140299996 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-09 |
20140299997 | SPACER PROCESS FOR ON PITCH CONTACTS AND RELATED STRUCTURES - Methods are disclosed, including for increasing the density of isolated features in an integrated circuit. Also disclosed are associated structures. In some embodiments, contacts are formed on pitch with other structures, such as conductive interconnects that may be formed by pitch multiplication. To form the contacts, in some embodiments, a pattern corresponding to some of the contacts is formed in a selectively definable material such as photoresist. Features in the selectively definable material are trimmed, and spacer material is blanket deposited over the features and the deposited material is then etched to leave spacers on sides of the features. The selectively definable material is removed, leaving a mask defined by the spacer material. The pattern defined by the spacer material may be transferred to a substrate, to form on pitch contacts. In some embodiments, the on pitch contacts may be used to electrically contact conductive interconnects in the substrate. | 2014-10-09 |
20140299998 | METHOD FOR MAKING CONTACT WITH A SEMICONDUCTOR AND CONTACT ARRANGEMENT FOR A SEMICONDUCTOR - The invention relates to a method for making contact with a semiconductor ( | 2014-10-09 |
20140299999 | INTEGRATED CIRCUIT PACKAGE ASSEMBLIES INCLUDING A GLASS SOLDER MASK LAYER - Embodiments of the present disclosure are directed towards techniques and configurations for integrated circuit package assemblies including a glass solder mask layer and/or bridge. In one embodiment, an apparatus includes one or more build-up layers having electrical routing features and a solder mask layer composed of a glass material, the solder mask layer being coupled with the one or more build-up layers and having openings disposed in the solder mask layer to allow coupling of package-level interconnect structures with the electrical routing features through the one or more openings. Other embodiments may be described and/or claimed. | 2014-10-09 |
20140300000 | Semiconductor Device and Method - A system and method for a semiconductor device are provided. An embodiment comprises a dielectric layer, a hard mask layer over the dielectric layer, and a capping layer over the hard mask layer. A multi-patterning process is performed to form an interconnect using the capping layer as a mask to form an opening for the interconnect. | 2014-10-09 |
20140300001 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR PACKAGE INCLUDING THE PRINTED CIRCUIT BOARD - A printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad. A cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure. | 2014-10-09 |
20140300002 | Semiconductor Device and Method of Forming Conductive Vias Using Backside Via Reveal and Selective Passivation - A semiconductor device includes a plurality of semiconductor die and a plurality of conductive vias formed in the semiconductor die. An insulating layer is formed over the semiconductor die while leaving the conductive vias exposed. An interconnect structure is formed over the insulating layer and conductive vias. The insulating layer is formed using electrografting or oxidation. An under bump metallization is formed over the conductive vias. A portion of the semiconductor die is removed to expose the conductive vias. The interconnect structure is formed over two or more of the conductive vias. A portion of the semiconductor die is removed to leave the conductive vias with a height greater than a height of the semiconductor die. A second insulating layer is formed over the first insulating layer. A portion of the second insulating layer is removed to expose the conductive via. | 2014-10-09 |
20140300003 | SEMICONDUCTOR DEVICE AND INTERCONNECT SUBSTRATE - A semiconductor substrate includes a semiconductor chip and an interconnect substrate. The interconnect substrate has an interconnect region between a first main surface formed with plural orderly arranged first and second signal electrodes connected to the semiconductor chip, and a second main surface. The interconnect region has a core substrate, interconnect layers formed on both surfaces thereof, plural first through holes and plural first vias that pass through the interconnect layer on the side of the first main surface for forming impedance matching capacitances. Each first through hole is connected to a first signal interconnect at a position spaced part from the first signal electrode by a first interconnect length and each first via is connected to the second signal interconnect at a position spaced apart from the second signal electrode by a second interconnect length that is substantially equal with the first interconnect length. | 2014-10-09 |
20140300004 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME - Provided are a semiconductor package and a method of fabricating the same. In one embodiment, to fabricate a semiconductor package, a wafer having semiconductor chips fabricated therein is provided. A heat sink layer is formed over the wafer. The heat sink layer contacts top surfaces of the semiconductor chips. Thereafter, the plurality of semiconductor chips are singulated from the wafer. | 2014-10-09 |
20140300005 | MULTILEVEL INTERCONNECT STRUCTURES AND METHODS OF FABRICATING SAME - A multilevel interconnect structure for a semiconductor device includes an intermetal dielectric layer with funnel-shaped connecting vias. The funnel-shaped connecting vias are provided in connection with systems exhibiting submicron spacings. The architecture of the multilevel interconnect structure provides a low resistance connecting via. | 2014-10-09 |
20140300006 | CONDUCTIVE STRUCTURES, SYSTEMS AND DEVICES INCLUDING CONDUCTIVE STRUCTURES AND RELATED METHODS - Conductive structures include a plurality of conductive steps and a contact extending at least partially therethrough in communication with at least one of the plurality of conductive steps and insulated from at least another one of the conductive steps. Devices may include such conductive structures. Systems may include a semiconductor device and a stair step conductive structure having a plurality of contacts extending through a step of the stair step conductive structure. Methods of forming conductive structures include forming contacts in contact holes formed through at least one conductive step of a conductive structure. Methods of forming electrical connections in stair step conductive structures include forming contacts in contact holes formed through each step of the stair step conductive structure. | 2014-10-09 |
20140300007 | SEMICONDUCTOR APPARATUS - A semiconductor apparatus has a configuration in which multiple copper wiring layers and multiple insulating layers are alternately layered. A low-impedance wiring is formed occupying a predetermined region. A first wiring pattern includes multiple copper wiring members arranged in parallel with predetermined intervals in a first copper wiring layer, each of which has a rectangular shape extending in a first direction. A second wiring pattern includes multiple copper wiring members arranged in parallel with predetermined intervals in a second copper wiring layer adjacent to the first copper wiring layer, each of which has a rectangular shape extending in a second direction orthogonal to the first direction. The region occupied by the first wiring pattern and that occupied by the second wiring pattern are arranged such that they at least overlap. The first wiring pattern and the second wiring pattern are electrically connected so as to have the same electric potential. | 2014-10-09 |
20140300008 | Wafer scale technique for interconnecting vertically stacked dies - A method and device for interconnecting stacked die surfaces with electrically conductive traces is provided that includes bonding, using a first layer of a photoresist compound, a second die ( | 2014-10-09 |
20140300009 | PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME - A package structure includes a flexible-rigid PCB and a chip. The flexible PCB includes a flexible PCB, a glue piece and an outer trace layer. The flexible PCB includes two bending portions and a fixing portion connected between the two bending portions, and includes an insulating layer and an inner trace layer formed on the insulating layer. The glue piece is adhered to the fixing portion. The outer trace layer is adhered to the glue piece and includes conductive pads. The fixing portion, the glue piece and the outer trace layer form a rigid portion, the bending portions form flexible portions. The chip is packaged on the rigid portion and includes electrode pads electrically connected to the conductive pads. | 2014-10-09 |
20140300010 | AERATOR WITH DUAL SPRAYING FUNCTIONS - Disclosed is an aerator with dual spraying functions, including a flow control assembly, a water separator, and a water dispenser that are combined with a housing. The flow control assembly and the water separator are combined together and the water separator and the water dispenser are rotatably connected to each other. The water separator has a surface in which discharge holes are formed. The water dispenser has an internal chamber having a circumferential portion in which needle-like water channels are formed to correspond to the water separator. Bubbling water passages are formed between the needle-like water channels and a central portion surrounded by the needle-like water channels defines a bubbling water channel. | 2014-10-09 |
20140300011 | APPARATUS AND METHOD FOR MANUFACTURING OPTICAL FILM - An exemplary apparatus for manufacturing an optical film includes a feed hopper, a platen, a first pressing roller group, and a second pressing roller group. The feed hopper is configured for providing resin. The platen and the first pressing roller group are arranged adjacent to the feeding hopper and spaced a predetermined distance to define a guiding channel. A second pressing roller group is arranged below the first pressing roller group and spaced the predetermined distance thereby defining a molding channel. The melted resin flows into the guiding channel and is pressed by the platen and the first pressing roller group, and is then rolled into the molding channel with rolling of the first pressing roller group. The first and the second pressing roller group are configured for forming microstructures on opposite surfaces of the optical film, respectively. A method for manufacturing the optical film is also provided. | 2014-10-09 |
20140300012 | METHODS MATERIALS AND SYSTEMS FOR PRODUCING A CONTACT LENS AND CONTACT LENSES PRODUCED USING SAID METHODS MATERIALS AND SYSTEMS - Disclosed are methods, materials and systems for producing contact lenses and contact lenses produced using said methods, materials and systems. According to some embodiments, a contact lens produced by said methods, materials and systems includes an extra-ocular indicator (“EOI”) adapted to alter in color upon removal of said lens from an eye. The EOI may be at least partially composed of a pigment adapted to become relatively more visible when the contact lens is outside an eye than when the contact lens is placed in an eye. | 2014-10-09 |
20140300013 | DENTAL ARTICLES USING NANOCRYSTALLINE MATERIALS AND METHODS OF MANUFACTURE - Method of forming dental articles by using relatively low sintering temperatures to achieve high density dental articles exhibiting strengths equal to and greater than about 700 MPa. Ceramic powders comprised of nanoparticulate crystallites are used to manufacture dental articles. The ceramic powders may include sintering agents, binders and other similar additives to aid in the processing of the ceramic powder into a dental article. The ceramic powders may be processed into dental articles using various methods including, but not limited to, injection molding, gel-casting, slip casting, or electroforming, hand, cad/camming and other various rapid prototyping methods. The ceramic powder may be formed into a suspension, pellet, feedstock material or a pre-sintered blank prior to forming into the dental article. | 2014-10-09 |
20140300014 | Dental Block - A system, method and composition for making a dental ceramics block. The system, method, and composition resulting in natural color matching without drying time between color layers. The system, method and composition also resulting in good color preparation on restorations of about 0.001 mm-1.000 mm thickness. | 2014-10-09 |
20140300015 | METHOD FOR PRODUCING BALLAST BODIES - The invention relates to a method for producing load transferring regions in a ballast body of a track superstructure by introducing curable liquid plastics or reactive plastic mixtures from a mixing unit by means of at least two distributor pipes with outlets into the load transferring regions and allowing the plastic or the reactive plastic mixture to cure in said load transferring regions. The two distributor pipes with outlets are positioned on the left or on the right from the outside of the rails into the region between the two rails such that the outlets are located adjacent to each other and are laterally spaced from the front face ( | 2014-10-09 |
20140300016 | IMPRINT APPARATUS, METHOD OF MANUFACTURING ARTICLE AND ALIGNMENT APPARATUS - The present invention provides an imprint apparatus comprising at least one first detector configured to detect a first number of first marks among a plurality of marks formed in the plurality of shot regions, a second detector having a field of view wider than that of the first detector, and configured to detect a second number of second marks different from the first marks among the plurality of marks, the second number being larger than the first number, and a controller configured to align the plurality of shot regions and the mold by using a detection result from the second detector. | 2014-10-09 |
20140300017 | ADDITIVE FABRICATION SUPPORT STRUCTURES - Some aspects provide a method of generating a support structure for an object, the support structure and the object to be fabricated via one or more additive fabrication techniques, comprising identifying one or more regions of the object as one or more regions to which mechanical support is to be provided, identifying one or more support points within at least a first region of the one or more regions, and generating the support structure for the object, the support structure comprising one or more support tips coupled to the object at the one or more support points, the support tips being generated based at least in part on a direction normal to the surface of the object at the respective support point. | 2014-10-09 |
20140300018 | PATTERN FORMING METHOD AND PATTERN FORMING APPARATUS - According to an aspect of the present invention, there is provided a pattern forming apparatus in which a mold having a pattern is brought into contact with an imprinting material on a substrate to transfer the pattern, the apparatus including: a holding part configured to hold the mold; a moving part configured to move the holding part so that the mold is brought into contact with the imprinting material on the substrate and that the mold is removed therefrom; and a control part configured to control so that at least one of conditions of removing the mold can be changed based on conditions of the pattern formed in the mold, the conditions including a rate and an angle of removing the mold. | 2014-10-09 |
20140300019 | INJECTION MOLDING FLOW CONTROL APPARATUS AND METHOD - A method and apparatus for performing an injection molding cycle comprising drivably interconnecting a valve pin to an electric motor actuator and controllably operating the electric motor to drive the valve pin at one or more reduced rates of upstream or downstream travel based on either detection of the position of the pin or actuator or on a preselected length of time at which to drive the valve pin. | 2014-10-09 |
20140300020 | SYSTEM AND METHOD OF MAKING MASONRY BLOCKS - A method of making a masonry block employing a mold assembly having a plurality liner plates each having a major surface that together form a mold cavity having an open top and an open bottom, wherein at least one liner plate is moveable between a retracted position and a desired extended position. The method includes providing a negative of a desired texture on the major surface of the moveable liner plate, moving the moveable liner plate to a retracted position, closing the bottom of the mold cavity by positioning a pallet below the mold assembly, filling the mold cavity with dry cast concrete via the open top, and vibrating the mold assembly and dry cast concrete therein. The method further includes moving the moveable liner plate toward a desired extended position after the mold cavity has been filled with dry cast concrete, before the open top of the mold cavity is closed, and while the mold assembly is vibrating, and closing the open top of the mold cavity with a head shoe assembly subsequent to commencement of the vibrating and the moving of the moveable liner plate toward the desired extended position. | 2014-10-09 |
20140300021 | Device for the manufacture of a bonded component from fibre-reinforced plastics and also a method - A device and method for the manufacture of a bonded component from fiber-reinforced plastics, with a base molding tool and a molding tool. The bonded component is arranged between the base molding tool and the molding tool. The bonded component has at least one base laminate and at least one reinforcement laminate. The molding tool is covered with an aeration material and with a vacuum envelope. The vacuum envelope is sealed with respect to the base molding tool by means of a seal. At least one matrix material film is arranged underneath at least one molding tool overhang, in at least some regions. Undesirable cavities within the device are primarily filled with material from the matrix material film, so that leakage flows of matrix material from the bonded component reduce during the autoclave process. By this means complex and cost-intensive rework of the bonded component is avoided. | 2014-10-09 |
20140300022 | DEVICE AND METHOD FOR MANUFACTURING PLASTIC CONTAINERS - An apparatus and method for the production of plastic containers, in particular, plastic tanks, for example, fuel tanks for motor vehicles. | 2014-10-09 |
20140300023 | METHOD FOR COATING A MOLDED PART - In a method for coating a molded part ( | 2014-10-09 |
20140300024 | NONWOVEN FABRIC FOR PRESS MOLDING, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING MOLDED PRODUCT - Provided is a nonwoven fabric for press molding and a molded product. With use of the nonwoven fabric, a fiberboard can be molded in a shorter time and even by 3D press molding a molded product with an excellent appearance quality can be obtained. The nonwoven fabric for press molding is formed of polylactic acid fibers and natural fibers, the polylactic acid fibers having a crystallization temperature on cooling of 120° C. or higher, the nonwoven fabric having a tensile strength of 20 N/cm | 2014-10-09 |
20140300025 | ORAL DISINTEGRATING TABLET - An oral disintegrating tablet containing (1) D-mannitol, (2) an active ingredient, (3) one or more disintegrating agents selected from the group consisting of crospovidone and carmellose, and (4) one or more lubricants selected from the group consisting of sodium stearyl fumarate and sucrose esters of fatty acids. The oral disintegrating tablet of the present invention has some excellent properties of (1) allowing easy production in a common facility without necessitating a specialized pharmaceutical technique, (2) having an appropriate strength that does not breakdown in the process of distribution, (3) having a fast disintegrating ability in the oral cavity, and (4) also having excellent ingestion feel such as greatly reduced bitterness or gritty feel; therefore, the tablet can be suitably used as a dosage form that is suitable for aged individuals, children, and seriously ill patients. | 2014-10-09 |
20140300026 | BIODEGRADABLE BEVERAGE CARRIER - A biodegradable liquid container carrier is made from molded pulp or fiber and is designed to grasp liquid containers at the top portion thereof. As a result, less material is used in the manufacture of the carrier. This is made possible by a combination of a wet end treatment with a fatty acid modified PET during processing of the pulp mass before forming the pulp mass into a liquid container carrier. A base coat that is 10-80% clay or pigment, 20-90% styrene-butadiene latex and 0-15% fatty acid modified PET and a top coat that is 75-100% fatty acid modified PET and 0-25% clay mixture onto the base coat are then applied to the molded liquid container carrier. These treatments greatly enhance the strength, rigidity and water-resistance of the carrier. However, the carrier is still biodegradable and will biodegrade in 90 days under composting conditions. | 2014-10-09 |
20140300027 | SYSTEMS AND METHODS FOR APPLYING A BRAID TO AN IRREGULAR CORE - Various methods ( | 2014-10-09 |
20140300028 | METHOD OF MAKING CONTINUOUS FILAMENT REINFORCED STRUCTURAL PLASTIC PROFILES USING PULTRUSION/COEXTRUSION - A system and method are disclosed for producing a continuous filament reinforced thermoplastic profile having consistent cross section. A continuous reinforcing filament is pre-wetted with a first thermoplastic resin and introduced into a die, where it is contacted with a second thermoplastic resin extruded from an extruder at melt state. The temperature of the die is carefully controlled so that the pre-wetted filament and first resin do not cure or solidify until after they have contacted and mixed with the second thermoplastic resin. The mixture temperature is then controlled to make a substantially solidified profile pre-shape. A capping layer comprising a third thermoplastic resin is then co-extruded onto the outer surface of the pre-shape. A multistage die for bringing together the filament and thermoplastic resins and for maintaining appropriate temperatures at each stage of the profile-forming process is also disclosed. | 2014-10-09 |
20140300029 | MOLDING ROLLER AND METHOD OF MANUFACTURING SAME - A molding roller includes a roller body and a molding film. The roller body includes a cylindrical surface. The molding film is coated on the cylindrical surface and includes a molding surface facing away from the cylindrical surface. A micro-structure pattern is formed on the molding surface. The molding film is made of polymer material including polyether-ether-ketone (PEEK). | 2014-10-09 |
20140300030 | METHOD OF MANUFACTURE OF PRODUCTS FROM GEOPOLYMER COMPOSITE - A method of manufacture of products from geopolymer composite shaped in a mold which is filled by casting of geopolymer composite in form of a precursor and after its hardening the casting is taken out from the mold and the casting surface is provided with a metallic layer. Before metal-plating casting surface with absorption capacity greater than 5% is treated to make it chemically stable so that pH of a leachate from 100 g of the bulk product in 1000 g distilled water after 24 hours does not exceed 9. In order to reduce the absorption capacity of the casting surface it is penetrated with polymer substances or particles of a non-porous filler are added into the geopolymer composite in the precursor state. The metallic layer on the casting surface is made by a method from the group of methods that include vacuum deposition, vacuum sputtering, galvanization, cold metal spraying, dip coating in melted metal, plasma spraying of melted metal, deposition of metal from metal salt solution or colloid solution or sintering of powder metal. | 2014-10-09 |
20140300031 | BINDER SYSTEM BASED ON POLYURETHANE FOR PRODUCING CORES AND CASTING MOLDS USING CYCLIC FORMALS, MOLDING MATERIAL MIXTURE, AND METHOD - A binder system for a molding mixture has at least one phenolic resin component, at least one isocyanate component and at least one solvent component, where the at least one solvent component is a cyclic formal, also known as a cyclic formaldehyde, with or without additional solvents. The phenolic resin component is prepared by reacting a phenol compound with an aldehyde compound. The isocyanate component has at least polyisocyanate that has at least two isocyanate groups per molecule. In the molding mixture, the binder is combined with a refractory molding material. | 2014-10-09 |
20140300032 | Method and apparatus for manufacturing waterproof footwear with attached compressible lining - A method and apparatus for making a lined waterproof footwear product, and footwear product formed therefrom, are provided. A last, having an exterior surface configured to correspond to the size and shape of the interior surface of the footwear product, is covered with a microcellular lining material. An injection mold comprises shells having a pre-determined configuration to mold an upper portion that attaches to the lining during the molding process. In the finished footwear product, the molded upper portion has a molded foot portion that extends around the wearer's foot and an upwardly-extending molded portion that covers a part of the lining while leaving another part of the lining uncovered. | 2014-10-09 |
20140300033 | PTFE LAYERS AND METHODS OF MANUFACTURING - Thin PTFE layers are described having little or no node and fibril microstructure and methods of manufacturing PTFE layers are disclosed that allow for controllable permeability and porosity of the layers. In some embodiments, the PTFE layers may act as a barrier layer in an endovascular graft or other medical device. | 2014-10-09 |
20140300034 | METHODS OF MANUFACTURING TAMPER- RESISTANT AND TAMPER EVIDENT CONTAINERS - A method of thermoforming a tamper-resistant/tamper-evident container includes forming a cover portion that includes an outwardly extending peripheral flange, forming a base portion including an upper peripheral rim and a skirt depending downwardly therefrom. The upper peripheral rim is configured to communicate with at least a portion of the outwardly extending peripheral flange of the cover portion to hinder access to the container when the container is closed. Forming a hinge joining the cover portion and the base portion such that the vertical height of the hinge correlates with the height of the skirt that depends downwardly from the base portion when the height of the skirt is substantially uniform around the perimeter of the container and forming at least one line of weakness in the hinge, the line of weakness is severed to facilitate removal of the cover portion from the base portion to open the container. | 2014-10-09 |
20140300035 | USE OF OPTIMIZED PISTON MEMBER FOR GENERATING PEAK LIQUID PRESSURE - Use of optimized piston member for generating peak liquid pressure. A one-step hydraulic blow molding system and method for forming a preform and a liquid filled container from the preform. The machine and method include a sealing mechanism that forms a seal primarily utilizing compressive forces in an axial direction to prevent the leakage of liquid blow medium. The sealing mechanism includes an axial end face of a forming head and an upper axial surface of a neck ring. | 2014-10-09 |
20140300036 | REFRACTORY PURGING DEVICES - A device for blowing gas into a metallurgical vessel contains at least one gas flow channel fluidly connecting a gas inlet located at one end to a gas outlet located at the opposite end. The channel is in the shape of a slit. The gas channel contains a series of continuous concave bridges connecting the opposing surfaces defining the channel, with their concave side oriented towards the gas outlet. The concave bridges are disposed in a staggered arrangement, such that any shortest line running from the gas outlet to the gas inlet of the channel necessarily intercepts the concave side of at least one bridge. The device is resistant to clogging by infiltrated molten metal or slag. | 2014-10-09 |
20140300037 | WHEEL WITH SUSPENSION SYSTEM AND CENTRALIZING UNIT WITH SUSPENSION SYSTEM - A wheel with a suspension system being connectable to a vehicle, like a wheel chair, comprises a hub ( | 2014-10-09 |
20140300038 | AIR SPRING - An air spring includes an upper surface plate, a lower surface plate, and a diaphragm connecting the upper surface plate and the lower surface plate. The diaphragm has an annular shape having an opening on an inner circumferential side. In the diaphragm, an upper surface plate contact portion, which is a region defining the opening and being in contact with the upper surface plate, includes a deformed portion elastically deformed to protrude toward the lower surface plate side by contact with a support plate. The deformed portion is in contact with a sliding member located on the lower surface plate side when viewed from the deformed portion. | 2014-10-09 |
20140300039 | NODAL SPRING ASSEMBLY FOR AN ELECTRONIC TOOTHBRUSH - A nodally mounted spring arrangement for a drive train which is used in an electronic toothbrush which includes a housing. A V shaped spring member ( | 2014-10-09 |
20140300040 | CHASSIS BUSHING WITH INTEGRATED TRAVEL LIMITER - A mold bonded chassis bushing has an outer housing and an inner member separated by a tubular gap. A body of elastomeric material is mold bonded into a first portion of the bushing such that it bridges and at least partially fills the gap. The elastomeric material does not fill or bridge the annular gap in a central area or a second portion of the bushing, such that a void is defined between the inner surface of the outer housing and the outer surface of the inner housing in the central area and second portion. A protrusion extends from the inner surface of the outer housing or the outer surface of the inner member, in the central area such that the void extends between the protrusion and the respective opposed surface. The protrusion functions as a travel limiter for the bushing without compressing the elastomeric material in the first portion. | 2014-10-09 |
20140300041 | KEY CLAMP ROTATION CONTROLLER - A key clamping device includes a first key clamp, a second key clamp and a rotational device connected to the first and second key clamps. The rotational device may facilitate rotation of the first and second key clamps. | 2014-10-09 |
20140300042 | STRAIGHT EDGE CLAMP - The present invention relates to a straight edge clamp that has a clamping head assembly and a stop assembly mounted upon the body of the straight edge. The head and stop are not connected together and the stop assembly is free to move with respect to the head assembly. The stop assembly has a locking assembly that allows it to be locked to the straight edge. The straight edge clamp body can include sections that are adapted to be connected together to form the overall length of the straight edge clamp. | 2014-10-09 |
20140300043 | FILM ALIGNMENT DEVICE - A film alignment device includes a stage on which a film is disposed and an alignment body above the stage, the alignment body and the stage being spaceable apart from and facing each other. The stage includes a plurality of guide parts at sides thereof. The alignment body includes a plurality of pins configured to move in the guide parts to align the film. | 2014-10-09 |
20140300044 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet feeding device includes a feeding tray, a conveying device, an ejecting tray, a feeding guide and a conveying rib. On the feeding tray, a sheet is placed. The conveying device feeds the sheet on the feeding tray to an image reading device. The ejecting tray receives the sheet after image reading. The feeding guide is configured to be movable in a direction intersecting a feeding direction of the sheet and to regulate a position in a width direction of the sheet on the feeding tray. The conveying rib is configured to be movable in interlocking with movement of the feeding guide and to lead the sheet to be ejected onto the ejecting tray. | 2014-10-09 |
20140300045 | METHOD OF USING SEPARATOR ROLL POSITIONER IN A REMOVABLE MEDIA DAM AND SEPARATOR ROLL SPEED TO CORRECT FEED ERRORS - A method of using a separator roll positioner and separator roll rotational speed to correct media feed errors by angularly rotating a separator roll between a retracted position and an extended position to adjust the height of the separator roll with respect to a media contact surface or by varying separator roll rotational speed thereby varying the media sheet separation force. | 2014-10-09 |
20140300046 | REMOVABLE MEDIA DAM WITH SEPARATOR ROLL POSITIONER FOR A MEDIA TRAY - A removable media dam for a media input tray. The removable media dam is mountable in a front wall of the media tray and may contain one or more rollers for feeding media from the media input tray. The removable media dam includes a separator roll positioner for angularly rotating a separator roll between a retracted position and an extended position to adjust the height of the separator roll with respect to a media contact surface thereby varying the media sheet separation force applied by the separator roll to media sheets being fed from the media tray. In one form, the removable media dam is mountable by a user without the use of tools. | 2014-10-09 |
20140300047 | PAPER POST-PROCESSING APPARATUS - A paper post-processing apparatus comprises a processing tray section; a post-processing section; a paper discharge tray section; a first chuck section configured to hold the rear end of the paper standing by in the buffer section; a second chuck section configured to hold the rear end of the paper loaded on the processing tray; and a third chuck section configured to hold the rear end of the paper loaded on the paper discharge tray; wherein a next paper is fed onto the paper held by the first chuck section in the buffer section, a paper is fed onto the paper held by the second chuck section from the buffer section in the processing tray section, and a paper is discharged onto the paper on the paper discharge tray held by the third chuck section from the processing tray section in the paper discharge tray section. | 2014-10-09 |
20140300048 | SHEET DISCHARGE TRAY AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A sheet discharge tray according to one aspect of the present disclosure includes an inclined support surface and a rib. The inclined support surface is inclined downward toward a sheet discharge portion and is configured to support a paper sheet discharged from the sheet discharge portion. The rib is provided along the inclined support surface. The rib has a larger elevation angle relative to a horizontal plane as compared to an angle of the inclined support surface. | 2014-10-09 |
20140300049 | SHEET RETENTION DEVICE - A sheet retention device is provided for retaining at least one sheet. The sheet retention device comprises a sheet supporting means for supporting at least a first portion of the sheet, a rotatable guiding means configured to enclose a second portion of the sheet, an urging means and a drive means for in operation controllably rotating the rotatable guiding means. The rotatable guiding means comprises a passageway arranged through the rotatable guiding means, which passageway is configured to enclose the second portion of the sheet, the passageway having an entrance portion at one side of an outer surface of the rotatable guiding means and an exit portion at another side of an outer surface of the rotatable guiding means. Said exit portion is arranged in the passageway at an opposite end with respect to the entrance portion. The rotatable guiding means comprises a sheet deflecting surface, wherein in operation during at least part of a revolution of the rotatable guiding means a portion of the sheet is guided by the sheet deflecting surface into a sheet retaining position. The sheet retaining position is defined by the outer surface of the rotatable guiding means and the urging means. The urging means are urged against a portion of the outer surface of the rotatable guiding means in said sheet retaining position. | 2014-10-09 |
20140300050 | Three-Dimensional Puzzle or Display Platform - A three-dimensional platform comprising a tessellated surface of pieces, each piece comprising a top and sides. The pieces comprise a fixed square piece having at least two opposing sides orientated acutely relative to the top to define a fixed square retention surface. The remaining surfaces orientate substantially perpendicular relative to the top. There is a mobile square piece having at least two opposing sides orientated obtusely relative to the top to define a mobile square retention surface. The remaining surfaces are oriented substantially perpendicular relative to the top. A mobile triangular piece having all sides orientated obtusely relative to the top. The fixed square retention surface indexes only with either the mobile square retention surface or the triangular piece surface to effect retention of the pieces to define the three-dimensional platform. | 2014-10-09 |
20140300051 | NUMBER GAMES AND WORD GAMES - A number game in which the object is to match a player's score to a target number, including a playing surface with a plurality of numbers therein and operators on the outside of the playing surface which includes at least one moveable playing piece. Whenever a playing piece is moved to one of the numbers on the playing surface, the player's score is changed based on that number and according to the mathematical function of the operator towards which the playing piece was moved. One embodiment of the invention is a word game in which each of the numbers on the playing surface has an associated letter. Movement of the playing piece from number to number in this version of the game necessarily also means movement of the playing piece to the number's associated letter. Each single play consists of a single continuous movement of the playing piece from letter to letter in an attempt to form a word. A temporary score is tabulated for each single play. When the single play results in a valid word being formed, the temporary score is added to the player's score. | 2014-10-09 |
20140300052 | GAME BOARD AND METHOD FOR PLAYING A STRATEGY GAME - A game board and method are disclosed for playing a strategy game. The strategy game provides a pyramid shaped game board that requires players to utilize stratagem to be first to reach the pyramid apex, while eliminating each other's playing pieces. Each players starts with playing pieces, such as marbles. The playing pieces start in a starting area located at a lowermost level, and advance up the pyramid to the apex. The players advance one space by moving the playing piece in any direction towards an open space. The players advance additional spaces by jumping their own playing piece, or opposing player's playing pieces. The jump over multiple playing pieces requires a space between each jumped playing piece. The player wins by reaching the apex first or eliminating all the opposing playing pieces. The player must have a last playing piece left to win when reaching the apex. | 2014-10-09 |
20140300053 | CRAPS GAME WITH A REPEATED NUMBER BASED WAGERING AREA - A craps game is disclosed that combines traditional craps wagers with a set of wagers having longer odds, and thus higher payouts, which are determined based upon the matching of a predefined set of numbers a specified number of times with the roll of the dice prior to the occurrence of a terminating event. In one form, the set of numbers is a single number. In a further form, at least one wager includes a specified number which matches the predefined number which makes up a single member set. | 2014-10-09 |
20140300054 | AMUSEMENT GAME WITH ROTATING TARGET - An amusement game with a rotating target displays different targets to players on opposing teams. Players on each team throw objects at the targets to score points. The rotating target includes sensors that sense if the object hits the target. | 2014-10-09 |
20140300055 | TARGET HANGER - A target hanger, comprising an L-shaped body having a first elongate portion and a second elongate portion, the first elongate portion having a first end and a second end, a first side edge and a second side edge, the second elongate portion extending perpendicularly outward from the first side edge at the second end of the first elongate portion. A first target receptacle is positioned on the first side edge of the first elongate portion and a second target receptacle is positioned on the second side edge of the first elongate portion. The first and second target receptacles being spaced from the second elongate portion by at least a distance that is greater than a thickness of a target board; the first and second target receptacles each being sized and shaped to receive and retain an outer edge of the target sufficiently to support the weight of the target. | 2014-10-09 |
20140300056 | Team Auto Racing Format - A method of automotive racing wherein at least two teams of vehicles race each other to determine the winning team to create an unparalleled, action-packed experience for fans of automotive racing. Such a racing format also allows for the successful creation of a racing league that offers fans home teams and a true playoff system with a championship race. | 2014-10-09 |