41st week of 2015 patent applcation highlights part 70 |
Patent application number | Title | Published |
20150289329 | Lighting Control System Using Input Voltage Dependent Control - A method and apparatus for controlling gain factor in a driver device for a lighting device according to the input voltage signal to reduce output current or output power dependency on the amplitude of the input voltage signal. One method couples an input voltage signal to the input port of the driver device and couples an output branch to the output port of the driver device. The gain factor is adjusted according to the input voltage signal to reduce output current or output power dependency on input voltage amplitude of the input voltage signal. The gain factor can also be configured according to a reference voltage and the output voltage across the output port to deliver a substantially constant output power. | 2015-10-08 |
20150289330 | LIGHT EMITTING DIODE DRIVING SYSTEM WITH CARRIER SIGNAL CONTROL - A rectifier rectifies an alternating current power to obtain a direct current power. The rectifier sends the direct current power to a driving power and carrier signal generation apparatus. The driving power and carrier signal generation apparatus generates a driving power. The driving power and carrier signal generation apparatus sends the driving power through a transmission line to at least a light emitting diode driving apparatus to drive at least a light emitting diode. The driving power and carrier signal generation apparatus generates a carrier signal. The driving power and carrier signal generation apparatus sends the carrier signal through the transmission line to the light emitting diode driving apparatuses. The light emitting diode driving apparatuses drive the light emitting diodes according to the carrier signals. | 2015-10-08 |
20150289331 | Two-Stage Multichannel LED Driver with CLL Resonant Circuit - Zero voltage switching (ZVS) is provided in switches of a switching circuit in a second stage of a power converter by an inductor of a CLL resonant circuit connected in parallel with both a primary winding of one or more transformers connected in series and an output of the switching circuit so that the parasitic output capacitances of the switches can be charged and discharged, respectively, during the dead-time of the switching circuit by current in the inductor and independently of current in the magnetizing inductance of the transformer. Therefore, the magnetizing inductance of the transformer can be made sufficiently large to balance currents delivered to respective loads that may be unbalanced as is particularly desirable for driving a plurality of LED strings for illumination and is consistent with controlled dimming of the LED strings. A current sensor such as a resistance can be place in any LED string and all transformer modules and string currents cross regulated, | 2015-10-08 |
20150289332 | HIGH EFFICIENCY LED DRIVERS WITH HIGH POWER FACTOR - The present invention relates to a high efficiency, high power factor LED driver for driving an LED device. In one embodiment, an LED driver can include: an LED current detection circuit coupled to the LED device, and configured to generate a feedback signal that represents an error between a driving current and an expected driving current of the LED device; a power stage circuit, where a first power switch terminal is coupled to a first input voltage, and a second power switch terminal is coupled to ground; and a control circuit configured to generate a control signal according to the feedback signal and a drain-source voltage of the power switch, where the control signal, in each switch period, turns on the power switch when the drain-source voltage reaches a low level, and turns off the power switch after a fixed time interval based on the feedback signal. | 2015-10-08 |
20150289333 | SYSTEM AND METHOD FOR POWERING AND CONTROLLING A SOLID STATE LIGHTING UNIT - The present disclosure provides a lighting system. In one example, the lighting system includes a circuit board including a plurality of light emitting groups and an integrated circuit electrically coupled to the light emitting groups and configured to receive a rectified sine waveform of a power source. The integrated circuit is configured to divide a half cycle of the rectified sine waveform into a plurality of voltage regions. The integrated circuit is also configured to turn on or off a number of the light emitting groups based on a voltage value in one of the voltage regions of the rectified sine waveform. | 2015-10-08 |
20150289334 | SYSTEM AND METHOD FOR POWERING AND CONTROLLING A SOLID STATE LIGHTING UNIT - The present disclosure provides a lighting system. In one example, the lighting system includes a circuit board including a plurality of light emitting groups, an integrated circuit electrically coupled to the light emitting groups, a rectifier circuit electrically coupled to the integrated circuit and configured to generate a rectified sine waveform of a power source, and a dimmer circuit electrically coupled to the integrated circuit and configured to transmit a dimming signal to the integrated circuit. In one case, the integrated circuit is configured to modify a power current of the light emitting groups to globally control an emission intensity of all of the light emitting groups uniformly in accordance with the dimming signal. | 2015-10-08 |
20150289335 | SYSTEM AND METHOD FOR POWERING AND CONTROLLING A SOLID STATE LIGHTING UNIT - The present disclosure provides a method for adjusting output of a lighting system. In one example, the method comprises providing to an integrated circuit a rectified sine waveform of a power source, providing to the integrated circuit a dimming signal corresponding to a dimming profile, modifying the rectified sine waveform into a truncated rectified sine waveform in accordance with the dimming signal, and selectively turning on or off a number of light emitting diodes in accordance with the truncated rectified sine waveform to produce a light output. | 2015-10-08 |
20150289336 | LED LIGHTING DEVICE AND METHOD OF CONTROLLING THE SAME - Provided are a light emitting diode (LED) lighting device and a method of controlling the same. The LED lighting includes an LED module in which a plurality of LED arrays having a plurality of LEDs connected in series are connected in parallel, a constant current supply configured to apply a constant current to the LED module, variable resistors connected to the | 2015-10-08 |
20150289337 | LIGHTING FIXTURE - A controller of a lighting fixture is configured to set a light modulation level of an LED to a first light modulation level in a period from a beginning of a night time slot until when a predetermined first time period elapses, regardless of a detection result of a human detecting sensor, and set the light modulation level of the LED to a second light modulation level that is lower than the first light modulation level when the first time period elapses. The controller is configured to set, when the human detecting sensor detects a person in a state where the light modulation level of the LED is set to the second light modulation level, the light modulation level of the LED to the first light modulation level for a predetermined time period. | 2015-10-08 |
20150289338 | AUTOMATIC CHROMA KEY BACKGROUND GENERATOR WITH INCIDENT KEY LIGHTING - Various embodiments relate to an apparatus for controlling a lighting device. A light control circuit can use a controlled lighting sequence control and drive viewed sections of a lighting device to display chroma key color or emit infrared light, while driving other unviewed portions of the lighting device to display ambient and incident lighting. The viewed and unviewed lighting sections can be based on the field of vision of an image capture device and can change in relation to movements of the image capture device. A sensor can make measurements to determine the field of vision of the image capture device and can be used to generate or modify the controlled lighting sequence. An image processing circuit can generate a composite image using the chroma key while maintaining the subjects that are captured using ambient and incident lighting. | 2015-10-08 |
20150289339 | LIGHT REGULATION METHOD, LIGHT REGULATION APPARATUS AND ADJUSTABLE LIGHT SOURCE - A light regulation method, a light regulation apparatus and an adjustable light source are provided. The light regulation method comprises: collecting environment parameter information in an illumination environment; acquiring a light regulation driving signal from the environment parameter information; and controlling at least one light emitting units on basis of the light regulation driving signal such that the at least one light emitting units work in a predetermined range of color temperature. The light regulation method, the light regulation apparatus and the adjustable light source may regulate the illumination light depending on the illumination environment to improve the comfort of the illumination. | 2015-10-08 |
20150289340 | LIGHTING DEVICE WITH VARIABLE COLOR RENDERING - The present disclosure relates to an LED-based lighting component that can control the color rendering capability of its generated light based on the presence or characteristics of ambient light. In one embodiment, the lighting component may employ at least two different types of LEDs to generate light. Control circuitry of the lighting component is able to monitor ambient light and drive the LEDs based on an ambient light characteristic that is indicative of the CRI of the ambient light. If the ambient light characteristic is indicative of the ambient light having a lower CRI, the control system will drive the LEDs to emit light with a defined CRI. If the ambient light characteristic is indicative of the ambient light having a higher CRI, the control system will drive the LEDs to emit light with a reduced CRI, which is lower than the defined CRI. | 2015-10-08 |
20150289341 | Light Emitting Device Driving Apparatus and Illumination System Including the Same - Disclosed is a light emitting device driving apparatus for controlling a light emitting unit including series-connected light emitting device arrays. The apparatus includes a rectifier for rectifying an AC signal, and outputting a ripple current signal according to a result of the rectification, a current adjuster for outputting a selection voltage, and a sequential driving controller connected to channel lines connected to respective output terminals of the light emitting device arrays, the sequential driving controller selectively establishing current paths between the light emitting device arrays and the channel lines, based on a voltage level of the ripple current signal, and adjusting an intensity of current flowing through the channel lines, based on the selection voltage. The current adjuster performs analog-digital conversion upon a setting voltage, generates a digital value according to a result of the analog-digital conversion, and outputs one of a plurality of selective voltages, based on the digital value. | 2015-10-08 |
20150289342 | Lensed Cable Light Systems - A light assembly includes an electroluminescent cable, an elongated lens, and a substantially planar substrate. The electroluminescent cable has an outer surface extending along a longitudinal dimension of the electroluminescent cable. The elongated lens extends along the longitudinal dimension of the electroluminescent cable and encloses at least a portion of the outer surface of the electroluminescent cable. The elongated lens is adapted to refract light emitted from the electroluminescent cable. The elongated lens structure is adhered to the substantially planar substrate. In certain instances, the substrate is a reflective substrate adapted to reflect light emitted from the electroluminescent cable. | 2015-10-08 |
20150289343 | ORGANIC EL DISPLAY DEVICE AND METHOD OF MANUFACTURING ORGANIC EL DISPLAY DEVICE - An organic EL display device includes: a lower electrode disposed in each of pixels; an upper electrode disposed so as to cover the whole of the display area; an organic layer disposed between the lower electrode and the upper electrode and composed of a plurality of layers including a light-emitting layer composed of an organic material; a wire formed outside the display area and composed of conductive material; and a tapered structure layer formed on the wire and including tapered portions at each of which a side surface portion not in contact with the wire extends so as to overhang the wire. At least one layer of the organic layer is formed on the tapered structure layer. The tapered structure layer forms a contact hole surrounded by the side surface portions. The upper electrode is in contact with the wire through the contact hole. | 2015-10-08 |
20150289344 | COMPOSITE LIGHT SOURCE SYSTEMS AND METHODS - A composite light source includes a plurality of illumination panels, that emit light of a fixed color and a variable luminous intensity. Over time, the luminous intensities of at least two of the illumination panels vary, while a combined luminous intensity of the illumination panels remains about constant. Another composite light source includes a plurality of illumination panels that emit light. Each illumination panel of at least a first subset of the plurality of illumination panels emits the light with a first luminous intensity, and each illumination panel of at least a second subset of the plurality of illumination panels emits the light with a second luminous intensity that is different from the first luminous intensity. | 2015-10-08 |
20150289345 | LIGHTING SYSTEM AND CONTROL METHOD THEREOF - The present invention relates to a lighting device including a radio communication unit for communicating with at least one device to receive an image of a space from the device, a light-emitting unit including at least one light-emitting element for providing light to the space, and a controller for controlling the light-emitting unit on the basis of an illuminance value calculated on the basis of the image. | 2015-10-08 |
20150289346 | Instrument Control Device, Instrument Control System, Instrument Control Method and Program - In the present invention, an instrument control device is provided with the following: a human detection sensor for detecting the presence or absence of a person in a specific region on the basis of temperature changes in the specific region; a tag correspondence communication device for communicating with a tag located in the specific region; and a communication unit for communicating with instruments that carry out a specific operation. The instrument control device is provided with an instrument operation control unit that causes an instrument to begin a specific operation in a case where the human detection sensor detects the presence of a person, and that causes the instrument to stop the specific operation in a case where no person is present as detected by the human detection sensor, and where the tag correspondence communication device is not communicating with the tag. | 2015-10-08 |
20150289347 | LIGHTING METHODS FOR PROVIDING PERSONALIZED LIGHTING TO USERS POSITIONED PROXIMAL TO ONE ANOTHER - Methods for providing personalized lighting to users ( | 2015-10-08 |
20150289348 | CONTROL DEVICE AND METHOD FOR DATA TRANSMISSION VIA A LOAD LINE - A data transmission from a control device ( | 2015-10-08 |
20150289349 | Lighting Apparatus Having Communication Module - Disclosed is a lighting apparatus. The lighting apparatus includes a lighting module to receive therein a lighting part that emits light to an outside and a power control part having a connector; and a communication module extending by passing through the lighting module and detachably coupled to the connector to transfer a control signal received through a wireless network to the power control part. | 2015-10-08 |
20150289350 | SYSTEM AND METHOD FOR REMOTE CONTROL OF ELECTRICAL APPLIANCE USING REFLECTED LIGHT - The invention addresses the problem of dependency of wireless control systems for electrical appliances on pre-existing control switches along with limited switching functionality. It relates to a system ( | 2015-10-08 |
20150289351 | LIGHT STRING - A light string includes a plurality of bulbs connected in series and powered by an AC power supply. Each bulb is connected in parallel with a capacitor, the capacitor is a polarized electrolytic capacitor, and capacitance of the capacitor is 47uF-120uF; a rated voltage of the capacitor is higher than a rated voltage of the bulb, and the rated voltage of the capacitor is 16V-100V; and when one bulb in the light string fails, the capacitor that is connected in parallel with the failed bulb operates normally; a positive plate and a negative plate of the capacitor connected in parallel with said each bulb are both covered with an oxide film insulating layer; when the light string is powered on, the oxide film insulating layer prevents breakdown and short circuit of the capacitor connected in parallel with said each bulb under the influence of a reverse voltage of the AC power. | 2015-10-08 |
20150289352 | X-RAY COMPUTED TOMOGRAPHY APPARATUS AND X-RAY GENERATION APPARATUS - According to on embodiment, an inverter high voltage generator includes a DC power supply, an inverter, a high voltage converter, a discharge detector, a controller. The DC power supply generates a direct current. The inverter converts the direct current from the DC power supply to an alternating current by switching. The high voltage converter converts an AC output pulse from the inverter to a high voltage. The discharge detector detects an electric discharge that has occurred in an X-ray tube. The controller controls, upon detection of the discharge, switching of the inverter to change a pulse width or a frequency of the AC output pulse from the inverter so as to gradually increase a measured tube voltage value of the X-ray tube up to a target tube voltage value. | 2015-10-08 |
20150289353 | LASER-DRIVEN LIGHT SOURCE - An apparatus for producing light includes a chamber and an ignition source that ionizes a gas within the chamber. The apparatus also includes at least one laser that provides energy to the ionized gas within the chamber to produce a high brightness light. The laser can provide a substantially continuous amount of energy to the ionized gas to generate a substantially continuous high brightness light. | 2015-10-08 |
20150289354 | PLASMA TORCH AND SYSTEM WITH ELECTROMAGNETIC SHIELD ASSIST MECHANISM - A plasma arc system includes a plasma torch having a torch nozzle with an opening at a distal end for a plasma jet to exit. An electromagnetic shield cap is disposed near the distal end of the torch nozzle with the shield cap having an opening that is coaxial with the opening of the torch nozzle. A plasma cutting power source supplies current to the torch to create the plasma jet. A magnetic field power source provides a current to the electromagnetic shield cap to generate a magnetic field near the plasma jet to focus the plasma jet as the plasma jet exits the torch nozzle. A controller synchronizes operation of the power sources during a transition from a piercing operation to a cutting operation. | 2015-10-08 |
20150289355 | HIGH FREQUENCY POWER SUPPLY DEVICE AND HIGH FREQUENCY POWER SUPPLYING METHOD - A high frequency power supply device and power supplying method are disclosed, which can rapidly and accurately control power used for generation of plasmas. The device includes a first high frequency power supply, providing power at frequency f | 2015-10-08 |
20150289356 | POWER MODULE - In a power module, a power semiconductor element is mounted on a heat dissipation substrate having a tilted part formed at an end portion thereof, a resin case is arranged so as to surround the power semiconductor element and to contact the heat dissipation substrate, and a cooling fin is arranged so as to contact a surface of the heat dissipation substrate opposite a surface of the heat dissipation substrate on which the power semiconductor element is mounted. The power module includes pressure member contacting the tilted part of the heat dissipation substrate to press the heat dissipation substrate against the cooling fin. | 2015-10-08 |
20150289357 | ELECTRONIC CONTROL DEVICE - The invention provides an electronic control. device having a high-grade heat sink that: does not require tight control at the time of manufacturing; is structurally simple; can be produced at a higher production rate; and is cost-effective. In this device, when a circuit board | 2015-10-08 |
20150289358 | HEAT RADIATION PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING THE SAME, BACKLIGHT UNIT INCLUDING THE SAME, AND LIQUID CRYSTAL DISPLAY DEVICE - Provided are a heat radiation printed circuit board and a method of manufacturing the same, the heat radiation printed circuit board being produced by the method including: forming a circuit layer having an insulating layer, a circuit pattern and a solder resist on a first area of one surface of a metal substrate; and forming a bending part in a second area, in which the insulating layer is not formed, by bending the metal substrate, whereby a crack can be prevented in advance from being generated in the insulating layer, and durability and reliability of the heat radiation printed circuit board and a backlight unit applying the same can be improved. | 2015-10-08 |
20150289359 | Circuit Card Apparatus And Methods - A circuit card apparatus includes a circuit card and a heat dissipation device in thermal contact with the circuit card at a thermal interface to conduct heat from the circuit card. An adjustable spacing element is adjustably coupled to one of the heat dissipation device and the circuit card. The adjustable spacing element is configured to be adjusted to set a minimum spaced distance between a portion of the circuit card and a portion of the heat dissipation device. A locking element is coupled to the adjustable spacing element to lock the minimum spaced distance. In further examples, methods of manufacturing a circuit card apparatus include the step of adjusting a spacing element to set the spaced distance as a minimum spaced distance between a portion of a heat dissipation device and a portion of a circuit card. The method further comprises the step of locking the minimum spaced distance. | 2015-10-08 |
20150289360 | CIRCUITS INCORPORATING INTEGRATED PASSIVE DEVICES HAVING INDUCTANCES IN 3D CONFIGURATIONS AND STACKED WITH CORRESPONDING DIES - A circuit including a die and an integrated passive device. The die includes a first substrate and at least one active device. The integrated passive device includes a first layer, a second substrate, a second layer and an inductance. The inductance includes vias, where the vias are implemented in the second substrate. The inductance is implemented on the first layer, the second substrate, and the second layer. A resistivity per unit area of the second substrate is greater than a resistivity per unit area of the first substrate. The third layer is disposed between the die and the integrated passive device. The third layer includes pillars, where the pillars respectively connect ends of the inductance to the at least one active device. The die, the integrated passive device and the third layer are disposed relative to each other to form a stack. | 2015-10-08 |
20150289361 | MICROELECTRONIC STRUCTURE INCLUDING AIR GAP - A microelectronic structure and a method for fabricating the microelectronic structure provide a plurality of voids interposed between a plurality of conductor layers. The plurality of voids is also located between a liner layer and an inter-level dielectric layer. The voids provide for enhanced electrical performance of the microelectronic structure. | 2015-10-08 |
20150289362 | PRINTED WIRING BOARD - A printed wiring board comprises a pattern layer, an insulating layer and a ground layer laminated in an upper-lower direction. The printed wiring board is formed with one or more vias. The insulating layer is provided between the pattern layer and the ground layer. The ground layer is formed with a ground pattern. The pattern layer is formed with one common ground plane and two or more pads. The pads are arranged in a lateral direction. The common ground plane is located forward of the pads in the front-rear direction. The vias include a first via that connects the common ground plane and the ground pattern with each other. The pads include one or more ground pads and one or more signal pads. The ground pads are connected with the common ground plane. The signal pads are unconnected with the common ground plane. | 2015-10-08 |
20150289363 | FLEXIBLE SUBSTRATE - A flexible substrate includes a substrate including interconnection wiring on a surface of or in the substrate, a component disposed on the surface of or in the substrate and electrically connected to the interconnection wiring, and an external connection conductor provided on the surface of the substrate. The substrate includes, when viewed two-dimensionally, a base portion where the external connection conductor is disposed, and a projecting portion projecting from the base portion. The projecting portion includes a first constricted portion provided at a connection to the base portion, and a first wide portion provided on an extension of the first constricted portion and having a width greater than that of the first constricted portion, with the component being disposed in the first wide portion. | 2015-10-08 |
20150289364 | STRETCHABLE DEVICE FOR TRANSMITTING SIGNAL - A stretchable device for transmitting signal between end points, such as a sensor and electronic unit, includes a conductive element, which is coupled with a supporting structure by introducing the conductive element successively through the thickness of the supporting structure to the first and second side of the supporting structure, thereby providing a corrugated structure for the conductive element, which is configured to be straighten out at least partially during stretching the device in its longitudinal direction. The conductive element is coupled with the supporting structure between first and second outer layers thereby providing the stretchable device. | 2015-10-08 |
20150289365 | Circuit Carrier With Interior Plating Lines and Peripheral Shielding - A dielectric substrate may serve as a circuit carrier for integrated circuits and other electrical components. The dielectric substrate may be formed from a dielectric material such as a ceramic substrate material, a printed circuit board substrate material, or other substrate material. The dielectric substrate may have a rectangular outline with four peripheral edge surfaces. The dielectric material may contain multiple layers that are laminated together and may support metal traces forming contacts and other interconnects. Integrated circuits and other electrical components may be mounted to the contacts. The metal traces may include electroplating lines that extend inwardly. The dielectric material may have a rectangular ring shape with a central rectangular opening having inner edge surfaces. The electroplating lines may be exposed along the inner edge surfaces. The four peripheral edge surfaces may be provided with a conductive electromagnetic interference shielding layer. | 2015-10-08 |
20150289366 | Electrically Conductive Articles - Articles comprising a substrate having a first major surface; an electrical conductor pattern on the first major surface of the substrate, the electrical conductor pattern comprising a plurality of separated pairs of separated first and second electrically conductive metallic traces. Optionally the articles further comprise a first electrically conductive layer. Embodiments of articles described herein are useful in, for example, displays, touch sensors, lighting elements, photovoltaic cells, electrochromic windows and displays, and electroluminescent lamps and displays. | 2015-10-08 |
20150289367 | BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY COMPRISING THE SAME - Provided are a backlight unit and a liquid crystal display including the backlight unit. The backlight unit includes a light emitting package, and a light guide plate disposed at one side of the light emitting package. The light emitting package includes a printed circuit board including first regions that are spaced an interval apart from each other and second regions defined between the first regions, light source units disposed on the first regions of the printed circuit board, dummy wiring patterns disposed on the second regions of the printed circuit board, and wiring patterns disposed on the printed circuit board and electrically connected to the light source units. | 2015-10-08 |
20150289368 | HYBRID PRINTED CIRCUIT BOARD CONSTRUCTION - A hybrid printed circuit board is described. The hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers. | 2015-10-08 |
20150289369 | Semiconductor Module - A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width W | 2015-10-08 |
20150289370 | DOUBLE-SIDED PATTERNED TRANSPARENT CONDUCTIVE FILM AND METHOD FOR MANUFACTURING THE SAME - A double-sided patterned transparent conductive film includes an upper surface conductive layer ( | 2015-10-08 |
20150289371 | SUBSTRATE (As Amended) - A substrate includes an insulating substrate, a metal layer formed on one surface of the insulating substrate, and an electronic component soldered to the surface of the metal layer. The metal layer is formed of a metal plate. The surface of the metal layer has a soldering area, and a groove portion positioned on the outer periphery of the soldering area. | 2015-10-08 |
20150289372 | FLUORESCENT CONDUCTIVE FILL MATERIAL FOR PLATED THROUGH HOLE STRUCTURES AND METHODS OF DEFECT INSPECTION UTILIZING THE SAME - A microelectronic substrate having a substrate core with at least one plated through hole extending therethrough, wherein the plated through hole includes a fluorescent conductive fill material. In one embodiment, the plated through hole may comprise a hole defined to extend from a first surface to an opposing second surface of the substrate core, wherein a conductive material layer is formed on a sidewall(s) of the substrate core hole and a conductive fill material, having a fluorescent component, is disposed to fill the remaining substrate core hole after forming the conductive material layer. In another embodiment of the present description, the fluorescent conductive fill material is used for the detection of defects. | 2015-10-08 |
20150289373 | METHOD FOR PRODUCING A FLEXIBLE CIRCUIT CONFIGURATION, FLEXIBLE CIRCUIT CONFIGURATION, AND ELECTRICAL CIRCUIT CONFIGURATION HAVING SUCH A FLEXIBLE CIRCUIT CONFIGURATION - For the production of a flexible circuit configuration, which contains a layer sequence and a film connected thereto, for the creation of through contacts through the film up to terminal surfaces of the layer sequence, it is proposed that the film be connected unstructured to the layer sequence provided in a defined position on the substrate and then, while the composite of layer sequence and film remains on the substrate, perforations be created through the film up to terminal surfaces of a conductive layer of the layer sequence and contact metal be deposited in structured form on the film and in the perforations as through contacts. | 2015-10-08 |
20150289374 | CONNECTOR - The instant disclosure relates to a connector including a wiring layer, a dielectric layer, a conductive structure, a first protective layer and at least one cantilever structure. The dielectric layer is disposed on the wiring layer, wherein the dielectric layer has at least one via hole to partially expose the wiring layer. The conductive structure is disposed on the inner wall of the at least one via hole of the dielectric layer and electrically connected to the wiring layer. The first protective layer is disposed on the dielectric layer. The cantilever structure is disposed between the first protective layer and the dielectric layer, wherein the at least one cantilever structure is electrically connected to the wiring layer via the conductive structure. | 2015-10-08 |
20150289375 | MODULE FOR FACILITATING POSITIONING OF ELECTRONIC COMPONENTS - This module includes an insulating substrate having a first surface and a second surface, which are positioned on opposite sides to each other, a first metal layer that is provided on the first surface of the insulating substrate and include a metal plate, a second metal layer provided on the second surface of the insulating substrate, a first circuit board including the insulating substrate, the first metal layer, and the second metal layer, an electronic component joined to the first metal layer, and a positioning portion, which is located on the joint surface between the first metal layer and the electronic component, at which the first metal layer and the electronic component are engaged with each other through a recess-projection relationship. The insulating substrate is located between the second metal layer and a part of the first metal layer where the positioning portion is located. | 2015-10-08 |
20150289376 | Networking Packages Based on Interposers - A package structure includes a networking unit including a plurality of switches/routers and a plurality of network interface units coupled to the plurality of switches/routers, and an interposer including a plurality of metal connections. The interposer is substantially free from functional elements built therein. A functional element is outside of, and bonded onto, the interposer, wherein the functional element is electrically coupled to the networking unit through the plurality of metal connections. | 2015-10-08 |
20150289377 | MANUFACTURING METHOD OF CONNECTOR - The instant disclosure relates to a manufacturing method of connector which comprises the following steps. The first step is to provide a substrate layer and forming a first metal layer on the substrate layer. The next step is to pattern the first metal layer to form a wiring layer. The next step is to form a dielectric layer on the wiring layer, wherein the dielectric layer is formed with at least one via hole to partially expose the wiring layer and a conductive structure arranged on the inner wall of the at least one via hole and electrically connected to the wiring layer. The next step is to form a first protective layer on the dielectric layer and at least one cantilever structure between the first protective layer and the dielectric layer. The last step is to remove the substrate layer. | 2015-10-08 |
20150289378 | METHOD OF PREPARING METAL PATTERN HAVING 3D STRUCTURE - The present application relates to a method of preparing a metal pattern having a 3D structure, a metal pattern laminate, and use of the metal pattern laminate. According to the method of preparing a metal pattern, the metal pattern having a 3D structure can be effectively formed on a receptor. Especially, the metal pattern having a 3D structure can also be effectively and rapidly transferred to a surface of the receptor, such as, a flexible substrate, to which the metal pattern is not easily transferred. The metal pattern laminate prepared using the method can, for example, be usefully used for metal layers of flexible electronic devices or metal interconnection lines. | 2015-10-08 |
20150289379 | Manufacture of a circuit board and circuit board containing a component - Method for the manufacture of a circuit board containing a component and circuit board containing a component. The invention is based on first manufacturing ( | 2015-10-08 |
20150289380 | WIRING BOARD AND METHOD OF FABRICATING THE SAME - A wiring board includes an electrode pad having a first surface and a second surface located on an opposite side from the first surface, a conductor pattern connected to the first surface of the electrode pad, and an insulator layer embedded with the electrode pad and the conductor pattern. The insulator layer covers an outer peripheral portion of the second surface of the electrode pad. | 2015-10-08 |
20150289381 | Method for producing a three-dimensional circuit configuration and circuit configuration - A method for producing a three-dimensional, injection-molded circuit configuration includes: providing at least two injection molds, in each case having at least one effective surface; applying an electrically conductive material on at least one of the effective surfaces of at least one of the injection molds, while forming electrically conductive patterns; forming a hollow space bounded by the effective surfaces of the at least two injection molds; introducing an insulating material into the hollow space using an injection molding process, and forming a circuit substrate completely or partially accommodating the conductive patterns; and removing from the injection molds the injection-molded circuit configuration having the conductive patterns and the circuit substrate. | 2015-10-08 |
20150289382 | PRODUCTION METHOD FOR PRINTED WIRING BOARD AND PRINTED WIRING BOARD PRODUCED BY SAID METHOD - This method includes the steps of forming a second resin layer ( | 2015-10-08 |
20150289383 | METHOD FOR FORMING HIGH-DEFINITION METAL PATTERN, HIGH-DEFINITION METAL PATTERN, AND ELECTRONIC COMPONENT - Provided are a method for forming a high-definition metal pattern which including the steps of (1) forming a receiving layer on a substrate by coating the substrate with a resin composition including a urethane resin having a weight-average molecular weight of five thousand or more or a vinyl resin and a medium, (2) forming a plating-core pattern on the receiving layer by printing an ink including a particle that serves as a plating core on the receiving layer by reverse offset printing, and (3) depositing a metal on the plating-core pattern by electroless plating, a high-definition metal pattern formed by the above-described method, and an electronic component including the high-definition metal pattern. | 2015-10-08 |
20150289384 | CONDUCTIVE FILM AND METHOD FOR MANUFACTURING SAME, AND RESIN ARTICLE WITH PLATING LAYER AND METHOD FOR MANUFACTURING SAME - There is provided with a conductive film. The conductive film has a resin article having a modified portion on a surface thereof, the modified portion being formed by irradiation with an ultraviolet laser and an oxidation process after the irradiation with the ultraviolet laser. The conductive film also has a conductor provided by plating on the modified portion irradiated with the ultraviolet laser. | 2015-10-08 |
20150289385 | MANUFACTURING METHOD OF POWER-MODULE SUBSTRATE - A manufacturing method of power-module substrate ( | 2015-10-08 |
20150289386 | ELECTRONIC COMPONENT MOUNTING SYSTEM - Component information including operating parameters for numerical determination of an operation mode of an electronic component mounting operation unit ( | 2015-10-08 |
20150289387 | METHOD FOR COMBINED THROUGH-HOLE PLATING AND VIA FILLING - The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole filling and filling of blind micro vias. The method utilizes a metal redox system and pulse reverse plating. | 2015-10-08 |
20150289388 | Modular Enclosure - An enclosure includes a plurality of modular construction units that connect together to at least partially define an internal compartment of the enclosure. Each construction unit comprises a wall segment extending a length from a corner end to a free end, and a corner segment extending outward from the corner end of the wall segment. The corner segment is integrally formed with the wall segment. The corner segment includes a receiver socket that is configured to receive the free end of another corresponding construction unit therein to connect the construction units together. The construction units connect together one after the other with a chasing symmetry to define the internal compartment of the enclosure. | 2015-10-08 |
20150289389 | Modular Enclosure - An enclosure includes a plurality of modular corner segments and a plurality of modular wall segments that connect together to at least partially define an internal compartment of the enclosure. The wall segments extending lengths between opposite free ends. At least a majority of the wall segments are fabricated from a polymer. Each corner segment includes opposite first and second receiver sockets that are each configured to receive a corresponding free end of a corresponding wall segment therein to connect the corner segment to the corresponding wall segments. At least a majority of the corner segments are fabricated from a polymer. The corner segments and the wall segments connect together to define the internal compartment of the enclosure. | 2015-10-08 |
20150289390 | DISPLAY APPARATUS - Disclosed is a display apparatus with an improved structure of its display unit and main body. The display apparatus includes: a display unit which includes a display connector and displays an image; and a main body which includes a power supply unit for supplying power to the display unit, an image processing unit for outputting image signals, and a main body connector which is directly or indirectly connected to the display connector in order to supply the power and the image signals output from the power supply unit and the image processing unit, respectively, to the display unit. | 2015-10-08 |
20150289391 | Power Conversion Apparatus and Electric Vehicle - The metallic case of a power conversion apparatus includes a casing having a side wall, as well as an upper case and a lower case, a first area being formed between a cooling jacket provided at the inner periphery of the side wall and the lower case, the metal base plate dividing the first area between the cooling jacket and the upper case into a lower side second area and an upper side third area, first and second power modules being fastened to a top surface and a capacitor module being provided in the first area, driving circuits that drive inverter circuits of the power modules respectively being provided in the second area, and a control circuit that controls the driver circuits being provided in the third area. | 2015-10-08 |
20150289392 | ELECTRONIC DEVICE MODULE AND MANUFACTURING METHOD THEREOF - An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors. | 2015-10-08 |
20150289393 | ELECTRONIC UNIT OF A FLUID SENSOR OR VALVE AND FLUID SENSOR OR FLUID VALVE UNIT - An electronic unit of a fluid sensor or fluid valve has a substantially cylindrical housing with a longitudinal axis and an open end face, which can be closed by a lid, several spacers formed as separate parts, which can be introduced into the housing in direction of the longitudinal axis and are directly stacked on top of each other. At least one spacer at least one electronic component is attached, which together with the spacer forms a premounted unit to be introduced into the housing. | 2015-10-08 |
20150289394 | MODULAR ELECTRONIC SYSTEM AND BUS SUBSCRIBER - A modular electronic system for receiving, processing or forwarding information. Devices comprise a housing including flat electromagnetically effective transfer elements in or on an insulating housing wall and at least one circuit board including flat electromagnetically effective transfer elements and electronic components. | 2015-10-08 |
20150289395 | ADAPTIVE PLUG FOR EDGE PROTECTION - Housings for electronic devices including adaptive plugs, and the use of adaptive plugs in methods of manufacturing housings. The housing may include an opening, and an adaptive plug releasably positioned within the opening. A method of forming a housing may include forming an opening within the housing, disposing a curable material within the opening of the housing, and curing the material to form an adaptive plug. The adaptive plug may be positioned within the opening of the housing. The method may also include performing at least one surface treatment on the housing. A method of protecting an edge of an opening in a housing may include providing the housing including the opening, forming an adaptive plug within the opening of the housing, and forming a barrier on the edge of the opening using the adaptive plug. | 2015-10-08 |
20150289396 | DISPLAY DEVICE - A display device including: a display panel; a chassis base that houses the display panel on one side and comprises at least one pair of supporting bosses on the other side; and a wall-mount holder that is connected to the pair of supporting bosses and includes a supporting rod coupling hole, wherein the pair of supporting bosses includes a first supporting boss and a second supporting boss, and wherein the first supporting boss and the second supporting boss include a guide pin and a screw groove. | 2015-10-08 |
20150289397 | IMAGE DISPLAY DEVICE - An image display device includes: a display to output an image; a frame to cover at least a partial upper portion of a rear surface of the display and form an appearance; and a back cover coupled to the frame to cover the rear surface of the display, wherein the back cover includes a first cover disposed in a horizontal direction and detachably coupled to the frame; a second cover coupled to the first cover and disposed to overlap with the first cover; and a fixing member disposed at an inner side of the first cover and the second cover and fixes the second cover to the first cover. | 2015-10-08 |
20150289398 | DISPLAY DEVICE - A display device includes a first cover member that is provided with a first frame surrounding a peripheral edge of a front surface of a display unit, a second cover member that is disposed on the front surface side of the first cover member and that is provided with a second frame that overlaps with the first frame, engaging protrusions that protrude from the front surface of the first frame or a rear surface of the second frame, and engaging recesses that are formed on a rear surface of the second frame, and that the engaging protrusions engage. | 2015-10-08 |
20150289399 | HOUSING ASSEMBLY - A housing assembly includes a first housing, a second housing, two first bolts, two second bolts, two first guiding rails and two second guiding rails. The first housing has a top board and two side boards. The second housing has a bottom board. The two first bolts and two second bolts are formed on the two side boards of the first housing. The two first guiding rails and two second guiding rails are formed on two sides of the bottom board of the second housing. Each first guiding rail has a first guiding groove, which includes a first vertical section, a first horizontal section, a first opening and a first fixing node. Each second guiding rail has a second guiding groove, which includes a second vertical section, a second horizontal section, a second opening and a second fixing node. | 2015-10-08 |
20150289400 | ELECTRONIC DEVICE HAVING SECURITY STRUCTURE - A electronic device includes a chassis, a panel, a cover and a security structure. The panel covers a side of the chassis. The cover covers another side of the chassis. The security structure includes a locking component, a positioning component and a linking shaft. The locking component is disposed on the panel and interfered with the chassis to lock the panel. The positioning component is disposed on the cover and interfered with the chassis to position the cover. The linking shaft is disposed between the locking component and the positioning component and stops the positioning component from being separated from the chassis. When a position of the locking component is adjusted to release the interference between the locking component and the chassis, the linking shaft is driven by the locking component to release the positioning component. | 2015-10-08 |
20150289401 | CASE AND WIRELESS COMMUNICATION DEVICE - A housing for storing therein a circuit board, includes: a through hole; an electrically conductive pattern passing through inner walls of the through hole so as to be stretched from the outside surface of the housing to the inside surface of the housing, and being electrically connected to the circuit board; and a plug member with which the through hole is filled, the through hole having openings on the outside and the inside, respectively, of the housing, and the opening on the outside of the housing being larger than the opening on the inside of the housing. | 2015-10-08 |
20150289402 | SMART USB MODULES AND METHOD OF MAKING - A system and method for data storage are disclosed. In a first aspect, the system comprises a printed circuit board, a central processing unit (CPU) coupled to the printed circuit board, an USB connector coupled to the CPU, and an USB receptacle connector coupled to the CPU. In a second aspect, the system is a smart USB device that includes a smart USB module and a USB drive coupled to the smart USB module. | 2015-10-08 |
20150289403 | SUBMERSIBLE POWER DISTRIBUTION SYSTEM AND METHODS OF ASSEMBLY THEREOF - A submersible power distribution system is provided. The system includes at least one receptacle configured to be exposed to an underwater environment and a plurality of power conversion modules positioned within the at least one receptacle. Each of the plurality of power conversion modules includes a first enclosure configured to be exposed to the underwater environment, the first enclosure defining a first interior cavity configured to have a first pressure. Power conversion modules also include at least one second enclosure positioned within the first interior cavity. The at least one second enclosure defines a second interior cavity configured to have a second pressure that is lower than the first pressure. The at least one second enclosure is configured to restrict exposure of non-pressure-tolerant power electronics in the second interior cavity to the first pressure. | 2015-10-08 |
20150289404 | FASTENING SYSTEMS FOR POWER MODULES - A fastening system for a power module ( | 2015-10-08 |
20150289405 | SYSTEM FOR BLIND MATE ADAPTING FIELD REPLACEABLE UNITS TO BAYS IN STORAGE RACK - A system for the management of rack-mounted field replaceable units (FRUs) that affords the enhanced availability and serviceability of FRUs provided by blade-based systems but in a manner that accommodates different types of FRUs (e.g., in relation to form factors, functionality, power and cooling requirements, and/or the like) installed within a rack or cabinet. | 2015-10-08 |
20150289406 | HIGH-DENSITY, FAIL-IN-PLACE SWITCHES FOR COMPUTER AND DATA NETWORKS - A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards. | 2015-10-08 |
20150289407 | Connector and Connector Assembly - A connector is provided and includes a bottom, a top case positioned above the bottom case, and a partition is positioned between the top case and the bottom case. A plurality of ports is provided between the top case and the bottom case and the ports are separated by the partition. A temperature exchange device is mounted on the bottom case. | 2015-10-08 |
20150289408 | Silicon-Based Cooling Package For Cooling And Thermally Decoupling Devices In Close Proximity - Various embodiments of an apparatus that simultaneously cools and thermally decouples adjacent electrically-driven devices in close proximity are provided. In one aspect, an apparatus comprises a first non-silicon heat sink and a first silicon-based heat sink disposed on the first non-silicon heat sink. The first silicon-based heat sink is configured to receive a first electrically-driven device on a first portion of the first silicon-based heat sink and to receive a second electrically-driven device on a second portion of the first silicon-based heat sink. The first silicon-based heat sink includes a first groove or a first opening between the first portion and the second portion such that a heat conduction path between the first electrically-driven device and the first non-silicon heat sink through the first silicon-based heat sink is shorter than a heat conduction path between the first electrically-driven device and the second electrically-driven device through the first silicon-based heat sink. | 2015-10-08 |
20150289409 | Electronic Device With Combination Heat Sink/Blower Or Fan Assembly - An electronic device is provided. The electronic device includes a circuit board having heat generating components thereon. The electronic device further includes a heat sink with air current generating electric device assembly, disposed over the circuit board, through which heat from the circuit board and the components thereon is released. The heat sink with air current generating electric device assembly includes a heat sink having a solid central core and a plurality of fins protruding from the core. The heat sink with air current generating electric device assembly further includes an air current generating electric device disposed over the heat sink and having an air intake facing a top of the heat sink and an exhaust opening directed parallel to a plane of the circuit board. | 2015-10-08 |
20150289410 | ELECTRONIC DEVICE WITH COOLING BY A LIQUID METAL SPREADER - An electronic device with cooling of a heat dissipation source, by a liquid metals spreader, the device including at least one heat dissipation source, at least one spreader through which at least one liquid metal circulation channel passes forming a loop routed below a heat dissipation source, at least one heat sink, and at least one electromagnetic pump moving the liquid metal in the at least one channel such that the liquid metal absorbs heat dissipated by a heat dissipation source and transports the absorbed heat to be evacuated by the heat sink. Each spreader includes at least two plates made of an electrical insulating material located on each side of at least one bar made of deformable material. | 2015-10-08 |
20150289411 | INVERTER DEVICE - An inverter device includes: a housing; semiconductor modules; a first heat exchanger having a first passage, wherein a heat generating component is thermally coupled to the first heat exchanger; a second heat exchanger provided inside the housing; a supply port connected to a supply pipe for supplying coolant; a discharge port connected to a discharge pipe, wherein the discharge pipe discharges coolant from the first heat exchanger or the second heat exchanger to a coolant supply source; a discharge port connected to a discharge pipe, which discharges coolant from the first heat exchanger or the second heat exchanger to the coolant supply source; and communication lines which allow the first passage and a second passage to communicate with each other. | 2015-10-08 |
20150289412 | FORMED HOSE WITH DIFFERENT FIBER-REINFORCED REGIONS - Formed hose configurations are provided which include an innermost elastomer layer, a first fiber-reinforcement region, and multiple second fiber-reinforcement regions. The first fiber-reinforcement region has a first fiber-reinforcement density, and is disposed, at least in part, at a bend region of the formed hose, and the multiple second fiber-reinforcement regions have a second fiber-reinforcement density, and are disposed at least at the first and second end regions of the formed hose. The second fiber-reinforcement density is greater than the first fiber-reinforcement density, and results in the first and second ends of the formed hose being less radially-deformable than the bend region of the hose. This facilitates providing a mechanical fluid-tight connection with a hose barb fitting when the formed hose is slid over the hose barb fitting, absent any clamp over the formed hose and hose barb fitting connection. | 2015-10-08 |
20150289413 | SYSTEMS AND METHODS FOR USING ADDITIVE MANUFACTURING FOR THERMAL MANAGEMENT - According to one embodiment, a thermal management system for electronic devices, including a heat frame, a conformal slot portion, chassis frame, and heat fins wherein the heat frame, conformal slot, chassis frame, and heat fins are integrally formed as a unitary structure by additive manufacturing. In another example, there is a modular vapor assembly for electronic components having a vapor chamber comprising a component surface and a top surface with a vapor channel formed therebetween with at least one liquid receptacle and having a wick structure on at least some of an interior of the component surface. In operation, there is a circuit card with at least some of the electronic components coupled to the vapor chamber component surface and the wick structures transfer at least some of the liquid from the receptacle towards the electronic components, wherein the liquid turns to a vapor that moves towards the receptacle. | 2015-10-08 |
20150289414 | METHOD AND APPARATUS FOR COOLING ELECTONIC COMPONENTS - An apparatus for cooling electronic devices to be used in the vacuum of space is described. a window frame is provided as packaging for an electronic device having a substrate and a chip. The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip. The window frame is hermetically sealed to the backside of the chip. The window frame is also welded to a kovar ring located on the backside of the chip to provide a hermetic seal between the window frame and the substrate. | 2015-10-08 |
20150289415 | COOLING FIN AND HEAT DISSIPATION MODULE HAVING THE SAME - A cooling fin, applied in a heat dissipation module, includes a fin body, a penetration portion, and at least one bending portion. The penetration portion is formed on the fin body and includes a slot, a first bending wall, and a second bending wall. The first bending wall and the second bending wall are formed at the opposite sides of the slot. The bending portion is formed on the fin body and adjacent to one end of the slot. | 2015-10-08 |
20150289416 | SILICON-BASED HEAT-DISSIPATION DEVICE FOR HEAT-GENERATING DEVICES - Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device. | 2015-10-08 |
20150289417 | SERVER CABINET - A server cabinet includes a bottom wall, a top wall, two opposite side walls, two air inlet tubes each with a number of openings, a number of servers, a number of air distributing tubes received in the servers, a number of rotating members rotatably installed to the air inlet tubes, and a number of resilient members installed to the air inlet tubes. Each server defines a number of vents aligning with the corresponding openings of the air inlet tubes. Each air distributing tube communicates with the vents of the corresponding server. The air inlet tubes are attached to the side walls. Each air distributing tube defines a number of air outlets communicating with the corresponding server. Each rotating member includes a shielding plate. Each resilient member abuts against the corresponding shielding plate to cover the corresponding opening of the air inlet tubes. | 2015-10-08 |
20150289418 | ELECTRICAL MACHINE HAVING A SHIELDING PLATE - Electrical machine ( | 2015-10-08 |
20150289419 | HIGH-FREQUENCY MODULE - A high-frequency module includes a substrate, an integrated circuit mounted to the substrate, a cylindrical shield enclosing the integrated circuit to block radio waves, a casing provided on an opposite side of the substrate relative to the shield to block radio waves, and a choke portion provided in an inner wall of the casing, the inner wall being opposed to the shield, or provided in the substrate, with a predetermined gap being formed relative to the shield, to create an antiphase in radio waves having a predetermined frequency emitted from the integrated circuit into a space above the substrate. | 2015-10-08 |
20150289420 | WIRING MEMBER - A wire harness includes first to third electric wires, a braid shield that covers the first to third electric wires, and a tube-shaped electromagnetic wave absorber having a through hole that allows the first to third electric wires to be inserted therethrough, the electromagnetic wave absorber absorbing electromagnetic waves emitted from the first to third electric wires. The braid shield covers an outer circumferential surface and two axial end surfaces of the electromagnetic wave absorber to restrict movement of the electromagnetic wave absorber in an axial direction. The braid shield satisfies 1≦n≦15 and 10≦m≦50 where the number of carriers of the braid shield is denoted by n and the number of ends of the braid shield is denoted by m. | 2015-10-08 |
20150289421 | APPARATUS FOR AN EMP SHIELD FOR COMPUTING DEVICES - An apparatus includes a first electrically conductive mesh material having a transparent material that is configured for venting heat from a computing device. The first electrically conductive mesh material is configured to be flexible for folding to enclose the computing device. The first electrically conductive mesh material is configured for mitigating electro-magnetic pulse damage to the enclosed computing device. A second electrically conductive mesh material has a transparent material that is configured for venting heat from the computing device. The second electrically conductive mesh material is configured to be flexible for folding to enclose the first electrically conductive mesh material. The second electrically conductive mesh material is configured for mitigating electro-magnetic pulse damage to the enclosed computing device. At least one sealing member electrically seals the first electrically conductive mesh material and the second electrically conductive mesh material about the computing device. | 2015-10-08 |
20150289422 | POTENTIAL EQUALIZATION IN A CONTROL DEVICE FOR A MOTOR VEHICLE - An arrangement for potential equalization in a control device for a motor vehicle includes at least one electrical component on a circuit carrier, a carrier structure on which the circuit carrier is arranged, and at least one contacting element that electroconductively connects the circuit carrier to the carrier structure by way of a connecting element that forms a potential equalization. The contacting element has a bondable surface coating. | 2015-10-08 |
20150289423 | WIRING MEMBER - A wire harness includes first to third electric wires; a braid shield that covers the first to third electric wires; a tube-shaped electromagnetic wave absorber having a through hole that allows the first to third electric wires to be inserted therethrough, the electromagnetic wave absorber absorbing electromagnetic waves emitted from the first to third electric wires; and a resin tape and fasteners that fix the positions of the electromagnetic wave absorber and the braid shield relative to each other. The electromagnetic wave absorber is movable in an axial direction of the first to third electric wires relative to the first to third electric wires as a result of extension and contraction of the braid shield in the axial direction. | 2015-10-08 |
20150289424 | Grid Topography For Patterned Semiconductor Coating That Minimizes Optical Scatter And Obscuration - A surveillance device includes an electronic component and a protective surface outwardly of the electronic component. A generally transparent substrate is formed from a first material. Spaced portions of an electrically conductive coating are formed within channels in the substrate. The electrically conductive material is a semiconductor material. A method is also disclosed. | 2015-10-08 |
20150289425 | MOLDED FIBER-REINFORCED COMPOSITE MATERIAL PRODUCT AND METHOD OF PRODUCING THE SAME - A molded fiber-reinforced composite material product having a thin sheet shape, includes: an electromagnetic wave blocking prepreg made of conductive fibers and a thermosetting matrix resin; an electromagnetic wave transparent prepreg made of non-conductive fibers and a thermosetting matrix resin; a first layer formed by joining the electromagnetic wave blocking prepreg and the electromagnetic wave transparent prepreg together at a joining line perpendicular to the thickness direction of the molded fiber-reinforced composite material product; a second layer formed on the first layer and including the electromagnetic wave transparent prepreg disposed to cover at least a portion of the joining line; and an electromagnetic wave transparent section not including the electromagnetic wave blocking prepreg in the thickness direction. | 2015-10-08 |
20150289426 | ELECTRONIC COMPONENT MOUNTING SYSTEM - In a case where a solder amount of a solder portion printed on an electrode does not meet a reference amount, solder is additionally applied to a center position of the electrode by a control section. With respect to a component mounting position to which the solder is not additionally applied, correction from a component mounting position of a substrate to a corrected mounting position is performed and an electronic component is mounted at the corrected mounting position. The electronic component corresponding to another component mounting position with the solder additionally applied thereto is mounted at the design component mounting position in the positioned substrate. | 2015-10-08 |
20150289427 | CARRIER TAPE - The present invention is directed to a carrier tape having pockets for carrying electronic components. The carrier tape includes a longitudinally extending elevated central portion having a plurality of pockets formed therein and two side portions, each side portion disposed on opposite sides of the elevated central portion and extending longitudinally therewith, wherein each side portion is attached to the elevated central portion by an inclined portion such that the central portion is higher than the side portions when disposed in a flat configuration. | 2015-10-08 |
20150289428 | Apple tree named "MILLY' - A new and distinct | 2015-10-08 |