40th week of 2014 patent applcation highlights part 20 |
Patent application number | Title | Published |
20140291827 | Lead Frame and Semiconductor Device - A lead frame includes an outer lead and a plating layer that covers a lower surface and side surfaces of the outer lead. The plating layer does not cover the upper surface of the outer lead. A frame base material is exposed from the plating layer at the upper surface of the outer lead. | 2014-10-02 |
20140291828 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device includes: a semiconductor element having an electrode facing a first direction; a first lead having a conductive distal end surface facing the electrode, and a rising portion which is connected to the distal end surface to extend away from the electrode; a conductive bonding material bonding the electrode of the semiconductor element to the distal end surface of the first lead; and a sealing resin covering the semiconductor element, at least a portion of the first lead, and the conductive bonding material | 2014-10-02 |
20140291829 | ADHESIVE BONDING TECHNIQUE FOR USE WITH CAPACITIVE MICRO-SENSORS - A micro-sensor device that includes a passivation-protected ASIC module and a micro-sensor module bonded to a patterned cap provides protection for signal conditioning circuitry while allowing one or more sensing elements in the micro-sensor module to be exposed to an ambient environment. According to a method of fabricating the micro-sensor device, the patterned cap can be bonded to the micro-sensor module using a planarizing adhesive that is chemically compatible with the sensing elements. In one embodiment, the adhesive material is the same material used for the dielectric active elements, for example, a photo-sensitive polyimide film. | 2014-10-02 |
20140291830 | SEMICONDUCTOR PACKAGES HAVING PACKAGE-ON-PACKAGE STRUCTURES - A semiconductor package includes a lower package with a lower semiconductor chip on a lower package substrate, and an upper package with an upper semiconductor chip on an upper package substrate. The upper semiconductor chip has a plurality of chip pads and the upper package substrate has a plurality of substrate pads. The upper package is stacked on the lower package. The chip pads have a first pitch and the substrate pads have a second pitch greater than the first pitch. The upper package substrate has a plurality of connection lines that electrically connect the substrate pads to the chip pads. | 2014-10-02 |
20140291831 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE - A semiconductor device includes a metallic plate, a bonding layer, a semiconductor chip, and a resin molding. The semiconductor chip is fixed to the metallic plate with the bonding layer. The resin molding is in contact with the metallic plate, and covers the semiconductor chip. In the semiconductor device, a dent is provided in the metallic plate so that the dent is located next to an edge of a fillet of the bonding layer, in a plan view of the metallic plate. | 2014-10-02 |
20140291832 | INTEGRATED COOLING MODULES OF POWER SEMICONDUCTOR DEVICE - A semiconductor module is disclosed having at least one power semiconductor device, wherein the at least one power semiconductor device has first and second planar sides; a first thermally conductive substrate in thermal contact with the first planar side of the power semiconductor device; a first cooling module defining a first cavity, the first cavity in thermal contact with the first thermally conductive substrate, and the first cooling module in mechanical connection with the first thermally conductive substrate; a first inlet provided in the first cavity for receiving a coolant; a first outlet provided in the first cavity for discharging said coolant; wherein the power semiconductor device is in coolant-proof isolation from the cavity. | 2014-10-02 |
20140291833 | SEMICONDUCTOR DEVICE - In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the cooler. The cooler has a pressed part in which the semiconductor module is pressed, and a strut fixing part to which the strut is fixed. The strut fixing part has higher rigidity than the pressed part. | 2014-10-02 |
20140291834 | SEMICONDUCTOR DEVICES AND PACKAGES INCLUDING CONDUCTIVE UNDERFILL MATERIAL AND RELATED METHODS - Semiconductor devices and device packages include at least one semiconductor die electrically coupled to a substrate through a plurality of conductive structures. The at least one semiconductor die may be a plurality of memory dice, and the substrate may be a logic die. An underfill material disposed between the at least one semiconductor die and the substrate may include a thermally conductive material. An electrically insulating material is disposed between the plurality of conductive structures and the underfill material. Methods of attaching a semiconductor die to a substrate, such as for forming semiconductor device packages, include covering or coating at least an outer side surface of conductive structures, electrically coupling the semiconductor die to the substrate with an electrically insulating material, and disposing a thermally conductive material between the semiconductor die and the substrate. | 2014-10-02 |
20140291835 | IC Package with Integrated Waveguide Launcher - Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate. | 2014-10-02 |
20140291836 | SEMICONDUCTOR DEVICE - A semiconductor device includes a substrate having a plurality of electrodes and a plurality of leads that are connected to the electrodes and a semiconductor element that is mounted on the substrate. The semiconductor element has a rectangular shape including a long side, a short side, and a corner portion, and has bumps connected to the electrodes. An underfill is filled between the substrate and the semiconductor element and extends on the substrate around the semiconductor element. An overcoat covers the leads on the substrate. At least one of the plurality of leads that is connected to the electrode corresponding to the bump arranged nearest to the corner portion along the long side of the semiconductor element has at least two successive bent portions that are bent in the same direction and is laid out toward the short side of the semiconductor element in a plan view. | 2014-10-02 |
20140291837 | EMBEDDED PACKAGE AND METHOD FOR MANUFACTURING THE SAME - An embedded package includes a semiconductor chip divided into a cell region and a peripheral region, having a first surface and a second surface which faces away from the first surface, and including an integrated circuit which is formed in the cell region on the first surface, a bonding pad which is formed in the peripheral region on the first surface and a bump which is formed over the bonding pad; a core layer attached to the second surface of the to semiconductor chip; an insulation component formed over the core layer including the semiconductor chip and having an opening which exposes the bump; and a circuit wiring line formed over the insulation component and the bump and electrically connected to the bump, wherein the insulation component formed in the cell region has a thickness larger than a height of the bump. | 2014-10-02 |
20140291838 | Design Scheme for Connector Site Spacing and Resulting Structures - A system and method for preventing cracks in a passivation layer is provided. In an embodiment a contact pad has a first diameter and an opening through the passivation layer has a second diameter, wherein the first diameter is greater than the second diameter by a first distance of about 10 μm. In another embodiment, an underbump metallization is formed through the opening, and the underbump metallization has a third diameter that is greater than the first diameter by a second distance of about 5 μm. In yet another embodiment, a sum of the first distance and the second distance is greater than about 15 μm. In another embodiment the underbump metallization has a first dimension that is less than a dimension of the contact pad and a second dimension that is greater than a dimension of the contact pad. | 2014-10-02 |
20140291839 | Solder Joint Flip Chip Interconnection - A flip chip interconnect has a tapering interconnect structure, and the area of contact of the interconnect structure with the site on the substrate metallization is less than the area of contact of the interconnect structure with the die pad. Also, a bond-on-lead or bond-on-narrow pad or bond on a small area of a contact pad interconnection includes such tapering flip chip interconnects. Also, methods for making the interconnect structure include providing a die having interconnect pads, providing a substrate having interconnect sites on a patterned conductive layer, providing a bump on a die pad, providing a fusible electrically conductive material either at the interconnect site or on the bump, mating the bump to the interconnect site, and heating to melt the fusible material. | 2014-10-02 |
20140291840 | STACKED SEMICONDUCTOR PACKAGE - A stacked semiconductor chip includes a main substrate supporting a semiconductor chip module, wherein the semiconductor module comprises at least two sub semiconductor chip modules each having a sub substrate in which a first semiconductor chip is embedded and at least two second semiconductor chips are stacked on the sub substrate. | 2014-10-02 |
20140291841 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SAME, AND ELECTRONIC COMPONENT - [Problem] To provide a semiconductor device both capable of greatly reducing the size of a through electrode and capable of reducing the size of a surface electrode and provide a method for manufacturing a semiconductor device capable of reliably bringing a through electrode into contact with a surface electrode regardless of the size of the surface electrode. | 2014-10-02 |
20140291842 | ENHANCED FLIP-CHIP DIE ARCHITECTURE - A method of assembling a multi-chip electronic device into a thin electronic package entails inverting a flip-chip die arrangement over a hollow substrate, stacking additional dies on the hollow substrate to form a multi-chip electronic device, and encapsulating the multi-chip electronic device. Containment of the encapsulant can be achieved by joining split substrate portions, or by reinforcing a hollow unitary substrate, using a removable adhesive film. Use of the removable adhesive film facilitates surrounding the multi-chip electronic device with the encapsulant. The adhesive film can also prevent encapsulant from creeping around the substrate to an underside of the substrate that supports solder ball pads for subsequent attachment to a ball grid array (BGA) or a land grid array (LGA). | 2014-10-02 |
20140291843 | HYBRID SOLDER AND FILLED PASTE IN MICROELECTRONIC PACKAGING - Hybrid solder for solder balls and filled paste are described. A solder ball may be formed of a droplet of higher temperature solder and a coating of lower temperature solder. This may be used with a solder paste that has an adhesive and a filler of low temperature solder particles, the filler comprising less than 80 weight percent of the paste. The solder balls and paste may be used in soldering packages for microelectronic devices. A package may be formed by applying a solder paste to a bond pad of a substrate, attaching a hybrid solder ball to each pad using the paste, and attaching the package substrate to a microelectronic substrate by reflowing the hybrid solder balls to form a hybrid solder interconnect. | 2014-10-02 |
20140291844 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - Provided are a semiconductor device having a stably formed structure capable of being electrically connected to a second electronic device without causing damage to the semiconductor device, and a manufacturing method thereof. In one embodiment, the semiconductor device may comprise a semiconductor die, an encapsulation part formed on lateral surfaces of the semiconductor die, a dielectric layer formed on the semiconductor die and the encapsulation part, a redistribution layer passing through a part of the dielectric layer and electrically connected to the semiconductor die, a plurality of conductive balls extending through other parts of the dielectric layer and electrically connected to the redistribution layer where the conductive balls are exposed to an environment outside of the semiconductor device, and conductive vias extending through the encapsulation part and electrically connected to the redistribution layer. | 2014-10-02 |
20140291845 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - An inventive semiconductor device includes a semiconductor chip having a passivation film, and a sealing resin layer provided over the passivation film for sealing a front side of the semiconductor chip. The sealing resin layer extends to a side surface of the passivation film to cover the side surface. | 2014-10-02 |
20140291846 | ARRAY SUBSTRATE AND FANOUT LINE STRUCTURE OF THE ARRAY SUBSTRATE - A fanout line structure of an array substrate includes a plurality of fanout lines arranged on a fanout area of the array substrate, where the fanout line is used to connect a signal line with a bonding pad. Lengths of different fanout lines are different. At least one fanout line includes a first subsection and a second subsection. An electrical resistivity of material of the second subsection of the fanout line is greater than an electrical resistivity of material of the first subsection of the fanout line. Length of a first fanout line is greater than length of a second fanout line, and length of a second subsection of the second fanout line is greater than length of a second subsection of the first fanout line. | 2014-10-02 |
20140291847 | METHODS OF FORMING A BARRIER SYSTEM CONTAINING AN ALLOY OF METALS INTRODUCED INTO THE BARRIER SYSTEM, AND AN INTEGRATED CIRCUIT PRODUCT CONTAINING SUCH A BARRIER SYSTEM - One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier system comprised of at least one barrier material and at least two metallic elements, and performing a heating process to form a metal alloy comprised of the at least two metallic elements in the barrier system. Also disclosed is a device that comprises a trench/via in a layer of insulating material, a barrier system positioned in the trench/via, wherein the barrier system comprises at least one barrier material and a metal alloy comprised of at least two metallic elements that are comprised of materials other than the at least one barrier material, and a conductive structure positioned in the trench/via above the barrier system. | 2014-10-02 |
20140291848 | SEMICONDUCTOR DEVICE - A semiconductor device may include pillars and a plurality of conductive layers being stacked while surrounding the pillars and including a plurality of first regions including non-conductive material layers and a plurality of second regions including conductive material layers, wherein the first regions and the second regions are alternately arranged. | 2014-10-02 |
20140291849 | Multi-Level Semiconductor Package - A semiconductor package includes a semiconductor die having a first electrode at a first side and a second electrode at a second side opposing the first side, a first lead under the semiconductor die and connected to the first electrode at a first level of the package, and a second lead having a height greater than the first lead and terminating at a second level in the package above the first level, the second level corresponding to a height of the semiconductor die. A connector of a single continuous planar construction over the semiconductor die and the second lead is connected to both the second electrode and the second lead at the same second level of the package. | 2014-10-02 |
20140291850 | METHOD FOR MANUFACTURING ELECTRONIC DEVICES - An embodiment for manufacturing electronic devices is proposed. The embodiment includes the following phases: a) forming a plurality of chips in a semiconductor material wafer including a main surface; each chip includes respective integrated electronic components and respective contact pads facing the main surface; said contact pads are electrically coupled to the integrated electronic components; b) attaching at least one conductive ribbon to at least one contact pad of each chip; c) covering the main surface of the semiconductor material wafer and the at least one conductive ribbon with a layer of plastic material; d) lapping an exposed surface of the layer of plastic material to remove a portion of the plastic material layer at least to uncover portions of the at least one conductive ribbon, and e) sectioning the semiconductor material wafer to separate the chips. | 2014-10-02 |
20140291851 | LEAD PIN FOR PACKAGE SUBSTRATE - A lead pin for a package substrate includes: a connection pin being inserted into a hole formed in an external substrate; a head part formed on one end of the connection pin; and a barrier part formed on one surface of the head part in order to block the path of a solder paste so that the solder paste is prevented from flowing so as to cover the upper portion of the head part when the head part is mounted on the package substrate. | 2014-10-02 |
20140291852 | INTERCONNECT FOR AN OPTOELECTRONIC DEVICE - Interconnects for optoelectronic devices are described. For example, an interconnect for an optoelectronic device includes an interconnect body having an inner surface, an outer surface, a first end, and a second end. A plurality of bond pads is coupled to the inner surface of the interconnect body, between the first and second ends. A stress relief feature is disposed in the interconnect body. The stress relief feature includes a slot disposed entirely within the interconnect body without extending through to the inner surface, without extending through to the outer surface, without extending through to the first end, and without extending through to the second end of the interconnect body. | 2014-10-02 |
20140291853 | PACKAGE STRUCTURE OF A CHIP AND A SUBSTRATE - A package structure includes a thin chip substrate, a stabilizing material layer, a chip and a filling material. A first circuit metal layer of the substrate is inlaid into a dielectric layer and a co-plane is defined by the first circuit metal layer and the dielectric layer and is exposed from the dielectric layer. The bonding pads of the substrate are on the co-plane, have a height higher than the co-plane and connected to the first circuit metal layer. The stabilizing material layer is provided on two sides of the co-plane to define a receiving space for accommodating the chip. The filling material is injected into the receiving space to fasten the pins of the chip securely with bonding pads. Since no plastic molding is required, a total thickness of the package structure and the cost is reduced. The stabilizing material layer prevents the substrate from warping and distortion. | 2014-10-02 |
20140291854 | SEMICONDUCTOR PACKAGES HAVING TSV AND ADHESIVE LAYER - A semiconductor package includes a first semiconductor chip on a substrate and having a plurality of through-silicon vias (TSVs). A second semiconductor chip having an active layer is on the first semiconductor chip. An adhesive layer is between the first semiconductor chip and the active layer. Connection terminals extend through the adhesive layer and are connected to the TSVs and the active layer. Side surfaces of the adhesive layer are aligned with side surfaces of the second semiconductor chip. | 2014-10-02 |
20140291855 | SEMICONDUCTOR DEVICE AND SEMICONDUCTOR SYSTEM INCLUDING THE SAME - A semiconductor device includes a plurality of semiconductor chips in a stack structure and a through-silicon via suitable for passing through the chips and transfer a signal from or to one or more of the chips. Each of the chips includes a buffering block disposed in path of the through-silicon via, and suitable for buffering the signal, an internal circuit, and a delay compensation block suitable for applying delay corresponding to the buffering blocks of the chips to the signal, wherein the delay compensation blocks of the chips compensates for delay difference of the signal transferred to and from the internal circuit of the chip, due to operations of the buffering block, based on stack information for distinguishing the chips. | 2014-10-02 |
20140291856 | TSV LAYOUT STRUCTURE AND TSV INTERCONNECT STRUCTURE, AND FABRICATION METHODS THEREOF - TSV layout structure and TSV interconnect structure, and their fabrication methods are provided. An exemplary TSV interconnect structure includes a semiconductor substrate having a first region and a second region; and a plurality of through-holes disposed in the first region and the second region of the semiconductor substrate. An average through-hole density of the first region is greater than an average through-hole density of the entire semiconductor substrate. The average through-hole density of the entire semiconductor substrate is less than or equal to about 2%. A metal layer having a planarized surface is filled in the plurality of through-holes in the semiconductor substrate. | 2014-10-02 |
20140291857 | STACKED STRUCTURE AND METHOD OF MANUFACTURING THE STACKED STRUCTURE - A stacked structure, includes: a wiring; an insulating layer; a substrate; and a protective layer, wherein the wiring, the insulating layer, and the substrate are stacked from a bottom side, and an end portion of the wiring is projected from a side face of the stacked structure, and the protective layer is provided between the insulating layer and at least a part of the wiring and is configured of a material different from a material configuring the insulating layer. | 2014-10-02 |
20140291858 | METHOD FOR MAKING A PHOTOLITHOGRAPHY MASK INTENDED FOR THE FORMATION OF CONTACTS, MASK AND INTEGRATED CIRCUIT CORRESPONDING THERETO - A method for making a photolithography mask for formation of electrically conducting contact pads between tracks of a metallization level and electrically active zones of integrated circuits formed on a semiconductor wafer includes forming a first mask region including first opening zones intended for the formation of the contact pads. The first opening zone has a first degree of opening that is below a threshold. A second mask region including additional opening zones is formed, with the overall degree of opening of the mask being greater than or equal to the threshold. | 2014-10-02 |
20140291859 | ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - An electronic component built-in substrate, includes, a substrate having an opening portion, a first wiring layer formed in the substrate, an electronic component arranged in the opening portion, a first insulating layer formed on one face of the substrate and sealing the electronic component, a second insulating layer formed on other face of the substrate, a second wiring layer formed on the first insulating layer, and a third wiring layer formed on the second insulating layer. The first insulating layer is formed of an inner insulating layer covering the one face of the substrate and filling an inside of the opening portion, and an outer insulating layer formed on the inner insulating layer. | 2014-10-02 |
20140291860 | Semiconductor-on-insulator integrated circuit with interconnect below the insulator - An integrated circuit assembly comprises an insulating layer, a semiconductor layer, a handle layer, a metal interconnect layer, and transistors. The insulating layer has a first surface, a second surface, and a hole extending from the first surface to the second surface. The semiconductor layer has a first surface and a second surface, the first surface of the semiconductor layer contacting the first surface of the insulating layer. The handle layer is coupled to the second surface of the semiconductor layer. The metal interconnect layer is coupled to the second surface of the insulating layer, the metal interconnect layer being disposed within the hole in the insulating layer. The transistors are located in the semiconductor layer. The hole in the insulating layer extends to at least the first surface of the semiconductor layer. The metal interconnect layer electrically couples a plurality of the transistors to each other. | 2014-10-02 |
20140291861 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-02 |
20140291862 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-02 |
20140291863 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-02 |
20140291864 | SEMICONDUCTOR DEVICE HAVING GROOVE-SHAPED VIA-HOLE - The semiconductor device has insulating films | 2014-10-02 |
20140291865 | ELECTRONIC APPARATUS AND FABRICATION METHOD OF THE SAME - A first semiconductor component and a second semiconductor component are attached together via an adhesion layer so that the first semiconductor component and the second semiconductor component are electrically connected with each other via a through electrode. The through electrode is formed to fill a through hole formed in the second semiconductor component and a through hole formed in a portion the adhesion layer. The through hole formed in the portion the adhesion layer is positioned between the through hole formed in the second semiconductor component and a second connection surface of a first semiconductor component through electrode. | 2014-10-02 |
20140291866 | EMBEDDED DIE-DOWN PACKAGE-ON-PACKAGE DEVICE - An apparatus including a die; and a build-up carrier including alternating layers of conductive material and dielectric material disposed on a device side of the die and dielectric material embedding a portion of a thickness dimension of the die; and a plurality of carrier contact points disposed at a gradation between the device side of the die and the embedded thickness dimension of the die and configured for connecting the carrier to a substrate. A method including disposing a die on a sacrificial substrate with a device side of the die opposite the sacrificial substrate; forming a build-up carrier adjacent a device side of a die, wherein the build-up carrier includes a dielectric material defining a gradation between the device side of the die and a backside of the die, the gradation including a plurality of carrier contact points; and separating the die and the carrier from the sacrificial substrate. | 2014-10-02 |
20140291867 | APPARATUS AND METHOD TO ATTACH A WIRELESS COMMUNICATION DEVICE INTO A SEMICONDUCTOR PACKAGE - A semiconductor package includes an RFID chip positioned between a first die and a second die attached to a support substrate. The RFID chip is free of electrical connections to the dice and the support substrate. The RFID chip is sized to correspond to an interposer board. Data pertaining to operating characteristics of the dice are stored to and read from the RFID chip during back-end processing to determine abnormalities and improve yield. Said data may be stored to a database corresponding to the RFID chip in the package. A method of making a semiconductor package having an RFID chip positioned between dice is provided. The package is traceable by customers via the data stored to the RFID chip and the database. | 2014-10-02 |
20140291868 | STACK TYPE SEMICONDUCTOR PACKAGE - A stack type semiconductor package includes a lower semiconductor package including a lower package substrate and at least one lower semiconductor chip disposed on the lower package substrate; an upper semiconductor package including an upper package substrate larger than the lower package substrate and at least one upper semiconductor chip disposed on the upper package substrate; an inter-package connector connecting an upper surface of the lower package substrate to a lower surface of the upper package substrate; and a filler filling in between the lower package substrate and the upper package substrate while substantially surrounding the inter-package connector. | 2014-10-02 |
20140291869 | ANISOTROPIC CONDUCTIVE FILM INCLUDING CONDUCTIVE ADHESIVE LAYER AND SEMICONDUCTOR DEVICE CONNECTED BY THE SAME - An anisotropic conductive film includes a conductive adhesive layer including conductive particles and insulating particles, and an insulating adhesive layer not including conductive particles. In the anisotropic conductive film, the conductive particles and the insulating particles of the conductive adhesive layer have a total particle density of 7.0×10 | 2014-10-02 |
20140291870 | RESIN COMPOSITION, RESIN COMPOSITION SHEET, SEMICONDUCTOR DEVICE AND PRODUCTION METHOD THEREFOR - A resin composition excellent in both characteristics of preservation stability and connection reliability is provided by a resin composition that contains (a) an epoxy compound, (b) a microcapsule type hardening acceleration agent, and (c) an inorganic particle whose surface is modified with a compound that has an unsaturated double bond. | 2014-10-02 |
20140291871 | IMPEDANCE CONTROLLED PACKAGES WITH METAL SHEET OR 2-LAYER RDL - A microelectronic assembly is disclosed that is capable of achieving a desired impedance for raised conductive elements. The microelectronic assembly may include an interconnection element, a surface conductive element, a microelectronic device, a plurality of raised conductive elements, and a bond element. The microelectronic device may overlie the dielectric element and at least one surface conductive element attached to the front surface. The plurality of raised conductive elements may connect the device contacts with the element contacts. The raised conductive elements may have substantial portions spaced a first height above and extending at least generally parallel to at least one surface conductive element, such that a desired impedance may be achieved for the raised conductive elements. A bond element may electrically connect at least one surface conductive element with at least one reference contact that may be connectable to a source of reference potential. | 2014-10-02 |
20140291872 | Gel Having Improved Thermal Stability - A gel has improved thermal stability and is the ultraviolet hydrosilylation reaction product of (A) an organopolysiloxane having an average of at least 0.1 silicon-bonded alkenyl group per molecule and (B) a cross-linker having an average of at least 2 silicon-bonded hydrogen atoms per molecule. (A) and (B) react via hydrosilylation in the presence of (C) a UV-activated hydrosilylation catalyst comprising at least one of platinum, rhodium, ruthenium, palladium, osmium, and iridium, and (D) a thermal stabilizer. The (D) thermal stabilizer is present in an amount of from about 0.01 to about 30 weight percent based on a total weight of (A) and (B) and having transparency to UV light sufficient for the ultraviolet hydrosilylation reaction product to form. | 2014-10-02 |
20140291873 | FOAM GENERATION APPARATUS - A foam generation apparatus is claimed. The apparatus includes a housing defining an interior portion and two ports disposed on an exterior surface of the housing. One of the ports is adapted to receive chemical into the interior portion of the housing, and another of the ports is adapted to receive compressed air into the interior portion of the housing. The apparatus also includes coarse threads integrally molded at a top portion of the housing. Finally, the apparatus includes an insert that includes a cap, a rod extending from an interior portion of the cap, and one or more agitation balls affixed to the rod. Like the housing, the cap also includes coarse threads formed therein. As such, the insert is disposed within the housing and secured to the housing by way of the coarse threads of the insert and the housing. | 2014-10-02 |
20140291874 | MEMBRANE HUMIDIFIER - A membrane humidifier is disclosed. The membrane humidifier may include: a housing in which a hollow fiber membrane bundle is mounted, the hollow fiber membrane bundle being formed by integrating a plurality of hollow fiber membranes; a potting portion fixing an end portion of the hollow fiber membrane bundle to the housing and coupled to an end portion of the housing so as to hermetically seal the housing; and a sealing member disposed between the housing and the potting portion and hermetically sealing the housing. | 2014-10-02 |
20140291875 | Methods and Apparatus Useful in the Manufacture of Contact Lenses - Methods for manufacturing ophthalmic devices and apparatus for treatment of ophthalmic devices are provided. The apparatus includes a tank, liquid, baffle and ophthalmic devices. The methods include placing the liquid, baffle and ophthalmic devices in a tank including at least one element which produces bubbles and/or convection currents. The baffle is structured and/or positioned to prevent bubbles from contacting the ophthalmic devices in the tank, to reduce the force of the convection currents, or both. | 2014-10-02 |
20140291876 | POWDER COMPOUND AGENT COLLECTION DEVICE FOR SEAL PRESSURIZED-TYPE KNEADING MACHINE, AND COLLECTION METHOD THEREFOR - To improve the work environment by preventing a larger amount of a powder compounding agent from being discarded as power dust and by returning the powder compounding agent into a kneading tank by capturing said powder compounding agent by employing a simple means in closed pressure type kneader. Also to bring the compound quality closer to the design quality by drastically increasing the valuable collection rate. A recovery device for collecting an ejected powder compounding agent is installed on a closed pressure type kneader for kneading a kneading material along with a powder compounding agent in a kneading tank by rotating a kneading rotor. In the recovery device, a tubular air bag capable of expanding and contracting is connected to the side surface of the surrounding wall of the kneading tank with a ventilation chute between the air bag and the surrounding wall, the surrounding wall surrounding the periphery of a pressurized lid rising/lowering path. A branching duct capable of connecting to and being disconnected from the outside is connected to the top of the air bag, and a filter tube for filtering and capturing the powder compounding agent carried by a gaseous body flowing from the side of the kneading tank is disposed in a suspended manner within the air bag. As a consequence, it is possible to return the powder compounding agent captured by means of the filter tube to the kneading tank by means of the pressurized air flow accumulated in the air bag. | 2014-10-02 |
20140291877 | BLOW MOLD UNIT, BLOW MOLDING MACHINE AND METHOD FOR REPLACING BLOW MOLD UNIT - Embodiments include a blow molding machine, a method for replacing a blow mold unit, and a mold unit including a blow mold including first and second blow cavity split molds and a plurality of raised bottom molds; first and second pressure receiving plates; a-first and second fixing plates to which the first and second blow cavity split molds and the first and second pressure receiving plates are respectively fixed; a third fixing plate interposed between the first and second fixing plates and to which the raised bottom molds are fixed at a first surface thereof; a pressure receiving rod hanging down from a second surface of the third fixing plate and including an engaged portion engageable with the engaging portion; and a placement portion fixed to at least one of the first and second fixing plates and placing the third fixing plate thereon when the first and second blow cavity split molds are closed. | 2014-10-02 |
20140291878 | METHODS FOR CONTROLLING ACROSS-WAFER DIRECTED SELF-ASSEMBLY - A method for treating a layered substrate including a layer of a block copolymer is provided. The method includes identifying a non-uniformity in the layer of the block copolymer; controlling a process variable correlated to the non-uniformity in the layer of the block copolymer; and annealing the layer of the block copolymer under a process condition affected by the process variable to compensate for at least a portion of the non-uniformity in the layer of the block copolymer to form a pattern comprising a plurality of domains having improved uniformity therein. The method further provides a way for reducing a non-uniformity in a layered substrate comprising a layer of a block copolymer on a pre-patterned substrate. | 2014-10-02 |
20140291879 | IMPRINT LITHOGRAPHY - An imprint lithography apparatus is disclosed that has a first array of template holders, a second array of template holders, and a substrate table arranged to support a substrate to be imprinted, wherein the first array of template holders is arranged to hold an array of imprint templates that can be used to imprint a first array of patterns onto the substrate, and the second array of template holders is arranged hold an array of imprint templates that can be used to imprint a second array of patterns onto the substrate, the patterns imprinted by the second array being interspersed between the patterns imprinted by the first array. | 2014-10-02 |
20140291880 | MANUFACTURING METHOD FOR CONVEYANCE SEAT - A manufacturing method for a conveyance seat having a pad structure including a seat pad and a back face member includes integrally molding the seat pad with the back face member in a state where the back face member is arranged so as to cross over at least part of a parting line that is formed by laying a first sub element and a second sub element of a molding die on top of each other, the molding die being formed of at least the first sub element and the second sub element. | 2014-10-02 |
20140291881 | WAFER LEVEL TRANSFER MOLDING AND APPARATUS FOR PERFORMING THE SAME - A method includes placing a package structure into a mold chase, with top surfaces of device dies in the package structure contacting a release film in the mold chase. A molding compound is injected into an inner space of the mold chase through an injection port, with the injection port on a side of the mold chase. During the injection of the molding compound, a venting step is performed through a first venting port and a second venting port of the mold chase. The first venting port has a first flow rate, and the second port has a second flow rate different from the first flow rate. | 2014-10-02 |
20140291882 | Processing method of natural cellulose fiber intrinsically with enhanced antiseptic, deodorant and negative-ion features from bamboo - The present invention provides a processing method of natural cellulose fiber intrinsically with enhanced antiseptic, deodorant and negative-ion features from bamboo. The process uses mixture of wasted coffee residue and bamboo pulp as raw material. The process uses N-methylmorpholine N-oxide (NMMO) as primary solvent and 1, 3-phenylene-bis 2-oxazoline (BOX) as additive stabilizer. A cellulose solution is firstly formed by the wasted coffee residue, bamboo pulp, NMMO and BOX aforesaid. Secondly, via grinding, blending, dissolving and thermal dehydrating, the cellulose solution is converted into spinning dope. Thirdly, spin the dope obtained previously by dry-jet wet spinning method and coagulate and regenerate in a coagulation bath to form into threads. Finally, rinse, desiccate and lubricate the regenerated threads obtained previously as well as wind it up to produce reeled natural bamboo cellulose fiber with enhanced antiseptic, deodorant and negative-ion features. | 2014-10-02 |
20140291883 | Processing method of non-woven intrinsically with enhanced deodorant feature from bamboo - The present invention provides a processing method of non-woven intrinsically with enhanced deodorant feature from bamboo. The process uses mixture of wasted coffee residue and bamboo pulp as raw material. The process uses N-methylmorpholine N-oxide (NMMO) as primary solvent and 1,3-phenylene-bis 2-oxazoline (BOX) as additive stabilizer. A cellulose solution is firstly formed by the wasted coffee residue, bamboo pulp, NMMO and BOX aforesaid. Secondly, via grinding, blending, dissolving and thermal dehydrating, the cellulose solution is converted into spinning dope. Thirdly, via meltblown method, the dope is extruded out of spinnerets in a die assembly by a metering gear pump to form thread bundle. Finally, the thread bundle is orderly treated by coagulation with regeneration via ejecting mist aerosol of water, rinsing, bleaching, re-rinsing, drying, winding-up and the like to create continuous filaments, then final product for nonwoven with deodorant feature is produced by the filaments from bamboo cellulose. | 2014-10-02 |
20140291884 | ELECTRICALLY CONDUCTIVE BUSHING CONNECTION TO STRUCTURE FOR CURRENT PATH - An electrically conductive structural connection employs a pass through or fastener having a first diameter. A fastener hole, with a second diameter larger than the diameter of the pass through, extends through a thickness of a structure and receives the pass through. A bushing having a diameter and a thickness to fit between the first and second diameters extends though and past the thickness of said structure. When the feedthrough is compressively secured to the structure, the bushing expands radially between the first diameter and the second diameter to maintain at least one contact point between the fastener and the structure. | 2014-10-02 |
20140291885 | METHOD AND DEVICE FOR FORMING A DEPOSIT OF ONE OR MORE FRAGILE MATERIALS ON A SUBSTRATE BY SPRAYING A POWDER - The invention relates to a method for forming a deposit of a fragile material on a substrate ( | 2014-10-02 |
20140291886 | THREE DIMENSIONAL PRINTING - Various embodiments related to three dimensional printers, and reinforced filaments, and their methods of use are described. In one embodiment, a void free reinforced filament is fed into an extrusion nozzle. The reinforced filament includes a core, which may be continuous or semi-continuous, and a matrix material surrounding the core. The reinforced filament is heated to a temperature greater than a melting temperature of the matrix material and less than a melting temperature of the core prior to extruding the filament from the extrusion nozzle. | 2014-10-02 |
20140291887 | METHOD FOR MAKING GAS-SEPARATION MEMBRANES HAVING IMPROVED FLUX AND SELECTIVITY - A polymeric fiber for use in gas separation is formed from a spin dope which includes solvent and non-solvent materials. The fiber is passed through a quench bath, and then a leach bath, in which the solvent and non-solvent are removed. The quench bath and the leach bath include sets of rollers which transport the fiber through the system. Each set of rollers in the leach bath operates at a speed which is greater than or equal to the speed of the rollers which are immediately upstream. Thus, the fiber is stretched, in different amounts, at the same time that the solvent and non-solvent are being removed, and while the fiber is still wet. The resulting fiber has been found to exhibit superior flux and selectivity properties. | 2014-10-02 |
20140291888 | INHALATION THERAPY DEVICE WITH A NOZZLE NEBULISER - The invention relates to an inhalation therapy device with a nozzle nebuliser, in particular with a nozzle nebuliser having a nozzle element which is easy to clean and is thereby simple and reliable to handle so that the nozzle is not damaged and the geometry of the nozzle is not affected during cleaning. The aerosol generator comprises a nozzle element, said nozzle consisting of at least a first part and a second part, said first part of the nozzle element being made of a more resilient material than said second part of the nozzle element, and said first part of the nozzle element being attached to said second part of the nozzle element. Owing to the resilient material, the nozzle can deform during cleaning and can return to the original shape without altering its initial geometry. | 2014-10-02 |
20140291889 | DEVICE AND METHOD FOR MOLDING FIBER-REINFORCED PLASTIC MEMBER - The present invention provides a device and a method for molding fiber-reinforced plastics by which the molding cost can be reduced. A device for molding a fiber-reinforced plastic member | 2014-10-02 |
20140291890 | METHOD FOR PRODUCING A RESILIENT FORCE - TRANSMITTING MEMBER, AND RESILIENT FORCE-TRANSMITTING MEMBER - The present disclosure relates to a method for producing a resilient force-transmitting member, in particular for transmitting torques for example in a motor vehicle or in an industrial application, wherein the force-transmitting member is provided with at least two receiving openings for connecting to force-transmitting components, an elastomer body and at least one inlay loop embedded in the elastomer body. The method includes positioning the at least one inlay loop in a predetermined desired position in a mould, providing at least one venting mandrel in the mould one free end of which is in contact with the inlay loop, injecting elastomer material into the mould, removing the at least one venting mandrel and vulcanising the elastomer body. | 2014-10-02 |
20140291891 | METHOD FOR PRODUCING A MEMBER FOR APPLYING COSMETIC PRODUCT, AND ASSOCIATED ASSEMBLY FOR THE PRODUCTION THEREOF - The method for producing a member for applying a cosmetic product comprising:
| 2014-10-02 |
20140291892 | BASE MATERIAL FOR DISK PROCESS FOR PRODUCING THE SAME, AND DISK ROLL - A process for producing a base material for disks including forming a raw slurry material into a platy shape and drying the plate, the raw slurry material containing inorganic fibers which have a wet volume of about 300 mL/5 g or larger and which are amorphous or have a degree of crystallinity of about 50% or lower. | 2014-10-02 |
20140291893 | SEAM CONCEALMENT FOR THREE-DIMENSIONAL MODELS - A three-dimensional model built with an extrusion-based digital manufacturing system, and having a perimeter based on a contour tool path that defines an interior region of a layer of the three-dimensional model, where at least one of a start point and a stop point of the contour tool path is located within the interior region of the layer. | 2014-10-02 |
20140291894 | INJECTABLE COMPOSITE MATERIAL REINFORCED BY NATURAL FIBERS - The invention relates to an injectable composite material comprising:
| 2014-10-02 |
20140291895 | Method of Manufacturing a Body with Oriented Aspherical Particles - A method of manufacturing a body with oriented aspherical particles is disclosed. In an embodiment, the method comprises introducing aspherical particles with an orientation property in a liquid base material and solidifying the base material under the influence of an orienting force field. | 2014-10-02 |
20140291896 | COMPONENT PROTECTIVE OVERMOLDING - Techniques for component protective overmolding include selectively applying a securing coating substantially over one or more elements coupled to a framework, molding a first protective layer over the framework, the one or more elements, and the securing coating, after the securing coating has been selectively applied, and molding a second protective layer over the first protective layer. In one embodiment, the second protective layer is configured to provide a surface configured to receive a pattern and is removable if a defect is yielded during inspection. Further, the securing coating may be a curable material, such as an ultra violet curable material. | 2014-10-02 |
20140291897 | PRODUCTION AND USE OF LAMINATED NANOFIBROUS STRUCTURES - An electrospinning device for providing a predetermined distance profile for the distance between outlets of the electrospinning device and the receiving surface. The latter may be obtained by geometrically adapting the electrospinning device or by moving the outlets with respect to the receiving surface during growth of the fibrous structure. | 2014-10-02 |
20140291898 | METHOD OF FORMING A POROUS SINTERED CERAMIC BODY - A porous sintered silicon carbide body that includes a ceramic and a solid lubricant and methods of making thereof are described. The porous silicon carbide body can be a seal. The porous sintered silicon carbide body defines pores that can have an average pore size in a range of between about 20 μm and about 40 μm, and a porosity in a range of between about 1% and about 6% by volume. | 2014-10-02 |
20140291899 | APPARATUS FOR INDUCING FLOW IN A MOLTEN MATERIAL - The apparatus includes a furnace having a furnace chamber ( | 2014-10-02 |
20140291900 | Nozzle System for a Cutting Torch for Autogenous Torch-Cutting with a Sleeve-Like Pipe Jacket for Drawing in Outside Air - The invention relates to a nozzle system ( | 2014-10-02 |
20140291901 | REDUCTION PROCESSING APPARATUS FOR STEEL-MAKING SLAG AND REDUCTION PROCESSING SYSTEM FOR STEEL-MAKING SLAG - This reduction processing apparatus for a steel-making slag that continuously performs reduction processing to a hot steel-making slag by using an electric furnace includes: a slag-supplying container that charges the hot steel-making slag into the electric furnace; an electrode that is provided at the electric furnace and heats a molten slag layer on a molten iron produced by reducing the hot steel-making slag; an auxiliary-raw-material supplying unit that supplies an auxiliary-raw-material including a reducing agent to the molten slag layer; and a tilting unit that tilts the slag-supplying container and adjusts a charging amount of the hot steel-making slag to the electric furnace. | 2014-10-02 |
20140291902 | COOLED LANCE FOR INJECTING INTO A METALLURGICAL VESSEL - A cooled lance for injection into metallurgical vessels, comprises an inner tube or pipe, with an inlet for gas at the upper part of the injection lance and outlets for the gas at the lower part, and at least one outer tube or pipe that forms a cooling jacket with the inner tube or pipe, wherein the inner tube or pipe is fixed at only one point at said at least one outer tube or pipe and the gas flow takes place only through the cooling jacket formed between the inner tube or pipe and the outer tube or pipe. | 2014-10-02 |
20140291903 | VACUUM HEAT TREATMENT DEVICE - The vacuum heat treatment device includes: a guide plate used to guide a cooling medium supplied by a cooling unit, into a heat-insulating container through one of at least two openings of the heat-insulating container in a state where the two openings of the heat-insulating container are opened; and a movement mechanism used to move the guide plate so that at least part of the guide plate is inserted into a movement area of a cover portion in a state where the two openings of the heat-insulating container are opened and so that the guide plate is retracted from the movement area of the cover portion before the cover portion is moved in order to close the two openings of the heat-insulating container. | 2014-10-02 |
20140291904 | CASTABLE REFRACTORY COMPOSITION - A castable refractory composition may include from 5% to 95% by weight of alumina, aluminosilicate, or mixtures thereof: up to 70% by weight silicon carbide: up to 10% by weight carbon: from 0.1% to 5% by weight alkaline earth metal oxide and/or hydroxide; and from 0.1% to 5% bv weight of silica having a surface area of at least about 10 m | 2014-10-02 |
20140291905 | FLUID-FILLED VIBRATION DAMPING DEVICE - A fluid-filled vibration damping device including: a primary fluid chamber which gives rise to internal pressure fluctuations based on deformation of a main rubber elastic body at times of vibration input; an auxiliary fluid chamber which gives rise to pressure differentials relative to the primary fluid chamber at times of vibration input; an orifice passage which permits a non-compressible sealed fluid filling the primary fluid chamber and the auxiliary fluid chamber to flow between the two fluid chambers; and an insoluble powder mixed in the sealed fluid filling the primary fluid chamber which provides a bubble nucleus and accelerates dispersed generation of bubbles when pressure within the primary fluid chamber is decreased. | 2014-10-02 |
20140291906 | COIL SPRING FOR BED MATTRESS HAVING MEANS FOR PREVENTING FRICTIONAL NOISE - A coil spring for a bed mattress. At least one of contact wiring portions | 2014-10-02 |
20140291907 | SUSPENSION DEVICE, SUSPENSION SUPPORT, AND BUFFER MEMBER - A suspension device includes a piston rod having a projecting part projecting from one end of a cylinder of a shock absorber to the outside of the cylinder, a lower mount rubber provided in the piston rod, and a cover plate provided in the piston rod and configured to transmit a shock received by the piston rod to the lower mount rubber, the lower mount rubber includes an inner circumferential groove configured to restrict the cover plate from being displaced with respect to the lower mount rubber in a state in which the piston rod is not arranged inside the lower mount rubber and the cover plate and the cover plate is fixed around the projecting part of the piston rod in a. state in which the piston rod is arranged inside the cover plate. | 2014-10-02 |
20140291908 | ACTUATING DEVICE - An actuating device has a linearly-movable fluidly operated piston drive (1). A pivot shaft (3) is movably, rotatably mounted in a housing (2). A lever arm (4) is connected with the pivot shaft (3) in a torsionally rigid manner. An adjustment mechanism (5) connects the piston drive (1) with the pivot shaft (3). A damping device (6) dampens movement of the lever arm (4). The damping device (6) is associated with the housing (2) and with the pivot shaft (3). | 2014-10-02 |
20140291909 | DEVICE FOR HOLDING WORKPIECES - The device used to hold workpieces is designed in a manner of tongs and is provided with two tong arms ( | 2014-10-02 |
20140291910 | ASSEMBLY JIG - An assembly jig, includes: a base unit; a first wall unit that is stood on the base unit; a second wall unit that is arranged in parallel with the first wall unit, and forms a member holding unit between the first wall unit and the second wall unit; and at least two contact surfaces that contact a work table. | 2014-10-02 |
20140291911 | AFTER-PROCESSING DEVICE AND IMAGE FORMATION APPARATUS - An after-processing device for performing sheet folding includes a pair of folding rollers, a heating member, and a supporting unit. The pair of folding rollers is configured to fold a sheet. The heating member is located downstream of the pair of folding rollers in terms of a sheet conveyance direction. The supporting unit supports the heating member in a manner such that position of the heating member in terms of the sheet conveyance direction is changeable in accordance with an amount of conveyance imparted on the sheet by the pair of folding rollers after folding. The position of the heating member in terms of the sheet conveyance direction changes such that the heating member is in contact with a leading edge of a fold portion of the sheet. | 2014-10-02 |
20140291912 | Printing Press, Folder, and Methods of Operation - Systems and methods for allowing existing rotary printing press units to produce smaller pages at a faster rate of speed without having to replace the press unit. Specifically, the systems and methods relate to retrofitting an existing press unit to produce three pages of material in each full rotation instead of the traditional two pages | 2014-10-02 |
20140291913 | RECORDING APPARATUS - A printer includes a lower tray and an upper tray disposed above the lower tray. An optical sensor which detects the presence or absence of a sheet is disposed above the upper tray. The upper tray is disposed to be slidable. A sliding operation of the upper tray enables modes to be switched over between a mode where the optical sensor opposes the upper tray and a mode where the optical sensor opposes the lower tray. One sensor can detect the presence or absence of the sheet in multiple trays. | 2014-10-02 |
20140291914 | RECORDING APPARATUS AND MEDIUM FEEDING DEVICE - A printer includes a lower tray and an upper tray disposed above the lower tray. An optical sensor which detects the presence or absence of a sheet is disposed above the upper tray. The optical sensor is disposed in a roller support member which supports a feeding roller and serves as a swingable swing member. A distance between the optical sensor and the sheet is adjusted by swing of the roller support member according to the number of sheets. | 2014-10-02 |
20140291915 | IMAGE FORMING APPARATUS - An image forming apparatus includes a registration roller pair, which is arranged on a downstream side in a sheet feeding direction with respect to a nip portion of a sheet feeding roller and a separation roller, configured to cause a leading edge of a sheet, the sheet is conveyed while being nipped by the sheet feeding roller and the separation roller, to abut against the stopped registration roller pair to form warping in the sheet. And, a backup sheet is deformed toward a separation roller side by abutting against the sheet, which has been warped by abutting the leading edge of the sheet against the registration roller pair, from the separation roller side in a vicinity of the downstream side in the sheet feeding direction with respect to the nip portion. | 2014-10-02 |
20140291916 | IMAGE FORMING APPARATUS CAPABLE OF FORMING A DUPLEX IMAGE ON ONE SHEET - An image forming apparatus, including an image forming part which forms an image on a printing medium, a main feeding part which accommodates the printing medium and supplies the printing medium to the image forming part, and a reversing part which transfers the printing medium, on which an image is formed on a first surface thereof in the image forming part, to the main feeding part, wherein the main feeding part includes a feeding roller part which re-feeds the printing medium, having been transferred through the reversing part, to the image forming part. | 2014-10-02 |
20140291917 | SHEET TRANSPORT APPARATUS AND IMAGE RECORDING APPARATUS - A sheet transport apparatus includes a first casing in which a transport path is formed; a transport unit which transports a sheet along the transport path; a second casing which is provided to be movable with respect to the first casing; a sheet support unit which is rotatably provided in the first casing at a position on a side to which the second casing is moved, the sheet support unit being changeable between a first state, a second state, and a third state and supporting the sheet at least in the third state; and an urging unit which urges the sheet support unit toward the first state within a range from the first state to the second state and which urges the sheet support unit toward the third state within a range from the second state to the third state. | 2014-10-02 |
20140291918 | IMAGE FORMING APPARATUS - A multifunction peripheral includes: a moving device configured to move up a lift plate; a changing device configured to mechanically change a resistance value of a variable resistor depending upon a position of the lift plate; a mechanical switch; a connecting device configured to apply a predetermined DC voltage to the variable resistor when an upper end of one or more paper sheets placed on the lift plate or an upper end of the lift plate has reached a predetermined uppermost position in the paper feed cassette; a calculating device configured to calculate a remaining amount of paper sheets placed on the lift plate as a function of a DC voltage value output from the variable resistor; and a stopping device configured to stop upward movement of the lift plate using the DC voltage value output from the variable resistor. | 2014-10-02 |
20140291919 | RECORDING MEDIUM FEEDING UNIT AND IMAGE FORMING APPARATUS INCLUDING THE SAME - A recording medium feeding unit includes a recoding medium loading plate, a main body, positioning members, racks, a pinion, a rotating shaft and an adjustment member. The main body holds the recording medium loading plate. The positioning members position the recording member in a widthwise direction. The racks are respectively provided on the positioning members, extend along the widthwise direction, and move in the widthwise direction integrally with the positioning members. The pinion is rotatably provided on the main body, is engaged with each of the racks, and is rotated in association with the movement of the racks. The rotating shaft rotatably supports the pinion. The adjustment member applies a rotation load to the pinion by allowing the pinion to be in contact therewith. The adjustment member is capable of adjusting the rotation load in a manner to move in the thickness direction of the recording medium loading plate. | 2014-10-02 |
20140291920 | IMAGE FORMING APPARATUS - An image forming apparatus includes: a discharging slot provided for discharging a recording medium on which an image is formed; a discharge tray including a supporting surface supporting the recording medium discharged from the discharging slot; a discharge mechanism configured to discharge the recording medium to the discharge tray through the discharging slot; and a press down mechanism including an abutting surface which is provided for pressing down the upper surface of the recording medium supported by the supporting surface of the discharge tray. The press down mechanism is rotatable about a rotation center provided on the upstream of the discharging slot in a discharge direction in which the recording medium is discharged from the discharging slot, and the abutting surface contacts with the supporting surface when no recording medium is supported by the discharge tray. | 2014-10-02 |
20140291921 | IMAGE FORMING APPARATUS - An image forming apparatus includes: a discharge tray having a supporting surface supporting a recording medium; a discharge mechanism which has a discharging slot through which the recording medium on which an image is formed is discharged and is provided to discharge the recording medium from the discharging slot in a discharge direction which is a direction toward a space vertically above the supporting surface of the discharge tray; and a press down unit which is configured to relatively move toward and away from the supporting surface with respect to the discharge tray, the press down unit being relatively moved away when contacting with a downstream end in the discharge direction of the recording medium discharged onto the discharge tray by the discharge mechanism, and applying the own weight to the downstream end of the recording medium when the recording medium is supported by the supporting surface. | 2014-10-02 |
20140291922 | SHEET PROCESSING APPARATUS - A sheet processing apparatus includes a sheet tray, a processing unit configured to process one or more sheets that are placed on the sheet tray, a supporting member that is movable into and out of a conveying path of a sheet to be placed on the sheet tray, and a driving unit configured to move the supporting member into and out of the conveying path of the sheet. The supporting member includes a sheet support section that supports the sheet when the supporting member is moved into the conveying path. | 2014-10-02 |
20140291923 | Image Forming Apparatus - There is provided an image forming apparatus including a driving source, a switchback roller which switches between a normal rotation direction and a reverse rotation direction, first and second gear train for rotating the switchback roller in the normal and reverse rotation directions, respectively, a switching mechanism which switches among a first mode for transmitting driving force to the first gear train, a second mode for transmitting the driving force to the second gear train, and a third mode for not to transmit the driving force, a switching element which switches between a first state allowing switching of the switching mechanism into the first or third mode and a second state allowing switching of the switching mechanism into the second mode; and a controller which controls a state change of the switching element between the first state and the second state. | 2014-10-02 |
20140291924 | IMAGE FORMING SYSTEM AND INTERMEDIATE APPARATUS - An image forming system of one aspect of the present invention includes a first image forming apparatus arranged on the upstream side in a sheet conveyance direction, a second image forming apparatus arranged on the downstream side in the sheet conveyance direction, and an intermediate apparatus arranged between the first image forming apparatus and the second image forming apparatus and having a registration roller on the sheet conveyance path through which a sheet conveyed from the first image forming apparatus is conveyed to the second image forming apparatus. The intermediate apparatus has a path opening mechanism configured to release a pressure contact of the registration roller arranged on the sheet conveyance path. | 2014-10-02 |
20140291925 | PAPER GUIDE MECHANISM AND PRINTING DEVICE WITH PAPER GUIDE MECHANISM - A paper guide mechanism includes an installation board and two guide assemblies. Each two guide assemblies slidably is engaged with the installation board and includes a first limiting piece, and the first limiting pieces are parallel to each other. One of the two guide assemblies is slidable relative to the installation board along a first direction, and another one of the two guide assemblies is slidable relative to the installation board along a second direction opposite to the first direction. Thus changing a distance between the first limiting pieces, so that the two guide assemblies can position different sizes of paper. | 2014-10-02 |
20140291926 | Transporting System, Image Forming System, and Controller - There is provided a transporting system including two rollers to transport a sheet, two driving devices to drive the rollers, two measuring devices to measure state quantities Z1 and Z2 concerning the rollers, and a controller to control the transport. The controller includes first and second estimating units to estimate values R1 and R2 related to reaction forces act on the rollers, a first calculating unit to calculate control input U1 in accordance with a deviation between a target state quantity and (Z1+Z2)/2, a second calculating unit to calculate control input U2 in accordance with a deviation between a target value and (R1−R2)/2, a first drive controller to input a control signal in accordance with (U1+U2) to the first driving device, and a second drive controller to input a control signal in accordance with (U1−U2) to the second driving device. | 2014-10-02 |