| 40th week of 2008 patent applcation highlights part 21 |
| Patent application number | Title | Published |
|---|
| 20080237844 | Microelectronic package and method of manufacturing same - A microelectronic package includes a package substrate ( | 2008-10-02 |
| 20080237845 | SYSTEMS AND METHODS FOR REMOVING HEAT FROM FLIP-CHIP DIE - A cooling apparatus includes a substrate; an integrated circuit (IC) die flip-bonded to the substrate; a thermally-conductive layer on one surface of the IC die; and a heat removal chamber having thermally-conductive microporous coat thermally coupled to the conductive layer. | 2008-10-02 |
| 20080237846 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A BGA substrate which has a back surface to which a heat radiating plate | 2008-10-02 |
| 20080237847 | Power semiconductor module, and power semiconductor device having the module mounted therein - A power semiconductor module according to the present invention includes: a planar base plate having a plurality of insulated substrates soldered on the top surface, the insulated substrates each having power semiconductor elements to be cooled mounted thereon; a plurality of radiation fins projecting from the bottom surface side of the base plate; and a peripheral wall projecting from the bottom surface side of the base plate so as to surround the radiation fins, the projecting length of the radiation fins is less than or equal to that of the peripheral wall, and the peripheral wall has end surfaces present in the same plane. In addition, a power semiconductor device having the power semiconductor module mounted therein includes: at least one reinforcing plate disposed on the top surface side of the base plate via a first buffering member; and a cooling jacket fixed to the bottom surface side of the base plate via a second buffering member with a plurality of tightening fixtures passing through the reinforcing plate and the base plate, the cooling jacket having a flow passage for a cooling medium formed to intervene in a position with respect to the base plate, and the first buffering member and the second buffering member are respectively disposed at least inside and outside with respect to the tightening fixtures. | 2008-10-02 |
| 20080237848 | SEMICONDUCTOR DEVICE - There is provided a semiconductor device which makes equalization of wirings between address system chips easy and reduce the influence of crosstalk noise and capacitive coupling noise among data system wirings for connecting the chips. There are mounted, on a module board, a plurality of stacked memory chips which a data processor chip simultaneously accesses. Address system bonding pads to which a plurality of memory chips correspond are commonly coupled by a wire to a bonding lead at one end of the module board wiring whose other end is coupled by a wire to an address system bonding pads of the data processor. Data system bonding pads of the data processor chip are individually coupled to data system bonding pads of the memory chip. With respect to an arrangement of the plurality of data system bonding pads of the data processor chip, an arrangement of the data system bonding pads to which the memory chip, coupled by the data system wiring, corresponds is made such that memory chips are disposed in an alternating sequence. | 2008-10-02 |
| 20080237849 | Method and apparatus providing integrated circuit having redistribution layer with recessed connectors - A method of making a semiconductor die includes forming a trench around a conductive stud extending from the first side to a second side of a substrate to expose a portion of the stud and then forming a conductive layer inside the trench and in electrical contact with the stud. | 2008-10-02 |
| 20080237850 | COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE - A compliant bump structure includes a substrate, at least a first polymer bump, at least a second polymer bump and at least a conductive layer. The substrate has at least a pad on a surface thereof. The first polymer bump is disposed on the pad. The second polymer bump is disposed on the surface of the substrate outside the pad. The conductive layer is disposed on the first and second polymer bumps. | 2008-10-02 |
| 20080237851 | SEMICONDUCTOR DEVICE, MANUFACTURING METHOD THEREOF, COMPOSITE METAL BODY AND MANUFACTURING METHOD THEREOF - A semiconductor device having a structure in which a semiconductor element and a Cu or Ni electrode are connected by way of a bonding layer comprising Cu, and the Cu bonding layer and the Cu or Ni electrode are diffusion-bonded to each other. The bonding layer is formed by conducting bonding in a reducing atmosphere by using a bonding material containing particles of Cu oxide with an average particle size of 1 nm to 50 μm and a reducing agent comprising an organic material, thereby providing excellent bonding strength to Ni or Cu electrode. | 2008-10-02 |
| 20080237852 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device in which a high concentration n type impurity region to be a conductive path and a drain electrode are disposed in an outer circumferential end of the chip to be an inactive region as a device region. Thereby, an up-drain structure is obtained without reducing the device region or without increasing the size of a semiconductor chip. The provided n type impurity region and drain electrode causes a depletion layer of a substrate to be terminated without needing an additional conventional annular region or shield metal. This is because the n type impurity region and the drain electrode also function as the annular region and the shield metal, respectively. With this configuration, a MOSFET with the up-drain structure having necessary components is obtained, while avoiding a reduction of the device region or an increase of the chip area. | 2008-10-02 |
| 20080237853 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - A conventional semiconductor device has a problem that reduction of a resistance value above a pad electrode is difficult because of an oxide film formed on a surface of the pad electrode. In a semiconductor device of this invention, an oxidation preventing metal layer is formed on a pad electrode, and the oxidation preventing metal layer is exposed at an opening region formed in a spin coat resin film at a portion above the pad electrode. In addition, a plating metal layer and a copper plated layer are formed on the oxidation preventing metal layer. With this structure, the resistance value above the pad electrode is reduced because the top surface of the pad electrode is difficult to oxidize, and the oxidation preventing metal layer having considerably smaller sheet resistivity than an oxidation film serves as part of a current path. | 2008-10-02 |
| 20080237854 | METHOD FOR FORMING CONTACT PADS - First, a substrate having a conductor therein is provided. Next, a first dielectric layer is disposed on the conductor and the substrate and a first opening is formed in the first dielectric layer for exposing the conductor. A first metal layer is deposited over the surface of the first dielectric layer and into the first opening. Next, an etching stop layer and a second metal layer are deposited over the surface of the first metal layer, and a pattern transfer process is performed by using a second dielectric layer as a mask to remove a portion of the first metal layer, the etching stop layer, and the second metal layer for exposing the first dielectric layer. A passivation layer is disposed on the second metal layer and the first dielectric layer and a second opening is formed in the passivation layer to expose a portion of the second metal layer. | 2008-10-02 |
| 20080237855 | Ball grid array package and its substrate - A BGA package and a substrate for the package are disclosed. A chip is disposed on a top surface of the substrate. A plurality of solder balls are disposed on a plurality of ball pads formed on a bottom surface of the substrate. The substrate has at least a core layer with a plurality of corner cavities filled with low-modulus materials as stress buffer. Additionally, some of the ball pads at the corners of the substrate are disposed under the corner cavities. | 2008-10-02 |
| 20080237856 | Semiconductor Package and Method for Fabricating the Same - A semiconductor package includes a wiring substrate, a semiconductor chip, and a conductor plate in order to reduce a voltage drop at the central portion of a chip caused by wiring resistance from a peripheral connection pad disposed on the periphery of the chip in the semiconductor package. Central electrode pads for use in ground/power-supply are disposed on the central portion of the chip. The conductor plate for use in ground/power-supply is disposed on the chip such that an insulating layer is disposed therebetween. The central electrode pads on the chip and the conductor plate are connected together by wire bonding through an opening formed in the insulating layer and the conductor plate. An extraction portion of the conductor plate is connected to a power-supply wiring pad on the wiring substrate. The central electrode pads and the conductor plate may also be connected together using gold stud bumps. Preferably, the conductor plate is composed of a multilayer structure of two or more layers, and each conductor plate is used in power-supply wiring or ground wiring. | 2008-10-02 |
| 20080237857 | Semiconductor package - There is disclosed a method of making an electronic package ( | 2008-10-02 |
| 20080237858 | ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME - An electronic device includes a conductive pattern formed on a first insulating film, a second insulating film formed on the conductive pattern and the first insulating film, a hole formed in the second insulating film on the conductive pattern, carbon nanotubes formed in the hole to extend from a surface of the conductive pattern, and a buried film buried in clearances among the carbon nanotubes in the hole. | 2008-10-02 |
| 20080237859 | DIFFUSION BARRIER FOR INTEGRATED CIRCUITS FORMED FROM A LAYER OF REACTIVE METAL AND METHOD OF FABRICATION - An interconnect structure for an integrated circuit and method of forming the interconnect structure. The method includes depositing a metallic layer containing a reactive metal in an interconnect opening formed within a dielectric material containing a dielectric reactant element, thermally reacting at least a portion of the metallic layer with at least a portion of the dielectric material to form a diffusion barrier primarily containing a compound of the reactive metal from the metallic layer and the dielectric reactant element from the dielectric material, and filling the interconnect opening with Cu metal, where the diffusion barrier surrounds the Cu metal within the opening. The reactive metal can be Co, Ru, Mo, W, or Ir, or a combination thereof. The interconnect opening can be a trench, a via, or a dual damascene opening. | 2008-10-02 |
| 20080237860 | INTERCONNECT STRUCTURES CONTAINING A RUTHENIUM BARRIER FILM AND METHOD OF FORMING - Embodiments of the invention provide a method for integrating a Ru barrier film with good barrier properties into Cu metallization. The method includes exposing a substrate to a Ta-, Ti-, or W-containing precursor at a substrate temperature below the thermal decomposition temperature of the Ta-, Ti-, or W-containing precursor on the substrate to form a chemisorbed seed layer of partially decomposed Ta-, Ti-, or W-containing precursor on the substrate. The method further includes depositing a Ru barrier film on the chemisorbed seed layer, and forming bulk Cu metal on the Ru barrier film. According to additional embodiments, an interconnect structure and method of forming are provided. | 2008-10-02 |
| 20080237861 | Novel Fluorine-Free Precursors and Methods for the Deposition of Conformal Conductive Films for Nanointerconnect Seed and Fill - A method including introducing a fluorine-free organometallic precursor in the presence of a substrate; and forming a conductive layer including a moiety of the organometallic precursor on the substrate according to an atomic layer or chemical vapor deposition process. A method including forming an opening through a dielectric layer to a contact point; introducing a fluorine-free copper film precursor and a co-reactant; and forming a copper-containing seed layer in the opening. A system including a computer including a microprocessor electrically coupled to a printed circuit board, the microprocessor including conductive interconnect structures formed from fluorine-free organometallic precursor. | 2008-10-02 |
| 20080237862 | Implementation of diffusion barrier in 3D memory - One or more diffusion barriers are formed around one or more conductors in a three dimensional or 3D memory cell. The diffusion barriers allow the conductors to comprise very low resistivity materials, such as copper, that may otherwise out diffuse into surrounding areas, particularly at elevated processing temperatures. Utilizing lower resistivity materials allows device dimension to be reduced by mitigating increases in resistance that occur when the size of the conductors is reduced. As such, more cells can be produced over a given area, thus increasing the density and storage capacity of a resulting memory array. | 2008-10-02 |
| 20080237863 | Semiconductor device and manufacturing method of semiconductor device - A semiconductor device, which is comprised of a copper wiring layer which is formed above a semiconductor substrate, a pad electrode layer which conducts electrically to the copper wiring layer and has an alloy, which contains copper and a metal whose oxidation tendency is higher than copper, formed to extend to the bottom surface, and an insulating protective film which has an opening extended to the pad electrode layer, is provided. | 2008-10-02 |
| 20080237864 | METAL INTERCONNECTION STRUCTURE OF A SEMICONDUCTOR DEVICE HAVING LOW RESISTANCE AND METHOD OF FABRICATING THE SAME - Provided is a metal interconnection structure of a semiconductor device, including a first metal film pattern disposed on an upper part of an insulation film of a semiconductor substrate; an intermetallic dielectric film having a metal contact plug in which a barrier layer, a metal film for contact plug and a second metal film are sequentially disposed, on the first metal film pattern; and a second metal film pattern disposed on the metal contact plug and intermetallic dielectric film and connected to the metal contact plug. | 2008-10-02 |
| 20080237865 | SEMICONDUCTOR DEVICE INCLUDING AN AMORPHOUS NITRIDED SILICON ADHESION LAYER AND METHOD OF MANUFACTURE THEREFOR - Provided is a method for manufacturing a semiconductor device. The method for manufacturing the semiconductor device, without limitation, includes forming a first semiconductor layer over a substrate, and forming a second semiconductor layer over the first semiconductor layer, wherein an amorphous nitrided silicon adhesion layer is located between and adheres the first and second semiconductor layers. | 2008-10-02 |
| 20080237866 | SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS - A semiconductor device is provided having an increased hardness against contact of a probe needle. The semiconductor device includes: a semiconductor substrate; a semiconductor element formed in the semiconductor substrate; an insulating film formed above the semiconductor substrate and covering the semiconductor element; a multilayer wiring structure formed in the insulating film; and a pad electrode structure connected to the multilayer wiring structure and formed on the insulating film, the pad electrode structure including a conductive adhesion film, a conductive pad electrode formed above the conductive adhesion film, and a conductive hydrogen barrier film formed above the conductive pad electrode. | 2008-10-02 |
| 20080237867 | LOW CONTACT RESISTANCE METAL CONTACT - A semiconductor structure and methods of making the same. The semiconductor structure includes a substrate having a suicide region disposed above a doped region, and a metal contact extending through the silicide region and being in direct contact with the doped region. | 2008-10-02 |
| 20080237868 | METHOD AND STRUCTURE FOR ULTRA NARROW CRACK STOP FOR MULTILEVEL SEMICONDUCTOR DEVICE - An integrated circuit design and a method of fabrication and, more particularly, a semiconductor structure having an ultra narrow crack stop for use in multilevel level devices and a method of making the same. The structure includes a first dielectric layer having a first connection connecting to an underlying interconnect and a second dielectric layer having a second connection connecting to the first connection. A stop gap structure extends through the first dielectric layer and the second dielectric layer, and has a width of about less than 1 um. | 2008-10-02 |
| 20080237869 | STRUCTURE AND METHOD FOR LOW RESISTANCE INTERCONNECTIONS - A method of forming an interconnection in a semiconductor device includes forming a first liner in a dielectric layer therein; depositing a tungsten filler on top of the first liner; performing chemical mechanical planarization (CMP) to smooth out and remove the first liner and tungsten filler from the semiconductor's exposed surface; selectively removing the first liner and tungsten filler in the via; wherein the selective removing results in the first liner and the tungsten filler being removed in an upper region of the via; forming a second liner in the upper region of the via and tungsten filler; selectively removing the second liner from the tungsten filler; forming a copper seed layer on top of the tungsten filler; depositing a copper filler on top of the copper seed layer; and performing chemical CMP to smooth out and remove the second liner and copper filler from the semiconductor's exposed surface. | 2008-10-02 |
| 20080237870 | Semiconductor device - The semiconductor device according to the present invention includes a semiconductor substrate, a first insulating layer laminated on the semiconductor substrate, a first metal wiring pattern embedded in a wire-forming region of the first insulating layer, a second insulating layer laminated on the first insulating layer, a second metal wiring pattern embedded in a wire-forming region of the second insulating layer and first dummy metal patterns embedded each in a wire-opposed region opposing to the wire-forming region of the second insulating layer and in a non-wire-opposed region opposing to a non-wire-forming region other than the wire-forming region of the second insulating layer, the wire-opposed region and the non-wire-opposed region each in a non-wire-forming region other than the wire-forming region of the first insulating layer. | 2008-10-02 |
| 20080237871 | Method of Manufacturing a Semiconductor Device and Semiconductor Device Obtained With Such a Method - The invention relates to a method of manufacturing a semiconductor device ( | 2008-10-02 |
| 20080237872 | Semiconductor Device and Method For Manufacturing Same - Disclosed is a semiconductor apparatus having a sealing structure that allows high-precision detection of defects occurring in a protective film, and a method of manufacturing the same. A semiconductor apparatus | 2008-10-02 |
| 20080237873 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH BONDING IN VIA - An integrated circuit package system includes a substrate having an opening provided therein, forming a conductor in the opening in the substrate open at the top and having a closed end at the bottom, attaching an integrated circuit die over the substrate, and connecting a die interconnect to the integrated circuit die and the closed end of the conductor. | 2008-10-02 |
| 20080237874 | Method of Producing a Silicon Oxide-Based Material with a Low Dielectric Constant - A method for manufacturing a material with a low dielectric constant, comprising a step of forming cavities in silicon dioxide by implantation of a rare gas different from helium and from neon at an implantation dose greater than 10 | 2008-10-02 |
| 20080237875 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A technique of manufacturing a semiconductor device in which etching in formation of a contact hole can be easily controlled is proposed. A semiconductor device includes at least a semiconductor layer formed over an insulating surface; a first insulating layer formed over the semiconductor layer; a gate electrode formed over the first insulating layer; a second insulating layer formed over the gate electrode; and a conductive layer formed over the second insulating layer connected to the semiconductor layer via an opening which is formed at least in the semiconductor layer and the second insulating layer and partially exposes the insulating surface. The conductive layer is electrically connected to the semiconductor layer at the side surface of the opening which is formed in the semiconductor layer. | 2008-10-02 |
| 20080237876 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - A method for easily manufacturing a semiconductor device in which variation in thickness or disconnection of a source electrode or a drain electrode is prevented is proposed A semiconductor device includes a semiconductor layer formed over an insulating substrate; a first insulating layer formed over the semiconductor layer; a gate electrode formed over the first insulating layer; a second insulating layer formed over the gate electrode; an opening which reaches the semiconductor layer and is formed at least in the first insulating layer and the second insulating layer; and a step portion formed at a side surface of the second insulating layer in the opening. | 2008-10-02 |
| 20080237877 | SEMICONDUCTOR DEVICE - This invention is directed to offer a semiconductor device having a structure capable of relaxing a mechanical stress applied to a bonding pad. A third interlayer insulation film having via holes is formed on a second interlayer insulation film to cover a third wiring layer. A third conductive layer is formed in the via hole. The third interlayer insulation film is composed of an array of a plurality of hexagonal column-shaped interlayer insulation films. And the via hole and the third conductive layer are formed to surround each hexagonal column-shaped interlayer insulation film. A fourth wiring layer connected with the third wiring layer through the third conductive layer is formed. The fourth wiring layer makes an uppermost wiring layer in an embodiment of this invention and serves as the bonding pad. | 2008-10-02 |
| 20080237878 | Semiconductor device and method of producing the same - A semiconductor device includes a semiconductor substrate having a main surface; an element separation film formed on the main surface in an element separation area and extending in a first direction; and a semiconductor element formed on the main surface in an active area and arranged in a second direction perpendicular to the first direction. The semiconductor element includes a metal silicide film. The metal silicide film includes a first portion adjacent to the element separation film. The semiconductor device further includes an interlayer insulation film formed on the main surface of the semiconductor substrate; a wiring portion formed on the interlayer insulation film; and a conductive plug formed in the interlayer insulation film for electrically connecting the semiconductor elements and the wiring portion. The conductive plug is situated on the element separation film and the metal silicide film. | 2008-10-02 |
| 20080237879 | SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND DUAL BUILD-UP LAYERS OVER BOTH SIDE-SURFACES FOR WLP AND METHOD OF THE SAME - A structure of a semiconductor device package having a substrate with a die receiving through hole, a connecting through hole structure and a contact pad. A die is disposed within the die receiving through hole. A surrounding material is formed under the die and filled in the gap between the die and the sidewall of the die receiving though hole. Dielectric layers are formed on the both side surface of the die and the substrate. Re-distribution layers (RDL) are formed on the dielectric layers and coupled to the contact pads. Protection layers are formed over the RDLs. | 2008-10-02 |
| 20080237880 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PROTECTED CONDUCTIVE LAYERS - An integrated circuit package system is provided including providing an integrated circuit die having a contact pad, forming a protection cover over the contact pad, forming a passivation layer having a first opening over the protection cover with the first opening exposing the protection cover, developing a conductive layer over the passivation layer, and forming a pad opening in the protection cover for exposing the contact pad. | 2008-10-02 |
| 20080237881 | RECESSED SOLDER SOCKET IN A SEMICONDUCTOR SUBSTRATE - Electronic devices and their formation are described. In one embodiment, a device includes a plurality of stacked semiconductor substrates. The device includes a first semiconductor substrate having a recess extending into a first surface thereof and a via extending from the recess to a second surface opposite the first surface of the first semiconductor substrate. The device also includes a solder positioned in the recess of the first semiconductor substrate. The device also includes an electrically conducting material in the via and electrically coupled to the solder positioned in the recess of the first semiconductor substrate. The device also includes a second semiconductor substrate having bonding pad extending therefrom, the bonding pad electrically coupled to the solder. The device is configured so that at least a portion of the second substrate bonding pad extends a distance into the recess in the first substrate. Other embodiments are described and claimed. | 2008-10-02 |
| 20080237882 | Annular via drilling (AVD) technology - In some embodiments, annular via drilling (AVD) technology is presented. In this regard, an annular via is introduced comprising an inner wall and an outer wall, the inner wall and the outer wall coupled with a dielectric layer and extending linearly from a surface of a conductor to a top of the dielectric layer. Other embodiments are also disclosed and claimed. | 2008-10-02 |
| 20080237883 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - First semiconductor element | 2008-10-02 |
| 20080237884 | Packaging substrate structure - A packaging substrate structure is disclosed, which at least comprises a build-up structure including a first dielectric layer, a second dielectric layer and a third dielectric layer. The second dielectric layer is disposed between the first dielectric layer and the third dielectric layer. The characteristic is that the Young's modulus of the second dielectric layer is lower then the first dielectric layer and the third dielectric layer so as to form a sandwich structure of high-low-high of Young's modulus. The packaging substrate structure of the present invention can improve the quality of the product. | 2008-10-02 |
| 20080237885 | Method for Improving Design Window - A method of forming photo masks having rectangular patterns and a method for forming a semiconductor structure using the photo masks is provided. The method for forming the photo masks includes determining a minimum spacing and identifying vertical conductive feature patterns having a spacing less than the minimum spacing value. The method further includes determining a first direction to expand and a second direction to shrink, and checking against design rules to see if the design rules are violated for each of the vertical conductive feature patterns identified. If designed rules are not violated, the identified vertical conductive feature pattern is replaced with a revised vertical conductive feature pattern having a rectangular shape. The photo masks are then formed. The semiconductor structure can be formed using the photo masks. | 2008-10-02 |
| 20080237886 | Three-dimensional crossbar array systems and methods for writing information to and reading information stored in three-dimensional crossbar array junctions - Various embodiments of the present invention are directed to three-dimensional crossbar arrays. In one aspect of the present invention, a three-dimensional crossbar array includes a plurality of crossbar arrays, a first demultiplexer, a second demultiplexer, and a third demultiplexer. Each crossbar array includes a first layer of nanowires, a second layer of nanowires overlaying the first layer of nanowires, and a third layer of nanowires overlaying the second layer of nanowires. The first demultiplexer is configured to address nanowires in the first layer of nanowires of each crossbar array, the second demultiplexer is configured to address nanowires in the second layer of nanowires of each crossbar array, and the third demultiplexer is configured to supply a signal to the nanowires in the third layer of nanowires of each crossbar array. | 2008-10-02 |
| 20080237887 | SEMICONDUCTOR DIE STACK HAVING HEIGHTENED CONTACT FOR WIRE BOND - A semiconductor device is disclosed including die bond pads which are heightened to allow wire bonding of offset stacked die even in tight offset configurations. After a first die is affixed to a substrate, one or more layers of an electrical conductor may be provided on some or all of the die bond pads of the first substrate to raise the height of the bond pads. The conductive layers may for example be conductive balls deposited on the die bond pads of the first substrate using a known wire bond capillary. Thereafter, a second die may be added, and wire bonding of the first die may be accomplished using a known wire bond capillary mounting a wire bond ball on a raised surface of a first semiconductor die bond pad. | 2008-10-02 |
| 20080237888 | Multichip semiconductor device, chip therefor and method of formation thereof - A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film formed on the top of the semiconductor substrate. At least one of the chips has a connect plug of a metal formed in a through hole that passes through the semiconductor substrate and the interlayer insulating film. The chip with the connect plug is electrically connected with another chip by that connect plug. | 2008-10-02 |
| 20080237889 | Semiconductor package, method of fabricating the same, and semiconductor package mold - Provided is a semiconductor package, which may include a plurality of semiconductor chips to form a multi-stack semiconductor package (MSP), a method of fabricating the semiconductor package and the MSP, and a semiconductor package mold for fabricating the semiconductor package. The semiconductor package may include a first semiconductor chip package having a first substrate including a first surface having a center portion on which a first semiconductor chip is mounted, and at least one first boundary portion on which a plurality of conductive connection pad groups are formed, and a molding member including a body that covers the first semiconductor chip, and at least one extension that extends from the body towards a corner portion of the first surface of the first substrate, wherein the extension extends while avoiding the conductive connection pad group. The semiconductor package may further include a second semiconductor chip package stacked on the first semiconductor chip package, the second semiconductor chip including a second substrate on which at least one second semiconductor chip that is electrically connected to the conductive connection pad group may be mounted. | 2008-10-02 |
| 20080237890 | Semiconductor Device and Wiring Board - A wiring board ( | 2008-10-02 |
| 20080237891 | SEMICONDUCTOR DEVICE - A semiconductor device having a stacked arrangement of a substrate and a first chip and a second chip is disclosed. In one embodiment, the first chip is arranged with a lower face on an upper face of the substrate; the second chip with a lower face on an upper face of the first chip, whereby a partial area of the upper face of the first chip that is adjacent to an edge of the first chip is uncovered by the second chip; a fifth wire contact pad is arranged on the uncovered area of the upper face of the first chip; a first bonding wire is arranged that is connected with a first wire contact pad of the substrate and the fifth wire contact pad of the first chip. | 2008-10-02 |
| 20080237892 | Semiconductor device - A semiconductor device having a first rectangular chip on which wires, electrode pads and chip mounting area are provided, a first dame formed on the first rectangular chip around the electrode pads and the chip mounting area so as to cover the wires and an under fill formed by filling liquid resin between a second rectangular chip mounted on the chip mounting area in a flip-chip manner and the first rectangular chip. | 2008-10-02 |
| 20080237893 | Anti Pad To Reduce Parasitic Capacitance And Improve Return Loss In A Semiconductor Die And Package - An apparatus for minimizing parasitic capacitance on a semiconductor die includes a semiconductor die having a least one signal line and at least one plane and an anti pad located between the at least one signal line and the at least one plane. | 2008-10-02 |
| 20080237894 | INTEGRATED CIRCUIT PACKAGE AND METHOD FOR THE SAME - Disclosed are an integrated circuit chip package and a method of connecting an integrated circuit chip and an attachment subject to each other while interposing an adhesive therebetween. The connection between integrated circuit chip and the attachment subject stress often leads to component failure and the addition of an interface layer with a similar thermal expansion coefficient improves reliability. The method may include applying the adhesive on the attachment subject, forming an interface layer between the integrated circuit chip and the adhesive wherein the interface layer has a thermal expansion coefficient similar to a thermal expansion coefficient of the integrated circuit chip. By connecting an integrated circuit chip and the attachment subject to each other by an adhesive via the interface layer, the generation of delamination is minimized and reliability is improved. | 2008-10-02 |
| 20080237895 | Semiconductor device - The invention provides a semiconductor device including a rectangular chip provided on a mounting region of a substrate, a liquid resin layer provided under the rectangular chip and on a side surface of the chip, and a plurality of dams formed on the substrate so as to extend along the side surface of the rectangular chip. The configuration allows the semiconductor device to be provided with the substrate having a reduced size which is achieved by preventing a liquid resin from flowing out. | 2008-10-02 |
| 20080237896 | Wafer level packages capable of reducing chipping defect and manufacturing methods thereof - A packaged semiconductor device may include a substrate including at least one device layer and at least one connector arranged thereon, and a resin cover covering each side of the substrate, the resin cover on at least one side of the substrate including an opening exposing the connector and the resin cover on at least one other side of the substrate exposing a portion of the substrate. | 2008-10-02 |
| 20080237897 | Microelectronic device having liquid crystalline epoxy resins - Liquid crystalline epoxy compounds, compositions including the compounds, and methods of using the compositions are disclosed. In one aspect, an epoxy compound may have a melting point that is less than 140° C. and may be liquid crystalline at a temperature greater than 150° C. | 2008-10-02 |
| 20080237898 | SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING THE SAME, HEAT SINK, SEMICONDUCTOR CHIP, INTERPOSER SUBSTRATE, AND GLASS PLATE - A semiconductor device of the present invention includes: a laminate structure, including a semiconductor chip, partially sealed with a resin; and a stress relief section for relieving a stress during resin sealing, provided as a convex section including a plain top surface on an uppermost section of the laminate structure, the stress relief section being provided in an annular shape on a peripheral region of the uppermost section so as to come into contact with the sealing resin. This makes it possible to improve the manufacturing yield of the semiconductor device in which the member of the uppermost section is exposed. | 2008-10-02 |
| 20080237899 | Break resistant joint - There is disclosed a portable misting fan formed by upper and lower body portions which are joined together along a joint. The joint is improved by providing the lower body portion with a non-circular neck portion along its top end, and wherein the upper body portion includes two halves which terminate in lower body collar sections, intended to be joined together in overlying relationship relative to the neck portion. A rail and groove system is employed as between the upper first and second body portions, and the neck portion, so that the rails will slidingly engage the grooves in the neck portion rendering the joint resistant to rotation. The neck portion includes an aperture into which a sleeve is press fitted, the sleeve includes upper and lower lips, and the lower body collar sections include inwardly extending flanges which overlie and engage the upper and lower lips formed in the sleeve, thereby brace and secure the pump assembly within the device. | 2008-10-02 |
| 20080237900 | Handheld water misting fan with improved air flow - The present invention is directed to an improved handheld water misting fan device wherein the power source compartment is positioned within the device at a location remote from the fan motor thereby to remove any structure from the area bounded by the fan shroud. The relocation of the power source compartment leaves the area bounded by the shroud substantially unobstructed thereby to improve air flow. The device is formed in a dog bone shaped configuration to provide a narrow handle section for improved grippability, and an enlarged fluid reservoir at the lower end thereof for greater reservoir capacity. | 2008-10-02 |
| 20080237901 | Water Purifying Apparatus - A water purifying apparatus includes a tubular portion having an inlet for receiving water and an outlet for emitting the water, and a nozzle portion disposed inside the tubular portion to allow the water flowing through the tubular portion to pass therethrough. The nozzle portion has a nozzle opening for discharging the water toward the outlet. The tubular portion is provided with air supply means for mixing air taken in from outside the tubular portion with the water discharged from the nozzle opening. The nozzle opening has a shape defined by one line segment or a combination of a plurality of line segments. | 2008-10-02 |
| 20080237902 | HUMIDIFIER - In a humidifier including a hollow fiber membrane bundle housed in a case, the hollow fiber membranes exchange water therethrough between the first and second gases flowing inside and outside the hollow fiber membrane to humidify one of the first and second gases having the water content lower than the other, and an annular mesh member throttles a part near the gas outlet of the second gas to provide a space between the part and the gas outlet of the second gas to easily discharge the second gas. | 2008-10-02 |
| 20080237903 | METHOD OF MANUFACTURING THERMOPLASTIC RESIN FILM - A method of manufacturing a thermoplastic resin film, comprising the steps of:
| 2008-10-02 |
| 20080237904 | OPTICAL ARTICLES AND SOL-GEL PROCESS FOR THEIR MANUFACTURE - An optical article, having an almost complete isotropy and dimensions equal to or lower than 500 μm, is prepared in which the sol-gel procedure comprises a preliminar step wherein the mould is cool filled with a sol containing the interesting oxide precursors, the sol gelation, the gel drying, the removal of gel from the mould and the final miniaturization of the dried gel. | 2008-10-02 |
| 20080237905 | Preparation of polyphosphazene microspheres - Methods of producing polyphosphazene microspheres comprising admixing aqueous solutions of a water-soluble polyphosphazene and an organic amine, or salt thereof, are disclosed. | 2008-10-02 |
| 20080237906 | METHOD OF MANUFACTURING PELLET AGGREGATE - A method for manufacturing a pellet aggregate by melting a raw material including a saturated norbornene resin and an additive to prepare a fluid, and cutting the fluid into pellets. In the method, the cutting of the fluid into the pellets is performed in a liquid to separate powder generated in manufacturing the pellets together with the liquid. And/Or, the manufactured pellets are passed through a sieve having a mesh size of 1 mm or more and 2 mm or less to separate powder generated in manufacturing the pellets. Whereby, the content of the powder in the pellet aggregate becomes a predetermined amount or less. | 2008-10-02 |
| 20080237907 | Process for the preparation of a polymerizable dental composition - A process for the preparation of a polymerizable dental composition comprising the steps of
| 2008-10-02 |
| 20080237908 | Vibration apparatus and methods of vibration - The present invention relates to apparatus and methods of vibration. In particular, the present invention relates to apparatus and methods of vibration for tooling in a structure, such as, for example, a fuselage. In one implementation, the tooling comprises at least two conductors that create a force to vibrate the media in the tooling, which improves the compaction of the media in the tooling and the extraction of the media from the tooling. Other implementations may be used for compaction and/or extraction of the media in the tooling. | 2008-10-02 |
| 20080237909 | Mould for Preparing Large Structures, Methods of Preparing Mould and Use of Mould | 2008-10-02 |
| 20080237910 | Resin composition, resin compact, production method of resin compact and recycling method of resin compact - A resin composition, includes: an aliphatic polyester; a second polymer compound having a glass transition point higher than a glass transition point of the aliphatic polyester; and aluminum phosphate. | 2008-10-02 |
| 20080237911 | Method to apply multiple coatings to a fiber web - A method for applying multiple polymeric coatings onto a fibrous substrate. More particularly, a method for applying multiple polymeric coatings onto fibrous substrates without regard to chemical or physical incompatibilities of the polymeric coating materials. A first polymeric material is applied onto at least one fibrous substrate, and a second polymeric material is applied onto a support. The fibrous substrate and support are joined, contacting the first polymeric material with the second polymeric material, followed by separating the support from the fibrous substrate, such that at least a portion of the second polymeric material remains on the first polymeric material on the fibrous substrate. | 2008-10-02 |
| 20080237912 | METHOD OF PRODUCING STAMPER FOR OPTICAL RECORDING MEDIUM, METHOD OF PRODUCING SUBSTRATE, METHOD OF PRODUCING OPTICAL RECORDING MEDIUM, AND APPARATUS FOR PRODUCING STAMPER FOR OPTICAL RECORDING MEDIUM - In a method of producing a stamper for roughening a substrate of an optical recording medium, a masking treatment is carried out prior to a blasting treatment, whereby a second pit forming site of a metal plate is protected such that the second pit forming site is not broken in the following blasting treatment. A mask of an adhesive sheet is attached to the second pit forming site in the masking treatment, and then a part of one major surface of the metal plate, exposed between the mask, is roughened in the blasting treatment. An original stamper of the metal plate, having a partly roughened major surface, is obtained by the blasting treatment. | 2008-10-02 |
| 20080237913 | METHOD FOR STRETCHING POLYMER FILM - A rear end portion of a leading TAC film and a front end portion of a following TAC film are connected using a double-sided adhesive tape and acetone, in order to stretch the TAC films continuously in a tenter. The double-sided adhesive tape is constituted of a base whose material is same as the TAC film and an adhesive layer coated on both surfaces of the base. Acetone is one of solvents used for preparing a dope in the TAC film production. The double-sided adhesive tape is firstly stuck on an upper surface of the rear end portion of the leading TAC film. Acetone is then applied, using a spray, on coating areas of the rear end portion of the leading TAC film. After that, the front end portion of the following TAC film is layered on the rear end portion of the leading TAC film, and the films are pressed and connected. | 2008-10-02 |
| 20080237914 | Methods for making fiber reinforced polypropylene composites using pre-cut fiber - The present disclosure is directed generally to methods for making fiber reinforced polypropylene composite pellets using pre-cut fiber fed to a compounding extruder by improved fiber feeder systems. One form of the method includes feeding into a compounding extruder at least 25 wt % polypropylene based polymer, from 5 to 60 wt % pre-cut organic fiber, and from 0 to 60 wt % inorganic filler; and extruding, cooling and pelletizing the resultant mixture of components to form fiber reinforced polypropylene composite pellets; wherein the pre-cut organic fiber is fed from a feeder including a feeder hopper, one or more conditioning augers/agitators, one or more metering augers below the feeder hopper, and a means for controlling the speed of the conditioning augers/agitators and metering augers; and wherein an article molded from the pellets has a flexural modulus of at least 2.07 GPa and exhibits ductility during instrumented impact testing. In another form, the feeder includes a feeder hopper, two or more counter-rotating metering rollers, one or more separating rollers below the metering rollers, and a means for controlling the speed of the metering rollers and separating rollers. In yet another form, a circle feeder may be used to feed the pre-cut fiber. | 2008-10-02 |
| 20080237915 | Process for Manufacturing Improved Dispensing Devices - The present invention relates to a method for the manufacture of a lavatory dispensing device useful for the delivery of at least one treatment composition, preferably a cleaning composition and/or a sanitizing composition to a sanitary appliance. | 2008-10-02 |
| 20080237916 | METHOD FOR STRETCHING POLYMER FILM - A rear end portion of a leading TAC film and a front end portion of a following TAC film are dissolved in acetone and connected. After being stretched in a tenter, the TAC films are sent to an edge slitting device. In the edge slitting device, both side edges of the TAC films that are held with clips are slit along slit lines. The slit side edges are cut into pieces by a cutter blower and then shredded into chips by a crusher. Since the slit side edges of the leading and following TAC films are welded with acetone, they can be recycled as being connected. | 2008-10-02 |
| 20080237917 | Plastics Pipe - A method for the production of a plastics pipe ( | 2008-10-02 |
| 20080237918 | Production of a creped material for connections and transitions on buildings - For producing a creped material, especially a sealing material for connections and transitions on buildings, with this material being provided with crepe folds, wherein the crepe folds run in different directions, a method is disclosed with the steps of: a) preparing a deformable material web ( | 2008-10-02 |
| 20080237919 | Method and apparatus for membrane deposition - A method and apparatus for applying a uniform membrane coating to a substrate, such as a honeycomb structure, having a plurality of through-channels, wherein the through-channels have an average diameter of less than or equal to 3 mm. The method includes providing a liquid precursor comprising membrane-forming materials to the substrate and applying a pressure differential across the substrate. The pressure differential causes the liquid precursor to travel uniformly through the through-channels, depositing the membrane-forming materials on the walls of the through-channels and forming the membrane on the walls of the through-channels. The apparatus includes a chamber capable of holding the substrate and of maintaining a pressure differential across the plurality of through-channels. | 2008-10-02 |
| 20080237920 | SOLUTION CASTING APPARATUS AND METHOD - A dope containing a polymer and a solvent is discharged as a casting bead from a casting die onto a running (rotating) casting drum to form a casting film. First and second partition plates are provided upstream and downstream from the casting die, respectively. A third partition plate is provided upstream of a peeling roller disposed upstream of the casting die in the rotational direction of the casting drum. Dry air is supplied from a dry air circulator to a drying chamber defined by the second and third partition plates. A side labyrinth seal portion is provided close to the side end surface of the casting drum. A labyrinth seal portion of each of the first to third partition plates and the side labyrinth seal portion prevent dry air from entering the casting chamber even when flow volume of dry air is increased for high-speed casting. | 2008-10-02 |
| 20080237921 | POLYMERIC COVER FOR ROBOTS - The present invention involves a cover for a spraying device of a robot which is formed from a polymer with enhanced residue retention properties. The polymer may be processed to increase the surface energy of the polymer. For example, the polymer may be subjected to a corona treatment in order to increase its surface energy. The corona treatment process may be performed on the polymer as received, prior to cutting or otherwise manipulating the polymer. Also, the polymer may be embossed to provide the enhancement. To assemble the polymer into a robot cover, the polymer as received may be cut into individual sections for assembly. The sections may then be assembled to one another by heat sealing the sections together. The heat sealing provides a bond between the individual sections of polymer that secures the individual sections together to create the robot cover. The polymer may also be formed into tubular sections for securing to the spraying device. | 2008-10-02 |
| 20080237922 | Composite components with integral protective casings - Methods and compositions for fabricating composite parts including at least one structural material and at least one protective material that are integrally bonded without the use of secondary bonding operations. One or more of the materials forming the layers of the composite parts may be a ceramic composition with or without porosity and one or more of the materials may be a polymer composition. Methods including co-injection processes also are provided for fabricating multi-layered structures in which each layer serves a desired function while still being integrated into the overall structure. | 2008-10-02 |
| 20080237923 | PROCESS FOR THE PRODUCTION OF A SHAPED ARTICLE - The invention relates to a process for the production of a shaped article comprising the compression of one or more fibre layers containing polyolefin fibres. The invention also relates to shaped articles obtainable with the process according to the invention and their use in anti-ballistic applications. In the process according to the invention the fibre layers contain 0.02 to 25 wt. % of a solvent for the polyolefin. The shaped articles obtained have an improved anti-ballistic quality. | 2008-10-02 |
| 20080237924 | FILTER CARTRIDGE AND METHOD OF CONSTRUCTION THEREOF - A filter cartridge includes a one-piece housing having a port and a filtration element disposed in the housing. The filtration element is a coherent filter block that can be, but is not necessarily, larger in cross dimension than the port. In one embodiment, the filtration element is a coherent filter block that generally conforms to the shape of the hollow interior, but is slightly smaller than the hollow interior so as to define a gap between the filtration element and the inner surface. One method for constructing a filter cartridge includes providing a housing having a hollow interior and at least one port, introducing a granular material into the hollow interior via the port, and transforming the granular material in the hollow material into a coherent filter block. Another method for constructing a filter cartridge includes providing a filtration element in the form of a coherent filter block, and overmolding a housing around the filtration element. | 2008-10-02 |
| 20080237925 | Vehicle Component and Method For Making a Vehicle Component - A trim panel includes a one-piece molded member having a molded-in edge wrap along at least one edge. The molded-in edge wrap is formed by a process wherein a cover stock material ( | 2008-10-02 |
| 20080237926 | Process for the Manufacture of Oriented Polymer Strips - A process for the manufacture of an oriented strip comprising a semi-crystalline polymer according to which a film comprising said polymer is drawn in a longitudinal direction on a length L between 2 points at which the film moves at a respective linear velocity of V | 2008-10-02 |
| 20080237927 | METHOD FOR STRETCHING POLYMER FILM AND DEVICE FOR RECOVERING SLIT FILM EDGE - A rear end portion of a leading TAC film and a front end portion of a following TAC film are connected using a double-sided adhesive tape and a single-sided adhesive tape. Both side edges of the TAC films are slit with cutters of an edge slitting device. The slit side edges are sent to a cutter blower. In the cutter blower, the slit side edges are cut into small pieces and sent to a crusher through a first pipe. Upon receiving a tape detection signal, a plate controller rotates a plate from a close position to an open position. When the plate is in the open position, the cut films are sent from the first pipe to a second pipe via an opening, and then to a receptacle. | 2008-10-02 |
| 20080237928 | CASTING DEVICE, SOLUTION CASTING APPARATUS, AND SOLUTION CASTING METHOD - A casting dope is cast onto a casting belt to form a casting film, and then the casting film is peeled as a wet film from the casting belt. The wet film is guided through a transfer area toward a tenter drying device. In the tenter drying device, a tenter performs sequentially the drying, the stretching and the relaxation of the wet film during transporting the wet film. On the wet film, a bowing phenomena occurs by the relaxation to generate a first disorientation of an optical axis, and therefore the orientation of slow axed becomes not uniform. The stretching provide a second disorientation of the optical axis so as to cancel the first disorientation. Thus in the obtained film, the nonuniformity of the orientation of the slow axes is reduced. | 2008-10-02 |
| 20080237929 | Systems and methods for tire construction - In various embodiments, different sections of a tire may be preformed and bonded together. The preformed sections may include at least one fixing lug formed thereon. The preformed sections may be placed into a bonding mold where the preformed sections may be aligned in the bonding mold by aligning the fixing lugs on the preformed sections with corresponding features in the bonding molds. In some embodiments, bonding material may be placed on bonding areas between the preformed sections and the preformed sections may be placed in the bonding mold. In some embodiments, compressed air may be supplied through the air intake valve to the preformed sections in the bonding mold. Thermal energy may be applied to the preformed sections to form the tire. | 2008-10-02 |
| 20080237930 | ZERO GAP ZERO FLUSH BEZEL FIT METHOD FOR VACUUM WRAPPED OR MOLD BEHIND AUTOMOTIVE INSTRUMENT PANEL, DOOR INNER LINER AND RELATED CONSTRUCTIONS - A method of producing tight bezel fits between automotive interior panels and their mating subcomponents. The method includes forming at laminate preform, injection molding a substrate layer behind the laminate preform to form a molded automotive interior panel, and forming an opening in the molded automotive interior panel. The method further includes post embossing the molded automotive interior panel adjacent a perimeter of the opening to produce an embossed interface between the molded automotive interior panel and a mating subcomponent installed in the opening, thereby producing a tight bezel fit between the molded automotive interior panel and the mating subcomponent installed in the opening. Alternatively, the method includes utilizing a vacuum wrapped automotive interior panel with the embossing step described above. The invention also provides for an automotive interior panel including a tight bezel fit between the panel and mating subcomponents, formed by the aforementioned methods. | 2008-10-02 |
| 20080237931 | Mold for Fine Pattern Transfer and Method for Forming Resin Pattern Using Same - A mold for forming a resin pattern using nanoimprint lithography according to the present invention comprises a main mold including a fine pattern of a protrusion and a depression intended to be transferred, and a spacer for forming a space between the protrusion of the fine pattern of the main mold and a transferred object during a transfer of the fine pattern, in which the spacer has a vent passage capable of flowing gas therethrough and has an elasticity against a pressing force during the transfer. | 2008-10-02 |
| 20080237932 | Application material extruding container and forming method of application material extruding container - To reduce manufacturing cost of an extruding container, a female thread member ( | 2008-10-02 |
| 20080237933 | Methods and systems for manufacturing the manufacture of layered three-dimensional forms - New methods and systems for manufacturing a three-dimensional form, comprising steps of providing a plurality of particulates; contacting the particulates with an activation agent; contacting particulates having the activation agent with a binder material that is activatable by the activation agent; at least partially hardening the binder for forming a layer of the three-dimensional form; and repeating these steps to form the remainder of the three-dimensional form. Following sequential application of all required layers and binder material to make the form, the unbound particles are appropriately removed (and optionally re-used), to result in the desired three-dimensional form. The invention also contemplates a novel method for preparing a form, where unbound particulates free of binder material are re-claimed. | 2008-10-02 |
| 20080237934 | Method and Device For Producing Electrospun Fibers and Fibers Produced Thereby - The present invention relates to methods for producing fibers made from one or more polymers or polymer composites, and to structures that can be produced from such fibers. In one embodiment, the fibers of the present invention are nanofibers. The present invention also relates to apparatus for producing fibers made from one or more polymers or polymer composites, and methods by which such fibers are made. | 2008-10-02 |
| 20080237935 | Biaxially Oriented polyolefing Film Having Improved Surface Properties - The invention relates to a method for raising the surface tension of biaxially-stretched films made of thermoplastic polymers. According to the method, a film is first treated on a surface by means of an atmospheric pressure plasma before being stretched transversally or simultaneously across the width thereof, and the film is additional a subjected to a second treatment by means of a corona or flame after being stretched transversally or simultaneously, the second treatment being done on the same surface which has already been plasma-treated. | 2008-10-02 |
| 20080237936 | Pattern forming mold and method and apparatus for forming a pattern - A pattern forming mold according to an exemplary embodiment of the present invention includes a body, an effective pattern formed at the body, and a dummy pattern formed along a circumference of the effective pattern. The pattern forming mold may further include a light blocking unit formed along a circumference of the effective pattern at a region corresponding to the dummy pattern. | 2008-10-02 |
| 20080237937 | Means and Method for Producing Enhanced Object Gripping Surfaces and Enhancing Object Strength, and The Objects So Enhanced - A process for enhancing a gripping area of an object, providing a frictionally enhanced, moisture repellent, sure-grip gripping surface, achieved by less than one second ultraviolet radiation curing of an ultraviolet-curable coating applied over polymeric fibers enveloping the gripping surface of the object. This inexpensive three step process uses commonly available, low-cost materials, minimal energy, is environmentally friendly, does not require repeated steps, thermosetting, vulcanization, caustic chemicals, molds, molding techniques, and gluing a molded cover onto a surface. Also, metallicized objects where metallicizing imparts superior strength to objects reducing or eliminating breakage and/or splintering when impacted, by a ball if object is a bat reducing or eliminating potential lethal hazards often imparted to a ball when hit by aluminum bats. | 2008-10-02 |
| 20080237938 | Method for manufacturing information recording medium, method of transferring concavo-convex pattern, and transfer apparatus - A method for manufacturing an information recording medium, a method of transferring a concavo-convex pattern, and a transfer apparatus are provided which are capable of curing a resin material with reliability even when using a light-transmitting stamper repeatedly. A stamper made of a light-transmitting resin, having a predetermined concavo-convex pattern formed on its transfer area, is inspected for an optical characteristic. The stamper is brought into contact with an energy-ray curable resin material applied to an object to be processed, thereby transferring the concavo-convex pattern to the resin material, and the resin material is irradiated with an energy ray through the stamper so that the resin material cures. The stamper is used a plurality of times to repeat these steps a plurality of times, thereby manufacturing a plurality of information recording media. | 2008-10-02 |
| 20080237939 | Soft Plastic Insert For Use In Protective Case - An insert for protecting articles to be stored in a protective case. The insert is generally hollow and formed of a flexible thermoplastic material. The insert may be formed by a blow-molding process. The insert is shaped to fit within a protective case, which is also often formed by a blow-molded process. The material used to form the insert is less dense than that of the material used to form the protective case, and therefore the insert material is less stiff, softer, and more flexible. | 2008-10-02 |
| 20080237940 | Sold ink stick formation with flexible molding tool - A molding tool is provided for forming solid ink sticks. The molding tool comprises a vessel having at least one sidewall defining a cavity for receiving molten phase change ink material. The molding tool includes a lid for covering an opening over the cavity of the vessel. The lid has an interior surface for at least partially enclosing the cavity. The enclosed cavity has a shape corresponding to at least a portion of an ink stick shape. The at least one sidewall of the vessel and/or the interior surface of the lid are configured to flex to facilitate release of an at least partially solidified ink stick from the cavity. | 2008-10-02 |
| 20080237941 | METHOD FOR MANUFACTURING HONEYCOMB STRUCTURE - A honeycomb structure is manufactured by molding a pillar-shaped honeycomb molded body having a large number of cells disposed in parallel with one another in a longitudinal direction with a cell wall therebetween by extrusion-molding a raw material composition including a ceramic powder and a binder, and carrying out a firing treatment on the honeycomb molded body to manufacture a honeycomb fired body. A plurality of the honeycomb fired bodies are provided, and both end faces of each of the plurality of the honeycomb fired bodies are hold with a holding member after positioning the plurality of the honeycomb fired bodies on a predetermined position. An adhesive paste is injected into a gap between the plurality of honeycomb fired bodies held on the predetermined position. The adhesive paste is dried and solidified to form an adhesive layer. | 2008-10-02 |
| 20080237942 | METHOD FOR MANUFACTURING POROUS SILICON CARBIDE SINTERED BODY - A method for manufacturing a porous silicon carbide sintered body that includes manufacturing a silicon carbide molded body by using a raw material composition containing at least silicon carbide powder, silicon powder, and a binder. The method further includes carrying out a degreasing treatment on the silicon carbide molded body to manufacture a silicon carbide degreased body, and carrying out a firing treatment on the silicon carbide degreased body to manufacture a porous silicon carbide sintered body. The raw material composition has about 1 to about 3% by weight of the total amount of the silicon carbide powder and the silicon powder in a content of the silicon powder. And, the firing treatment is carried out at a temperature allowing silicon carbide powder to mutually form intergranular necks through counter diffusion. | 2008-10-02 |
| 20080237943 | Arrangement and a Method For Heating Metal Objects - The invention relates to a an arrangement and a method for heating metal objects such as metal bars by convection. The metal objects are passed on a conveyor through a series of chambers where hot air is blown through the conveyor. The temperature is controlled by a sensor connected to a control devise such as a thyristor. | 2008-10-02 |
