39th week of 2008 patent applcation highlights part 15 |
Patent application number | Title | Published |
20080230873 | SEMICONDUCTOR DEVICE WITH CAPACITOR AND/OR INDUCTOR AND METHOD OF MAKING - An integrated circuit has a plurality of terminals for making electrical connection to the integrated circuit. At least one device is formed adjacent an outer edge of the integrated circuit. The device includes at least one metal conductor for forming an edge seal for protecting the integrated circuit during die singulation. The device is coupled to one or more functional circuits within the integrated circuit by routing the at least one metal conductor to the one or more functional circuits, the at least one device providing a reactance value to the one or more functional circuits for non-test operational use. The device may be formed as one or more capacitors or as one or more inductors. Various structures may be used for the capacitor and the inductor. | 2008-09-25 |
20080230874 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE - A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer. | 2008-09-25 |
20080230875 | DUV LASER ANNEALING AND STABILIZATION OF SiCOH FILMS - A method of fabricating a dielectric film comprising atoms of Si, C, O and H (hereinafter SiCOH) that has improved insulating properties as compared with prior art dielectric films, including prior art SiCOH dielectric films that are not subjected to the inventive deep ultra-violet (DUV) is disclosed. The improved properties include reduced current leakage which is achieved without adversely affecting (increasing) the dielectric constant of the SiCOH dielectric film. In accordance with the present invention, a SiCOH dielectric film exhibiting reduced current leakage and improved reliability is obtained by subjecting an as deposited SiCOH dielectric film to a DUV laser anneal. The DUV laser anneal step of the present invention likely removes the weakly bonded C from the film, thus improving leakage current. | 2008-09-25 |
20080230876 | Leadframe Design for QFN Package with Top Terminal Leads - A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top portion. The top portion forms a top terminal lead structure. A second lead finger is electrically connected to the first lead finger. A portion of the second lead finger forms a bottom terminal lead structure. A portion of the second lead finger corresponds to a bottom surface of the semiconductor package. A surface of the substantially flat, top portion corresponds to a top surface of the semiconductor package. | 2008-09-25 |
20080230877 | SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME - A semiconductor package and a method of fabricating the same. The method includes providing a semiconductor substrate on which a chip pad is formed. A wire redistribution layer connected to the chip pad is formed. An insulating layer which includes an opening exposing a portion of the wire redistribution layer is formed. A metal ink is applied within the opening to thereby form a bonding pad. The applied metal ink within the opening and the insulating layer can be cured simultaneously. | 2008-09-25 |
20080230878 | Leadframe based flip chip semiconductor package and lead frame thereof - A flip chip semiconductor package is disclosed according to the present invention, the flip chip semiconductor package comprises a chip that is mounted on and electrically connects to a leadframe via a plurality of solder bumps by means of flip chip, and an encapsulate that encapsulates the chip, the plurality of solder bumps, and the leadframe, wherein, the leadframe further comprises a plurality of leads and a ground plane that is located between the plurality of leads, and also a slit is formed on the ground plane, and then a molding compound that makes up the encapsulant should be capable of filling within the slit, thus to enhance the adhesion between the ground plane and the encapsulant, and then avoid delamination between the ground plane and the encapsulant in subsequent thermal cycle processes, thereby increasing the reliability of fabricated products. | 2008-09-25 |
20080230879 | METHODS AND APPARATUS FOR FLIP-CHIP-ON-LEAD SEMICONDUCTOR PACKAGE - Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and placing a die on the first assembly, the die having an active area. Fabrication can further include reflowing the conductive material to form a second assembly such that a connection extends from the die active area, through the conductive material, to the protrusion. A semiconductor package includes a leadframe having a protrusion, a conductive material reflowed to the protrusion, and a die having an active area coupled to the protrusion by the reflowed solder. | 2008-09-25 |
20080230880 | Leadframe Array with Riveted Heat Sinks - The invention provides improved rivet and heat sink arrangements in leadframes and IC packages. The invention discloses a semiconductor device leadframe array with numerous leadframes having integrated circuit sites provided for receiving individual integrated circuit chips. Support strips are arranged adjacent to and supporting the integrated circuit sites in an array of one or more rows. Package areas provided each include one or integrated circuit site for ultimate encapsulation in an integrated circuit package. Rivet points are located on the support strips outside of the package areas. An array of heat sinks having corresponding rivet points is riveted to the leadframe array to complete the assembly. Alternative embodiments of the invention provide apparatus and methods for the assembly of an integrated circuit package with a leadframe having an operably coupled integrated circuit chip. One or more support strips supporting the leadframe include rivet points adjacent to the integrated circuit mounting site. A heat sink is secured in coplanar contact with the leadframe using rivets secured in the rivet points of the leadframe and corresponding rivet points in the heat sink. Individual package assemblies made using the invention provide heat sinks secured in contact with the leadframe, integrated circuit, or both, without the necessity for the inclusion of glues, thermal compounds, welds, tapes, or rivets within the package assembly. | 2008-09-25 |
20080230881 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEAD SUPPORT - An integrated circuit package system is provided including forming a paddle having an integrated circuit die thereover, an outer lead, and an inner lead between the paddle and the outer lead. The integrated circuit package system is also provided including placing a lead support over the inner lead without traversing to an inner body bottom side of the inner lead, connecting the integrated circuit die and the inner lead, and encapsulating the inner lead having the lead support thereover and the inner lead exposed. | 2008-09-25 |
20080230882 | CHIP PACKAGE STRUCTURE - A chip package structure includes a die pad of which at least a notch is formed on at least one side and opposite to a mold gate. The die pad contributes to accelerating the injection of an encapsulating material, so as to exhaust the air in the mold in time, before the encapsulating material solidifies during the molding step, thereby overcoming or at least improving the problem of defects such as air bubbles in the encapsulation. | 2008-09-25 |
20080230883 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MOLDED STRIP PROTRUSION - An integrated circuit package system includes an in-line strip, attaching an integrated circuit die over the in-line strip, and applying a molding material with a molded segment having a molded strip protrusion formed therefrom over the in-line strip. | 2008-09-25 |
20080230884 | Semiconductor device package having multi-chips with side-by-side configuration and method of the same - The present invention provides a semiconductor device package having multi-chips with side-by-side configuration comprising a substrate with die receiving through holes, connecting through holes structure and first contact pads on an upper surface and second contact pads on a lower surface of the substrate. A first die having first bonding pads and a second die having second bonding pads are respectively disposed within the die receiving through holes. The first adhesion material is formed under the first and second die and the substrate, and the second adhesion material is filled in the gap between the first and second die and sidewall of the die receiving though holes of the substrate. Further, bonding wires are formed to couple between the first bonding pads and the first contact pads, between the second bonding pads and the first contact pads. A dielectric layer is formed on the bonding wires, the first and second die and the substrate. A build up layer is form on the lower surface of substrate and the back side of first and second die. | 2008-09-25 |
20080230885 | CHIP HERMETIC PACKAGE DEVICE AND METHOD FOR PRODUCING THE SAME - A chip hermetic package device includes a substrate, a chip, a hermetic lid, a hermetic material and a post. The height of the post is larger than the thickness of the hermetic material. A method for producing a chip hermetic package includes the steps of: mounting the chip on the substrate; disposing the post and the hermetic material between the substrate and the hermetic lid; disposing the hermetic lid on the substrate to form a chamber, the post supporting the hermetic lid on the substrate to form an air passage; and performing a sealing step in an atmosphere of inert gas. The present invention utilizes the post to form the air passage between the substrate and the hermetic lid. Therefore, only is the sealing step performed in the atmosphere of nitrogen, and present invention needs a reduced number of equipment. Therefore, the present invention has a low cost, simplifies the packaging process and improves efficiency. | 2008-09-25 |
20080230886 | Stacked package module - A stacked package module is disclosed, which comprises: a first package structure comprising a first circuit board with a first chip embedded therein, wherein the first chip has a plurality of electrode pads, the first circuit board comprises a first surface, an opposite second surface, a plurality of first conductive pads on the first surface, a plurality of second conductive pads on the second surface, a plurality of conductive vias, and at least one circuit layer, and the electrodes of the first chip directly electrically connect to the conductive pads on the surfaces of the circuit board through the conductive vias and the circuit layer within the circuit board; and a second package structure electrically connecting to the first package structure through a plurality of solder balls to make package on package. The stacked package module provided by this invention has characteristics of compact size, high performance, and high flexibility. | 2008-09-25 |
20080230887 | SEMICONDUCTOR PACKAGE AND THE METHOD OF MAKING THE SAME - The present invention relates to semiconductor package and the method of making the same. The method of the invention comprises the following steps: (a) providing a first substrate; (b) mounting a first chip onto a surface of the first substrate; (c) forming a plurality of conductive elements on the surface of the first substrate; (d) covering the conductive elements with a mold, the mold having a plurality of cavities accommodating top ends of each of the conductive elements; and (e) forming a first molding compound for encapsulating the surface of the first substrate, the first chip and parts of the conductive elements, wherein the height of the first molding compound is smaller than the height of each of the conductive elements. Thus, the first molding compound encapsulates the entire surface of the first substrate, so that the mold flush of the first molding compound will not occur, and the rigidity of the first substrate is increased. | 2008-09-25 |
20080230888 | Semiconductor device - A first memory chip ( | 2008-09-25 |
20080230889 | SEMICONDUCTOR PACKAGE - A semiconductor package that includes a substrate having a metallic back plate, an insulation body and a plurality of conductive pads on the insulation body, and a semiconductor die coupled to said conductive pads, the conductive pads including regions readied for direct connection to pads external to the package using a conductive adhesive. | 2008-09-25 |
20080230890 | STRUCTURE AND ELECTRONICS DEVICE USING THE STRUCTURE - A structure includes a circuit substrate including a first substrate and a second substrate. The first substrate has a region where an electronic component is to be mounted. The second substrate has a side surface connected to a first side surface of the first substrate. The structure further includes a frame on the circuit substrate, enclosing the region in a plane view. The frame crosses the boundary between the first substrate and the second substrate. | 2008-09-25 |
20080230891 | CHIP AND WAFER INTEGRATION PROCESS USING VERTICAL CONNECTIONS - A metallized feature is formed in the top surface of a substrate, and a handling plate is attached to the substrate. The substrate is then thinned at the bottom surface thereof to expose the bottom of the feature, to form a conducting through-via. The substrate may comprise a chip having a device (e.g. DRAM) fabricated therein. The process therefore permits vertical integration with a second chip (e.g. a PE chip). The plate may be a wafer attached to the substrate using a vertical stud/via interconnection. The substrate and plate may each have devices fabricated therein, so that the process provides vertical wafer-level integration of the devices. | 2008-09-25 |
20080230892 | Chip package module - A chip package module is disclosed, which comprises a core plate and two rigid plates individually having a circuit layer. The core plate is sandwiched in between the two rigid plates to form a composite circuit board. Furthermore, the two rigid plates individually have a cavity to expose the surface of the core plate. In addition, the cavities individually have at least one chip disposed therein, and each chip electrically connects to the composite circuit board. The present invention reduces the height of the package module and makes the package module lighter and smaller. | 2008-09-25 |
20080230893 | Integrated Circuit with Package Lid - Various integrated circuit packages, lids therefor and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing an integrated circuit package lid that has a surface adapted to face towards an integrated circuit, and forming a wetting film on the surface. The wetting film has at least one void where the surface of the lid is exposed. The void inhibits bonding so that a stress reduction site is produced. | 2008-09-25 |
20080230894 | Carbon nanotubes for active direct and indirect cooling of electronics device - A system for cooling a semiconductor device is disclosed. The system includes a lid encasing the semiconductor device, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. Furthermore, a second system for cooling a semiconductor device is disclosed. The second system includes a lid, a first plurality of carbon nanotubes disposed within the lid, and a fluid system configured to pass a fluid through the lid. The lid is configured to be mounted over and encase the semiconductor device. Additionally, a method for cooling a semiconductor device is disclosed. The method includes disposing a first plurality of carbon nanotubes within a lid, mounting the lid over the semiconductor device, and passing a fluid through the lid. | 2008-09-25 |
20080230895 | SEMICONDUCTOR PACKAGE AND THE METHOD FOR MANUFACTURING THE SAME - A method for manufacturing semiconductor packages is provided. The upper surface of a substrate has a plurality of slots and surface mount devices are positioned across the slots. In this circumstance, the space below the surface mount devices can be filled up with sealant as a result of the arrangement of the slots. This can avoid the occurrence of the melted solders to bridge to each other and of the tomb stone effect of the surface mount devices. | 2008-09-25 |
20080230896 | Copper die bumps with electromigration cap and plated solder - Embodiments of the invention include apparatuses and methods relating to copper die bumps with electromigration cap and plated solder. In one embodiment, an apparatus comprises an integrated circuit die, a plurality of copper bumps on a surface of the die, electromigration (EM) caps substantially covering a mating surface of the copper bumps capable of controlling intermetallic formation between the copper bumps and a solder, and solder plating on the EM caps capable of protecting the EM caps from oxidation prior to packaging. | 2008-09-25 |
20080230897 | METHOD OF MANUFACTURING ELECTRONIC DEVICE, SUBSTRATE AND SEMICONDUCTOR DEVICE - A method includes a step of forming a bump | 2008-09-25 |
20080230898 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THEREOF - A semiconductor device which includes a first semiconductor chip, a second semiconductor chip flip-chip bonded to the first semiconductor chip, a resin portion for sealing the first semiconductor chip and the second semiconductor chip such that a lower surface of the first semiconductor chip and an upper surface of the second semiconductor chip are exposed and a side surface of the first semiconductor chip is covered, and a post electrode which pierces the resin portion and is connected to the first semiconductor chip, and a manufacturing method thereof are provided. | 2008-09-25 |
20080230899 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In a semiconductor device according to the present invention, a plurality of opening regions | 2008-09-25 |
20080230900 | DETERMINING THE PLACEMENT OF SEMICONDUCTOR COMPONENTS ON AN INTEGRATED CIRCUIT - Systems and methods are disclosed herein for determining the placement of a standard cell, representing a semiconductor component in a design stage, on an integrated circuit die. One embodiment of a method, among others, comprises analyzing regions of a semiconductor die with respect to the susceptibility of the region to be exposed to radiation. This method further comprises placing the standard cell in one of the analyzed regions of the semiconductor die, the standard cell being placed based on the sensitivity of the standard cell to radiation. The method may also comprise running an algorithm, e.g. using a component placement engine, for determining the placement of semiconductor components on an integrated circuit die. | 2008-09-25 |
20080230901 | STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH DISPLACED CAPTURED PADS - A structure, for controlled collapse chip connection (C4) between an integrated circuit (IC) and a substrate, that alleviates the adverse effects resulting from induced stresses in C4 solder joints, the structure includes: a first and second array defined on the ball limiting metallurgy (BLM) side of the IC; a first and second array of surface mount (SM) pads arranged on the substrate placement side; and wherein the reduction of the adverse effects resulting from the induced stress in the solder joints is facilitated by varying the relative alignment of the first and second arrays of SM pads to the first and second arrays of solder balls. | 2008-09-25 |
20080230902 | Method of Forming Solder Bump on High Topography Plated Cu - A solder bump is formed on a high-topography, electroplated copper pad integrating a first and second passivation layer. A sacrifice layer is deposited over the second passivation layer. The sacrifice layer is lithographically patterned. A via is etched in the sacrifice layer. A solder bump is formed in the via. A portion of the sacrifice layer is removed using the solder bump as a mask. A semiconductor device includes a substrate, an input/output (I/O) pad disposed over the substrate, a first passivation layer disposed over a portion of the I/O pad, a first conductive layer disposed over the first passivation layer, a second passivation layer disposed over the first conductive layer, a sacrifice layer disposed over the second passivation layer, the sacrifice layer having a via, and a solder bump formed in the via, the solder bump used as a mask to remove a portion of the sacrifice layer. | 2008-09-25 |
20080230903 | SEMICONDUCTOR CHIP, SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING THE SAME - A semiconductor chip constitutes a semiconductor device in which a plurality of semiconductor chips are laminated. The semiconductor chip includes a plurality of terminals which are to be connected to another semiconductor chip. At least one terminal of the terminals has a higher height than that of another terminal. | 2008-09-25 |
20080230904 | Gallium Nitride-Based III-V Group Compound Semiconductor Device and Method of Manufacturing the Same - The present invention relates to a gallium nitride-based compound semiconductor device and a method of manufacturing the same. According to the present invention, there is provided a gallium nitride-based III-V group compound semiconductor device comprising a gallium nitride-based semiconductor layer and an ohmic electrode layer formed on the gallium nitride-based semiconductor layer. The ohmic electrode layer comprises a contact metal layer, a reflective metal layer, and a diffusion barrier layer. | 2008-09-25 |
20080230905 | Power Semiconductor Module, Method for Producing a Power Semiconductor Module, and Semiconductor Chip - In a power semiconductor module, a copper-containing first soldering partner, a connection layer, and a copper-containing second soldering partner are arranged successively and fixedly connected with one another. The connection layer has a portion of intermetallic copper-tin phases of at least 90% by weight. For producing such a power semiconductor module the soldering partners and the solder arranged there between are pressed against one another with a predefined pressure and the solder is melted. After termination of a predefined period of time the diffused copper and the tin from the liquid solder form a connection layer comprising intermetallic copper-tin phases, the portion of which is at least 90% by weight of the connection layer created from the solder layer. | 2008-09-25 |
20080230906 | CONTACT STRUCTURE HAVING DIELECTRIC SPACER AND METHOD - A contact structure and method of forming same are disclosed. The contact structure may include a metal body surrounded by a dielectric spacer, the metal body and the dielectric spacer positioned within an interlevel dielectric layer, wherein the metal body is electrically coupled to a silicide region below a lowermost portion of the metal body. | 2008-09-25 |
20080230907 | INTEGRATED CIRCUIT SYSTEM WITH CARBON ENHANCEMENT - An integrated circuit hard mask processing system is provided including providing a substrate having an integrated circuit; forming an interconnect layer over the integrated circuit; applying a low-K dielectric layer over the interconnect layer; forming a via opening through the low-K dielectric layer to the interconnect layer; and forming a carbon implant region around the via opening, a trench opening, or a combination thereof, for protecting the low-K dielectric layer. | 2008-09-25 |
20080230908 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a pad that is formed on a semiconductor layer, contains Al, and has an interconnection portion that is formed outside a bonding area; an interconnection layer that contains Au and is electrically connected to the interconnection portion of the pad, an edge of the interconnection layer being formed outside of the bonding area; and a barrier layer that is provided between the interconnection portion and the interconnection layer. | 2008-09-25 |
20080230909 | Method for forming anti-stiction bumps on a micro-electro mechanical structure - A technique for forming anti-stiction bumps on a bottom surface of a micro-electro mechanical (MEM) structure includes a number of process steps. The MEM structure is fabricated from an assembly that includes a support substrate bonded to a single-crystal semiconductor layer, via an insulator layer. A plurality of holes are formed through the single-crystal semiconductor layer to the insulator layer on an interior portion of a defined movable structure. A portion of the insulator layer underneath the holes is removed. The holes are then filled with a conformal film that extends below a lower surface of the defined movable structure to provide a plurality of anti-stiction bumps. A trench is then formed through the single-crystal semiconductor layer to the insulator layer to form the defined movable structure. Finally, a remainder of the insulator layer underneath the defined movable structure is removed to free the defined movable structure. | 2008-09-25 |
20080230910 | INTEGRATED CIRCUIT AND METHOD FOR PRODUCING THE SAME - An integrated circuit provides a carrier substrate, a wiring level above a carrier substrate, wherein the wiring level comprises a first conductor track composed of a first conductive material and a second conductor track composed of the first conductive material, an insulating layer above the wiring level, wherein the insulating layer comprises a first opening in a region of the first conductor track of the wiring level and a second opening in a region of the second conductor track of the wiring level and a contact bridge composed of a second conductive material, wherein the contact bridge is connected to the first conductor track in a region of the first opening and is connected to the second conductor track in a region of the second opening. | 2008-09-25 |
20080230911 | Method of forming a silicide layer on a thinned silicon wafer, and related semiconducting structure - A semiconducting structure includes a thinned silicon substrate ( | 2008-09-25 |
20080230912 | WAFER-LEVEL STACK PACKAGE AND METHOD OF FABRICATING THE SAME - A method of manufacturing a semiconductor device includes forming an integrated circuit region on a semiconductor wafer. A first metal layer pattern is formed over the integrated circuit region. A via hole is formed to extend through the first metal layer pattern and the integrated circuit region. A final metal layer pattern is formed over the first metal layer pattern and within the via hole. A plug is formed within the via hole. Thereafter, a passivation layer is formed to overlie the final metal layer pattern. | 2008-09-25 |
20080230913 | Stackable semiconductor device and fabrication method thereof - The invention provides a stackable semiconductor device and a fabrication method thereof, including providing a wafer having a plurality of dies mounted thereon, both the die and the wafer having an active surface and a non-active surface opposing one another respectively, wherein each die has a plurality of solder pads formed on the active surface thereof and a groove formed between adjacent solder pads to form a first metal layer therein that is electrically connected to the solder pads; subsequently thinning the non-active surface of the wafer to where the grooves are located to expose the first metal layer therefrom, and forming a second metal layer on the non-active surface of the wafer for electrically connecting with the first metal layer; and separating the dies to form a plurality of stackable semiconductor devices. Thereby, the first and second metal layers formed on the active surface and the non-active surface of the semiconductor device can be stacked and connected to constitute a multi-die stack structure, thereby increasing integration without increasing the area of the stacked dies. Further, the problems known in the prior art of poor electrical connection, complicated manufacturing process and increased cost as a result of using wire bonding and TSV can be avoided. | 2008-09-25 |
20080230914 | SEMICONDUCTOR ELEMENT, METHOD OF MANUFACTURING SEMICONDUCTOR ELEMENT, MULTI-LAYER PRINTED CIRCUIT BOARD, AND METHOD OF MANUFACTURING MULTI-LAYER PRINTED CIRCUIT BOARD - A transition layer | 2008-09-25 |
20080230915 | SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY - A semiconductor package using Ag or Ag alloy wire which can maintain superior reliability against a noble metal and lower its manufacturing cost is provided. The semiconductor package comprises a semiconductor substrate. A semiconductor chip is attached to the package substrate and has one or more pads which comprise a noble metal. And one or more wires are bonded so as to electrically connect the one or more pads and the package substrate and comprise Ag or Ag alloy. | 2008-09-25 |
20080230916 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND FABRICATION PROCESS THEREOF - A semiconductor IC device includes a buried interconnection in interconnection layers over a semiconductor substrate, in which electrical connection of interconnections are provided over and under an interconnection layer of an embedded interconnection from among the interconnection layers such that a first connecting conductor portion within a connecting hole extending from an upper interconnection toward the interconnection layer of a predetermined buried interconnection and a second connecting conductor portion within the connecting hole extending from a lower interconnection toward the interconnection layer of the predetermined buried interconnection are electrically connected via a connecting conductor portion for relay in the connecting groove of the interconnection layer of a predetermined buried interconnection. The connecting conductor portion for relay is sized so that the length of the connecting conductor portion for relay in an extending direction of the predetermined buried interconnection is longer than that of the connecting hole. | 2008-09-25 |
20080230917 | METHOD OF FABRICATING TWO-STEP SELF-ALIGNED CONTACT - A method of fabricating a self-aligned contact is provided. A first dielectric layer is formed on a substrate having a contact region therein. Next, a lower hole corresponding to the contact region is formed in the first dielectric layer. Thereafter, a second dielectric layer is formed on the first dielectric layer, and then an upper hole self-aligned to and communicated with the lower hole is formed in the second dielectric layer, wherein the upper hole and the lower hole constitute a self-aligned contact hole. Afterwards, the self-aligned contact hole is filled with a conductive layer. | 2008-09-25 |
20080230918 | SEMICONDUCTOR INTEGRATED CIRCUIT AND DESIGN METHOD OF SIGNAL TERMINALS ON INPUT/OUTPUT CELL - A semiconductor integrated circuit, including an input/output cell including signal terminals, wherein the signal terminal of the input/output cell is connected to an internal circuit via an interconnect wiring. The signal terminal of the I/O cell includes a plurality of (e.g., four) conductive layers. Each pair of adjacent ones of the plurality of conductive layers are connected together by a via. One of the plurality of conductive layers to which a via of the largest diameter is connected (e.g., the fourth conductive layer) is formed with a width such that only one of the largest-diameter via can be accommodated. Therefore, it is possible to suppress the migration of atoms from the interconnect wiring to the input terminal of the I/O cell, and to suppress the open failure of the via formed on the interconnect wiring. | 2008-09-25 |
20080230919 | Dual damascene with via liner - A dual damascene structure with improved profiles and reduced defects and method of forming the same, the method including forming a first dielectric over a conductive area; forming a first dielectric insulator over the first dielectric; forming a first opening in the first dielectric insulator; lining the opening with a second dielectric; forming a second dielectric insulator over the first dielectric insulator; forming a second opening in the second dielectric insulator overlying and communicating with the first opening; and, filling the first and second openings with a conductive material to electrically communicate with the conductive area. | 2008-09-25 |
20080230920 | Wire-Bonded Semiconductor Component with Reinforced Inner Connection Metallization - A semiconductor component comprising a semiconductor chip ( | 2008-09-25 |
20080230921 | Semiconductor device and method for manufacturing the same - A semiconductor device includes a first semiconductor chip; a multilayer wiring which is formed on the first semiconductor chip and which is connected to the first semiconductor chip; a second semiconductor chip connected to the first semiconductor chip by way of the multilayer wiring; a sealing material which seals the second semiconductor chip; and projecting plugs which are connected to the multilayer wiring and whose extremities become exposed on the sealing material. | 2008-09-25 |
20080230922 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD - A technique for mounting a plurality of electronic parts on one surface of a wiring substrate is provided. A semiconductor device comprises a wiring substrate having connection pads disposed outside a parts mount; a plurality of electronic parts with the first surface having a plurality of electrodes and the second surface fixing; a first underlying insulation layer provided between the connecting pads and the electrodes; a first metal layer formed overlaid on the first underlying insulation layer and providing connections between the connecting pads and the electrodes; a second underlying insulation layer having electrically insulating properties, provided between the respective electrodes of adjacent electronic parts; a second metal layer formed overlaid on the second underlying insulation layer and providing connections between the respective electrodes of adjacent electronic parts; and a first surface insulation layer covering the first metal layer and a second surface insulation layer covering the second metal layer. | 2008-09-25 |
20080230923 | CHIP STACK PACKAGE AND METHOD OF MANUFACTURING THE CHIP STACK PACKAGE - A chip stack package includes a substrate, a plurality of chips, a plurality of adhesive layers and a plug. The substrate has a wiring pattern and a seed layer formed on the wiring pattern. Each of the chips has an electrode pad and a first through-hole that penetrates the electrode pad. The chips are stacked such that the first through-holes are aligned on the seed layer of the substrate. The adhesive layers are interposed between the substrate and one of the chips, as well as between the chips. Each of the adhesive layers has a second through-hole connected to the first through-hole. The plug fills up the first through-holes and the second through-holes and electrically connects the electrode pads to the wiring pattern of the substrate. A cross-sectional area of the plug in the second through-holes may be larger than that of the plug in the first through-holes. | 2008-09-25 |
20080230924 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE FOR USE THEREIN, AND MANUFACTURING METHOD THEREOF - A semiconductor package includes a substrate for mounting and fixing a semiconductor chip thereon and a connecting pattern. The substrate is provided with an elongate opening formed therein. The semiconductor chip is fixed with its surface being mounted on the substrate and with its electrode being aligned within the elongate opening. The electrode of the semiconductor chip is electrically connected to the connecting pattern via wires through the elongate opening. The elongate opening and the wires are sealed with resin. | 2008-09-25 |
20080230925 | SOLDER-BUMPING STRUCTURES PRODUCED BY A SOLDER BUMPING METHOD - A method for solder bumping provides a substrate and forms a film on the substrate. The film has openings therethrough. A stencil is aligned on the film. The stencil has openings therethrough over the openings through the film. Solder paste is printed onto the substrate and into the openings through the stencil and the openings through the film. The solder paste is reflowed to form solder balls therefrom. The stencil and the film are then removed. | 2008-09-25 |
20080230926 | Surface Treatments for Contact Pads Used in Semiconductor Chip Packagages and Methods of Providing Such Surface Treatments - An inorganic solder mask ( | 2008-09-25 |
20080230927 | Fully tested wafers having bond pads undamaged by probing and applications thereof - Methods and apparatus for producing fully tested unsingulated integrated circuits without probe scrub damage to bond pads includes forming a wafer/wafer translator pair removably attached to each other wherein the wafer translator includes contact structures formed from a soft crushable electrically conductive material and these contact structures are brought into contact with the bond pads in the presence of an inert gas; and subsequently a vacuum is drawn between the wafer and the wafer translator. In one aspect of the present invention, the unsingulated integrated circuits are exercised by a plurality of test systems wherein the bond pads are never physically touched by the test system and electrical access to the wafer is only provided through the inquiry-side of the wafer translator. In a further aspect of the present invention, known good die having bond pads without probe scrub marks are provided for incorporation into products. | 2008-09-25 |
20080230928 | Module comprising a semiconductor chip - A module includes a semiconductor chip having at least a first terminal contact surface and a second terminal contact surface. A first bond element made of a material on the basis of Cu is attached to the first terminal contact surface, and a second bond element is attached to the second terminal contact surface. The second bond element is made of a material different from the material of the first bond element or is made of a type of bond element different from the type of the first bond element. | 2008-09-25 |
20080230929 | OVERLAY MARK OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE INCLUDING THE OVERLAY MARK - Provided are an overlay mark of a semiconductor device and a semiconductor device including the overlay mark. The overlay mark includes: reference marks formed in rectangular shapes comprising sides in which fine patterns are formed; and comparison marks formed as rectangular shapes which are smaller than the rectangular shapes of the reference marks and formed of fine patterns, wherein the number of comparison marks is equal to the number of reference marks, wherein the reference marks and the comparison marks are formed on different thin films formed on a semiconductor substrate to be used to inspect alignment states of the different thin films, and the overlay mark reflects an effect of aberration of patterns of memory cells through the fine patterns during a calculation of MR (mis-registration). | 2008-09-25 |
20080230930 | INTAKE AIR AMOUNT CONTROLLING APPARATUS FOR AN INTERNAL-COMBUSTION ENGINE - An intake air amount controlling apparatus of an engine is provided. The apparatus comprises an intake manifold that is branched from an intake manifold collecting portion of the engine. The intake manifold communicates with an intake port of a cylinder head of a corresponding cylinder. The apparatus further comprises a throttle valve in the intake manifold of the cylinder and a throttle bore provided in the intake manifold. The throttle bore has a curved surface. The throttle valve rotates such that one half of the throttle valve contacts with the curved surface of the throttle bore until the throttle valve reaches a predetermined opening degree. Thus, an air flow via the one half of the throttle valve is prevented from entering the intake port. An air flow via the other half of the throttle valve is allowed to enter the intake port. Areas of cross sections, which are orthogonal to an air flow passing in the intake manifold, of the intake manifold at upstream and downstream of the throttle valve are larger than an area of a cross section, which is orthogonal to an air flow entering the intake port, crossing an open face at which the intake manifold communicates with the intake port. | 2008-09-25 |
20080230931 | Process and Installation for Molding an Optical Lens - The object of the invention is a process for molding an optical element such as a lens ( | 2008-09-25 |
20080230932 | MOLDING APPARATUS AND MOLDING METHOD FOR OPTICAL ELEMENTS - There is provided a molding apparatus and a molding method for optical elements, which are capable of conveying respective molds to respective correct positions. | 2008-09-25 |
20080230933 | OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THE SAME - The present invention provides an optical element capable of improving the adhesive property between a refractive index anisotropic layer and an alignment property providing layer for. providing alignment property to the refractive index anisotropic layer and further improving the endurance of each of the layers. | 2008-09-25 |
20080230934 | METHOD OF PRODUCING A WAFER SCALE PACKAGE - A method for manufacturing a wafer scale package including at least one substrate having replicated optical elements. The method uses two substrates, at least one of which is pre-shaped and has at least one recess in its front surface. Optical elements are replicated on a first substrate by causing a replication tool to abut the first substrate. The second substrate is then attached to the first substrate in an abutting relationship in such a way that the optical element is contained in a cavity formed by the recess in one of the substrates in combination with the other substrate. Thereby, a well defined axial distance between the optical elements and the second substrate is achieved. Consequently, well defined axial distance between the optical elements and any other objects attached to the second substrate, e.g. further optical elements, image capturing devices, light sources, is also established. | 2008-09-25 |
20080230935 | Methods for producing a pitch foam - Methods to produce a pitch foam from a hydrocarbon carbonaceous precursor material. A gaseous blowing material is dissolved in the carbonaceous precursor material, and the resultant solution is pressurized in a vessel. As the solution is exhausted from the vessel, the gaseous blowing agent and the hydrocarbons of the carbonaceous precursor material evaporate from the pressurized solution to form a foam-like solution. The pitch foam is formed from the foam-like solution by directing the foam-like solution onto a surface, whereupon, the foam-like solution solidifies into the pitch foam. | 2008-09-25 |
20080230936 | MEMBRANE ELECTRODE ASSEMBLY AND METHOD OF MANUFACTURING SAME - Disclosed herein is a membrane electrode assembly with a superior power generating efficiency and a method of manufacturing the same. Also disclosed is a manufacturing apparatus thereof wherein a gasket with an optimum thickness can be easily applied to the membrane electrode assembly without preparing various types of gaskets. A method of manufacturing the membrane electrode assembly with catalytic layers and gas diffusion layers on surfaces of the electrolyte membrane comprises controlling a molding thickness according to thicknesses of the catalytic layers and the gas diffusion layers and integrally molding the gasket portions formed with resin materials on at least one surface of the electrolyte membrane. | 2008-09-25 |
20080230937 | Method For Controlling The Injection Molding Process Of An Injection Molding Machine - A method for controlling the injection moulding process of an injection moulding machine with an injection moulding tool that forms at least one cavity for a moulded part to be produced, wherein a melt is introduced into the cavity by an incision. The temporal progression of the temperature of the mould wall is determined and controlled in the course of the injection moulding process. | 2008-09-25 |
20080230938 | Moulded Part Comprising a Composite Layer Plate or Film and a Carrier Layer with an Improved Shine - The invention relates to moldings, comprising a composite layered sheet or composite layered film, reverse-coated with a backing layer of plastic applied by an injection-molding, foaming, casting, or compression-molding method, where the composite layered sheet or composite layered film comprises
| 2008-09-25 |
20080230939 | METHOD OF MAKING COMPOSITE SUPPORT STRUCTURE FOR USE IN SANDING AND SANDERS FORMED THEREFROM - A method of making a composite support structure and sander includes the steps of providing a rigid plate adjacent a mold such that a polyfoam layer can be formed to a front surface thereof which includes a wall defining a contained surface, the plate having a back surface for connection to a handle and introducing into the mold fluid components which react to form a polyfoam which is reaction bonded to the front surface of the rigid plate such that a back surface of the polyfoam layer forms within the contained surface and about the wall in a complementary manner thereto and a front surface of the polyfoam layer extends outward from the front surface of the rigid plate and is formed to have a relatively planar surface thereby rendering the composite support structure for removably connecting sandpaper to the relatively planar surface of the polyfoam layer. | 2008-09-25 |
20080230940 | Method For Producing Metal-Ceramic-Composite Materials - The production of moulded bodies from hard-metal powders by pressing and simultaneous or subsequent heat treatment is known. The mixture of hard material powders and aluminium powders for producing dry-pressed moulded bodies is an example thereof. As a result of the risk of demixing and the loss of homogeneity, the upper limit, for example according to prior art, for the proportion of hard material particles added to the aluminium powder is approximately 20 vol. %. The aim of the invention is to increase the proportion of hard material particles it the mixture. To this end, the inventive method for producing metal ceramic composite materials is characterised by dry-pressing powders with base compositions of between 25 and 79 vol. % of at least one metallic phase, preferably aluminium and the alloys thereof, and between 75 and 21 vol. % of at least one non-metallic inorganic constitnent, as ceramic materials, preferably silicon carbides, aluminium oxides, titanium oxides, carbon and silicates. | 2008-09-25 |
20080230941 | Methods for applying images to resin materials - A process for printing an image on a surface of a resin member includes (a) providing a transfer medium with an image on one side of the transfer medium, (b) providing a liquid resin, (c) placing the one side of the transfer medium with the image and the liquid resin in contact with each other, and (d) partially curing the liquid resin to form the resin member while maintaining the image of the transfer medium in contact with an image side of the resin member. The process may include placing the liquid resin and/or the transfer medium in a mold for shaping the resin member during curing. | 2008-09-25 |
20080230942 | Composite sheet materials and processes for manufacturing same - Provided are, among other things, systems, methods and techniques for manufacturing sheet material. In one representative embodiment, a sheet of fabric material is positioned across a patterning template that has a number of openings; and the sheet of fabric material and the patterning template are fed through an extrusion device in which extrusion material coats the fabric material and forces the fabric material into the openings in the patterning template, thereby producing a composite sheet material. | 2008-09-25 |
20080230943 | Method and apparatus for enhanced fiber bundle dispersion with a divergent fiber draw unit - A method and associated apparatus for melt extruding a nonwoven web includes providing a plurality of fibers from an extrusion device. The fibers are conveyed through a diverging profile portion of a fiber drawing unit (FDU) that causes the fibers to spread and expand in the machine direction within the FDU. The fibers are then conveyed through a diverging diffusion chamber spaced from the outlet of the FDU to reduce the velocity of the fibers and further spread the fibers in the machine direction. The fibers may be subjected to an applied electrostatic charge in either the diffusion chamber or the FDU. From the outlet of the diffusion chamber, the fibers are laid onto a forming surface as a nonwoven web. | 2008-09-25 |
20080230944 | METHOD FOR PRODUCING CELLULOSE ACYLATE FILM - A dope is cast onto a drum. A casting film is cooled and solidified by the drum. The casting film is peeled as a film containing a solvent. The peeled film is guided to a tenter. In the tenter, in a first drying step, the film is dried by dry air from an air duct while being stretched in the width direction in a state that side edge portions of the film are held by pins. Thereafter, in a second drying step, the film is dried while tension is applied to the film in the width direction. A first ratio calculated by (a moving speed of the pins)/(a rotation speed of the drum), a second ratio calculated by L | 2008-09-25 |
20080230945 | SOLUTION CASTING APPARATUS AND SOLUTION CASTING METHOD - A casting die includes lip plates and inner deckle plates, each of which has a contact face. The contact faces form an outlet of the casing die. A distance between a ridge of the lip plate and that of the inner deckle plate is at most 9 μm. Further, nozzles are disposed so as to be close to the outlet. A periphery of a support runs at more than 50 m/min. A casting dope is discharged from the outlet to the support, so as to form a dope bead between the outlet and the periphery. A decompression chamber decompresses in a rear face side from the dope bead. | 2008-09-25 |
20080230946 | SOLUTION CASTING METHOD - A primary dope containing a polymer, a solvent and an additive is fed to a filtration device in a filtrating unit. The filtration device includes a filter on which a deposit layer of a filtration aid is formed, and impurities in the primary dope are adsorbed to the deposit layer. After the filtration, a residue containing the impurities and the filtration aid on the filter, and the filtration device is filled a cleaning liquid. Then a stirrer in the filtration device is stirred so as to disperse the residue to the cleaning liquid. Thus a slurry liquid is obtained and fed to a separation device. In the separation device, the slurry liquid is fed into a strainer to separate the slurry liquid to the residue and the liquid material. The residue is dried in a drying device and the solvent vapor is recovered. | 2008-09-25 |
20080230947 | Articles Comprising Nanoscale Patterns With Reduced Edge Roughness and Methods of Making Same - In accordance with the invention, an article comprising a nanoscale surface pattern, such as a grating, is provided with a nanoscale patterns of reduced edge and/or sidewall roughness. Smooth featured articles, can be fabricated by nanoimprint lithography using a mold having sloped profile molding features. Another approach uses a mold especially fabricated to provide smooth sidewalls of reduced roughness, and a third approach adds a post-imprint smoothing step. These approaches can be utilized individually or in various combinations to make the novel articles. | 2008-09-25 |
20080230948 | HEAT STAKING PROCESS WITH INCREASED RETENTION FORCE - A heat staking method and apparatus is provided for use in deforming a heat-stake so that it becomes mechanically coupled to an encapsulate. The deformed portion of the heat-stake contacts a retention component that provides additional composition strength and fastening surface to the encapsulate. | 2008-09-25 |
20080230949 | Injection molding process for forming coated molded parts - A method for molding color-coated plastic parts is disclosed. The method includes a technique for applying a color layer to the surface of sections of a mold when the mold is closed, and distributing a substrate into a cavity defined by the mold sections whereby the last point of fill for the substrate is located at an entry location of a color material. | 2008-09-25 |
20080230950 | RESIN SEALING METHOD, MOLD FOR RESIN SEALING, AND RESIN SEALING APPARATUS - A resin sealing method includes the steps of providing an intermediate mold between an upper mold and a lower mold, the intermediate mold having a cavity forming part where a resin sealed part is received; and introducing sealing resin into the cavity forming part of the intermediate mold and another main surface of the intermediate mold via a runner, the runner being provided in a vicinity of the cavity forming part of the intermediate mold and piercing the intermediate mold in a thickness direction. | 2008-09-25 |
20080230951 | Methods for making microfluidic devices and devices produced thereof - Described herein are methods for making microfluidic devices comprising glass or glass-containing materials, wherein the methods have decreased cost and/or improved dimensional properties over similar formed glass articles produced using current techniques. | 2008-09-25 |
20080230952 | Apparatus for molding proppants and method - An apparatus for molding a proppant is disclosed. The apparatus comprises a first member comprising a manifold for channeling a plastic fluid to a cavity block, with the cavity block containing a plurality of semi-spherical cavities. The apparatus further includes a second member that comprises a movable plate for engaging with the first member, with the movable plate having an opening therein, and a core block positioned within the opening, with the core block containing a plurality of reciprocal semi-spherical cavities configured to engage the semi-spherical cavities of the cavity block so that a plurality of spheres are formed, with the core block further containing a plurality of arm cavities that link the plurality of spheres so that a star cluster (which links the proppants) is formed. A method of manufacturing proppants and a method of using the proppants is also disclosed. | 2008-09-25 |
20080230953 | MODELING COMPOUND STAMPING TOYS AND METHODS - A modeling compound stamping tool is disclosed including a stamping element having multiple images, and a gear assembly with a handle mechanically coupled for selection of an image of the stamping element to assist in the creation of art forms, artistic designs or impressions. The described methods of stamping the modeling compounds in a toy provide the stamping element with the multiple images, and selecting an image for applying to a quantity of modeling compound. A dial or a handle is disclosed for rotating between images of the stamping element to position various different images in downwardly facing positions for pressing the stamping element against the quantity of modeling compound to produce the desired image. | 2008-09-25 |
20080230954 | Injection Stretch Blow Molded Polylactide Bottle and Process For Making Same - An injection stretch blow molding process for making containers from a polylactic acid resin. In one aspect the process comprises molding the polylactic acid resin into a perform, applying heat to the perform, stretching and blowing the perform in axial and radial dimensions in order to form a preliminary molded container, conditioning the molded container pursuant to a first conditioning method, conditioning the molded container pursuant to a second conditioning method, and stretching and blowing the molded container in order to form a final molded container. Relatively rigid bottles constructed in accordance with one or more processes disclosed herein are also contemplated. | 2008-09-25 |
20080230955 | LUBRICANT COMPOSITION AND ARTICLE, DISK MOLDING STAMPER, DISK MOLDING APPARATUS, DISK FORMING METHOD, METHOD OF FORMING LUBRICATION COATING - A boundary lubricant film | 2008-09-25 |
20080230956 | Process for Producing Foam Boards - A process for producing foam moldings from prefoamed foam particles which have a polymer coating in a mold under pressure, wherein the prefoamed foam particles comprise from 10 to 70% by weight, based on the foam particles, of a filler, and also foam moldings produced therefrom and their use. | 2008-09-25 |
20080230957 | Device for Transforming Materials Using Induction Heating - A device for transforming thermoplastic matrix composite materials or thermosetting materials, includes two mold casings that are mobile relative to each other, electrically conductive, and include a molding zone designed to be in contact with the material to be transformed. The faces of one of the two mold casings are situated so as to be facing magnetic field generator, except for the molding zones, and are coated with a shielding layer made of a non-magnetic material preventing the magnetic field from penetrating into the mold casings. The mold casings are electrically insulated from each other during the molding phase so that the faces of the two mold casings demarcate an air gap wherein flows the magnetic field that induces currents at the surface of the molding zones thus localizing the heating at the interface between the molding zone and the material to be transformed. | 2008-09-25 |
20080230958 | In-Mould Coating Method and Device for the Same - An in-mould coating method and a coating device for the same, wherein the inserts in the mould of the coating device are made of transparent material and are each coated with reflective material. In each insert are installed light generators, light sensors, cameras, etc. The coating method comprises the steps of: closing the mould after placing a semi-finished product formed by injection molding or other processes in the mould; injecting liquid lacquer or other liquid coating material, and using the cameras to monitor filling; and after finishing filling, starting the light generators and utilizing the light sensors to monitor the amount of light irradiated on the injected liquid lacquer or other liquid coating materials in such a manner that the injected liquid lacquer or other liquid coating materials is hardened to form a coating film on the surface of the semi-finished product. | 2008-09-25 |
20080230959 | Compositions for Dark-Field Polymerization and Method of Using the Same for Imprint Lithography Processes - The present invention provides a composition and a method of using the same to form a pattern on a substrate using imprint lithography employing dark-field polymerization. To that end, the composition includes a bis vinyl ether component, and an initiator component that produces an acid in response to radiation. The bis vinyl ether component is reactive to the acid and polymerizes in response thereto. | 2008-09-25 |
20080230960 | Method for manufacturing information recording medium, method for forming resin mask, transferring apparatus, and light-transmitting stamper - An information recording medium manufacturing method is provided in which a resin material can be reliably cured even when a light-transmitting stamper is used repeatedly. A resin mask forming method and a transferring apparatus and a light-transmitting stamper used in these methods are also provided. In the above methods, a visible light curable resin material is spread over a workpiece. Then, a light-transmitting stamper including a transferring portion having a predetermined concavo-convex pattern formed therein is brought into contact with the resin material to transfer the concavo-convex pattern to the resin material, and light including visible light is projected onto the resin material through the light-transmitting stamper to cure the resin material. | 2008-09-25 |
20080230961 | METHOD FOR PRODUCING A MULTI-CHAMBER SYRINGE WITH A BY-PASS CHANNEL - A method for producing a multi-chamber syringe with a by-pass channel from a plastic material comprises the steps of producing a tubular preform from a thermoplastic material; providing a die designed to enclose the preform from the outside in an area of the by-pass channel to be formed, the at least one by-pass channel being preformed as a recess on an inner surface of the die; heating-up the preform to a temperature above the softening range of the plastic material, and positioning the preform in a predefined axial position inside the die; subjecting the preform to a differential pressure until the at least one by-pass channel is plastically formed; and cooling down the syringe body so formed to room temperature. | 2008-09-25 |
20080230962 | Method of creating high strength expanded thermoformable honeycomb structures with cementitious reinforcement - A method for producing expanded honeycomb materials with cementitious reinforcement, in a composite structure having significant structural rigidity and strength, reduction in overall weight and ease of installation comprising the steps of: placing an expanded thermoformable honeycomb in a mold or suitable mold; partially or completely filling either or both sides of the honeycomb with cementitious material; vibrating the cementitious material within the structure to eliminate any air pockets or voids; leveling the cementitious material and allowing it to cure at room or elevated temperature; removing the composite structures from the mold. | 2008-09-25 |
20080230963 | Method of manufacturing low temperatue co-firing substrate - There is provided a method of manufacturing an LTCC substrate, capable of enhancing coatability of an external electrode pad, yield of the LTCC substrate as a package and product reliability and ensuring compactness of a product utilizing the LTCC substrate package. The method includes: forming a cavity on external electrode pad forming layers, respectively and filling the cavity with an external electrode pad material; depositing the external electrode pad forming layers on a ceramic stack with a printed circuit pattern formed therein; and sintering the ceramic stack having the external electrode pad forming layers deposited thereon at a low temperature. | 2008-09-25 |
20080230964 | Tungsten Shot - The present invention relates to a process for the production of sintered three-dimensional strips of shaped bodies and for the production of the shaped bodies from a pulverulent, inorganic material, to sintered three-dimensional shaped bodies and to the use of the sintered, three-dimensional shaped bodies as shot pellets, munitions, angling weights, for balancing tires, as oscillating weight in clocks, for radiation screening, as a balancing weight in drive motors and engines, for the production of sports equipment or as a catalyst support. | 2008-09-25 |
20080230965 | Handling Device For Elements of Tapping Runners - A handling device for elements of tapping runners on a shaft furnace, in particular for runner covers, the device including a support base arranged on the cast house floor of a blast furnace, laterally of the tapping runner and a frame ( | 2008-09-25 |
20080230966 | SCRAP MELTER AND IMPELLER THEREFORE - A device for submerging scrap metal includes: (a) a drive source, (b) a drive shaft having a first end and a second end, the first end being connected to the drive source, and (d) an impeller connected to the second end of the drive shaft, the impeller preferably having two or more outwardly-extending blades. Preferably, each of the blades has a portion that directs molten metal at least partially downward. The impeller design leads to lower operating speeds, lower vibration, longer component life and less maintenance. Additionally, the impeller preferably has a connective portion. The connective portion is used to connect the impeller to the shaft and preferably comprises a nonthreaded, tapered bore extending through the impeller. | 2008-09-25 |
20080230967 | TELESCOPING SPRING - A spring having telescoping capabilities is provided. The spring includes a spring body having an inner diameter and a first spring end that defines a first spring opening. The spring further includes a first elongated member having first and second ends. The first elongated member is slidably received within the spring body such that the first end of the first elongated member is retained within the spring body and the second end of the first elongated member protrudes from the first spring opening. | 2008-09-25 |
20080230968 | LIQUID SEALED VIBRATION ISOLATING DEVICE - A vibration isolating device includes an insulator for isolating the transmission of an inputted vibration by an elastic deformation. A principal vibration input portion is provided in a central area of a concave curved wall portion formed in the insulator. A thin wall portion and a thick wall portion are formed by relatively varying a thickness of the insulator around the vibration input portion, wherein the concave curved wall portion of the insulator is formed in a substantially circular shape when viewed in a principal vibration inputted direction. The thick wall portion is formed substantially in the shape of a belt of a predetermined width and extends across the concave curved wall portion in the diametrical direction thereof while passing the vibration input portion. A rigid body covering portion for covering a surface of a metallic member of the vibration input portion is provided in the central area of the thick wall portion. A thickness of the rigid body covering portion is at least 1.7 mm. | 2008-09-25 |
20080230969 | Fluid filled type vibration damping device - A fluid filled type vibration damping device including a fluid filled unit having a fluid chamber sealed therein, a main rubber elastic body being a separate component from the fluid filled unit, a first mounting member affixed to the main rubber elastic body at a center section of a first end thereof. The fluid filled unit is positioned next to the other end of the main rubber elastic body with an elastic rubber wall thereof juxtaposed against the end face of the main rubber elastic body. A second mounting member is formed by including a tubular housing of the fluid filled unit with the tubular housing fastened to an outside peripheral face of the main rubber elastic body. An outside air communication passage is formed at an outside peripheral section between the juxtaposed elastic rubber wall of the fluid filled unit and the end face of the main rubber elastic body. | 2008-09-25 |
20080230970 | Mount for Shock and Vibration Damping - An isolator mount for the active dissipation of shocks and vibrations is presented. The invention includes at least one energy dissipating layer and deflectable elements so as to provide soft damping for small disturbance excitations, yet remaining sufficiently stiff to mitigate large shocks. The mount transfers mechanical energy to the dissipating layers via the device structure. Dissipating layers convert shock and vibration energies to either heat or magnetic energy. | 2008-09-25 |
20080230971 | METHOD AND SYSTEM FOR MACHINING AN ARRAY OF COMPONENTS - The invention provides an enhanced method and system for machining an array of components. A holding mechanism is provided for holding an array of components in a machining process. The holding mechanism comprises: a rigid base plate and at least one support for holding a raw material while machining, one end of each support being coupled to the rigid base plate. The holding mechanism is further provided with a secure plate movably coupled to the rigid base plate. The secure plate is provided with one or more holding parts such as double-sided tape or guiding pins for holding the raw material. The secure plate can be elevated to hold the raw material during a machining operation such as peripheral machining. | 2008-09-25 |
20080230972 | Pipe holding or manipulating tool - A pipe tool with a base unit and peripheral components for holding or manipulating pipe sections. The peripheral components allow the pipe tool to be configured for holding pipes of various sizes in alignment so they may be welded at a seam. The tool can also be reconfigured for changing the cross sectional shape of a deformed pipe end or for spreading open objects such as valve or pipe flanges. | 2008-09-25 |