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39th week of 2020 patent applcation highlights part 65
Patent application number
Title
Published
20200303289
SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT
2020-09-24
20200303290
SEMICONDUCTOR DEVICE
2020-09-24
20200303291
INTEGRATED CIRCUIT (IC) PACKAGE WITH SUBSTRATE HAVING VALIDATION CONNECTORS
2020-09-24
20200303292
PACKAGE WITH ELECTRICAL PATHWAY
2020-09-24
20200303293
WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
2020-09-24
20200303294
SEMICONDUCTOR PACKAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
2020-09-24
20200303295
POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2020-09-24
20200303296
SEMICONDUCTOR DEVICE
2020-09-24
20200303297
HIGH DENSITY MULTIPLE DIE STRUCTURE
2020-09-24
20200303298
SEMICONDUCTOR DEVICE
2020-09-24
20200303299
Semiconductor Device and Method of Manufacturing Semiconductor Device
2020-09-24
20200303300
SEMICONDUCTOR MEMORY DEVICE
2020-09-24
20200303301
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
2020-09-24
20200303302
HIGH-PERFORMANCE VARIABLE GAIN AMPLIFIER EMPLOYING LAMINATE TRANSMISSION LINE STRUCTURES
2020-09-24
20200303303
SEMICONDUCTOR DEVICES AND DISPLAY DRIVER INTEGRATED CIRCUITS INCLUDING THE SEMICONDUCTOR DEVICES
2020-09-24
20200303304
ELECTRONIC COMPONENT
2020-09-24
20200303305
SEMICONDUCTOR MEMORY DEVICE
2020-09-24
20200303306
SEMICONDUCTOR DEVICE
2020-09-24
20200303307
SEMICONDUCTOR DEVICE
2020-09-24
20200303308
SEMICONDUCTOR DEVICE
2020-09-24
20200303309
EMIB PATCH ON GLASS LAMINATE SUBSTRATE
2020-09-24
20200303310
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE PACKAGES WITH LITHOTGRAPHICALLY FORMED BUMPS AND METHODS OF ASSEMBLING SAME
2020-09-24
20200303311
REDUNDANCY SCHEME FOR MULTI-CHIP STACKED DEVICES
2020-09-24
20200303312
METHODS AND DEVICES FOR SOLDERLESS INTEGRATION OF MULTIPLE SEMICONDUCTOR DIES ON FLEXIBLE SUBSTRATES
2020-09-24
20200303313
Interposer-Type Component Carrier and Method of Manufacturing the Same
2020-09-24
20200303314
SEMICONDUCTOR PACKAGE
2020-09-24
20200303315
SEMICONDUCTOR PACKAGE USING CAVITY SUBSTRATE AND MANUFACTURING METHODS
2020-09-24
20200303316
PACKAGE STRUCTURE HAVING REDISTRIBUTION LAYER STRUCTURES
2020-09-24
20200303317
SEMICONDUCTOR DEVICE AND FABRICATION METHOD FOR SEMICONDUCTOR DEVICE
2020-09-24
20200303318
SHIELDED ELECTRONIC MODULES AND METHODS OF FORMING THE SAME UTILIZING PLATING AND DOUBLE-CUT SINGULATION
2020-09-24
20200303319
ISOLATED TRANSFORMER WITH INTEGRATED SHIELD TOPOLOGY FOR REDUCED EMI
2020-09-24
20200303320
ELECTRONIC ASSEMBLY, ELECTRONIC APPARATUS INCLUDING THE SAME AND METHOD FOR FABRICATING ELECTRONIC ASSEMBLY
2020-09-24
20200303321
EMI SHIELD FOR MOLDED PACKAGES
2020-09-24
20200303322
ACTIVE CONTROL OF ELECTRONIC PACKAGE WARPAGE
2020-09-24
20200303323
SEMICONDUCTOR DEVICE
2020-09-24
20200303324
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
2020-09-24
20200303325
Detection of Laser-Based Security Attacks
2020-09-24
20200303326
POWER INTEGRATED MODULE
2020-09-24
20200303327
WAVEGUIDE FAN-OUT
2020-09-24
20200303328
CONTACTLESS HIGH-FREQUENCY INTERCONNECT
2020-09-24
20200303329
MICROELECTRONIC PACKAGE WITH RADIO FREQUENCY (RF) CHIPLET
2020-09-24
20200303330
CIRCUIT STRUCTURE AND CHIP PACKAGE
2020-09-24
20200303331
MANUFACTURING METHOD OF SEMICONDCUTOR PACKAGE
2020-09-24
20200303332
Integrated Fan-Out Structure and Method of Forming
2020-09-24
20200303333
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
2020-09-24
20200303334
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
2020-09-24
20200303335
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
2020-09-24
20200303336
MODULE
2020-09-24
20200303337
SOLDER MATERIAL FOR SEMICONDUCTOR DEVICE
2020-09-24
20200303338
SEMICONDUCTOR DEVICE
2020-09-24
20200303339
LEAD-FREE COLUMN INTERCONNECT
2020-09-24
20200303340
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
2020-09-24
20200303341
PACKAGE INTEGRATION FOR MEMORY DEVICES
2020-09-24
20200303342
Package with Thinned Substrate
2020-09-24
20200303343
ARTIFICIAL INTELLIGENCE PROCESSOR WITH THREE-DIMENSIONAL STACKED MEMORY
2020-09-24
20200303344
ARTIFICIAL INTELLIGENCE PROCESSOR WITH THREE-DIMENSIONAL STACKED MEMORY
2020-09-24
20200303345
SEMICONDUCTOR DEVICE
2020-09-24
20200303346
SEMICONDUCTOR DEVICE
2020-09-24
20200303347
SEMICONDUCTOR STORAGE DEVICE AND METHOD OF MANUFACTURING THE SAME
2020-09-24
20200303348
INTERCONNECTED STACKED CIRCUITS
2020-09-24
20200303349
SEMICONDUCTOR DEVICES HAVING THROUGH-STACK INTERCONNECTS FOR FACILITATING CONNECTIVITY TESTING
2020-09-24
20200303350
SEMICONDUCTOR DEVICE ASSEMBLIES WITH ANNULAR INTERPOSERS
2020-09-24
20200303351
HYBRID BONDING TECHNOLOGY FOR STACKING INTEGRATED CIRCUITS
2020-09-24
20200303352
PACKAGE STRUCTURE
2020-09-24
20200303353
PANEL LIGHT
2020-09-24
20200303354
LED Filaments and LED Filament Lamps
2020-09-24
20200303355
LED Filaments and LED Filament Lamps
2020-09-24
20200303356
Tunable LED-Filaments and Tunable LED-Filament Lamps
2020-09-24
20200303357
LIGHT EMITTING DEVICE
2020-09-24
20200303358
LIGHT-EMITTING DIODE DEVICE AND WHITE LIGHT EMITTING SYSTEM
2020-09-24
20200303359
PROCESS FOR MANUFACTURING AN LED-BASED EMISSIVE DISPLAY DEVICE
2020-09-24
20200303360
SEMICONDUCTOR DEVICE
2020-09-24
20200303361
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PREPARING THE SAME
2020-09-24
20200303362
SEMICONDUCTOR UNIT, SEMICONDUCTOR MODULE, AND SEMICONDUCTOR DEVICE
2020-09-24
20200303363
INTERPOSER, MICROELECTRONIC DEVICE ASSEMBLY INCLUDING SAME AND METHODS OF FABRICATION
2020-09-24
20200303364
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
2020-09-24
20200303365
Contoured Package-on-Package Joint
2020-09-24
20200303366
INTEGRATED CIRCUIT FILLER AND METHOD THEREOF
2020-09-24
20200303367
ELECTROSTATIC DISCHARGE PROTECTION DEVICE
2020-09-24
20200303368
SILICON-CONTROLLED-RECTIFIER ELECTROSTATIC PROTECTION STRUCTURE AND FABRICATION METHOD THEREOF
2020-09-24
20200303369
SILICON-CONTROLLED-RECTIFIER ELECTROSTATIC PROTECTION STRUCTURE AND FABRICATION METHOD THEREOF
2020-09-24
20200303370
HIGH SURGE TRANSIENT VOLTAGE SUPPRESSOR
2020-09-24
20200303371
INTEGRATION OF PASSIVE COMPONENTS IN III-N DEVICES
2020-09-24
20200303372
SEMICONDUCTOR DEVICE AND AMPLIFIER MODULE
2020-09-24
20200303373
PMOS AND NMOS CONTACTS IN COMMON TRENCH
2020-09-24
20200303374
INTEGRATED CIRCUIT AND STANDARD CELL LIBRARY
2020-09-24
20200303375
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2020-09-24
20200303376
COMPLEMENTARY TRANSISTOR AND SEMICONDUCTOR DEVICE
2020-09-24
20200303377
HETEROGENEOUSLY INTEGRATED SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2020-09-24
20200303378
Semiconductor Device and Method
2020-09-24
20200303379
THREE-DIMENSIONAL DEVICES HAVING REDUCED CONTACT LENGTH
2020-09-24
20200303380
Semiconductor Device and Fabrication Method thereof
2020-09-24
20200303381
NONVOLATILE STATIC RANDOM ACCESS MEMORY (SRAM) DEVICES
2020-09-24
20200303382
SEMICONDUCTOR MEMORY DEVICE
2020-09-24
20200303383
SEMICONDUCTOR DEVICE
2020-09-24
20200303384
NOR FLASH MEMORY AND MANUFACTURING METHOD THEREOF
2020-09-24
20200303385
ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME
2020-09-24
20200303386
OTP ELEMENTS WITH HIGH ASPECT RATIO MTJ
2020-09-24
20200303387
Process for Manufacturing NOR Memory Cell with Vertical Floating Gate
2020-09-24
20200303388
STACKED VERTICAL TRANSISTOR ERASABLE PROGRAMMABLE READ-ONLY MEMORY AND PROGRAMMABLE INVERTER DEVICES
2020-09-24