39th week of 2020 patent applcation highlights part 64 |
Patent application number | Title | Published |
20200303189 | SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF | 2020-09-24 |
20200303190 | IMPRINTING METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2020-09-24 |
20200303191 | STRESS COMPENSATION FOR WAFER TO WAFER BONDING | 2020-09-24 |
20200303192 | APPARATUS HAVING INTEGRATED CIRCUIT WELL STRUCTURES OF VERTICAL AND/OR RETROGRADE PROFILES | 2020-09-24 |
20200303193 | LASER ANNEALING DEVICE, MASK, THIN FILM RANSISTOR, AND LASER ANNEALING METHOD | 2020-09-24 |
20200303194 | FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | 2020-09-24 |
20200303195 | METHOD OF SELECTIVELY FORMING METAL SILICIDES FOR SEMICONDUCTOR DEVICES | 2020-09-24 |
20200303196 | METHODS FOR FORMING A TRANSITION METAL NIOBIUM NITRIDE FILM ON A SUBSTRATE BY ATOMIC LAYER DEPOSITION AND RELATED SEMICONDUCTOR DEVICE STRUCTURES | 2020-09-24 |
20200303197 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2020-09-24 |
20200303198 | POLISHING COMPOSITION AND POLISHING METHOD | 2020-09-24 |
20200303199 | LONGITUDINAL SILICON INGOT SLICING APPARATUS | 2020-09-24 |
20200303200 | METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE | 2020-09-24 |
20200303201 | SUBSTRATE PROCESSING DEVICE AND SUBSTRATE PROCESSING METHOD FOR CARRYING OUT CHEMICAL TREATMENT FOR SUBSTRATE | 2020-09-24 |
20200303202 | DRY ETCH PROCESS LANDING ON METAL OXIDE ETCH STOP LAYER OVER METAL LAYER AND STRUCTURE FORMED THEREBY | 2020-09-24 |
20200303203 | METHOD OF ETCHING FILM AND PLASMA PROCESSING APPARATUS | 2020-09-24 |
20200303204 | Method for Forming Semiconductor Device Structure with Fine Line Pitch and Fine End-To-End Space | 2020-09-24 |
20200303205 | ALUMINUM NITRIDE SINTERED BODY AND MEMBER FOR SEMICONDUCTOR MANUFACUTING APPARATUS COMPRISING SAME | 2020-09-24 |
20200303206 | Pre-Heat Processes for Millisecond Anneal System | 2020-09-24 |
20200303207 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING DEVICE | 2020-09-24 |
20200303208 | FIELD-EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SAME | 2020-09-24 |
20200303209 | METHOD OF FABRICATING A SEMICONDUCTOR DEVICE USING AN ADHESIVE LAYER | 2020-09-24 |
20200303210 | LEAD FRAME | 2020-09-24 |
20200303211 | SEMICONDUCTOR PACKAGE AND MANUFACTURING PROCESS THEREOF | 2020-09-24 |
20200303212 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2020-09-24 |
20200303213 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE STRUCTURE | 2020-09-24 |
20200303214 | SEMICONDUCTOR PACKAGE STRUCTURE | 2020-09-24 |
20200303215 | SEMICONDUCTOR APPARATUS, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR APPARATUS | 2020-09-24 |
20200303216 | FAN-OUT WAFER LEVEL CHIP-SCALE PACKAGES AND METHODS OF MANUFACTURE | 2020-09-24 |
20200303217 | Wafer Manufacturing Cleaning Apparatus, Process And Method Of Use | 2020-09-24 |
20200303218 | SUBSTRATE CLEANING EQUIPMENT, SUBSTRATE TREATMENT SYSTEM INCLUDING THE SAME, AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SUBSTRATE CLEANING EQUIPMENT | 2020-09-24 |
20200303219 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | 2020-09-24 |
20200303220 | SUBSTRATE CLEANING METHOD | 2020-09-24 |
20200303221 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2020-09-24 |
20200303222 | HEAT TREATMENT APPARATUS AND FILM DEPOSITION METHOD | 2020-09-24 |
20200303223 | TEMPERATURE MEASURING MECHANISM, TEMPERATURE MEASURING METHOD, AND STAGE DEVICE | 2020-09-24 |
20200303224 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-09-24 |
20200303225 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-09-24 |
20200303226 | WAFER STORAGE CONTAINER | 2020-09-24 |
20200303227 | LOAD PORT APPARATUS AND METHOD OF MOUNTING CONTAINER | 2020-09-24 |
20200303228 | SUBSTRATE TRANSFER MECHANISM TO REDUCE BACK-SIDE SUBSTRATE CONTACT | 2020-09-24 |
20200303229 | ELECTROSTATIC CHUCK DEVICE AND METHOD OF MANUFACTURING ELECTROSTATIC CHUCK DEVICE | 2020-09-24 |
20200303230 | WAFER PLACEMENT APPARATUS AND METHOD OF MANUFACTURING THE SAME | 2020-09-24 |
20200303231 | ELECTROSTATIC CHUCK | 2020-09-24 |
20200303232 | ELECTROSTATIC CHUCK | 2020-09-24 |
20200303233 | SUBSTRATE PROCESSING APPARATUS INCLUDING EDGE RING | 2020-09-24 |
20200303234 | SUBSTRATE PROCESSING APPARATUS, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND RECORDING MEDIUM | 2020-09-24 |
20200303235 | APPARATUS FOR PROCESSING SUBSTRATE AND METHOD FOR DETECTING A PRESENCE OF A FOCUS RING ON A STAGE | 2020-09-24 |
20200303236 | IMPLANTABLE ALL DIAMOND MICROELECTRODE AND FABRICATION METHOD | 2020-09-24 |
20200303237 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE | 2020-09-24 |
20200303238 | CAPACITANCE REDUCTION FOR SEMICONDUCTOR DEVICES BASED ON WAFER BONDING | 2020-09-24 |
20200303239 | SEMICONDUCTOR DEVICE WITH SELECTIVE INSULATOR FOR IMPROVED CAPACITANCE | 2020-09-24 |
20200303240 | DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF FABRICATING THE SAME | 2020-09-24 |
20200303241 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE | 2020-09-24 |
20200303242 | METHOD FOR MANUFACTURING A FILM ON A SUPPORT HAVING A NON-FLAT SURFACE | 2020-09-24 |
20200303243 | METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE | 2020-09-24 |
20200303244 | SEMICONDUCTOR WAFER HAVING INTEGRATED CIRCUITS WITH BOTTOM LOCAL INTERCONNECTS | 2020-09-24 |
20200303245 | Methods of Forming Conductive Features Using a Vacuum Environment | 2020-09-24 |
20200303246 | SEMICONDUCTOR DEVICE WITH LINERLESS CONTACTS | 2020-09-24 |
20200303247 | SEMICONDUCTOR STRUCTURES WITH A PROTECTIVE LINER AND METHODS OF FORMING THE SAME | 2020-09-24 |
20200303248 | CIRCUIT WAFER AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2020-09-24 |
20200303249 | SEMICONDUCTOR PACKAGE, DIE ATTACH FILM, AND METHOD FOR MANUFACTURING DIE ATTACH FILM | 2020-09-24 |
20200303250 | METHOD FOR FORMING A METAL GAPFILL | 2020-09-24 |
20200303251 | Semiconductor Device and Method of Manufacturing the Same | 2020-09-24 |
20200303252 | METHOD OF FORMING METAL TRACES | 2020-09-24 |
20200303253 | SEMICONDUCTOR BACK END OF LINE (BEOL) INTERCONNECT USING MULTIPLE MATERIALS IN A FULLY SELF-ALIGNED VIA (FSAV) PROCESS | 2020-09-24 |
20200303254 | METHODS AND APPARATUS FOR FABRICATION OF SELF-ALIGNING INTERCONNECT STRUCTURE | 2020-09-24 |
20200303255 | METHOD FOR FORMING SEMICONDUCTOR DEVICE WITH GATE STACK | 2020-09-24 |
20200303256 | METHOD FOR CONTROLLING TRANSISTOR DELAY OF NANOWIRE OR NANOSHEET TRANSISTOR DEVICES | 2020-09-24 |
20200303257 | ISOLATION WALL STRESSOR STRUCTURES TO IMPROVE CHANNEL STRESS AND THEIR METHODS OF FABRICATION | 2020-09-24 |
20200303258 | Fin Spacer Protected Source and Drain Regions in FinFETs | 2020-09-24 |
20200303259 | SEMICONDUCTOR DEVICE INCLUDING A FIN-FET AND METHOD OF MANUFACTURING THE SAME | 2020-09-24 |
20200303260 | SEMICONDUCTOR DEVICE INCLUDING A FIN-FET AND METHOD OF MANUFACTURING THE SAME | 2020-09-24 |
20200303261 | FORMING TWO PORTION SPACER AFTER METAL GATE AND CONTACT FORMATION, AND RELATED IC STRUCTURE | 2020-09-24 |
20200303262 | SEMICONDUCTOR INTEGRATED CIRCUIT | 2020-09-24 |
20200303263 | STACKED VERTICAL FIELD-EFFECT TRANSISTORS WITH SACRIFICIAL LAYER PATTERNING | 2020-09-24 |
20200303264 | MIDDLE-OF-LINE CONTACTS WITH VARYING CONTACT AREA PROVIDING REDUCED CONTACT RESISTANCE | 2020-09-24 |
20200303265 | Process Monitoring Of Deep Structures With X-Ray Scatterometry | 2020-09-24 |
20200303266 | ION DEPTH PROFILE CONTROL METHOD, ION IMPLANTATION METHOD AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD BASED ON THE CONTROL METHOD, AND ION IMPLANTATION SYSTEM ADAPTING THE CONTROL METHOD | 2020-09-24 |
20200303267 | SEMICONDUCTOR ASSEMBLY AND DETERIORATION DETECTION METHOD | 2020-09-24 |
20200303268 | SEMICONDUCTOR DEVICE INCLUDING RESIDUAL TEST PATTERN | 2020-09-24 |
20200303269 | SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING SEMICONDUCTOR DEVICE | 2020-09-24 |
20200303270 | FILM FOR A PACKAGE SUBSTRATE | 2020-09-24 |
20200303271 | HEAT DISSIPATION SUBSTRATE AND FABRICATING METHOD THEREOF | 2020-09-24 |
20200303272 | Sealing Structure and Manufacturing Method Thereof | 2020-09-24 |
20200303273 | POWER MODULE | 2020-09-24 |
20200303274 | FAN OUT PACKAGE WITH INTEGRATED PERIPHERAL DEVICES AND METHODS | 2020-09-24 |
20200303275 | Non-Vertical Through-via in Package | 2020-09-24 |
20200303276 | CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | 2020-09-24 |
20200303277 | SEMICONDUCTOR PACKAGE AND METHOD MANUFACTURING THE SAME | 2020-09-24 |
20200303278 | SEMICONDUCTOR POWER DEVICE WITH CORRESPONDING PACKAGE AND RELATED MANUFACTURING PROCESS | 2020-09-24 |
20200303279 | OPTIMIZED WEIGHT HEAT SPREADER FOR AN ELECTRONIC PACKAGE | 2020-09-24 |
20200303280 | THERMALLY ENHANCED ASSEMBLY WITH METALLIC INTERFACIAL STRUCTURE BETWEEN HEAT GENERATING COMPONENT AND HEAT SPREADER | 2020-09-24 |
20200303281 | DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH | 2020-09-24 |
20200303282 | SPATIALLY LOCALIZED THERMAL INTERFACE MATERIALS | 2020-09-24 |
20200303283 | FLEXIBLE BASE DESIGN FOR CHIPSET HEAT SINK | 2020-09-24 |
20200303284 | VERTICAL SEMICONDUCTOR DEVICES | 2020-09-24 |
20200303285 | MULTI-CHIP PACKAGE WITH HIGH THERMAL CONDUCTIVITY DIE ATTACH | 2020-09-24 |
20200303286 | LEAD FRAME | 2020-09-24 |
20200303287 | LEAD FRAME | 2020-09-24 |
20200303288 | LEAD FRAME | 2020-09-24 |