38th week of 2019 patent applcation highlights part 62 |
Patent application number | Title | Published |
20190287883 | LEAD FRAME WITH BENDABLE LEADS | 2019-09-19 |
20190287884 | MULTI-CHIP PACKAGES WITH STABILIZED DIE PADS | 2019-09-19 |
20190287885 | POWER CONVERTER HAVING A CONDUCTIVE CLIP | 2019-09-19 |
20190287886 | PACKAGE INCLUDING MULTIPLE SEMICONDUCTOR DEVICES | 2019-09-19 |
20190287887 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287888 | FILM PACKAGE, CHIP-ON-FILM PACKAGE, AND PACKAGE MODULE | 2019-09-19 |
20190287889 | SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME | 2019-09-19 |
20190287890 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2019-09-19 |
20190287891 | INTEGRATED CIRCUIT INCLUDING STANDARD CELL | 2019-09-19 |
20190287892 | MULTILAYER STRUCTURE AND RELATED METHOD OF MANUFACTURE FOR ELECTRONICS | 2019-09-19 |
20190287893 | WIRING SUBSTRATE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR WIRING SUBSTRATE | 2019-09-19 |
20190287894 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-09-19 |
20190287895 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2019-09-19 |
20190287896 | SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MODULE | 2019-09-19 |
20190287897 | Enhancing Integrated Circuit Density with Active Atomic Reservoir | 2019-09-19 |
20190287898 | METHODS AND APPARATUS FOR EMBEDDED ANTIFUSES | 2019-09-19 |
20190287899 | FUSE STRUCTURE OF DYNAMIC RANDOM ACCESS MEMORY | 2019-09-19 |
20190287900 | REDUCED AREA EFUSE CELL STRUCTURE | 2019-09-19 |
20190287901 | ELECTRICAL FUSE AND/OR RESISTOR STRUCTURES | 2019-09-19 |
20190287902 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-09-19 |
20190287903 | SEMICONDUCTOR MEMORY DEVICE | 2019-09-19 |
20190287904 | BARE-DIE SMART BRIDGE CONNECTED WITH COPPER PILLARS FOR SYSTEM-IN-PACKAGE APPARATUS | 2019-09-19 |
20190287905 | DIFFERENT SCALING RATIO IN FEOL / MOL/ BEOL | 2019-09-19 |
20190287906 | POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT | 2019-09-19 |
20190287907 | CROSS-LINKED THERMOPLASTIC DIELECTRIC FOR CHIP PACKAGE | 2019-09-19 |
20190287908 | WAVEGUIDE INTERCONNECT BRIDGES | 2019-09-19 |
20190287909 | Integrated Circuit Packaging Structure and Method | 2019-09-19 |
20190287910 | Fabric-Based Items Having Strands With Embedded Components | 2019-09-19 |
20190287911 | System on Integrated Chips and Methods of Forming the Same | 2019-09-19 |
20190287912 | ELECTRICAL JUNCTION | 2019-09-19 |
20190287913 | THINNED SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2019-09-19 |
20190287914 | SEMICONDUCTOR STRUCTURE | 2019-09-19 |
20190287915 | METHODS OF FORMING BARRIER STRUCTURES IN HIGH DENSITY PACKAGE SUBSTRATES | 2019-09-19 |
20190287916 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITIONALLY GRADED WORD LINE DIFFUSION BARRIER LAYER FOR AND METHODS OF FORMING THE SAME | 2019-09-19 |
20190287917 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287918 | INTEGRATED CIRCUIT (IC) PACKAGES WITH SHIELDS AND METHODS OF PRODUCING THE SAME | 2019-09-19 |
20190287919 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287920 | SEMICONDUCTOR PACKAGE HAVING REFLECTIVE LAYER WITH SELECTIVE TRANSMITTANCE | 2019-09-19 |
20190287921 | MAGNETIC SHIELDING OF STT-MRAM IN MULTICHIP PACKAGING AND METHOD OF MANUFACTURING THE SAME | 2019-09-19 |
20190287922 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287923 | RADIATION-TOLERANT UNIT MOSFET HARDENED AGAINST SINGLE EVENT EFFECT AND TOTAL IONIZING DOSE EFFECT | 2019-09-19 |
20190287924 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-09-19 |
20190287925 | SEMICONDUCTOR DEVICE AND MANUFACTURINGMETHOD THEREOF | 2019-09-19 |
20190287926 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287927 | FLEXIBLE FAN-OUT WAFER LEVEL PROCESS AND STRUCTURE | 2019-09-19 |
20190287928 | FABRICATION METHOD OF SEMICONDUCTOR PACKAGE | 2019-09-19 |
20190287929 | INTEGRATED CIRCUIT (IC) DEVICES WITH VARYING DIAMETER VIA LAYER | 2019-09-19 |
20190287930 | CORE SUBSTRATE, MULTI-LAYER WIRING SUBSTRATE, SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, COPPER-CLAD SUBSTRATE, AND METHOD FOR MANUFACTURING CORE SUBSTRATE | 2019-09-19 |
20190287931 | CHIP ON FILM PACKAGE | 2019-09-19 |
20190287932 | Seal Ring for Hybrid-Bond | 2019-09-19 |
20190287933 | POWER CONVERTING DEVICE | 2019-09-19 |
20190287934 | MAGNETIC BILAYER STRUCTURE FOR A CORED OR CORELESS SEMICONDUCTOR PACKAGE | 2019-09-19 |
20190287935 | ULTRA LOW LOSS MICROELECTRONIC DEVICES HAVING INSULATING SUBSTRATES WITH OPTIONAL AIR CAVITY STRUCTURES | 2019-09-19 |
20190287936 | INTEGRATED CIRCUIT (IC) DEVICE INCLUDING A FORCE MITIGATION SYSTEM FOR REDUCING UNDER-PAD DAMAGE CAUSED BY WIRE BOND | 2019-09-19 |
20190287937 | GRID ARRAY CONNECTION DEVICE AND METHOD | 2019-09-19 |
20190287938 | FAN-OUT COMPONENT PACKAGE | 2019-09-19 |
20190287939 | SEMICONDUCTOR DEVICE AND FABRICATING METHOD OF THE SAME | 2019-09-19 |
20190287940 | RIBBON BONDING TOOLS AND METHODS OF USING THE SAME | 2019-09-19 |
20190287941 | WIRE BONDING METHOD AND WIRE BONDING APPARATUS | 2019-09-19 |
20190287942 | SEMICONDUCTOR PACKAGE HAVING PASSIVE SUPPORT WAFER | 2019-09-19 |
20190287943 | POWER PACKAGE MODULE OF MULTIPLE POWER CHIPS AND METHOD OF MANUFACTURING POWER CHIP UNIT | 2019-09-19 |
20190287944 | ASICS FACE TO FACE SELF ASSEMBLY | 2019-09-19 |
20190287945 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287946 | SIGNAL ROUTING IN COMPLEX QUANTUM SYSTEMS | 2019-09-19 |
20190287947 | SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2019-09-19 |
20190287948 | SEMICONDUCTOR MODULE | 2019-09-19 |
20190287949 | MAKING SEMICONDUCTOR DEVICES BY STACKING STRATA OF MICRO LEDS | 2019-09-19 |
20190287950 | HIGH EFFICIENCY CHIP-ON-BOARD LIGHT-EMITTING DIODE | 2019-09-19 |
20190287951 | SEMICONDUCTOR PACKAGES | 2019-09-19 |
20190287952 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287953 | SEMICONDUCTOR PACKAGE | 2019-09-19 |
20190287954 | SOLID STATE TRANSDUCERS WITH STATE DETECTION, AND ASSOCIATED SYSTEMS AND METHODS | 2019-09-19 |
20190287955 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-09-19 |
20190287956 | RECESSED SEMICONDUCTOR DIE IN A DIE STACK TO ACCOMODATE A COMPONENT | 2019-09-19 |
20190287957 | VERTICAL TRANSPORT STATIC RANDOM-ACCESS MEMORY CELLS WITH TRANSISTORS OF ACTIVE REGIONS ARRANGED IN LINEAR ROWS | 2019-09-19 |
20190287958 | ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE | 2019-09-19 |
20190287959 | Protection Circuit with a FET Device Coupled from a Protected Bus to Ground | 2019-09-19 |
20190287960 | Semiconductor ESD Protection Device and Method | 2019-09-19 |
20190287961 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287962 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287963 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287964 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287965 | SEMICONDUCTOR DEVICES | 2019-09-19 |
20190287966 | PROCESS ETCH WITH REDUCED LOADING EFFECT | 2019-09-19 |
20190287967 | SEMICONDUCTOR DEVICE HAVING FIN STRUCTURES OF VARYING DIMENSIONS | 2019-09-19 |
20190287968 | SIMULTANEOUSLY FABRICATING A HIGH VOLTAGE TRANSISTOR AND A FINFET | 2019-09-19 |
20190287969 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287970 | STRUCTURE AND METHOD FOR MULTIPLE THRESHOLD VOLTAGE DEFINITION IN ADVANCED CMOS DEVICE TECHNOLOGY | 2019-09-19 |
20190287971 | FINFET DEVICE WITH OXIDATION-RESIST STI LINER STRUCTURE | 2019-09-19 |
20190287972 | DUAL FIN ENDCAP FOR SELF-ALIGNED GATE EDGE (SAGE) ARCHITECTURES | 2019-09-19 |
20190287973 | DOPING WITH SOLID-STATE DIFFUSION SOURCES FOR FINFET ARCHITECTURES | 2019-09-19 |
20190287974 | SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287975 | SEMICONDUCTOR DEVICES | 2019-09-19 |
20190287976 | SEMICONDUCTOR STRUCTURE WITH A CONDUCTIVE LINE AND FABRICATING METHOD OF A STOP LAYER | 2019-09-19 |
20190287977 | SEMICONDUCTOR MEMORY DEVICE | 2019-09-19 |
20190287978 | DENSE VERTICAL FIELD EFFECT TRANSISTOR STRUCTURE | 2019-09-19 |
20190287979 | NONVOLATILE SEMICONDUCTOR MEMORY DEVICE | 2019-09-19 |
20190287980 | FRROELECTRIC MEMORY DEVICE | 2019-09-19 |
20190287981 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-09-19 |
20190287982 | THREE-DIMENSIONAL MEMORY DEVICE CONTAINING COMPOSITIONALLY GRADED WORD LINE DIFFUSION BARRIER LAYER FOR AND METHODS OF FORMING THE SAME | 2019-09-19 |