38th week of 2019 patent applcation highlights part 61 |
Patent application number | Title | Published |
20190287783 | Mass Analysis Apparatus and Mass Analysis Method | 2019-09-19 |
20190287784 | Mass Analysis Apparatus and Mass Analysis Method | 2019-09-19 |
20190287785 | System and Method for Pumping Laser Sustained Plasma and Enhancing Selected Wavelengths of Output Illumination | 2019-09-19 |
20190287786 | A FIELD EMISSION LIGHT SOURCE ADAPTED TO EMIT UV LIGHT | 2019-09-19 |
20190287787 | FILM FORMING METHOD AND FILM FORMING APPARATUS | 2019-09-19 |
20190287788 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME | 2019-09-19 |
20190287789 | WURTZITE HETEROEPITAXIAL STRUCTURES WITH INCLINED SIDEWALL FACETS FOR DEFECT PROPAGATION CONTROL IN SILICON CMOS-COMPATIBLE SEMICONDUCTOR DEVICES | 2019-09-19 |
20190287790 | LASER IRRADIATION APPARATUS AND METHOD OF MANUFACTURING THIN FILM TRANSISTOR | 2019-09-19 |
20190287791 | APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH ASPECT RATIO NANOSTRUCTURES | 2019-09-19 |
20190287792 | METHOD OF MANUFACTURING INTEGRATED CIRCUIT DEVICE | 2019-09-19 |
20190287793 | System and Method for Tuning Thickness of Resist Films | 2019-09-19 |
20190287794 | TEMPLATE, METHOD OF FABRICATING TEMPLATE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287795 | Critical Dimension Correction Via Calibrated Trim Dosing | 2019-09-19 |
20190287796 | SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING APPARATUS AND A COMPUTER-READABLE STORAGE MEDIUM | 2019-09-19 |
20190287797 | METHODS OF FORMING A MATERIAL LAYER | 2019-09-19 |
20190287798 | Compositions and Processes for Depositing Carbon-Doped Silicon-Containing Films | 2019-09-19 |
20190287799 | APPARATUS FOR MANUFACTURING GROUP III NITRIDE SINGLE CRYSTAL, METHOD FOR MANUFACTURING GROUP III NITRIDE SINGLE CRYSTAL USING THE APPARATUS, AND ALUMINUM NITRIDE SINGLE CRYSTAL | 2019-09-19 |
20190287800 | GRAPHENE NANORIBBON PRECURSOR, GRAPHENE NANORIBBON, ELECTRONIC DEVICE, AND METHOD | 2019-09-19 |
20190287801 | METHOD OF PRODUCING WAFER AND APPARATUS FOR PRODUCING WAFER | 2019-09-19 |
20190287802 | MASK FORMATION BY SELECTIVELY REMOVING PORTIONS OF A LAYER THAT HAVE NOT BEEN IMPLANTED | 2019-09-19 |
20190287803 | METHOD FOR IMPLEMENTING AND REGULATING PATTERNING OF A GRAPHENE FILM BY ULTRAVIOLET PHOTO-OXIDATION | 2019-09-19 |
20190287804 | Method for Forming Complementary Doped Semiconductor Regions in a Semiconductor Body | 2019-09-19 |
20190287805 | MODIFYING WORK FUNCTION OF A METAL FILM WITH A PLASMA PROCESS | 2019-09-19 |
20190287806 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-09-19 |
20190287807 | Schemes for Selective Deposition for Patterning Applications | 2019-09-19 |
20190287808 | SELECTIVE ATOMIC LAYER ETCHING OF SEMICONDUCTOR MATERIALS | 2019-09-19 |
20190287809 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SEMICONDUCTOR DEVICE FABRICATION METHOD | 2019-09-19 |
20190287810 | METHOD OF ETCHING MICROELECTRONIC MECHANICAL SYSTEM FEATURES IN A SILICON WAFER | 2019-09-19 |
20190287811 | SEMICONDUCTOR STRUCTURE | 2019-09-19 |
20190287812 | Dry Etching Agent Composition and Dry Etching Method | 2019-09-19 |
20190287813 | TEXTILE PATTERNING FOR SUBTRACTIVELY-PATTERNED SELF-ALIGNED INTERCONNECTS, PLUGS, AND VIAS | 2019-09-19 |
20190287814 | USE OF WAFER BRIGHTNESS TO MONITOR LASER ANNEAL PROCESS AND LASER ANNEAL TOOL | 2019-09-19 |
20190287815 | SEMICONDUCTOR PACKAGE SUBSTRATE WITH THROUGH-HOLE MAGNETIC CORE INDUCTOR USING CONDUCTIVE PASTE | 2019-09-19 |
20190287816 | SYSTEM AND METHOD FOR LASER ASSISTED BONDING OF AN ELECTRONIC DEVICE | 2019-09-19 |
20190287817 | PROCESS FOR FABRICATING A HETEROSTRUCTURE COMPRISING A CONDUCTIVE STRUCTURE AND A SEMICONDUCTOR STRUCTURE AND INCLUDING A STEP OF ELECTRICAL DISCHARGE MACHINING | 2019-09-19 |
20190287818 | ENCAPSULATED SEMICONDUCTOR PACKAGE | 2019-09-19 |
20190287819 | INTEGRATED FAN-OUT PACKAGE HAVING MULTI-BAND ANTENNA AND METHOD OF FORMING THE SAME | 2019-09-19 |
20190287820 | PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-09-19 |
20190287821 | APPARATUS AND METHOD FOR INCREASED PURGE VELOCITY IN SPECIALTY GAS SYSTEMS | 2019-09-19 |
20190287822 | EFEM, EQUIPMENT FRONT END MODULE | 2019-09-19 |
20190287823 | STICTION-FREE DRYING PROCESS WITH CONTAMINANT REMOVAL FOR HIGH-ASPECT RATIO SEMICONDUCTOR DEVICE STRUCTURES | 2019-09-19 |
20190287824 | METHODS AND APPARATUS FOR CLEANING SUBSTRATES | 2019-09-19 |
20190287825 | PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS | 2019-09-19 |
20190287826 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287827 | Phase Mixture Temperature Controlled Hot Plate | 2019-09-19 |
20190287828 | HEAT INSULATION STRUCTURE AND VERTICAL HEAT TREATMENT APPARATUS | 2019-09-19 |
20190287829 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287830 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287831 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287832 | SEGMENTED VERTICAL WAFER BOAT | 2019-09-19 |
20190287833 | SUBSTRATE TRANSPORT APPARATUS | 2019-09-19 |
20190287834 | EFEM, EQUIPMENT FRONT END MODULE | 2019-09-19 |
20190287835 | Interchangeable Edge Rings For Stabilizing Wafer Placement And System Using Same | 2019-09-19 |
20190287836 | POSITIONING METHOD | 2019-09-19 |
20190287837 | MEASUREMENT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD | 2019-09-19 |
20190287838 | ELECTROSTATIC CHUCK | 2019-09-19 |
20190287839 | ELECTROSTATIC CHUCK | 2019-09-19 |
20190287840 | ELECTROSTATIC CHUCK | 2019-09-19 |
20190287841 | DUAL SIDE DE-BONDING IN COMPONENT CARRIERS USING PHOTOABLATION | 2019-09-19 |
20190287842 | SUBSTRATE HOLDING APPARATUS AND SUBSTRATE PROCESSING APPARATUS | 2019-09-19 |
20190287843 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287844 | PIN CONTROL METHOD AND SUBSTRATE PROCESSING APPARATUS | 2019-09-19 |
20190287845 | SUPPORT RING WITH PLASMA SPRAY COATING | 2019-09-19 |
20190287846 | SEMICONDUCTOR DEVICE USING INTER-DIFFUSION AND METHOD FOR MANUFACTURING THE SAME | 2019-09-19 |
20190287847 | CAVITY FORMATION WITHIN AND UNDER SEMICONDUCTOR DEVICES | 2019-09-19 |
20190287848 | Interconnect Structure Having an Etch Stop Layer Over Conductive Lines | 2019-09-19 |
20190287849 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2019-09-19 |
20190287850 | FIELD EFFECT DEVICE WITH REDUCED CAPACITANCE AND RESISTANCE IN SOURCE/DRAIN CONTACTS AT REDUCED GATE PITCH | 2019-09-19 |
20190287851 | Conductive Feature Formation and Structure Using Bottom-Up Filling Deposition | 2019-09-19 |
20190287852 | FORMING GATE LINE-END OF SEMICONDUCTOR STRUCTURES | 2019-09-19 |
20190287853 | THROUGH ELECTRODE SUBSTRATE, METHOD OF MANUFACTURING THROUGH ELECTRODE SUBSTRATE, AND MOUNTING SUBSTRATE | 2019-09-19 |
20190287854 | STRESS COMPENSATION AND RELIEF IN BONDED WAFERS | 2019-09-19 |
20190287855 | METHOD OF SEPARATING A BACK LAYER ON A SUBSTRATE USING EXPOSURE TO REDUCED TEMPERATURE AND RELATED APPARATUS | 2019-09-19 |
20190287856 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287857 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THEREOF | 2019-09-19 |
20190287858 | LATERALLY ADJACENT AND DIVERSE GROUP III-N TRANSISTORS | 2019-09-19 |
20190287859 | Asymmetric Source/Drain Epitaxy | 2019-09-19 |
20190287860 | TRANSISTOR STRUCTURE | 2019-09-19 |
20190287861 | SUBSTRATE WITH A FIN REGION COMPRISING A STEPPED HEIGHT STRUCTURE | 2019-09-19 |
20190287862 | INTEGRATED CIRCUIT WITH IMPROVED RESISTIVE REGION | 2019-09-19 |
20190287863 | VERTICAL FIELD EFFECT TRANSISTORS INCORPORATING U-SHAPED SEMICONDUCTOR BODIES AND METHODS | 2019-09-19 |
20190287864 | INNER SPACER AND JUNCTION FORMATION FOR INTEGRATING EXTENDED-GATE AND STANDARD-GATE NANOSHEET TRANSISTORS | 2019-09-19 |
20190287865 | IC UNIT AND METHOND OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME | 2019-09-19 |
20190287866 | CHEMICAL MECHANICAL POLISHING APPARATUS CONTAINING HYDRAULIC MULTI-CHAMBER BLADDER AND METHOD OF USING THEREOF | 2019-09-19 |
20190287867 | SUBSTRATE STRUCTURE, SEMICONDUCTOR PACKAGE STRUCTURE AND SEMICONDUCTOR PROCESS | 2019-09-19 |
20190287868 | EXPOSING CIRCUITRY FOR DIE TESTING | 2019-09-19 |
20190287869 | INTEGRATED CHIP SCALE PACKAGES | 2019-09-19 |
20190287870 | FILLING COMPOSITION FOR SEMICONDUCTOR PACKAGE | 2019-09-19 |
20190287871 | POWER SEMICONDUCTOR DEVICE, ROTATING ELECTRIC MACHINE INCLUDING SAME, AND METHOD OF MANUFACTURING POWER SEMICONDUCTOR DEVICE | 2019-09-19 |
20190287872 | MULTI-USE PACKAGE ARCHITECTURE | 2019-09-19 |
20190287873 | Method of Packaging Thin Die and Semiconductor Device Including Thin Die | 2019-09-19 |
20190287874 | ELECTRONIC DEVICES AND FABRICATING PROCESSES | 2019-09-19 |
20190287875 | METHODS FOR FORMING A CHIP PACKAGE | 2019-09-19 |
20190287876 | THREE-DIMENSIONAL PACKAGING STRUCTURE AND PACKAGING METHOD OF POWER DEVICES | 2019-09-19 |
20190287877 | HEAT RADIATION DEVICE, SEMICONDUCTOR PACKAGE COMPRISING THE SAME, AND SEMICONDUCTOR DEVICE COMPRISING THE SAME | 2019-09-19 |
20190287878 | SYSTEM FOR COOLING COMPONENTS IN AN ELECTRONIC MODULE | 2019-09-19 |
20190287879 | INTERCONNECTED INTEGRATED CIRCUIT (IC) CHIP STRUCTURE AND PACKAGING AND METHOD OF FORMING SAME | 2019-09-19 |
20190287880 | SMDS INTEGRATION ON QFN BY 3D STACKED SOLUTION | 2019-09-19 |
20190287881 | SEMICONDUCTOR PACKAGE WITH DIE STACKED ON SURFACE MOUNTED DEVICES | 2019-09-19 |
20190287882 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2019-09-19 |