38th week of 2014 patent applcation highlights part 94 |
Patent application number | Title | Published |
20140268566 | DIGITAL SUBSCRIBER LINE ACCESS MULTIPLEXER ENCLOSURES HAVING ONBOARD POWER - A system includes a digital subscriber line access multiplexer (DSLAM) enclosure having a power area for housing power components and a component area for housing components configured to receive power from the power components. The system further includes at least one DSLAM positioned in the component area of the DSLAM enclosure and an AC power supply for providing AC power to the at least one DSLAM. The AC power supply is positioned in the power area of the DSLAM enclosure. | 2014-09-18 |
20140268567 | ELECTRONIC DEVICE ENCLOSURE - An electronic device enclosure includes a casing, an air duct mounted in the casing, and a latching member. The air duct includes a receiving bracket formed on the air duct for receiving an uninterruptible power supply module. The latching member is covered on the receiving bracket to position the uninterruptible power supply module. A first side of the latching member is rotatably connected to the receiving bracket, and a second side of the latching member is detachably latched to the receiving bracket. | 2014-09-18 |
20140268568 | BOARD UNIT AND ELECTRONIC DEVICE - A board unit includes a board to have an object to be cooled, the object being implemented on the board, a baffle plate to be rotatably coupled to the board and to be displaced to a first rotary position to guide a cooling air, flowing from a first direction to the board, to the object to be cooled and a second rotary position to guide a cooling air, flowing from a second direction to the board, to the object to be cooled, and an arm to be movably attached to the board and also to be rotatably coupled to a rotary end of the baffle plate to displace the baffle plate to the first rotary position and the second rotary position with movement. | 2014-09-18 |
20140268569 | Method And System For Providing A Customized Storage Container - A method and system for providing a customized storage container includes a generally rectangular housing and at least one printed circuit board contained within the rectangular housing. The customized storage container encloses a first row of interconnector modules that are positioned adjacent to a first, open end of the rectangular housing. The customized storage container also encloses a second row of interconnector modules positioned adjacent to the first, open end of the rectangular housing. At least one air vent is positioned along a side of the rectangular housing and adjacent to a second, closed end of the rectangular housing. According to one exemplary embodiment, the storage container can comprise a single printed circuit board for supporting the first and second row of interconnector modules. In another exemplary embodiment, the storage container can comprise two printed circuit boards for supporting the first and second rows interconnector modules. | 2014-09-18 |
20140268570 | POWER POLE ISOLATED HEAT PIPE INVERTER ASSEMBLY - A power pole inverter is provided. The power pole inverter includes a housing assembly, a capacitor assembly, a number of arm assemblies, a number of heat sinks, and a support assembly. The housing assembly includes a number of sidewalk. The housing assembly sidewalls defining an enclosed space. The capacitor assembly is coupled to the housing assembly. Each arm assembly includes a plurality of electrical components and a number of electrical buses. Each the electrical bus includes a body with terminals, each the terminal structured to be coupled to, and in electrical communication with, the capacitor assembly, each arm assembly including a neutral terminal. Each arm assembly is coupled to, and in electrical communication with, the capacitor assembly. The support assembly includes a non-conductive frame assembly. The support assembly is structured to support each the heat sink in isolation. | 2014-09-18 |
20140268571 | SYSTEM AND METHOD FOR COOLING HEAT GENERATING COMPONENTS - An assembly for cooling heat generating components, such as power electronics, computer processors and other devices. Multiple components may be mounted to a support and cooled by a flow of cooling fluid. A single cooling fluid inlet and outlet may be provided for the support, yet multiple components, including components that have different heat removal requirements may be suitably cooled. One or more manifold elements may provide cooling fluid flow paths that contact a heat transfer surface of a corresponding component to receive heat. | 2014-09-18 |
20140268572 | ADVANCED COOLING FOR POWER MODULE SWITCHES - A system includes an electronic device, a heat spreader with a vapor chamber attached to a bottom end of the electronic device, so that heat flows from the electronic device to the heat spreader, and a heat sink with microchannels running through it attached to a bottom end of the heat spreader, so that heat from the heat spreader flows through the heat sink and to an ambient. A method for cooling a device includes transferring heat generated by a device through a conductivity layer, spreading the heat through a heat spreader, transferring the heat from the heat spreader to a heat sink that contains microchannels, and releasing the heat from the heat sink into an ambient. | 2014-09-18 |
20140268573 | MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE IN RESPONSE TO AN INFERRED USER CONTACT WITH THE PORTABLE ELECTRONIC DEVICE - Described embodiments include a portable electronic device. The device includes a shell housing components of the portable electronic device having a heat-generating component. The device includes a heat-rejection element located at an exterior surface of the shell. The heat-rejection element is configured to reject heat received from the heat-generating component into an environment in thermal contact with the heat-rejection element. The device includes a controllable thermal coupler configured to regulate heat transfer to the heat-rejection element. The device includes an activity monitor configured to infer a user touch to the shell in response to a detected activity of the portable electronic device. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the heat-rejection element in response to the inferred user touch. | 2014-09-18 |
20140268574 | COMPONENT BUILT-IN BOARD AND METHOD OF MANUFACTURING THE SAME, AND COMPONENT BUILT-IN BOARD MOUNTING BODY - A component built-in board comprises stacked therein a plurality of printed wiring bases having a wiring pattern and a via formed on/in a resin base thereof, and comprises an electronic component built in thereto, wherein at least a portion of the plurality of printed wiring bases include a thermal wiring in the wiring pattern and include a thermal via in the via, at least one of the plurality of printed wiring bases has formed therein an opening where the electronic component is built, and has formed therein a heat-conducting layer and closely attached to a surface on an opposite side to an electrode formation surface of the electronic component built in to the opening, and the electronic component is fixed in the opening by an adhesive layer stacked on the heat-conducting layer, via a hole formed in a region facing onto the opening of the heat-conducting layer. | 2014-09-18 |
20140268575 | IMPLEMENTING HEAT SINK LOADING HAVING MULTIPOINT LOADING WITH ACTUATION OUTBOARD OF HEATSINK FOOTPRINT - A method and apparatus are provided for implementing enhanced heat sink loading for cooling an electronic module having one or more semiconductor chips. The apparatus includes an electronic module having one or more semiconductor chips; a heat sink; a heat sink load bearing member further comprising raised points; a load spring passing through the heat sink, the load spring having a latch arm at a first end and a load screw at a second end actuating the load spring, the load spring when actuated is configured to bear against the raised points to equalize pressure distribution over one or more semiconductor chips on the electronic module. | 2014-09-18 |
20140268576 | LINE REPLACEABLE UNIT WITH UNIVERSAL HEAT SINK RECEPTACLE - A line replaceable unit includes a universal heat sink receptacle formed in an inner surface of a wall of an enclosure. The universal heat sink receptacle is configured to receive a heat spreader for any standard or custom COM Express module so that the line replaceable unit may be efficiently reconfigured with different COM Express modules if needed. | 2014-09-18 |
20140268577 | CHIP PACKAGE CONNECTOR ASSEMBLY - This disclosure relates generally to a chip package assembly arranged to be electrically coupled to a circuit board including a plurality of circuit board contacts. The chip package assembly may include a chip package including a first side and a second side, the second side including a first plurality of contacts arranged to be electrically coupled to the plurality of circuit board contacts and a second plurality of contacts arranged to be electrically coupled to a remote device via a connector assembly. | 2014-09-18 |
20140268578 | Electronic Device With Heat Dissipating Electromagnetic Interference Shielding Structures - An electronic device may have a metal electromagnetic interference shielding enclosure. The enclosure may have a bottom wall, vertical sidewalls that extend upwards from the bottom wall, and a lid that covers the enclosure to define an interior cavity. Power supply components and other electrical components may be mounted within the interior cavity. A printed circuit board on which integrated circuits and other components are mounted may have an upper surface that faces the bottom wall of the enclosure and an opposing lower surface that faces a metal plate. Fence structures may be used to help shield components mounted on the printed circuit. Heat may be dissipated from components on the printed circuit into the bottom wall and into the metal plate. A plastic housing may be used to house the shielding enclosure, printed circuit board, components mounted on the printed circuit board, and the metal plate. | 2014-09-18 |
20140268579 | ELECTRONIC DEVICES ASSEMBLED WITH HEAT ABSORBING AND/OR THERMALLY INSULATING COMPOSITION - Provided herein are electronic devices assembled with a heat absorbing and/or thermally insulating composition. | 2014-09-18 |
20140268580 | METHOD AND APPARATUS FOR PROVIDING A GROUND AND A HEAT TRANSFER INTERFACE ON A PRINTED CIRCUIT BOARD - In one embodiment, a printed circuit board (PCB) assembly includes a PCB, the PCB being arranged to define a through-hole therein, the through-hole having a surface, wherein the PCB includes a top surface and a bottom surface. The PCB assembly also includes a slug arrangement and a surface mount component. The slug arrangement is formed from an electrically and thermally conductive material and includes at least a first portion and a second portion. At least a part of the first portion is positioned in the through-hole, and the second portion is coupled to the bottom surface. The surface mount component is positioned over the through-hole and the top surface, and has a first surface configured to contact the first portion. | 2014-09-18 |
20140268581 | WIRING SUBSTRATE AND MANUFACTURING METHOD THEREOF - Disclosed is a wiring substrate and method of manufacturing thereof, the wiring substrate including: a substrate having a high thermal conductive layer, in which at least one of a front surface and a rear surface of the substrate is a mounting surface for a variety of components; a connection terminal extended from the substrate and bending in a direction that is perpendicular to a surface of the substrate; and a heat radiation piece section integrally installed to the connection terminal. | 2014-09-18 |
20140268582 | ELECTRONIC DEVICE ENCLOSURE SYSTEM AND METHOD - An enclosure for storing more than one electronic device. The enclosure includes a frame having a rear surface to be in apposition to a support surface, a rack supported within the frame, the racking having at least one slot for receiving an electronic device, and a door supported by the frame and pivotable about a generally vertical axis between a closed position substantially perpendicular to the rear surface and an open position substantially planar with the rear surface, the slot being accessible through a side of the enclosure when the door is in the open position. | 2014-09-18 |
20140268583 | Electrical Gasket and Electronic Module Having Electrical Gasket - An electrical gasket provides an electrical seal between first and second components in an electrical module. The electrical gasket includes an attachment portion for fixedly attaching the electrical gasket to one of the first and second components and a plurality of spring members for engaging the other of the first and second components to make mechanical and electrical contact between the first and second components such that the electrical seal is provided between the first and second electrical components. One of the components of the module can be an EMI shield or printed circuit board of the module, and another of the components can be the module housing. | 2014-09-18 |
20140268584 | DISPLAY APPARATUS - A display apparatus includes a display module for displaying an image, and a variable member for varying a shape of the display module. The variable member includes a first portion capable of varying in shape, and a second portion having opposite ends respectively fixed to opposite ends of the first portion, where a distance between the opposite ends of the second portion is varied such that the opposite ends of the first portion protrudes with respect to a central region of the first portion and thereby, the display module is varied in shape. | 2014-09-18 |
20140268585 | ELECTRONIC MODULE AND ELECTRONIC DEVICE - An electronic device including a rear cover, a transparent front cover, a first electronic element, a second electronic element, a conductive tape, and an elastomer is provided. The transparent front cover is disposed on the rear cover. The first electronic element is disposed between the transparent front cover and the rear cover. The second electronic element is disposed between the first electronic element and the rear cover. The conductive tape is disposed between the first electronic element and the second electronic element, and contacts the first electronic element and the second electronic element to electrically connect the first electronic element to the second electronic element. The elastomer is disposed between the first electronic element and the second electronic element, and is attached to the conductive tape under pressure. An electronic module including the first electronic element, the second electronic element, the conductive tape, and the elastomer above is provided. | 2014-09-18 |
20140268586 | SEMICONDUCTOR PACKAGE AND PRINTED CIRCUIT BOARD - A substrate of a semiconductor package comprises a conductor pattern which is formed in a surface layer, and is electrically connected to one terminal out of a power terminal and a ground terminal of a semiconductor element. The substrate also comprises in the surface layer a conductor pattern which is arranged while being separated from the conductor pattern, and a conductor pattern which is formed so as to have a wiring width thinner than that of the conductor pattern and connects the conductor pattern with the conductor pattern. The substrate also comprises a conductor pattern which is formed in an inner layer, faces the conductor pattern through a dielectric and is electrically connected to the other terminal out of the power terminal and the ground terminal of the semiconductor element. | 2014-09-18 |
20140268587 | MODULE AND METHOD OF MANUFACTURING THE SAME - An engagement structure for preventing the separation of a resin layer is formed in a contact surface of an insulating substrate in a connecting component, the contact surface being in contact with the resin layer. The resin layer engages with the engagement structure in the contact surface in the insulating substrate in contact with the resin layer, the contact surface forming the side surface of the connecting component. | 2014-09-18 |
20140268588 | PORTABLE TERMINAL AND METHOD OF MANUFACTURING A MODULE THEREOF - A portable terminal including a module, in which one or more storage members are disposed, and a method for manufacturing the portable terminal are provided. The portable terminal includes a first assembly that includes a shield can and a flexible circuit board attached to a surface of the shield can. The portable terminal also includes at least one socket unit mounted to an upper side of the first assembly. The socket unit is mounted to an upper side of the flexible circuit board while the first assembly is positioned on a jig. | 2014-09-18 |
20140268589 | CIRCUIT BOARD AND ELECTRONIC DEVICE PROVIDED WITH SAME - A circuit board and an electronic device having the circuit board that includes a ceramic sintered body, a through conductor and a metal wiring layer. The ceramic sintered body includes a through hole penetrating from a first main surface to a second main surface thereof. The through conductor is in the through hole and has first and second ends. The metal wiring layer covering the first end and electrically connected to the through conductor. The through conductor includes: a first portion having a hollow cylinder shape, in contact with an inner wall of the through hole and extending from the first end to the second end; and a second portion having a columnar shape and disposed inside the first portion. The second portion has an average grain size of the metal larger than that in the first portion. | 2014-09-18 |
20140268590 | WINDOW MEMBER AND METHOD OF MANUFACTURING THE SAME - A window member includes: a glass member; a display member wherein the glass member has a bottom surface which faces and overlays the display member and a pattern layer provided on a first surface of the glass member and having a fine pattern. The pattern layer is silk-screen printed on the first surface of the glass member to directly contact the surface of the glass member. A method of manufacturing a window member, includes: forming a pattern layer such that the pattern layer contacts a surface of the glass member along a periphery of the glass member. The pattern layer is formed at a location which is offset inward from a periphery of the glass member. | 2014-09-18 |
20140268591 | PRINTING COMPLEX ELECTRONIC CIRCUITS - A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. The devices in each group are connected in parallel so that each group acts as a single device. In one embodiment, about 10 devices are contained in each group so the redundancy makes each group very reliable. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits. | 2014-09-18 |
20140268592 | Assembling and Handling Edge Interconnect Packaging System - Apparatuses and methods related to the field of microchip assembly and handling, in particular to devices and methods for assembling and handling microchips manufactured with solid edge-to-edge interconnects, such as Quilt Packaging® interconnect technology. Specialized assembly tools are configured to pick up one or more microchips, place the microchips in a specified location aligned to a substrate, package, or another microchip, and facilitate electrical contact through one of a variety of approaches, including solder reflow. This specialized assembly tooling performs heating functions to reflow solder to establish electrical and mechanical interconnections between multiple microchips. Additionally, the interconnected microchips may be arranged in an arbitrarily large array. | 2014-09-18 |
20140268593 | FLEXIBLE INTERCONNECT STRUCTURE FOR A SENSOR ASSEMBLY - This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor. | 2014-09-18 |
20140268594 | METHOD OF EMBEDDING A PRE-ASSEMBLED UNIT INCLUDING A DEVICE INTO A FLEXIBLE PRINTED CIRCUIT AND CORRESPONDING ASSEMBLY - A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer. | 2014-09-18 |
20140268595 | FLEXIBLE DISPLAY DEVICE - A flexible display device includes a flexible display panel, a flexible printed circuit board extending from the display panel, an integrated circuit chip that is mounted on at least one surface of the flexible printed circuit board and is configured to drive the display panel, and a protection member attached to a rear surface of the display panel. When the flexible printed circuit board is flexed to be partially positioned on the rear surface of the display panel, the protection member is positioned between the display panel and the integrated circuit chip. The flexible display device prevents the integrated circuit chip stacked with the display panel from making direct contact with the display panel using the protection member. Thus, even if the display device is deformed into, for example, a flexed or rolled state, it is possible to prevent the display panel from being damaged. | 2014-09-18 |
20140268596 | Flexible Metal Interconnect Structure - A flexible metal interconnect structure for transmitting signals between IC devices in flexible electronic devices is formed between two compliant flexible material layers that are laminated together form a multi-layer flexible substrate. The interconnect structure is formed by two rows of spaced-apart conductive pads (metal islands) attached to the inside (facing) surfaces of the flexible material layers. Compliant micro-contact elements such as micro-springs provide sliding metal pressure contacts that maintain electrical connections between the islands during stretching of the composite sheet. Specifically, at least two micro-contact elements are attached to each metal island in one of the rows, with one element in sliding pressure contact with an associated first metal island in the opposing row and the second element in sliding pressure contact with an associated second metal island. The islands and sliding contacts can be patterned into high density traces that accommodate large strains. | 2014-09-18 |
20140268597 | Metro Cell Aggregator Enclosure - A telecommunications aggregator enclosure includes a housing and a cover movably connected thereto. The cover is movable between open and closed positions. A printed circuit board is disposed in the housing. At least one first optical termination is connected to the printed circuit board to receive cables from a base station router. At least one second optical termination is connected to the printed circuit board to receive cables from at least one metro cell. A power supply module is connected to the printed circuit board to supply power thereto. | 2014-09-18 |
20140268598 | Electronic Device Having Connector With Integrated Shielding - An electronic device may have a housing in which electrical components on a printed circuit board are mounted. A connector may be mounted to the edge of the printed circuit board using solder. The connector may have a threaded portion that protrudes through the housing. A threadless portion of the connector may be aligned with the housing. The connector may have a metal body member covered with a metal shell. The metal shell may have a portion that covers the electrical components and serves as an electromagnetic interference shield for the electrical components. The connector may have a threaded barrel. The threaded barrel may have a threaded outer portion with a diameter that is larger than a threaded inner portion. The threadless portion of the connector may lie between the threaded outer and inner portions. | 2014-09-18 |
20140268599 | DATA TRANSFER DEVICE WITH CONFIGURABLE SLOT SIZES AND METHODS OF USING THE SAME - A data transfer device that comprises: a chassis; a backplane; a slot arranged within the chassis and configured to hold a card; and a connector system integrated on the backplane and configured to electrically couple the card with the backplane; wherein the connector system includes a group of connectors arranged along a length of the slot such that a plurality of cards with card lengths less than the length of the slot may be electrically coupled to the backplane within a single slot. | 2014-09-18 |
20140268600 | HOUSING FOR AN ELECTRONIC DEVICE INTERNAL WALLS - An electronic device may include a housing and a printed circuit board, where the housing has a front cover and a back cover that at least substantially enclose the printed circuit board. In some instances, the back cover may include an outer shell and one or more inward extending walls that extend inwardly toward the printed circuit board. In some cases, the inward extending walls, the outer shell, and the printed circuit board define two or more internal pockets within the housing. The pockets may, in some cases, separate one region of the printed circuit board from another region of the printed circuit board. In some instances, the one or more inward extending walls may be configured to provide support to a back side of the printed circuit board, which may be particularly useful when a touch screen display is mounted on a front side of the printed circuit board. | 2014-09-18 |
20140268601 | Filter Packaging for System for Wireless, Motion and Position-Sensing, Integrating Radiation Sensor for Occupational and Environmental Dosimetry - A device comprising: a printed circuit board (PCB); a sensor package mounted on a first side of the PCB; electronics mounted on a second side of the PCB; and one or more filters, wherein the sensor package comprises one or more radiation sensors mounted therein, wherein each of the one or more filters filter one or more types of radiation that enter an exposed side of each of the one or more sensors at angle of at least 60 degrees with respect to a respective axial line through respective centers of each of the one or more sensors. | 2014-09-18 |
20140268602 | ELECTRONIC DEVICE AND METHODS - An electronic assembly may have a display, a display holder, and a printed circuit board (PCB). The display may have a front side for viewing the display, a back side, and side walls extending between the front side and the back side. The display holder may have a recess for receiving at least part of the display, where the display holder may extend adjacent part of the front side of the display and adjacent at least part of the side walls of the display. The PCB may be secured relative to the display holder and adjacent the back side of the display. The PCB may be in operative communication with the display. In some cases, a spacer may be situated between the back side of the display and the PCB. | 2014-09-18 |
20140268603 | AREA ARRAY DEVICE CONNECTION STRUCTURES WITH COMPLIMENTARY WARP CHARACTERISTICS - A method for designing structures with complimentary dynamic warp characteristics for attachment of a component to a PC board is disclosed. The method may include determining characteristics of thermally induced dynamic warp of the PC board and of the first component, analyzing and comparing differences between the dynamic warp characteristics of the PC board and the first component and selecting design modifications to match PC board and the first component dynamic warp characteristics. Selecting design modifications may include determining if the first component dynamic warp characteristics can be changed, determining if matching the dynamic warp characteristics of the PC board and the first component can be achieved by modifying the design of at least one of the PC board and the first component. The result of the method may be modified dynamic warp characteristics of at least one of the PC board and the first component. | 2014-09-18 |
20140268604 | Methods and Systems For Embedding Filaments in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices - The present invention provides systems and methods for embedding a filament or filament mesh in a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device by providing at least a first layer of a substrate material, and embedding at least a portion of a filament or filament mesh within the first layer of the substrate material such the portion of the filament or filament mesh is substantially flush with a top surface of the first layer and a substrate material in a flowable state is displaced by the portion of the filament and does not substantially protrude above the top surface of the first layer, allowing the continuation of an additive manufacturing process above the embedded filament or filament mesh. A method is provided for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device. | 2014-09-18 |
20140268605 | Electronic Package Mounting - An assembly and method for mounting an electronic package to a printed circuit board (PCB) in which a gasket is shaped to fit tightly around and under a perimeter edge of an electronic package. | 2014-09-18 |
20140268606 | PACKAGE OF ENVIRONMENTALLY SENSITIVE ELECTRONIC DEVICE AND FABRICATING METHOD THEREOF - A package of an environmentally sensitive electronic device and a fabricating method thereof are provided, wherein the package may include a first substrate, a second substrate, the environmentally sensitive electronic device, a packaging body, and a filler. In one or more embodiments, the environmentally sensitive electronic device may be disposed on the first substrate and located between the first substrate and the second substrate. The filler is disposed between the first substrate and the second substrate and covers the environmentally sensitive electronic device. The packaging body is sandwiched between the first substrate and the second substrate and encloses the environmentally sensitive electronic device and the filler. A material for the packaging body may include a bonding of transition metal and metalloid. | 2014-09-18 |
20140268607 | Methods and Systems For Connecting Inter-Layer Conductors and Components in 3D Structures, Structural Components, and Structural Electronic, Electromagnetic and Electromechanical Components/Devices - The present invention provides systems and methods for creating interlayer mechanical or electrical attachments or connections using filaments within a three-dimensional structure, structural component, or structural electronic, electromagnetic or electromechanical component/device. | 2014-09-18 |
20140268608 | COMPONENT HOLDING STRUCTURES, SYSTEM, AND METHOD - A component holding structure for holding a plurality of through-hole components having an axial lead includes a pair of opposing end walls that define a cavity between them. The cavity is configured to receive the through-hole components. The through-hole components are positioned between the pair of opposing end walls in a vertically-stacked configuration. Each one of the end walls includes at least one slot that is configured to receive the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. Each one of the end walls also includes a plurality of lead guides that are configured to guide the axial lead of each through-hole component when the plurality of through-hole components are inserted into the component holding structure. | 2014-09-18 |
20140268609 | SUPPORT STRUCTURE FOR INTEGRATED CIRCUITRY - Among other things, one or more support structures for integrated circuitry and techniques for forming such support structures are provided. A support structure comprises one or more trench structures, such as a first trench structure and a second trench structure formed around a periphery of integrated circuitry. In some embodiments, one or more trench structures are formed according to partial substrate etching, such that respective trench structures are formed into a region of a substrate. In some embodiments, one or more trench structures are formed according to discontinued substrate etching, such that respective trench structures comprise one or more trench portions separated by separation regions of the substrate. The support structure mitigates stress energy from reaching the integrated circuitry, and facilitates process-induced charge release from the integrated circuitry. | 2014-09-18 |
20140268610 | METHOD AND SYSTEM FOR FORMING A MICROVIA IN A PRINTED CIRCUIT BOARD - A method for forming vias in a multilayered printed circuit board is disclosed, which includes providing a multilayered printed circuit board having at least two or more layers; placing a donut pad on an upper layer of at least one layer of the multilayered printed circuit board for forming a via through one or more of the layers of the multilayered printed circuit board, the donut pad having a clearance of less than approximately 80 to 90 percent of a diameter of the via; and forming at least one via through the donut pad and at least one or more layers of the multilayered printed circuit board. | 2014-09-18 |
20140268611 | System For Applying Power Directly Into Power Connectors For Modular Systems - A system for providing electrical power connection across components mounted to a backplane of an electrical chassis includes a backplane having multiple apertures and front and rear faces. A daughter board faces the front face of the backplane. The daughter board has multiple traces with individual conductive pads. A power connector connected to the rear face of the backplane has multiple conductive members. Multiple fasteners each extend through both the daughter board and into the backplane to electrically couple each of the conductive pads of the daughter board to one of the conductive members of the power connector. | 2014-09-18 |
20140268612 | CORELESS SUBSTRATE WITH PASSIVE DEVICE PADS - Embodiments of the present disclosure are directed towards coreless substrates with passive device pads, as well as methods for forming coreless substrates with passive device pads and package assemblies and systems incorporating such coreless substrates. A coreless substrate may comprise a plurality of build-up layers, such as bumpless build-up layers (BBUL). In various embodiments, electrical routing features and passive device pads may be disposed on an outer surface of the substrate. In various embodiments, the passive device pads may be coupled with a conductive element disposed on or within the build-up layers. In various embodiments, an electrical path may be defined in the plurality of build-up layers to route electrical power between the passive device pads and a die coupled to the coreless substrate. | 2014-09-18 |
20140268613 | Apparatus for improved power distribution in an electrical component board - Embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blinds are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. A resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component. | 2014-09-18 |
20140268614 | COUPLED VIAS FOR CHANNEL CROSS-TALK REDUCTION - Capacitively coupled vertical transitions may be configured with a desired amount of mutual capacitance to at least partially cancel crosstalk for an overall channel crosstalk (e.g., FEXT) reduction. In embodiments, capacitive coupling of adjacent vertical transitions is achieved with overlapping metal surfaces within the vertical transitions. In embodiments, one or more of the overlapping metal surfaces are vias, via pads, or metal stub features extending off a vertical transition. In embodiments, signal paths with overlapped vertical transitions are utilized to achieve crosstalk reduction of more than one victim-aggressor pair and/or to achieve crosstalk reduction of more than two aggressors. In embodiments, capacitively coupled vertical transitions are implemented in a package substrate, an interposer, or a printed circuit board. | 2014-09-18 |
20140268615 | TWO-STAGE POWER DELIVERY ARCHITECTURE - A two-stage power delivery network includes a voltage regulator and an interposer. The interposer includes a packaging substrate having an embedded inductor. The embedded inductor includes a set of traces and a set of through substrate vias at opposing ends of the traces. The interposer is coupled to the voltage regulator. The two-stage power delivery network also includes a semiconductor die supported by the packaging substrate. The two-stage power delivery network also includes a capacitor that is supported by the packaging substrate. The capacitor is operable to provide a decoupling capacitance associated with the semiconductor die and a capacitance to reduce a switching noise of the voltage regulator. | 2014-09-18 |
20140268616 | CAPACITOR WITH A DIELECTRIC BETWEEN A VIA AND A PLATE OF THE CAPACITOR - In a particular embodiment, a device includes a substrate, a via that extends at least partially through the substrate, and a capacitor. A dielectric of the capacitor is located between the via and a plate of the capacitor, and the plate of the capacitor is external to the substrate and within the device. | 2014-09-18 |
20140268617 | SUPERCAPACITOR STRUCTURES - Supercapacitor structures are provided which include, for example: one or more layers of supercapacitors; and one or more contact tabs. The one or more contact tabs electrically contact and extend outward from the supercapacitor structure to facilitate electrical connection to the supercapacitor structure, and the one or more contact tabs include a multi-contact tab. The multi-contact tab is configured and sized with multiple contact locations which are disposed external to the supercapacitor structure. Various supercapacitor structures are provided, including one supercapacitor structure with a shared C-shaped current collector, and another supercapacitor structure with stacked supercapacitors. One or more additional multi-contact tabs may also extend from the supercapacitor structure(s) and distribute the same or a different capacitor voltage than the multi-contact tab. | 2014-09-18 |
20140268618 | PRINTED BOARD, PRINTED BOARD UNIT, AND METHOD OF MANUFACTURING PRINTED BOARD - A printed-board includes a first conductor-layer, a second conductor-layer provided to a layer different from the first conductor-layer, an insulation-layer provided between the first conductor-layer and the second conductor-layer, a plurality of through-holes that pass through the first conductor-layer, the second conductor-layer, and the insulation-layer, and a plurality of vias that are formed in the plurality of through-holes, respectively, and couple the first conductor-layer and the second conductor-layer, each of the plurality of vias including a conductor portion that occupies part of an internal space of the through-hole, and a non-conductor portion that occupies remaining part of the internal space, wherein in a given pair of vias adjacent to each other, the conductor portion of one of the pair of vias is arranged so as to face the non-conductor portion of another one of the pair of vias. | 2014-09-18 |
20140268619 | Method of Manufacturing Substrate for Chip Packages and Method of Manufacturing Chip Package - Provided are a method of manufacturing a substrate for chip packages and a method of manufacturing a chip package, the method of manufacturing the substrate including: forming a lower adhesive layer in a lower part of an insulation film; forming an upper adhesive layer in an upper part of the insulation film to form a base material; forming via holes in the base material; and forming a circuit pattern layer on the upper adhesive layer, so it is effective to improve adhesion power between the molding resin and the insulation film at the time of manufacturing a chip package later. | 2014-09-18 |
20140268620 | EXPANDABLE BACKPLANE - An expandable backplane is provided. The expandable backplane includes a baseboard management controller for connecting several disks, a first expansion board, a second expansion board, and a multiplexer. The multiplexer is connected between the baseboard management controller, the first expansion board, and the second expansion board. The multiplexer is used to control the second expansion board to be connected to the baseboard management controller via the first expansion board or control the second expansion board to be directly connected to the baseboard management controller according to a connection state of a Mini-SAS Cable connected between the first expansion board and the second expansion board. | 2014-09-18 |
20140268621 | Edge Mounting for Printed Circuit - An electric apparatus is adapted to be electrically coupled to a target platform. The electric apparatus includes a first printed circuit including a first surface parallel to a first plane and a second surface parallel to a second plane perpendicular to the first plane. The first surface has a first area and the second surface has a second area smaller than the first area. A multitude of conductive traces are formed in a layer of the first printed circuit parallel to the first plane. First and second contact regions respectively overlay first and second portions of the second surface. The first and second contact regions are electrically connected to first and second ones of the multitude of conductive traces respectively. The first printed circuit is coupled to the target platform at the first and second contact regions when the first printed circuit is electrically coupled to the target platform. | 2014-09-18 |
20140268622 | FIXING MECHANISM FOR FIXING AN PORTABLE ELECTRONIC DEVICE AND RELATED ELECTRONIC APPARATUS - The present invention discloses a fixing mechanism including a base, a cover, a connecting component, at least one resilient component and a pushing component. The base is for containing a portable electronic device. The cover is pivoted to the base. The connecting component is disposed on the base for engaging with the cover. The at least one resilient component is disposed on the base. The pushing component is connected to the at least one resilient component and the connecting component, the pushing component is driven to move in a first direction as the portable electronic device is installed on the base, so as to drive the connecting component to separate from the cover, so that the cover pivots in a first pivoting direction relative to the base to engage with the end of the portable electronic device. | 2014-09-18 |
20140268623 | MOBILE TERMINAL - Disclosed is a mobile terminal, comprising: a display; a metal frame coupled to a rear surface of the display by an adhesive tape, and having a screw-coupling groove on a rear surface thereof; a front case coupled to the rear surface of the metal frame, and having a screw-coupling hole; a screw inserted into the screw-coupling groove and the screw-coupling hole on a rear surface of the front case; and a rear case coupled to the front case, and configured to cover the rear surface of the metal frame. Under such configuration, the rear surface of the display is coupled to the case. Accordingly, the size of a bezel portion disposed on a side surface of the mobile terminal can be prevented from increasing, and a display panel can be easily separated from the front case. | 2014-09-18 |
20140268624 | CARRIER FOR MOUNTING A PIEZOELECTRIC DEVICE ON A CIRCUIT BOARD AND METHOD FOR MOUNTING A PIEZOELECTRIC DEVICE ON A CIRCUIT BOARD - A carrier for mounting a piezoelectric device, e.g., a surface acoustic wave (SAW) device, on a circuit board and a method of mounting a piezoelectric device on a circuit board using such a carrier are disclosed. The carrier includes a carrier bottom, a plurality of metal contacts, and a carrier lid attached to the carrier bottom. The carrier bottom has an opening extending partially through the carrier bottom from a top surface thereof and the opening is configured such that when a piezoelectric device to be mounted in the carrier is inserted into the carrier bottom, the piezoelectric device is at least partially recessed within the carrier bottom. The metal contacts include a cantilevered end configured for electrical connection to a piezoelectric device. The carrier lid is configured to retain a piezoelectric device within the carrier bottom and to apply substantially even pressure across a top surface of a piezoelectric device. The method includes mounting the carrier bottom to the circuit board prior to insertion of the piezoelectric device and connection of the carrier lid. | 2014-09-18 |
20140268625 | Formulation for Packaging an Electronic Device and Assemblies Made Therefrom - Disclosed and claimed herein is a formulation for packaging an electronic device and assemblies made therefrom. | 2014-09-18 |
20140268626 | Antenna Mechanical Faceplate Design - A faceplate configured for attachment to a communications module may be provided. The faceplate may comprise a first surface arranged in a vertical direction relative to the chassis and a second surface arranged at an angle to the first surface. The second surface may comprise a connector for attachment to another piece of equipment, such as an antenna. | 2014-09-18 |
20140268627 | Apparatus and Method for a Suspended Track and Curtain - An apparatus comprises a track system. The track system comprises a first straight track portion, a first curved track portion, and a second straight track portion. The track portions are engaged with each other to form a continuous track. A plurality of simple connectors are engaged with the straight track portions, and a plurality of split connectors are engaged with the curved track portion. A plurality of threaded rods have a top end portion and a bottom end portion. The bottom end portions are engaged with at least some of the plurality of connectors. The top end portions are engaged with a frame structure. A roller is adapted to be moveable along the track system. A curtain is engaged with the roller for moving the curtain between an open position and a collapsed position along the track system in a generally looping motion. | 2014-09-18 |
20140268628 | REMOTE CONTROL HAVING A CAPACITIVE TOUCH SURFACE AND A MECHANISM FOR AWAKENING THE REMOTE CONTROL - A remote control device having capacitive touch controls may be configured to enter a sleep state (or mode). For example, the remote control device may be configured to enter the sleep state upon expiration of an interval of time since a most recent button press. The remote control may be configured to awaken from the sleep state when one or more portions of a housing of the remote control are deflected, for example, when a user grasps the remote control to actuate one or more of the capacitive touch controls. For example, the remote control device may include a switch. The switch may include a carbon structure that may be configured to contact an open circuit pad on a circuit board to close the corresponding circuit when the housing is deflected and awaken the remote control device from the sleep state. | 2014-09-18 |
20140268629 | System and Method for Displaying Visual Notifications on an Electronic Device - A light assembly for providing a notification light on an electronic device is described. The light assembly comprises a first light source for providing a background portion for the notification light, a second light source for providing a patterned portion for the notification light, and at least one pattern element to generate the pattern portion. | 2014-09-18 |
20140268630 | GLASS FACEPLATE FOR KEYPAD OF A LOAD CONTROL SYSTEM - A glass faceplate is cemented to a plastic carrier which can be removably connected to the adapter plate of a wall box dimmer. The glass plate is a flat tempered glass which may be suitably colored or clear and has a thickness less than three millimeters. Two elastic tethers are connected at one end to the carrier plate and at the other end to the adapter plate to serve as a pivotal connection at the bottoms of the two plates and prevent the accidental fall and breakage of the glass faceplate. | 2014-09-18 |
20140268631 | REMOTE LUMIPHOR SOLID STATE LIGHTING DEVICES WITH ENHANCED LIGHT EXTRACTION - Solid state light emitting devices include lumiphor elements that are spatially segregated from electrically activated solid state emitters with an intermediately arranged optical element (including but not limited to a dichroic filter). Curved or faceted optical elements, and curved or faceted reflectors, may be employed. Multiple solid state emitters may be arranged in multiple reflector cups or recesses. Characteristics of optical elements and/or lumiphor elements of such devices may be varied with respect to angular position. | 2014-09-18 |
20140268632 | LIGHT APPARATUS WITH INDENTATION - A light apparatus is provided for displaying a design when the light apparatus is illuminated by a light source. In an example embodiment, the light apparatus includes a wall having a first surface and a second surface opposite to the first surface, a light source positioned behind the wall and the first surface facing the light source, the first surface of the wall comprising an indentation extending into the wall and ending before the second surface, and the indentation forming a design in the wall. In an example embodiment, the light apparatus is a lamp. In another example embodiment, the light apparatus further includes a photoluminescent layer positioned within the indentation. | 2014-09-18 |
20140268633 | DISPLAY APPARATUS - A display apparatus includes a display panel including a plurality of pixels, and a backlight unit disposed at a rear surface of the display panel and supplying a light to the display panel, where the backlight unit includes a first light source which provides a first color light to the display panel, a second light source which provides a second color light to the display panel, and a third light sources which provides a third color light to the display panel, spectral bands of the first, second and third color light are different from each other, and the first color light and the second color light have substantially the same color as each other. | 2014-09-18 |
20140268634 | DISPLAY APPARATUS - A display apparatus is provided. The display apparatus includes a first light source unit comprising a first light source that emits light having a first spectral band and a photo-converter that converts the light having the first spectral band to a first color light. A spectral band of the first color light is different from the first spectral band of the light emitted from the first light source. The display apparatus also includes a second light source unit comprising a second light source that emits light having a second spectral band. The light having the second spectral band corresponds to a second color light, and has a same color as the light having the first spectral band. A spectral band of the second color light is different from the spectral band of the first color light. | 2014-09-18 |
20140268635 | PHOSPHORIC HORTICULTURAL LIGHT - A horticultural light for use in green houses and growth chambers of plants, includes multiple LEDs (Light Emitting Diode) configured to excite a single remote phosphor up-conversion unit, typically realized on a replaceable cover glass of the light. The LED emitters are also replaceable, and preferably attached to a trunk, and not a circuit board. The distance between the plurality of LEDs and the remote phosphor up-conversion unit is configured so that the temperature of the remote phosphor up-conversion unit is 40±10 C.°, and the LED is at 130±30 C.° temperature. The combination of being able to control a separation between the remote phosphor up-conversion unit and the LEDs and having multiple LEDs emit to a single remote phosphor up-conversion unit has a great synergistic advantage: this provides a very energy efficient way of designing complex emission spectra that can be used on an industrial scale. | 2014-09-18 |
20140268636 | LAMP HAVING MULTI-FUNCTIONAL SUPPORT - There is provided a lamp having a support and a socket on the support for receiving a light bulb and selectively providing power thereto. The support has a body portion shaped to resemble a selected article. The body portion has a cavity or recess shaped to form an indicia indicating an entity associated with the selected article. The cavity or recess is positioned to receive light from the light bulb, and is filled with a photoluminescent material. | 2014-09-18 |
20140268637 | WAVELENGTH CONVERTING STRUCTURE AND MANUFACTURING METHOD THEREOF - A wavelength converting structure suitable for covering a carrier carrying at least one light-emitting diode (LED) chip is provided. The wavelength converting structure includes a base film and a fluorescent layer. The base film has a first bending portion and a first flat portion connected to the first bending portion. The first flat portion is disposed on the carrier, and an accommodating space is defined by the first bending portion and the carrier. The LED chip is disposed in the accommodating space. The fluorescent layer is disposed on the base film and has a second bending portion and a second flat portion connected to the second bending portion. The second bending portion is conformal to the first bending portion, and the second flat portion is conformal to the first flat portion. | 2014-09-18 |
20140268638 | LED LAMP WITH UNIFORM OMNIDIRECTIONAL LIGHT INTENSITY OUTPUT - A light emitting apparatus comprises: an LED-based light source; a spherical, spheroidal, or toroidal diffuser generating a Lambertian light intensity distribution output at any point on the diffuser surface responsive to illumination inside the diffuser; and a base including a base connector. The LED based light source, the diffuser, and the base are secured together as a unitary LED lamp installable in a lighting socket by connecting the base connector with the lighting socket. The diffuser is shaped and arranged respective to the LED based light source in the unitary LED lamp to conform with an isolux surface of the LED based light source. The base is operatively connected with the LED based light source in the unitary LED lamp to electrically power the LED based light source using electrical power received at the base connector. | 2014-09-18 |
20140268639 | Multi-Wavelength-Emitting Lens To Reduce Blending of Light Over Long Distances - A lamp for safety signalling is disclosed. The lamp uses quantum dot phosphors to down-convert light from a primary light source and provide red or green light. | 2014-09-18 |
20140268640 | LIGHTING DEVICE - A lighting device comprises: a heat sink which comprises one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and comprises a substrate and a plurality of light sources disposed on the substrate, wherein the substrate has a first hole disposed at the center thereof and a second hole; a power controller which is electrically connected to the light emitting module through the second hole of the substrate and is disposed in the receiving recess of the heat sink, wherein the light emitting module comprises a first light emitting module comprising a first substrate and a first light source, and a second light emitting module comprising a second substrate and a second light source, wherein the first substrate and the second substrate are disposed adjacent to each other. | 2014-09-18 |
20140268641 | Illumination system, luminaire, collimator, and display device - The invention relates to an illumination system ( | 2014-09-18 |
20140268642 | LIGHT SOURCE DEVICE AND ENDOSCOPE APPARATUS COMPRISING THE SAME - A light source device includes a first semiconductor light source, a second semiconductor light source, and a wavelength converter. The first semiconductor light source emits light in a first wavelength range. The second semiconductor light source emits light in a second wavelength range different from the first wavelength range. The wavelength converter absorbs the light in the first wavelength range to emit light in a third wavelength range different from either of the first wavelength range and the second wavelength range, and transmits the light in the second wavelength range substantially entirely. | 2014-09-18 |
20140268643 | LIGHT SOURCE DEVICE AND ENDOSCOPE APPARATUS COMPRISING THE SAME - A light source device includes a first semiconductor light source, a second semiconductor light source, and a wavelength converter. The first semiconductor light source emits light in a first wavelength range. The second semiconductor light source emits light in a second wavelength range different from the first wavelength range. The wavelength converter absorbs the light in the first wavelength range to emit light in a third wavelength range different from either of the first wavelength range and the second wavelength range, and transmits the light in the second wavelength range substantially entirely. | 2014-09-18 |
20140268644 | CONVERTER ARRANGEMENT, METHOD FOR PRODUCING THE CONVERTER ARRANGEMENT AND LIGHTING ARRANGEMENT - A converter arrangement may include a converter element, including crystal or ceramic, having at least one luminescent substance, and a cooling element for dissipating heat from the converter element, wherein the converter element and the cooling element are connected in direct physical contact with one another. A method for producing a converter arrangement is also disclosed. A converter element including crystal or ceramic, having at least one luminescent substance, for dissipating heat from the converter element, is connected to a cooling element such that the converter element and the cooling element are physically in direct contact with one another. | 2014-09-18 |
20140268645 | REMOTE CONTROL AND INFLATABLE PRODUCT USING THE SAME - A remote control for an inflatable product includes a top cover, a bottom cover correspondingly fitted to the top cover, an air pump switch mounted on the top cover to control on/off of the air pump and a lighting module. | 2014-09-18 |
20140268646 | LIGHT ANIMATION IN AN APPLIANCE - An appliance such as a refrigerator includes a housing such as a refrigerator cabinet, a compartment disposed within the refrigerator cabinet or housing, a visual display positioned at an interior of the compartment, a circuit operatively connected to the visual display and configured to operate the visual display in a manner indicative of an environmental system of the refrigerator. The visual display may be a flat panel display and may show an animation. | 2014-09-18 |
20140268647 | HEATERS FOR ELECTROMAGNETIC WAVE TRANSMITTING SURFACES IN COLD-TEMPERATURE ENVIRONMENTS - An electromagnetic wave transmitting device having a body and a heating assembly. The body can include a transmitting end and a receiving end. The heating assembly can be disposed on at least a portion of the transmitting end of the body. The heating assembly can include an electrically resistive element having an electrical connector. The heating assembly can also include a first electrically non-conductive film disposed over the electrically resistive element. | 2014-09-18 |
20140268648 | DOMESTIC APPLIANCE INCLUDING PIEZOELECTRIC COMPONENTS - A domestic appliance such as a refrigerator, washing machine, and dryer is disclosed. The appliance may include a piezoelectric device. The piezoelectric device may be configured to supply electrical power to various electrically-powered elements in the appliance, such as a light source, a drive status sensor, and active balancing components. | 2014-09-18 |
20140268649 | RETROFIT LED MODULE - An LED retrofit assembly including an LED module comprising an LED lamp, and a power supply module coupled to the LED lamp. The power supply conditions power received from an external power source to power the LED lamp and is mountable remotely from the LED module. The LED module is removably supportable by a bayonet base lamp socket. | 2014-09-18 |
20140268650 | SELF-GENERATING LIGHTING SHOWER HEAD - The present invention of a self-generating lighting shower head comprises a top hood, an upper holder, an inlet header, a revolving part, a lower holder, an electric module, a shade unit, and a shower head disc unit: the upper holder is held in the top hood; the inlet header is installed in the water bearing space; the revolving part with a number of rotary vanes is placed in the inlet header and rotates under rush of water flows via water inlets; the lower holder has a watertight cavity at bottom to accommodate the electric module; the electric module comprises a spindle pivoted to and driven by the revolving part for generation of electric energy transformed from dynamic energy and luminescence excited by a number of luminous components on a printed circuit board. As such, the present invention is capable of generating electricity supplied to luminous components for illumination during a shower. | 2014-09-18 |
20140268651 | FRAGRANCE WARMER AND LIGHT STRING ASSEMBLY HAVING THE SAME - A fragrance-producing light string assembly can be achieved using either a fragrance warmer configured to connect to a conventional light string assembly or a light string assembly having an integrated fragrance warmer. The fragrance warmer is configured to apply heat to a removable and replaceable fragrance pellet that is formed from a polymeric material that is impregnated with a vaporizing agent and configured to emit the vaporizing agent when heated. The fragrance warmer includes a heating element and a heating plate arranged to apply heat to the fragrance pellet using electrical power from the light string assembly. | 2014-09-18 |
20140268652 | ELECTRONIC FLAMELESS CANDLE - An electronic flameless candle including a body having a top surface, a bottom surface, a sidewall between the top surface and the bottom surface, and a cavity defined by the top surface, the bottom surface and the sidewall, the body configured in shape and size to simulate a true flame candle. The candle may also include a light source operably connected to the body, the light source electrically operated to illuminate in a way that simulates a natural flicker of a real candle flame. The candle may also include a scent component, operably connected to the body, the scent component configured to emit a scent when heated and/or a sensor component, operably connected to the body, the sensor component configured to sense an environmental condition and affect a mode of the light source upon the sensing of the environmental condition. | 2014-09-18 |
20140268653 | LIGHT EMITTING UNIT WITH HIGH LIGHT SPREADING ANGLE, BACKLIGHT ASSEMBLY HAVING THE SAME, AND DISPLAY APPARATUS - A backlight assembly includes a light emitting unit, a reflective sheet, and a bottom cover. The light-emitting unit includes a light source emitting light and an optical system. The optical system is spaced apart from the light source in a direction in which the light emitted from the light emitting unit initially travels. The optical system has a curved shape that reflects a portion of the light emitted from the light source and transmits a remaining portion of the light emitted from the light source. The reflective sheet is disposed under the light-emitting unit to re-reflect the light reflected by the optical system. The bottom cover accommodates the light emitting unit and the reflective sheet. Thus, the light-spreading angle of the light-emitting unit becomes wide. | 2014-09-18 |
20140268654 | ADAPTABLE BEZEL ASSEMBLY FOR EXTREME SERVICE CONDITIONS - A display assembly includes a first bezel part and a second bezel part each defining a substantially rectangular frame that encloses an open area. The first frame is sized and arranged to substantially align with the second frame. The second bezel part is capable of secure attachment to the first bezel part at an interface that defines at least one gap between the first frame and the second frame. A display screen has a display edge portion disposed in the gap between the first frame and the second frame. The display screen extends across the open area. Optionally, the display assembly includes an EMI screen and/or a touch screen aligned with the display screen and having an edge portion received in the gap, where the EMI screen, display screen, and touch screen are each individually removable from the display assembly. | 2014-09-18 |
20140268655 | COLOR STABLE RED-EMITTING PHOSPHORS - A color stable Mn4+ doped phosphor of formula I, | 2014-09-18 |
20140268656 | DISPLAY DEVICE - A display device including a display panel which displays images, an intermediate frame on which the display panel is seated, a lower receptacle which includes a first receiving portion including a bottom plate and sidewalls, and a second receiving portion separate from the first receiving portion, and a light source unit which includes an alignment plate and a point light source mounted on the alignment plate. The light source unit contacts the sidewalls of the lower receptacle, and the first receiving portion is coupled with the intermediate frame. | 2014-09-18 |
20140268657 | Rigid LCD Assembly - Exemplary embodiments disclosed herein provide a rigid LCD assembly including a LCD having a perimeter, a first layer of tape around the perimeter of the LCD, and a diffusing plate attached to the later of tape so as to create a cavity defined by the space between the LCD, tape, and diffusing plate. One or more optical films may be inserted into the cavity, and while constricted in directions perpendicular to the films, the films may be free to move slightly in the directions parallel to the films. A U-shaped backlight wall may attach to the diffusing plate and would contain a backlight. An optional thermal plate can be attached to the backlight wall, which can be used with a second thermal plate to define a channel for accepting cooling air. | 2014-09-18 |
20140268658 | PHOTOMETRICALLY ADJUSTABLE DIFFUSER USING A VARIABLE COMBINATION OF BULK AND SURFACE RELIEF DIFFUSER TECHNOLOGIES, METHODS OF MAKING, AND USE THEREOF - Novel light diffusers that include both bulk and surface diffuser elements are provided. One embodiment includes diffusing elements forming a structured coating on a substantially clear substrate. Another embodiment includes a bulk diffuser with a structured surface. Methods for making and methods of using the light diffusers are also disclosed. | 2014-09-18 |
20140268659 | BACKLIGHT UNIT AND DISPLAY USING THE SAME - Disclosed are a backlight unit and a display using the same. The backlight unit includes a first reflector, a second reflector, and at least one light source disposed between the first reflector and the second reflector, and the end of the second reflector is separated from the at least one light source by a first distance in the upward direction of the at least one light source. | 2014-09-18 |
20140268660 | NIGHT LIGHT - A night light includes a main pedestal arranged with a circuit set, wherein the main pedestal comprises a utility-power connector configured to couple with a power supply for power production, a light emitter electrically connected to the main pedestal, a casing covering a top portion of the main pedestal, wherein a groove is radially arranged at a wall of the casing, a fluid-ball body having a transparent solid structure, wherein the fluid-ball body comprises a flange fitting with the groove, wherein the flange of the fluid-ball body is secured to the casing, wherein a carrying portion is at the outer of the fluid-ball body, wherein a transparent cover is at the outer of the carrying portion, wherein an accommodating space is formed between the carrying portion and the transparent cover. | 2014-09-18 |
20140268661 | DECORATION WITH WAVING ACCESSORY - A decoration with a waving accessory includes a fluid-lamp body, a pedestal and an accessory in the fluid-lamp body, wherein the accessory is arranged with connection of a flexible wire. Thereby, when the fluid-lamp body is loaded with a fluid, the accessory can be carried by the fluid so as to suspend. When the fluid-lamp body is waving, the accessory can be caused to suspend and wave so as to create a visual effect. | 2014-09-18 |
20140268662 | STRUCTURE OF BASE FOR DECORATIVE AQUATIC BALL - The structure of base for decorative aquatic ball mainly contains a shell, a hollow transparent shell made of plastic material; a decorative layer, a laser paper film with a pattern, the laser paper film covering the inner wall of the shell; and a decorative aquatic ball, a light-transmittable three-dimensional shape, disposed on top of the shell, and sealing in a fluid with slightly higher viscosity. As such, the decorative layer enables the base carrying the aquatic ball to create rich and layered visual effects. | 2014-09-18 |
20140268663 | ROTATIONAL GAME DECORATIVE DEVICE - A rotational game decorative device is disclosed, including: a aquatic lamp main body, a magnet-driven element, a buoy and a bottom base. The magnetic-driven element and the buoy are disposed inside the aquatic lamp main body. The top and the bottom of the buoy are disposed with a plurality of rotational plates disposed with interval. The bottom base is fixedly engaged to the aquatic lamp main body with a magnetic rotational axis for correspondingly attaching to the magnet-driven element, and driven by a driving element to rotate. When the magnetic rotational axis rotates, the magnet-driven element also rotates because of attachment to the magnetic rotational axis so as to wave the fluid inside the aquatic lamp main body, which leading to pushing to rotational plats to rotate the buoy. | 2014-09-18 |
20140268664 | CONIC DECORATIVE LAMP - A conic decorative lamp is disclosed, including: a shell, a magnet-driven element, a conic buoy and a bottom base. The magnetic-driven element and the conic buoy are disposed inside the shell. The bottom of the conic buoy is disposed with a plurality of rotational plates, disposed with interval. The bottom base is fixedly engaged to the conic shell with at least a light-emitting element disposed inside as well as a magnetic rotational axis for correspondingly attaching to the magnet-driven element, and driven by a driving element to rotate. When the magnetic rotational axis rotates, the magnet-driven element also rotates because of attachment to the magnetic rotational axis so as to wave the fluid inside the shell, which leading to pushing to rotational plats to rotate the conic buoy. | 2014-09-18 |
20140268665 | SWIRL WATER LAMP VASE - The present invention is related to a swirl water lamp vase, which comprises a mean seat body, internal of it is provided a magnetic component rotated driven by the power motor, and the open end of the main seat body is provided a water lamp holder which can accommodate space, and the bottom of the water lamp holder is provided a magneto-motive component corresponding to the rotation of the magnetic component and light emitting group, in order to using the adsorption of the motor to drive the rotation of the magnetic component, making the liquid of the internal water lamp generate the swirling and glary flowing effects, simultaneously, the accommodating space has the functions of accommodating flowers and plants, by the description as above, it makes the water lamp vase has the double interesting efficacies of the glary visual and fluid visual. | 2014-09-18 |