37th week of 2022 patent applcation highlights part 85 |
Patent application number | Title | Published |
20220295625 | NOZZLE APPARATUS - An apparatus includes: a tube; a body including: a first body wall and a second body wall; and a support structure including: a first support portion and a second support portion. The first body wall extends in a first direction, the second body wall extends in a second direction that is different than the first direction, a first portion of the tube passes through an opening in the second body wall the first support portion is configured to attach to the first body wall, and a second portion of the tube is configured to pass through the second support portion when the first support portion is attached to the first body wall. An interior of the tube and an interior of the body are configured to receive molten target material, and the target material emits extreme ultraviolet (EUV) light when in a plasma state. | 2022-09-15 |
20220295626 | WIRELESS POWER SUPPLY WIRING CIRCUIT BOARD AND BATTERY MODULE - A wireless power supply wiring circuit board includes a first insulating layer, a conductive layer that is on one surface in the thickness direction of the first insulating layer and includes a wiring portion, a transceiver circuit portion that is electrically connected to the wiring portion, a component mounting portion which is on the other surface in the thickness direction of the first insulating layer and on which an electronic component electrically connected to the wiring portion is mounted, and a metal dam portion provided around at least part of the component mounting portion. | 2022-09-15 |
20220295627 | HEATSINK WITH PERPENDICULAR VAPOR CHAMBER - Heat dissipation systems may include a base, a vapor chamber, and a plurality of cooling fins. The base may contact a top surface of a chip on a printed circuit board to be cooled. The vapor chamber may be planar and be coupled to and extend from the base so that the planar vapor chamber is perpendicular relative to the top surface of the chip. The vapor chamber is coupled to the base so that a first portion of the vapor chamber extends along the base in a first direction, and a second portion of the vapor chamber, adjacent to the first portion of the vapor chamber, extends in the first direction past an edge of the base in order to overhang the printed circuit board. Both the first portion and the second portion of the vapor chamber include the plurality of cooling fins. | 2022-09-15 |
20220295628 | IMPEDANCE MATCHING WITHIN A SIGNAL TRANSMISSION CHANNEL - A printed circuit board for an information handling system includes a trace, a routing component, and one or more intermediate components. The trace has a first impedance, and the routing component has a second impedance. The intermediate components have respective intermediate impedances. Each of the intermediate impedances has a corresponding value in a range between a value of the first impedance and a value of the second impedance. The one or more intermediate impedances reduce an impedance discontinuity between the trace and the routing component. | 2022-09-15 |
20220295629 | RADIO FREQUENCY CROSSOVER WITH HIGH ISOLATION IN MICROELECTRONICS H-FRAME DEVICE - A microelectronics H-frame device comprising an RF crossover includes: a stack of two or more substrates, wherein a bottom surface of a top substrate comprises top substrate bottom metallization, and wherein a top surface of a bottom substrate comprises bottom substrate top metallization, wherein the top substrate bottom metallization and the bottom substrate top metallization form a ground plane that provides isolation to allow a first signal line to traverse one or more of the top substrate and the bottom substrate without being disturbed by a second signal line traversing one or more of the top substrate and the bottom substrate at a non-zero angle relative to the first signal line, at least one of the first signal line and the second signal line passing to a second level with the protection of the ground plane, thereby providing isolation from the other signal line. | 2022-09-15 |
20220295630 | PRINTED BOARD AND PRINTED BOARD ASSEMBLY - A printed board includes a first wiring layer including a first terminal, a second wiring layer including a second terminal facing to the first terminal, a dielectric layer interposed between the first wiring layer and the second wiring layer and having an end face, and a plurality of through-hole vias configured to electrically connect the first terminal and the second terminal. The plurality of through-hole vias includes a first through-hole via which is closest to an end-face edge of the first terminal, and a second through-hole via which is closest to an inner edge of the second terminal. The end-face edge being closer to the end face than the inner edge. A distance between the first through-hole via and the end-face edge is equal to or smaller than one eighth of a signal wavelength of a high speed signal transmitted through the first terminal. | 2022-09-15 |
20220295631 | FLEXIBLE PRINTED WIRING BOARD AND BATTERY WIRING MODULE - A flexible printed wiring board according to an aspect includes a base film, a conductive pattern disposed on one surface of the base film, and an extra length absorbing portion protruding from the base film and disposed in a direction of a plane, the extra length absorbing portion including a pattern connected portion connected to the conductive pattern, a coupling portion having a first linear wiring portion, a first arcuate wiring portion, and a second linear wiring portion coupled in this order continuously from the pattern connected portion, and a connecting terminal connected to the coupling portion, the pattern connected portion and the connecting terminal being opposite to each other in a direction in which the extra length absorbing portion protrudes. | 2022-09-15 |
20220295632 | CIRCUIT BOARD - A method of manufacturing a base plate includes the following steps: providing a first substrate, the first substrate including a first base layer, a first copper coating and a second copper coating covered on two sides of the first base layer; opening at least one first hole on the first substrate, the first hole penetrating the first base layer and the first copper; forming a first electroplated coating on the first copper coating, the first copper coating filling the first hole to form a first connecting portion; opening at least one second hole on the first connecting portion and the first electroplated coating to form a plurality of second connecting pins. | 2022-09-15 |
20220295633 | ELECTRICAL SOLDER CONNECTION, SENSOR WITH A SOLDER CONNECTION AND METHOD OF MANUFACTURE - solder connection that connects a contact pad on a first surface to a strip-shaped conductor. The strip-shaped conductor has a widening at one end and a through opening therein. A solder ball is located in the opening and connects the end of the conductor to the contact pad. | 2022-09-15 |
20220295634 | PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR, AND TERMINAL - A Printed Circuit Board (PCB), a method for manufacturing a PCB, and a terminal are provided. The PCB includes: a PCB daughter board which is a Radio Frequency (RF) PCB; and a PCB mother board with a hollow slot, wherein the PCB daughter board is embedded in the hollow slot. | 2022-09-15 |
20220295635 | SANDWICH STRUCTURE POWER SUPPLY MODULE - A sandwich structure power supply module, having: an inductor pack having a first inductor and a second inductor; a bottom PCB (Printed Circuit Board) at the bottom of the sandwich structure power supply module; a top PCB on top of the inductor pack; a connector coupled between the bottom PCB and the top PCB, coupling solder pads on the bottom PCB to solder pads on the top PCB; and a first and a second power device chips on top of the top PCB, wherein the first power device chip and the second power device chip respectively has at least one pin coupled to the first inductor and the second inductor via the top PCB; wherein each inductor comprises one winding having a first end and a second end bent to and extended at a plane perpendicular to an axis along a length of the winding. | 2022-09-15 |
20220295636 | DISPLAY DEVICE AND DRIVING METHOD THEREOF - A display device includes: a display panel including a plurality of pixels; a first flexible printed circuit board attached to the display panel and electrically connected thereto; a first printed circuit board attached to the first flexible printed circuit board and electrically connected thereto; a data driver which applies a data voltage to the plurality of pixels, receives a voltage flowing to the plurality of pixels and generates mobility sensing information based on the voltage flowing to the plurality of pixels; and a timing controller which detects a first misalignment between the first printed circuit board and the first flexible printed circuit board, and a second misalignment between the display panel and the first flexible printed circuit board, based on the mobility sensing information. | 2022-09-15 |
20220295637 | FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING SAME - A flexible printed circuit board includes: a base film having a hole for forming a through hole; and a coil-shaped wiring layer layered on at least one surface side of the base film, wherein the wiring layer includes a land portion arranged at an inner peripheral surface of the hole and at a peripheral portion of the hole of the base film, and a winding portion arranged in a spiral shape with the land portion as an inside end portion or an outside end portion, wherein the winding portion includes a first winding portion that is an outermost circumference and a second winding portion that is inside relative to the outermost circumference, and wherein a ratio of an average thickness of the land portion to an average thickness of the second winding portion is 1.1 or more and 5 or less. | 2022-09-15 |
20220295638 | SANDWICH STRUCTURE POWER SUPPLY MODULE - A sandwich structure power supply module, having: an inductor pack having a first inductor and a second inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and a first power device chip and a second power device chip on top of the top PCB, wherein the first power device chip has at least one pin electrically connected to the first inductor via the top PCB, and the second power device chip has at least one pin electrically connected to the second inductor via the top PCB; wherein each inductor comprises one winding having a first end and a second end, and wherein at least one of the first end and the second end of each winding is bent to and extended at a plane perpendicular to an axis along a length of the winding. | 2022-09-15 |
20220295639 | SANDWICH STRUCTURE POWER SUPPLY MODULE - A sandwich structure power supply module, having: an inductor pack having at least one inductor; a top PCB (Printed Circuit Board) on top of the inductor pack; and at least one power device chip on top of the top PCB, wherein each one of the power device chips has at least one pin connected to an associated inductor via the top PCB; wherein the inductor pack is wrapped with metal layers, wherein each two metal layers are lied against to a same surface of the inductor pack, with an isolation layer in between, and wherein the two metal layers are connected to different potentials. | 2022-09-15 |
20220295640 | ELECTRONIC COMPONENT MOUNTING STRUCTURE - An electronic component mounting structure is an electronic component mounting structure in which an electronic component group is mounted on a substrate, and a pattern constituting a part of a current path between the inflow port and the outflow port, the electronic component group includes a plurality of electronic components connected between the inflow port and the outflow port, each of the electronic components has a current inflow terminal electrically connected to the inflow port and a current outflow terminal electrically connected to the outflow port, and one of a first spatial distance group and a second spatial distance group has equal spatial distances within the one spatial distance group, and the first spatial distance group includes spatial distances between the inflow port and the inflow terminals, and the second spatial distance group includes spatial distances between the outflow port and the outflow terminals. | 2022-09-15 |
20220295641 | Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method - Method of manufacturing a metal-ceramic substrate ( | 2022-09-15 |
20220295642 | Electronic Control Device - An electronic control device includes: a circuit board; an electronic component; and a bonding portion bonding the circuit board and the electronic component to each other. The bonding portion contains Sn as a main component, Bi and Sb in a total content ratio of 3 wt % or more, and Ag in a content of 3 to 3.9 wt %, with no In. | 2022-09-15 |
20220295643 | REFLOW SOLDERING MACHINE FOR CONTINUOUSLY SOLDERING OF SOLDERING GOODS - The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite the base part and that can be raised when the reflow soldering machine is operating, wherein the process channel can be covered by at least one covering hood that can be opened, and wherein the cover part is motion-coupled to the covering hood in such a way that when the covering hood is opened, the cover part is also taken along by the covering hood. | 2022-09-15 |
20220295644 | BONDED BODY, CERAMIC COPPER CIRCUIT BOARD, METHOD FOR MANUFACTURING BONDED BODY, AND METHOD FOR MANUFACTURING CERAMIC COPPER CIRCUIT BOARD - A bonded body includes a ceramic substrate and a copper plate, in which the copper plate is bonded to the ceramic substrate via a bonding layer, the copper plate includes a surface perpendicular to a direction in which the ceramic substrate and the copper plate are bonded, and a number percentage of copper crystal grains having major diameters greater than 400 μm in three 5 mm×5 mm regions included in the surface is not less than 0% and not more than 5%. The bonding temperature is favorably not more than 800° C. The number percentage of the copper crystal grains having major diameters greater than 400 μm is favorably not more than 1%. | 2022-09-15 |
20220295645 | METHOD FOR OPTIMIZED FILLING HOLE AND MANUFACTURING FINE LINE ON PRINTED CIRCUIT BOARD - A method for optimized filling holes and manufacturing fine lines on a printed circuit board (PCB) carries out the two processes separately. The inner wall of the hole is metalized with reduced graphene oxide (rGO) and then electroplated to fill the hole with copper. The processes are individually performed and thus operating parameters are considered independently. As a result, the copper-plating fillings are evenly compact and the fine lines have square profiles. | 2022-09-15 |
20220295646 | TEMPORARY CARRIER AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE THEREBY - A temporary carrier according to an embodiment of the present invention may include a core layer, a first Cu foil layer and a second Cu foil layer on surfaces of both sides of the core layer. Each of the first Cu foil layer and the second Cu foil layer may include double Cu foils which are physically attached together. | 2022-09-15 |
20220295647 | ELECTRONIC DEVICE COMPRISING REINFORCEMENT STRUCTURE FOR DAMAGE PREVENTION - An electronic device is provided. The electronic device includes a display forming the front surface of the electronic device, a housing in which the display is seated and which at least forms a first side surface of the electronic device, an opening provided in the first side surface formed by the housing, a printed circuit board disposed adjacent to the first side surface, a connecting interface disposed on the PCB so as to be electrically connected to an external connector when the external connector is inserted through the opening, and a reinforcement member disposed on the PCB so as to surround the side surface of the connecting interface without covering the top surface of the connecting interface. | 2022-09-15 |
20220295648 | ELECTRONIC DEVICE - A portable electronic device can include a housing defining an aperture and a display positioned in the aperture. The portable electronic device can include a number of components that can provide desired functionalities and levels of performance. For example, the device can include one or more couplers that interconnect various portions of the housing together. Additionally or alternatively, the portable electronic device can include one or more millimeter-wave antennas. Additionally, or alternatively, the electronic device can include one or more grounding elements or layers that reliably and electrically ground the display to the housing. | 2022-09-15 |
20220295649 | SUPPORT ASSEMBLY AND STORAGE AND DEPLOYMENT APPARATUS FOR FLEXIBLE DISPLAY PANEL - The present disclosure provides a support assembly and a storage and deployment apparatus for a flexible display panel. The support assembly of the present disclosure is configured to support a flexible display panel, and includes: a support structure configured to support the flexible display panel, and a driving structure configured to drive the support structure against the flexible display panel. At least a portion of the support structure is fixedly connected to the flexible display panel so that when the flexible display panel is reciprocated in a first direction and a second direction, the support structure is switchable between a first state and a second state. The support structure has a smaller support surface in the first state than in the second state, and the first direction is opposite to the second direction. | 2022-09-15 |
20220295650 | ELECTRONIC APPARATUS - An electronic apparatus includes a first body, a second body, a flexible screen assembly, and a driver. The first body includes a first surface. The second body is rotatably connected to the first body and includes a second surface neighboring to the first surface. The first surface and the second surface form a folded state with an included angle not greater than a predetermined angle and an unfolded state with the included angle greater than the predetermined angle. The flexible screen assembly includes a first member and a second member. In the folded state, the first member is connected to the first body and covers the first surface. The second member is slidably connected to the second body. The driver is connected to the flexible screen assembly and configured to drive the flexible screen assembly to move in a first direction in the unfolded state. | 2022-09-15 |
20220295651 | ELECTRONIC DEVICE - An electronic device according to various embodiments includes a display, a first housing including an upper cover, a lower cover, a first side cover configured to connect the upper cover and the lower cover, and a pair of second side covers configured to connect the upper cover, the lower cover, and the first side cover, a first roller disposed adjacent to the first side cover and configured to wind the display, a second housing connected to the display, and a moving structure disposed opposite to the first side cover and configured to move the second housing from the first housing. | 2022-09-15 |
20220295652 | MODULAR WALL MOUNT ENCLOSURE - A modular, non-metallic enclosure with a first enclosure having an open end between first and second side panels and a second enclosure having an open end between third and fourth side panels. At the open end of the first enclosure, the first and second side panels each include a guide rail having a male guiderail member and a female guiderail channel. At the open end of the second enclosure, the third and fourth side panels each include a guide rail having a male guiderail member and a female guiderail channel. The male guiderail member/female guiderail channel of the first sidewall are configured to engage with the opposite of the male guiderail member/female guiderail channel of the third side wall. The male guiderail member/female guiderail channel of the second sidewall are configured to engage with the opposite of the male guiderail member/female guiderail channel of the fourth side panel. | 2022-09-15 |
20220295653 | CONNECTION MEMBER AND DISPLAY DEVICE INCLUDING SAME - A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer. | 2022-09-15 |
20220295654 | ELECTRONIC DEVICE - A touch panel device includes a first conductive film having first and second regions, at least a part of the first conductive film between the first and the second regions being removed, a second conductive film laminated on the first conductive film across a gap, first and second terminals that output signals, a first electrode electrically connected to the first terminal, a second electrode facing the first electrode across the first region, a first resistor provided on the first conductive film in the second region and having a pair of electrodes, the pair of electrodes facing each other across a first resistance region in the first conductive film, one of the electrodes being electrically connected to the second electrode, the other of the electrodes being electrically connected to the second terminal, and a first switch electrically connecting the first conductive film to the second conductive film, in the second region. | 2022-09-15 |
20220295655 | Composite Structure, Flexible Display Assembly, and Foldable Display Terminal - A composite structure includes a first layer and a second layer that are stacked, the first layer is configured to connect the second layer and a flexible display, and the second layer is configured to dissipate heat. Each of the first layer and the second layer includes a first surface and a second surface opposite to each other, where the first surface of the first layer is proximate to the flexible display, and the first surface of the second layer is proximate to the second surface of the first layer. An elastic modulus of the first layer is greater than or equal to an elastic modulus of the second layer, and a coefficient of thermal conductivity of the first layer is less than or equal to a coefficient of thermal conductivity of the second layer. | 2022-09-15 |
20220295656 | ELECTRONIC DEVICE - An electronic device includes: a substrate at which an electronic component is mounted; and a resin case configured to accommodate the substrate internally, in which: the case has an attachment portion configured to attach the case to a flat plate-shaped fixing portion of a fixture target by the fixing portion being inserted into the attachment portion and the attachment portion engaging with the fixing portion; the attachment portion has a first pressing portion having a convex portion that is inserted into a concave portion of the inserted fixing portion, and a pair of second pressing portions that hold between them respective side faces of the inserted fixing portion; and leading end sides of the pair of second pressing portions abut on the inserted fixing portion and are resiliently deformed in directions away from each other, holding between them the respective side faces of the fixing portion in a state in which the leading end sides have been resiliently deformed. | 2022-09-15 |
20220295657 | POTTING BOAT HEAT SINK - A potting boat adapted to receive a printed circuit board is described. The boning boat includes a base plate and a plurality of sidewalls projecting from the base plate, a plurality of cooling fins, a recessed portion, and an arm. The plurality of cooling fins are formed on one of the sidewalls. The cooling fins extend laterally outward from the one of the sidewalls. The recessed portion is in a first sidewall of the plurality of sidewalls, and extends laterally inward. The arm has a first end fixed to the sidewall and an opposite, second end not connected with the first sidewall. The arm at least partially overlays the recessed portion to define a void within which electrical wires connected to the printed circuit board are retained proximate the first sidewall. | 2022-09-15 |
20220295658 | IMD HAVING A CORE CIRCUITRY SUPPORT STRUCTURE - A medical device includes a hybrid circuitry assembly and a core circuitry support structure. The core circuitry support structure includes a frame defining a cavity configured to receive at least a portion of the hybrid circuitry assembly. An outer surface of the frame is shaped to correspond to an inside surface of a core assembly housing configured to enclose the hybrid circuitry assembly and the core circuitry support structure. | 2022-09-15 |
20220295659 | SERVER ASSEMBLY - A sever assembly including a mounting frame, a battery box and a battery. The mounting frame includes an accommodation space configured to accommodate a disk drive. The battery box is disposed in the accommodation space of the mounting frame. The battery is installed in the battery box. | 2022-09-15 |
20220295660 | SYSTEM CHASSIS WITH RAISED SLIDING CHANNEL - A system chassis includes a bottom panel, a first sidewall, and a second sidewall. The bottom panel defines a width of the system chassis. The first sidewall extends substantially vertically from a first end of the bottom panel. The first sidewall includes a first channel vertically offset from the bottom panel. The first channel is configured to mate with a first rail of an equipment rack. The second sidewall extends substantially vertically from a second end of the bottom panel, and is opposite to the first sidewall. The second sidewall includes a second channel configured to mate with an opposing rail of the equipment rack. | 2022-09-15 |
20220295661 | Flexible Rotating Blanking Panel for an IT Rack - Disclosed are systems and methods for providing a blanking panel. One embodiment includes a blanking panel for an information technology (IT) rack. The IT rack may have a width for receiving hardware into a rack space unit. The IT rack may have a plurality of vertical mounting beams that define the width. The blanking panel may include a cover that is sized and shaped to cover a front portion of the rack space unit on the IT rack and a plurality of rack connectors that connect the blanking panel to the plurality of vertical mounting beams. In some embodiments, the blanking panel includes a rotating pin, where at least one of the plurality of rack connectors is rotatably connected to permit rotation of the rotating pin around a second axis and where the rotating pin includes a pivot joint, to permit the rotating pin to rotate around a first axis. | 2022-09-15 |
20220295662 | POWER ELECTRONICS MODULE WITH IMPROVED COOLING - The invention relates to a power electronics module including a flat circuit carrier ( | 2022-09-15 |
20220295663 | ELECTRONIC DEVICE - An electronic device is provided. The electronic device includes a housing, a first circuit board, and a first heat sink. The housing forms a receiving space. The first circuit board and the first heat sink are received in the receiving space along the gravity direction. One side of the first circuit board has at least one electronic element. The first heat sink has a first base board and at least first side board. The first base board is arranged adjacent to the first circuit board. The electronic element transferred heat to the first base board. The first side board connects to the first base board, and cooperatively forms a first heat dissipating channel along the gravity direction. The first side board is close to or contacts the housing, so that the heat of the electronic element can be transferred by heat conduction and heat convection to dissipate outside. | 2022-09-15 |
20220295664 | ELECTRONIC ASSEMBLY AND TERMINAL DEVICE - An electronic assembly ( | 2022-09-15 |
20220295665 | FAN CONTROL SYSTEM AND METHOD - A fan control system for use in a server system is disclosed. The fan control system includes a first monitoring and protection chip, a second monitoring and protection chip, a switch, a plurality of fans and a complex programmable logic device (CPLD). In a shutdown state of the server system, the switch is switched under control of the CPLD so that the fans are connected to the second monitoring and protection chip, receive standby power therefrom and run at a standby power level. When the server system is switched to a working state, the switch is switched under control of the CPLD so that the fans are connected to the first monitoring and protection chip, receive operating power therefrom and run at a higher working power level. This design can address different heat dissipation needs of various applications. | 2022-09-15 |
20220295666 | FAN CONTROL FOR ELECTRONIC DISPLAY ASSEMBLIES - Condensation control systems and methods for display assemblies are provided. A cover forms part of a housing for an electronic display, the housing accommodating an airflow pathway. Temperature sensors located along the airflow pathway measure temperature which is reported to a controller. The controller determines a dewpoint temperature and calculates a dewpoint spread between the dewpoint temperature and the measured temperature. Where the dewpoint spread is less than a predetermined threshold, modified operations are initiated by the controller. | 2022-09-15 |
20220295667 | COOLING DEVICE - A cooling device includes a plurality of heat receiving parts each disposed on one of a plurality of heat generating bodies, and having a refrigerant evaporation space in which a portion of a refrigerant is evaporated in the refrigerant evaporation space by heat of one of the plurality of heat generating bodies, a heat dissipating part condensing the refrigerant evaporated in the plurality of heat receiving parts, a refrigerant supply path through which the refrigerant condensed by the heat dissipating part to transition into a liquid-phase refrigerant flowing toward the plurality of heat receiving parts, and a refrigerant reflux path through which a gas-liquid multiphase flow of the liquid-phase refrigerant and the refrigerant evaporated in the heat receiving parts to transition into a gas-phase refrigerant flowing toward the heat dissipating part. | 2022-09-15 |
20220295668 | DATA STORAGE DEVICE COOLING - A data storage device including a passive cooling system. The data storage device including an enclosure and a printed circuit board coupled to the enclosure. The data storage device also including a vapor chamber coupled to the printed circuit board and one or more heat pipes in fluid communication with the vapor chamber. The vapor chamber and one or more heat pipes including a two-phase liquid therein and defining a thickness of less than or equal to 0.7 mm. The two-phase liquid dissipating heat within the data storage device by evaporating and condensing. In some embodiments, the data storage device also including a disk separator positioned between adjacent recording disks and acting similar to the vapor chamber. | 2022-09-15 |
20220295669 | HEAT DISSIPATION DEVICE - A heat dissipation device includes an upper cover, a lower cover, an upper wick, a first wick, a plurality of second wicks, a third wick, and a gas-liquid separation structure. The lower cover and the upper cover together form a sealed vacuum chamber therebetween. The upper wick is attached on a first inner surface of the upper cover and is in fluid communication with the second wicks and the third wick. The first wick is attached on a second inner surface of the lower cover. The second wicks are attached on the lower cover. Third wick is attached on a third inner surface of the lower cover and is connected to and in fluid communication with the first wick. The gas-liquid separation structure is attached on a planar area of the third wick so as to separate a vapor from a liquid in the sealed vacuum chamber. | 2022-09-15 |
20220295670 | LOOP HEAT PIPE, COOLING SYSTEM, ELECTRONIC EQUIPMENT, AND WICK - Disclosed is a loop heat pipe having an evaporator, a condenser, a vapor line connected between the evaporator and the condenser through which a vapor-phase working fluid flows, a liquid line connected between the condenser and the evaporator through which a liquid-phase working fluid flows, and a wick having an elasticity and provided inside the evaporator in a compressed and deformed state. The liquid-phase working fluid permeates into the wick, and a boundary between the liquid phase working fluid and the vapor phase working fluid is formed in the wick. A stress generated in the wick due to compressive deformation is greater than a pressure loss that occurs during circulation of the working fluid from the vapor-phase side of the boundary via the condenser back to the liquid-phase side of the boundary. | 2022-09-15 |
20220295671 | HIGH AVAILABILITY FLUID CONNECTOR FOR LIQUID COOLING - A blind mating adapter unit is disclosed that is adjustably locatable on a server chassis. The blind mating adapter unit is rotatably adjustable to align the orientation of one or more fluid connectors on the blind mating adapter unit to a corresponding one or more mating fluid connectors on a coolant distribution manifold installed in a server rack. An elliptical frame having an elliptical orbit, coupled to an elliptical plate having a connector channel, can be rotated about a rotation axis continuously or in fixed increments. The connector channel and elliptical orbit define a rotation path for the aligning the fluid connectors and the rotation axis defines the position of the fluid connectors on the rotation path. When the server is slid into place in the server rack, the fluid connectors on the blind mating adapter fluidly couple to the corresponding mating fluid connectors on the coolant distribution manifold. The blind mating adapter unit functions as an intermediate layer for server and rack fluid mating. | 2022-09-15 |
20220295672 | POWER CONVERSION DEVICE AND MANUFACTURING METHOD THEREFOR - The power conversion device includes: a power module having a shape of a rectangular parallelepiped; a cooling plate; and a cooler. The cooler includes: a cooling flow path through which a coolant flows; a first flow path hole extending from a third side surface side to a fourth side surface side; a second flow path hole extending from the third side surface side to the fourth side surface side; a first coupling portion coupling the cooling flow path and the first flow path hole; and a second coupling portion coupling the cooling flow path and the second flow path hole. The power module and each of at least a part of the first flow path hole and at least a part of the second flow path hole are located to overlap with each other as seen in a direction perpendicular to another surface of the cooling plate. | 2022-09-15 |
20220295673 | POWER CONVERTER - A power converter includes a power conversion module including a heat generation device, a cooling medium path through which a cooling medium for cooling the heat generation device flows, and a cooling medium collection unit disposed facing the power conversion module and collecting the cooling medium that has cooled the heat generation device. The power conversion module includes a first heat conductive member in which a first flow path forming a part of a cooling medium path is provided. The cooling medium path includes a first connecting pipe connecting a first flow path provided in the first heat conductive member with the cooling medium collection unit. The power converter further includes a first support tool provided in at least one of the cooling medium collection unit and the power conversion module and supporting the first connecting pipe. | 2022-09-15 |
20220295674 | AIR HEAT EXCHANGER AND METHOD FOR PRODUCTION THEREOF AND ELECTRONIC ASSEMBLY EQUIPPED THEREWITH - The invention relates to an air heat exchanger | 2022-09-15 |
20220295675 | COOLING SYSTEM - Provided is a cooling system that includes a first cooling passage in which a first cooling object is cooled by first coolant, a flow passage that supplies the first coolant to a second cooling object from the first cooling passage, a flow rate regulation mechanism that regulates a flow rate of the first coolant flowing in the first cooling passage, and a controller that controls the flow rate regulation mechanism. The controller controls the flow rate regulation mechanism so that the flow rate of the first coolant flowing in the first cooling passage is lower when temperature of the first cooling object is lower than temperature of the first coolant, than the flow rate when the temperature of the first cooling object is equal to or higher than the temperature of the first coolant. | 2022-09-15 |
20220295676 | EXPANSION JOINT SEALING SYSTEM HAVING SHIELDING PROPERTIES - An expansion joint sealing system comprises a core body having an EMP, EMI, RFI, electronic surveillance and/or EMR shielding/barrier material introduced in the core body as at least one of a component or layer, disposed on the core body as a coating or wrapping, or disposed beneath the core body. The core body with the shielding/barrier material is configured to expand and contract when compressed between substrates forming an expansion joint to accommodate movement of the substrates and maintain a seal of the expansion joint. | 2022-09-15 |
20220295677 | ADAPTIVE DESIGN AND FABRICATION OF RADIATION SHIELDING INSERTS FOR ELECTRONIC COMPONENTS - A method includes obtaining a base housing for electronic components. The base housing attenuates radiation entering the base housing by a base amount. An inner volume of the base housing defined by an inner surface of the base housing experiences attenuated radiation. The method also includes affixing one or more inserts to the inner surface of the base housing to further attenuate the attenuated radiation in corresponding one or more areas of the inner volume. | 2022-09-15 |
20220295678 | FEEDER AND COMPONENT MOUNTING MACHINE - A feeder includes a sprocket that feeds a tape accommodating multiple components; a motor that rotates the sprocket; a storage section to store the rotational position of the sprocket detected by a sensor as an initial rotational position when the tape is set in the feeder and store a cumulative feeding amount of the tape fed by the rotation of the sprocket; and a control section to control the motor such that the sprocket rotates in a forward direction based on a feeding amount of the tape required for a supply when supplying the components to the component mounting machine, and control the motor such that the sprocket does not rotate in a reverse direction in excess of the initial rotational position based on the initial rotational position and the cumulative feeding amount when rewinding the tape. | 2022-09-15 |
20220295679 | TAPE FEEDER - There is provided a tape feeder for supplying, using a taped electric component including a carrier tape and multiple electric components held onto the carrier tape, the electric component in a supply position, the tape feeder including a detection sensor configured to detect presence or absence of the electric component in the supply position. | 2022-09-15 |
20220295680 | PERIPHERY MONITORING DEVICE - A periphery monitoring device includes monitoring areas in at least three directions of moving body. Safety laser scanners are mounted to the moving body for each of the monitoring areas in the directions. A monitoring area in at least one direction is a three-dimensional monitoring area, and a monitoring area in the other direction is a horizontal monitoring area to be monitored in two dimensions in a horizontal direction. The safety laser scanner configured to monitor the three-dimensional monitoring area is mounted to an upper portion of the moving body, and the three-dimensional monitoring area forms an inclined plane-like monitoring area. A safety laser scanner configured to monitor the horizontal monitoring area is mounted to the lower portion of the moving body, and the horizontal monitoring area forms a horizontal plane-like monitoring area from the lower portion of the moving body. | 2022-09-15 |
20220295681 | AUTOMATIC BACKUP PIN ARRANGEMENT SYSTEM FOR COMPONENT MOUNTING MACHINE - An automatic backup pin arrangement operation includes a backup plate facing a lower surface of circuit board where backup pins stored in a stock areas are picked up with an XY-robot to be automatically arranged at positions of the backup plate designated in a production job. In a case where there is no free space in the stock areas for an unnecessary backup pin removed from the backup plate to be placed when a production job for changing the arrangement of the backup pins is switched, at least a part of a region of the backup plate facing a lower surface of the circuit board, which does not interfere with a mounted component on a lower surface side of the circuit board, is used as retraction area, and the unnecessary backup pin that cannot be retracted to the stock area is retracted to the retraction area. | 2022-09-15 |