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36th week of 2021 patent applcation highlights part 59
Patent application number
Title
Published
20210280507
PACKAGE COMPRISING DUMMY INTERCONNECTS
2021-09-09
20210280508
SEMICONDUCTOR DEVICE
2021-09-09
20210280509
INTERCONNECTION STRUCTURE HAVING REDUCED CAPACITANCE
2021-09-09
20210280510
HYBRID SELECTIVE DIELECTRIC DEPOSITION FOR ALIGNED VIA INTEGRATION
2021-09-09
20210280511
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
2021-09-09
20210280512
Package Panel Processing With Integrated Ceramic Isolation
2021-09-09
20210280513
ONE-TIME PROGRAMMABLE CAPACITIVE FUSE BIT AND A MEMORY
2021-09-09
20210280514
FAILURE PREVENTION OF CHIP POWER NETWORK
2021-09-09
20210280515
TRIMMING CIRCUIT AND TRIMMING METHOD
2021-09-09
20210280516
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280517
DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED MULTI-DIE INTERCONNECT BRIDGE
2021-09-09
20210280518
EMIB ARCHITECTURE WITH DEDICATED METAL LAYERS FOR IMPROVING POWER DELIVERY
2021-09-09
20210280519
PACKAGE STRUCTURE AND SEMICONDUCTOR PACAKGE
2021-09-09
20210280520
FORMATION METHOD OF CHIP PACKAGE WITH FAN-OUT STRUCTURE
2021-09-09
20210280521
SUBSTRATE STRUCTURE INCLUDING EMBEDDED SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
2021-09-09
20210280522
MULTI-MOLDING METHOD FOR FAN-OUT STACKED SEMICONDUCTOR PACKAGE
2021-09-09
20210280523
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING SPLIT, DOUBLE-SIDED METALLIZATION STRUCTURES TO FACILITATE A SEMICONDUCTOR DIE ("DIE") MODULE EMPLOYING STACKED DICE, AND RELATED FABRICATION METHODS
2021-09-09
20210280524
PACKAGE STRUCTURE
2021-09-09
20210280525
PACKAGING METHOD OF PANEL-LEVEL CHIP DEVICE
2021-09-09
20210280526
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280527
SEMICONDUCTOR DEVICE
2021-09-09
20210280528
SEMICONDUCTOR STRUCTURE
2021-09-09
20210280529
Package Structure and Communications Device
2021-09-09
20210280530
ELECTRONIC PACKAGE
2021-09-09
20210280531
SEMICONDUCTOR DEVICE WITH ALUMINUM NITRIDE ANTI-DEFLECTION LAYER
2021-09-09
20210280532
SEMICONDUCTOR PACKAGE
2021-09-09
20210280533
CRACK SUPPRESSION STRUCTURE FOR HV ISOLATION COMPONENT
2021-09-09
20210280534
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
2021-09-09
20210280535
SYSTEMS AND METHODS FOR THE USE OF FRAUD PREVENTION FLUID TO PREVENT CHIP FRAUD
2021-09-09
20210280536
INTEGRATED CIRCUIT
2021-09-09
20210280537
SEMICONDUCTOR DEVICE
2021-09-09
20210280538
FABRICATED TWO-SIDED MILLIMETER WAVE ANTENNA USING THROUGH-SILICON-VIAS
2021-09-09
20210280539
SEMICONDUCTOR PACKAGE INCLUDING INTERCONNECTION MEMBER AND BONDING WIRES AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280540
DEVICE COMPRISING CONTACT TO CONTACT COUPLING OF PACKAGES
2021-09-09
20210280541
SEMICONDUCTOR DEVICES INCLUDING A THICK METAL LAYER AND A BUMP
2021-09-09
20210280542
SEMICONDUCTOR PRODUCT WITH INTERLOCKING METAL-TO-METAL BONDS AND METHOD FOR MANUFACTURING THEREOF
2021-09-09
20210280543
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
2021-09-09
20210280544
SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
2021-09-09
20210280545
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280546
STACKED SEMICONDUCTOR DEVICE AND MULTIPLE CHIPS USED THEREIN
2021-09-09
20210280547
ZINC-COBALT BARRIER FOR INTERFACE IN SOLDER BOND APPLICATIONS
2021-09-09
20210280548
ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280549
SEMICONDUCTOR MODULE
2021-09-09
20210280550
SEMICONDUCTOR MODULE
2021-09-09
20210280551
BONDING STRUCTURE, SEMICONDUCTOR DEVICE, AND BONDING STRUCTURE FORMATION METHOD
2021-09-09
20210280552
SEMICONDUCTOR PACKAGE STRUCTURE WITH HEAT SINK AND METHOD PREPARING THE SAME
2021-09-09
20210280553
PALLADIUM-COATED COPPER BONDING WIRE AND METHOD FOR MANUFACTURING SAME
2021-09-09
20210280554
SEMICONDUCTOR APPARATUS
2021-09-09
20210280555
SEMICONDUCTOR MODULE
2021-09-09
20210280556
SEMICONDUCTOR MODULE
2021-09-09
20210280557
APPARATUSES AND METHODS FOR COUPLING A PLURALITY OF SEMICONDUCTOR DEVICES
2021-09-09
20210280558
INTEGRATED CIRCUIT PACKAGE WITH GLASS SPACER
2021-09-09
20210280559
SEMICONDUCTOR DEVICE INCLUDING FRACTURED SEMICONDUCTOR DIES
2021-09-09
20210280560
SEMICONDUCTOR DEVICE WITH CONNECTING STRUCTURE AND METHOD FOR FABRICATING THE SAME
2021-09-09
20210280561
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280562
SEMICONDUCTOR DEVICES HAVING A CONDUCTIVE PILLAR AND METHODS OF MANUFACTURING THE SAME
2021-09-09
20210280563
SEMICONDUCTOR DEVICE, FABRICATION METHOD THEREOF, PACKAGE AND FABRICATION METHOD THEREOF
2021-09-09
20210280564
SEMICONDUCTOR PACKAGE HAVING A HIGH RELIABILITY
2021-09-09
20210280565
SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
2021-09-09
20210280566
DUAL-SIDED CO-PACKAGED OPTICS FOR HIGH BANDWIDTH NETWORKING APPLICATIONS
2021-09-09
20210280567
DISPLAY DEVICE
2021-09-09
20210280568
INTEGRATED CIRCUIT BRIDGE FOR PHOTONICS AND ELECTRICAL CHIP INTEGRATION
2021-09-09
20210280569
DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
2021-09-09
20210280570
DISPLAY DEVICE
2021-09-09
20210280571
VERTICAL POWER GRID STANDARD CELL ARCHITECTURE
2021-09-09
20210280572
INTEGRATED CIRCUIT HAVING ANGLED CONDUCTIVE FEATURE
2021-09-09
20210280573
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
2021-09-09
20210280574
ESD PROTECTION DEVICE AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280575
Semiconductor Device and Fabricating Method Thereof
2021-09-09
20210280576
SEMICONDUCTOR DEVICE
2021-09-09
20210280577
Recessed STI as the Gate Dielectric of HV Device
2021-09-09
20210280578
REDUCING GATE RESISTANCE IN STACKED VERTICAL TRANSPORT FIELD EFFECT TRANSISTORS
2021-09-09
20210280579
METHOD FOR FORMING SEMICONDUCTOR DEVICE
2021-09-09
20210280580
APPARATUS AND CIRCUITS INCLUDING TRANSISTORS WITH DIFFERENT THRESHOLD VOLTAGES AND METHODS OF FABRICATING THE SAME
2021-09-09
20210280581
Semiconductor Device and Manufacturing Method Thereof
2021-09-09
20210280582
THREE-DIMENSIONAL (3D), VERTICALLY-INTEGRATED FIELD-EFFECT TRANSISTORS (FETS) ELECTRICALLY COUPLED BY INTEGRATED VERTICAL FET-TO-FET INTERCONNECTS FOR COMPLEMENTARY METAL-OXIDE SEMICONDUCTOR (CMOS) CELL CIRCUITS
2021-09-09
20210280583
SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
2021-09-09
20210280584
INTEGRATED CHIP WITH IMPROVED LATCH-UP IMMUNITY
2021-09-09
20210280585
SEMICONDUCTOR STRUCTURE AND FORMATION METHOD THEREOF
2021-09-09
20210280586
Memory Arrays Comprising Memory Cells
2021-09-09
20210280587
SEMICONDUCTOR MEMORY DEVICE
2021-09-09
20210280588
ANTI-FUSE DEVICE METHOD AND LAYOUT
2021-09-09
20210280589
NON-VOLATILE MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
2021-09-09
20210280590
STRUCTURE OF MEMORY DEVICE HAVING FLOATING GATE WITH PROTRUDING STRUCTURE
2021-09-09
20210280591
NON-VOLATILE MEMORY (NVM) CELL STRUCTURE TO INCREASE RELIABILITY
2021-09-09
20210280592
NON-VOLATILE MEMORY (NVM) CELL STRUCTURE TO INCREASE RELIABILITY
2021-09-09
20210280593
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2021-09-09
20210280594
Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells
2021-09-09
20210280595
Memory Arrays Comprising Strings Of Memory Cells And Methods Used In Forming A Memory Array Comprising Strings Of Memory Cells
2021-09-09
20210280596
THREE DIMENSIONAL MEMORY DEVICE
2021-09-09
20210280597
Integrated Assemblies and Methods of Forming Integrated Assemblies
2021-09-09
20210280598
MEMORY DEVICE
2021-09-09
20210280599
NONVOLATILE MEMORY DEVICE AND METHOD OF FABRICATING THE SAME
2021-09-09
20210280600
SEMICONDUCTOR STORAGE DEVICE
2021-09-09
20210280601
SEMICONDUCTOR MEMORY DEVICE
2021-09-09
20210280602
Integrated Assemblies Having Vertically-Spaced Channel Material Segments, and Methods of Forming Integrated Assemblies
2021-09-09
20210280603
SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME
2021-09-09
20210280604
THREE-DIMENSIONAL VERTICAL NOR FLASH THIN-FILM TRANSISTOR STRINGS
2021-09-09
20210280605
Epitaxial Monocrystalline Channel for Storage Transistors in 3-Dimensional Memory Structures and Methods for Formation Thereof
2021-09-09
20210280606
NOVEL 3D NAND MEMORY DEVICE AND METHOD OF FORMING THE SAME
2021-09-09