| 36th week of 2011 patent applcation highlights part 37 |
| Patent application number | Title | Published |
|---|
| 20110217815 | MANUFACTURING METHOD OF OXIDE SEMICONDUCTOR FILM AND MANUFACTURING METHOD OF TRANSISTOR - An object is to provide a manufacturing method of an oxide semiconductor film with high crystallinity. Another object is to provide a manufacturing method of a transistor with high field effect mobility. In a manufacturing method of an oxide semiconductor film, an oxide semiconductor film is formed over a substrate in an atmosphere in which oxygen is purposely not contained, and then the oxide semiconductor film is crystallized by a heat treatment in an atmosphere containing oxygen. | 2011-09-08 |
| 20110217816 | FIELD EFFECT TRANSISTOR AND METHOD FOR FABRICATING THE SAME - A field effect transistor includes: a nitride semiconductor layer having a channel layer; a gate electrode including a Schottky electrode that contacts the nitride semiconductor layer and includes a gallium doped zinc oxide | 2011-09-08 |
| 20110217817 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME - Provided are a semiconductor memory device and a method of manufacturing the semiconductor memory device. The semiconductor memory device includes a semiconductor substrate including a first active region and a second active region, a gate electrode including a silicide layer formed on the first active region and a resistor pattern formed on the second active region. A distance from a top surface of the semiconductor substrate to a top surface of the resistor pattern is smaller than a distance from a top surface of the semiconductor substrate to a top surface of the gate electrode. | 2011-09-08 |
| 20110217818 | PHASE CHANGE MEMORY CELL HAVING VERTICAL CHANNEL ACCESS TRANSISTOR - A device includes a substrate having a first region and a second region. The first region comprises a first field effect transistor having a horizontal channel region within the substrate, a gate overlying the horizontal channel region, and a first dielectric covering the gate of the first field effect transistor. The second region of the substrate includes a second field effect transistor comprising a first terminal extending through the first dielectric to contact the substrate, a second terminal overlying the first terminal and having a top surface, and a vertical channel region separating the first and second terminals. The second field effect transistor also includes a gate on the first dielectric and adjacent the vertical channel region, the gate having a top surface that is co-planar with the top surface of the second terminal. | 2011-09-08 |
| 20110217819 | DRAM LAYOUT WITH VERTICAL FETS AND METHOD OF FORMATION - DRAM cell arrays having a cell area of less than about 4F | 2011-09-08 |
| 20110217820 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES - A method of fabricating a semiconductor device using a recess channel array is disclosed. A substrate is provided having a first region and a second region, including a first transistor in the first region including a first gate electrode partially filling a trench, and source and drain regions that are formed at both sides of the trench, and covered by a first insulating layer. A first conductive layer is formed on the substrate. A contact hole through which the drain region is exposed is formed by patterning the first conductive layer and the first insulating layer. A contact plug is formed that fills the contact hole. A bit line is formed that is electrically connected to the drain region through the contact plug, and simultaneously a second gate electrode is formed in the second region by patterning the first conductive layer. | 2011-09-08 |
| 20110217821 | METHOD OF MANUFACTURING DOPING PATTERNS - A method of manufacturing doping patterns includes providing a substrate having a plurality of STIs defining and electrically isolating a plurality of active regions in the substrate, forming a patterned photoresist having a plurality of exposing regions for exposing the active regions and the STIs in between the active regions on the substrate, and performing an ion implantation to form a plurality of doping patterns in the active regions. | 2011-09-08 |
| 20110217822 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method is described for manufacturing a semiconductor device. The method can form a conductive layer including tungsten on a foundation layer. The method can form a trench by selectively etching the conductive layer. The trench is shallower than a depth from a surface of the conductive layer to the foundation layer. The method can form a protective film on a side surface and a bottom surface of the conductive layer in the trench using a gas containing bromine. The protective film includes a compound of the tungsten and the bromine. The method can remove the protective film on the bottom surface of the conductive layer. The method can etch a portion of the conductive layer below the trench with the protective film on the side surface of the conductive layer. | 2011-09-08 |
| 20110217823 | STORAGE CAPACITOR HAVING AN INCREASED APERTURE RATIO AND METHOD OF MANUFACTURING THE SAME - Disclosed is a method of manufacturing a storage capacitor having increased aperture ratio: providing a substrate having a metal layer disposed thereon, and said metal layer is covered correspondingly with a first dielectric layer and a second dielectric layer in sequence; forming a photoresist layer with a uniform thickness to cover said second dielectric layer; performing a process of exposure-to-light and development to a portion of said photoresist layer that is correspondingly disposed over said metal layer sequentially, so that its thickness is less than its original thickness; removing said photoresist layer and etching said portion of said second dielectric layer, so that a thickness of said portion of said second dielectric layer is less than its original thickness, and the etching depth of said portion is greater than that of the other remaining portions of said second dielectric layer; and forming an electrode layer on said second dielectric layer. | 2011-09-08 |
| 20110217824 | ELECTRODE STRUCTURE, METHOD OF FABRICATING THE SAME, AND SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device includes the following processes. A first groove is formed in a first insulating film. A first conductive film is formed on inner surfaces of the first groove. A second groove is formed in the first insulating film to remove a part of the first conductive film. The second groove intersects the first groove. | 2011-09-08 |
| 20110217825 | FORMING STRUCTURES THAT INCLUDE A RELAXED OR PSEUDO-RELAXED LAYER ON A SUBSTRATE - A method for forming a structure that includes a relaxed or pseudo-relaxed layer on a substrate. The method includes the steps of growing an elastically stressed layer of semiconductor material on a donor substrate; forming a glassy layer of a viscous material on the stressed layer; removing a portion of the donor substrate to form a structure that includes the glassy layer, the stressed layer and a surface layer of donor substrate material; patterning the stressed layer; and heat treating the structure at a temperature of at least a viscosity temperature of the glassy layer to relax the stressed layer and form the relaxed or pseudo-relaxed layer of the structure. | 2011-09-08 |
| 20110217826 | METHOD OF FABRICATING SEMICONDUCTOR DEVICE - A method of fabricating a semiconductor device according to one embodiment includes preparing a wafer having a plurality of chip areas, each chip area to become semiconductor chip, bonding the first side of the wafer to a support substrate through a removable adhesive, dividing the wafer into individually separate semiconductor chips, applying adhesive tape to the second side of the separate semiconductor chips, the second side being opposite to the first side bonded to the support substrate, and the adhesive tape being softer than the support substrate, removing the support substrate from the semiconductor chips, and picking up the separate semiconductor chips that are on the adhesive tape. | 2011-09-08 |
| 20110217827 | Removing Undesirable Nanotubes During Nanotube Device Fabrication - Fabricating single-walled carbon nanotube transistor devices includes removing undesirable types of nanotubes. These undesirable types of nanotubes may include nonsemiconducting nanotubes, multiwalled nanotubes, and others. The undesirable nanotubes may be removed electrically using voltage or current, or a combination of these. This approach to removing undesirable nanotubes is sometimes referred to as “burn-off.” The undesirable nanotubes may be removed chemically or using radiation. The undesirable nanotubes of an integrated circuit may be removed in sections or one transistor (or a group of transistors) at a time in order to reduce the electrical current used or prevent damage to the integrated circuit during burn-off. | 2011-09-08 |
| 20110217828 | METHODS OF FABRICATING VERTICAL SEMICONDUCTOR DEVICE UTILIZING PHASE CHANGES IN SEMICONDUCTOR MATERIALS - A method of fabricating a vertical NAND semiconductor device can include changing a phase of a first preliminary semiconductor layer in an opening from solid to liquid to form a first single crystalline semiconductor layer in the opening and then forming a second preliminary semiconductor layer on the first single crystalline semiconductor layer. The phase of the second preliminary semiconductor layer is changed from solid to liquid to form a second single crystalline semiconductor layer that combines with the first single crystalline semiconductor layers to form a single crystalline semiconductor layer in the opening. | 2011-09-08 |
| 20110217829 | SEMICONDUCTOR DEVICES WITH NON-PUNCH-THROUGH SEMICONDUCTOR CHANNELS HAVING ENHANCED CONDUCTION AND METHODS OF MAKING - Semiconductor devices are described wherein current flow in the device is confined between the rectifying junctions (e.g., p-n junctions or metal-semiconductor junctions). The device provides non-punch-through behavior and enhanced current conduction capability. The devices can be power semiconductor devices as such as Junction Field-Effect Transistors (VJFETs), Static Induction Transistors (SITs), Junction Field Effect Thyristors, or JFET current limiters. The devices can be made in wide bandgap semiconductors such as silicon carbide (SiC). According to some embodiments, the device can be a normally-off SiC vertical junction field effect transistor. Methods of making the devices and circuits comprising the devices are also described. | 2011-09-08 |
| 20110217830 | PLASMA DOPING METHOD AND APPARATUS - There are provided a plasma doping method and an apparatus which have excellent reproducibility of the concentration of impurities implanted into the surfaces of samples. In a vacuum container, in a state where gas is ejected toward a substrate placed on a sample electrode through gas ejection holes provided in a counter electrode, gas is exhausted from the vacuum container through a turbo molecular pump as an exhaust device, and the inside of the vacuum container is maintained at a predetermined pressure through a pressure adjustment valve, the distance between the counter electrode and the sample electrode is set to be sufficiently small with respect to the area of the counter electrode to prevent plasma from being diffused outward, and capacitive-coupled plasma is generated between the counter electrode and the sample electrode to perform plasma doping. The gas used herein is a gas with a low concentration which contains impurities such as diborane or phosphine. | 2011-09-08 |
| 20110217831 | Nonvolatile semiconductor memory and method of manufacturing the same - A method of forming a nonvolatile semiconductor memory device includes forming a semiconductor substrate, forming upper and lower portions of a first gate electrode on a gate insulating film formed on the semiconductor substrate, the lower portion of the first gate electrode formed on the gate insulating film, the upper portion of the first gate electrode formed on the lower portion of the first gate electrode and having a gate length which is less than a gate length of the lower portion of the first gate electrode, forming a spacer insulating film to contact respective surfaces of the upper and lower portions of the first gate electrode, in which a length of the spacer insulating film combined with the gate length of the upper portion of the first gate electrode is equal to the gate length of the lower portion of the first gate electrode, forming an electric charge trapping film covering a portion of the semiconductor substrate, a surface of the lower portion of the first gate electrode, and a surface of the spacer insulating film, and forming a second gate electrode in a side direction of the first gate electrode and electrically insulated from the first gate electrode by the electric charge trapping film, the second gate electrode having a distance between the upper portion of the first gate electrode that is greater than a distance between the lower portion of the first gate electrode, in which the second gate electrode is separated by the upper portion of the first gate electrode by the electric charge trapping film and the spacer insulating film. | 2011-09-08 |
| 20110217832 | METHOD OF FILLING A DEEP TRENCH IN A SUBSTRATE - Methods of filling deep trenches in substrates are described. A method includes providing a substrate with a deep trench formed therein. The method also includes forming a dielectric layer conformal with the substrate and the deep trench. The method also includes, with the entire portion of the dielectric layer conformal with the deep trench exposed, removing at least a portion, but not all, of the dielectric layer at the top of the deep trench with a relatively low bias plasma etch process. | 2011-09-08 |
| 20110217833 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE USING AN ETCHANT - In an etchant for etching a capping layer having etching selectivity with respect to a dielectric layer, the capping layer changes compositions of the dielectric layer, to thereby control a threshold voltage of a gate electrode including the dielectric layer. The etchant includes about 0.01 to 3 percent by weight of an acid, about 10 to 40 percent by weight of a fluoride salt and a solvent. Accordingly, the dielectric layer is prevented from being damaged by the etching process for removing the capping layer and the electric characteristics of the gate electrode are improved. | 2011-09-08 |
| 20110217834 | METHOD AND APPARATUS FOR SINGLE STEP SELECTIVE NITRIDATION - Methods and apparatus for selective one-step nitridation of semiconductor substrates is provided. Nitrogen is selectively incorporated in silicon regions of a semiconductor substrate having silicon regions and silicon oxide regions by use of a selective nitridation process. Nitrogen containing radicals may be directed toward the substrate by forming a nitrogen containing plasma and filtering or removing ions from the plasma, or a thermal nitridation process using selective precursors may be performed. A remote plasma generator may be coupled to a processing chamber, optionally including one or more ion filters, showerheads, and radical distributors, or an in situ plasma may be generated and one or more ion filters or shields disposed in the chamber between the plasma generation zone and the substrate support. | 2011-09-08 |
| 20110217835 | METHODS OF FABRICATING SEMICONDUCTOR DEVICES WITH SIDEWALL CONDUCTIVE PATTERNS - A gate pattern is disclosed that includes a semiconductor substrate, a lower conductive pattern, an upper conductive pattern, and a sidewall conductive pattern. The lower conductive pattern is on the substrate. The insulating pattern is on the lower conductive pattern. The upper conductive pattern is on the insulating pattern opposite to the lower conductive pattern. The sidewall conductive pattern is on at least a portion of sidewalls of the upper conductive pattern and the lower conductive pattern. The sidewall conductive pattern electrically connects the upper conductive pattern and the lower conductive pattern. An upper edge portion of the lower conductive pattern may be recessed relative to a lower edge portion of the lower conductive pattern to define a ledge thereon. The sidewall conductive pattern may be directly on the ledge and sidewall of the recessed upper edge portion of the lower conductive pattern. | 2011-09-08 |
| 20110217836 | Programmable Via Devices in Back End of Line Level - Programmable via devices and methods for the fabrication thereof are provided. In one aspect, a programmable via device is provided. The programmable via device comprises a first dielectric layer; at least one isolation layer over the first dielectric layer; a heater within the isolation layer; a capping layer over a side of the isolation layer opposite the first dielectric layer; at least one programmable via extending through the capping layer and at least a portion of the isolation layer and in contact with the heater, the programmable via comprising at least one phase change material; a conductive cap over the programmable via; a second dielectric layer over a side of the capping layer opposite the isolation layer; a first conductive via and a second conductive via, each extending through the second dielectric layer, the capping layer and at least a portion of the isolation layer and in contact with the heater; and a third conductive via extending through the second dielectric layer and in contact with the conductive cap. | 2011-09-08 |
| 20110217837 | CONNECTING PAD PRODUCING METHOD - A connecting pad producing method has a first process of projecting an insulating member in a surface of a base material such that a region where a connecting pad is formed is surrounded, a second process of forming a conductive layer in the surface of the base material such that the insulating member is coated with the conductive layer, and a third process of removing the conductive layer with which the insulating member is coated, exposing the insulating member over a whole periphery from the conductive layer, and forming the connecting pad including the conductive layer in a region surrounded by the insulating member. | 2011-09-08 |
| 20110217838 | METHOD FOR FORMING INTERCONNECT STRUCTURE HAVING AIRGAP - A method for forming an interconnect structure with airgaps, includes: providing a structure having a trench formed on a substrate; depositing a spacer oxide layer on sidewalls of the trench as sidewall spacers by plasma enhanced atomic layer deposition; filling the trench having the sidewall spacers with copper; removing the sidewall spacers to form an airgap structure; and encapsulating the airgap structure, wherein airgaps are formed between the filled copper and the sidewalls of the trench. | 2011-09-08 |
| 20110217839 | Interconnect arrangement and associated production methods - An interconnect arrangement and fabrication method are described. The interconnect arrangement includes an electrically conductive mount substrate, a dielectric layer formed on the mount substrate, and an electrically conductive interconnect formed on the dielectric layer. At least a portion of the dielectric layer under the interconnect contains a cavity. To fabricate the interconnect arrangement, a sacrificial layer is formed on the mount substrate and the interconnect layer is formed on the sacrificial layer. The interconnect layer and the sacrificial layer are structured to produce a structured interconnect on the structured sacrificial layer. A porous dielectric layer is formed on a surface of the mount substrate and of the structured interconnect as well as the sacrificial layer. The sacrificial layer is then removed to form the cavity under the interconnect. | 2011-09-08 |
| 20110217840 | Method for Forming Self-Assembled Mono-Layer Liner for Cu/Porous Low-k Interconnections - A method for fabricating an integrated circuit comprises forming a low-k dielectric layer over a semiconductor substrate, etching the low-k dielectric layer to form an opening, and treating the low-k dielectric layer with a gaseous organic chemical to cause a reaction between the low-k dielectric layer and the gaseous organic chemical. The gaseous organic chemical is free from silicon. | 2011-09-08 |
| 20110217841 | METHOD OF FORMING THROUGH SILICON VIA WITH DUMMY STRUCTURE - A method of forming a through silicon via (TSV) structure includes forming an interconnect pad over a substrate. An under layer is formed over the interconnect pad. A vertical conductive post is formed at least partially through the substrate. At least one dummy structure is formed at least partially through the under layer. A top pad is formed over the dummy structure and the vertical conductive post. The top pad covers a wider area than a cross section of the vertical conductive post. The interconnect pad is electrically connected to the top pad. The dummy structure connects the top pad and the under layer thereby fastening the top pad and the interconnect pad. | 2011-09-08 |
| 20110217842 | METHOD FOR FORMING SEMICONDUCTOR DEVICE - A method for manufacturing semiconductor device includes forming an interlayer dielectric layer including a contact plug defined therein to electrically couple a semiconductor substrate on which a cell region and a dummy region are defined. A sacrificial layer is formed over the interlayer dielectric layer. An etch stop pattern is formed over the sacrificial layer, the etch stop pattern being vertically aligned to the dummy region. A storage electrode region through the sacrificial layer is defined to expose a first storage electrode contact of the cell region, the second storage electrode contact of the dummy region remaining covered by the sacrificial layer. A conductive layer is deposited within the storage electrode region to form a storage electrode contacting the first storage electrode contact of the cell region. | 2011-09-08 |
| 20110217843 | PATTERNING MASK AND METHOD OF FORMATION OF MASK USING STEP DOUBLE PATTERNING - A method of forming a mask for use in fabricating an integrated circuit includes forming first non-removable portions of a photoresist material through a mask having a plurality of apertures, shifting the mask, forming second non-removable second portions of the photoresist material overlapping the first portions, and removing removable portions of the photoresist material arranged between the first and second portions. The formed photoresist mask may be used to form vias in an integrated circuit. The pattern of vias produced have the capability to exceed the current imaging resolution of a single exposure treatment. | 2011-09-08 |
| 20110217844 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - The present invention provides a method of manufacturing a semiconductor device. The method includes stacking a SiO | 2011-09-08 |
| 20110217845 | Polishing Composition and Polishing Method Using The Same - A polishing composition is disclosed containing a nonionic active agent with a molecular weight of 1,000 or more and less than 100,000 and an HLB value of not less than 17, a basic compound, and water. The nonionic active agent is preferably an oxyalkylene homopolymer or a copolymer of different oxyalkylenes. The polishing composition may further contain at least one of silicon dioxide and a water-soluble polymer. The polishing composition is used, for example, in polishing the surface of semiconductor substrates such as silicon wafers. | 2011-09-08 |
| 20110217846 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - To prevent the occurrence of short circuit or abnormality of wiring resistance values, a semiconductor wafer is subjected to nitrogen plasma treatment after one of the following steps is over; a step of providing a resist pattern on an inter-layer insulation film and then dry-etching the inter-layer insulation film, and a step of dry-etching a stressor SiN film after the resist pattern is removed. | 2011-09-08 |
| 20110217847 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device and manufacturing method thereof capable of improving an operating speed of a MOSFET using an inexpensive structure. The method comprises the steps of forming a stress film to cover a source, drain, sidewall insulating layer and gate of the MOSFET and forming in the stress film a slit extending from the stress film surface toward the sidewall insulating layer. As a result, an effect of allowing local stress components in the stress films on the source and the drain to be relaxed by local stress components in the stress film on the gate is suppressed by the slit. | 2011-09-08 |
| 20110217848 | PHOTORESIST REMOVING PROCESSOR AND METHODS - A processing chamber successfully removes hardened photoresist via direct infrared radiation onto the wafer, in the presence of an acid such as sulfuric acid, optionally along with an oxidizer such as hydrogen peroxide. The processing chamber includes a fixture for holding and optionally rotating the wafer. An infrared irradiating assembly has infrared lamps outside of the processing chamber positioned to radiate infrared light into the processing chamber. The infrared lamps may be arranged to irradiate substantially the entire surface of a wafer on the rotor. A cooling assembly can be associated with the infrared radiating assembly to provide a quick cool down and avoid over-processing. Photoresist is removed using small amounts of chemical solutions. | 2011-09-08 |
| 20110217849 | DEVICE AND METHOD FOR PRODUCING DIELECTRIC LAYERS IN MICROWAVE PLASMA - A device for producing a microwave plasma, and a device and a method for treating semiconductor substrates with a microwave plasma, the microwave plasma device comprising at least one electrode ( | 2011-09-08 |
| 20110217850 | METHODS FOR OXIDATION OF A SEMICONDUCTOR DEVICE - Methods of fabricating an oxide layer on a semiconductor substrate are provided herein. The oxide layer may be formed over an entire structure disposed on the substrate, or selectively formed on a non-metal containing layer with little or no oxidation of an exposed metal-containing layer. The methods disclosed herein may be performed in a variety of process chambers, including but not limited to decoupled plasma oxidation chambers, rapid and/or remote plasma oxidation chambers, and/or plasma immersion ion implantation chambers. In some embodiments, a method may include providing a substrate comprising a metal-containing layer and non-metal containing layer; and forming an oxide layer on an exposed surface of the non-metal containing layer by exposing the substrate to a plasma formed from a process gas comprising a hydrogen-containing gas, an oxygen-containing gas, and at least one of a supplemental oxygen-containing gas or a nitrogen-containing gas. | 2011-09-08 |
| 20110217851 | CONFORMAL LAYERS BY RADICAL-COMPONENT CVD - Methods, materials, and systems are described for forming conformal dielectric layers containing silicon and nitrogen (e.g., a silicon-nitrogen-hydrogen (Si—N—H) film) from a carbon-free silicon-and-nitrogen precursor and radical-nitrogen precursor. The carbon-free silicon-and-nitrogen precursor is predominantly excited by contact with the radical-nitrogen precursor. Because the silicon-and-nitrogen film is formed without carbon, the conversion of the film into hardened silicon oxide is done with less pore formation and less volume shrinkage. The deposited silicon-and-nitrogen-containing film may be wholly or partially converted to silicon oxide which allows the optical properties of the conformal dielectric layer to be selectable. The deposition of a thin silicon-and-nitrogen-containing film may be performed at low temperature to form a liner layer in a substrate trench. The low temperature liner layer has been found to improve the wetting properties and allows flowable films to more completely fill the trench. | 2011-09-08 |
| 20110217852 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE - Provided is technology for preventing breakage of an induction target part of a substrate processing apparatus using an induction heating method. The substrate processing apparatus including a reaction vessel configured to process a substrate therein; a first induction target part comprising a peripheral portion and a center portion wherein a thickness of the center portion is less than that of the peripheral portion, the first induction target part being configured to heat the substrate accommodated on the center portion; a second induction target part comprising a peripheral portion and a center portion wherein a thickness of the center portion is equal to or greater than that of the peripheral portion, the second induction target part being configured to heat the substrate accommodated on the center portion of the first induction target part; an induction target part holder configured to hold the first induction target part and the second induction target part in a manner that the second induction part is spaced apart from the first induction target part by a predetermined distance; and an induction heating device configured to heat at least the first and second induction target parts in the reaction vessel held by the induction target part holder using an induction heating method. | 2011-09-08 |
| 20110217853 | Connection Device for High Frequency Signals Between a Connector and a Transmission Line - A connection device for high frequency signals includes a printed circuit on one external face of which is printed a transmission line and a coaxial connector surface mounted on the printed circuit on the external face. The invention is of particular use for the transmission of radiofrequency signals in the X band, in particular for frequencies from 9 to 10 GHz. The transmission line is connected to the connector by means of a bump contact belonging to the transmission line to which is attached a central core of the connector. The printed circuit comprises at least one internal ground plane parallel to the external face and contributing to the matching of the transmission line. The invention aims to improve the transparency of the transition between the connector and the transmission line. According to the invention, the internal ground plane is perforated by means of a resist facing the bump contact. | 2011-09-08 |
| 20110217854 | ELECTRICAL CONNECTOR ASSEMBLY INCLUDING HOOPS AND HOOKS - Apparatus, systems and methods for forming a connector assembly that includes hoops and hooks designed to engage each other are disclosed. According to one aspect, a connector assembly includes a first substrate and a second substrate. The first substrate includes a plurality of hooks arranged in a hook area. The hooks include at least one hook that is arranged to form an electrical contact. The second substrate includes a plurality of hoops arranged in a hoop area. The hoops include at least one hoop that is arranged to form the electrical contact. The hook interfaces with the hoop to form the electrical contact. | 2011-09-08 |
| 20110217855 | INTERFACE DEVICE AND ELECTRONIC DEVICE ADOPTING THE SAME - An interface device includes a board including first and second sides at opposite locations thereof. First and second connectors of different types are included. First and second connectors are mounted on the first and second sides, respectively and comply with a common communication standard. An electronic circuit mounted on the board and connected to the first and second connectors is included. The electronic circuit is adapted for data communication in compliance with the communication standard. | 2011-09-08 |
| 20110217856 | TERMINAL ASSEMBLY INCLUDING A JUNCTION BOX FOR A PHOTOVOLTAIC MODULE AND METHOD OF FORMING - A terminal assembly and a junction box for a photovoltaic module are provided. The terminal assembly includes a terminal connector, a power cable, and a gasket. The junction box is positioned over the terminal connector and attached to a first surface of the photovoltaic module. The terminal connector extends through the first surface of a photovoltaic module. The power cable is attached to the terminal connector and extends through the junction box. The gasket is housed between the first surface of the photovoltaic module and the junction box. The gasket comprises a first material and a second material and provides a seal about an end portion of the power cable. A method for forming the terminal assembly is also provided. | 2011-09-08 |
| 20110217857 | CRADLE FOR FASTENING A TERMINAL BLOCK TO A MOUNTING FRAME AND ARRANGEMENT FOR EARTHING A TERMINAL BLOCK - The invention relates to a cradle ( | 2011-09-08 |
| 20110217858 | USB Connector and USB Device - A USB connector for connecting with a USB female comprises a rotating shaft assembly which is capable of rotating, metal legs, a connecting line, and a substrate, and said rotating shaft assembly includes a rotating shaft, a rotating shaft sleeve and a rotating shaft support, the rotating shaft is disposed in the rotating shaft sleeve and is capable of rotating relative to the rotating shaft sleeve, the rotating shaft sleeve is located in a support hole of the rotating shaft support, and the rotating shaft assembly with the rotating shaft support is fixed on the surface of the substrate by the rotating shaft support. According to the USB connector and the USB device, the metal legs are formed on the surface of the substrate to ensure the connecting strength of the metal legs and reduce the thickness of the USB device. | 2011-09-08 |
| 20110217859 | Waterproof connector that can be designed to be short in overall length - A retainer is incorporated into a fitting portion of a housing so as to be movable between a preset position and a set position in a direction crossing terminal receiving holes. Further, a seal member is attached to an outer periphery of the fitting portion. The seal member is brought into close contact with an inner periphery of a fitting hole of a mating connector for sealing when the fitting portion is fitted to the fitting hole. The retainer has projections which retreat to the sides of the terminal receiving holes to allow insertion of terminals into the terminal receiving holes when the retainer is at the preset position and which project into the terminal receiving holes to engage with the terminals so as to hold the terminals in a come-off preventing state when the retainer is at the set position. The retainer and the seal member are provided at positions which overlap each other in a direction of fitting to the mating connector. | 2011-09-08 |
| 20110217860 | Fluidics Interface System - A leak resistant electrical connector configured as a fluidic barrier between a fluidics device, which may comprise a chemFET sensor, and other electrical circuitry wherein the fluidics device further comprises one or more electrical contacts conductively coupled to one or more electrical contacts associated with the electrical circuitry through the connector. | 2011-09-08 |
| 20110217861 | DEVICE FOR CONNECTING ELECTRICAL LINES FOR BORING AND PRODUCTION INSTALLATIONS - A device for connecting two electrical lines to essentially tubular connecting elements ( | 2011-09-08 |
| 20110217862 | CONNECTOR STRUCTURE FOR HIGH-FREQUENCY TRANSMISSION LINES - A connector structure for high-frequency transmission lines comprises a locking sleeve used for receiving the connector of a signal cable therein for signal transmission, and is characterized in that: the locking sleeve comprises a hollow part and the hollow part is disposed in the locking sleeve, where the hollow part includes a hollow metal piece, so that when connected into the locking sleeve, the connector of the signal cable is inserted through the hollow metal piece of the hollow part. | 2011-09-08 |
| 20110217863 | ELECTRICAL DISTRIBUTION BLOCK APPARATUS AND METHOD OF ASSEMBLY - An electrical receptacle includes a first portion having a face with a plurality of openings and including a first set of protrusions and a first set of receptors, the first portion being configured to receive a plurality of electrical conductors, and a second mating portion including a second set of protrusions and a second set of receptors. The first set of receptors is configured to interact with the second set of protrusions and the first set of protrusions is configured to interact with the second set of receptors to snap lock the second mating portion to the first portion and form the electrical receptacle. Further, a method is provided for assembling and disassembling an electrical receptacle. | 2011-09-08 |
| 20110217864 | Electrical Connector - An electrical connector that can provide stable contact between a signal transmission terminal and a short-circuit terminal even if the connector is downsized. The connector includes a main body having a plurality of terminal receiving cavities provided with lances by which signal transmission terminals are secured and a plurality of short-circuit terminal receiving cavities adjacent to the terminal receiving cavities for receiving short-circuit terminals. Each short-circuit terminal includes a bent part at a forward position and a contact at a rearward position. The main body further includes a window that is formed at a position to the rear of the lances corresponding to the contacts of the short-circuit terminals and through which the terminal receiving cavities and the short-circuit terminal receiving cavities communicate with each other. The contacts of the short-circuit terminals are in contact with the female terminals through the window. | 2011-09-08 |
| 20110217865 | Electrical Connector Assembly - An electrical connector assembly is configured so that a plug can be connected to or disconnected from a receptacle easily and reliably. Levers ( | 2011-09-08 |
| 20110217866 | Closed IDC terminal - This present invention refers to a combined terminal and casing for establishing electrical contact between a multi-wire cable and a magnetic wire that uses the insulation displacement connector (IDC) concept, wherein the terminal ( | 2011-09-08 |
| 20110217867 | CONSOLIDATION POINT ENCLOSURE - A consolidation point enclosure for a telecommunications network, including a base member for supporting the consolidation point on a mounting surface; and first and second bracket parts coupled to opposite end sections of a generally planar connection section of the base member, wherein the bracket parts are adapted to couple opposite ends sections of a patch panel to the base member so that a common insertion direction of modular jacks of the patch panel is substantially parallel to the generally planar connection section of the base member. | 2011-09-08 |
| 20110217868 | RIGHT-ANGLE CONNECTOR HAVING A SHIELDING AND METHOD FOR PRODUCING THE SHIELDING OF THE RIGHT-ANGLE CONNECTOR - The invention relates to a right-angle connector ( | 2011-09-08 |
| 20110217869 | Connector Hat With Extended Mounting Posts For Securing A Connector Shell To A Circuit Board - Concepts and technologies described herein provide for securing a connector shell to a circuit board using a separate connector hat with elongated mounting posts. According to one aspect of the disclosure provided herein, a connector hat includes a one-piece body with a top surface and a pair of mounting posts. The mounting posts extend downwards from opposing side edges of the top surface. The posts are of sufficient length to extend beyond a bottom surface of a connector shell to which the connector hat is configured to attach, and through a bottom surface of an associated circuit board. The two-piece connector assembly design utilizing the connector hat with mounting posts allows the mounting posts to be manufactured at any desirable length to facilitate installation of the connector assembly to a circuit board. | 2011-09-08 |
| 20110217870 | HIGH FREQUENCY PLUG CONNECTOR - An HF plug connector having an outside conductor part, and inside conductor part arranged within the outside conductor part and an end on the mating side that is designed for a plug-in connection to a complementary HF plug connector, wherein a housing made of an electrically insulating material, is arranged on the mating side end of the HF plug connector, at least partially surrounding the outside conductor part, wherein the housing exhibits a through-hole into which the outside conductor part engages. The outside conductor part has a first axial retaining element designed to a first predetermined section of the housing upon assembly on the outside conductor part and a second axial retaining element designed so that said second axial retaining element presses a second predetermined section of the housing together upon assembly on the outside conductor part. | 2011-09-08 |
| 20110217871 | MODULAR INTERCONNECT APPARATUS - The present application provides a modular interconnect apparatus. In one embodiment, the interconnect apparatus includes a frame; and a plurality of coaxial modules connected to the frame, wherein each of the plurality of coaxial modules comprises: a signal contact having a middle portion, a first end and a second end; a first ring shaped ground contact surrounding the first end of the signal contact, wherein the first end of the signal contact is coaxial with the first ring shaped ground contact; a second ring shaped ground contact surrounding the second end of the signal contact, wherein the second end of the signal contact is coaxial with the second ring shaped ground contact; and a housing that houses at least a portion of signal contact and ground contacts. | 2011-09-08 |
| 20110217872 | Electrical Connector - An electrical connector includes an insulating housing defining two openings, a circuit board received in the insulating housing and formed two sets of contacts, a cover covering the insulating housing and enclosing the circuit board except the sets of contacts, and a pair of grounding shells inserted into the openings respectively. Each of the grounding shells defines an inserting edge exposed through the opening and a blocking edge received in the insulating housing. One of the grounding shells connects to a grounding unit of a cord telephone base, and the other grounding shell connects to a grounding unit of a portable wireless telephone to prevent the cord telephone base and the portable wireless telephone from electrostatic influence. | 2011-09-08 |
| 20110217873 | METHOD AND SYSTEM FOR A CONNECTOR WITH INTEGRATED POWER OVER ETHERNET FUNCTIONALITY - Aspects of a method and system for a connector with integrated power over Ethernet functionality are provided. In this regard, one or more circuits and/or processors that reside within and/or on a connector may be operable to manage a supply power that is delivered over a cable based on characteristics of the connector and/or characteristics of the cable. The cable may carry the supply power while concurrently carrying data communications. The one or more circuits and/or processors may be operable to source and sink the supply power. The one or more circuits and/or processors may be operable to control which one or more conductors of the cable are utilized for conveying the supply power. | 2011-09-08 |
| 20110217874 | CONNECTOR INCLUDING ELECTRONIC DEVICE - A electronic device is disclosed in which substantially all of the electronic components of the device reside within a connector suitable for coupling to a port on a computing device. The device, referred to as a “dongle,” may therefore have an overall volume that is less than that of other devices for performing the same function. The dongle may, for example, perform the function of an encryption key to protect the computing device against unauthorized use. The dongle may be mated with the computing device port, thereby enveloping substantially all of the dongle within the port. The dongle does not extend appreciably from the port to which it is mated, thereby not adding appreciably to the volume of the computing device, and thereby making it easier to transport the computing device while the dongle is coupled to it. | 2011-09-08 |
| 20110217875 | RECEPTACLE POWER MANAGEMENT SYSTEM AND MANAGING METHOD THEREOF - A receptacle device is disclosed. The receptacle device includes a body, a setting unit for setting address information of the receptacle device, a processing unit for generating an address signal according to the address information, and a communication unit for transmitting the address signal to the host so as to manage the distribution of the receptacle device. | 2011-09-08 |
| 20110217876 | ELECTRICAL CONNECTOR WITH SACRIFICIAL APPENDAGE - An electrical connector assembly may include a yoke that includes an outer housing and a central conductor provided within the outer housing. The central conductor may include at least three outwardly extending portions. A first outwardly extending portion and a second outwardly extending portion maybe operatively coupled to first and second power cables, respectively. A third outwardly extending portion may include a sacrificial appendage configured to be cut through to confirm that the electrical connector is de-energized. | 2011-09-08 |
| 20110217877 | METHOD FOR SIMULTANEOUSLY FORMING A MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO PARTS - A method connects two parts, which overlap each other only partially and have electrically conducting structures, mechanically and electrically at the same time. For purposes of electrical insulation and/or for mechanical and/or chemical protection, at least one of the conductors is extensively covered with an electrically insulating material beyond the overlapping area and including the connection surface. In order to establish the connection, the conducting parts are pressed against each other in the area of the connection surfaces of said conducting parts and in the area surrounding said connection surfaces. An adhesive is used as the electrically insulating material. The adhesive is put into a sticky state during the connection, thereby forming an electrical contact between the electrical connection surfaces and in the area surrounding said electrical connection surfaces, after which the adhesive is brought into a permanently adhering state. | 2011-09-08 |
| 20110217878 | ELECTRONIC DEVICE, ADAPTER AND RECEPTACLE - An electronic device, an adapter and a receptacle are provided. The electronic device includes a card body, a plurality of first and second terminals, and at least one stub. The card body has a front edge, a first surface and a second surface opposite to the first surface. The first terminals are between the first terminals and the front edge. The stub is disposed on the second surface and near the front edge. The adapter includes a body and a plurality of elastic terminals. The body has an accommodating portion for accommodating an electronic device. One ends of the elastic terminals are fixed to the body. When the electronic device is accommodated at the accommodating portion, a plurality of flat terminals of the electronic device are outside of the accommodating portion, and another ends of the elastic terminals are against the flat terminals correspondingly. | 2011-09-08 |
| 20110217879 | PLUG-TYPE CONNECTOR AND MATING PLUG-TYPE CONNECTOR - The invention describes a plug-type connector ( | 2011-09-08 |
| 20110217880 | SYSTEM CONNECTOR WITH ADAPTER MODULE - System connector ( | 2011-09-08 |
| 20110217881 | PLUG CONNECTOR FOR A STAR QUAD CABLE - A plug connector for a cable having at least two signal conductors, in particular a star quad cable, having a signal conductor part and an insulating part which holds the signal conductor part. The signal conductor part has a spring lug, electrically and mechanically connected to a signal conductor, wherein the insulating part has an axial hole and a spring lug passes through each of said axial holes, wherein the holes are arranged to hold the spring lugs at a physical distance from one another. The spring lugs project beyond the insulating part at the plugging-side end and are bent over in such a way that the respective bent-over portions of the spring lugs run from the plugging-side end in the direction of the cable-side end on an outer face of the insulating part and can be resiliently elastically deformed in the radial direction. | 2011-09-08 |
| 20110217882 | PLUG-IN CONNECTOR - In a plug-in connector ( | 2011-09-08 |
| 20110217883 | Press-fit terminal - A press-fit terminal includes: through-hole contact portions provided at intermediate portions in a terminal protruding direction, both ends of the through-hole contact portions in a widthwise direction being pressed against an inner peripheral surface of a through-hole of a substrate; distal end side wide portions and proximal end side wide portions provided on both sides of the through-hole contact portions in the terminal protruding direction, and protruding toward both sides in the widthwise direction so as to position the substrate in a manner such that the substrate is sandwiched between the distal end side wide portions and the proximal end side wide portions on both sides of the substrate in a thickness direction; width varying portions whose width between both ends in the widthwise direction gradually reduces from the distal end side wide portions toward a distal end side in the terminal protruding direction; a longitudinal perforated hole provided to extend over the width varying portions, the distal end side wide portions, the through-hole contact portions, and the proximal end side wide portions; a distal end connecting portion integrally connecting the width varying portions separated by the perforated hole, at a distal end side in the terminal protruding direction, wherein when the press-fit terminal is inserted into the through-hole from a side of the distal end connecting portion and portions in the width varying portions are engaged with the through-hole, the press-fit terminal is elastically deformed inward in the widthwise direction due to the perforated hole, and when the distal end side wide portions are passed through the through-hole and the press-fit terminal is elastically returned outward in the widthwise direction, the through-hole contact portions are pressed against the inner peripheral surface of the through-hole to be electrically connected to the inner peripheral surface of the through-hole; and the distal end connecting portion having a fragile breaking portion broken before the distal end side wide portions reach the through-hole when the width varying portions are engaged with the through-hole to be elastically deformed while the width varying portions are passed through the through-hole. | 2011-09-08 |
| 20110217884 | BATTERY CLAMP - A battery clamp assembly connecting an electrical wire to a battery terminal includes a body having a clamp cavity and at least one connection socket for receiving the electrical wire, a clamp device positioned in the clamp cavity, a compression wedge positioned in the clamp cavity, and a fastening member that engages the compression wedge to couple the clamp and the compression wedge to the body. A polarity marker may be plugged into a terminal aperture provided in an access cover to permit visual identification of the terminal connection. A method of completing an electrical circuit between a component and a power source may include coupling a battery clamp assembly to the power source, connecting the electrical wire to the battery clamp assembly by securing the electrical wire into the connection using the compression screw, and tightening the fastening member which engages the compression wedge to close the clamp. | 2011-09-08 |
| 20110217885 | APPARATUS AND METHOD FOR EFFECTING ELECTRICAL TERMINATION WITH A PLURALITY OF TYPES OF TERMINATION STRUCTURES - An apparatus for effecting electrical termination with a plurality of types of termination structures includes: (a) a base member presenting a face in a first direction; and (b) a plurality of electrically conductive connection members extending in the first direction from the face. Each respective connection member of the plurality of connection members presents a rod-shaped post. Each post has a first portion presenting a threaded structure and has a second portion presenting an unthreaded structure. | 2011-09-08 |
| 20110217886 | OUTBOARD MOTOR CONTROL APPARATUS - In an apparatus for controlling operation of an outboard motor having an internal combustion engine, a transmission, and a trim angle regulation mechanism, where operation of the transmission is controlled to change the gear position from a second speed to a first speed when detected throttle change amount not less than a first predetermined value and operation of the trim angle regulation mechanism is controlled to start the trim-up operation such that the trim angle converges to a predetermined angle, the operation of the trim angle regulation mechanism is controlled such that the trim angle is decreased based on the detected rudder angle when steering of the outboard motor is started, thereby enabling to appropriately prevent cavitation caused by steering of the outboard motor, so that the boat can be smoothly turned. | 2011-09-08 |
| 20110217887 | VEHICLE DRIVE TRANSMISSION AND STEERING SYSTEM - On an amphibious ATV, a triple-differential transmission is combined a continuously-variable drive. The gearbox can be set at a low ratio, for negotiation of difficult terrain, and at a high ratio for cruising trails. The high-low shift mechanism is located upstream, in the drive train, of the forward-reverse shift mechanism. Both mechanisms are located upstream of the steer-differential and of the two wheel-differentials. Main power from the engine is passed, through the mechanisms, directly to a wheel-ring that is common to both wheel-differentials. The common wheel-ring is bearing'd, not from the gearbox housing, but from the wheel-shafts, which are themselves bearing'd into the gearbox housing. Similarly, the steer-diff-housing is bearing'd, not from the gearbox housing, but from the steer-shafts, which are themselves bearing'd from the gearbox housing, which makes for a compact, narrow, layout of the gearbox—well suited to the ATV. The steer-brake-disks are located on the steer-shafts, and are positioned outside the gearbox housing. | 2011-09-08 |
| 20110217888 | OUTBOARD MOTOR CONTROL APPARATUS - In an apparatus for controlling operation of an outboard motor having an engine to power a propeller, a transmission being selectively changeable in gear position to establish speeds including a first speed and second speed and transmitting power of the engine to the propeller with a gear ratio determined by established speed, and a trim angle regulation mechanism regulating a trim angle through trim-up/down operation, the transmission is controlled to change the gear position from the second speed to the first speed when the second speed is selected and a throttle opening change amount is at or above a predetermined value; and the trim angle regulation mechanism is operated to start the trim-up operation based on engine speed. With this, the transmission can be appropriately controlled to suppress the decrease in boat speed caused by change of gear position, thereby mitigating an unnatural feel given to the operator. | 2011-09-08 |
| 20110217889 | Paddle Pocket - A pocket applied to a crate and formed to retain a paddle in an upright attitude. The crate is fixed to a stand up paddle surfboard to allow a board rider to stow the paddle in a manner that does not interfere with the rider during activities, such as fishing. | 2011-09-08 |
| 20110217890 | SWIMMING DEVICE FOR A SWIMMER OR DIVER - A swimming device ( | 2011-09-08 |
| 20110217891 | Method and Apparatus for Partially Submerged User Operation - An “in the water” user experience is provided. A device holds a user partially submerged in the water, and propels the user and device with the user partially submerged. The user and device together have a center of buoyancy, which can be adjusted to accommodate users of different size and weight. Thus, a user can be propelled through the water. | 2011-09-08 |
| 20110217892 | FABRIC, A DEVICE WITH FABRIC AND A MANUFACTURING METHOD FOR FABRIC - A woven fabric ( | 2011-09-08 |
| 20110217893 | METHOD FOR WEAVING SUBSTRATES WITH INTEGRAL SIDEWALLS - The present invention generally relates to an integrally woven three-dimensional preform with at least one sidewall in at least one direction constructed from a woven base fabric comprising two or more layers, and a method of forming thereof. A plurality of fibers in a first direction is interwoven between at least the top layer and a second layer, such that top layer is foldable relative to the other layers and form, upon folding, an integral sidewall. A plurality of fibers may also be interwoven between the second-from-the-top layer and a second layer, such that the second-from-the-top layer is foldable relative to the other layers, upon folding, form a second integral sidewall perpendicular to the first integral sidewall. The preform may optionally comprise a plurality of non-integral sidewalls formed by folding portions of the topmost layer. | 2011-09-08 |
| 20110217894 | TWO-SIDED HYDROPHILIC/HYDROPHOBIC NONWOVEN AND METHOD OF MANUFACTURING THEREOF - A nonwoven fabric comprises: a first layer comprising hydrophilic spunbond fibers including a hydrophilic melt additive, the first layer forming at least one exposed outer surface of the nonwoven fabric; a second layer comprising hydrophobic spunbond fibers, the second layer forming an opposite exposed outer surface of the nonwoven fabric; and a third layer comprising meltblown fibers interposed between the first and second layers; wherein the nonwoven fabric has an absorptive capacity of at least 100%. | 2011-09-08 |
| 20110217895 | Wipes - The invention relates to wipes for use on either a human or a household surface. The wipe of this invention has at least a wet layer, a dry layer and a moisture impervious layer there between. The moisture impervious layer is impermeable to all liquid leaching from the wet layer to the dry layer. | 2011-09-08 |
| 20110217896 | PROCESS FOR PREPARING A DISPLAY PANEL - This application is directed to processes for preparing electrophoretic displays and semi-finished display panels comprising display cells prepared from the microcup and top-sealing technologies. The semi-finished display panel comprises an array of display cells sandwiched between two temporary substrate layers, between a temporary substrate layer and a conductor layer or between a temporary substrate layer and a permanent substrate layer, wherein said display cells are filled with an electrophoretic fluid and top-sealed with a polymeric sealing layer formed from a top-sealing composition which is being hardened while on top of the electrophoretic fluid. | 2011-09-08 |
| 20110217897 | Fun meter - A fun meter is provided with a meter body and a remote hand controller. The meter body has a visible sweep face, a back wall, and a sidewall. The back wall includes a fastener for attaching the back wall to an article of clothing. The sweep face includes a visible indicator region and a visible indicator for indicating a relative position of the indicator along the sweep face. The remote hand controller is electrically connected to the meter body for operation of the visible indicator with a pressure sensitive switch. A direct current circuit includes an adjustable resistance and a voltage source electrically connected to the switch and the visible indicator so that the visible indicator registers a relative position on the indicator region of the sweep face in proportion to operation of the switch by hand. | 2011-09-08 |
| 20110217898 | Lighted Toy Brick - A toy brick includes a housing adapted for releasable engagement to at least one other toy brick and having at least one translucent portion, at least one lighting device arranged inside the housing and adapted to generate light viewable through the at least one translucent portion, at least one battery arranged inside the housing and electrically connected to the at least one lighting device, and at least one switch arranged inside the housing and operable from outside the housing to illuminate the at least one lighting device. The at least one switch can be a motion-activated switch. | 2011-09-08 |
| 20110217899 | WHIRLPOOL TOY - A whirlpool toy for use in a partially enclosed household fixture having water therein and having a drain. An example of the whirlpool toy comprises a generally cylindrical body having a generally cylindrical upper chamber, the body having a top allowing a clear view of the upper chamber and at least one generally vertical side wall. A first outlet aperture is formed in a bottom of the upper chamber, located near a center of the bottom of the upper chamber. A lower chamber is connected to the upper chamber by the first outlet aperture, and has an open bottom offering a flow connection to the exterior of the device. The lower chamber extends beyond and is offset from the upper chamber. At least one inlet slot extends vertically up a portion of the at least one generally vertical side wall. A third chamber may be connected above the lower chamber offset to allow for the removal of objects drawn down into the lower chamber. | 2011-09-08 |
| 20110217900 | SAFETY STUFFED TOY AND METHOD FOR PRODUCING THE SAME - A safety stuffed toy has a latex body formed to define an exterior appearance and having a chamber therein, and a PU stuffing formed by polyurethane foam, fully filled in the chamber and adhered to an inner wall of the latex body. A method for producing a safety stuffed toy has a mold preparing step, a latex injecting step, a polyurethane filling step, a foaming step and a demolding step. As the PU stuffing is securely bonded to the latex body and won't be easily fragmented, the present invention is advantageous in providing a safer stuffed toy. Besides, the foaming process of the polyurethane foam material spontaneously and extensively spreads the polyurethane foam material inside the chamber of body to facilitate stuffing the body effectively. | 2011-09-08 |
| 20110217901 | Pop-up Play Set - A play set having a main panel section and a pair of side panel sections, each of which is pivotably connected to tile side lateral edges of the main panel section. When the play set is in a first orientation, the main panel section and the pair of side panel sections are oriented generally co-planar to each other such that the upper main surface and upper side surfaces define a play surface having a perimeter, and when the play set is in a second orientation, the side panel sections are adjacent each other and in a plane parallel to the main panel section to define a play set case. When in the first orientation, one of the panel sections includes an elongated member extendable therefrom in a telescoping manner to define an additional play surface outside the perimeter of the main panel sections and side panel sections. | 2011-09-08 |
| 20110217902 | BRASSIERE CONSTRUCTION USING MULTIPLE LAYERS OF FABRIC - A body-shaping garment and fabric is provided. The garment includes an inner fabric layer and an outer fabric layer. The inner fabric layer is placed in an angular orientation relative to the outer fabric layer. Further, the inner fabric layer and the outer fabric layer have sufficiently isotropic hysteresis. | 2011-09-08 |
| 20110217903 | Sports Bra - The present invention relates generally to sports bras with breast enhancement features. | 2011-09-08 |
| 20110217904 | Athletic Bra - A bra to be worn during vigorous physical activity. It provides the wearer with a high level of breast tissue support without undue restriction of breathing or shoulder movement, while providing means for ventilation and moisture management. The bra is underwire-free, and designed to be worn as outerwear. The bra achieves these objectives through the innovative combination of various non-stretch and stretch fabrics. The non-stretch portions of the garment provide a high level of compression and stability to the breast tissue, while the multiple regions of stretch fabric minimize breathing and shoulder restrictions and provide ventilation. Non-stretch wicking fabric is used to form the majority of the body of the bra, and is used to pull the breast tissue in and hold it firmly to the chest. This non-stretch fabric is connected to panels of stretch wicking fabric located in the front and back of the body of the bra. | 2011-09-08 |
| 20110217905 | GRINDING MACHINE HAVING THE FUNCTION OF MEASURING DISTANCE - The invention relates to a grinding machine for grinding a workpiece, which has been set on a chuck top surface, by moving a rotating grinding wheel in relation to the workpiece. The grinding machine includes: a microscope configured to be vertically movable; a CCD camera configured to take an image viewed through the microscope; and an image processor configured to process the image taken by the CCD camera to measure a vertical distance between a reference plane of the microscope and an object of the microscope. The image processor is adapted to measure the vertical distance between the reference plane of the microscope and the object of the microscope based on sharpness of the image, which corresponds to how clear the microscope is focused. | 2011-09-08 |
| 20110217906 | POLISHING APPARATUS AND POLISHING METHOD - A polishing apparatus can effectively prevent abrasive particles from falling off a polishing tape during polishing. The polishing apparatus includes: a polishing head for polishing a peripheral portion of a substrate by pressing a surface of a polishing tape, having abrasive particles fixed on the surface, against the peripheral portion of the substrate while allowing the polishing tape to travel in one direction; and a conditioning apparatus, disposed upstream of the polishing head in the traveling direction of the polishing tape, for conditioning the surface of the polishing tape in advance in order to prevent the abrasive particles from falling off the surface of the polishing tape during polishing. | 2011-09-08 |
| 20110217907 | SURFACE APPLIED ABRASIVE CLEANING APPARATUS AND METHOD - A rotor assembly is provided for blast processing. The rotor assembly includes multiple lofting elements to create a vortex to loft particulate material to be used to process a target, and multiple elements to project the particulate material toward the target. The rotor assembly is enclosed within an operating chamber that has a target area into which the particulate material is projected to strike the target. There may further be angled deflectors at the opening to direct particulate material back toward the rotor assembly to use the | 2011-09-08 |
| 20110217908 | Coarse and Fine Grinding/Polishing Machine - A grinding/polishing machine includes first and second grinding units. The first grinding unit is mounted slidably on a column on a base support to move along a Z-axis direction, and has a first grinding wheel. The second grinding unit is mounted slidably on. the first grinding unit to move along a Y-axis direction and has a second grinding wheel aligned with the first grinding wheel. When the second grinding wheel is in a grinding position, the second grinding wheel is situated between the first grinding wheel and a platform mounted on the base support to hold a workpiece. When the second grinding wheel moves away from the first grinding wheel, the first grinding wheel is movable to the platform for a grinding operation. The first and second grinding wheels have different levels of coarseness/fineness. | 2011-09-08 |
| 20110217909 | DEVICE IN A PNEUMATIC POWER TOOL AND POWER TOOL - A speed control device is provided for a pneumatic power tool which includes a housing with a pressure air inlet, an output spindle, and an air turbine with a turbine wheel drivingly connected to the output spindle. Nozzles are arranged for directing motive air onto the turbine wheel. The speed control device includes a valve unit for controlling pressure air flow through the nozzles in response to a speed responsive parameter. The plurality of nozzles are divided into n separate nozzle groups having individual air feed through individual air feed passages (n is an integer, n>1). The valve unit is capable of being actuated into n states for controlling air feed to the n nozzle groups, whereby for each subsequent state, x (1≦x≦n, x is an integer) air feed passages are connected to the pressure air inlet such that nozzle groups 1 to x are fed with air. | 2011-09-08 |
| 20110217910 | CHEMICAL MECHANICAL POLISHING APPARATUS - A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer. | 2011-09-08 |
| 20110217911 | POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING PROCESS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME - A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern. | 2011-09-08 |
| 20110217912 | WINDSHIELD WIPER REPAIRING DEVICE - A windshield wiper repairing device comprises of a hollow frame ( | 2011-09-08 |
| 20110217913 | SYSTEM AND METHOD FOR ALLOWING A QUALITY CHECK OF SAUSAGE-SHAPED PRODUCTS - The invention relates to a system for allowing a quality check of sausage shaped products. The system includes a filling tube for feeding filling material into a tubular packing casing. The system further includes a clipping machine having a displacer unit with at least two pairs of displacer elements for gathering the filled tubular packing casing and for providing a plait-like portion. The system further includes a clipping unit for applying two closure means to the plait-like portion of the tubular packing casing, and a feeding unit for feeding flexible suspension elements to the clipping unit. The system further comprises a discharge device for by-passing the transportation unit by at least one of the sausage-shaped products and for discharging the by-passed sausage-shaped product out of the clipping machine. | 2011-09-08 |
| 20110217914 | VENTILATION NOZZLE FOR THE INTERIOR OF A VEHICLE - A ventilation nozzle is provided for the interior of a motor vehicle comprising first and comprising second adjustable vanes for changing an air flow. The second vents are disposed downstream of the first vents and first and second vents are mounted so that they can be swiveled by means of a common control member in a casing of the nozzle. The control member is mounted swivelably downstream of the second vents. | 2011-09-08 |
