| 36th week of 2013 patent applcation highlights part 33 |
| Patent application number | Title | Published |
|---|
| 20130230959 | Method of Forming a Field Effect Transistor Having Source/Drain Material Over Insulative Material - In one implementation, a method of forming a field effect transistor includes etching an opening into source/drain area of a semiconductor substrate. The opening has a base comprising semiconductive material. After the etching, insulative material is formed within the opening over the semiconductive material base. The insulative material less than completely fills the opening and has a substantially uniform thickness across the opening. Semiconductive source/drain material is formed within the opening over the insulative material within the opening. A transistor gate is provided operatively proximate the semiconductive source/drain material. Other aspects and implementations are contemplated. | 2013-09-05 |
| 20130230960 | STRUCTURE FABRICATION METHOD - A structure fabrication method. A provided structure includes a gate dielectric region on the substrate and a gate electrode region on the gate dielectric region. Atoms are implanted in a top portion of the gate electrode region, which expands the top portion of the gate electrode in a direction parallel to a top surface of the gate dielectric region. After the atom implantation, a conformal dielectric layer is formed on top and side walls of the gate electrode region. A dielectric spacer layer, formed on the conformal dielectric layer, is etched such that only spacer portions of the dielectric spacer layer which are under the conformal dielectric layer remain, wherein for any point of the remaining spacer portions, a straight line through that point and parallel to a reference direction intersects the conformal dielectric layer. The reference direction is perpendicular to the top surface of the gate dielectric region. | 2013-09-05 |
| 20130230961 | SEMICONDUCTOR MEMORY DEVICES AND METHODS OF FORMING THE SAME - According to example embodiments of inventive concepts, method of forming a semiconductor memory devices includes sequentially forming a first mold layer, a first support layer, a second mold layer, and a second support layer on a substrate, forming lower electrodes penetrating the second support layer, the second mold layer, the first support layer, and the first mold layer on the substrate, patterning the second support layer to form a second support pattern including an opening, removing the second mold layer to expose portions of sidewalls of the lower electrodes, and etching the exposed sidewalls of the lower electrodes. | 2013-09-05 |
| 20130230962 | METHODS FOR FORMING NICKEL OXIDE FILMS FOR USE WITH RESISTIVE SWITCHING MEMORY DEVICES/US - Methods for forming a NiO film on a substrate for use with a resistive switching memory device are presenting including: preparing a nickel ion solution; receiving the substrate, where the substrate includes a bottom electrode, the bottom electrode utilized as a cathode; forming a Ni(OH) | 2013-09-05 |
| 20130230963 | Semiconductor Devices and Methods of Fabricating the Same - A semiconductor device includes capacitors connected in parallel. Electrode active portions and a discharge active portion are defined on a semiconductor substrate, and capping electrodes are disposed respectively on the electrode active portions. A capacitor-dielectric layer is disposed between each of the capping electrodes and each of the electrode active portions that overlap each other. A counter doped region is disposed in the discharge active portion. A lower interlayer dielectric covers the entire surface of the semiconductor substrate. Electrode contact plugs respectively contact the capping electrodes through the lower interlayer dielectric, and a discharge contact plug contacts the counter doped region through the lower interlayer dielectric. A lower interconnection is disposed on the lower interlayer dielectric and contacts the electrode contact plugs and the discharge contact plug. | 2013-09-05 |
| 20130230964 | MANUFACTURING METHOD FOR SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE - A method for manufacturing a semiconductor integrated circuit device includes the step of forming an SOI device region and a bulk device region on an SOI type semiconductor wafer. The method includes: removing a BOX layer and an SOI layer in a bulk device region; and thereafter forming an STI region in both the SOI device region and the bulk device region. In the method, the STI region in the SOI device region is formed to extend through the BOX layer. | 2013-09-05 |
| 20130230965 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE - According to one embodiment, a manufacturing method of a semiconductor device includes forming a lower mask film on a semiconductor substrate. The method includes forming a barrier film in a first area. The method includes forming an upper mask film. The method includes removing an upper mask member and leaving a lower mask member in the first area and removing the upper mask member and the lower mask member in the second area. The removing is performed by etching in a condition in which an etching rate of the upper mask member and an etching rate of the lower mask member are higher than that of the barrier member. The method includes forming a conductive film. The method includes selectively removing the conductive film by performing etching in a condition in which an etching rate of the conductive film is higher than that of the lower mask member. | 2013-09-05 |
| 20130230966 | PROCESSING METHOD FOR BUMP-INCLUDED DEVICE WAFER - A processing method for a bump-included device wafer which includes an adhesive providing step of providing an adhesive in an annular groove of a carrier wafer so that the adhesive projects from the upper surface of an annular projection of the carrier wafer; a wafer attaching step of attaching and fixing the front side of the device wafer through the adhesive to the front side of the carrier wafer so as to accommodate bumps in a recess of the carrier wafer after performing the adhesive providing step; and a thickness reducing step of grinding or polishing the back side of the device wafer to reduce the thickness of the device wafer to a predetermined thickness after performing the wafer attaching step. | 2013-09-05 |
| 20130230967 | MANUFACTURING PROCESS FOR A STACKED STRUCTURE COMPRISING A THIN LAYER BONDING TO A TARGET SUBSTRATE - A process for manufacturing a stacked structure comprising at least one thin layer bonded to a target substrate, in which a thin layer is formed by introduction gaseous species into an initial substrate, to form a weakened layer separating a film from the rest of the initial substrate, a first contact face of the thin layer is bonded to a face of an intermediate substrate by molecular adhesion, and the initial substrate is fractured at the weakened layer so as to expose a free face of the thin layer. The intermediate substrate is then removed in order to obtain the stacked structure. | 2013-09-05 |
| 20130230968 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 2013-09-05 |
| 20130230969 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 2013-09-05 |
| 20130230970 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 2013-09-05 |
| 20130230971 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma. | 2013-09-05 |
| 20130230972 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 2013-09-05 |
| 20130230973 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma. | 2013-09-05 |
| 20130230974 | Method and Apparatus for Plasma Dicing a Semi-conductor Wafer - The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma. | 2013-09-05 |
| 20130230975 | METHOD OF FORMING A GERMANIUM THIN FILM - A method of forming a germanium thin film on an underlying film includes forming a germanium seed layer by absorbing a germanium on a surface of the underlying film using an aminogermane-based gas, and forming a germanium thin film on the germanium seed layer using a germane-based gas. | 2013-09-05 |
| 20130230976 | FLAT PANEL DISPLAY DEVICE COMPRISING POLYSILICON THIN FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME - The present invention relates to a flat panel display device comprising a polysilicon thin film transistor and a method of manufacturing the same. Grain sizes of polysilicon grains formed in active channel regions of thin film transistors of a driving circuit portion and a pixel portion of the flat panel display device are different from each other. Further, the flat panel display device comprising P-type and N-type thin film transistors having different particle shapes from each other. | 2013-09-05 |
| 20130230977 | THIN CAPPED CHANNEL LAYERS OF SEMICONDUCTOR DEVICES AND METHODS OF FORMING THE SAME - Semiconductor devices and methods of forming the same. The method includes providing a semiconductor substrate having a channel layer over the substrate. A capping layer including silicon and having a first thickness is formed over the channel layer. The capping layer is partially oxidized to form an oxidized portion of the capping layer. The oxidized portion of the capping layer is removed to form a thinned capping layer having a second thickness less than the first thickness. | 2013-09-05 |
| 20130230978 | SELF-ALIGNED CONTACTS - A method of forming a gate structure with a self-aligned contact is provided and includes sequentially depositing a sacrificial layer and a secondary layer onto poly-Si disposed at a location of the gate structure, encapsulating the sacrificial layer, the secondary layer and the poly-Si, removing the sacrificial layer through openings formed in the secondary layer and forming silicide within at least the space formally occupied by the sacrificial layer. | 2013-09-05 |
| 20130230979 | METHOD OF FORMING A PATTERN IN A SEMICONDUCTOR DEVICE AND METHOD OF FORMING A GATE USING THE SAME - A method of forming a pattern in a semiconductor device is described. A substrate divided into cell and peripheral regions is provided, and an object layer is formed on a substrate. A buffer pattern is formed on the object layer in the cell region along a first direction. A spacer is formed along a sidewall of the buffer pattern in the cell region, and a hard mask layer remains on the object layer in the peripheral region. The buffer layer is removed, and the spacer is separated along a second direction different from the first direction, thereby forming a cell hard mask pattern. A peripheral hard mask pattern is formed in the peripheral region. A minute pattern is formed using the cell and peripheral hard mask patterns in the substrate. Therefore, a line width variation or an edge line roughness due to the photolithography process is minimized. | 2013-09-05 |
| 20130230980 | PHOTORESIST STRUCTURES HAVING RESISTANCE TO PEELING - A method of patterning a semiconductor device including dividing a layout into more than one pattern. The method further includes depositing a film stack on a semiconductor substrate, depositing a hard mask on the film stack, and depositing a first photoresist on the hard mask. The method further includes patterning the first photoresist using a first pattern of the more than one pattern. The method further includes etching the hard mask to transfer a design of the first pattern of the more than one pattern to the hard mask. The method further includes depositing a second photoresist over the etched hard mask and patterning the second photoresist using a second pattern of the more than one pattern. The method further includes etching portions of the film stack exposed by a combination of the etched hard mask and the second photoresist. | 2013-09-05 |
| 20130230981 | PATTERN FORMING METHOD - According to one embodiment, a pattern forming method comprises forming, on a metal layer and an insulating layer, an underlying layer the surface state of which is changeable by irradiation with a light ray, radiating the light ray to the underlying layer, thereby changing the surface state of a portion of the underlying layer above the metal layer, forming a block polymer layer on the underlying layer, forming, on the underlying layer, a directed self-assembly phase which contains a first polymer portion and a second polymer portion, the first polymer portion being positioned above the underlying layer portion the surface state of which has been changed by the radiation of the light ray, removing the first polymer portion, and the underlying layer portion underneath the first polymer portion to make a hole, and burying a conductive film into the hole. | 2013-09-05 |
| 20130230982 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method for manufacturing a semiconductor device includes forming a first copper film in a first recess and a second recess having a width narrower than the first recess formed in an insulating layer above a substrate while the substrate is heated to a reflow temperature at which copper flows. The method includes forming a second copper film having an impurity concentration higher than the first copper film above the first copper film with lower flowability than the forming the first copper film. | 2013-09-05 |
| 20130230983 | HYBRID INTERCONNECT STRUCTURE FOR PERFORMANCE IMPROVEMENT AND RELIABILITY ENHANCEMENT - A method of forming a hybrid interconnect structure including dielectric spacers is provided. The method includes forming at least one opening in a dielectric material utilizing a patterned hard mask located on a surface of the dielectric material as a mask, wherein an undercut is present beneath said patterned hard mask. Next, a dense dielectric spacer is formed in the at least one opening and at least partially on exposed sidewalls of the dielectric material. A diffusion barrier and a conductive material are then formed within the at least one opening. | 2013-09-05 |
| 20130230984 | METHOD TO ALTER SILICIDE PROPERTIES USING GCIB TREATMENT - A method of manufacturing a semiconductor device is described. The method comprises performing a gas cluster ion beam (GCIB) pre-treatment and/or post-treatment of at least a portion of a silicon-containing substrate during formation of a silicide region. | 2013-09-05 |
| 20130230985 | Three-Dimensional System-in-Package Architecture - A system and method for making semiconductor die connections with through-silicon vias (TSVs) are disclosed. A semiconductor die is manufactured with both via-first TSVs as well as via-last TSVs in order to establish low resistance paths for die connections between adjacent dies as well as for providing a low resistance path for feedthrough channels between multiple dies. | 2013-09-05 |
| 20130230986 | ADHESION IMPROVEMENT FOR LOW K DIELECTRICS TO CONDUCTIVE MATERIALS - Methods are provided for processing a substrate for depositing an adhesion layer between a conductive material and a dielectric layer. In one aspect, the invention provides a method for processing a substrate including positioning a substrate having a conductive material disposed thereon, introducing a reducing compound or a silicon based compound, exposing the conductive material to the reducing compound or the silicon based compound, and depositing a silicon carbide layer without breaking vacuum. | 2013-09-05 |
| 20130230987 | FLOWABLE OXIDE FILM WITH TUNABLE WET ETCH RATE - Provided herein are integration-compatible dielectric films and methods of depositing and modifying them. According to various embodiments, the methods can include deposition of flowable dielectric films targeting specific film properties and/or modification of those properties with an integration-compatible treatment process. In certain embodiments, methods of depositing and modifying flowable dielectric films having tunable wet etch rates and other properties are provided. Wet etch rates can be tuned during integration through am integration-compatible treatment process. Examples of treatment processes include plasma exposure and ultraviolet radiation exposure. | 2013-09-05 |
| 20130230988 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - According to one embodiment, a method for manufacturing a semiconductor device includes forming a plurality of second core films, the second core film having a first array portion, and a second array portion which is arranged so as to be spaced at a larger second space than the first space in the first direction from the first array portion, the second space being positioned above the loop portion. The method includes processing the second film to be processed below the first array portion into a second line and space pattern which includes a second line pattern extending in the second direction, and removing the second film to be processed below the second space and the loop portion of the first film to be processed, by an etching using the second spacer film as a mask. | 2013-09-05 |
| 20130230989 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE - A method for fabricating a semiconductor device is provided, wherein the method comprises steps as follows: A first conductive-type metal-oxide-semiconductor transistor and a second conductive-type metal-oxide-semiconductor transistor are firstly formed on a substrate. Subsequently, a first stress-inducing dielectric layer and a first capping layer are formed in sequence on the first conductive-type metal-oxide-semiconductor transistor; and then a second stress-inducing dielectric layer and a second capping layer are formed in sequence on the second conductive-type metal-oxide-semiconductor transistor. Next, the fist capping layer is removed. | 2013-09-05 |
| 20130230990 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - According to the invention, there is provided a plasma processing apparatus which can generate plasma stably and efficiently, and can efficiently treat all of the desired regions to be treated of a base material within a short period of time. Provided is a plasma processing apparatus including an opening portion having an opening width of 1 mm or more; a dielectric member that defines a circular chamber constituting a circular space which communicates the opening; a gas supply pipe that introduces gas into an inside of the circular chamber; a coil that is provided in a vicinity of the circular chamber; a high-frequency power supply that is connected to the coil; and a base material mounting table on which a base material is disposed near the opening. | 2013-09-05 |
| 20130230991 | PRINTED CIRCUIT BOARD CONNECTION ASSEMBLY - In at least one embodiment, a vehicle power module comprises a first printed circuit board (PCB) including a first plurality of electrical components for providing a first voltage and a second voltage. The vehicle power module further comprises a second PCB including a second plurality of electrical components, the second PCB being spaced away from the first printed circuit board and a first connector assembly being coupled to the first PCB and to the second PCB for providing the first voltage to the second PCB. The vehicle power module further comprises a second connector assembly being coupled to the first PCB and to the second PCB for providing the second voltage to the second PCB. The first connector assembly provides the first voltage of up to 14V and the second connector assembly provides the second voltage of 200V or greater. | 2013-09-05 |
| 20130230992 | PRINTED WIRING BOARD AND CONNECTOR, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A printed wiring board includes a board body that includes a signal line embedded at a predetermined wiring position and a through hole electrically connected to the signal line, and a connector that includes a connector plate including a connection terminal electrically connected to the signal line via the through hole, and electrically connects the connection terminal to the signal line by insertion of the connection terminal of the connector plate into the through hole in a direction of one of a front surface and a rear surface of the board body according to a wiring position of the signal line so that a transmission path of the connection terminal on a stub side is shorter than a transmission path of the connection terminal on an input and output side. | 2013-09-05 |
| 20130230993 | BLOCKOUT DEVICE FOR USB PORT - A blockout device for a USB port is disclosed. The blockout device prevents contamination, damage or misuse of the USB port when not in use. The blockout device includes a locking member, a body member and a shell. The locking member has a bottom and a top. The bottom of the locking member includes a plurality of teeth for engaging the USB port. The body member has a top, a bottom and sides defining a channel therein. The locking member is positioned within the channel of the body. The shell has a cavity that receives the locking member and the body member. The locking member and the body member are positioned within the cavity of the shell when the blockout device is installed in the USB port. | 2013-09-05 |
| 20130230994 | Lever Connector - A lever connector includes a housing, and a lever rotatably provided on the housing to be rotated in a locking direction to be disposed at a connection locking position. The lever includes support plate portions rotatably supported by both sides of the housing, the housing has a hump portion protruding in a direction intersecting with a rotating direction of the lever, the lever has a protrusion portion protruding in an opposite direction to the hump portion to be engaged with the hump portion, the hump portion has a tapered surface inclined in a protruding direction of the protrusion portion as extending in the locking direction from a top of the hump portion, and as the protrusion portion is slid along the tapered surface to be engaged with the tapered surface, the lever is applied with a rotating force in the locking direction. | 2013-09-05 |
| 20130230995 | ELECTRICAL CONNECTOR HEADER FOR AN LED-BASED LIGHT - An LED-based light configured for replacing a conventional fluorescent light in a fluorescent light fixture comprises: an LED circuit board including at least one LED; a power supply circuit board configured to supply power to the at least one LED; an end cap carrying at least one pin configured for connection to the fixture; a pin connector header including a first body retentively supporting at least one pin connecting lead and configured to engage the power supply circuit board such that the pin connecting lead is positioned to electrically connect the power supply circuit board and the pin; and a circuit connector header including a second body retentively supporting at least one circuit connecting lead and configured to engage the power supply circuit board such that the circuit connecting lead is positioned to electrically connect the power supply circuit board and the LED circuit board. | 2013-09-05 |
| 20130230996 | ELECTRICAL CONNECTOR ASSEMBLY - An electrical connector assembly includes a housing having a front end and a rear end and including housing channels extending axially from the front end to the rear end for holding a wire assembly. The connector assembly includes a stabilizer having a front end and a rear end. The stabilizer includes supports extending from the front end with support channels along a longitudinal axis of the stabilizer. The stabilizer is coupled to the rear end of the housing so that the support channels align with the housing channels to accept corresponding wire assemblies therein. A front retaining feature holds the stabilizer to the housing. A rear retaining feature holds the wire assemblies to the stabilizer. | 2013-09-05 |
| 20130230997 | POWER CABLE TERMINATION ARRANGEMENT - A power cable termination arrangement is disclosed, comprising an electrically conductive closed-end sleeve ( | 2013-09-05 |
| 20130230998 | MEMORY DEVICE LATCHING SYSTEM - A memory device latching system includes a processor. A plurality of memory devices are coupled to the processor through respective memory sockets. A first memory socket includes a first latch member having a first latch actuation member and defining a second latch member channel. A second memory socket includes a second latch member having a second latch actuation member and defining a first latch member channel. The first memory socket and the second memory socket are mounted to a circuit board such that the first latch end is located adjacent the second latch end, and the first latch member and the second latch member are operable to move to open positions such that at least a portion of the first latch actuation member is located in the first latch member channel and at least a portion of the second latch actuation member is located in the second latch member channel. | 2013-09-05 |
| 20130230999 | HOLDER LOCK STRUCTURE - A holder locking structure includes: a connector housing and a front holder. The connector housing includes: a fitting hood to which another connector is inserted and fit; a terminal accommodation accommodating a terminal fitting; a rib which is protruded into the fitting hood and is configured to prevent terminal connection fault of the terminal fitting; and a first locking portion configured to lock the front holder. The front holder is inserted in the fitting hood of the connector housing and is locked to the connector housing to prevent removal of the terminal fitting. The front holder is provided with a rib insertion hole to which the rib is inserted and a jig insertion hole into which a jig can be inserted to unlock the front holder from the connector housing. The rib insertion hole and the jig insertion hole are continuously provided. | 2013-09-05 |
| 20130231000 | DETONATOR ASSEMBLY - A detonator which has a printed circuit board with contact pads which are electrically connected to conductors by means of a compression-type fitting. | 2013-09-05 |
| 20130231001 | MEMORY CARD SOCKET AND HARD CAM FOR SAME - The memory card socket of the Present Disclosure can achieve a microminiaturized and ultraslim configuration of a memory card/micro SIM card socket, in regard to the formation of the movement zones having step differences in the guide groove in order to ensure movement of the end of the pin rod along the guide groove, wherein a heart-shaped guide groove is formed within the heart cam and the end of the pin rod is inserted into the guide groove, by reducing the total thickness of the heart cam, through a reduction in the number of step differences of the zones from at least three to one, and replacement of the eliminated step differences with sloped protrusions. | 2013-09-05 |
| 20130231002 | CONNECTOR - A connector comprises a receiving portion, a housing and an actuator. The housing has a lock portion protruding upward and a recess formed with a bottom portion. The actuator has a pressing portion. The actuator is supported by the housing so as to be pivotable between an open position and a close position. When the actuator is located at the open position, a plate-like or sheet-like object comprising an interposed portion and a locked portion, for example, a Flexible Printed Circuit (FPC), is inserted and received in the receiving portion. When the object is received in the receiving portion, the interposed portion is located above the recess, and the locked portion is located rearward of the lock portion. The pressing portion and the bottom portion interpose the interposed portion of the object when the actuator pivots from the open position to the close position. | 2013-09-05 |
| 20130231003 | CABLE ASSEMBLY WITH BETTER MECHANICAL PROPERTY - A cable assembly includes an electrical connector and a cable. The electrical connector defines a mating port and comprising contacts with contacting portions exposing to the mating port and connecting portion. The cable includes conductive wires connecting with the connecting portion of the contact. The cable comprises a main body and an enlarged portion connecting with the contacts. The main body is configured with a same diameter and the enlarged portion is configured with an enlarged diameter than the main portion. | 2013-09-05 |
| 20130231004 | RECEPTACLE CONNECTOR - A receptacle connector adapted for soldering with a circuit board and engaging with a plug connector includes an insulating housing, a plurality of terminals molded in the insulating housing, at least two first connecting elements, a second connecting element, a first waterproof board, a second waterproof board, and a shielding shell surrounding the insulating housing. The insulating housing has a top wall which defines at least two locating grooves for receiving the first connecting elements therein. The second connecting element has a base plate mounted to a bottom of the bottom wall. The first waterproof board is mounted to a top of the insulating housing. The second waterproof board is mounted under the second connecting element. A top face of the first waterproof board and a bottom face of the second waterproof board are coated with waterproof adhesive material to form a waterproof adhesive layer respectively. | 2013-09-05 |
| 20130231005 | Gasket for an EMI Connector | 2013-09-05 |
| 20130231006 | ELECTRICAL CONNECTOR INCORPORATING CURCUIT ELEMENTS - An electrical connector electrically connects a first printed circuit board and a second printed circuit board, where the electrical connector includes: (a) an insulative housing; (b) a plurality of signal conductors, with at least a portion of each of the plurality of signal conductors disposed within the insulative housing; (c) each of the plurality of signal conductors having a first contact end, a second contact end and an intermediate portion therebetween; and (d) a passive circuit element electrically connected to the intermediate portion of each of the plurality of signal conductors, where the passive circuit element is housed in an insulative package and includes at least a capacitor or an inductor. | 2013-09-05 |
| 20130231007 | CONNECTOR AND SWITCH - There is provided a connector including a connection terminal to be connected to another connection terminal of another connector; a fixed contact; a movable contact provided on one button end portion of a movable plate; a card made of an insulating material and being in contact with the movable plate; a button in contact with the card; a swing spring connected to the button; and a slide operating portion for controlling a contact between the fixed contact and the movable contact, wherein one of the fixed contact and the movable contact is connected to the connection terminal, the button is pushed down by moving the slide operating portion in one direction to thereby move the movable plate via the card, the connector is in a turn-on state when the fixed contact is in contact with the movable contact, the swing spring generates restoring force in a direction of separating a contact between the fixed contact and the movable contact, and the movable contact is separated from the fixed contact so as to be in a turn-off state the connector by moving the slide operating portion in another direction opposite to the one direction. | 2013-09-05 |
| 20130231008 | EDGE CONNECTOR FOR SHIELDED ADAPTER - Electrical connections that provide a highly manufacturable, well-shielded path from a cable to a printed circuit board. One example provides a path that includes a card and a connector. Conductors in a cable may be attached to a card. The card may be shielded with a ground plane on one or more sides and edges. The card may insert into a connector that may be attached to a printed circuit board. The connector may include a shield that may have a top portion that forms electrical contact with a ground plane on a top of a card inserted in the connector. The connector may have an opening for accepting the card that is defined by the top portion of the shield and a plurality of rows of contacts. The rows of contacts may include an outer row of ground contacts, and an inner row of signal contacts. | 2013-09-05 |
| 20130231009 | ELECTRICAL COMPONENT HAVING AN ARRAY OF ELECTRICAL CONTACTS - An electrical component including a substrate having opposite first and second sides and a plurality of vias extending into the substrate from the first side. The substrate has first conductive pads on the first side that are electrically connected to corresponding vias. The electrical component also includes a plurality of electrical contacts that are mounted to the substrate along the first side. Each of the electrical contacts includes a contact heel and a contact beam that extends from the corresponding contact heel and at least partially away from the first side. The contact heels are laser-welded to corresponding first conductive pads. | 2013-09-05 |
| 20130231010 | CONNECTOR MECHANISM - A connector mechanism includes a first casing, a second casing, a rotary cover, a circuit board, a socket, a base, a rotary fastener and a resilient component. The rotary cover is connected to the second casing in a rotable manner. The rotary fastener is pivoted to the base. The rotary fastener is pressed by the rotary cover when the rotary cover rotates to a close position. The rotary fastener fastens a plug when the rotary cover rotates to an open position so as not to press the rotary fastener and when the plug is inserted into the socket. The resilient component is connected to the rotary fastener for driving the rotary fastener to fasten the plug when the rotary cover rotates to the open position. | 2013-09-05 |
| 20130231011 | PLUG CONNECTOR WITH IMPROVED CONSTRUCTION - A plug style connector has an outer connector housing with an internal passage which accommodates a cable assembly. A plurality of multi-wire cables extend through a wire organizer that arranges the cables in a preselected arrangement. Exposed free ends of the conductors of the wires are terminated to multiple circuit boards which are separated in a preselected spacing by a spacer member. The spacer member and wire organizer have flat opposing surfaces that define boundaries of a body portion formed by the application of a hot melt to the cables, the hot melt adheres to the wire organizer and the spacer to hold the cable wires and their associated circuit boards in place for correct insertion into the connector housing. | 2013-09-05 |
| 20130231012 | Crimping Sleeve for Crimped Connections - The invention relates to a crimping sleeve comprising a base part and at least two deformable crimping blades for producing a crimped connection to a cable, wherein the crimping blades each comprise a first region connected to the base part, a second region, and a middle region disposed between the first and the second regions, and wherein the base part comprises a greater thickness than the middle region of the crimping blades, the first region tapers down from the base part toward the middle region at least on a first side and the second region further tapers down from the middle region, starting at least on a second side opposite the first side, said sleeve thereby being equally suitable for cables having different cross sections for producing a reliable connection between the cables and crimping sleeve. The invention further relates to a connecting element having such a crimping sleeve. | 2013-09-05 |
| 20130231013 | CRIMPING TERMINAL - A first member including an electric connection portion and a second member including an electric wire connecting portion are joined together. The first member and the second member are made of dissimilar metal materials. Joined portions of the first member and the second member are covered with a resin mold portion. | 2013-09-05 |
| 20130231014 | Paddleboard & Process - A paddleboard ( | 2013-09-05 |
| 20130231015 | BUOY - A buoy includes a turret coupled to a buoyant body using a bearing assembly; a deckhouse disposed on the buoyant body; and a bearing retainer configured to retain the bearing assembly and to releasably attach to the turret. The buoy may also include a locking mechanism having an inner opening in the turret, an outer opening in the buoyant body, and a locking member configured for insertion through the inner and outer openings. In one embodiment, the inner opening is out of alignment with the outer opening during operation of the buoy. The buoy may further include a detachable cover on the deckhouse, wherein the cover is configured to attach to the bearing retainer. | 2013-09-05 |
| 20130231016 | INFLATABLE DEVICE CAPABLE OF GLIDING, IN PARTICULAR OVER WATER - The invention relates to an inflatable device capable of acting as a glide medium for at least one person, which can in particular be used for bodyboard devices for gliding over water or snow. The device includes at least one first bag made of a flexible material, having a means for feeding a fluid therein and capable of being inflated by said fluid, at least one stabilization means connected to the first bag and capable of being arranged between or rigidly connected to the upper portion of the legs of a person, and means for positioning the hands, preferably arranged on the first bag. Thus, the proper stabilization of the device beneath the person during a gliding phase is ensured. | 2013-09-05 |
| 20130231017 | PREPREGS BASED ON A STORAGE-STABLE REACTIVE OR HIGHLY REACTIVE POLYURETHANE COMPOSITION - The invention relates to prepregs based on a storage-stable reactive or highly reactive polyurethane composition for producing composite components having visible carbon fibre fabrics or scrims. | 2013-09-05 |
| 20130231018 | PREPREGS FOR USE IN BUILDING LAY-UPS OF COMPOSITE MATERIALS - A scrim-reinforced prepreg assembly for use in building low-porosity lay-ups. The assembly includes a prepreg that is composed of a fibrous reinforcement and a heat-curable resin mixture, the prepreg having suitable viscosity and sufficient tackiness to hold a scrim which is adhered to the prepreg by applying light pressure. The scrim is impressed onto the prepreg to such a degree, that less than half of the circumference of the scrim strands becomes coated by the heat-curable resin mixture. | 2013-09-05 |
| 20130231019 | Asymmetrical Concrete Backerboard - The present invention is a backerboard having a fiberglass mesh on one side, and a impervious reinforcement membrane on the other side. The backerboard incorporates a low density, high compressive strength concrete core having an upper principal surface and a lower principal surface. The upper principal surface of the core is covered by a fiberglass mesh reinforcement layer, itself covered and bonded to the core by a thin layer of Portland cement. The lower principal surface of the backerboard is covered with a high tensile strength, impervious reinforcement membrane. | 2013-09-05 |
| 20130231020 | NOVEL AQUEOUS DISPERSION OF POLYTETRAFLUOROETHYLENE - Disclosed are aqueous dispersions of fluoropolymer comprising from 45 to 70 weight % of non-melt-processible polytetrafluoroethylene (PTFE) particles, and based on the weight of the PTFE particles, from 1 to 15 weight % of nonionic surfactants, and 1-10 weight % of a water soluble alkaline earth metal salt, or 0.1-10 weight % of a colloidal silica. Also disclosed are compositions comprising the aqueous PTFE dispersions of this invention and their uses for coating applications with improved critical cracking thickness. | 2013-09-05 |
| 20130231021 | Phosphoric Acid Resistant Polymaleimide Prepolymer Compositions - The present invention relates to a phosphoric acid resistant advanced polymaleimide prepolymer composition including a polymaleimide prepolymer resulting from the advancement reaction of a polyimide and an alkenylphenol, alkenylphenol ether or mixture thereof in the presence of an amine catalyst; a solvent and a heteropolyacid. The phosphoric acid resistant advanced polymaleimide prepolymer composition may be used in various applications such as prepregs, laminates, printed circuit boards, castings, composites, moulded articles, adhesives and coatings. | 2013-09-05 |
| 20130231022 | PREPREGS BASED ON A STORAGE-STABLE REACTIVE OR HIGHLY REACTIVE POLYURETHANE COMPOSITION - The invention relates to prepregs coloured with pigment or dye preparations and based on a storage-stable reactive or highly reactive polyurethane composition. | 2013-09-05 |
| 20130231023 | FORMALDEHYDE-FREE PROTEINACEOUS BINDER COMPOSITIONS - Binder compositions are described, where the compositions include a protein, a first crosslinking compound that includes a carbohydrate, and a second crosslinking compound that includes two or more primary amine groups. The first and second crosslinking compounds may be individually crosslinkable with each other and with the protein. Also described are fiber products that may include inorganic or organic fibers and a cured thermoset binder prepared from a protein and at least two crosslinking compounds. Additionally, methods of making fiber products are described that include providing inorganic or organic fibers, and applying a liquid binder composition to the fibers to form a fiber-binder amalgam. The liquid binder composition may include a protein and at least two crosslinking compounds that include a carbohydrate and an organic amine with two or more primary amines. The amalgam may be heated to a curing temperature to form the fiber product. | 2013-09-05 |
| 20130231024 | SYSTEMS AND METHODS FOR REDUCED CRIMP CARBON FIBER HELICAL FABRIC - Systems and methods for weaving helical carbon fabrics with minimum fiber crimp are provided herein. In various embodiments, small denier natural or synthetic yarns are used in the warp direction to interlace the carbon fiber wefts with minimum deformation. Specific weave designs are used in combination with the small denier yarn to maintain the primary carbon fiber weft and warp un-crimped. | 2013-09-05 |
| 20130231025 | METHOD AND DEVICE FOR MANUFACTURING LIQUID CRYSTAL PANEL - The present invention discloses a method and a device for manufacturing liquid crystal panel. The method includes: after introducing liquid crystal between two substrates, subjecting the substrates to edge cutting in order to expose a signal pad; supplying an inspection signal to the signal pad to effect inspection, wherein if a defect is found, then repair of the defect is carried out; and after the inspection or after the repair, applying first alignment to have monomers of the liquid crystal polymerized to form pre-tilt angle. The present invention carries out inspection of substrates before an alignment operation is performed to have monomers of liquid crystal polymerized to show pre-tilt angle and if no defect is identified or if defects are identified but are subjected to repairing by a repair process to ensure that no defect exists in the substrates, the liquid crystal monomers are processed to show the pre-tilt angle. | 2013-09-05 |
| 20130231026 | STRAW SYSTEM - An amusement device is disclosed that uses fluid flow through a straw to set in motion an impeller. The impeller may rotate an axle that may be attached to a novelty object outside the straw shaft. Rotation of the axle may cause the novelty object to move as the straw is used. | 2013-09-05 |
| 20130231027 | ACTION TOY AND PLAYSET - In combination a toy figure and an apparatus for launching the toy figure from the apparatus is provided, the toy figure having: a main body portion; a pair of leg members extending from the main body portion, wherein each of the pair of leg members has an enlarged rounded feature at a distal end and wherein the enlarged rounded feature is provided with a mass for self-righting the toy figure into a vertical orientation regardless of the initial orientation of the toy figure; and wherein the apparatus is a vehicle having a deployable launching mechanism configured to receive the toy figure therein. | 2013-09-05 |
| 20130231028 | TOY VEHICLE TRACK SET - A track set for toy vehicles is provided, the track set having: a first track circuit having a loop section and a figure-8 track circuit; a second track circuit having a loop section and figure-8 track circuit, wherein the figure-8 track circuits are overlaid on each other to provide multiple intersections between each figure-8 track circuit, wherein the toy vehicles travelling on the figure-8 track circuits can crash into each other as they travel along the figure-8 track circuits; and a mechanism for propelling the vehicles along the first track circuit and the second track circuit. | 2013-09-05 |
| 20130231029 | Interactive Toy - In an embodiment of the present invention, an interactive remote controlled toy ( | 2013-09-05 |
| 20130231030 | DEVICES, SYSTEMS, AND METHODS FOR RECOVERY AND RECYCLING OF CARPET COMPONENTS - Devices, systems and methods for the recycling and recovery of carpet are disclosed herein. Devices, systems and methods for disassembling carpet into the various components used for carpet construction by abrasive removal and separation of components are also disclosed herein. | 2013-09-05 |
| 20130231031 | Stepped Retaining Ring - A two part retaining ring is described. A rigid upper portion has an annular recess along its inner diameter. An annular wearable lower portion has an inner diameter, an annular extension defined by the inner diameter and a vertical wall that is perpendicular to a surface of the second portion and opposite to the inner diameter. The annular extension fits into the annular recess of the annular first portion. A bonding material is on the vertical wall of the annular second portion. | 2013-09-05 |
| 20130231032 | POLISHING PAD WITH TWO-SECTION WINDOW HAVING RECESS - A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves. | 2013-09-05 |
| 20130231033 | Attachment Type Sharpening Tool - A sharpening tool includes a main base ( | 2013-09-05 |
| 20130231034 | METHOD AND APPARATUS FOR PROCESSING LIVESTOCK CARCASSES TO DESTROY MICROORGANISMS - An apparatus and method are provided to clean and sanitize livestock carcasses. The apparatus includes a livestock carcass travel path, at least one liquid dispenser configured to dispense liquid to the carcass travel path, and at least one treatment electrode. A control circuit is configured to cause an alternating electric field to be generated between the electrode and a surface of a carcass along the travel path, through the dispensed liquid. | 2013-09-05 |
| 20130231035 | ACTIVE AIR FLOW CONTROL IN AIRCRAFT - An active airflow control system for an aircraft includes an air conditioning system, an air conditioning controller configured to control operation of the air conditioning system, a plurality of flow control devices in fluid communication with the air conditioning system and in signal communication with the air conditioning controller, wherein the plurality of flow control devices are configured to increase and decrease an amount of air flowing therethrough in response to receiving a controlling signal from the air conditioning controller, and a plurality of zones in fluid communication with the air conditioning system, wherein each zone of the plurality of zones is a pressurized zone of the aircraft, and wherein each zone of the plurality of zones is in fluid communication with at least one flow control device of the plurality of flow control devices. | 2013-09-05 |
| 20130231036 | AIR CONDITIONING SYSTEM FOR MOTOR VEHICLES - An air conditioning system for motor vehicles includes an air conditioner case, a cold air path through which a cold air flows, a warm air path through which a warm air flows, a temperature control door arranged to swing between the cold air path and the warm air path so as to control an opening degree of the cold air path and an opening degree of the warm air path, a defrost vent arranged to discharge the cold air and the warm air toward an upper region of a vehicle room, a bypass duct arranged to bypass a part of the warm air toward the defrost vent, the bypass duct including an inlet aligned with the warm air path and an outlet aligned with the defrost vent, and a cold air introducing portion arranged in at least one of the inlet and the outlet of the bypass duct. | 2013-09-05 |
| 20130231037 | INTAKE STRUCTURE OF EXTERNAL AIR FOR VEHICLE - An intake structure of external air for a vehicle may include a car body panel connected to a cowl top cover at an upper end thereof, wherein an external air intake space may be formed in a width direction of the vehicle between the car body panel and the cowl top cover, and wherein the car body panel guides the external air flowing into the external air intake space from the cowl top cover to an interior of the vehicle, a separator covering an engine to form an engine compartment therein, wherein the separator has a center portion blocking a front of the external air intake space from the engine compartment, and a shield panel that may be connected to the separator to block the engine compartment from the external air intake space together with the separator. | 2013-09-05 |
| 20130231038 | CONTAINER OF CLOUD COMPUTING SYSTEM - A container of a cloud computing system includes a housing defining a chamber, an airflow inlet and an airflow outlet, a fan fixed in the airflow inlet, and a dust gauze covering the airflow inlet. The airflow inlet and the airflow outlet both communicate with the chamber. The fan is capable of rotating clockwise or counter-clockwise by a controlling device. During the fan rotates clockwise, the fan draws exterior air into the chamber through the airflow inlet, and then air vents out of the chamber via the airflow outlet. During the fan rotates counter-clockwise, the fan draws the air in the chamber blow to the dust gauze via the airflow inlet to clear dust on the dust gauze. | 2013-09-05 |
| 20130231039 | COOLING STRUCTURE OF ELECTRONIC DEVICE - A cooling structure is designed for an electronic device including a plurality of fans causing cooling air, a plurality of electronic parts serving as heat sources, and a plurality of power source units, all of which are arranged inside the housing. The electronic parts are positioned in the downstream side of cooling air produced by the fans, while the power source units are positioned in the further downstream side of cooling air compared to the electronic parts. The power source units are spaced out from each other in the perpendicular direction to the cooling airflow direction of cooling air such that the power source units do not overlap with the electronic parts in the cooling airflow direction in plan view. The cooling structure prevents cooling air, which is temporarily warmed by the electronic parts, from directly flowing into the power source units, thus improving a cooling effect. | 2013-09-05 |
| 20130231040 | Temperature-Controlled Enclosures And Temperature Control System Using The Same - A temperature chamber in which a device is tested is connected to a temperature-controlled air source for controlling temperature of the chamber. The temperature chamber includes thermal insulation formed on side surfaces of the chamber. A universal manifold adaptor for directing the temperature-controlled air directly to a device being tested is connected to the chamber. The temperature chamber also includes an exhaust system. A self-closing cable feed-through module is connected to an outer surface of the chamber. The feed-through module includes a first portion and a second portion, wherein cables are fed through the first and second portions into the chamber in a first position and the first and second portions form a leak tight seal around the cables in a second position. | 2013-09-05 |
| 20130231041 | AIR GUIDING APPARATUS - An air guiding apparatus includes a frame, a rotating structure, and a plurality of louvers. The frame defines an opening. The rotating structure is received in the opening and rotatable relative to the frame about an axis. The plurality of louvers are attached to the rotating structure and are rotatable relative to the rotating structure about a direction, which is substantially perpendicular to the axis. | 2013-09-05 |
| 20130231042 | VENT PLATE WITH WEATHER BARRIER FOR AN EXTERIOR WALL - A vent plate for an exterior wall of a building includes a plate body that has a first face facing the exterior wall, a second face facing away from the exterior wall, and one or more holes extending between the first face and the second face for receiving piping. One or more seals are positioned about the one or more holes and seal against the outer diameter of the piping received in the holes. | 2013-09-05 |
| 20130231043 | METHOD AND SYSTEM FOR TRANSMITTING AND/OR RECEIVING ADVERTISMENT AND DATA CONTENTS AND PROVIDING MULTIPLE VALUE ADDED SERVICES ON ELECTRONIC COMMUNICATION DEVICE WITH A DISPLAY MECHANISEM - The various embodiments herein provide a method and system for sending data content and advertising and providing multiple value added services on a user screen of a mobile communication device and any electronic portable/non portable device. The system and method comprising installing software application on the user's communication device for sending and/or receiving content data; one or more Application Server that provides business logic and respond to all requests; one or more Application Programmable Interface Server; one or more Community Server that integrate with service provider; one or more Web Server where all connections and requests terminate and which forwards all requests to the application server; one or more Database Server; one or more Statistics Server; one or more Administration Server which administrations can use to upload, schedule, plan, and provision content and services and view logs of all transactions performed in the system. | 2013-09-05 |
| 20130231044 | MULTIMEDIA DATA DISTRIBUTION SYSTEM AND OPERATING METHOD THEREOF - A multimedia data distribution system is provided. The multimedia data distribution system comprises a multimedia controller and at least a distribution zone. A distribution zone has a zone hub and zero to finite number of zone media player. The zone hub receives multimedia data from a multimedia content source through an out-of-zone data path and then synchronously redistributes multimedia contents to rest of zone media players via in-zone data paths. A multimedia controller utilizes out-of-zone control path to transmit control message to a zone hub, which in turn relays the control messages to addressed zone media player(s) via in-zone control paths. The zone hub of a distribution zone receives status updates from individual zone media players via in-zone status update paths, aggregates them, and then relays to the multimedia controller via the out-of-zone status update path. While out-of-zone data, control, and status update paths are setting up based on Wi-Fi connections to an infrastructure AP or a Hotspot, all of the in-zone paths are established on Wi-Fi Direct peer-to-peer connections. | 2013-09-05 |
| 20130231045 | SCALABLE MILLIMETER-WAVE WIRELESS NETWORK ARCHITECTURE FOR HIGH USER CONCENTRATIONS - Technologies are presented for an architecture and infrastructure for a scalable, very high bandwidth, wireless network that can accommodate arbitrarily high geographic concentrations of high-bandwidth users. The architecture may include a network of highly localized service areas that communicate with a central access point through a hierarchy of aggregate-and-relay stages. Communications may be mediated by a hybrid combination of ad-hoc and infrastructure-network features that are supported separately within the framework of a standardized system, for example in the 60 GHz (millimeter-wave) band. The infrastructure may include a dense mesh of fixed control points that communicate over lossy, high-bandwidth, directional channels permitting dense spatial frequency sharing and providing for highly localized coverage, thereby enabling high user densities | 2013-09-05 |
| 20130231046 | Electronic Device With Shared Near Field Communications and Sensor Structures - An electronic device may have electrical components such as sensors. A sensor may have sensor circuitry that gathers sensor data using a conductive structure. The sensor may be a touch sensor that uses the conductive structure to form a capacitive touch sensor electrode or may be a fingerprint sensor that uses the conductive structure with a fingerprint electrode array to handle fingerprint sensor signals. Near field communications circuitry may be included in an electronic device. When operated in a sensor mode, the sensor circuitry may use the conductive structure to gather a fingerprint or other sensor data. When operated in near field communications mode, the near field communications circuitry can use the conductive structure to transmit and receive capacitively coupled or inductively coupled near field communications signals. A fingerprint sensor may have optical structures that communicate with external equipment. | 2013-09-05 |
| 20130231047 | COMMUNICATION APPARATUS AND CONTROL METHOD THEREOF - A communication apparatus includes a wireless communication unit which makes a wireless communication with a wireless apparatus, and is configured to read out data from a memory included in the wireless communication unit when electric power is not supplied from a power supply to the wireless communication unit. The communication apparatus specifies storage target data to be stored in the memory from those managed by the communication apparatus. The communication apparatus then saves the specified storage target data in the memory. The communication apparatus reads out data, which is saved in the memory, by the wireless communication unit in a state in which electric power is not supplied from the power supply to the wireless communication unit, and outputs the readout data to the wireless apparatus. | 2013-09-05 |
| 20130231048 | DEVICE WITH AN EEPROM HAVING BOTH A NEAR FIELD COMMUNICATION INTERFACE AND A SECOND INTERFACE - A peripheral device and a method for programming the read/writeable memory of the RFID circuitry by communications between either RF antenna or bus communications port controller interface or both. In the peripheral device, an EEPROM, bus communications controller interface, NFC interface, antenna, and logic controller operate to receive and transmit configuration and calibration data between a wireless personal area network circuit and an external wireless personal area network enabled device. The dual interfaced EEPROM is operable to share or partition its EEPROM between an NFC interface and a bus communications controller. | 2013-09-05 |
| 20130231049 | METHOD AND APPARATUS TO DYNAMICALLY ENABLE AND CONTROL COMMUNICATION LINK OPTIMIZATIONS ON A COMMUNICATION DEVICE - Embodiment methods and systems include external hardware that can be fitted to a wireless communication device to optimize group communications on the wireless devices. The wireless device may be coupled to an external case configured with a physical button that enables group communication such as push-to-talk and other push-to-experience capabilities. Optimizations for push-to-talk communication may be implemented in a push-to-talk mode in response to detecting connection to the external hardware. Signaling between the external case and the wireless device allows detection of the switch to (or from) push-to-talk mode when a user depresses (or releases) the hard key. | 2013-09-05 |
| 20130231050 | INFORMATION PROCESSING DEVICE, COMMUNICATION SYSTEM, AND CHANNEL SETTING METHOD - There is provided an information processing device including a determination unit that, when in each of a plurality of spaces short-range wireless communication is simultaneously performed in each space using a plurality of wireless communication devices, determines a channel to be used in each space for each space based on a predetermined rule, and a control unit that performs control of setting the channel determined in accordance with the space in which the wireless communication device is used in the wireless communication device. | 2013-09-05 |
| 20130231051 | INFORMATION PROCESSING APPARATUS, CONTROL METHOD OF INFORMATION PROCESSING APPARATUS, AND STORAGE MEDIUM STORING PROGRAM - In an information processing apparatus capable of executing a first wireless communication method and a second wireless communication method having a communication range wider than that of the first wireless communication method, an apparatus to be caused to execute predetermined processing is searched for using both the first wireless communication method and the second wireless communication method. When a common apparatus has been found by both the first wireless communication method and the second wireless communication method, the common apparatus is decided as the apparatus to be caused to execute the predetermined processing by the second wireless communication method. | 2013-09-05 |
| 20130231052 | METHOD OF ESTABLISHING COMMUNICATION BETWEEN DEVICES IN A VEHICLE - A method and system for establishing secure short range wireless communication between devices in a vehicle. The method involves obtaining a vehicle identifier associated with the vehicle and a module identifier associated with a vehicle module. Then, the method determines a secure pin number for the vehicle module and a similar pin for a vehicle telematics unit. Once the secure pin number is determined at both devices then the devices can communicate via short range wireless communication in a secure manner using the secure pin number. | 2013-09-05 |
| 20130231053 | Automatic Power-Off of Bluetooth Device from Linked Device - Methods and systems for powering-off a Bluetooth device from a linked device are provided. A device can transmit a Bluetooth signal to a linked device to instruct the linked device to power-off. In this manner, the user need only turn off one device manually which results in all linked devices being powered off. This process can be initiated by a user through a device directly linked with the device to be powered-off or through a device that is indirectly connected, through one or more Bluetooth networks, with the device to be powered-off. This process can also be automatically initiated by a device when a set of predetermined conditions exist. Once instructed to do so, a device can initiate a predetermined power-off process which can involve terminating any ongoing functions and turning off various subsystems. In accordance with the present invention, a user can initiate a power-off of all the devices on a Bluetooth network through a single device. | 2013-09-05 |
| 20130231054 | Establishing Directed Communication Based Upon Physical Interaction Between Two Devices - A method and system for establishing wireless communication with a device is provided. Aspects of an exemplary embodiment include detecting, at a first device, a physical interaction involving the first device and a second device. Further, the first device identifies a network address usable for establishing communication between the first device and the second device, the network address identified based on information associated with the detected physical interaction. Further, a role of the first device is determined, wherein the role of the first device is an initiator device. Further, based on the role of the first device as the initiator device, the network address is wirelessly provided to the second device. Further, content is wirelessly transferred between the first device and the second device using the network address. | 2013-09-05 |
| 20130231055 | MOBILE DEVICE CONTROL WITH EXTERNAL DEVICE - A mobile arrangement ( | 2013-09-05 |
| 20130231056 | COMMUNICATION SYSTEM AND COMMUNICATION METHOD - The present invention relates to a communication system and a communication method. The communication system includes a micro IC card, a radio frequency (RF) card sleeve and a multi-frequency card reader. The micro IC card is used to communicate with the RF card sleeve through a contact interface. The multi-frequency card reader is used to perform an RF communication with the RF card sleeve. The communication method includes exchanging data with a micro IC card through an RF channel; and the micro IC card sleeve exchanges data with the micro IC card by a contact communication. The communication system and method provide operators a working environment to adapt cards with different frequencies. Thus, telecommunication operators and financial service providers are able to independently issue their own cards, which lowers difficulties of promoting mobile payment services, and aids to boost the popularization and applications of the mobile payment services. | 2013-09-05 |
| 20130231057 | STATIONARY ANALOG FM-RECEIVER FOR RECEIVING ANALOG WIRELESSLY TRANSMITTED FM-AUDIO SIGNALS FROM AT LEAST ONE MOBILE UNIT AND A METHOD OF RECEIVING AN ANALOG FREQUENCY-MODULATED AUDIO SIGNAL FROM A MOBILE ANALOG FM-TRANSMITTER - There is provided a stationary analog FM-receiver for receiving analog wirelessly transmitted FM-audio signals from at least one mobile unit. The frequency has a frequency demodulator (FDM) for demodulating the received FM-audio signals. The FM-receiver further has a link quality unit (LQE) for determining a link quality for the wireless transmission of the FM-audio signals. The link quality unit (LQE) has a high-pass filter (HP) with a limit frequency for high-pass filtration of an output signal of the frequency demodulator (FDM) and a power determining unit (SE, LBE) for determining the power of the output signal of the high-pass filter (HP). The limit frequency of the high-pass filter (HP) lies in the region of between 20 kHz and 80 kHz, in particular in the region of between 50 kHz and 80 kHz. | 2013-09-05 |
| 20130231058 | BEAMFORMING - A method implemented in a wireless communications system is disclosed. The method includes determining a first candidate set of transmit beams for a wireless transmitter having a transmit antenna array and a second candidate set of receive beams for a wireless receiver having a receive antenna array, transmitting, from the wireless transmitter, each transmit beam in the first candidate set, and applying, at the wireless receiver, receive beams in the second candidate set to receive said each transmit beam in the first candidate set. Other methods, systems, and apparatuses also are disclosed. | 2013-09-05 |
