35th week of 2021 patent applcation highlights part 58 |
Patent application number | Title | Published |
20210272823 | LIGHT IRRADIATION TYPE HEAT TREATMENT METHOD | 2021-09-02 |
20210272824 | APPARATUS FOR SIMULTANEOUSLY TRANSFERRING MICRO-DEVICES TO TARGET OBJECT | 2021-09-02 |
20210272825 | RECONFIGURABLE MAINFRAME WITH REPLACEABLE INTERFACE PLATE | 2021-09-02 |
20210272826 | DEVELOPMENT PROCESSING APPARATUS AND DEVELOPMENT PROCESSING METHOD | 2021-09-02 |
20210272827 | HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS | 2021-09-02 |
20210272828 | DYNAMIC TEMPERATURE CONTROL OF SUBSTRATE SUPPORT IN SUBSTRATE PROCESSING SYSTEM | 2021-09-02 |
20210272829 | SUBSTRATE POSITIONING DEVICE WITH REMOTE TEMPERATURE SENSOR | 2021-09-02 |
20210272830 | STORAGE SHELF, AND METHOD FOR INSTALLING STORAGE SHELF | 2021-09-02 |
20210272831 | TRANSPORT SYSTEM, ASSOCIATED MOVABLE CONTAINER AND METHOD | 2021-09-02 |
20210272832 | REDUCED FOOTPRINT WAFER HANDLING PLATFORM | 2021-09-02 |
20210272833 | MEASUREMENT SYSTEM, SUBSTRATE PROCESSING SYSTEM, AND DEVICE MANUFACTURING METHOD | 2021-09-02 |
20210272834 | ELECTROSTATIC CHUCK MANUFACTURING METHOD, ELECTROSTATIC CHUCK, AND SUBSTRATE PROCESSING APPARATUS | 2021-09-02 |
20210272835 | SEMICONDUCTOR DEVICE AND STRUCTURE | 2021-09-02 |
20210272836 | BONDING APPARATUS, BONDING SYSTEM, BONDING METHOD AND RECORDING MEDIUM | 2021-09-02 |
20210272837 | WAFER FRAME SORTER AND STOCKER | 2021-09-02 |
20210272838 | SUBSTRATE PROCESSING APPARATUS AND METHOD OF PROCESSING A SUBSTRATE | 2021-09-02 |
20210272839 | Support Structure for Thermal Processing Systems | 2021-09-02 |
20210272840 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-09-02 |
20210272841 | SEMICONDUCTOR DEVICE | 2021-09-02 |
20210272842 | TRANSISTOR DEVICE WITH SINKER CONTACTS AND METHODS FOR MANUFACTURING THE SAME | 2021-09-02 |
20210272843 | Power Semiconductor Device with p-contact | 2021-09-02 |
20210272844 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-09-02 |
20210272845 | METHODS OF FORMING MICROELECTRONIC DEVICES | 2021-09-02 |
20210272846 | DISPOSING PROTECTIVE COVER FILM AND UNDERFILL LAYER OVER SINGULATED INTEGRATED CIRCUIT DICE FOR PROTECTION DURING INTEGRATED CIRCUIT PROCESSING | 2021-09-02 |
20210272847 | JET ABLATION DIE SINGULATION SYSTEMS AND RELATED METHODS | 2021-09-02 |
20210272848 | Cut EPI Process and Structures | 2021-09-02 |
20210272849 | Wrap-Around Contact on FinFET | 2021-09-02 |
20210272850 | METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE | 2021-09-02 |
20210272851 | IC STRUCTURE WITH SHORT CHANNEL GATE STRUCTURE HAVING SHORTER GATE HEIGHT THAN LONG CHANNEL GATE STRUCTURE | 2021-09-02 |
20210272852 | Gate Structure and Method | 2021-09-02 |
20210272853 | Integrated Circuits with Buried Interconnect Conductors | 2021-09-02 |
20210272854 | FABRICATION OF A VERTICAL FIN FIELD EFFECT TRANSISTOR WITH REDUCED DIMENSIONAL VARIATIONS | 2021-09-02 |
20210272855 | Dual Silicide Structure and Methods Thereof | 2021-09-02 |
20210272856 | MULTI-GATE DEVICE AND RELATED METHODS | 2021-09-02 |
20210272857 | STACKED VERTICAL TUNNEL FET METHODS | 2021-09-02 |
20210272858 | Transmission-Based Temperature Measurement of a Workpiece in a Thermal Processing System | 2021-09-02 |
20210272859 | ARRAY SUBSTRATE AND FABRICATION METHOD THEREOF, AND DISPLAY DEVICE | 2021-09-02 |
20210272860 | DISPLAY DEVICE | 2021-09-02 |
20210272861 | Protector Cap for Package with Thermal Interface Material | 2021-09-02 |
20210272862 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-09-02 |
20210272863 | FLUIDIC FLOW CHANNEL OVER ACTIVE SURFACE OF A DIE | 2021-09-02 |
20210272864 | MANUFACTURING METHOD OF CARRIER FOR SEMICONDUCTOR CHIP MOUNTING THEREON | 2021-09-02 |
20210272865 | METAL BASE SUBSTRATE | 2021-09-02 |
20210272866 | SEMICONDUCTOR PACKAGE STRUCTURE | 2021-09-02 |
20210272867 | SILICON CARBIDE SEMICONDUCTOR DEVICE | 2021-09-02 |
20210272868 | ELECTRONIC ELEMENT MOUNTING SUBSTRATE, ELECTRONIC DEVICE, AND ELECTRONIC MODULE | 2021-09-02 |
20210272869 | METHOD FOR FORMING SEMICONDUCTOR PACKAGE | 2021-09-02 |
20210272870 | APPARATUS AND METHOD FOR DISSIPATING HEAT IN MULTIPLE SEMICONDUCTOR DEVICE MODULES | 2021-09-02 |
20210272871 | INTEGRATED RADIATOR HAVING TEMPERATURE GRADIENT | 2021-09-02 |
20210272872 | THERMAL MANAGEMENT MATERIALS FOR SEMICONDUCTOR DEVICES, AND ASSOCIATED SYSTEMS AND METHODS | 2021-09-02 |
20210272873 | METHOD, APPARATUS, AND ASSEMBLY FOR THERMALLY CONNECTING LAYERS | 2021-09-02 |
20210272874 | POWER MODULE HOUSING WITH IMPROVED PROTRUSION DESIGN | 2021-09-02 |
20210272875 | Integrated Circuit Package and Method | 2021-09-02 |
20210272876 | TRANSISTOR HEAT DISSIPATION MODULE AND ASSEMBLY METHOD THEREOF | 2021-09-02 |
20210272877 | SEMICONDUCTOR DEVICE INCLUDING HETEROJUNCTION BIPOLAR TRANSISTOR | 2021-09-02 |
20210272878 | HIGH THERMAL CONDUCTIVITY, HIGH MODULUS STRUCTURE WITHIN A MOLD MATERIAL LAYER OF AN INTEGRATED CIRCUIT PACKAGE | 2021-09-02 |
20210272879 | SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME | 2021-09-02 |
20210272880 | SEMICONDUCTOR PACKAGE INCLUDING COMPOSITE MOLDING STRUCTURE | 2021-09-02 |
20210272881 | EMBEDDED BRIDGE WITH THROUGH-SILICON VIAS | 2021-09-02 |
20210272882 | POWER MODULE | 2021-09-02 |
20210272883 | LEAD FRAME FOR HERMETIC RF CHIP PACKAGE EMBEDDED WITH IMPEDANCE MATCHING FUNCTION | 2021-09-02 |
20210272884 | METAL TAB FOR CHIP ASSEMBLY | 2021-09-02 |
20210272885 | INTERPOSER HEAT SPREADER | 2021-09-02 |
20210272886 | LAMINATE STACKED ON DIE FOR HIGH VOLTAGE ISOLATION CAPACITOR | 2021-09-02 |
20210272887 | SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES | 2021-09-02 |
20210272888 | HETEROGENEOUS FAN-OUT STRUCTURE AND METHOD OF MANUFACTURE | 2021-09-02 |
20210272889 | SYMMETRICAL SUBSTRATE FOR SEMICONDUCTOR PACKAGING | 2021-09-02 |
20210272890 | SEMICONDUCTOR MODULE | 2021-09-02 |
20210272891 | CONTINUOUS INTERCONNECTS BETWEEN HETEROGENEOUS MATERIALS | 2021-09-02 |
20210272892 | DIFFERENTIAL CROSSTALK SELF-CANCELATION IN STACKABLE STRUCTURES | 2021-09-02 |
20210272893 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2021-09-02 |
20210272894 | PACKAGE STRUCTURES AND METHOD OF FORMING THE SAME | 2021-09-02 |
20210272895 | SEMICONDUCTOR DEVICE INCLUDING RECESSED INTERCONNECT STRUCTURE | 2021-09-02 |
20210272896 | TECHNIQUES TO INHIBIT DELAMINATION FROM FLOWABLE GAP-FILL DIELECTRIC | 2021-09-02 |
20210272897 | PACKAGE STRUCTURE, PACKAGE-ON-PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-09-02 |
20210272898 | SEMICONDUCTOR PACKAGING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME | 2021-09-02 |
20210272899 | ANTI-FUSE STRUCTURE AND METHOD FOR FABRICATING SAME, AS WELL AS SEMICONDUCTOR DEVICE | 2021-09-02 |
20210272900 | VERTICAL MEMORY DEVICES | 2021-09-02 |
20210272901 | Via Structures | 2021-09-02 |
20210272902 | CONTACTS HAVING A GEOMETRY TO REDUCE RESISTANCE | 2021-09-02 |
20210272903 | SEMICONDUCTOR DEVICE INCLUDING BACK SIDE POWER SUPPLY CIRCUIT | 2021-09-02 |
20210272904 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE | 2021-09-02 |
20210272905 | MICROELECTRONIC PACKAGE WITH SUBSTRATE CAVITY FOR BRIDGE-ATTACH | 2021-09-02 |
20210272906 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-09-02 |
20210272907 | REDISTRIBUTION LAYER OF FAN-OUT PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-09-02 |
20210272908 | SEMICONDUCTOR DEVICES WITH FLEXIBLE CONNECTOR ARRAY | 2021-09-02 |
20210272909 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF FORMING SAME | 2021-09-02 |
20210272910 | CHEMICAL DIRECT PATTERN PLATING METHOD | 2021-09-02 |
20210272911 | OVERLAY MARK AND METHOD OF MAKING | 2021-09-02 |
20210272912 | SEMICONDUCTOR DIE CONTAINING SILICON NITRIDE STRESS COMPENSATING REGIONS AND METHOD FOR MAKING THE SAME | 2021-09-02 |
20210272913 | SEMICONDUCTOR PACKAGE | 2021-09-02 |
20210272914 | METHOD OF MAKING PACKAGE INCLUDING STRESS RELIEF STRUCTURES AND PACKAGE | 2021-09-02 |
20210272915 | CRACK SENSOR FOR SENSING CRACKS IN A SOLDER PAD, AND METHOD FOR PRODUCTION QUALITY CONTROL | 2021-09-02 |
20210272916 | INTEGRATED CIRCUIT | 2021-09-02 |
20210272917 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2021-09-02 |
20210272918 | SEMICONDUCTOR DEVICES, SEMICONDUCTOR PACKAGES, AND METHODS OF MANUFACTURING THE SEMICONDUCTOR DEVICES | 2021-09-02 |
20210272919 | SEMICONDUCTOR PACKAGE HAVING VARYING CONDUCTIVE PAD SIZES | 2021-09-02 |
20210272920 | SEMICONDUCTOR DEVICE WITH BACKMETAL AND RELATED METHODS | 2021-09-02 |
20210272921 | METHODS FOR FORMING ELEMENTS FOR MICROELECTRONIC COMPONENTS, RELATED CONDUCTIVE ELEMENTS, AND MICROELECTRONIC COMPONENTS, ASSEMBLIES AND ELECTRONIC SYSTEMS INCORPORATING SUCH CONDUCTIVE ELEMENTS | 2021-09-02 |
20210272922 | FOLDABLE LAYERED CONNECTION, AND METHOD FOR MANUFACTURING A FOLDABLE LAYERED CONNECTION | 2021-09-02 |