35th week of 2010 patent applcation highlights part 13 |
Patent application number | Title | Published |
20100219498 | METHOD FOR MANUFACTURING NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE, AND NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE - An isolation oxide film whose upper surface is higher than a surface of a substrate is formed in the substrate. A silicon oxide film is formed on the substrate between the isolation oxide films. A self-aligned polysilicon film is formed on the silicon oxide film between the isolation oxide films. After forming a resist pattern covering the peripheral circuitry, the isolation oxide films in the memory cell are etched by a predetermined thickness. An ONO film is formed on the entire surface of the substrate, a second resist pattern covering the memory cell is formed. Then, the ONO film, the polysilicon film | 2010-09-02 |
20100219499 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME - An excessive metallic film on a device isolation region is prevented from contributing to silicidation in an end of a source-drain diffusion layer region to thereby form a silicide film with uniform film thickness. There are sequentially conducted a step of forming a device isolation region | 2010-09-02 |
20100219500 | METHOD FOR MANUFACTURING DIRECT BONDED SOI WAFER AND DIRECT BONDED SOI WAFER MANUFACTURED BY THE METHOND - A direct bonded SOI wafer having an entire buried oxide film layer covered and not exposed is manufactured by: (A) forming a laminated body by laminating a semiconductor wafer and a support wafer via an oxide film; and (B) forming a thin-film single crystal silicon layer on the support wafer using a buried oxide film layer by film-thinning the semiconductor wafer to a predetermined thickness. In a process (C) the entire buried oxide film layer is covered by a main surface on the laminating side of the support wafer and the single crystal silicon layer. The covering of the entire buried film layer is carried out by, between process (A) and (B), removing the oxide film formed on the circumferential end edge of the main surface on the laminating side and the chamfered portion to leave the oxide film only on the laminated surface except the circumferential end edge. | 2010-09-02 |
20100219501 | TRENCH ISOLATION IMPLANTATION - Embodiments of the disclosure include a shallow trench isolation structure having a dielectric material with energetic species implanted to a predetermined depth of the dielectric material. Embodiments further include methods of fabricating the trench structures with the implant of energetic species to the predetermined depth. In various embodiments the implant of energetic species is used to densify the dielectric material to provide a uniform wet etch rate across the surface of the dielectric material. Embodiments also include memory devices, integrated circuits, and electronic systems that include shallow trench isolation structures having the dielectric material with the high flux of energetic species implanted to the predetermined depth of the dielectric material. | 2010-09-02 |
20100219502 | MIM Decoupling Capacitors under a Contact Pad - An integrated circuit structure includes one or more external contact pads with decoupling capacitors, such as metal-insulator-metal (MIM) capacitors, formed directly thereunder. In an embodiment, the decoupling capacitors are formed below the first metallization layer, and in another embodiment, the decoupling capacitors are formed in the uppermost inter-metal dielectric layer. A bottom plate of the decoupling capacitors is electrically coupled to one of V | 2010-09-02 |
20100219503 | CHIP CAPACITIVE COUPLING - A method of creating a semiconductor chip having a substrate, a doped semiconductor material abutting the substrate and a device pad at an outer side of the doped semiconductor material involves creating a via through at least a portion of the substrate, the via having a periphery and a bottom at a location and depth sufficient to bring the via into proximity with the device pad but be physically spaced apart from the device pad, introducing an electrically conductive material into the via, and connecting the electrically conductive material to a signal source so the signal will deliberately be propagated from the electrically conductive material to the device pad without any direct electrical connection existing between the electrically conductive material and the device pad. | 2010-09-02 |
20100219504 | Four-Terminal Gate-Controlled LVBJTs - An integrated circuit structure includes a well region of a first conductivity type, an emitter of a second conductivity type opposite the first conductivity type over the well region, a collector of the second conductivity type over the well region and substantially encircling the emitter, and a base contact of the first conductivity type over the well region. The base contact is horizontally spaced apart from the emitter by the collector. At least one conductive strip horizontally spaces the emitter, the collector, and the base contact apart from each other. A dielectric layer is directly under, and contacting, the at least one conductive strip. | 2010-09-02 |
20100219505 | NITRIDE CRYSTAL WITH REMOVABLE SURFACE LAYER AND METHODS OF MANUFACTURE - A nitride crystal or wafer with a removable surface layer comprises a high quality nitride base crystal, a release layer, and a high quality epitaxial layer. The release layer has a large optical absorption coefficient at wavelengths where the base crystal is substantially transparent and may be etched under conditions where the nitride base crystal and the high quality epitaxial layer are not. The high quality epitaxial layer may be removed from the nitride base crystal by laser liftoff or by chemical etching after deposition of at least one epitaxial device layer. The nitride crystal with a removable surface layer is useful as a substrate for a light emitting diode, a laser diode, a transistor, a photodetector, a solar cell, or for photoelectrochemical water splitting for hydrogen generation. | 2010-09-02 |
20100219506 | Systems and Methods of Laser Texturing and Crystallization of Material Surfaces - The surface of a material is textured and crystallized in a single step by exposing the surface to pulses from an ultrafast laser. The laser treatment causes pillars to form on the treated surface. These pillars provide for greater light absorption. The crystallization of the material provides for higher electric conductivity and changes in optical properties of the material. The method may be performed in a gaseous environment, so that laser assisted chemical etching will aid in the texturing of the surface. This method may be used on various material surfaces, such as semiconductors, metals, ceramics, polymers, and glasses. | 2010-09-02 |
20100219507 | PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE - According to the invention, a process for producing a semiconductor device using an adhesive sheet for a spacer, comprising preparing an adhesive sheet having a spacer layer provided with an adhesive layer on at least one surface thereof as the adhesive sheet for a spacer, a step of sticking the adhesive sheet for a spacer onto a dicing sheet with the adhesive layer as a sticking surface, a step of dicing the adhesive sheet for a spacer to form a chip-shaped spacer provided with the adhesive layer, a step of peeling the spacer from the dicing sheet together with the adhesive layer, and a step of fixing the spacer onto an adherend with the adhesive layer interposed therebetween. | 2010-09-02 |
20100219508 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate on which an internal circuit is formed in a central position an insulating layer formed over the semiconductor substrate, and a moisture-resistant ring formed by a metal plug embedded in the insulating layer, the moisture-resistant ring surrounding the internal circuit, the moisture-resistant ring extending over the semiconductor substrate in a shape, the moisture-resistant ring including a first extending portion linearly extending in a first direction in parallel to the surface of the semiconductor substrate, a vertical portion connected to the first extending portion extending in a second direction orthogonal to the first extending portion, and a second extending portion orthogonal to the vertical portion and parallel to the surface of the semiconductor substrate, the second extending portion spaced apart from the first extending portion, the second extending portion crossing the vertical portion. | 2010-09-02 |
20100219509 | TILED SUBSTRATES FOR DEPOSITION AND EPITAXIAL LIFT OFF PROCESSES - Embodiments of the invention generally relate to epitaxial lift off (ELO) films and methods for producing such films. Embodiments provide a method to simultaneously and separately grow a plurality of ELO films or stacks on a common support substrate which is tiled with numerous epitaxial growth substrates or surfaces. Thereafter, the ELO films are removed from the epitaxial growth substrates by an etching step during an ELO process. The tiled growth substrate contains the epitaxial growth substrates disposed on the support substrate may be reused to grow further ELO films. In one embodiment, a tiled growth substrate is provided which includes two or more gallium arsenide growth substrates separately disposed on a support substrate having a coefficient of thermal expansion within a range from about 5×10 | 2010-09-02 |
20100219510 | METHOD FOR FABRICATING HIGH DENSITY PILLAR STRUCTURES BY DOUBLE PATTERNING USING POSITIVE PHOTORESIST - A method of making a semiconductor device includes forming a first photoresist layer over an underlying layer, patterning the first photoresist layer into a first photoresist pattern, wherein the first photoresist pattern comprises a plurality of spaced apart first photoresist features located over the underlying layer, and etching the underlying layer using the first photoresist pattern as a mask to form a plurality of first spaced apart features. The method further includes removing the first photoresist pattern, forming a second photoresist layer over the plurality of first spaced apart features, and patterning the second photoresist layer into a second photoresist pattern, wherein the second photoresist pattern comprises a plurality of second photoresist features covering edge portions of the plurality of first spaced apart features. The method also includes etching exposed portions of the plurality of first spaced apart features using the second photoresist pattern as a mask, such that a plurality of spaced apart edge portions of the plurality of first spaced apart features remain, and removing the second photoresist pattern. | 2010-09-02 |
20100219511 | CARBON NANOTUBE-SOLDER COMPOSITE STRUCTURES FOR INTERCONNECTS, PROCESS OF MAKING SAME, PACKAGES CONTAINING SAME, AND SYSTEMS CONTAINING SAME - A carbon nanotube (CNT) array is patterned on a substrate. The substrate can be a microelectronic die, an interposer-type structure for a flip-chip, a mounting substrate, or a board. The CNT array is patterned by using a patterned metallic seed layer on the substrate to form the CNT array by chemical vapor deposition. The patterned CNT array can also be patterned by using a patterned mask on the substrate to form the CNT array by growing. A computing system that uses the CNT array for heat transfer from the die is also used. | 2010-09-02 |
20100219512 | Method for Forming Porous Insulating Film and Semiconductor Device - A method for forming porous insulating film using cyclic siloxane raw material monomer is provided, which method suppresses detachment of hydrocarbon and is able to form a low-density film. | 2010-09-02 |
20100219513 | INTEGRATED CIRCUIT STRUCTURE AND A METHOD OF FORMING THE SAME - An integrated circuit structure is disclosed. The integrated circuit structure includes a first package substrate including a radiating element, the radiating element having a radiating element connection extending from the radiating element. The integrated circuit structure further includes a first chip positioned adjacent to the radiating element connection, the first chip having a first chip connection on a surface of the first chip, wherein the first chip connection forms a capacitive coupling with the radiating element connection. A method of forming an integrated circuit structure is also disclosed. | 2010-09-02 |
20100219514 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first region, a second region and a third region surrounding the second region; an integrated circuit including an active element in the first region and provided in and above a first substrate; an antenna which is provided in the second region, connected to the integrated circuit and configured to receive or transmit a high-frequency signal; and a first shield layer which is grounded and includes a stack of a plurality of conductive layers in the third region. | 2010-09-02 |
20100219515 | LEAD FRAME - A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability. | 2010-09-02 |
20100219516 | Power management integrated circuit - An integrated circuit (IC) package is disclosed. The IC package includes a first die; and a second die bonded to the CPU die in a three dimensional packaging layout. | 2010-09-02 |
20100219517 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND MOLDING DIE - Provided is a method for manufacturing a semiconductor device in which movement of an island in resin sealing is prevented. A molding die includes an upper die and a lower die. The upper and lower dies are fitted together to form cavities and runners. In the lower die, a pod is provided. After heating and melting of a tablet made of a solid resin and housed in the pod, the melted sealing resin is pressurized by a plunger, and is supplied to each of the cavities. Specifically, a liquid sealing resin is supplied from the pod to the cavities, sequentially, from the upstream of the flow of the sealing resin supplied from the pod. The cavities communicate with each other through the runners. Furthermore, the runners through which the cavities communicate are provided to be tilted with respect to a path for supplying the sealing resin. | 2010-09-02 |
20100219518 | QUAD FLAT NON-LEADED PACKAGE - A quad flat non-leaded package including a leadframe, a chip, a plurality of first bonding wires and a molding compound is provided. The leadframe includes a plurality of first leads, and each first lead has a first portion and a second portion that extend along an axis. The length of the first portion is greater than the length of the second portion. The thickness of the first portion is greater than the thickness of the second portion. The chip is disposed on the leadframe and covers a portion of the first portions. The first bonding wires are connected between the chip and another portion of the first portions or the chip and the second portions, such that the chip is electrically connected to the first leads through the first bonding wires. The molding compound encapsulates a portion of the first leads, the chip and the first bonding wires. | 2010-09-02 |
20100219519 | COMPLETE POWER MANAGEMENT SYSTEM IMPLEMENTED IN A SINGLE SURFACE MOUNT PACKAGE - A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink. | 2010-09-02 |
20100219520 | LEAD FRAME - A lead frame includes a plurality of leads electrically connected to a semiconductor chip and a lead lock including a base layer disposed over the plurality of the leads and formed of a material having a coefficient of thermal expansion similar to that of inner leads. An adhesive layer is disposed between the base layer and the plurality of leads to fix the plurality of leads and adhere the base layer to the leads. At least one line electrically connects the semiconductor chip to the base layer of the lead lock. Since regions for bus bars are replaced by the lead lock and are removed, the lead frame can be miniaturized and has superior thermal stability and dimension stability. | 2010-09-02 |
20100219521 | WINDOW TYPE SEMICONDUCTOR PACKAGE - A window-type semiconductor package is revealed, primarily comprising a substrate with an interconnection channel, a chip on the substrate, a die-attach adhesive between the chip and the substrate, and an encapsulant filling the interconnection channel. A first solder mask formed on the top surface of the substrate has a specific pattern. The die-attach adhesive bonds the active surface of the chip to the first solder mask with the bonding pads of the chip aligned inside the interconnection channel. The first solder mask has an opening to expose the interconnection channel and further to form an indentation from the interconnection channel to expose the top surface to prevent damaging of the active surface of the chip adjacent to the edges of the interconnection channel to ensure the integrity and yield of the final products. | 2010-09-02 |
20100219522 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS - A first sealing resin seals a side surface of an electronic component and a side surface of a conductive member. A second sealing resin is provided on the first sealing resin, and seals an electrode pad and an electrode pad forming surface of the electronic component and a part of the conductive member. A multilayer wiring structure includes a plurality of stacked insulating layers and a wiring pattern and is provided on a surface of the second sealing resin from which a connecting surface of the electrode pad and a first connecting surface of the conductive member are exposed. The wiring pattern is connected to the connecting surface of the electrode pad and the first connecting surface of the conductive member. | 2010-09-02 |
20100219523 | STACKABLE INTEGRATED CIRCUIT PACKAGE SYSTEM - A stackable integrated circuit package system includes: a substrate having a first side and a second side opposite the first side, the substrate having a cavity provided therein; a first integrated circuit die in the cavity with a first interconnect extending out from the cavity without connection and a second interconnect connected to the first side; a first mold compound to cover the first integrated circuit die, the second interconnect, and a portion of the first interconnect; a second integrated circuit die mounted to the first integrated circuit die with a third interconnect connected to the second side; a second mold compound to cover the second integrated circuit die and the third interconnect; and external interconnects, not encapsulated by the second encapsulant, mounted on the second side. | 2010-09-02 |
20100219524 | CHIP SCALE PACKAGE AND METHOD OF FABRICATING THE SAME - A chip scale package (CSP) package and method of fabricating the same are provided. The fabricating method includes the following steps. First, a substrate is provided. Next, a chip is disposed on the front surface of the substrate and electrically connected to the substrate. Then, a thermal conductive paste is formed on the surface of the chip. Afterwards, a molding compound for enclosing the chip is formed. Lastly, a milling process is applied to the molding compound so that the height of the molding compound is aligned with that of the thermal conductive paste. The chip can be disposed on the substrate by way of wire bonding or flip-chip bonding. The thermal conductive paste is disposed on the surface of the chip either before or after the milling process is completed. | 2010-09-02 |
20100219525 | Semiconductor device - Disclosed is a semiconductor device having improved heat dissipation efficiency. The semiconductor device includes a silicon interposer having a first surface and a second surface opposite the first surface. A plurality of semiconductor chips are provided on the first surface side of the silicon interposer. The silicon interposer has a plurality of via holes extending from the first surface to the second surface. An N type semiconductor and a P type semiconductor constituting a Peltier element are provided in each two of the via holes. | 2010-09-02 |
20100219526 | FLEXIBLE MICROELECTRONICS ADHESIVE - A curable thermal interface material is provided comprising a functionalized elastomer and a filler. Preferred materials comprise an epoxidized polybutadiene cured with an iodonium catalyst and a filler comprising silver and/or aluminum oxide. | 2010-09-02 |
20100219527 | METALLIZATION SYSTEM OF A SEMICONDUCTOR DEVICE INCLUDING METAL PILLARS HAVING A REDUCED DIAMETER AT THE BOTTOM - In a metallization system of a complex semiconductor device, metal pillars, such as copper pillars, may be formed in a nail-like configuration in order to reduce the maximum mechanical stress acting on the metallization system while providing a required contact surface for connecting to the package substrate. The nail-like configuration may be obtained on the basis of appropriately configured resist masks. | 2010-09-02 |
20100219528 | Electromigration-Resistant Flip-Chip Solder Joints - A semiconductor device contact structure practically eliminating the copper diffusion into the solder as well as the current crowding at the contact with the subsequent electromigration in the solder. A column-like electroplated copper stud ( | 2010-09-02 |
20100219529 | METHOD AND APPARATUS FOR FORMING METAL-METAL OXIDE ETCH STOP/BARRIER FOR INTEGRATED CIRCUIT INTERCONNECTS - Described is a method and apparatus for forming interconnects with a metal-metal oxide electromigration barrier and etch-stop. In one embodiment of the invention, the method includes depositing a metal layer on the top of a planarized interconnect layer, the interconnect layer having an interlayer dielectric (ILD) with a top that is planar with the top of an electrically conductive interconnect. In one embodiment of the invention, the method includes reacting the metal layer with the ILD to form a metal oxide layer on the top of the ILD. At the same time, the metal layer will not be significantly oxidized by the electrically conductive interconnect, thus forming a metal barrier on the electrically conductive interconnect to improve electromigration performance. The metal barrier and metal oxide layer together comprise a protective layer. A second ILD may be subsequently formed on the protective layer, and the protective layer may act an etch-stop during a subsequent etch of the second ILD. | 2010-09-02 |
20100219530 | Contact Structure of a Semiconductor Device - A method for fabricating a contact of a semiconductor device includes the steps of forming a dielectric layer having a contact hole on a semiconductor substrate, forming an out-gassing barrier layer comprising a poly-silicon layer to cover at least inner walls of the contact hole in order to prevent undesired out-gassing from the dielectric layer, and depositing an aluminum layer on the out-gassing barrier layer. The contact structure of the semiconductor device includes the aluminum layer filled in the contact layer formed on the semiconductor substrate, and the out-gassing barrier layer formed under the aluminum layer to prevent out-gassing from the dielectric layer. A fine contact can be formed along with the aluminum layer, thereby realizing the contact structure of a lower contact resistance. As a result, it is possible to realize stabilization of an overall contact resistance of the semiconductor device. | 2010-09-02 |
20100219531 | METHOD OF FORMING A LOW RESISTANCE SEMICONDUCTOR CONTACT AND STRUCTURE THEREFOR - In one embodiment, silicide layers are formed on two oppositely doped adjacent semiconductor regions. A conductor material is formed electrically contacting both of the two silicides. | 2010-09-02 |
20100219532 | SEMICONDUCTOR DEVICE - A semiconductor device includes: a first semiconductor chip having an upper face on which at least one first electrode pad is formed; a second semiconductor chip provided above the first semiconductor chip and having an upper face on which at least one second electrode pad is formed; a conductive film external to the first semiconductor chip and the second semiconductor chip; and a wire. The wire electrically connects the first electrode pad and the second electrode pad to each other via the conductive film. | 2010-09-02 |
20100219533 | MULTILAYERED WIRING STRUCTURE, AND METHOD FOR MANUFACTURING MULTILAYERED WIRING - Provided is a wiring of the Damascene structure for preventing the TDDB withstand voltage degradation and for keeping the planarity to prevent the degradation of a focus margin. A trench wiring ( | 2010-09-02 |
20100219534 | MICROSTRUCTURE DEVICE INCLUDING A METALLIZATION STRUCTURE WITH SELF-ALIGNED AIR GAPS AND REFILLED AIR GAP EXCLUSION ZONES - In a sophisticated metallization system, self-aligned air gaps may be provided in a locally selective manner by using a radiation sensitive material for filling recesses or for forming therein the metal regions. Consequently, upon selectively exposing the radiation sensitive material, a selective removal of exposed or non-exposed portions may be accomplished, thereby resulting in a highly efficient overall manufacturing flow. | 2010-09-02 |
20100219535 | METHOD FOR PRODUCING A SEMICONDUCTOR COMPONENT - A method for producing a semiconductor component with an easily solderable contact structure comprising the provision of a semiconductor substrate of a planar design with a first side, a second side, a surface normal standing vertically thereon, a dielectric passivation layer arranged on at least one of the sides and a first contact layer arranged on passivation layer, the application, at least in some areas, of at least one second contact layer onto the first contact layer, the at least one second contact layer comprising at least a partial layer made of an easily solderable metal, especially of nickel and/or silver and/or tin and/or a compound thereof, and the making of an electrically conductive contact between the second contact layer and the semiconductor substrate. | 2010-09-02 |
20100219536 | CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE, WIRING BOARD, CONNECTOR, AND MICROCONTACTOR - A connecting terminal, a semiconductor package, a wiring board, a connector, and a microcontactor that can achieve a stable contact with a contact target are provided. To achieve the object and to establish an electrical connection to a contact target by making a physical contact with the contact target, there are provided a plurality of conductive terminal-forming members each having a terminal portion, which is extended in a band shape and at least a part of a surface of which forms a curved surface. Each terminal portion is configured so that a part of which is laminated on a part of at least one terminal portion in a thickness direction. All the terminal portions may be laminated at respective tip portions in the thickness direction. | 2010-09-02 |
20100219537 | SEMICONDUCTOR DEVICE - A first semiconductor chip and a second semiconductor chip which form a stack are mounted on a module substrate by deflecting a centre position of the semiconductor chips from the module substrate. In the side where the distance from the edge of the deflected semiconductor chip to the edge of a module substrate is shorter, the electrode pad on the first semiconductor chip and the electrode pad on the second semiconductor chip are directly connected with a wire. In the side where the distance from the edge of the deflected semiconductor chip to the edge of a module substrate is longer, the electrode pad on the first semiconductor chip and the electrode pad on the second semiconductor chip are combined with the corresponding bonding lead on the module substrate with a wire. | 2010-09-02 |
20100219538 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A semiconductor device comprises a semiconductor layer including a plurality of paralleled linear straight sections extending in a first direction. The layer also includes a plurality of connecting sections each having a width in the first direction sufficient to form a wire-connectable contact therein and arranged to connect between adjacent ones of the straight sections in a second direction. The connecting sections have respective ends formed aligned with a first straight line parallel to the second direction. | 2010-09-02 |
20100219539 | NEGATIVE ION LIQUID MANUFACTURING APPARATUS - Intended is to provide an apparatus, which is small in size and low at cost and which can manufacture a minus-ion generating liquid in a large quantity stably and continuously by a method safer than that of the prior art. In the apparatus, a single-stage reproducing pump comprises a casing having a suction port for sucking a liquid and a discharge port for discharging the liquid sucked from the suction port, an impeller disposed in the casing and forming a multiplicity of blades on the circumference of its disc, and a passage formed in the casing along the outer circumference of that impeller for guiding the liquid sucked from the suction port, to the discharge port. The area normal to the liquid flow direction of the passage becomes narrower from the suction port side to the discharge port side. The single-stage reproducing pump further comprises gas inflow means for feeding hydrogen and oxygen into a pressure liquid midway of the passage, in which the pressure of the liquid is gradually boosted from the suction port side to the discharge port side. | 2010-09-02 |
20100219540 | METHOD OF MAKING OPTICAL BODY HAVING POLYACRYLATE SKIN LAYER - A method of making an optical body an optical body is disclosed. The method includes coextruding a first skin layer and a first strippable skin layer on a first side of an optical layer. The first skin layer is disposed between the optical layer and the first strippable skin layer. The first skin layer includes a mixture of a polyacrylate and a second polymer which may or may not be miscible in the polyacrylate. The second polymer may be an anti-static polymer. | 2010-09-02 |
20100219541 | METHOD FOR MANUFACTURING OPTICAL DEVICE - Disclosed is a method for manufacturing an optical device, which enables to suppress deformation during annealing or deformation due to environmental changes over time after annealing. This method for manufacturing an optical device enables to suppress deterioration of a film when the film is formed on the surface of the device. Specifically disclosed is a method for manufacturing an optical device, which is characterized by comprising a step for molding an organic-inorganic composite material containing a thermosetting resin and inorganic particles, a step for annealing the molded article of the organic-inorganic composite material, and a step for forming a film over the molded article of the organic-inorganic composite material. | 2010-09-02 |
20100219542 | SUBSTRATE MANUFACTURING METHOD INCLUDING PROTRUSION REMOVING STEP, AND METHOD AND APPARATUS FOR MODIFYING COLOR FILTER PROTRUSION - A method for removing and modifying a protrusion by using a short pulse laser is provided for modifying a color filter. In a color filter modifying method, a transparent substrate ( | 2010-09-02 |
20100219543 | METHOD FOR PRODUCING AND A SYSTEM FOR COOLING A HOT-FILLED SOFTGEL CAPSULE - A system for producing a hot-filled softgel capsule utilizes a chilled liquid. The chilled liquid is routed through a chilled liquid conveyor tray into a chilled liquid bath. The chilled liquid conveyor tray directs the flowing chilled liquid into a flowing chilled liquid layer. Softgel capsules having a heated fill material are deposited in the flowing chilled liquid layer. The chilled liquid layer cools the capsule by transferring heat from the capsule to the chilled liquid. The flowing chilled liquid layer transports the capsule out of the chilled liquid conveyor tray into a chilled liquid bath. A capsule transfer conveyor transports the capsule out of the chilled liquid bath to a chilled liquid removal device. The chilled liquid removal device removes the chilled liquid from the capsule. | 2010-09-02 |
20100219544 | PROCESS FOR PRODUCING CERAMIC FINE PARTICLES, AND CERAMIC FINE PARTICLE PRODUCING APPARATUS USED THEREIN - Provided are a ceramic-fine-particle producing process making it possible to produce, with ease, ceramic fine particles which have a spherical shape close to a complete round and an excellent mono-dispersibility, and are made only of a solid component of a simple ceramic material without making a fine channel structure complicated, and an apparatus used therein for producing ceramic fine particles. | 2010-09-02 |
20100219545 | APPARATUS AND METHOD OF MANUFACTURING ASEPTIC CAPSULES - Provided are an apparatus and a method of aseptically manufacturing cell-immobilizing capsules, the apparatus comprising a multi-nozzle assembly and a double mesh system for the washing and size-selection of the capsules, and thus, the production, washing, selection and recovery of the capsules can be easily conducted under an aseptic condition in an integrated fashion. | 2010-09-02 |
20100219546 | DIGITALLY FORMING A DENTAL MODEL FOR FABRICATING ORTHODONTIC LABORATORY APPLIANCES - The present invention provides a method that uses digital data, such as that obtained from an intraoral scanner, to fabricate a wide range of customized laboratory appliances. The digital data is used to form a negative mold, which is in turn used to make a physical dental model. The negative mold is configured such that it can be flexed, stretched, fractured or disassembled to release the physical dental model. The physical dental model is then used for fabricating an orthodontic laboratory appliance. | 2010-09-02 |
20100219547 | LYOCELL METHOD COMPRISING AN ADJUSTMENT OF THE PROCESSING DURATION BASED ON THE DEGREE OF POLYMERIZATION - The invention relates to a method and a device for producing Lyocell fibres which are extruded from a cellulose solution of water, cellulose and tertiary amine oxide in a spinning head ( | 2010-09-02 |
20100219548 | FINE-STRUCTURE TRANSFER APPARATUS AND METHOD - A fine-structure transfer method in which a fine-featured pattern formed on one of the two surfaces of a stamper is pressed against a coating of a resist on one of the two surfaces of a transfer element so as to transfer the fine-featured pattern to the resist coating, wherein the atmosphere in the space between the stamper and the transfer element is replaced by the vapor of the resist before the stamper is pressed against the transfer element. Also disclosed is a fine-structure transfer apparatus having at least a stamper and a stage on which to place a transfer element having a coating of a resist, further having a device for heating the resist coating to be vaporized or a device for supplying the vapor of the resist into the space between the stamper and the transfer element. | 2010-09-02 |
20100219549 | METHODS OF MAKING AN UNSUPPORTED ARTICLE OF SEMICONDUCTING MATERIAL BY CONTROLLED UNDERCOOLING - The invention relates to methods of making articles of semiconducting material and semiconducting material articles formed thereby, such as semiconducting material that may be useful in making photovoltaic cells. | 2010-09-02 |
20100219550 | METHOD FOR MAKING THERMAL INTERFACE MATERIAL - The present disclosure relates to a method for making a thermal interface material. A carbon nanotube array on a substrate is provided. The carbon nanotube array includes a plurality of carbon nanotubes substantially parallel to each other and substantially perpendicular to the substrate. The carbon nanotubes of the carbon nanotube array are slanted toward a central axis of the carbon nanotube array. A liquid matrix material is compounded with the carbon nanotube array. Additionally, the liquid matrix material is solidified. | 2010-09-02 |
20100219551 | ELECTROCONDUCTIVE STRUCTURE, MANUFACTURING METHOD THEREFOR, AND SEPARATOR FOR FUEL CELL - The present invention provides a method for manufacturing a conductive structure having high electrical conductivity, and a method for manufacturing a dimensionally accurate separator for a fuel cell having high electrical conductivity. In the present invention, the cavity surface temperature of a mold is kept equal to or higher than the crystal melting temperature (T | 2010-09-02 |
20100219552 | Method for producing limestone-simulating concrete - A new process for creating a decorative surface on a cast concrete tile. A mold is prepared by coating with mold release. An aggregate of water, coloring dye, sand, Portland cement, and preferably filler material such as pea gravel is pre-mixed. Baking soda is mixed with a significant volume of water to create a high-viscosity paste. The paste preferably has a high solid to liquid ratio so that it can be crumbled into baking soda clumps of various sizes. The dampened baking soda clumps are sprinkled randomly onto the bottom surface of the mold (which will bear against what becomes the top surface of the cast tile). The pre-mixed aggregate is then added to the mold. Once the aggregate is cured, the cast concrete tile is removed. The baking soda clumps create complex voids in the tile's upper surface, producing a surface texture similar to limestone. | 2010-09-02 |
20100219553 | SIMULTANEOUS INJECTION-MOLDING AND DECORATING METHOD - In the simultaneous molding and decorating method for forming an image onto the surface of a resin molding simultaneously with resin molding by holding a decoration sheet on which the image is rotary printed in a die, such a decoration sheet as having a predetermined pattern for every revolution of the cylinder of a printing machine wherein the image is formed in the longitudinal direction at a constant interval is used. By holding the decoration sheet longer than one revolution but shorter than two revolutions of that in the die and performing resin molding, the image is formed onto the surface of a long molding exceeding the outer circumference of the cylinder. | 2010-09-02 |
20100219554 | METHOD OF MAKING A PATTERN ON A BUILDING ON SITE - The invention provides a method of making a pattern on a building on site, which comprises following steps: applying a base coat on a surface of said building; pressing and adhering a pattern mold onto said base coat before initial setting of said base coat so as to form a compound body of the base coat and the pattern mold; applying a cover coat on said compound body; releasing the mold so as to obtain said pattern. The decoration method of the invention makes the wall surface safe and solid, of a long service life, available of a variety of patterns and convenient to construct. | 2010-09-02 |
20100219555 | Method for extrusion of multi-layer coated elongate member - A method of making a multi-layer insulated elongate member is disclosed. The method includes providing an elongate member and tube extruding a first thermoplastic material onto an outer surface of the elongate member to create a first layer having a thickness less than or equal to 0.064 mm (0.0025 inch) using a first extruder apparatus. The method further includes using a second extruder apparatus for pressure extruding a compound comprising a second thermoplastic material different from the first thermoplastic material onto an outer surface of the first layer to create a second layer. The second layer fully wets the first layer and the flow point of the first thermoplastic material is at least 30° C. greater than the extrusion melt temperature of the second thermoplastic material. | 2010-09-02 |
20100219556 | Support Tray For Extruded Ceramic Ware And Method - Honeycomb extrudate is made by extruding a plasticized ceramic-forming batch material to form a length of wet honeycomb extrudate, transferring the extrudate to a support tray, and transferring the tray and extrudate to a dryer, the tray being capable of contactingly supporting greater than one-third of the circumferential surface of the wet extrudate. The extrudate is subject to reduced handling damage, e.g. from forces of gravitational and/or lateral acceleration arising during transfer. | 2010-09-02 |
20100219557 | Biodegradable resin film or sheet and process for producing the same - A biodegradable resin drawn film or biodegradable resin drawn sheet that is excellent in transparency, impact resistance and film re-forming capability (recyclability); and a process for producing the same. In particular, a biodegradable resin drawn film or biodegradable resin drawn sheet composed mainly of a mixture of (A) a biodegradable resin of greater than or equal to 30° C. as a glass transition temperature Tg and (B) a biodegradable resin of less than or equal to 5° C. as a glass transition temperature Tg characterized in that a multiplicity of domains comprising component (B) mainly in the configuration of lamellar or rod-shaped pieces are present in a continuous phase comprising component (A) substantially in parallel to the external surface of the film or sheet; and a process for producing the same. | 2010-09-02 |
20100219558 | MELT EXTRUDER AND PROCESS FOR PRODUCING THERMOPLASTIC RESIN FILM - When amorphous thermoplastic resin is supplied from a hopper, the resin is rotated by a screw in a barrel and generates frictional heat. In this point of view, in a melt extruder according to an aspect of the present invention, a temperature control zone that generates particularly high frictional heat is constantly cooled by a cooling device, and heated by a heating device to obtain a target temperature, thereby significantly reducing variations in barrel temperature. This can stabilize screw tip pressure, and reduce variations in thickness of a resin film discharged from the barrel. | 2010-09-02 |
20100219559 | BISECTED MOLD FOR TIRE MOLDING AND PROCESS FOR MANUFACTURING TIRE WITH USE OF THE MOLD - Provided are a bisected mold for tire molding that enables manufacturing of high-performance tires and that at a mold clamping, avoids a tire from being pinched to thereby attain a yield enhancement; and a process for manufacturing a tire. Inside a container bisected into upper and lower parts in the state of mold opening, there are disposed a mold for tire molding and, along upper and lower side plates, an unvulcanized tire. After performing vulcanization molding of the unvulcanized tire while changing from this state to a state of mold clamping of sectors and segments split into a plurality of pieces in a circumferential direction of the unvulcanized tire through a driving device and a slide unit means, only the sectors are subjected to mold opening by use of a driving means while maintaining the state of mold clamping of the mold for tire molding and the segments by the driving device and the slide unit means, and subsequently taking the vulcanization-molded tire. | 2010-09-02 |
20100219560 | Malleable Mold And Method of Use Thereof - A method is disclosed for forming a candle having the steps of providing a mold device having a unitary, one piece, seamless body capable of being used as a stand alone device having a hollow, three-dimensional shape with at least one opening therein; the body being made from a uniform material which is malleably reusable and capable of flexation during demolding, and which returns to its original shape after each demolding via shape memory, and having an axis extending vertically there through, wherein the body yields a seamless product; populating the mold with the desired candle material and volume thereof; and separating the mold from about the candle by peeling back the mold. | 2010-09-02 |
20100219561 | Method for Producing a Panel or Housing Part of a Vehicle - A panel or housing part of a vehicle is made by heating a semifinished product comprising at least one core layer in the form of a nonwoven fabric made of high melting-point and low melting-point fibers above a melting temperature of the low melting-point fibers and shaping the heated semifinished body under pressure in a mold having a mold gap to produce the panel or housing part. The semifinished product is compacted in the mold in some highly densified regions at the edge of the panel or housing part and/or at a spacing from the edge to produce monolithic regions that are substantially free of gas inclusions such that the material of the semifinished product in these highly densified regions flows along the mold gap, while maintaining in other regions the porosity of the nonwoven fabric of the core layer. | 2010-09-02 |
20100219562 | METHODS OF MAKING AN ENDOVASCULAR PROSTHESIS USING A DEFORMABLE MATRIX - A method of making an endovascular prosthesis comprises the steps of applying a first layer of polymer to a portion of a deformable matrix, contacting a stent with the polymer to deform the matrix, applying a second layer of polymer over at least a portion of the stent and first layer, solidifying the layers of polymer to form the endovascular prosthesis, and removing the matrix. | 2010-09-02 |
20100219563 | Apparatus and Method for Manufacturing Polymeric Fibrils - An electrospinning apparatus is described. The electrospinning apparatus has a rotary nozzle mechanism that moves simultaneously along a non-linear track for forming polymeric fibrils, so that the polymeric fibrils can be piled to form a uniform web on a receiving carrier from any receiving angle. Therefore, the electrospinning apparatus resolves problems of the prior polymeric fibrils, such as various distribution and slow production rate. In addition, a method of manufacturing polymeric fibrils in the aforementioned electrospinning apparatus is further described. | 2010-09-02 |
20100219564 | Resin Molding Apparatus and Resin Molding Process - Conventional production of plastic products not releasing harmful organic molecules requires a high injection or extrusion pressure in order to avoid heating of a resin to high temperature, resulting in use of a large-sized and heavy resin molding apparatus having high electric power consumption. The employment of a method of inhibiting oxidative decomposition and catalytic decomposition enables the formation of a molten plastic having an extremely low viscosity without decomposition or dissociation even at high temperature, whereby the molding of the resin can be conducted at a very low injection or extrusion pressure to attain the downsizing and weight saving of the resin molding apparatus. | 2010-09-02 |
20100219565 | Cooling Apparatus of Hot Steel Plate, Cooling Method of Hot Steel Plate, and Program - An apparatus for controlled cooling of hot steel plate while constraining and conveying the plate by constraining rolls horizontally which is inexpensive and enabling continuous control of the cooling ability over a broad range, that is, a cooling apparatus for spraying hot steel plate hot rolled and transferred between pairs of constraining rolls with cooling water from pluralities of lines of spray nozzles so as to cool the same, which apparatus has lines of gentle cooling spray nozzles and lines of strong cooling spray nozzles with different orifice shapes and enables continuous control of the cooling ability over a broad range due to the fact that a maximum cooling water impact pressure integrated value of the lines of gentle cooling spray nozzles and a minimum cooling water impact pressure integrated value of the lines of strong cooling spray nozzles are continuous. | 2010-09-02 |
20100219566 | Cooling Control Method, Cooling Control Apparatus, and Cooling Water Amount Calculation Apparatus - A cooling control method which quickly controls the amounts of cooling water sprayed from top and bottom surfaces of the cooling apparatus when cooling steel plate to a predetermined cooling end temperature so as prevent shape deterioration of steel plate occurring due to the difference of cooling rates between the top surface and the bottom surface with a high precision, that is, a cooling control method of calculating cooling conditions required for cooling the steel plate to a predetermined temperature for a plurality of positions inside the cooling apparatus based on measured temperatures at a time when the steel plate passes through the cooling apparatus by a thermometer disposed at the entry-side of the cooling apparatus and setting a cooling schedule, calculating a heat transfer coefficient from the set temperature and a cooling bottom water density, calculating a cooling top water density from the calculated heat transfer coefficient, and controlling the amounts of cooling water of the cooling apparatus based on the ratio of the cooling bottom water density and cooling top water density so as to cool the steel plate to a predetermined cooling end temperature, thereby simplifying the amount of calculation required for controlling the amounts of cooling water sprayed from the top and bottom surfaces of the cooling apparatus. | 2010-09-02 |
20100219567 | PROCESS LINE CONTROL APPARATUS AND METHOD FOR CONTROLLING PROCESS LINE - A process line control apparatus which controls a process line including an annealing furnace ( | 2010-09-02 |
20100219568 | METHOD FOR IN-LINE HEAT EXCHANGER TUBE BRAZING - The invention relates to an installation for soldering or for heat-treating workpieces ( | 2010-09-02 |
20100219569 | HYDRAULIC SHOCK ABSORBER - A hydraulic shock absorber includes a damper cylinder having a hollow bore therein. A piston rod and piston separate the bore into a rod side oil chamber and a piston side oil chamber. A pressure side damping force generator is provided with a sub piston in the piston side oil chamber. A first separator is provided in a sub piston side oil chamber of the sub piston, with a communication hole that communicates between the sub piston side oil chamber and a bladder side oil chamber. A hollow bladder is mounted in the bladder side oil chamber. A blow hole is provided in the bladder side oil chamber, the blow hole being normally closed by the bladder and opening when oil enters the bladder side oil chamber such that the bladder is contracted by an oil pressure when a volume of the oil reaches a predetermined capacity. | 2010-09-02 |
20100219570 | VIBRATION ISOLATOR - A vibration isolator ( | 2010-09-02 |
20100219571 | Vibration Isolator - A vibration isolator which is capable of stably opening and closing an orifice is provided at low manufacturing cost. A plunger for opening and closing an idle orifice is disposed in a manner that is slidably engaged with the inner wall surface of an orifice-forming member. A shaft portion extending downward is formed in the central portion of the plunger. A convex portion which is formed with a through-hole in which the shaft portion is slidably is provided on the bottom of the orifice-forming member so as to provide a bearing portion. The shaft portion of the plunger and the bearing portion of the orifice-forming member constitute a guide member for guiding the reciprocating motion of this plunger. | 2010-09-02 |
20100219572 | Independent Spring Cartridge - An improved independent spring cartridge holder apparatus and system for holding an automobile suspension spring in tension while allowing a quick and safe change of the shock absorber and spring. This is especially valuable during a race where change outs need to be done quickly. | 2010-09-02 |
20100219573 | Work Holder - A work holder which is adapted to hold a workpiece firmly in place for machining operations with respect to a machine tool. The workpiece is fashioned with a dovetail protuberance, which protuberance is designed to affix the workpiece to the work holder to the machining operations. Once the machining is completed, the dovetail protuberance may be removed in any convenient manner. Thus, the finished product may not then exhibit the former protuberance. | 2010-09-02 |
20100219574 | QUICK ACTION CLAMPING CYLINDER WITH A SIMPLIFIED STRUCTURE - A quick-action clamping cylinder is described which has a housing and a cover which covers the housing and has a center opening for receiving a retractable nipple that is arranged on the lower side of a workpiece pallet. The retractable nipple is locked in a spring-loaded manner in the housing by means of a plurality of locking balls that are spring-loaded in the locked position on the outer periphery of the retractable nipple. The locking balls are disengaged from the retractable nipple in the unlocked position by displacing a piston actuated by a pressurized medium. The aim of the invention is to obtain a simple, small clamping system. To this end, the locking balls convert the spring force exerted by the springs into a multiple of the retraction force acting on the retractable nipple, by means of a lever arm transmission. | 2010-09-02 |
20100219575 | SHEET FINISHER, IMAGE FORMING APPARATUS USING THE SAME, AND SHEET FINISHING METHOD - A sheet finisher of the invention includes a saddle stitch unit configured to stitch a center of a sheet bundle in which printed sheets are bundled, a fold unit configured to fold the center stitched by the saddle stitch unit and to form a fold line, and a fold reinforcing unit configured to reinforce the fold line formed by the fold unit, the fold reinforcing unit includes a placement table on which the sheet bundle transported from the fold unit is placed, and a roller unit that includes a reinforce roller and moves the reinforce roller along a direction of the fold line while pressing it to the fold line, and the placement table is provided with a groove-like edge clearance along an edge of the sheet bundle. | 2010-09-02 |
20100219576 | SHEET PROCESSING APPARATUS AND SHEET PROCESSING METHOD - A sheet processing apparatus includes a stapler that applies post-processing to sheets conveyed from an image forming apparatus, a vertical aligning unit that conveys the sheets to the stapler and brings an edge of the sheets into contact with a movable stopper arranged in a conveying path for the sheets to align the sheets in a conveying direction, and a horizontal aligning unit that holds the sheets with a pair of movable aligning plates from both sides along the conveying direction to align the sheets in a direction orthogonal to the conveying direction. The sheet processing apparatus further includes a control unit that switches a position of the stopper according to a size of the sheets and controls the aligning plates to be located on both sides close to the center of the sheets when the sheets are brought into contact with the stopper. The stapler applies the post-processing to the sheets aligned. | 2010-09-02 |
20100219577 | MULTI-TRAY SHEET FEEDER - By providing an apparatus having a plurality of sheet feeders, each having a tray elongate in top plan view for supporting a stack of elongate sheets, wherein a tray can be displaced in an outward direction transverse to the longitudinal direction of the sheet feeders, it is made possible for a tray displaced in an outward direction to be tilted over a relatively large angle at a given vertical clearance from the other sheet feeders. | 2010-09-02 |
20100219578 | Medium delivery apparatus and medium processing apparatus with dual pressing members - A media delivery apparatus includes a media insertion portion and a media delivery port. A media guide surface is configured to guide media toward the delivery port. The feed roller is configured to feed the media toward the delivery port. The first pressing member is configured to press the media against the feed roller and the second pressing member is configured to press the media against the media guide surface. A driving mechanism is configured to drive the first pressing member. The first pressing member is moved from a waiting position and toward the feed roller and the second pressing member is moved from a retreating position to a side of the media guide surface interlockingly with the first pressing member. The second pressing member reaches a position at which the second pressing member presses the media against the media guide surface after the first pressing member reaches a position at which the first pressing member presses the media against the feed roller. | 2010-09-02 |
20100219579 | Stacker and card processing apparatus equipped with the stacker - A stacker is composed of a bottom plate, a containing section for storing a plurality of cards by stacking it on the bottom plate and a guiding section for guiding each card entering into the containing section. The guiding section is composed of a sidewall for restricting movement of an entering card when entering into the stacker in a first moving direction and a slanted section for slanting the card against the first moving direction. The slanted card moves in a second moving direction intersecting with the first moving direction at approximately a right angle by the gravitational force. | 2010-09-02 |
20100219580 | PAPER SHEET HANDLING MECHANISM AND METHOD FOR HANDLING PAPER SHEETS - A loop-shaped part is provided in a middle part of a transport path | 2010-09-02 |
20100219581 | PAPER FEED MECHANISM AND PRINTER - A printer has a paper feed mechanism that can reliably balance the paper feed force of the paper feed roller and paper pressure roller on the left and right sides of the recording paper width. Using the self-centering action of a pressure lever fulcrum | 2010-09-02 |
20100219582 | Automatic Card Shuffler - An automatic card shuffler includes a card input unit, card ejection unit, card separation and delivery unit and card collection unit. A card ejection unit ejects cards in a singular fashion from a stack of cards placed into the input unit. The cards are ejected to a stop arm maintaining the entrance to the card separation unit. Adjustment means permit the shuffler to accommodate different sized cards. Upon processor command, the stop arm raises to allow a plurality of cards to pass under to the card separation and delivery unit. A series of rotating belts and rollers act to separate the cards and propel them individually to the collection unit. By utilizing separate motors to drive the belts and rollers it is possible to cease the movement of the belts so that the rollers independently act upon the cards. A floating gate slightly forward of the stop arm dictates that a minimum number of cards are managed simultaneously. The shuffler is controlled by a processing unit in communication with multiple internal sensors. An audio system communicates voice outputs regarding shuffler malfunctions and instructions to an operator. | 2010-09-02 |
20100219583 | Decision-making board game that helps shape a life - A decision making family fun board or electronic game having a playing surface, playing pieces, and multiple choose questions that help shape a life. The common sense questions have an earned value of best, good, or poor that correspond to the answer and the playing piece. There are designated spots on the playing surface to place the playing pieces that is orderly and challenging. | 2010-09-02 |
20100219584 | GAME OF SOCIAL INTRODUCTION - Disclosed herein is a game of social interaction, the game including a plurality of participants. The participants include at least one host and a plurality of invitees. In an exemplary embodiment, the following steps for carrying out the game, the host selecting from a universe of people, a finite number of players, inviting the finite number of players to a social event, creating an event, which will be generally pleasing to the players; assigning a card to player, each card relative to a pre-determined topic; a first guest reading his/her card aloud, inviting social intercourse based upon the card which is read aloud; a second guest reading his/her card aloud; and repeating the inviting social intercourse and reading steps until each of the players at the event has had the opportunity to read and receive social intercourse based upon their card, whereby upon introduction of each player and social discourse is initiated and the ice is broken so that normal social intercourse can begin. | 2010-09-02 |
20100219585 | ISOLATOR SEAL - An isolator seal includes a stator member for placement into the stator of rotating equipment and a rotor member for placement onto a rotary shaft of the rotating equipment. The stator member and the rotor member provide respective adjacent surfaces, while a static shut-off device engages both adjacent surfaces when the rotor member is static and disengages one or more of the surfaces when the rotor member is dynamic. In one embodiment of the invention at least one of the surfaces is inclined to the longitudinal axis at an angle greater or less than 90°. In a further embodiment, the static shut-off device includes a resilient annular sealing member and an auxiliary member, which can move between a first position, when the rotor member is static, at which the auxiliary member compresses the resilient annular member into engagement with both surfaces, and a second position at which the compression on the resilient member is reduced, so that the resilient annular member disengages one or more of the rotor and stator surfaces when the rotor is dynamic. | 2010-09-02 |
20100219586 | QUICK RELEASE BELLOW SEAL GUARD - A quick release bellow seal guard for use with a shaft assembly having a first guard member having an open central region and a second guard member releasably coupled to the first guard member also having an open central region. The first guard member further includes a wall extending from a base portion to a distal end. The second guard member further includes a proximal end releasably coupled to the distal end of the first guard member to collectively define an interior guard volume. The quick release bellow seal guard further includes a seal member sealingly engaging at least one of the first guard member and the second guard member and further sealingly engaging the shaft assembly. The seal member is positioned within the interior guard volume. | 2010-09-02 |
20100219587 | WHEEL SEAL - A wheel seal is mainly provided with an annular internal sleeve oil seal. An annular concave inwards is formed at one side of the internal sleeve oil seal to contain one end of an annular outer annular member. A gap is kept between the internal sleeve oil seal and the outer annular member to contain an anti-friction ring and a second barrier. A labyrinth zone that is up and down is formed in the second barrier. Thus, the anti-friction ring is used to not only block foreign matters from entering the wheel seal through the gap and then being damaged, but also effectively transfer the strength from the inner annular member to the outer annular member at the time of installation for increasing the success rate of installation. | 2010-09-02 |
20100219588 | Seal with Spiral Grooves and Contamination Entrapment Dams - A dynamic seal utilizes a groove on the active side of the seal to capture a leaked lubricant and pump the lubricant back into the lubricated side of the seal. The groove stops short of the leading edge of the seal that faces the lubricant side forming a static dam between the termination point of the groove and the seal edge. When the fluid pressure within the groove exceeds the opening pressure for the seal lip, the lubricant within the groove is pumped back into the lubricant side of the seal. The groove can have an induction zone wherein the fluid pressure rise is gradual and a booster zone wherein the fluid pressure rise is relatively faster than in the induction zone. The booster zone is disposed adjacent the static dam. Bars are provided across the spiral grooves to prevent contaminants from reaching and becoming trapped in the booster zone. | 2010-09-02 |
20100219589 | SEAL WITH FIRE PROTECTION - A seal for pipe penetration or the like is formed, in at least one embodiment, of two halves, the seal received in a sleeve or opening of a wall or the like. The seal forms a central opening for a pipe or tube when the seal halves are brought together. Each seal half is formed of two base parts. Between the base parts a layer of intumescent material is placed. On the inside of the base parts peelable layers are arranged. The layers are peeled off to adapt the inner diameter of the seal to the pipe or tube received. In case of fire, the intumescent material will expand which expansion will collapse and close off the pipe or tube received in the seal. | 2010-09-02 |
20100219590 | BOOT MOUNTING STRUCTURE FOR CONSTANT-SPEED UNIVERSAL JOINT, AND SILICONE BOOT FOR THE CONSTANT-SPEED UNIVERSAL JOINT - Provided are a boot-mounting structure for a constant velocity universal joint and a silicone boot for a constant velocity universal joint, which can prevent a crack caused by interference with a boot band while maintaining a stable sealing property. The boot band ( | 2010-09-02 |
20100219591 | POWER-ASSIST BRAKE SYSTEM EQUIPPED WITH ADHESIVE JOINT AND METHOD FOR MOUNTING SAME - In order to allow a single operator on a vehicle assembly line to attach a brake servo to a bulkhead by moving round from the engine compartment side to the passenger compartment side, use is made of a brake servo fitted with an adhesive and insulating seal ( | 2010-09-02 |
20100219592 | Sealing Array for High Temperature Applications - A sealing array for positioning in an annular space between tubular members to provide a seal therebetween. The sealing array includes a pair of oppositely disposed backup rings, each defining a primary outer seal member of the sealing array. A pair of rigid cap rings is disposed between the backup rings. Each cap ring has a substantially planar surface and an oppositely disposed surface that engages one of the backup rings to energize the backup rings upon the application of sufficient pressure. The cap rings are sized to form controlled extrusion gaps with both tubular members. An energizing element is disposed between the planar surfaces of the cap rings. The energizing element engages a planar surface of at least one of the cap rings and seals the extrusion gaps associated with the engaged cap ring upon the application of sufficient pressure. | 2010-09-02 |
20100219593 | Bit Retention Device - A bit retention device includes a shaft having a sidewall defining a hexagonal cavity extending from a first end thereof and a ball groove extending through the sidewall and communicating with the hexagonal cavity. A ball is disposed in the ball groove and a ball spring engages the ball and biases the ball toward the first end. An actuator sleeve surrounding the shaft includes an internal ramp engaging the ball. The internal ramp includes a shallow ramp portion having a first angle of inclination with respect to a center axis and a steep ramp portion having a second angle of inclination with respect to said center axis of said shaft that is greater than the first angle of inclination. A spring biased plunger assembly is disposed in the bore for biasing a bit received in the bore in a direction toward the insertion end. | 2010-09-02 |
20100219594 | QUICK CHANGE TOOL BIT HOLDER - The quick change tool bit holder comprises a bore for receiving a bit. A retaining tooth, or plurality of teeth, is movable into engagement with the bit when the bit is inserted into the bore to retain the bit in the bore. An ejector ejects the bit from the bore when the retaining tooth is moved out of engagement with the bit. The ejector may comprise a spring that is compressed when the bit is inserted in the bore and a push button is biased by the spring into engagement with the bit. A sleeve forces the retaining tooth into engagement with the bit when said sleeve is in the locking position where the tooth moves at an angle relative to a longitudinal axis into contact with the bit. A method of operating the quick change tool bit holder is also disclosed. | 2010-09-02 |
20100219595 | Drill adapter for an air impact wrench - A drill adapter for attaching to an air impact wrench. With attachment of the drill adapter, the air impact wrench can operate as a power drill for drilling bores in a workpiece. The drill adapter generally includes a body having a shaft receiving end and a drill chuck. The shaft receiving end includes a holding section sized and shaped for receiving the tool spindle or shaft of an air impact wrench. The drill chuck includes a plurality of jaws for clamping to a drill tool and tightening means for tightening or releasing the drill tool from the jaws. In operation, the tool spindle of a powered turning impact wrench is engaged within the holding section of the drill adapter. A drill tool is received in the drill chuck. When the impact wrench is fully engaged with the attachment described, the rotation torque output of the air impact wrench turns the drill adapter resulting in the air impact wrench operating as a power drill to form bores in a workpiece. | 2010-09-02 |
20100219596 | IN-LINE ROLLER SKATE, IN PARTICULAR RACING SKATE - In-line roller skate ( | 2010-09-02 |
20100219597 | Skateboard - Provided is a skateboard. The skateboard includes front and rear boards each including a foot placing unit, a directional caster including at least two connectors respectively disposed on bottom surfaces of the front and rear boards at a predetermined distance, rotating arms rotatably coupled to the connectors respectively, and wheels respectively supported by the rotating arms and rollingly contacting the ground, and a connection unit having both ends axial-rotatably and pivotally connected to one sides of the front and rear boards. | 2010-09-02 |