35th week of 2009 patent applcation highlights part 15 |
Patent application number | Title | Published |
20090212387 | MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A trench is formed on a semiconductor substrate with a first insulation film patterned on the semiconductor substrate as a mask; a second insulation film is embedded in the trench and flattened; an upper portion of the first insulation film is selectively removed, and a part of a side face of the second insulation film is exposed; a part of the second insulation film is isotropically removed; a lower portion of the remaining first insulation film is selectively removed; and then a part of the remaining second insulation film is further isotropically removed so that an upper face of the second insulation film is at a predetermined height from a surface of the semiconductor substrate, a taper having a minimum taper angle of 90° or more is formed on the side face of the second insulation film, and a STI is formed. | 2009-08-27 |
20090212388 | HIGH-Z STRUCTURE AND METHOD FOR CO-ALIGNMENT OF MIXED OPTICAL AND ELECTRON BEAM LITHOGRAPHIC FABRICATION LEVELS - A structure for aligning a first set of features of a fabrication level of an integrated circuit chip to an electron beam alignment target. The structure including a first trench in a semiconductor substrate, the first trench extending from a top surface of the substrate into the substrate a first distance; an electron back-scattering layer in a bottom of the first trench; a dielectric capping layer in the trench over the back-scattering layer; and a second trench in the substrate, the second trench extending from the top surface of the substrate into the substrate a second distance, the second distance less than the first distance. | 2009-08-27 |
20090212389 | SEMICONDUCTOR DEVICE WITH CAPACITOR AND FUSE, AND METHOD FOR MANUFACTURING THE SAME - A semiconductor device with a capacitor and a fuse, and a method for manufacturing the same are described. The semiconductor device comprises a semiconductor substrate having a capacitor region and a fuse region defined therein, a insulating layer over the semiconductor substrate, a storage node hole formed in the insulating layer, a barrier metal in the storage node hole, a dielectric layer formed on the barrier metal and the insulating layer, a lower metal layer for a plate electrode filling the storage node hole such that it is flush with the dielectric layer, an upper metal layer for the plate electrode on the dielectric layer and lower metal layer for the plate electrode; and a fuse metal layer formed of the same material as that of the upper metal layer for the plate electrode on the dielectric layer in the fuse region. | 2009-08-27 |
20090212390 | INDUCTIVELY COUPLED INTEGRATED CIRCUIT AND METHODS FOR USE THEREWITH - A circuit includes a first integrated circuit or die having a first circuit and a first inductive interface. A second integrated circuit or die has a second circuit and a second inductive interface. The first inductive interface and the second inductive interface are aligned to magnetically communicate signals between the first circuit and the second circuit. | 2009-08-27 |
20090212391 | Micromodules Including Integrated Thin Film Inductors and Methods of Making the Same - Micromodules and methods of making them are disclosed. An exemplary micromodule includes a substrate having a thin film inductor, and a bumped die mounted on the substrate and over the thin film inductor. | 2009-08-27 |
20090212392 | Capacitor Pairs with Improved Mismatch Performance - A semiconductor device includes a first capacitor comprising a plurality of first unit capacitors interconnected to each other, each having a first unit capacitance; and a second capacitor comprising a plurality of second unit capacitors interconnected to each other, each having a second unit capacitance, wherein the first unit capacitors and the second unit capacitors have equal numbers of unit capacitors. The first unit capacitors and the second unit capacitors are arranged in an array with rows and columns and placed in an alternating pattern in each row and each column. The first and the second unit capacitors each have a total number greater than two. | 2009-08-27 |
20090212393 | METHOD OF MANUFACTURING AN ELECTRONIC DEVICE INCLUDING A PNP BIPOLAR TRANSISTOR - A method of manufacturing an electronic device including a PNP bipolar transistor comprises forming a collector in a substrate, depositing a base layer and an emitter layer on the substrate, and growing a nitride interface layer on the base layer as a base current modulation means, such that the nitride interface layer is arranged between the base layer and the emitter layer. | 2009-08-27 |
20090212394 | BIPOLAR TRANSISTOR AND METHOD OF FABRICATING THE SAME - The invention provides a bipolar transistor with an improved performance because of a reduced collector series resistance and a reduced collector to substrate capacitance. The bipolar transistor includes a protrusion ( | 2009-08-27 |
20090212395 | Identifying New Semiconductor Detector Materials by D.C. Ionization Conductivity - Herein is described a method for identifying semiconductor radiation detector materials based on the mobility of internally generated electrons and holes. It was designed for the early stages of exploration, when samples are not available as single crystals, but as crystalline powders. Samples are confined under pressure in an electric field and the increase in current resulting from exposure to a high-intensity source of ionization current (e.g., | 2009-08-27 |
20090212396 | Laser Beam Machining Method And Semiconductor Chip - A laser processing method is provided, which, when cutting a substrate formed with a multilayer part including a plurality of functional devices, makes it possible to cut the multilayer part with a high precision in particular. | 2009-08-27 |
20090212397 | Ultrathin integrated circuit and method of manufacturing an ultrathin integrated circuit - A method of manufacturing an ultra thin integrated circuit comprises providing a substrate having a front side, a back side, and an edge extending from the front side to the back side; creating a defect layer in the substrate; forming semiconductor devices proximate the front side after creating the defect layer; and cleaving proximate the defect layer after forming the semiconductor devices. Other methods and apparatus are also provided. | 2009-08-27 |
20090212398 | Semiconductor device - A thin-film semiconductor element is formed on a plastic substrate in a semiconductor device. A thermal expansion buffer layer is interposed between the thin-film semiconductor element and the plastic substrate. Although the thin-film semiconductor element is made from a material with a thermal expansion coefficient differing from the thermal expansion coefficient of the plastic substrate, the thermal expansion buffer layer interposed between the thin-film semiconductor element and the plastic substrate protects the thin-film semiconductor element from damage caused by mechanical stress in the device fabrication process due to the different thermal expansion coefficients, enabling the semiconductor device to function reliably. | 2009-08-27 |
20090212399 | ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME - An electronic component includes a substrate, a functional element formed on the substrate, a plurality of terminals including a first terminal electrode connected to the functional element and a second terminal electrode layered on the first terminal electrode, and a feed line, one end of which is electrically connected to the first terminal electrode and the other end of which reaches an edge of the substrate, wherein the feed line includes a first portion directly reaching the edge, and a second portion branching from the first portion and then reaching the edge. | 2009-08-27 |
20090212400 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF - A semiconductor device includes: a semiconductor substrate having an active region on a surface thereof; at least one electrode pad provided in a peripheral portion of the surface of the semiconductor substrate; and a through electrode extending through the semiconductor substrate and connected to the electrode pad. A taper is provided on at least one side of the semiconductor substrate, whereby a portion of the through electrode which is exposed to a side of the semiconductor substrate serves as an external electrode. | 2009-08-27 |
20090212401 | PACKAGE SYSTEM FOR SHIELDING SEMICONDUCTOR DIES FROM ELECTROMAGNETIC INTERFERENCE - The present invention provides a package system including: providing a semiconductor die with a contact pad and a ground pad, mounting the semiconductor die on a package substrate using and adhesive layer, forming a vertical conductive structure on top of the ground pad in the semiconductor die, encapsulating at least portions of the semiconductor die, the vertical conductive structure, and the package substrate using an encapsulant, covering at least portions of the encapsulant and the vertical conductive structure with a shielding layer to place the vertical conductive structure in electrical contact with the shielding layer, and connecting the shielding layer to the package substrate. | 2009-08-27 |
20090212402 | SEMICONDUCTOR DEVICE - Disclosed is a semiconductor device which includes a semiconductor chip and a base substrate. The semiconductor chip includes a semiconductor substrate, an interconnect layer and a high-frequency interconnect. The interconnect layer is provided on the substrate. The high-frequency interconnect is formed within the interconnect layer. The semiconductor chip is mounted onto the base substrate. An electromagnetic shield layer is provided between the high-frequency interconnect and the interconnect. | 2009-08-27 |
20090212403 | THERMALLY ENHANCED MOLDED LEADLESS PACKAGE - A molded leadless package (MLP) semiconductor device includes a heat spreader with a single connecting projection extending from an edge of a cap of the heat spreader to a leadframe. The heat spreader can include additional projections on its edges that act as heat collectors and help to secure the spreader in the MLP. The connecting projection is attached to a lead of the leadframe so that heat gathered by the cap can be transferred through the connecting projection to the lead and to a printed circuit board to which the lead is connected. In embodiments, the heat spreader includes a central heat collector projection from the cap toward the die, preferably in the form of a solid cylinder, that enhances heat collection and transfer to the cap. The cap can include fins projecting from its top surface to facilitate radiant and convection cooling. | 2009-08-27 |
20090212404 | LEADFRAME HAVING MOLD LOCK VENT - A leadframe for supporting a semiconductor chip, the leadframe including a die pad having a first major surface and an opposing second major surface defining a thickness and having at least one perimeter edge, and an opening spaced from the at least one perimeter edge and extending through the thickness of the die pad between the first and second major surfaces. A vent extends from the at least one perimeter edge to the opening so that the opening is in communication with the at least one perimeter edge. | 2009-08-27 |
20090212405 | STACKED DIE MOLDED LEADLESS PACKAGE - A stacked die molded leadless package (MLP) stacks two dice and uses leads formed integrally with top and central clips and a leadframe to avoid wire bonding. The central clip leads are source and gate leads leading to source and gate portions of the central clip common to source and gate regions of both dice. The top clip and leadframe are thus connected to the drain regions of the upper and lower dice, the leads of the top clip being drain leads connected to the leadframe leads. The central clip and leadframe leads provide source, gate, and drain terminals in the finished MLP. A method of making the MLP includes flip-chip assembly of the clips, dice, and leadframes in pairs or greater simultaneous quantities. Spacers can be employed between connected components to ensure proper alignment and distribution of bonding material. | 2009-08-27 |
20090212406 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - When manufacturing a semiconductor device by mounting a semiconductor chip | 2009-08-27 |
20090212407 | Infinitely Stackable Interconnect Device and Method - An infinitely stackable interconnect device and method having the capability for electrical, thermal, optical, and fluidic interconnections to various layers. Through-substrate vias in the interconnect device are filled to enable electrical and thermal connection or optionally hermetically sealed relative to other surfaces to enable fluidic or optical connection. Optionally, optical components may be placed within the via region in order to manipulate optical signals. Redistribution of electrical interconnection is accomplished on both top and bottom surfaces of the substrate of the interconnect chip. The method for fabricating the interconnect device includes the steps of: forming, insulating, and at least partially filling vias with conductive material; connecting vias to conductive traces on a top surface of the interconnect chip; connecting vias to conductive traces on a bottom surface of the interconnect chip; providing bump regions for electrical and mechanical interconnection to a subsequent interconnect device; and forming recessed regions to accommodate a subsequent die in a stack. The method simultaneously accomplishes interconnection and packaging of multiple semiconductor die to form a stack. | 2009-08-27 |
20090212408 | INTEGRATED CIRCUIT PACKAGE SYSTEM FOR STACKABLE DEVICES - An integrated circuit package system comprising: providing a package die; and connecting a connector lead having a first connector end with a protruded connection surface and a lowered structure over the package die. | 2009-08-27 |
20090212409 | Stackable Semiconductor Package and Stack Method Thereof - A stackable semiconductor package is disclosed. In the stackable semiconductor package, land grid array (LGA) or ball grid array (BGA) semiconductor packages are stacked in the vertical direction. The stackable semiconductor package comprises: a first semiconductor package including a first substrate, at least one first semiconductor die mounted on the first substrate to be electrically connected to the first substrate, and a first encapsulant molded on the first substrate to surround the first semiconductor die; a second semiconductor package including a second substrate, at least one second semiconductor die mounted on the second substrate to be electrically connected to the second substrate, and a second encapsulant molded on the second substrate to surround the second semiconductor die; and one or more interposers positioned between the first and second semiconductor packages to electrically connect the first substrate to the second substrate so that the first and second semiconductor packages are stacked in the vertical direction. Further disclosed is stack method of semiconductor package. | 2009-08-27 |
20090212410 | STACK DIE PACKAGES - An integrated circuit package includes a substrate comprising a first contact. A first integrated circuit mechanically attached to the substrate. The first integrated circuit comprising a second contact. A first redistribution layer arranged on the first integrated circuit. The first redistribution layer includes a trace coupled to the second contact. A first wire connects the first contact to the second contact. A flip-chip integrated circuit comprises a third contact connected to the trace by a conductive bump. A second integrated circuit mechanically coupled to the flip-chip integrated circuit. The second integrated circuit comprises a fourth contact. A second wire connects the fourth contact to at least the second contact or the first contact. | 2009-08-27 |
20090212411 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR - A semiconductor device includes a thermoplastic resin case, a semiconductor chip mounted within the thermoplastic resin case, a metal terminal having a wire bonding surface and an opposing contact surface, and a wire connected between the wire bonding surface and the semiconductor chip. The contact surface of the metal terminal is thermoplastically bonded at an area to the inside of the thermoplastic resin case. | 2009-08-27 |
20090212412 | SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING - Provided is a semiconductor package accomplishing a fan-out structure through wire bonding in which a pad of a semiconductor chip is connected to a printed circuit board through wire bonding. A semiconductor package can be produced without a molding process and can be easily stacked on another semiconductor package while the appearance cracks and the warpage defects can be prevented. | 2009-08-27 |
20090212413 | BALL GRID ARRAY PACKAGE LAYOUT SUPPORTING MANY VOLTAGE SPLITS AND FLEXIBLE SPLIT LOCATIONS - A die package generally including (A) ground paths routing a power ground from a ground power set of contact pads in a first conductive layer to a ground ring in a second conductive layer, (B) core paths routing a core voltage from a core power set of contact pads in the first conductive layer to a core ring in the second conductive layer, and (C) input/output voltage paths routing input/output voltages from an input/output power set of contact pads in the first conductive layer to an input/output ring in the second conductive layer, (i) the input/output ring surrounding the core ring, (ii) the ring being configured to power input and output circuits of the die, (iii) the input/output ring being split into ring segments isolated from each other and (iv) at least one particular ring segment having a length of less than a single connector pitch. | 2009-08-27 |
20090212414 | SEMICONDUCTOR CHIPS HAVING REDISTRIBUTED POWER/GROUND LINES DIRECTLY CONNECTED TO POWER/GROUND LINES OF INTERNAL CIRCUITS AND METHODS OF FABRICATING THE SAME - Provided are embodiments of semiconductor chips having a redistributed metal interconnection directly connected to power/ground lines of an internal circuit are provided. Embodiments of the semiconductor chips include an internal circuit formed on a semiconductor substrate. A chip pad is disposed on the semiconductor substrate. The chip pad is electrically connected to the internal circuit through an internal interconnection. A passivation layer is provided over the chip pad. A redistributed metal interconnection is provided on the passivation layer. The redistributed metal interconnection directly connects the internal interconnection to the chip pad through a via-hole and a chip pad opening, which penetrate at least the passivation layer. Methods of fabricating the semiconductor chip are also provided. | 2009-08-27 |
20090212415 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTERNAL INTERCONNECTS WITHIN A DIE PLATFORM - The present invention provides an integrated circuit package system comprising: attaching a die platform to an integrated circuit die; mounting the integrated circuit die over an external interconnect with a bottom side of the external interconnect partially within the die platform; connecting the integrated circuit die and the external interconnect; and forming an encapsulation over the integrated circuit die with the external interconnect partially exposed. | 2009-08-27 |
20090212416 | INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURING SAME - An integrated circuit package includes a substrate ( | 2009-08-27 |
20090212417 | Semiconductor Device - A semiconductor device including: a heat sink, a die on the heat sink, resin encapsulating the die, and a mounting aperture in the resin having at least a segment between the heat sink and a first end of the resin, wherein the thickness of the heat sink is no greater than 35% of the thickness of the device. | 2009-08-27 |
20090212418 | THERMAL INTERFACE MATERIAL DESIGN FOR ENHANCED THERMAL PERFORMANCE AND IMPROVED PACKAGE STRUCTURAL INTEGRITY - An electronic package comprising a semiconductor device, a heat spreader layer, and a thermal interface material layer located between the semiconductor device and the heat spreader layer. The thermal interface material layer includes a resin layer having heat conductive particles suspended therein. A portion of the particles are exposed on at least one non-planar surface of the resin layer such that the portion of exposed particles occupies a majority of a total area of a horizontal plane of the non-planar surface. | 2009-08-27 |
20090212419 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH OVERHANG FILM - An integrated circuit package system includes: connecting a first interconnect between a carrier and a bottom integrated circuit thereover; forming a film, having an overhang portion, over the bottom integrated circuit with the overhang portion over the first interconnect; mounting a top integrated circuit over the film; connecting a second interconnect between the top integrated circuit and the carrier with the overhang portion between the first interconnect and the second interconnect; and forming an encapsulation over the carrier covering the top integrated circuit, the film, the first interconnect, and the second interconnect. | 2009-08-27 |
20090212420 | INTEGRATED CIRCUIT DEVICE AND METHOD FOR FABRICATING SAME - Fabricating an integrated circuit device includes providing a semiconductor substrate comprising a first surface and a sec-ond surface, forming a wiring layer on the first surface of the semiconductor substrate, providing a circuit chip, and arranging the circuit chip on the wiring layer of the semi-conductor substrate. The fabricating further includes forming an embedding layer on the wiring layer and on the circuit chip, the embedding layer encapsulating the circuit chip, thinning the semiconductor substrate at the second surface after forming the embedding layer, and forming a conductive via in the semiconductor substrate being electrically coupled to the wiring layer and exposed at the second surface of the semiconductor substrate. Moreover, an integrated circuit de-vice is described. | 2009-08-27 |
20090212421 | POLYMER INTERLAYER DIELECTRIC AND PASSIVATION MATERIALS FOR A MICROELECTRONIC DEVICE - Polymer interlayer dielectric and passivation materials for a microelectronic device are generally described. In one example, an apparatus includes one or more interconnect structures of a microelectronic device and one or more polymeric dielectric layers coupled with the one or more interconnect structures, the polymeric dielectric layers including copolymer backbones having a first monomeric unit and a second monomeric unit wherein the first monomeric unit has a different chemical structure than the second monomeric unit and wherein the copolymer backbones are cross-linked by a first cross-linker or a second cross-linker, or combinations thereof. | 2009-08-27 |
20090212422 | JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION - An improvement of joint reliability between Sn-yAg (0≦y≦4.0) solder and Ni—P under-bump metallic layers is achieved by cobalt (Co) addition. A solder joint with improved joint reliability is formed between a solder part of an electronic packaging and an under-bump metallic (UBM) layer, which has a specific structure comprising Sn-yAg-xCo (0.02≦x≦0.1, 0≦y≦4.0) alloy solder containing cobalt (Co) ingredient bonded to a Ni—P UBM. Also, a solder joint with a joint structure comprising Sn-yAg-xCo (0.02≦x≦0.1, 0≦y≦4.0) alloy solder with addition of Co ingredient and Ni—P UBM is formed, which is inserted between a PCB substrate and a silicon chip to join the same. | 2009-08-27 |
20090212423 | STACKED SOLDER BALLS FOR INTEGRATED CIRCUIT DEVICE PACKAGING AND ASSEMBLY - A semiconductor device is provided that includes a semiconductor chip, a plurality of solder bumps that electrically couple the semiconductor chip to the outside, and a metal bump being provided on the surface of each first solder bump which is at least a part of the plurality of solder bumps and being made of a metal having a melting point higher than that of the first solder bump. The wettability of the first solder bump is improved as each metal bump serves as a core when the corresponding first solder bump melts. Thus, the connection reliability of the first solder bump can be improved. | 2009-08-27 |
20090212424 | ROUTING STRUCTURE OF RE-DISTRIBUTION LAYER AND METHOD FOR RE-DISTRIBUTING ROUTING STRUCTURE IN INTEGRATED CIRCUIT - A routing structure of an RDL of a chip is provided. The routing structure comprises a power route, a plurality of first stripes, a ground route, and a plurality of second stripes. The power route is arranged in a first direction and comprises a plurality of first bumps and a plurality of first line segments. Each of the first line segments connects adjacent first bumps. The first stripes are arranged in a second direction and connected to the power route. The ground route is disposed at one side of the power route in a third direction, and comprises a plurality of second bumps and a plurality of second line segments. Each of the second line segments connects adjacent second bumps. The second stripes, are arranged in a forth direction and connected to the ground route. The first stripes and the second stripes are interleaved without intersecting one another. | 2009-08-27 |
20090212425 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME - A technique is provided which allows a chip mounted by wire bonding and a chip mounted by bump electrodes to share a manufacturing process. Both in a case where a chip is electrically coupled to an external circuit by bump electrodes and a case where the chip is electrically coupled to the external circuit by bonding wires, a bump coupling part and a bonding pad are both provided in a single uppermost wiring layer. When the bump electrodes are used, an opening is provided in an insulating film on the bump coupling part and a surface of the bonding pad is covered with the insulating film. On the other hand, when the bonding wires are used, an opening is provided in an insulating film on the bonding pad and a surface of the bump coupling part is covered with the insulating film. | 2009-08-27 |
20090212426 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - In a semiconductor device, a region under a pad electrode with a bump can be utilized efficiently and a large amount of force is prevented from applying locally to a semiconductor substrate under the bump when the semiconductor device is mounted. A first layer metal wiring is formed on the semiconductor substrate. A pad electrode is formed on the first layer metal wiring through an interlayer insulation film. The pad electrode is connected with the first layer metal wiring through a via hole that is formed in the interlayer insulation film. A protection film is formed on the pad electrode. The protection film has an opening to expose the pad electrode and an island-shaped protection film formed in the opening. An Au bump connected with the pad electrode through the opening in the protection film is formed on the pad electrode. The via hole is formed under the island-shaped protection film, and incompletely filled with a portion of the pad electrode. | 2009-08-27 |
20090212427 | Solder Structures Including Barrier Layers with Nickel and/or Copper - An electronic device may include an electronic substrate, and an under bump seed metallurgy layer on the electronic substrate. A barrier layer may be provided on the under bump seed metallurgy layer so that the under bump seed metallurgy layer is between the barrier layer and the electronic substrate, and the barrier layer may include nickel and/or copper. Moreover, portions of the under bump seed metallurgy layer may be undercut relative to portions of the barrier layer. In addition, a solder layer may be provided on the barrier layer so that the barrier layer is between the solder layer and the under bump seed metallurgy layer. | 2009-08-27 |
20090212428 | RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME - A conductive line structure of a semiconductor device, the structure comprising a substrate having bonding pad; a first dielectric layer formed over the substrate; a solder pad formed over the first dielectric layer; a buffer scheme formed over the first dielectric layer and between the bonding pad and the solder pad; a conductive line formed over the buffer scheme for coupling between the bonding pad and the solder pad; a second dielectric layer formed over the conductive line to expose the solder pad; and a solder ball formed over the solder pad. | 2009-08-27 |
20090212429 | Semiconductor Device and Method of Supporting a Wafer During Backgrinding and Reflow of Solder Bumps - A semiconductor device is made by providing a semiconductor wafer having an active surface, forming an under bump metallization layer on the active surface of the semiconductor wafer, forming a first photosensitive layer on the active surface of the semiconductor wafer, exposing a selected portion of the first photosensitive layer over the under bump metallization layer to light, removing a portion of a backside of the semiconductor wafer, opposite to the active surface, prior to developing the exposed portion of the first photosensitive layer, developing the exposed portion of the first photosensitive layer after removing the portion of the backside of the semiconductor wafer, and depositing solder material over the under bump metallization layer to form solder bumps. The remaining portion of the first photosensitive layer is then removed. A second photosensitive layer or metal stencil can be formed over the first photosensitive layer. | 2009-08-27 |
20090212430 | CARBON NANOTUBE-BASED CONDUCTIVE CONNECTIONS FOR INTEGRATED CIRCUIT DEVICES - Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material ( | 2009-08-27 |
20090212431 | THERMALLY PROGRAMMABLE ANTI-REVERSE ENGINEERING INTERCONNECTS AND METHODS OF FABRICATING SAME - An interconnect and method of making the interconnect. The method includes forming a dielectric layer on a substrate, the dielectric layer having a top surface and a bottom surface; forming a first wire and a second wire in the dielectric layer, the first wire separated from the second wire by a region of the dielectric layer; and forming metallic nanoparticles in or on the top surface of the dielectric layer between the first and second wires, the metallic nanoparticles capable of electrically connecting the first wire and the second wire only while the nanoparticles are heated to a temperature greater than room temperature and a voltage is applied between the first and second wires. | 2009-08-27 |
20090212432 | SEMICONDUCTOR DEVICE, ITS MANUFACTURING METHOD, AND SPUTTERING TARGET MATERIAL FOR USE IN THE METHOD - A semiconductor device enables a barrier layer to fully acquire a barriering property against the diffusion of Cu from a wiring main body and the diffusion of Si from an insulating film, enhances the adhesiveness of the barrier layer and the insulating film and excels in reliability of operation over a long period of time. In this invention, a semiconductor device | 2009-08-27 |
20090212433 | STRUCTURE AND PROCESS FOR METALLIZATION IN HIGH ASPECT RATIO FEATURES - A high aspect ratio metallization structure is provided in which a noble metal-containing material is present at least within a lower portion of a contact opening located in a dielectric material and is in direct contact with a metal semiconductor alloy located on an upper surface of a material stack of at least one semiconductor device. In one embodiment, the noble metal-containing material is plug located within the lower region of the contact opening and an upper region of the contact opening includes a conductive metal-containing material. The conductive metal-containing material is separated from plug of noble metal-containing material by a bottom walled portion of a U-shaped diffusion barrier. In another embodiment, the noble metal-containing material is present throughout the entire contact opening. | 2009-08-27 |
20090212434 | METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR STRUCTURE - Processes for improving adhesion of films to semiconductor wafers and a semiconductor structure are provided. By implementing the processes of the invention, it is possible to significantly suppress defect creation, e.g., decrease particle generation, during wafer fabrication processes. More specifically, the processes described significantly reduce flaking of a TaN film from edges or extreme edges (bevel) of the wafer by effectively increasing the adhesion properties of the TaN film on the wafer. The method increasing a mol percent of nitride with respect to a total tantalum plus nitride to 25% or greater during a barrier layer fabrication process. | 2009-08-27 |
20090212435 | POWER SEMICONDUCTOR DEVICE INCLUDING A DOUBLE METAL CONTACT - A power semiconductor device that includes a stack of a thin metal layer and a thick metal layer over the active region thereof, and a method for the fabrication thereof. | 2009-08-27 |
20090212436 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME - A semiconductor structure and method for forming the same are provided. The semiconductor structure comprises a semiconductor substrate, a plurality of top metallizations on the semiconductor substrate, a high density plasma layer filling gaps between the top metallizations and having a substantially planar upper surface overlying the top metallizations, and a passivation layer overlying the high density plasma layer. A metal bump can be formed overlying the top metallizations through the passivation layer and HDPCVD layer for subsequent bonding. | 2009-08-27 |
20090212437 | SEMICONDUCTOR DEVICE - In a semiconductor device having a Low-k film as an interlayer insulator, peeling of the interlayer insulator in a thermal cycle test is prevented, thereby providing a highly reliable semiconductor device. In a semiconductor device having a structure in which interlayer insulators in which buried wires each having a main electric conductive layer made of copper are formed and cap insulators of the buried wires are stacked, the cap insulator having a relatively high Young's modulus and contacting by its upper surface with the interlayer insulator made of a Low-k film having a relatively low Young's modulus is formed so as not to be provided in an edge portion of the semiconductor device. | 2009-08-27 |
20090212438 | INTEGRATED CIRCUIT DEVICE COMPRISING CONDUCTIVE VIAS AND METHOD OF MAKING THE SAME - A semiconductor substrate for an integrated circuit device comprises at least one insulating substrate region being formed of a cohesive insulating material. The insulating substrate region includes at least two conductive vias extending at least between a first surface and a second surface of the insulating substrate region. | 2009-08-27 |
20090212439 | FLUORINE DEPLETED ADHESION LAYER FOR METAL INTERCONNECT STRUCTURE - A line trough and a via cavity are formed within a dielectric layer comprising a fluorosilicate glass (FSG) layer. A fluorine depleted adhesion layer is formed within the line trough and the via cavity either by a plasma treatment that removes fluorine from exposed surfaces of the FSG layer, or by deposition of a substantially fluorine-free dielectric layer. Metal is deposited within the line trough and the via cavity to form a metal line and a metal via. The fluorine depleted adhesion layer provides enhanced adhesion to the metal line compared with prior art structures in which a metal line directly contacts a FSG layer. The enhanced adhesion of metal with an underlying dielectric layer provides higher resistance to delamination for a semiconductor package employing lead-free C4 balls on a metal interconnect structure. | 2009-08-27 |
20090212440 | Semiconductor device - An object of the present invention is to solve the problem that the number of pads increases due to high packaging density and the size of semiconductor devices increases due to increase of the pad density. A semiconductor device according to the present invention uses a conductor trace on an interconnection substrate to interconnect two nonadjacent pads. | 2009-08-27 |
20090212441 | Semiconductor Interconnect Structure with Stacked Vias Separated by Signal Line and Method Therefor - A semiconductor device is made by forming a first conductive layer over a substrate, forming a first passivation layer over the first conductive layer, forming a first via in the first passivation layer to expose the first conductive layer, forming a second conductive layer over the first passivation layer and within the first via to electrically connect to the first conductive layer, forming a second passivation layer over the second conductive layer, and forming a second via in the second passivation layer to expose the second conductive layer. The second via is smaller than the first via. The second via is either physically separate from or disposed over the first via. The second conductive layer within the second via has a flat surface which is wider than the second via. An under bump metallization is formed in the second via and electrically connected to the second conductive layer. | 2009-08-27 |
20090212442 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PENETRABLE FILM ADHESIVE - An integrated circuit package system including: providing a wire bonded die with an active side and a bond wire connected thereto; forming a penetrable film adhesive on the active side and partially encapsulating the bond wire; mounting an interposer, having a first functional side facing up away from the wire bonded die and a second functional side facing down toward the wire bonded die and having exposed conductors, over the wire bonded die; providing a substrate and connecting the first functional side by the exposed conductor with an electrical interconnect to the substrate; and encapsulating the wire bonded die, and the penetrable film adhesive with an encapsulation. | 2009-08-27 |
20090212443 | INTEGRATED CIRCUIT PACKAGE SUBSTRATE HAVING CONFIGURABLE BOND PADS - Methods, systems, and apparatuses for integrated circuit package substrates, integrated circuit packages, and processes for assembling the same, are provided. A substrate for a flip chip integrated circuit package includes a substrate body having opposing first and second surfaces. A solder mask layer covers at least a portion of the first surface of the substrate body. First and second electrically conductive features are formed on the substrate body. The first electrically conductive feature is a portion of a first electrical signal net, and the second electrically conductive feature is a portion of a second electrical signal net. The first and second electrically conductive features are configured to be selectively electrically coupled together by application of an electrically conductive material. The electrically conductive material may be a conductive epoxy, a jumper, a solder paste, a solder ball, or a solder bump that couples a flip chip die to the substrate. | 2009-08-27 |
20090212444 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package including a substrate, a circuit pattern, a chip, at least one conductive material and an adhesive is provided. The substrate has a first surface, a second surface opposite thereto, and at least one through hole which penetrates the first surface and the second surface. The circuit pattern structure is disposed on the second surface and has at least one connecting pad disposed at the through hole. The chip is disposed on the first surface of the substrate. The chip has at least one conductive post, wherein the conductive post and the conductive material are disposed inside the through hole, and the conductive post is electrically connected with the pattern circuit structure through the conductive material. The adhesive is disposed between the chip and the substrate. A manufacturing method of the semiconductor structure is also provided. | 2009-08-27 |
20090212445 | SEMICONDUCTOR INTEGRATED CIRCUIT - In a semiconductor integrated circuit, a second wiring layer includes a ground conductor having at least one opening formed therein. At least one opening is overlapped by at least one patch conductor included in a third wiring layer. At least one patch conductor and the ground conductor are electrically connected to each other by at least one via hole included in a second dielectric layer. A first wiring layer includes a signal line above the ground conductor. | 2009-08-27 |
20090212446 | Semiconductor Device - A semiconductor device including: a die pad, a die on the die pad, and resin encapsulating the die and forming an isolation thickness over the die pad, the resin including a mounting aperture and a major surface configured for mounting to an external device, the major surface having a non warpage compensation portion adjacent the die and a warpage compensation portion in a relatively thermally inactive zone with an approximate discontinuity and/or abrupt change in gradient between the non warpage compensation portion and the warpage compensation portion. | 2009-08-27 |
20090212447 | Mark Structure for Coarse Wafer Alignment and Method for Manufacturing Such a Mark Structure - A mark structure includes on a substrate, at least four lines. The lines extend parallel to each other in a first direction and are arranged with a pitch between each pair of lines that is directed in a second direction perpendicular to the first direction. The pitch between each pair of selected lines differs from the pitch between each other pair of selected lines. | 2009-08-27 |
20090212448 | FUEL SUPPLY ASSEMBLY - A fuel supply assembly for a two-stroke crankcase scavenged combustion engine that is operated with layered scavenging is presented. The assembly includes a housing and a first and second parallel channels extending through the housing. The first channel is for a fuel/air mixture and the second channel is for auxiliary air. The assembly also includes a partition wall extending in a plane between the first and second channels and arranged upstream and downstream of at least one butterfly valve. The assembly also includes a protruding section which extends across the butterfly along the axis of rotation at least on the downstream side of the butterfly. The housing includes fuel-conveying idling ducts that open in the first channel in the region where the butterfly valve, sealing member on the partition wall, substantially contacting the protruding section at least on the downstream side of the butterfly. | 2009-08-27 |
20090212449 | OPTICAL WAVEGUIDE SUBSTRATE MANUFACTURING METHOD - A voltage is applied on an interdigitated electrode provided on one main face of a single-domain ferroelectric single crystal substrate to form a periodic domain inversion structure | 2009-08-27 |
20090212450 | Method of manufacturing contact lens material and method of manufacturing soft contact lens - Provided is a contact lens material having a smooth surface with good water wettability and durability. In the method of manufacturing a contact lens material comprising a contact lens base material and a coating formed on at least a portion of a surface of the above base material, the contact lens base material is processed by plasma polymerization in a mixed gas atmosphere of methane and moist air, and then treated with plasma in a nonpolymerizable gas atmosphere to form the above coating. Further provided is a method of manufacturing a soft contact lens wherein water is introduced into the contact lens material manufactured by the above method to obtain a soft contact lens. | 2009-08-27 |
20090212451 | Method of Preparing Wholly Aromatic Polyester - The invention relates to a method of preparing wholly aromatic polyester including: mixing monomers, introducing the mixed monomers into a reactor having a rectangular or trapezoidal plate type stirring impeller, and polymerizing the introduced monomers through esterification with a power per unit volume of 10˜60 kW/m | 2009-08-27 |
20090212452 | RESTORING WORN RAIL CLIP SHOULDERS ON CONCRETE RAIL TIES - A method for restoring a worn rail clip shoulder located on a concrete rail tie. The method comprises applying a polymeric material to the worn rail clip shoulder located on the concrete rail tie; and restoring the worn rail clip shoulder by curing the polymeric material. The polymeric material is substantially sag resistant and maintains its shape without substantial runoff from the concrete rail tie during the restoring of the worn rail clip shoulder. | 2009-08-27 |
20090212453 | METHOD FOR CONTROLLING MOLD CLAMPING DEVICE - A predetermined speed control pattern B is sct. In a mold clamping process, in a mold closing section Zm, mold closing control is performed at a mold closing speed Vm, and based on a current mold closing speed Vd and a current mold closing position Xd, which are both detected, a deceleration starting position Xmc of the deceleration section Zmd, where the current mold closing speed Vd becomes a zero (O) at a virtual stop position Xc, is sequentially forecasted at each predetermined time interval by calculation. Upon reaching the deceleration starting position Xmc the deceleration section Zmd is started, and in the deceleration section Zmd, based on the detected current mold closing position Xd, a speed command value Dm corresponding to the speed control pattern B is obtained sequentially by calculation, and according to the speed command value Dm deceleration control is performed. Upon reaching a mold clamping-transition speed Ve, a predetermined mold clamping processing is performed via a low-pressure low-speed section Zc. | 2009-08-27 |
20090212454 | Process for Making Integrated Layered Urethane Products - Polyurethane shapes containing a core layer of a water soluble polymer such as polyethylene oxide (PEO) are produced by casting onto a surface an aqueous mixture containing a pre-polymer of a hydrophilic polyurethane as a first layer of uncured polyurethane, covering the uncured first layer with release paper and compressing the layer, uncovering the uncured first layer and distributing PEO on the uncured surface, applying a second layer of uncured polyurethane on top of the PEO while the polyurethane is still uncured, then covering the resulting mass with release paper and compressing it to form an integrated, layered shaped article containing a core region enriched in PEO that when wetted releases PEO over an extended period. The second layer is applied by adhering about one-half of the first uncured foam layer to the release paper as the first uncured layer is uncovered and then recombining the adhered material on top of the PEO and further compressing the resulting mass to produce an integrated, layered shaped article. The second layer can be applied, alternatively, by independently casting a second layer of uncured polyurethane foam after distributing the PEO and then compressing and curing. The PEO containing shapes are useful in making improved comfort strips for wet shaving razors. Shape products of the process where the core region contains other specified working ingredients are useful in applications including bandages and wound dressings, cosmetic sponges, cleaning and polishing sponges, dry cleaning and anti-static sheets, and in household, industrial and environmental clean up and waste recovery. | 2009-08-27 |
20090212455 | Method for Assembling Articles - Methods and tools for assembling an article are provided. The method includes providing a mold having a cavity configured as a desired shape, positioning a base within the mold so that a surface of the base material is exposed, applying a coating material, e.g., urethane or polyurethane, to substantially cover both the exposed surface of the base and an inner surface of the cavity, depositing a cushion material into the cavity and sealing the cavity with the exposed surface of the base so that the coating material forms a skin around the cushion material and adheres the cushion material to the base. | 2009-08-27 |
20090212456 | Apparatus for Imparting Indentations in a Slug from Which Simulated Green Tumbled Bricks Are Formed - An apparatus for imparting indentations in a slug from which green bricks are formed. The slug is elongate about a longitudinal axis and rectangular in transverse cross section to thereby provide a first and second side face extending parallel to the longitudinal axis, a top face and a bottom face. The first and second side face intersect with the top face at a first and second edge, respectively. The apparatus includes a conveyance assembly for conveying the slug in a working direction parallel to the longitudinal axis, and a first and second indentation assembly, adjacent to the conveyance assembly for imparting indentations to the first and second edge of the slug, respectively. The apparatus further includes a third indentation assembly for imparting indentations to the top face of the slug; and control means for controlling operation of the conveyance assembly and the first, second and third indentation assembly. The indentations imparted to the top face of the slug are aligned with the indentations imparted to the first and second edge. | 2009-08-27 |
20090212457 | System and method for making sheets, films, and objects directly from polymerization processes - A system for making sheets, films, and objects including a reactor-dryer for reacting at least one monomer to produce a polymer melt; a flash melter in communication with the reactor-dryer for heating the polymer melt received from the reactor-dryer; a flash tank in communication with the flash melter for removing volatile compounds from the polymer melt; and a control loop in communication with the flash tank for controlling the pressure of the polymer melt from the flash tank to a die forming unit. Methods of making sheets, films, and objects is further included. | 2009-08-27 |
20090212458 | METHOD AND APPARATUS FOR FORMING ARTICLES FROM MOULDABLE MATERIALS - A method and apparatus for forming an article from mouldable material is disclosed. A mouldable material, such as a thermoplastic is heated until it is molten and is fed into an injector ( | 2009-08-27 |
20090212459 | Method and System for Post-Treating Preforms - The invention concerns a system for the post-treatment of preforms ( | 2009-08-27 |
20090212460 | METHOD OF MANUFACTURING LIQUID EJECTING HEAD - A method of manufacturing a liquid ejecting head and a supply member having a plurality of liquid supply passages is provided. The supply member includes first and second supply members in which liquid supply passages are provided and filters provided between the first supply member and the second supply member. The method includes: preparing a connected filter formed of a plurality of filter element portions corresponding to the plurality of liquid supply passages and a connecting portion that connects the plurality of filter element portions; in a state where the filter element portions of the connected filter are held between the first supply member and the second supply member, charging molten resin from a position corresponding to the connecting portion of the connected filter to separate the connecting portion; and, during the charging, molding. | 2009-08-27 |
20090212461 | MOLD APPARATUS AND METHOD FOR INJECTION MOLDING - A mold apparatus includes a first mold core, a second mold core, a sprue, a first insert, and a second insert. The first and second mold cores cooperatively define a first mold chamber, a second mold chamber, a first runner connected to the first mold chamber, and a second runner connected to second mold chamber. The sprue bushing has a sprue, a first guiding groove, and a second guiding groove. The first and second guiding grooves are configured for guiding molten material from the sprue to the respective first and second runners. The first and second guiding grooves each have a recess. The first insert has a protruded end portion. The second insert has a recessed end portion. The first and second inserts are inserted into the first or second recess, thereby blocking the corresponding first or second runner or compensating the corresponding first or second recess. | 2009-08-27 |
20090212462 | IMPRINT LITHOGRAPHY - An imprint lithography apparatus is disclosed that has a first array of template holders, a second array of template holders, and a substrate table arranged to support a substrate to be imprinted, wherein the first array of template holders is arranged to hold an array of imprint templates that can be used to imprint a first array of patterns onto the substrate, and the second array of template holders is arranged hold an array of imprint templates that can be used to imprint a second array of patterns onto the substrate, the patterns imprinted by the second array being interspersed between the patterns imprinted by the first array. | 2009-08-27 |
20090212463 | APPARATUS FOR RECOVERING AND MOULDING STONES AND ORNAMENTAL ROCKS - The present invention concerns an apparatus for recovering and moulding stones and ornamental rocks. It comprises the following components:
| 2009-08-27 |
20090212464 | INJECTION MOLDING MACHINE AND METHOD OF USING THE SAME - The molding apparatus includes a cavity mold with a cavity surface for defining a cavity in which a molten injection material is injected, and a core mold with a core surface for defining the cavity upon engagement with the cavity mold. The core mold has an intermediate core mold plate having the core surface and a support plate. A guide pin inserted into a guide hole formed in the cavity mold and fitted through the intermediate core mold plate to allow the intermediate core mold plate to be moved only in a forward and backward direction is fixed to the support plate. A first spring is installed between the intermediate core mold plate and the support plate, a first heating means is installed to a parting surface of the intermediate core mold plate and a cooling means is installed to the support plate. | 2009-08-27 |
20090212465 | APPARATUS AND METHOD OF FABRICATING A COMPENSATING ELEMENT FOR WAVEFRONT CORRECTION USING SPATIALLY LOCALIZED CURING OF RESIN MIXTURES - An optical wavefront correction plate incorporates a unique, three-dimensional spatial retardation distribution utilizing the index of refraction change of resin mixture in its cured state. The optical wave plate comprises a pair of transparent plates, containing a layer of a monomers and polymerization initiators, such as resin mixture. This resin mixture exhibits a variable index of refraction as a function of the extent of its curing. Curing of the resin mixture may be made by exposure to light, such as ultraviolet light, and may be varied across and through the surface of the resin mixture to create a particular and unique three-dimensional wavefront retardation profile. The optical wave plate provides improved performance in large area mirrors, lenses, telescopes, microscopes, and ophthalmic diagnostic systems. | 2009-08-27 |
20090212466 | Catheter With Formed Guide Wire Ramp - A rapid exchange catheter comprises a guide wire lumen including a substantially sealed portion in which a lumen wall extends around an entire periphery thereof and a channel portion including a channel opening the lumen to an exterior of the catheter, wherein a width of the channel is less than a maximum width of the channel portion. A guide wire ramp extends into the channel portion, with the ramp extending further into the lumen of the channel portion as a distal end of the ramp is approached. | 2009-08-27 |
20090212467 | Expandable Bladder - An expandable bladder for manufacturing pneumatic tyres is used in combination with a vulcanisation apparatus including, for example, a mould having a plurality of sidewall plates and tread sectors that, when the mould is closed, delimit a moulding cavity suitable for housing the green pneumatic tyre to be cured. The expandable bladder includes an elastomeric material obtained by curing an elastomeric composition which includes at least one butyl rubber and at least one compound having at least one double bond and an at least partially fluorinated alkyl or polyoxyalkylene chain. | 2009-08-27 |
20090212468 | APPARATUS AND METHOD FOR FORMING AIR-LAID ABSORBENT CORES - An apparatus for forming air-laid absorbent cores, having a first and second mat-forming wheel, means for transferring a core element on the first mat-forming wheel onto a core element on the second mat-forming wheel while the latter core element still is maintained in its mould. The apparatus has means for applying a protective layer to the bottom of each mould of the second mat-forming wheel, means for applying a web of casing material on the peripheral surface of the first mat-forming wheel, means for guiding said web of casing material onto the periphery of the second mat-forming wheel, and means for changing the synchronization of the mat-forming wheels in order to control the time at which the leading edge of a mould on one of the mat-forming wheels passes the nip. A method of producing cores with different sizes without change of moulds. | 2009-08-27 |
20090212469 | METHODS OF MAKING A MIXTURE FOR A PTFE MEMBRANE WITH INORGANIC MATERIALS, AND COMPOSITIONS RELATED THERETO - Method for making a mixture used in the production of a polytetrafluoroethylene (PTFE) membrane including porous inorganic materials. The mixture includes PTFE resin, a lubricating agent, and a porous inorganic material. The mixture may be further processed to form a PTFE membrane. | 2009-08-27 |
20090212470 | Melting or Holding Furnace - A melting or holding furnace includes a furnace chamber surrounded by a housing. The chamber holds the melt with a maximum filling level. The furnace also has an outlet opening for transferring the melt to another container. The outlet opening is provided with a shut-off valve for dosing the emerging melt. The valve is covered by melt in normal operation. The housing is connected to a tilting device which tilts the housing in such a manner that the shut-off valve can be freed from melt for the purpose of repairing it even at a maximum filling level. | 2009-08-27 |
20090212471 | BOARD LINED FURNACE WITH SIDE IMMERSION HEATING ELEMENTS - A holding furnace for holding a molten metal includes a housing having an interior chamber for holding the molten metal. An insulating board structure is placed into the chamber along at least a side portion of the housing. The insulating board structure contains heat within the housing for maintaining the metal in a molten state. A heater assembly is provided in a side of the furnace. The heater assembly is installed in the side of the furnace with a structural arrangement that protects against leakage of molten metal from the furnace interior to the furnace exterior. | 2009-08-27 |
20090212472 | STRUT ASSEMBLY WITH AIR SPRING - A strut assembly includes a damper having a housing and a rod moveable relative to the housing along a longitudinal axis. The strut assembly includes a flexible membrane configured to receive a pressurized gas to form an air spring. A coil spring defines an inner diameter with the housing disposed within the inner diameter to permit relative movement between the coil spring and the housing. The coil spring is at least partially disposed outside the flexible membrane relative to the longitudinal axis. | 2009-08-27 |
20090212473 | Hydraulic Suspension System - A hydraulic suspension system includes a suspension base ( | 2009-08-27 |
20090212474 | Energy Absorption Apparatus for Fall Protection Systems - An energy absorption device is disclosed for use both as an in-line and horizontal life line shock or energy absorbers for fall arrest systems. The energy absorption device generally includes an elongate housing sleeve constructed from two mating halves, said housing sleeve having disposed therein at least one biasing element, a plurality of reinforcing plates, a fastener for securing the mating halves of the housing sleeve together, and a honeycomb core. The honeycomb core is pre-crushed in an axial direction such that peak load forces caused by an initial fall are eliminated and the core is crushed at a substantially uniform level. Further, a pretension indicator may be provided for assisting a user in obtaining a predetermined tension on the device. | 2009-08-27 |
20090212475 | Fastening Means Preventing The Transmission of Shocks and Vibrations - In an apparatus for connecting a structural member ( | 2009-08-27 |
20090212476 | COMPRESSION SPRINGS AND METHODS OF MAKING SAME - Compression springs, such as helical compression springs, include end portions with selectively contoured inner contact surfaces. The selective contours of the inner contact surfaces may take the form of planar, grooved, concave, or other shaped, non-circular surfaces. In addition, enough of the inner contact surface is contoured to reduce the contact stress and/or stress concentration effects on the adjacent coils when the compression spring is placed under load and the adjacent coil engages or contacts the respective end portion. The selective contouring of the end portions may be accomplished by holding the spring in a holder and moving a cutter relative to the end portion of the spring to remove the desired amount of material from the end portion. | 2009-08-27 |
20090212477 | Adjustable Door Spreader - The invention relates to an adjustable door spreader apparatus for use in the door framing industry. The apparatus equips a carpenter engaged in framing doors with an adjustable door spreader capable of spreading virtually all common door sizes, thereby saving time and materials by eliminating the need to build a single-use spreader for each door to be framed. | 2009-08-27 |
20090212478 | POWER ASSIST DEVICE AND METHOD OF CONTROLLING THE POWER ASSIST DEVICE - A method of controlling a power assist device including a workpiece holding device, a handle, a force sensor that measures operating force of a worker that acts on the handle, a robot arm that supports the workpiece holding device, and a control device that controls an action of the robot arm based on a measurement result of the force sensor. The workpiece holding device includes an angle sensor that measures an inclination angle of the workpiece holding device. An action of robot arm is controlled by the control device based on measurement results of the angle sensor and of the force sensor. | 2009-08-27 |
20090212479 | Floor engaging device for workbench - A workbench includes a wheel device secured to a work table, four floor engaging extremities attached to the work table, four rotary members rotatably attached to the work table and engaged with the floor engaging extremities respectively for adjusting the work table up and down relative to the floor engaging extremities, and a coupling device for coupling the rotary members together and for allowing the rotary members to be rotated relative to the floor engaging extremities simultaneously and thus for allowing the work table to be adjusted up and down relative to the floor engaging extremities simultaneously. A hand wheel may be coupled to the coupling device for operating the coupling device. | 2009-08-27 |
20090212480 | Transfer device for folder unit - In a transfer device R, which feeds a first web group W | 2009-08-27 |
20090212481 | PRINTING APPARATUS AND PRINT MEDIUM CONVEYANCE CONTROL METHOD - The objective of this invention is to prevent the diagonal movement of a print medium regardless of a change of print medium feed conditions, and accurately convey a print medium even when increasing the throughput. To accomplish this, it is controlled to generate a pulse signal so that a print medium conveyance speed detected by an encoder comes close to a target speed. The duty of the generated pulse signal is calculated every predetermined timing. When a sensor detects the leading end of the print medium, the duty of the pulse signal input to a feed motor is stored in a memory. It is determined whether the difference between the calculated duty and the stored duty has exceeded a predetermined value. If the difference has exceeded the predetermined value, supply of the pulse signal stops. When supply of the pulse stops, a conveyance roller is driven. | 2009-08-27 |
20090212482 | DEVICE FOR SELECTING MAILPIECES - A mailpiece selector device for separating mailpieces one-by-one from a stack of mailpieces and for transporting them downstream, the device comprising at least a first guide co-operating with a plurality of opposite selector rollers to select said mailpieces one-by-one and to transport them downstream, said first guide being comb-shaped and able to pivot about a first pivot axis in opposition to first resilient return means, one end of at least one tooth of the comb being coated with a wear-resistant material. | 2009-08-27 |
20090212483 | SHEET FEEDING DEVICE - Imaging target media stacked in a tray are bent in a width direction orthogonal to a transmission direction so that rigidity of the imaging target media in the transmission direction increases than the rigidity before bending. Consequently, even though a separation imaging-target medium is bound together with a transportation imaging-target medium using a binding member, the separation imaging-target medium is transmitted to an imaging unit along with the transportation imaging-target medium by transporting rollers without bending in the transmission direction. A superimposed-transmission of the imaging target media is detected by sensors and rotation of the transmitting roller is stopped. Due to this, the superimposed-transmission of the imaging target media is stopped just before the imaging unit. | 2009-08-27 |
20090212484 | PAPER EJECTING DEVICE - Curling of a printed sheet is corrected, friction is reduced on a paper transport surface, and the shape of the printed and ejected sheet is adjusted to a predetermined shape. | 2009-08-27 |
20090212485 | SHEET COLLECTING DEVICE, POST-PROCESSING APPARATUS AND IMAGE FORMING APPARATUS - Providing a sheet collecting device capable of being downsized and of operating stably wherein a sheet ejecting device that conveys and ejects a sheet in the direction for making the sheet fall along a slanted sheet collecting board is provided, and a leading edge stopper that holds sheets on the sheet collecting board is set so that a trailing edge of the sheet may be at a constant height independently of a sheet size. | 2009-08-27 |
20090212486 | SECURITY CONTAINER FOR VALUE DOCUMENTS - A security container for storing documents of value in stack form is provided with a stacking pocket for receiving documents of value in a stacked form, a bottom element disposed in the stacking pocket on which rests a fed document of value or a stack of fed documents of values and an inlet opening leading into the stacking pocket which is disposed such that documents of value fed to the security container after having passed through the inlet opening in the stacking pocket fall onto the bottom element or at least a document of value carried by it, in particular a topmost document of value on a stack of documents of value carried by the bottom element. In transport direction in or behind the inlet opening there is disposed at least one closing element with at least one portion which is deflectable from a closing position, in which it prevents a motion of a document of value completely entered into the stacking pocket back into the inlet opening, into a passing position in which it guides the document of value at least partially such that the document of value can reach into the stacking pocket and in which onto the portion there acts a restoring force driving towards the closing position, and which is movable against the restoring force into the passing position by a document of value fed through the inlet opening with a speed within a predetermined range. | 2009-08-27 |