33rd week of 2017 patent applcation highlights part 57 |
Patent application number | Title | Published |
20170236768 | HEAT-DISSIPATING STRUCTURE AND SEMICONDUCTOR MODULE USING SAME | 2017-08-17 |
20170236769 | HIGH THERMAL CONDUCTIVE HERMETIC RF PACKAGING | 2017-08-17 |
20170236770 | COMPLIANT PIN FIN HEAT SINK AND METHODS | 2017-08-17 |
20170236771 | Method of Forming a Reliable and Robust Electrical Contact | 2017-08-17 |
20170236772 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236773 | DEVICE WITH TOP-SIDE BASE PLATE | 2017-08-17 |
20170236774 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DRIVING DEVICE | 2017-08-17 |
20170236775 | LEAD FRAME AND METHOD FOR MANUFACTURING THE SAME | 2017-08-17 |
20170236776 | SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA | 2017-08-17 |
20170236777 | METHOD FOR MANUFACTURING A CIRCUIT CARRIER AND CIRCUIT CARRIER FOR ELECTRONIC COMPONENTS | 2017-08-17 |
20170236778 | DEVICE WITH INTERCONNECTION STRUCTURE FOR FORMING A CONDUCTION PATH OR A CONDUCTING PLANE WITH HIGH DECOUPLING CAPACITANCE | 2017-08-17 |
20170236779 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2017-08-17 |
20170236780 | INTEGRATED CIRCUIT HAVING IMPROVED ELECTROMIGRATION PERFORMANCE AND METHOD OF FORMING SAME | 2017-08-17 |
20170236781 | SELF-FORMING BARRIER FOR COBALT INTERCONNECTS | 2017-08-17 |
20170236782 | SEMICONDUCTOR MODULE MANUFACTURING METHOD AND SEMICONDUCTOR MODULE | 2017-08-17 |
20170236783 | PACKAGE STRUCTURE | 2017-08-17 |
20170236784 | ION FLOW BARRIER STRUCTURE FOR INTERCONNECT METALLIZATION | 2017-08-17 |
20170236785 | SHIELDED LEAD FRAME PACKAGES | 2017-08-17 |
20170236786 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | 2017-08-17 |
20170236787 | METHOD OF FABRICATING SEMICONDUCTOR PACKAGE HAVING METAL LAYER | 2017-08-17 |
20170236788 | Semiconductor Device and Method of Forming Interconnect Substrate for FO-WLCSP | 2017-08-17 |
20170236789 | SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236790 | Semiconductor Device on Leadframe with Integrated Passive Component | 2017-08-17 |
20170236791 | INTEGRATED CIRCUIT DEVICE | 2017-08-17 |
20170236792 | RELIABLE PASSIVATION FOR INTEGRATED CIRCUITS | 2017-08-17 |
20170236793 | Semiconductor Device | 2017-08-17 |
20170236794 | Multichip modules and methods of fabrication | 2017-08-17 |
20170236795 | CONNECTION BODY | 2017-08-17 |
20170236796 | BUMP-EQUIPPED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING BUMP-EQUIPPED ELECTRONIC COMPONENT | 2017-08-17 |
20170236797 | Ball Height Control in Bonding Process | 2017-08-17 |
20170236798 | APPARATUS FOR STACKING SEMICONDUCTOR CHIPS IN A SEMICONDUCTOR PACKAGE | 2017-08-17 |
20170236799 | BONDING METHOD FOR CONNECTING TWO WAFERS | 2017-08-17 |
20170236800 | METHOD FOR DIRECT ADHESION VIA LOW-ROUGHNESS METAL LAYERS | 2017-08-17 |
20170236801 | SEMICONDUCTOR DEVICES AND PROCESSING METHODS | 2017-08-17 |
20170236802 | Semiconductor Device and Method of Making Wafer Level Chip Scale Package | 2017-08-17 |
20170236803 | INTEGRATED CIRCUIT DIES WITH THROUGH-DIE VIAS | 2017-08-17 |
20170236804 | APPARATUSES AND METHODS FOR INTERNAL HEAT SPREADING FOR PACKAGED SEMICONDUCTOR DIE | 2017-08-17 |
20170236805 | Flexible Display Apparatus and Methods | 2017-08-17 |
20170236806 | LIGHT EMITTING APPARATUS, ILLUMINATION APPARATUS AND DISPLAY APPARATUS | 2017-08-17 |
20170236807 | III-V MICRO-LED ARRAYS AND METHODS FOR PREPARING THE SAME | 2017-08-17 |
20170236808 | SEMICONDUCTOR PACKAGE WITH LID HAVING LID CONDUCTIVE STRUCTURE | 2017-08-17 |
20170236809 | CHIP PACKAGE ASSEMBLY WITH POWER MANAGEMENT INTEGRATED CIRCUIT AND INTEGRATED CIRCUIT DIE | 2017-08-17 |
20170236810 | ELECTRONIC DEVICE | 2017-08-17 |
20170236811 | METHOD OF SELECTIVELY TRANSFERRING LED DIE TO A BACKPLANE USING HEIGHT CONTROLLED BONDING STRUCTURES | 2017-08-17 |
20170236812 | METHOD FOR MANUFACTURING POWER MODULE | 2017-08-17 |
20170236813 | Packaging Mechanisms for Dies With Different Sizes of Connectors | 2017-08-17 |
20170236814 | INTEGRATED CIRCUIT AND COMPUTER-IMPLEMENTED METHOD OF MANUFACTURING THE SAME | 2017-08-17 |
20170236815 | SYSTEM, APPARATUS, AND METHOD FOR N/P TUNING IN A FIN-FET | 2017-08-17 |
20170236816 | ELECTROSTATIC DISCHARGE DEVICE | 2017-08-17 |
20170236817 | ESD PROTECTION DEVICE | 2017-08-17 |
20170236818 | SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236819 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD | 2017-08-17 |
20170236820 | SEMICONDUCTOR DEVICE, AND ON-VEHICLE ELECTRONIC DEVICE AND AUTOMOBILE EACH INCLUDING THE SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236821 | SEMICONDUCTOR DEVICE INCLUDING TRANSISTORS WITH ADJUSTED THRESHOLD VOLTAGES | 2017-08-17 |
20170236822 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2017-08-17 |
20170236823 | SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236824 | COMPLEMENTARY BIPOLAR SRAM | 2017-08-17 |
20170236825 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE WITH RESERVOIR CAPACITORS AND METHOD OF MANUFACTURING THE SAME | 2017-08-17 |
20170236826 | INTEGRATED CIRCUIT DEVICES AND FABRICATION TECHNIQUES | 2017-08-17 |
20170236827 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME | 2017-08-17 |
20170236828 | Memory Cells | 2017-08-17 |
20170236829 | SINGLE-POLY NONVOLATILE MEMORY CELLS | 2017-08-17 |
20170236830 | SEMICONDUCTOR MEMORY DEVICE HAVING MEMORY CELLS ARRANGED THREE-DIMENSIONALLY AND METHOD OF MANUFACTURING THE SAME | 2017-08-17 |
20170236831 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2017-08-17 |
20170236832 | NAND MEMORY ARRAY WITH MISMATCHED CELL AND BITLINE PITCH | 2017-08-17 |
20170236833 | HKMG HIGH VOLTAGE CMOS FOR EMBEDDED NON-VOLATILE MEMORY | 2017-08-17 |
20170236834 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236835 | MULTI-TIER THREE-DIMENSIONAL MEMORY DEVICES CONTAINING ANNULAR DIELECTRIC SPACERS WITHIN MEMORY OPENINGS AND METHODS OF MAKING THE SAME | 2017-08-17 |
20170236836 | Three-dimensional Memory Device and Manufacturing Method Thereof | 2017-08-17 |
20170236837 | DISPLAY SUBSTRATE, LIQUID CRYSTAL DISPLAY PANEL AND DISPLAY APPARATUS HAVING THE SAME, AND FABRICATING METHOD THEREOF | 2017-08-17 |
20170236838 | THIN FILM TRANSISTOR ARRAY SUBSTRATE, DISPLAY PANEL AND DISPLAY DEVICE | 2017-08-17 |
20170236839 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2017-08-17 |
20170236840 | SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236841 | FIN WITH AN EPITAXIAL CLADDING LAYER | 2017-08-17 |
20170236842 | SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE | 2017-08-17 |
20170236843 | DISPLAY DEVICE HAVING IMPROVED MANUFACTURABILITY AND METHOD FOR FABRICATING SAME | 2017-08-17 |
20170236844 | SEMICONDUCTOR DEVICE AND DISPLAY DEVICE INCLUDING THE SEMICONDUCTOR DEVICE | 2017-08-17 |
20170236845 | SEMICONDUCTOR DEVICE AND DISPLAY DEVICE HAVING THE SAME | 2017-08-17 |
20170236846 | Semiconductor Device, Manufacturing Method Thereof, Module, and Electronic Device | 2017-08-17 |
20170236847 | Display Panel And Manufacturing Method For The Same | 2017-08-17 |
20170236848 | SEMICONDCUTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-08-17 |
20170236849 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2017-08-17 |
20170236850 | PATTERNING LAYER STACKS FOR ELECTRONIC DEVICES | 2017-08-17 |
20170236851 | MULTI-SENSOR OPTICAL DEVICE FOR DETECTING CHEMICAL SPECIES AND MANUFACTURING METHOD THEREOF | 2017-08-17 |
20170236852 | Semiconductor Photomultiplier | 2017-08-17 |
20170236853 | DISPLAY DEVICE WITH SEPARATION MEMBER INCLUDING STEPS | 2017-08-17 |
20170236854 | BACKSIDE ILLUMINATED (BSI) IMAGE SENSOR WITH A REFLECTOR | 2017-08-17 |
20170236855 | METHOD OF PRODUCING IMAGING PANEL, IMAGING PANEL, AND X-RAY IMAGING DEVICE | 2017-08-17 |
20170236856 | IMAGING PANEL, METHOD OF PRODUCING IMAGING PANEL, AND X-RAY IMAGING DEVICE | 2017-08-17 |
20170236857 | PHOTOELECTRIC CONVERSION ARRAY SUBSTRATE, ITS MANUFACTURING METHOD, AND PHOTOELECTRIC CONVERSION DEVICE | 2017-08-17 |
20170236858 | IMAGE SENSOR | 2017-08-17 |
20170236859 | SOLID STATE IMAGE SENSOR AND ELECTRONIC DEVICE | 2017-08-17 |
20170236860 | IMAGE SENSOR HAVING IMPROVED DICING PROPERTIES, MANUFACTURING APPARATUS, AND MANUFACTURING METHOD OF THE SAME | 2017-08-17 |
20170236861 | OPTICAL FILTER ARRAY | 2017-08-17 |
20170236862 | SOLID-STATE IMAGING DEVICE | 2017-08-17 |
20170236863 | Method of Manufacturing Image Sensor Having Enhanced Backside Illumination Quantum Efficiency | 2017-08-17 |
20170236864 | CMOS IMAGE SENSOR STRUCTURE | 2017-08-17 |
20170236865 | LIGHT EMITTING DIODE HAVING A PLURALITY OF LIGHT EMITTING UNITS | 2017-08-17 |
20170236866 | LIGHT SOURCE MODULE, DISPLAY PANEL, DISPLAY APPARATUS AND METHODS FOR MANUFACTURING THE SAME | 2017-08-17 |
20170236867 | SEMICONDUCTOR DEVICE | 2017-08-17 |