33rd week of 2020 patent applcation highlights part 57 |
Patent application number | Title | Published |
20200258713 | Charged-Particle Beam Device | 2020-08-13 |
20200258714 | DEVICE AND METHOD FOR OPERATING A CHARGED PARTICLE DEVICE WITH MULTIPLE BEAMLETS | 2020-08-13 |
20200258715 | CHARGED PARTICLE BEAM WRITING APPARATUS AND CHARGED PARTICLE BEAM WRITING METHOD | 2020-08-13 |
20200258716 | MULTI-CHARGED-PARTICLE BEAM WRITING APPARATUS AND MULTI-CHARGED-PARTICLE BEAM WRITING METHOD | 2020-08-13 |
20200258717 | MODULAR PRINT HEAD ASSEMBLY FOR PLASMA JET PRINTING | 2020-08-13 |
20200258718 | Gas Supply With Angled Injectors In Plasma Processing Apparatus | 2020-08-13 |
20200258719 | GAS SUPPLY MEMBER, PLASMA PROCESSING APPARATUS, AND METHOD FOR FORMING COATING FILM | 2020-08-13 |
20200258720 | FILM FORMATION VIA PULSED RF PLASMA | 2020-08-13 |
20200258721 | ATMOSPHERIC PRESSURE PLASMA DEVICE | 2020-08-13 |
20200258722 | SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2020-08-13 |
20200258723 | PHYSCIAL VAPOR DEPOSITION APPARATUS | 2020-08-13 |
20200258724 | SPUTTERING TARGET-BACKING PLATE ASSEMBLY | 2020-08-13 |
20200258725 | ELECTRON TUBE MODULE AND OPTICAL DEVICE | 2020-08-13 |
20200258726 | Hybrid Mass Spectrometer | 2020-08-13 |
20200258727 | MASS CALIBRATION OF MASS SPECTROMETER | 2020-08-13 |
20200258728 | MAINTAINING SPECTRAL QUALITY OVER LONG MEASURING PERIODS IN IMAGING MASS SPECTROMETRY | 2020-08-13 |
20200258729 | Collision Surface for Improved Ionisation | 2020-08-13 |
20200258730 | SURFACE-ASSISTED LASER DESORPTION/IONIZATION METHOD, MASS SPECTROMETRY METHOD AND MASS SPECTROMETRY DEVICE | 2020-08-13 |
20200258731 | RAPID INLINE PREPARATION OF A DILUTED SAMPLE | 2020-08-13 |
20200258732 | ATMOSPHERIC PRESSURE ION GUIDE | 2020-08-13 |
20200258733 | SYSTEMS AND APPROACHES FOR SEMICONDUCTOR METROLOGY AND SURFACE ANALYSIS USING SECONDARY ION MASS SPECTROMETRY | 2020-08-13 |
20200258734 | DEVICE AND SYSTEM FOR SELECTIVE IONIZATION AND ANALYTE DETECTION AND METHOD OF USING THE SAME | 2020-08-13 |
20200258735 | WAFER POLISHING METHOD AND APPARATUS | 2020-08-13 |
20200258736 | Substrate Processing Apparatus, Method of Manufacturing Semiconductor Device and Non-transitory Computer-readable Recording Medium | 2020-08-13 |
20200258737 | SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS | 2020-08-13 |
20200258738 | LAYERED SUBSTRATE FOR MICROELECTRONIC DEVICES | 2020-08-13 |
20200258739 | SEMICONDUCTOR DEVICE AND METHOD FOR SUPPORTING ULTRA-THIN SEMICONDUCTOR DIE | 2020-08-13 |
20200258740 | Method for Forming Stacked Nanowire Transistors | 2020-08-13 |
20200258741 | MULTI-DEPOSITION PROCESS FOR HIGH QUALITY GALLIUM NITRIDE DEVICE MANUFACTURING | 2020-08-13 |
20200258742 | METHODS AND APPARATUSES RELATED TO SHAPING WAFERS FABRICATED BY ION IMPLANTATION | 2020-08-13 |
20200258743 | APPARATUS AND METHOD FOR WAFER BONDING | 2020-08-13 |
20200258744 | GATE CONTACT OVER ACTIVE PROCESSES | 2020-08-13 |
20200258745 | Self-Aligned Semiconductor Gate Cut | 2020-08-13 |
20200258746 | Wrap-Around Contact Plug and Method Manufacturing Same | 2020-08-13 |
20200258747 | Substrate Processing Method and Film Forming System | 2020-08-13 |
20200258748 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS | 2020-08-13 |
20200258749 | ASYMMETRICAL PLUG TECHNIQUE FOR GAN DEVICES | 2020-08-13 |
20200258750 | DIE SUPPORT STRUCTURES AND RELATED METHODS | 2020-08-13 |
20200258751 | SILICON-ON-INSULATOR DIE SUPPORT STRUCTURES AND RELATED METHODS | 2020-08-13 |
20200258752 | SEMICONDUCTOR PACKAGE ELECTRICAL CONTACTS AND RELATED METHODS | 2020-08-13 |
20200258753 | PLASMA PROCESSING APPARATUS | 2020-08-13 |
20200258754 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES AND STRUCTURES THEREOF | 2020-08-13 |
20200258755 | METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE | 2020-08-13 |
20200258756 | WAFER THINNING APPARATUS HAVING FEEDBACK CONTROL | 2020-08-13 |
20200258757 | NOVEL ETCHING PROCESS WITH IN-SITU FORMATION OF PROTECTIVE LAYER | 2020-08-13 |
20200258758 | METHOD FOR FORMING SEMICONDUCTOR DEVICE STRUCTURE | 2020-08-13 |
20200258759 | STRUCTURES FOR CONDUCTING HEAT WITH A PACKAGED DEVICE AND METHOD OF PROVIDING SAME | 2020-08-13 |
20200258760 | Fan-Out Structure and Method of Fabricating the Same | 2020-08-13 |
20200258761 | PRINTING COMPONENT ARRAYS WITH DIFFERENT ORIENTATIONS | 2020-08-13 |
20200258762 | TEMPERATURE CONTROL APPARATUS | 2020-08-13 |
20200258763 | SYSTEMS AND METHODS FOR A SPRAY MEASUREMENT APPARATUS | 2020-08-13 |
20200258764 | METHOD OF ACHIEVING IMPROVED TRANSIENT RESPONSE IN APPARATUS FOR CONTROLLING FLOW AND SYSTEM FOR ACCOMPLISHING SAME | 2020-08-13 |
20200258765 | SUBSTRATE STORAGE CONTAINER | 2020-08-13 |
20200258766 | STORAGE APPARATUS FOR STORING CASSETTES FOR SUBSTRATES AND PROCESSING APPARATUS EQUIPPED THEREWITH | 2020-08-13 |
20200258767 | VACUUM TRANSFER DEVICE AND A METHOD OF FORMING THE SAME | 2020-08-13 |
20200258768 | SUBSTRATE HOLDING DEVICE | 2020-08-13 |
20200258769 | SEMICONDUCTOR MANUFACTURING DEVICE MEMBER, METHOD FOR MANUFACTURING THE SAME, AND FORMING DIE | 2020-08-13 |
20200258770 | AIRGAP VIAS IN ELECTRICAL INTERCONNECTS | 2020-08-13 |
20200258771 | INTERCONNECTION STRUCTURE AND METHOD OF FORMING THE SAME | 2020-08-13 |
20200258772 | INTERCONNECTION STRUCTURE OF METAL LINES, METHOD OF FABRICATING THE SAME AND SEMICONDUCTOR DEVICE | 2020-08-13 |
20200258773 | PRODUCTION OF SEMICONDUCTOR REGIONS IN AN ELECTRONIC CHIP | 2020-08-13 |
20200258774 | SEMICONDUCTOR ON INSULATOR STRUCTURE COMPRISING A PLASMA NITRIDE LAYER AND METHOD OF MANUFACTURE THEREOF | 2020-08-13 |
20200258775 | Semiconductor Device Including Protection Structure and Manufacturing Method Therefor | 2020-08-13 |
20200258776 | INTERCONNECT WITH HIGH QUALITY ULTRA-LOW-K DIELECTRIC | 2020-08-13 |
20200258777 | Conductive Interconnect Structures in Integrated Circuits | 2020-08-13 |
20200258778 | SELF-ALIGNED LOCAL INTERCONNECTS | 2020-08-13 |
20200258779 | FIELD EFFECT TRANSISTOR DEVICES WITH SELF-ALIGNED SOURCE/DRAIN CONTACTS AND GATE CONTACTS POSITIONED OVER ACTIVE TRANSISTORS | 2020-08-13 |
20200258780 | TRANSFER ARM FOR FILM FRAME SUBSTRATE HANDLING DURING PLASMA SINGULATION OF WAFERS | 2020-08-13 |
20200258781 | PACKAGING STRUCTURE | 2020-08-13 |
20200258782 | INTEGRATED CIRCUIT CHIP AND MANUFACTURING METHOD THEREFOR, AND GATE DRIVE CIRCUIT | 2020-08-13 |
20200258783 | FIELD EFFECT TRANSISTOR WITH AN ATOMICALLY THIN CHANNEL | 2020-08-13 |
20200258784 | Wrap-Around Contact on FinFET | 2020-08-13 |
20200258785 | QUADRUPLE GATE DIELECTRIC FOR GATE-ALL-AROUND TRANSISTORS | 2020-08-13 |
20200258786 | MUTLIPLE DIELECTRICS FOR GATE-ALL-AROUND TRANSISTORS | 2020-08-13 |
20200258787 | SEMICONDUCTOR DEVICE | 2020-08-13 |
20200258788 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2020-08-13 |
20200258789 | METHOD AND STRUCTURE TO PROVIDE INTEGRATED LONG CHANNEL VERTICAL FINFET DEVICE | 2020-08-13 |
20200258790 | FABRICATION OF LOGIC DEVICES AND POWER DEVICES ON THE SAME SUBSTRATE | 2020-08-13 |
20200258791 | MODE CONVERTER AND METHOD OF FABRICATING THEREOF | 2020-08-13 |
20200258792 | SYSTEM, METHOD AND NON-TRANSITORY COMPUTER READABLE MEDIUM FOR TUNING SENSITIVIES OF, AND DETERMINING A PROCESS WINDOW FOR, A MODULATED WAFER | 2020-08-13 |
20200258793 | LIQUID DELIVERY MEMBER, LIQUID DELIVERY APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2020-08-13 |
20200258794 | SEMICONDUCTOR PRODUCTION METHOD AND WAFER INSPECTION METHOD | 2020-08-13 |
20200258795 | SEMICONDUCTOR DEVICE, TEST METHOD, AND SYSTEM INCLUDING THE SAME | 2020-08-13 |
20200258796 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE CONTAINER | 2020-08-13 |
20200258797 | CIRCUIT MODULE | 2020-08-13 |
20200258798 | DEVICE AND COMPOSITION FOR FORMING ORGANIC LAYER | 2020-08-13 |
20200258799 | SEMICONDUCTOR PACKAGES AND MANUFACTURING MEHTODS THEREOF | 2020-08-13 |
20200258800 | SUBTRACTIVE ETCH RESOLUTION IMPLEMENTING A FUNCTIONAL THIN METAL RESIST | 2020-08-13 |
20200258801 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2020-08-13 |
20200258802 | METHOD FOR MANUFACTURING ELECTRONIC PACKAGE | 2020-08-13 |
20200258803 | SEMICONDUCTOR PACKAGE HAVING ROUTABLE ENCAPSULATED CONDUCTIVE SUBSTRATE AND METHOD | 2020-08-13 |
20200258804 | HEATING ELEMENT AND SUPPORTING CIRCUITRY FOR ADAPTING A NOMINALLY RATED SEMICONDUCTOR CHIP TO AN EXTREMELY COLD ENVIRONMENT | 2020-08-13 |
20200258805 | ELECTRONIC COMPONENT MODULE PROVIDED WITH SUBSTRATE ON WHICH ELECTRONIC COMPONENTS ARE MOUNTED AND HEAT SINK AND MANUFACTURING METHOD OF THE SAME | 2020-08-13 |
20200258806 | SEMICONDUCTOR DEVICE | 2020-08-13 |
20200258807 | Heat Sink Design For Flip Chip Ball Grid Array | 2020-08-13 |
20200258808 | THERMAL INTERFACE MATERIAL | 2020-08-13 |
20200258809 | SEMICONDUCTOR MODULE AND METHOD OF EVALUATING SEMICONDUCTOR MODULE | 2020-08-13 |
20200258810 | TECHNIQUES FOR COOLING INTEGRATED SYSTEMS | 2020-08-13 |
20200258811 | ENCAPSULATED PHASE CHANGE POROUS LAYER | 2020-08-13 |
20200258812 | SEMICONDUCTOR WITH INTEGRATED ELECTRICALLY CONDUCTIVE COOLING CHANNELS | 2020-08-13 |