32nd week of 2014 patent applcation highlights part 20 |
Patent application number | Title | Published |
20140217577 | Semiconductor Device and Method for Manufacturing a Semiconductor Device - A device includes a semiconductor chip including a first main face and a second main face, the second main face being the backside of the semiconductor chip. The second main face includes a first region and a second region, the second region being a peripheral region of the second main face. The device further includes a dielectric material arranged over the second region and an electrically conductive material arranged over the first region. | 2014-08-07 |
20140217578 | SEMICONDUCTOR PACKAGE PROCESS AND STRUCTURE THEREOF - A semiconductor package process includes the following steps, providing a first substrate having a first metal bump, the first metal bump comprises a joint portion having a first softening point; providing a second substrate having a second metal bump having a top surface, a lateral surface and a second softening point, wherein the first softening point is smaller than the second softening point; performing a heating procedure to make the joint portion of the first metal bump become a softened state; and laminating the first substrate on the second substrate to make the second metal bump embedded into the joint portion in the softened state to make the top surface and the lateral surface of the at least one second metal bump being clad extendedly by compressing the joint portion in the softened state. | 2014-08-07 |
20140217579 | HIGH DENSITY PACKAGE INTERCONNECTS - Electronic assemblies and methods including the formation of interconnect structures are described. In one embodiment an apparatus includes semiconductor die and a first metal bump on the die, the first metal bump including a surface having a first part and a second part. The apparatus also includes a solder resistant coating covering the first part of the surface and leaving the second part of the surface uncovered. Other embodiments are described and claimed. | 2014-08-07 |
20140217580 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME - A semiconductor device includes a bonding pad on a semiconductor substrate, a bump on the bonding pad, a solder on the bump, and an anti-wetting layer between the bump and the solder extending along a sidewall of the bump, the anti-wetting layer having a first thickness T | 2014-08-07 |
20140217581 | ELECTRONIC COMPONENT, MOTHER SUBSTRATE, AND ELECTRONIC COMPONENT MANUFACTURING METHOD - An electronic component includes a plurality of electrodes provided in a rectangular or substantially rectangular box-shaped area on an upper surface of a substrate, an electronic component element mounted on the substrate by flip-chip bonding, and an identification mark. The identification mark is provided between a first electrode, which is arranged along one side of the rectangular or substantially rectangular box-shaped area, and a second electrode, which is adjacent to the first electrode along the one side, of the plurality of electrodes provided on the upper surface of the substrate, and is located on or outside a line connecting the outer side edges of the first and second electrodes. | 2014-08-07 |
20140217582 | SEMICONDUCTOR DEVICE - This invention provides a multi-pin semiconductor device as a low-cost flip-chip BGA. In the flip-chip BGA, a plurality of signal bonding electrodes in a peripheral area of the upper surface of a multilayer wiring substrate are separated into inner and outer ones and a plurality of signal through holes coupled to a plurality of signal wirings drawn inside are located between a plurality of rows of signal bonding electrodes and a central region where a plurality of bonding electrodes for core power supply are located so that the chip pad pitch can be decreased and the cost of the BGA can be reduced without an increase in the number of layers in the multilayer wiring substrate. | 2014-08-07 |
20140217583 | SEMICONDUCTOR DEVICE INCLUDING A BUFFER LAYER STRUCTURE FOR REDUCING STRESS - A semiconductor device includes a semiconductor chip, wiring that is included in the semiconductor chip and has a coupling part between parts with different widths, a pad being formed above the wiring and in a position overlapping the coupling part, a bump being formed on the pad, a buffer layer being formed in a position between the coupling part and the pad so as to cover the entire coupling part, and inorganic insulating layers being formed between the wiring and the buffer layer and between the buffer layer and the pad, respectively. The buffer layer is made of a material other than resin and softer than the inorganic insulating layer | 2014-08-07 |
20140217584 | FLOW UNDERFILL FOR MICROELECTRONIC PACKAGES - A microelectronic assembly includes a first component with first conductive elements; a second component with second conductive elements; a bond metal; and an underfill layer. The posts have a height above the respective surface from which the posts project. A bond metal can be disposed between respective pairs of conductive elements, each pair including at least one of the posts and at least one of the first or second conductive elements confronting the at least one post. The bond metal can contact edges of the posts along at least one half the height of the posts. An underfill layer contacts and bonds the first and second surfaces of the first and second components. A residue of the underfill layer may be present at at least one interfacial surfaces between at least some of the posts and the bond metal or may be present within the bond metal. | 2014-08-07 |
20140217585 | 3D INTEGRATED CIRCUIT PACKAGE WITH THROUGH-MOLD FIRST LEVEL INTERCONNECTS - 3D integrated circuit packages with through-mold first level interconnects and methods to form such packages are described. For example, a semiconductor package includes a substrate. A bottom semiconductor die has an active side with a surface area. The bottom semiconductor die is coupled to the substrate with the active side distal from the substrate. A top semiconductor die has an active side with a surface area larger than the surface area of the bottom semiconductor die. The top semiconductor die is coupled to the substrate with the active side proximate to the substrate. The active side of the bottom semiconductor die is facing and conductively coupled to the active side of the top semiconductor die. The top semiconductor die is conductively coupled to the substrate by first level interconnects that bypass the bottom semiconductor die. | 2014-08-07 |
20140217586 | PACKAGE-ON-PACKAGE DEVICE - A package-on-package device includes memory chips side-by-side on a package substrate. Accordingly, it is possible to reduce a thickness of a semiconductor package. Further, data and command pads of a logic chip may be located to be adjacent to data and command pads of the memory chips. Accordingly, a routing distance between pads can be contracted and thus signal delivery speed can be improved. This makes it possible to improve an operation speed of the device. | 2014-08-07 |
20140217587 | Wafer Leveled Chip Packaging Structure and Method Thereof - A wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the wafer; forming a plurality of first conductive vias penetrating the first insulating layer, wherein parts of the first conductive vias are electrically connected with the first chip; forming a conductive pattern layer on the surface of the first insulating layer wherein the conductive pattern layer is electrically connected with the first conductive vias; forming a plurality of through holes penetrating the wafer; filling a second insulating layer in the through holes; and forming a plurality of second conductive vias in the second insulating layer, wherein the second conductive vias are electrically connected with the first conductive vias. | 2014-08-07 |
20140217588 | METHODS OF FORMING COPPER-BASED NITRIDE LINER/PASSIVATION LAYERS FOR CONDUCTIVE COPPER STRUCTURES AND THE RESULTING DEVICE - One illustrative method disclosed herein includes forming a trench/via in a layer of insulating material, forming a barrier layer in the trench/via, forming a copper-based seed layer on the barrier layer, converting at least a portion of the copper-based seed layer into a copper-based nitride layer, depositing a bulk copper-based material on the copper-based nitride layer so as to overfill the trench/via and performing at least one chemical mechanical polishing process to remove excess materials positioned outside of the trench/via to thereby define a copper-based conductive structure. A device disclosed herein includes a layer of insulating material, a copper-based conductive structure positioned in a trench/via within the layer of insulating material and a copper-based silicon or germanium nitride layer positioned between the copper-based conductive structure and the layer of insulating material. | 2014-08-07 |
20140217589 | SUPPORT STRUCTURE FOR BARRIER LAYER OF SEMICONDUCTOR DEVICE - Among other things, one or more support structures and techniques for forming such support structures within semiconductor devices are provided. The support structure comprises an oxide infused silicon layer that is formed within a trench of a dielectric layer on a substrate of a semiconductor device. The oxide infused silicon layer results from a silicon layer that is exposed to oxide during an ultraviolet (UV) curing process. The oxide infused silicon layer is configured to support a barrier layer against a conductive structure formed on the barrier layer within the trench. In this way, the support structure provides pressure against the barrier layer so that the barrier layer substantially maintains contact with the conductive structure, to promote improved performance and reliability of the conductive structure. | 2014-08-07 |
20140217590 | THROUGH SILICON VIA METALLIZATION - To achieve the foregoing and in accordance with the purpose of the present invention, a method for filling through silicon vias is provided. A dielectric layer is formed over the through silicon vias. A barrier layer, comprising tungsten, is deposited by CVD or ALD over the dielectric layer. The through silicon vias are filled with a conductive material. | 2014-08-07 |
20140217591 | MULTI-LAYER BARRIER LAYER FOR INTERCONNECT STRUCTURE - A semiconductor device includes a dielectric layer positioned above a substrate of the semiconductor device and a recess defined in the dielectric layer. An adhesion barrier layer is positioned on and in direct contact with at least the sidewalls of the recess, a barrier layer interface being defined where the adhesion barrier layer directly contacts the dielectric layer. A stress-reducing barrier layer is positioned adjacent to the adhesion barrier layer, wherein the stress-reducing barrier layer is adapted to reduce a stress level across the barrier layer interface from a first stress level to a second stress level that is less than the first stress level. At least one layer of a conductive fill material is positioned over the stress-reducing barrier layer, the at least one layer of the conductive fill material substantially filling the recess. | 2014-08-07 |
20140217592 | INTERCONNECT STRUCTURE AND METHOD OF MAKING SAME - An interconnect structure and method of fabricating the same is provided. More specifically, the interconnect structure is a defect free capped interconnect structure. The structure includes a conductive material formed in a trench of a planarized dielectric layer which is devoid of cap material. The structure further includes the cap material formed on the conductive material to prevent migration. The method of forming a structure includes selectively depositing a sacrificial material over a dielectric material and providing a metal capping layer over a conductive layer within a trench of the dielectric material. The method further includes removing the sacrificial material with any unwanted deposited or nucleated metal capping layer thereon. | 2014-08-07 |
20140217593 | Electrical Connecting Element and Method for Manufacturing the Same - An electrical connecting element for connecting a first substrate and a second substrate and a method for manufacturing the same are disclosed. The method of the present invention comprises: (A) providing a first substrate and a second substrate, wherein a first copper film is formed on the first substrate, a first metal film is formed on the second substrate, a first connecting surface of the first copper film has a (111)-containing surface, and the first metal film has a second connecting surface; and (B) connecting the first copper film and the first metal film to form an interconnect, wherein the first connecting surface of the first copper film is faced to the second connecting surface of the first metal film. | 2014-08-07 |
20140217594 | SEMICONDUCTOR DEVICE - Provided is a semiconductor device configured to prevent a penetration of moisture into an internal circuit. The moisture from a bonding pad to the internal circuit is blocked by providing an underlying polysilicon film ( | 2014-08-07 |
20140217595 | MOUNTING STRUCTURE AND MANUFACTURING METHOD FOR SAME - In a provided mounting structure, an electronic component such as a semiconductor chip having a fragile film is mounted on a substrate such as a circuit board with higher connection reliability. A junction that connects an electrode terminal ( | 2014-08-07 |
20140217596 | POWER TRANSISTOR ARRANGEMENT AND METHOD FOR MANUFACTURING THE SAME - Various embodiments provide a power transistor arrangement. The power transistor arrangement may include a carrier; a first power transistor having a control electrode and a first power electrode and a second power electrode; and a second power transistor having a control electrode and a first power electrode and a second power electrode. The first power transistor and the second power transistor may be arranged next to each other on the carrier such that the control electrode of the first power transistor and the control electrode of the second power transistor are facing the carrier. | 2014-08-07 |
20140217597 | Semiconductor Device and Method of Forming Stress Relieving Vias for Improved Fan-Out WLCSP Package - A semiconductor device includes a semiconductor die. An encapsulant is disposed around the semiconductor die to form a peripheral area. An interconnect structure is formed over a first surface of the semiconductor die and encapsulant. A plurality of vias is formed partially through the peripheral area of the encapsulant and offset from the semiconductor die. A portion of the encapsulant is disposed over a second surface of the semiconductor die opposite the first surface. The plurality of vias comprises a depth greater than a thickness of the portion of the encapsulant. A first portion of the plurality of vias is formed in a row offset from a side of the semiconductor die. A second portion of the plurality of vias is formed as an array of vias offset from a corner of the semiconductor die. A repair material disposed within the plurality of vias. | 2014-08-07 |
20140217598 | SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME - According to one embodiment, a semiconductor memory device includes a plurality of interconnects of an nth layer, a plurality of interconnects of a (n+1)th layer, a plurality of stacked films of the nth layer, each of the plurality of stacked films of the nth layer including a memory element, an inter-layer insulating film of the nth layer, a plurality of interconnects of a (n+2)th layer, a plurality of stacked films of the (n+1)th layer, each of the plurality of stacked films of the (n+1)th layer including a memory element, and an inter-layer insulating film of the (n+1)th layer. The inter-layer insulating film of the (n+1)th layer is provided also at a side surface of an end portion in the first direction of the interconnects of the nth layer. | 2014-08-07 |
20140217599 | BBUL MATERIAL INTEGRATION IN-PLANE WITH EMBEDDED DIE FOR WARPAGE CONTROL - An apparatus including a die including a first side and an opposite second side including a device side with contact points and lateral sidewalls defining a thickness of the die; a primary core adjacent at least a pair of the lateral sidewalls of the die; and a build-up carrier coupled to the second side of the die, the build-up carrier including a plurality of alternating layers of conductive material and insulating material, wherein at least one of the layers of conductive material is coupled to one of the contact points of the die. A method of forming a package and an apparatus including a computing device including a package are also disclosed. | 2014-08-07 |
20140217600 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - The present invention includes a plate electrode to be a plate-shaped electrode member, an epoxy sheet serving as an integrated insulating sheet and provided on the plate electrode, a double printed board serving as a control board and provided on the epoxy sheet, and a board integrated electrode in which the plate electrode and the double printed board are formed integrally by the epoxy sheet. | 2014-08-07 |
20140217601 | SEMICONDUCTOR DEVICE - The present invention provides a semiconductor device. The semiconductor device comprises: a metal pad and a first specific metal layer routing. The metal pad is positioned on a first metal layer of the semiconductor device. The first specific metal layer routing is formed on a second metal layer of the semiconductor device, and directly under the metal pad. | 2014-08-07 |
20140217602 | SEMICONDUCTOR DEVICE - Provided is a semiconductor package with improved mounting property. A concave portion is provided in an insulating resin between an island for mounting a semiconductor chip thereon and an opposing lead, to thereby prevent contact between solder printed on a circuit board and the insulating resin. Self-alignment property in melting solder is improved to increase an effective bonding area. | 2014-08-07 |
20140217603 | Semiconductor Device and Method of Fabricating the Same - A semiconductor device includes a via structure and a conductive structure. The via structure has a surface with a planar portion and a protrusion portion. The conductive structure is formed over at least part of the planar portion and not over at least part of the protrusion portion of the via structure. For example, the conductive structure is formed only onto the planar portion and not onto any of the protrusion portion for forming high quality connection between the conductive structure and the via structure. | 2014-08-07 |
20140217604 | Package Structure and Methods of Forming Same - A semiconductor device includes a first die having a first active surface and a first backside surface opposite the first active surface, a second die having a second active surface and a second backside surface opposite the second active surface, and an interposer, the first active surface of the first die being electrically coupled to a first side of the interposer, the second active surface of the second die being electrically coupled to a second side of the interposer. The semiconductor device also includes a first connector over the interposer, a first encapsulating material surrounding the second die, the first encapsulating material having a first surface over the interposer, and a via electrically coupling the first connector and the interposer. A first end of the via is substantially coplanar with the first surface of the first encapsulating material. | 2014-08-07 |
20140217605 | INTERCONNECTION STRUCTURE FOR PACKAGE AND FABRICATION METHOD THEREOF - An interconnection structure for a package is disclosed. The interconnection structure includes a substrate body having a conductive portion formed on a surface thereof; a first photosensitive dielectric layer formed on the surface of the substrate body and having a via for exposing the conductive potion; a conductive via formed in the via; a second photosensitive dielectric layer formed on the first photosensitive dielectric layer and having a opening for exposing the conductive via and a portion of the first photosensitive dielectric layer; and a conductive trace layer formed in the opening of the second photosensitive dielectric layer so as to be electrically connected to the conductive portion through the conductive via, thereby simplifying the fabrication process and reducing the fabrication cost and time. | 2014-08-07 |
20140217606 | THREE-DIMENSIONAL MONOLITHIC ELECTRONIC-PHOTONIC INTEGRATED CIRCUIT - A three-dimensional monolithic electronic-photonic integrated circuit and a method of manufacturing the same. The electronic-photonic integrated circuit may include a photonic element formed in a sealed space of a substrate and an electronic element formed on the substrate. The substrate may include a first substrate and a second substrate that are bonded to each other. The first substrate having a first trench corresponding to the sealed space formed therein, a first surface of the second substrate having the photonic element formed thereon, and the sealed space defined by a space formed inside the first trench that is sealed by the first surface of the second substrate. | 2014-08-07 |
20140217607 | REDUCED STRESS TSV AND INTERPOSER STRUCTURES - A component can include a substrate and a conductive via extending within an opening in the substrate. The substrate can have first and second opposing surfaces. The opening can extend from the first surface towards the second surface and can have an inner wall extending away from the first surface. A dielectric material can be exposed at the inner wall. The conductive via can define a relief channel within the opening adjacent the first surface. The relief channel can have an edge within a first distance from the inner wall in a direction of a plane parallel to and within five microns below the first surface, the first distance being the lesser of one micron and five percent of a maximum width of the opening in the plane. The edge can extend along the inner wall to span at least five percent of a circumference of the inner wall. | 2014-08-07 |
20140217608 | SEMICONDUCTOR MODULE, CIRCUIT BOARD - An improvement in the manufacturing efficiency of a circuit substrate and a semiconductor module where a semiconductor device including electrodes on a front and a back surface is mounted. | 2014-08-07 |
20140217609 | Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street - A semiconductor wafer has a plurality of semiconductor die separated by a peripheral region. A trench is formed in the peripheral region of the wafer. A via is formed on the die. The trench extends to and is continuous with the via. A first conductive layer is deposited in the trench and via to form conductive TSV. The first conductive layer is conformally applied or completely fills the trench and via. The trench has a larger area than the vias which accelerates formation of the first conductive layer. A second conductive layer is deposited over a front surface of the die. The second conductive layer is electrically connected to the first conductive layer. The first and second conductive layers can be formed simultaneously. A portion of a back surface of the wafer is removed to expose the first conductive layer. The die can be electrically interconnected through the TSVs. | 2014-08-07 |
20140217610 | 3D Semiconductor Package Interposer with Die Cavity - Disclosed herein is a method of forming a device, comprising mounting a plurality of first interconnects on one or more first integrated circuit dies. One or more second integrated circuit dies are mounted on a first side of an interposer. The interposer is mounted to at a second side to the first integrated circuit dies, the plurality of first interconnects disposed outside of the interposer. The interposer is mounted to a first side of a substrate by attaching the first interconnects to the substrate, the substrate in signal communication with one or more of the first integrated circuit dies through the first interconnects. | 2014-08-07 |
20140217611 | STACKED MULTILAYER STRUCTURE AND MANUFACTURING METHOD THEREOF - A stacked multilayer structure according to an embodiment of the present invention comprises: a stacked layer part including a plurality of conducting layers and a plurality of insulating layers, said plurality of insulating layers being stacked alternately with each layer of said plurality of conducting layers, one of said plurality of insulating layers being a topmost layer among said plurality of conducting layers and said plurality of insulating layers; and a plurality of contacts, each contact of said plurality of contacts being formed from said topmost layer and each contact of said plurality of contacts being in contact with a respective conducting layer of said plurality of conducting layers, a side surface of each of said plurality of contacts being insulated from said plurality of conducting layers via an insulating film. | 2014-08-07 |
20140217612 | ELECTRONIC FUSE HAVING A DAMAGED REGION - An electronic fuse structure including an M | 2014-08-07 |
20140217613 | INTEGRATED DEVICE AND FABRICATION PROCESS THEREOF - An integrated device includes a die attach pad, a main die, a stacked die, and a mold compound. The main die has a first (e.g., bottom) surface attached to the die attach pad and has a second (e.g., top) surface. The stacked die is attached to the second surface of the main die using, for example, an adhesive film. The main die and the stacked die include silicon crystal. The mold compound encapsulates the die attach pad, the main die, and the stacked die. | 2014-08-07 |
20140217614 | INTEGRATED CIRCUIT FILM AND METHOD OF MANUFACTURING THE SAME - An integrated circuit film and a method of manufacturing the same are disclosed. The integrated circuit film includes a circuit board containing a circuit route; a first set of pads located on a first surface of the circuit board and configured to be applicable to ISO 7816 standard; and a semiconductor device mounted on the circuit board for communicating with at least one of the first set of pads. The first set of pads are arranged in two rows and the semiconductor device is mounted on the circuit board in a space between the two rows of pads. | 2014-08-07 |
20140217615 | METHOD OF MAKING A SYSTEM-IN-PACKAGE DEVICE, AND A SYSTEM-IN-PACKAGE DEVICE - A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer. | 2014-08-07 |
20140217616 | STACK PACKAGE AND METHOD OF MANUFACTURING STACK PACKAGE - A stack package includes a first semiconductor chip having a plurality of first pads, and a second semiconductor chip stacked on the first semiconductor chip and having a plurality of second pads corresponding to the first pads respectively, the second pads connected to the corresponding first pads. The first and second pads are arranged such that the first and second pads overlap with each other even after the first and second semiconductor chips are rotated relative to each other by a predetermined angle. | 2014-08-07 |
20140217617 | MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS - A microelectronic package can include a substrate having first and second opposed surfaces extending in first and second transverse directions and an opening extending between the first and second surfaces and defining first and second distinct parts each elongated along a common axis extending in the first direction, first and second microelectronic elements each having a front surface facing the first surface of the substrate and a column of contacts at the respective front surface, a plurality of terminals exposed at the second surface, and first and second electrical connections aligned with the respective first and second parts of the opening and extending from at least some of the contacts of the respective first and second microelectronic elements to at least some of the terminals. The column of contacts of the first and second microelectronic elements can be aligned with the respective first and second parts of the opening. | 2014-08-07 |
20140217618 | METHOD FOR MAKING ELECTRONIC DEVICE WITH LIQUID CRYSTAL POLYMER AND RELATED DEVICES - A method of making an electronic device includes forming an electrically conductive pattern on a substrate, forming a coverlay layer on the substrate and the electrically conductive pattern, forming a partially cured, tacky adhesive layer on the coverlay layer, and forming openings in the coverlay layer and the partially cured, tacky adhesive layer aligned with the electrically conductive pattern. The method includes positioning an IC on the partially cured, tacky adhesive layer and thereafter curing the partially cured tacky adhesive layer to thereby simultaneously mechanically secure and electrically interconnect the IC to the substrate, the IC having bond pads on a surface thereof. | 2014-08-07 |
20140217619 | MICROELECTRONIC PACKAGE HAVING WIRE BOND VIAS AND STIFFENING LAYER - Microelectronic components and methods forming such microelectronic components are disclosed herein. The microelectronic components may include a plurality of electrically conductive vias in the form of wire bonds extending from a bonding surface of a substrate, such as surfaces of electrically conductive elements at a surface of the substrate. | 2014-08-07 |
20140217620 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface. | 2014-08-07 |
20140217621 | ENCAPSULATION FILM - The present application relates to an encapsulating film, an electronic device and a method of manufacturing the same. In the present application, an encapsulating film having excellent moisture blocking property, handleability, workability and durability and a structure including a diode encapsulated with the encapsulating film may be provided. | 2014-08-07 |
20140217622 | Semiconductor Package Resin Composition and Usage Method Thereof - A semiconductor package resin composition of the present invention includes an epoxy resin, a curing agent, inorganic particles, nano-particles surface treated with a silane that contains a photopolymerizable functional group, and a photopolymerization initiator. | 2014-08-07 |
20140217623 | SCENT DELIVERY METHOD AND APPARATUS USING AN EXISTING AIR MOVING DEVICE - A scent-releasing mechanism that is usable with an existing air moving device. The scent-releasing mechanism includes a chamber configured to enclose a scent source such as a scent cartridge, scent pad or the like, an air inlet, and an air outlet to release scent into a stream of air moved by the air moving device, so that the scent is dispersed throughout the room. At least one of the air inlet or air outlet is an adjustable port. The adjustable port may be adjusted to control the amount of scent released through the air outlet. | 2014-08-07 |
20140217624 | FOAM-FORMING ASSEMBLY AND SQUEEZE FOAMER - The invention provides a foam-forming assembly, comprising: | 2014-08-07 |
20140217625 | METHOD OF IMPRESSION-BASED PRODUCTION OF A FILTER FOR AN ELECTROMAGNETIC RADIATION - A process for producing an electromagnetic radiation filter includes at least two color filters, each formed from a stack on a stiff substrate of at least one dielectric layer and of metal layers in alternation, in order to transmit at least two colors. The process comprises depositing on said substrate a first metal layer, depositing on said first metal layer a first mechanically deformable dielectric layer having a set thickness e | 2014-08-07 |
20140217626 | MOLDING APPARATUS AND MOLDING METHOD - A lens molding apparatus ( | 2014-08-07 |
20140217627 | METHOD FOR MANUFACTURING OPTICAL ELEMENT AND DEVICE FOR MANUFACTURING SAME - A method for manufacturing an optical element, the method including: heating an optical element material by suspending it in a gas; supplying the heated optical element material from a direction which intersects a central axis interconnecting centers of a first mold and a second mold to a space between molds in a non-contact state, the space between molds being a space between the first mold and the second mold; pressurizing the optical element material supplied to the space between molds by the first mold and the second mold; and cooling the pressurized optical element material. | 2014-08-07 |
20140217628 | SYSTEMS AND METHODS FOR THE PRODUCTION OF MICROFIBERS AND NANOFIBERS USING A FLUID LEVEL SENSOR - Described herein are apparatuses and methods of creating fibers, such as microfibers and nanofibers. The methods discussed herein employ centrifugal forces to transform material into fibers. Apparatuses that may be used to create fibers are also described. Described herein are fiber producing devices that have various types of outlet elements coupled to the fiber producing device. | 2014-08-07 |
20140217629 | APPARATUSES HAVING OUTLET ELEMENTS AND METHODS FOR THE PRODUCTION OF MICROFIBERS AND NANOFIBERS - Described herein are apparatuses and methods of creating fibers, such as microfibers and nanofibers. The methods discussed herein employ centrifugal forces to transform material into fibers. Apparatuses that may be used to create fibers are also described. Described herein are fiber producing devices that have various types of outlet elements coupled to the fiber producing device. | 2014-08-07 |
20140217630 | METHOD FOR THE PRODUCTION OF MULTIPHASE COMPOSITE MATERIALS USING MICROWAVE PLASMA PROCESS - Disclosed herein is a method to produce multiphase composite materials directly from solution precursor droplets by a fast pyrolysis process using a microwave plasma embodiment containing a microwave generating source, a dielectric plasma torch, and a droplet maker. Here, using homogenous solution precursors, droplets are generated with a narrow size distribution, and are injected and introduced into the microwave plasma torch with generally uniform thermal path. The generally uniform thermal path in the torch is achieved by axial injection of droplets into an axisymmetric hot zone with laminar flows. Upon exposing to high temperature within the plasma with controlled residence time, the droplets are pyrolyzed and converted into particles by quenching with a controlled rate of the exhaust gas in a gas chamber. The particles generated have generally uniform sizes and uniform thermal history, and can be used for a variety of applications. | 2014-08-07 |
20140217631 | SULFUR GRANULATOR SYSTEM AND METHOD - Sulfur (or sulphur) spray nozzles disposed with a tank spray liquid molten sulfur into the cooling liquid in the tank. Solid sulfur seeds are formed in the cooling liquid and settle in the tank. The tank may be a spiral dewaterer tank that has a screw conveyor at the bottom of the tank that moves the seeds to a granulating drum for enlargement into sulfur granules. The tank may also he used to capture and remove sulfur dust from a slurry of sulfur dust and water recycled from the granulating drum. The sulfur dust in the cooling tank may be captured by contact with molten sulfur droplets streaming down the cooling liquid column such that the dust particles become incorporated into the droplet, thereby being converted to seed. The granulating drum may be equipped with two or more sets of segmented lifting flights. The sets of flights may not be in alignment. The flights may be spaced apart from the inside surface of the drum with segmented rib members. The rib members may allow for the movement of sulfur seeds and granules between the nights and the inside surface of the drum as the drum rotates. | 2014-08-07 |
20140217632 | METHOD FOR TEMPERATURE CONTROL OF A SHAPING TOOL - A temperature control device ( | 2014-08-07 |
20140217633 | TEMPERATURE CONTROL DEVICE FOR A SHAPING TOOL AND METHOD OF CONTROLLING THE SAME - A method of temperature control of a shaping tool or components of a shaping working machine is performed by a temperature control medium disposed in at least one temperature control branch of a temperature control system. A previously ascertained relationship between geometrical data of the at least one temperature control branch and through-flow amounts of the temperature control medium is provided, and a reference through-flow amount is set by the previously ascertained relationship for the geometrical data of the at least one temperature control branch. | 2014-08-07 |
20140217634 | DEVICE AND METHOD FOR IMMOBILIZING PATIENTS FOR BREAST RADIATION THERAPY - According to the improved systems and methods described herein, a patient may be immobilized so that one or both breasts are returned to a known position. Additionally, the improved systems and methods reduce respiratory movement of the breasts. Thus, the immobilization devices and techniques described herein provide accurate and reproducible breast positioning while simultaneously reducing respiratory motion. | 2014-08-07 |
20140217635 | POROUS SYNTHETIC RESIN MOLDED PART AND METHOD OF PRODUCING THE SAME - A method of producing a porous molded part includes a mixing process for mixing a granular porous organizer composed of a water-soluble compound, a porous forming assistant agent composed of a polyhydric alcohol, and a cross-linking agent composed of an organic peroxide with a thermoplastic resin composition having a glass transition temperature below 0° C. to obtain a molding material; a cross-linking and forming process for placing the molding material in a molding die and performing a heat press molding thereby progressing coincidentally a cross-linking reaction and a shape forming of a seal face to obtain a molded material; an extracting process for extracting the granular porous organizer from the molded material obtained in the cross-linking and forming process to obtain a porous molded part; and a drying process for drying the porous molded part obtained in the extracting process. | 2014-08-07 |
20140217636 | ARTICLES PREPARED USING RECYCLED MATERIALS AND METHODS OF PREPARATION THEREOF - The present invention is directed to articles of manufacture having at least a portion prepared using recycled material, including but not limited recycled rubber or other polymeric materials. The articles may incorporate the recycled materials in a granulated form. In specific embodiments, the article comprises an article of footwear (i.e., a shoe). Particularly, all or part of the shoe sole may be formed using the granulated material, the granules specifically being joined together using a binder material, such as a polyurethane, preferably a moisture cure, single component polyurethane binder. The invention further provides methods of preparing articles formed of granulated materials. The inventive methods are characterized by their excellent economic benefits, ease of use, and environmental benefits. | 2014-08-07 |
20140217637 | COMPARTMENTALIZED PELLET FOR IMPROVED CONTAMINANT REMOVAL - This invention is to an improved method for cleaning contaminated polymer when that polymer is to be blended with clean material. The method involves combining the contaminated material and the clean material in a compartmentalized pellet wherein the contaminated material is placed in the outermost compartment, the clean material is placed in an inner compartment and then subjecting the pellet to an extraction process. | 2014-08-07 |
20140217638 | MOLD AND METHOD FOR MANUFACTURING MOLD - Provided is a technology for suppressing, in a mold having a heat-insulating layer formed therein, a problem of chipping of the heat-insulating layer and the like even when a penetrating member is inserted through a through-hole provided in the mold. The mold is provided with a mold body having a convex part on an inner wall surface of the mold body, a heat-insulating layer arranged on the inner wall surface, and a through-hole which penetrates the convex part in a thickness direction of the mold body and through which the penetrating member can be inserted. An outer periphery of the through-hole is inside an outer periphery of a top surface of the convex part. A spacing between the outer periphery of the through-hole on the top surface of the convex part and the outer periphery of the top surface of the convex part is preferably 0.5 mm or less. | 2014-08-07 |
20140217639 | Downhole Impression Imaging System and Methods Using Shape Memory Material - A system and method for obtaining an impression of an object in a remote environment. An impression block is affixed to a running string and disposed into the remote environment and used to form an impression. The impression block includes an impression section formed of a shape memory material that can be transformed between an original shape and a temporary shape. | 2014-08-07 |
20140217640 | MOULD FOR PRODUCING ATOMIZER NOZZLES, MOULD SET, NEGATIVE MOULD AND METHOD FOR PRODUCING AN ATOMIZER NOZZLE - A mould for producing atomizer nozzles, wherein a mouthpiece core mould part defines an inner wall of the mouthpiece, at least in the region of a transition between the mouthpiece and the flow chamber, and is of integral design, wherein the flow chamber core mould part has a substantially smooth surface and continuous contours in the region of the transition from the flow chamber to the mouthpiece, and wherein the mouthpiece core mould part is placed against the flow chamber core mould part at the transition between the flow chamber and the mouthpiece. | 2014-08-07 |
20140217641 | PROCESS FOR THE MANUFACTURING OF A BOARD FOR GLIDING ON SNOW, AND BOARD FOR GLIDING ON SNOW OBTAINED FROM THIS PROCESS - Process for the manufacturing of a board for gliding on snow, with the said board including at least one fibrous reinforcement ( | 2014-08-07 |
20140217642 | REACTOR AND MANUFACTURING METHOD THEREOF - Divided cores | 2014-08-07 |
20140217643 | CARBON NANOTUBE FIBER AND METHOD FOR PRODUCING THE SAME - There are provided carbon nanotube fibers having excellent mechanical property and a method for producing the same. In a long carbon nanotube fiber | 2014-08-07 |
20140217644 | FORM FOR MAKING STRUCTURES - A form for forming a void or an architectural feature of a predetermined configuration in a moldable forming composition is disclosed. Embodiments of the invention provide an adjustable form body having first and second sides, said form body configurable between a first substantially planar position and a second non-planar position. In some embodiments, the form comprises a surface coating. A form body according to example embodiments of the invention has a plurality of grooves. | 2014-08-07 |
20140217645 | MOULDING METHODS AND APPARATUS | 2014-08-07 |
20140217646 | MASK MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING MASK USING LASER BEAM - A mask manufacturing apparatus includes a laser irradiator, a stage, a frame, and a heat spreader sheet. The laser irradiator divides a laser beam into a plurality of sub-laser beams and irradiates the sub-laser beams to a shadow mask material which is placed over a stage. The frame is disposed over the stage to support the shadow mask material. The heat spreader sheet makes contact with the shadow mask material, absorbs heat generated from the shadow mask material, and dissipates the heat to surroundings of the shadow mask material. Accordingly, the shadow mask material is protected from overheating. | 2014-08-07 |
20140217647 | ADDITIVE MANUFACTURING OF TILED OBJECTS - Objects and methods for the manufacture of objects are provided such that the manufactured objects comprise a plurality of tile pieces and seams between the tile pieces, the seams allowing for controlled breaking of the objects. In some embodiments, the objects comprise casting molds or mold parts comprising a tile structure. | 2014-08-07 |
20140217648 | FABRIC INCLUDING POLYOLEFIN ELASTIC FIBER - An article comprising a yarn comprising an elastomeric propylene-based polymer composition; said polymer composition comprising at least one elastomeric propylene-based polymer, wherein said yarn has a draft greater than 200%; wherein said article is a fabric or a garment. | 2014-08-07 |
20140217649 | TISSUE ENGINEERED CONSTRUCTS - The present invention relates to a field of biocompatible membranes, tubes and conduits which comprising a photosensitizer which is capable of being crosslinked to form a three dimensional structure which can be implanted into a subject to assist in tissue bonding and nerve maintenance and development. Methods of making such membranes, tubes and conduits and kits comprising them are also described. | 2014-08-07 |
20140217650 | SYSTEM FOR INJECTION MOLDING AND RELATED METHOD - A system for injection molding a part includes a plate, first and second primary mold slides, first and second secondary mold slides and at least a first core post. The first and second primary mold slides define an exterior of a first portion of a molded part and are movable relative to each other between an open position and a closed position. The first and second secondary mold slides define an exterior of a second portion of the molded part and are movable relative to each other between an open position and a closed position. A first core post defines an interior of the first portion of the molded part. The first and second secondary mold slides are operative to secure the molded part as the first and second primary mold slides are moved from their closed position to their open position, as the molded part is expanded under a source of pressurized air and as the first core post is withdrawn from an interior of the molded part. | 2014-08-07 |
20140217651 | PRESSURE SENSITIVE FLOW DISTRIBUTION MEDIUM FOR VARTM - A method for manufacturing a fibre reinforced composite by means of a vacuum assisted resin transfer moulding, comprising the steps of placing a fibre material in a mould, placing a flow distribution medium onto the fibre material, and covering the fibre material and the flow distribution medium with a vacuum foil for forming a closed mould cavity between the mould and the vacuum foil is described. It is characterised in using a flow distribution medium with a thickness depending on a pressure gradient over the vacuum foil. | 2014-08-07 |
20140217652 | METHOD AND DEVICE FOR MANUFACTURING A CYLINDRICAL PART FROM COMPOSITE MATERIAL - A method for manufacturing a cylindrical part from composite material, and a molding device to implement the method, the method including: installation of a fibrous structure on a horizontal mandrel; formation of an annular enclosure for molding around the fibrous structure and the mandrel; supply of the enclosure with resin via a first axial end, while keeping a second axial end of the enclosure at a pressure lower than a supply pressure of the resin. The second end includes at least two sectors of vents in a form of ring sectors, each being independently kept at a pressure lower than the supply pressure. | 2014-08-07 |
20140217653 | SYSTEM FOR ENERGY OPTIMIZATION IN A PLANT FOR PRODUCING DIRECT-REDUCED METAL ORES - A system for energy optimization in a plant ( | 2014-08-07 |
20140217654 | CERAMIC REFRACTORY STOPPER - The invention relates to a ceramic refractory stopper (a stopper device) for controlling a flow of molten metal at an outlet opening of a metallurgical vessel, such as a tundish. | 2014-08-07 |
20140217655 | RAMMING MASS FOR THE REFRACTORY COATING OF A METALLURGICAL VESSEL, METHOD FOR IMPLEMENTING SAME AND METALLURGICAL VESSEL, IN PARTICULAR A BLAST FURNACE, COMPRISING A COATING USING SAID RAMMING MASS - A ramming mass for the block lining of at least some of the refractory elements of a refractory lining of a metallurgical vessel such as a blast furnace, said ramming mass being composed of a mixture of a granular phase and a binder phase, wherein the granular phase and/or binder comprises at least one component having a microporous structure or capable of forming a microporous structure by firing during the blast furnace campaign. | 2014-08-07 |
20140217656 | ELASTOMERIC ARTICLES WITH IMPROVED PROPERTIES - An air spring having an airsleeve, wherein at least one layer of said airsleeve includes the vulcanization product of a composition that includes an unsaturated chlorinated polymer; and a saturated chlorinated polymer. | 2014-08-07 |
20140217657 | SEAT SUPPORT ASSEMBLY - A seat support assembly including a substantially tubular containing jacket having a first end with an inwardly oriented return lip and a second end closable with a sealing closure, a guide portion adapted to be at least partially received by a seat stand, a resilient separator abutting a portion of the guide portion and the sealing closure, an adapter to attach to the guide portion and at least abut an inner surface of the containing jacket wherein the assembly damps oscillation between the adapter and the containing jacket. | 2014-08-07 |
20140217658 | DAMPER - Provided is a damper configured so that a compact pedal unit can be obtained using the damper and so that the damper can be easily retrofitted to a pedal unit. A damper ( | 2014-08-07 |
20140217659 | PNEUMATICALLY AUGMENTED ELASTOMERIC DAMPER FOR IMPROVED SPRING RATE TUNING - A system and method to change a spring rate of a damper in real time. The damper includes a housing having an inner surface that forms a cavity. An elastomeric material is disposed within the cavity and fixedly attached to the inner surface of the housing. A first chamber is formed by a first end of the elastomeric material and the inner surface of the housing. The method includes restricting movement of the elastomeric material by regulating the pressure within the first chamber, which in turn changes the spring rate of the damper. | 2014-08-07 |
20140217660 | DOUBLE PUMPER MAGNETO-RHEOLOGICAL HYDRAULIC TIE BAR ASSEMBLY - A tie bar assembly includes front and rear units each including inner inserts interconnected with outer inserts with webs of elastomeric material. A pole sub-assembly is disposed between the units. The pole sub-assembly and the units define front and rear fluid chambers containing a magneto-rheological fluid. Fluid orifices are disposed through the pole sub-assembly for flow of the magneto-rheological fluid between fluid chambers. An electromagnet coil generates an electromagnetic field to affect viscosity of the magneto-rheological fluid. A connecting rod connects inner inserts and is slidably disposed through the pole sub-assembly for causing movement of the magneto-rheological fluid between fluid chambers. A displacement sensor detects movement to generate a signal to the electromagnet coil. Front and rear travel cushions are each disposed on the inner inserts for limiting the movement of the inner inserts toward the pole sub-assembly. | 2014-08-07 |
20140217661 | HYDRAULIC MOUNT APPARATUS FOR SUPPORTING VIBRATION SOURCE - A hydraulic mount apparatus ( | 2014-08-07 |
20140217662 | POLYMER SPRING - A polymer spring has a hollow tubular polymer body, wherein the first end portion of the body, the second end portion of the body, and the mid-portion of the body together substantially maintain an annular cylindrical column structure throughout the length of the body from the first end portion of the body to the second end portion of the body, such that the mid-portion of the body has a substantial portion that is in direct alignment with the first end portion of the body and the second end portion of the body when the spring is compressed to eliminate or reduce the chances of the spring failing caused by the spring folding or buckling and to reduce material fatigue in the polymer spring associated with folding or buckling. | 2014-08-07 |
20140217663 | ROTARY DAMPER - Rotary damper ( | 2014-08-07 |
20140217664 | PNEUMATIC SPRING DEVICE FOR A MOTOR VEHICLE - The invention relates to a pneumatic spring device for a motor vehicle, including a rolling piston ( | 2014-08-07 |
20140217665 | SUBSTRATE SUPPORT WITH CONTROLLED SEALING GAP - Embodiments of substrate supports are provided herein. In some embodiments, a substrate support may include a support plate having a support surface a support plate having a support surface to support a substrate, a support ring to support a substrate at a perimeter of the support surface; and a plurality of first support elements disposed in the support ring, wherein an end portion of each of the first support elements is raised above an upper surface of the support ring to define a gap between the upper surface of the support ring and an imaginary plane disposed on the end portions of plurality of first support elements. | 2014-08-07 |
20140217666 | WORKING CHAMBER SYSTEM FOR THE SURFACE TREATMENT OF WORKPIECES - A working chamber system for the surface treatment of workpieces comprises at least one tightly closable work chamber ( | 2014-08-07 |
20140217667 | SHEET FEEDER AND IMAGE FORMING APPARATUS - A sheet feeder includes a recording media storage device. The recording media storage device stores recording media and is attachable to and detachable from a main body of an image forming apparatus. The image forming apparatus includes a feeding mechanism to pick up and convey one of the recording media at a time. The lock member disables the recording media storage device to be detached. The overflow restriction member is disposed in the main body and changes between a restriction position closer to an uppermost part of the recording media and a withdrawal position farther from the uppermost part of the recording media. The position change mechanism is disposed in the main body and changes the overflow restriction member into the restriction position when the lock member changes into a free state in which the recording media storage device is attachable and detachable. | 2014-08-07 |
20140217668 | CONTINUOUS PRINTER AND PAPER DELIVERY SYSTEM - A printing and paper delivery system includes at least two printers disposed adjacent to one another. A first conveyor is coupled to a first printer of the at least two printers such that the first conveyer is configured to receive media output from an output chute of the first printer. A second conveyor is coupled to a second printer of the at least two printers such that the first conveyor is configured to receive media output from an output chute of the second printer. A controller is in signal communication with the first and second conveyors to facilitate the transfer of media from at least one of the at least two printers to a delivery location. | 2014-08-07 |
20140217669 | PAPER SHEET PROCESSING DEVICE - Device with: banknote processing unit ( | 2014-08-07 |
20140217670 | CARD SHOE - A card shoe comprising security features. The card shoe may include a housing and a flexible flag to at least partially overlie a front cover and an opening in the front cover. The card shoe may include an opening between a playing card support and a bottom of the front cover sized to allow only one playing card to be withdrawn at one time. The card shoe may include identification tags and areas for advertising. A form of advertising may include light-emitting diodes incorporated into the housing of the card shoe. | 2014-08-07 |
20140217671 | Three-Dimensional Brain Teaser - The invention pertains to toys, more specifically to mechanical three-dimensional brain teasers, which can be used for play and also as a training device for developing manual dexterity, a souvenir or an educational aid. The three-dimensional brain teaser is in the form of a body of revolution having three continuous grooves on the surface thereof, which are arranged symmetrically about the body of revolution and intersect at six points. Movable components capable of moving along one continuous groove and from one continuous groove into another are arranged in the continuous grooves. The points of intersection of the continuous grooves lie in three half planes, wherein the points of intersection of each pair of the three continuous grooves lie in the same half plane, and the sections of the continuous grooves arranged between said points of intersection contain an equal number of movable components, and the remaining two sections of each continuous groove, which are located between the points of intersection in the adjacent half planes, contain an unequal number of movable components. | 2014-08-07 |
20140217672 | PAIRS CARD GAME - A card game in which players attempt to build the highest ranking two pairs of playing cards built in various rounds. Initially, one face down community card is dealt on the table, four face up public cards and one face down private card dealt to each player. Each player inspects his or her public cards to determine if there are two pairs of cards. The player with two pairs and having the highest ranking value may place a wager. If no player has two pairs, then one additional public card is dealt to each player until at least one player has two pairs of cards. Next, the community card is revealed to all players that may be combined with a player's public cards to make a second set of two pairs of cards. The player with the highest pair of cards in the second set may place a wager. Next, each remaining player may examine the private card and combine it with the community and public cards to make a third set of two pairs of cards. The player having at least two pairs and having the highest ranking value is declared the winner. | 2014-08-07 |
20140217673 | COMMUNICATION GAME KIT AND METHOD - Kits, methods and computer programs are disclosed which facilitate playing of a communication game incorporating rebuses. Each of an assortment of game pieces may have one or more respective symbols thereon. Each symbol may be convertible between an active state and an inactive state. Each game piece may be convertible by one or more players from an unused status to a used status during play intervals, wherein a respective game piece is in its used status when placed in an adjacent arrangement with one or more other game pieces such that their active symbols combine to form one or more communication elements incorporating one or more rebus elements. A bonus element may be activatable by a player for temporary designation of the activating player as a bonus player and for substantially random presentation of a player instruction from a set of player instructions. Timing and scoring aspects may be incorporated. | 2014-08-07 |
20140217674 | REPLACEABLE MOVING TARGET SYSTEM AND METHOD - An electronic moving target system and method, which users may aim and shoot various instruments at which can be configured to present rigid or flexible targets from a variety of different directions. The target system presents users with realistic moving targets which may be quickly and easily be replaced as needed. The moving target system is fully programmable by a user and may present a series of varying challenges to a marksman. The moving target system may include a target surface operatively connected to a control arm which is powered by a motor. The motor receives signals from a control box supplying instructions from a microcontroller. | 2014-08-07 |
20140217675 | VALVE, PIPE AND PIPE COMPONENT REPAIR - In some implementations, an injectable flange gasket includes a plate having two parallel surfaces, each of the two parallel surfaces having an perimeter, the plate also having an outer edge between the perimeters of the parallel surfaces, the outer edge being about perpendicular to the two parallel surfaces, at least one groove in only one of the two parallel surfaces, the groove being continuous and the plate also having a hole that extends from a wall of the groove and through the outer edge of the plate. | 2014-08-07 |
20140217676 | SLIDING PARTS - Sliding parts are provided where a plurality of dynamic pressure-generating grooves for generating dynamic pressure via the relative rotational sliding of the stationary ring and the rotating ring are formed in a circumferential direction on a sealing face of one of a stationary ring and the rotating ring so as to communicate with a sealed fluid-containing space, and pumping areas for generating pumping action via the relative rotational sliding of the stationary ring and the rotating ring are formed within the dynamic pressure-generating grooves. | 2014-08-07 |