| 32nd week of 2009 patent applcation highlights part 14 |
| Patent application number | Title | Published |
|---|
| 20090194860 | Chip Housing Having Reduced Induced Vibration - A premold housing for accommodating a chip structure includes a first part of the housing which is connected to the chip structure as well as connected in an elastically deflectable manner to an additional part of the housing which is fastened to the support structure bearing the entire housing. A mechanism is provided for damping the deflection of the first part of the housing which is connected to the chip structure. | 2009-08-06 |
| 20090194861 | Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level - A plurality of devices are hermetically packaged at the wafer level by 1) providing a substrate wafer having a plurality of at least partially-formed devices thereon; 2) forming separation walls on the substrate wafer, around different ones of the at least partially-formed devices; and 3) wafer bonding a cap wafer to the separation walls, to form a plurality of hermetic packages. | 2009-08-06 |
| 20090194862 | SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME - There is provided a semiconductor module having improved heat radiation efficiency. A semiconductor module includes a semiconductor element, a pair of Cu heat radiating plates sandwiching the semiconductor element, insulating and heat radiating plates sandwiching the Cu heat radiating plates, heat radiating fins sandwiching the insulating and heat radiating plates, and solder applied between the Cu heat radiating plates and the insulating and heat radiating plates as well as between the insulating and heat radiating plates and the heat radiating fins. | 2009-08-06 |
| 20090194863 | SEMICONDUCTOR PACKAGE AND METHOD FOR MAKING THE SAME - A semiconductor package includes: a semiconductor substrate; an inner insulator layer formed on the substrate; at least one internal wiring extending from a front side of the substrate along one of lateral sides of the substrate to a rear side of the substrate; a first outer insulator layer disposed at the front side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole; and a second outer insulator layer disposed at the rear side of the substrate, formed on the internal wiring, and formed with at least one wire-connecting hole which exposes a portion of the internal wiring. | 2009-08-06 |
| 20090194864 | INTEGRATED MODULE FOR DATA PROCESSING SYSTEM - An apparatus for an integrated module. A silicon carrier with through-silicon vias has a plurality of die connected to a top side of the silicon carrier. In addition, a substrate is connected to a bottom side of the silicon carrier. The substrate is coupled to the plurality of die via the through-silicon vias. | 2009-08-06 |
| 20090194865 | METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE, METHOD FOR DETECTING A SEMICONDUCTOR SUBSTRATE AND SEMICONDUCTOR CHIP PACKAGE - A method for manufacturing a semiconductor device, includes: preparing a semiconductor substrate with a first notch; preparing a supporting substrate with a second notch; laminating the semiconductor substrate with the supporting substrate so that the first notch can be matched with the second notch; and processing a second main surface of the semiconductor substrate opposite to a first main surface thereof facing to the supporting substrate to reduce a thickness of the semiconductor substrate to a predetermined thickness. | 2009-08-06 |
| 20090194866 | SEMICONDUCTOR DEVICE HAVING WIRING LINE AND MANUFACTURING METHOD THEREOF - An insulating film covering the upper surface of an external connection electrode of a semiconductor construct is formed. A mask metal layer in which there is formed an opening having a planar size smaller than that of the external connection electrode is formed on the insulating film. The mask metal layer is used as a mask to apply a laser beam to the insulating film, such that a connection opening reaching the external connection electrode is formed in the insulating film. A wiring line is formed on the insulating film in such a manner as to be connected to the external connection electrode via the connection opening. | 2009-08-06 |
| 20090194867 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH INTERNAL STACKING MODULE ADHESIVE - An integrated circuit package system comprising: providing a substrate; forming a base assembled package over the substrate; forming a top package over the base assemble package; and applying a top package stacking material for stand-off or insulation to the base assembled package and the top package. | 2009-08-06 |
| 20090194868 | PANEL LEVEL METHODS AND SYSTEMS FOR PACKAGING INTEGRATED CIRCUITS WITH INTEGRATED HEAT SINKS - Panel level methods and arrangements are described for attaching heat sinks in panel form with dice attached to a leadframe panel. Various methods produce integrated circuit packages each having an exposed heat sink on one outer surface of the package and an exposed die attach pad on a second opposite surface of the package. | 2009-08-06 |
| 20090194869 | HEAT SINK PACKAGE - Provided are a heat sink package in which a semiconductor package and a heat sink are bound to each other and a method of fabricating the same. | 2009-08-06 |
| 20090194870 | Method and Apparatus for Solid State Cooling System - The disclosure relates to a Point Cooler based on a combination of principles, including large area, low current density PN junction cooling, and electron emission from heavily doped shallowly-depleted P tips. Using Junction Cooling rather than thermoelectric cooling enables an all silicon device to be made that favorably competes with the commercial thermoelectric cooling systems. Theoretical values of T | 2009-08-06 |
| 20090194871 | SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES - A method of mounting a semiconductor die on a substrate with a solder mask on a first surface includes placing a die on the solder mask, and mounting the die to the substrate by applying pressure and heat. The applied pressure ranges from a bond force of approximately 5 to 10 Kg, the heat has a temperature range from approximately 150 to 200° C. and the pressure is applied for a range of approximately 1 to 10 seconds. | 2009-08-06 |
| 20090194872 | DEPOPULATING INTEGRATED CIRCUIT PACKAGE BALL LOCATIONS TO ENABLE IMPROVED EDGE CLEARANCE IN SHIPPING TRAY - Methods, systems, and apparatuses for integrated circuit packages, transport containers, and for transporting integrated circuit packages are provided. A transport container for an integrated circuit package includes a body and a plurality of mounting features. The body has a surface that includes a package receiving region. The plurality of mounting features is positioned in the package receiving region. A first mounting feature is positioned on a first inner surface of the package receiving region and a second mounting feature is positioned on a second inner surface of the package receiving region. The package receiving region is configured to receive an integrated circuit package such that the received package is supported by the plurality of mounting features. The first and second mounting features coincide with respective spaces in first and second edges of an array of solder balls on a surface of the package. | 2009-08-06 |
| 20090194873 | INTEGRATED CIRCUIT DEVICE AND A METHOD OF MAKING THE INTEGRATED CIRCUIT DEVICE - An integrated circuit device comprises a first semiconductor chip on a first substrate and a second semiconductor chip on a second substrate. A side surface of the first semiconductor chip is facing a side surface of the second semiconductor chip. At least one electric cable is provided to be connecting the first substrate to the second substrate. | 2009-08-06 |
| 20090194874 | SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF - A semiconductor chip package and a method for manufacturing thereof includes sequentially forming upper dielectric layer patterns and lower dielectric patterns over a substrate to expose an underlying metal line such that the lower dielectric layer patterns overlap the metal line, positioning a solder ball over and contacting the lower dielectric layer patterns such that the solder ball does not contact the metal line, and then placing the solder ball in a contacting position over the metal line by performing an etching process on the lower dielectric layer patterns. Therefore, no cracks occur on the chip pads so that there is no concern of short phenomenon generated in the terminal. | 2009-08-06 |
| 20090194875 | HIGH PURITY Cu STRUCTURE FOR INTERCONNECT APPLICATIONS - A structure and method of forming a high purity copper structure for interconnect applications is described. The structure includes a patterned dielectric material and at least one Cu-containing conductive material having an upper surface embedded within the dielectric material; and a diffusion barrier and a noble metal liner separating the patterned dielectric material from the at least one Cu-containing conductive material; where the Cu-containing conductive material having high purity, C<10 ppm, Cl<10 ppm, S<10 ppm, and uniform impurity. A method of fabricating the interconnect structure is also described. The method includes providing an initial interconnect structure that includes a dielectric having at least one opening; forming a diffusion barrier layer on all exposed surfaces; forming a noble metal layer on the diffusion barrier layer; forming a Cu containing layer on the noble metal layer; and completely filling the at least one opening with the Cu containing layer. | 2009-08-06 |
| 20090194876 | INTERCONNECT STRUCTURE AND METHOD FOR Cu/ULTRA LOW k INTEGRATION - A semiconductor structure is provided that includes a lower interconnect level including a first dielectric material having at least one conductive feature embedded therein; a dielectric capping layer located on the first dielectric material and some, but not all, portions of the at least one conductive feature; and an upper interconnect level including a second dielectric material having at least one conductively filled via and an overlying conductively filled line disposed therein, wherein the conductively filled via is in contact with an exposed surface of the at least one conductive feature of the first interconnect level by an anchoring area. Moreover, the conductively filled via and conductively filled line of the inventive structure are separated from the second dielectric material by a single continuous diffusion barrier layer. As such, the second dielectric material includes no damaged regions in areas adjacent to the conductively filled line. A method of forming such an interconnect structure is also provided. | 2009-08-06 |
| 20090194877 | SEMICONDUCTOR DEVICE HAVING SOI STRUCTURE - A plurality of conductive layers and a plurality of wiring layers connecting a supporting substrate having SOI structure and uppermost wire are formed along a peripheral part of a semiconductor chip together with the uppermost wire, to thereby surround a transistor forming region in which a transistor is to be formed. | 2009-08-06 |
| 20090194878 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME - The present invention relates to a semiconductor device and a method of manufacture thereof, particularly, to the technology capable of preventing the overlap failure between the metal line and the bit line pad, since the size of the bit line pad can be increased and the height between the bit line pad and the metal line can be reduced, by designing the semiconductor device to form the bit line and the bit line pad with the stacking structure | 2009-08-06 |
| 20090194879 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A semiconductor device includes a plurality of first interconnection layers which are provided in an insulating layer and formed in a pattern having a width and space smaller than a resolution limit of an exposure technique, and a second interconnection layer which is provided between the first interconnection layers in the insulating layer and has a width larger than that of a first interconnection layer. A space between the second interconnection layer and each of first interconnection layers adjacent to both sides of the second interconnection layer equals the space between the first interconnection layers. | 2009-08-06 |
| 20090194880 | WAFER LEVEL CHIP SCALE PACKAGE AND PROCESS OF MANUFACTURE - Power wafer level chip scale package (CSP) and process of manufacture are enclosed. The power wafer level chip scale package includes all source, gate and drain electrodes located on one side of the device, which is convenient for mounting to a printed circuit board (PCB) with solder paste. | 2009-08-06 |
| 20090194881 | Method for Manufacturing a Wafer Level Package - A method for manufacturing a wafer level package of an integrated circuit element for direct attachment to a wiring board is disclosed. An integrated circuit element includes input/output pads located on an active side. A non-conductive support structure is formed on the active side of the integrated circuit element in an area that is free from input/output pads. A conductive path is formed upon the support structure and a non-conductive coating is formed on over the active side of the integrated circuit element such that a surface is formed which leaves interface pads accessible. | 2009-08-06 |
| 20090194882 | ELECTRONIC DEVICE - One embodiment provides a method of manufacturing semiconductor devices. For example, a sawn and expanded wafer is utilized having dielectrical material deposited between the diced and deposited chips. The method includes placing at least two chips on a metallic layer, depositing mold material on the metallic layer and between the chips, and selectively removing a portion of the mold material from the metallic layer to selectively expose a portion of the metallic layer. The method additionally includes covering the selectively exposed portion of the metallic layer with a conductive material, and singulating the at least two chips. | 2009-08-06 |
| 20090194883 | DATA LINE STRUCTURE IN LEAD REGION AND MANUFACTURING METHOD THEREOF - An embodiment of the invention provides a data line structure in a lead region of a thin film transistor liquid crystal display (TFT-LCD). The data line structure in the lead region comprises a substrate and a gate layer data line segment, a dielectric layer, a data line lead, and a passivation layer, which are formed sequentially in the lead region on the substrate. The gate layer data line segment extends corresponding to the data line lead; the data line lead is formed with a via hole therein; a portion of the gate insulating layer and a portion of the passivation layer in a position corresponding to the via hole are removed so as to form a connection hole together with the via hole; a connection line segment is formed in the connection hole, and the gate layer data line segment and the data line lead are connected by the connection line segment in the connection hole. | 2009-08-06 |
| 20090194884 | POWER SEMICONDUCTOR MODULE INCLUDING A CONTACT ELEMENT - A power semiconductor module including a contact element. One embodiment provides an electrically conductive contact element extending in a longitudinal direction and having a first end and a second end lying opposite the first end. The contact element has a first flange at its first end. The first flange is embodied such that when the contact element is placed with the first flange ahead onto a plane perpendicular to the longitudinal direction, the first flange has with the plane a number of first contact areas spaced apart from one another. | 2009-08-06 |
| 20090194885 | SEMICONDUCTOR DEVICE HAVING WIRING LINE AND MANUFACTURING METHOD THEREOF - On the lower surface of a semiconductor construct having an external connection electrode, there are formed an insulating film having a planar size greater than that of the semiconductor construct, and a metal layer and a mask metal layer having a connection pad portion in which a first opening corresponding to the external connection electrode is formed. A laser beam is applied using the mask metal layer as a mask, and a second opening is thereby formed in a part of the insulating film corresponding to the external connection electrode. Then, a connection conductor is formed to connect a wiring line to the external connection electrode via the second opening of the insulating film. | 2009-08-06 |
| 20090194886 | PASS THROUGH VIA TECHNOLOGY FOR USE DURING TEH MANUFACTURE OF A SEMICONDUCTOR DEVICE - Via structures are described which pass through a semiconductor substrate assembly such as a semiconductor die or wafer and allows for two different types of connections to be formed during a single formation process. One connection passes through the wafer without being electrically coupled to the wafer, while the other connection electrically connects to a conductive pad. To connect to a pad, a larger opening is etched into an overlying dielectric layer, while to pass through a pad without connection, a narrower opening is etched into the overlying dielectric layer. | 2009-08-06 |
| 20090194887 | EMBEDDED DIE PACKAGE ON PACKAGE (POP) WITH PRE-MOLDED LEADFRAME - A multiple-chip package has top and bottom pre-molded leadframes formed prior to the flip-chip attachment of semiconductor die to the leadframes. After die attachment, underfill is used to encase all but one surface of the die, and the top and bottom leadframes are joined together by solder bump balls with the exposed surfaces of the semiconductor dice proximate to each other. | 2009-08-06 |
| 20090194888 | SEMICONDUCTOR DEVICE INCLUDING WIRING AND MANUFACTURING METHOD THEREOF - A semiconductor construct is provided which has a semiconductor substrate, an external connection electrode, and an electrode enveloping layer for enveloping the external connection electrode. Also, a base plate is provided which includes a wiring having a first opening corresponding to the external connection electrode. Subsequently, the base plate is removed after the semiconductor construct is fixed to the base plate, and a second opening which reaches the external connection electrode is formed on the electrode enveloping layer corresponding to the first opening of the wiring. Then, a connection conductor for electrically connecting the wiring and the external connection electrode is formed. | 2009-08-06 |
| 20090194889 | BOND PAD STRUCTURE - A bonding pad structure is provided that includes two conductive layers and a connective layer interposing the two conductive layers. The connective layer includes a contiguous, conductive structure. In an embodiment, the contiguous conductive structure is a solid layer of conductive material. In other embodiments, the contiguous conductive structure is a conductive network including, for example, a matrix configuration or a plurality of conductive stripes. At least one dielectric spacer may interpose the conductive network. In an embodiment, the conductive density of the connective layer is between approximately 20% and 100%. | 2009-08-06 |
| 20090194890 | Integrated Circuit and Memory Module - Embodiments of the invention relate generally to an integrated circuit and a memory module. In an embodiment of the invention, an integrated circuit is provided. The integrated circuit may include a semiconductor carrier including at least one electrically inactive region on an upper surface thereof, a passivation layer structure disposed above the upper surface of the semiconductor carrier, and at least one lithographic trench in the passivation layer structure above the at least one electrically inactive region on the upper surface of the semiconductor carrier. | 2009-08-06 |
| 20090194891 | Long period gratings on hollow-core fibers - High-quality long periodic grating (LPGs) were written in air-core photonic bandgap fibers by use of high frequency short duration CO2 laser pulses to periodically vary the size and shape of the air-holes in the holey cladding. The variation of cladding holes changes the waveguide structure, instead of the index of the materials forming the waveguide, and resonantly couples the core mode to discrete higher order or surface-like modes and then to lossy quasi-continuum of cladding and radiating modes. This mechanism is different from LPGs in solid core fibers in which the core mode is directly coupled into discrete cladding modes. The LPGs in hollow-core PBFs have unique properties such as very large PDL, very small or insensitivity to temperature, bent and external refractive index, and large strain sensitivity, and will have applications in both communication devices and sensors. | 2009-08-06 |
| 20090194892 | METHOD OF MANUFACTURING OPTICAL COMPONENTS - A method of manufacturing an optical component is provided. The method comprises steps of providing a first liquid; providing a fluid, disposed above the first liquid, wherein an interface exists between the first liquid and the fluid; providing a polymer precursor at the interface; and solidifying the polymer precursor so as to form the optical component made by a polymer. | 2009-08-06 |
| 20090194893 | Chewable Capsule and Production Method Thereof - This chewable capsule has an encapsulating shell and a filling contained within the encapsulating shell, in which outer diameter of the above encapsulating shell ranges from 14 mm to 25 mm, and mass of the above encapsulating shell, ranges from 10% to 20% of the total mass of the chewable capsule, the quantity of the above filling contained within the above encapsulating shell ranges from 1400 mg to 3000 mg, and gelatin is contained in the above encapsulating shell. | 2009-08-06 |
| 20090194894 | Residual solvent extraction method and microparticles produced thereby - Methods for preparing microparticles having reduced residual solvent levels. Microparticles are contacted with a non-aqueous washing system to reduce the level of residual solvent in the microparticles. Preferred non-aqueous washing systems include 100% ethanol and a blend of ethanol and heptane. A solvent blend of a hardening solvent and a washing solvent can be used to harden and wash microparticles in a single step, thereby eliminating the need for a post-hardening wash step. | 2009-08-06 |
| 20090194895 | CVD DENSIFIED PREFORM FOLLOWED BY VPI AND RTM - Method for producing carbon-carbon composite brake discs by: (a) providing annular nonwoven carbon fiber brake disc preforms; (b) carbonizing the brake disc preforms; (c) densifying the carbonized preforms by CVD/CVI (chemical vapor deposition/chemical vapor infiltration); (d) densifying the products of step (c) with isotropic or mesophase pitch by VPI (vacuum pitch infiltration) or RTM (resin transfer molding) processing; (e) carbonizing the preforms to remove non-carbon volatiles from the pitch and to open porosity in the pitch-infused preforms; (f) densifying the products of step (e) with isotropic or mesophase pitch by VPI or RTM processing; (g) carbonizing the preforms to remove non-carbon volatiles from pitch and to open porosity in the pitch-infused preforms; and (h) heat-treating the resulting pitch-densified carbon-carbon composite brake disc preforms. This manufacturing approach reduces lot-to-lot variability in friction performance of the resulting carbon-carbon composite brake discs. | 2009-08-06 |
| 20090194896 | METHODS AND APPARATUS TO PREVENT MOLD COMPOUND FEEDER JAMS IN SYSTEMS TO PACKAGE INTEGRATED CIRCUITS - Methods and apparatus to preventing mold feeder jams in a system to package integrated circuits. An example method includes detecting if a mold compound tablet has a first alignment on a path and removing the mold compound tablet from the path if the mold compound tablet has a second alignment different from the first alignment. | 2009-08-06 |
| 20090194897 | Injection member of molding machine and molding method - An injection member of a molding machine is provided which can shorten the molding cycle and maintenance time, and prevent occurrence of galling between a cylinder member and an injection member. The injection member of the molding machine includes a supply section (P | 2009-08-06 |
| 20090194898 | Hafnium Silicide Target for Forming Gate Oxide Film, and Method for Preparation Thereof - A hafnium silicide target is provided. The target is used for forming a gate oxide film composed of HfSi | 2009-08-06 |
| 20090194899 | Adjustable air shield for skewed godet rolls - The present invention relates to an adjustable air shield for skewed godet rolls. The air shield can be any blocking type plate with or without perforations. Furthermore, these air shields may be placed in close proximity to the pair of skewed, relax rolls in the relax zone of a fiber producing process. The plates are positioned on the inside of the threadline so that the airflow is substantially reduced around the threadline on the skewed rolls. The preferred embodiment of the present invention is one or more skewed godet rolls in the relax area of the fiber production process with air shields positioned on the inside of the fiber string up (threadline) between the pair of skewed rolls, such that the gap between any roll and any air shield is uniform and constant. | 2009-08-06 |
| 20090194900 | DRAWING APPARATUS AND DRAWING METHOD - The present invention aims at providing a drawing apparatus capable of taking out a material, the inner surface of which has been formed into a concavo-convex shape with drawing, from a mold with excellent release performance, even in the case where the concavo-convex part formed in the inner surface of the product is of a shape causing it to get caught in the direction of pulling out of the product against the mold and, in a drawing apparatus comprising a mold | 2009-08-06 |
| 20090194901 | CASTING DEVICE, SOLUTION CASTING APPARATUS, AND SOLUTION CASTING METHOD - In a feed block, a main conduit and sub conduits are formed. High-viscosity dope flows through the main conduit, and low-viscosity dope flows through the sub conduits. Distribution pins are disposed in a joint portion where the sub conduits intersect with the main conduit for controlling the flow volume of the low-viscosity dope. A tapered cutout is formed in the peripheral surface of the distribution pin. The distribution pin is attached in such an orientation that a wider side of the cutout coincides with the lower reaches of a dope flow. Since ledges are formed in both ends of the cutout, the amount of the low-viscosity dope flowing through the cutout is smaller in both widthwise ends than in the middle. | 2009-08-06 |
| 20090194902 | Bumper Back Beam For Vehicle and Molding Method Thereof - Disclosed herein is a method of molding a bumper back beam for a vehicle and the bumper back beam manufactured using the method. The method of molding the bumper back beam includes: preparing a lattice mat and long fiber pellets as raw materials, introducing the lattice mat into a die, supplying the long fiber pellets into the die and then injection-molding a bumper back beam from the lattice mat and long fiber pellets at low pressures and separating the injection-molded bumper back beam from the die. | 2009-08-06 |
| 20090194903 | Non-stringing hot tip - Disclosed is a nozzle tip, having a tip insert attached to a nozzle tip outlet end of a nozzle tip body, the tip insert being made of a material, or having a thermal barrier coating, having a thermal conductivity value of K<10 W/m° K, and having a lower thermal conductivity than that of the nozzle tip body, to preclude the conduction of excessive heat to the nozzle tip outlet end, and promoting a more decisive fracture of the solidified resin at a gate orifice upon ejection of a molded product, thereby eliminating a string of molten resin and a vestige of excessive height, both of which are undesirable, on the molded product. | 2009-08-06 |
| 20090194904 | PROCESS AND APPARTUS FOR MAKING AN INJECTION MOLDED VIAL - A process for forming a vial consisting of a tube, an insert secured within the tube, and a cap secured to the tube, which includes injection molding of the insert, removing the insert from the injection molding machine and placing it over a pin on a moving pallet by use of a manipulator, injection molding of the tube by a separate injection molding machine and moving the injection molded tube to a position where it is placed over the insert on the moving pallet by use of a manipulator, wherein a cap for the tube is formed at a separate injection molding machine where the cap is secured to the tube, wherein the joined tube with insert and cap are moved to a cap closing station wherein, after closing of the cap onto the tube, the assembled vial is inspected, tested and packaged. | 2009-08-06 |
| 20090194905 | MOLDING METHOD AND MOLDING APPARATUS OF MOLD PRODUCT HAVING THIN FILM AT INNER SURFACE - A molding method involves a first and a second sliding die, a first and a second fixed die, and a sliding film forming chamber. The first, the second sliding dies are moved in directions reverse to each other to take a primary molding position, a film forming position and a secondary molding position. The sliding film forming chamber includes a first, a second masking plate and are arranged to be remote from the first, the second fixed dies. Further, the sliding film forming chamber is slid in an up and down direction. The first, the second sliding dies are respectively formed with recess portions and cores, the first, the second fixed dies are respectively formed with cores and recess portions. | 2009-08-06 |
| 20090194906 | Process of draping a non-crimp fabric over a forming tool - A method of producing a non-crimp fabric and a non-crimp fabric comprising a layup of fabric plies stitched together by a thread, at least part of which is fusible, is provided. The method can include heating the stitched plies to soften or melt the fusible thread. The use of fusible thread can act as an in situ binder within the non-crimp fabric and tension created by the unfused stitching may create channels for matrix resin infusion during manufacture. | 2009-08-06 |
| 20090194907 | Formed felt device and method of making the same - A bumper for protecting a contact point of a surface from engagement with an object and a method of fabricating the same are provided. The bumper includes a shell having first and second ends, an outer surface, and an inner surface defining a passageway through the shell between the first and second ends. A resilient material is positioned in the passageway and extends between the first end and the second end of the shell. | 2009-08-06 |
| 20090194908 | MOLD FOR INJECTION MOLDING AND AN INJECTION MOLDING DEVICE/METHOD WITH SURFACE QUALITY IMPROVEMENT ABILITY - A mold for injection molding and an injection molding device/method with surface quality improvement ability are disclosed, in which the injection molding device comprises: a mold including a first mold piece and a second mold piece; and a film feeder. In an exemplary embodiment, the second mold piece is configured with a suction unit in a manner that the film feeder is enabled to provide a film to the suction unit. | 2009-08-06 |
| 20090194909 | Apparatus and method for manufacturing products from a thermoplastic mass - An apparatus for manufacturing products from material which is thermoplastically deformable, as from plastic, comprising: —a mold ( | 2009-08-06 |
| 20090194910 | Two Stage Spring Pack Device for Hot Runner Sealing - A two stage spring pack device comprising a nozzle or back up insulator, surrounded by a first stage spring for applying an initial force, and a plurality of Belleville springs to exert a secondary force against a thermally expanding hot runner manifold in an injection molding system, precludes resin leakage between a manifold and nozzle or between mating manifolds in a cross manifold system. The first stage spring imparts a relatively low initial force against the hot runner components while the system heats up from ambient temperature to prevent plate bowing and component hobbing, until it is fully compressed, at which point a subsequently larger sealing force is exerted by the constant force Belleville springs to prevent leakage between the mating components at operating temperature and injection pressure. | 2009-08-06 |
| 20090194911 | OPTICAL MICRO-ARRAY FOR E.G. MICRO SENSORS - Method for manufacturing a polymer body ( | 2009-08-06 |
| 20090194912 | MOLDING COMPOSITION AND METHOD USING SAME TO FORM DISPLACEMENTS FOR USE IN A METAL CASTING PROCESS - A method to form a displacement for use in a metal casting process, wherein the method provides a plurality of ceramic particles and a plurality of resin particles. The method grinds the plurality of ceramic particles until those ceramic particles comprise diameters less than 150 microns, and grinds the plurality of resin particles until those resin particles comprise diameters less than 100 microns, and forms a powder blend comprising the plurality of ground ceramic particles and the plurality of ground resin particles. The method then disposes the powder blend into a mold comprising a cavity defining the desired displacement. The method further densifies the blend, and cures the resin to form the displacement. | 2009-08-06 |
| 20090194913 | Method of micro/nano imprinting - Disclosed is a method of micro/nano imprinting, which applies soft mold, pre-shaping sealing film, and soft holder arrangements to the micro/nano structure imprinting process of the curved substrates. The method of the present invention can prevent the curved surface from crumbling, which may result from high gas pressuring, and can obtain uniform imprinting pressure distribution throughout the whole curved substrate. Moreover, replicating micro/nano structures onto double-sided curve, both convex and concave, surfaces can also be achieved. | 2009-08-06 |
| 20090194914 | Mold, process for producing mold, and process for producing sheet - A mold comprising alumina having a microscopic pattern, in which distances between adjacent recesses or salients therein are not longer than wavelength of visible light, formed by anodic oxidation on a surface of an aluminum pre-mold without a rolling mark, wherein height or depth difference at a crystal grain boundary is 300 nm or less. | 2009-08-06 |
| 20090194915 | Preforms Made of Two or More Materials and Processes for Obtaining Them - Process for making preforms made of two different materials wherein the first material ( | 2009-08-06 |
| 20090194916 | Container, thermo-molding apparatus and method for thermo-molding the same - The present invention provides a bottomed cylindrical container, comprising a body wall, a bottom wall, and a ring-shaped foot downwardly extending from the bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said foot is formed by folding an inner wall by compressed fluid to be fusion-bonded with an outer wall, so as to form the foot comprising the inner wall and the outer wall. The present invention also provides a bottomed cylindrical container, comprising a body wall having a grounding edge at a lower end thereof, and a bottom wall, said container being produced by thermo-molding a resin sheet, characterized in that said bottom wall connects with an upper edge of an inner wall produced by folding back the body wall along the grounding edge and by fusion-bonding it to an inner periphery of the body wall. In addition, the present invention provides the methods for thermo-molding these containers and their apparatuses. | 2009-08-06 |
| 20090194917 | CONTROLLED COOLING APPARATUS AND COOLING METHOD OF STEEL PLATE - The present invention provides a steel plate cooling method, in controlled cooling of thick-gauge steel plate, which uniformly cools steel plate over its entire length and eliminates plate warping, that is, a method of conveying and cooling the top and bottom surfaces of steel plate in a high temperature state after hot rolling while constraining the high temperature rolled steel plate by a plurality of sets or top and bottom draining rolls, wherein cooling nozzles having a large number of nozzle openings and individually or simultaneously spraying the two fluids of air and water are used to cool the steel plate, the cooling method of steel plate characterized by giving a stable pattern by driving out air trying to invade the path of flow reaching the front end of the cooling apparatus when the water which is fed is low in amount or low in pressure. Further, the apparatus for working this method is a steel plate cooling apparatus comprised of an outside header having an air feed system, a plurality of air spray nozzles arranged at the air spray surface of this header, an inside header having a cooling water feed system, and a plurality of cooling water spray nozzles arranged at a cooling water spray surface of this header. | 2009-08-06 |
| 20090194918 | Gas supply system for a metallurgical furnace and method for operating this system - A gas supply system for a side blowing and/or bottom blowing metallurgical furnace with at least one tuyere which is mounted in the side wall and/or in the bottom of the furnace, wherein gas is conveyed through a line of the gas supply system to the tuyere and through the tuyere to the interior of the metallurgical furnace and emerges there in the form of bubbles. The gas supply system has an inflow restrictor which is assigned to the tuyere or is positioned upstream of the tuyere and reduces or interrupts the gas supply to the interior of the furnace at equal intervals of time. | 2009-08-06 |
| 20090194919 | DIRECT SMELTING PLANT - A direct smelting plant for producing molten metal from a metalliferous feed material using a molten bath based direct melting process is disclosed. The plant includes a plurality of gas injection lances to inject the oxygen-containing gas into the vessel that extend downwardly through openings in a side wall of a direct smelting vessel. | 2009-08-06 |
| 20090194920 | Integrated Suspension Control Device - A suspension device is provided having a casing that defines a cavity, which further defines a stop face. A piston is slidably disposed in the cavity and offset from the stop face, wherein the piston is operable to move axially relative to the stop face when a force is imparted on at least one of the casing and the piston. A spring is disposed in the cavity and between the stop face and the piston, wherein the spring communicates with the piston and the end face and is operable to compress as the piston moves toward the end face and absorb the force. A friction damper is disposed in the cavity and operable to generate frictional drag between the piston and the casing, wherein the frictional drag inhibits axial movement of the piston in the cavity. | 2009-08-06 |
| 20090194921 | HIGH FORCE CIVIL ENGINEERING DAMPER - A civil engineering damper for damping civil engineered structures comprising a damper housing including two dynamic fluid chambers within a piston cylinder and two static fluid chambers straddling the dynamic fluid chambers along an axis of the housing a piston mounted for reciprocation along the axis of the damper housing. A piston web portion divides the piston cylinder into the two dynamic fluid chamber. A restricted passageway through the piston web portion includes an orifice that provides a resistance to fluid flow between the dynamic fluid chambers. The damper also includes regulated passageways between adjacent dynamic and static fluid chambers valved to allow a flow of fluid from the static fluid chambers to the dynamic fluid chambers and check flows of fluid from the dynamic fluid chambers to the static fluid chambers. | 2009-08-06 |
| 20090194922 | RECONFIGURABLE END-OF-ARM TOOL FOR ROBOTIC ARM - A configurable end-of-arm tool attachable to an articulable robotic arm is described. The end-of-arm tool comprises a rail element, a machine-adjustable swing arm, a machine-adjustable extendable shaft attached to the swing arm. A machine-adjustable rotator set is attached to the extendable shaft, and a workpiece interface tool is attached to the extendable shaft. The swing arm, the extendable shaft, and the rotator set are machine-adjustable to place the workpiece interface tool at a predetermined position. | 2009-08-06 |
| 20090194923 | PIPE STAND WITH ACCESSORIES - A pipe stand able to support a conduit includes a table having a first surface, supports pivotably coupled to the table for supporting the table in an elevated position with respect to the support surface, and a shelf extending between the supports and positioned between the table and the support surface. At least one of the supports includes an electrical connector, and a power cord is in electrical communication with the electrical connector and connectable to an external power source. The pipe stand includes a first jaw extending from the first surface of the table and shaped to engage a portion of the conduit, and a second jaw a second jaw extending from the first surface of the table and spaced a distance from the first jaw, the second jaw shaped to engage another portion of the conduit. A clamping device is supported by one of the first jaw and the second jaw. The clamping device includes a cord removeably coupled to the table and engageable with the conduit and a winch for biasing the cord with respect to the conduit. | 2009-08-06 |
| 20090194924 | CLAMP WITH CLAMP FORCE SENSOR | 2009-08-06 |
| 20090194925 | CORK CUTTING BOARD AND METHOD OF MAKING - A food cutting board, said cutting board having at least one flat surface composed entirely of a high density cork composite material. | 2009-08-06 |
| 20090194926 | PRINTING SYSTEM AND METHOD - A printing system includes a first sheet media source dispensing a length of sheet media and a second sheet media source dispensing pre-cut sheets of media. A merging unit is operative to receive the length of sheet media and position pre-cut sheets of media along the same. A marking unit receives and marks images on the length of sheet media as well as the pre-cut sheets positioned thereon. A separating unit is adapted to separate the pre-cut sheets from the length of sheet media. A cutting unit is adapted to divide the length of sheet media into marked and unmarked sheets of media. A sheet receiving unit is operative to receive the marked sheets of media and the pre-cut sheets of media. A method of printing on continuous feed and pre-cut sheet media is also included. | 2009-08-06 |
| 20090194927 | SHEET COMPILING SYSTEM AND METHOD - A compiling unit includes a collection tray and a variable-speed compiling system adapted to operate at at least two speeds to thereby receive a sheet of media at a higher speed and register the sheet of media within the collection tray at a lower speed. A control system is adapted to selectively operate the variable-speed compiling system at the at least two speeds. A printing system having a sheet media source, at least one marking engine, such a compiling unit and such a control system is included. A method of compiling sheet media is also included. | 2009-08-06 |
| 20090194928 | Printing Assembly With Adhesive Application Station - A printing assembly comprising a printhead; a feed mechanism for feeding pages past the printhead; an adhesive application station for applying a two-part adhesive onto opposite sides of each page; and a page-binding tray for receiving the printed pages and binding the pages together. | 2009-08-06 |
| 20090194929 | Medium Delivery Apparatus and Medium Processing Apparatus - A medium delivery apparatus, includes: a medium insertion portion; a medium delivery port; first and second medium guide surfaces; a feed roller; a first pressing member; a second pressing member; a rotating member; an urging member, configured to give an urging force acting in a first rotation direction to the rotating member to rotate the second pressing member toward the protruding position; an elastic member, configured to cause the second pressing member and the rotating member to abut against each other; and a stationary abutting portion, against which the rotating member abuts when the first pressing member is placed in the vicinity of the waiting position. | 2009-08-06 |
| 20090194930 | DEVICE FOR SEPARATING INDIVIDUAL FLAT OBJECTS FROM A STACK AND FOR TRANSPORTING AWAY THE SEPARATED OBJECTS - For separating individual flat and bendable objects ( | 2009-08-06 |
| 20090194931 | SHEET FEEDING DEVICES AND IMAGE RECORDING APPARATUS INCLUDING THE SAME - A sheet feeding device having a first sheet feeding path and a second sheet feeding path through which a sheet is configured to be fed. A first sheet-guiding member is disposed between the first sheet feeding path and the second sheet feeding path. The first sheet-guiding member is configured to move between a first position and a second position. A second sheet-guiding member is disposed opposite the first sheet feeding path. The second sheet-guiding member is configured to move between a third position and a fourth position. A connecting member is configured to selectively couple the first sheet-guiding member to the second sheet-guiding member. | 2009-08-06 |
| 20090194932 | MAILPIECE SELECTOR DEVICE HAVING AN ADJUSTABLE GUIDE - A mailpiece selector device comprising at least one guide co-operating with a plurality of opposite selector rollers passing through a deck for receiving a stack of mailpieces, said guide co-operating with said rollers to select said mailpieces one-by-one and to transport them downstream, said guide presenting a predetermined inclination at an angle θ relative to a horizontal plane defined by said deck, with a distance between said deck and a low end portion of said guide that is larger at the portion of said guide that is closer to a referencing wall than at the portion of said guide that is further away from said referencing wall. | 2009-08-06 |
| 20090194933 | Printer With Reversible Air Flow Sheet Picker - A printer for sheets of porous media supplied from a stack of such sheets. The printer has a printhead, a sheet pick-up assembly having a conduit connected to a reversible air supply, the conduit having an outlet directed towards a top sheet of the stack for directing an airstream onto the top sheet such that air penetrates the top sheet and generates an air cushion lifting the top sheet from a second sheet, the reversible air supply configured to suck air into the outlet after the top sheet has lifted from the second sheet to hold the top sheet against the outlet and a sheet feed mechanism for displacing the conduit to draw the top sheet away from the stack. | 2009-08-06 |
| 20090194934 | PAPER FEEDING DEVICE FOR IMAGE FORMING APPARATUS - An embodiment of the present invention relates to an image forming apparatus including: a control panel for designating a size of sheets fed by a paper feeding cassette; a sidewall motor that opens a front sidewall and a rear sidewall to the maximum when the paper feeding cassette is drawn out from an apparatus main body and slides the front sidewall and the rear sidewall to both side positions of the sheets of the designated size when the paper feeding cassette is inserted into the apparatus main body; and an end wall motor that opens an end wall to the maximum when the paper feeding cassette is drawn out from the apparatus main body and slides the end wall to a trailing end position of the sheets of the designated size when the paper feeding cassette is inserted into the apparatus main body. | 2009-08-06 |
| 20090194935 | PAPER FEED CASSETTE DEVICE AND IMAGE RECORDING DEVICE - The invention is directed to a paper feed cassette device to be removably installed to image recording device. The paper feed cassette device includes a paper feed cassette portion and a paper discharge tray portion that receives the recording media. The paper feed cassette portion has a first paper feed cassette portion and a second paper feed cassette portion that selectively contracts and extends by sliding along a particular direction. The paper discharge tray portion has a first paper discharge tray portion disposed above the first paper feed cassette portion and a second paper discharge tray portion that selectively contracts and expands by sliding along the particular direction. The second paper discharge tray portion selectively engages the second paper feed cassette portion, and the second paper feed cassette portion and the second paper discharge tray portion integrally slide with respect to the first paper discharge tray portion. | 2009-08-06 |
| 20090194936 | METHOD AND APPARATUS FOR RELIEVING STRESS IN A PRE-REGISTRATION NIP - A method of using a buckle for relieving the stresses in sheets caused by differential displacements of drive nips during the registration process includes creating a buckle between pre-registration nips and registration nips. The velocities of the pre-registration nips and registration nips are closely controlled so that the magnitude of buckle between them is large enough to relieve the stresses in the sheet during the registration process, yet small enough to not interfere with the registration process. | 2009-08-06 |
| 20090194937 | Paper-stopped linkage mechanism - A paper-stopped linkage mechanism, located at the upper cover of the office machine, includes a paper feeder mechanism, a paper stopper mechanism and a linkage. The paper feeder mechanism is movably located at the upper cover and has at least one paper-feeding roller. The paper stopper mechanism is movably located at the upper cover. The linkage is swingingly pivoted with the upper cover. The linkage has a first linking portion and a second linking portion. The first linking portion and the second linking portion are respectively connected with the paper feeder mechanism and the paper stopper mechanism. The paper feeder mechanism and the paper stopper mechanism are linked by the linkage and move in the opposite directions. Both the paper feeder mechanism and the paper stopper mechanism are located at the upper cover and are linked by the linkage so that the paper stopper mechanism can be driven immediately. | 2009-08-06 |
| 20090194938 | Image forming apparatus - An image forming apparatus | 2009-08-06 |
| 20090194939 | SHEET CONVEYING DEVICE FOR IMAGE FORMING APPARATUS - In an embodiment of the present invention, a plate is laid over sides of a second guide and a first guide that pivots relative to the second guide. The plate pivots with a first pin on the side of the second guide as a fulcrum. A second pin on the side of the first guide is inserted through a slit of the plate. The plate is pivoted by pivoting of the first guide in an opening direction. The second pin is fit in a stop slit provided in the slit to maintain the first guide in an open state. The first guide is pivoted in a closing direction to remove the second pin from the stop slit and close the first guide. | 2009-08-06 |
| 20090194940 | Sheet-Processing Assembly having an Apparatus for Transporting a Pallet, Pallet Conveying System and Sheet-Fed Rotary Printing Press - A sheet-processing assembly includes an apparatus for transporting a pallet bearing a sheet stack and a transfer conveyor having a number of transport rollers disposed transversely to the direction of transport of the pallet and a receiving fixture for a load-bearing element for the pallet, for example a lift truck fork. The receiving fixture is aligned parallel to the transport rollers. A conveying system having a transfer conveyor and a sheet-fed rotary printing press having a conveying system, are also provided. | 2009-08-06 |
| 20090194941 | INFLATABLE PONG TABLE - An inflatable pong table comprises a substantially hollow inflatable member. The inflatable member may be formed with an opposing pair of end recesses and having an intermediate recess interposed between the end recesses. The pong table may further comprise a pair of end inserts that are removably insertable within the end recesses. Each of the end inserts preferably includes a plurality of apertures formed therein. Each of the apertures may be sized and configured to receive the base of a beverage container. An intermediate insert is preferably configured to be removably insertable into the intermediate recess. The intermediate insert is preferably formed with a substantially hard and planar upper surface to facilitate bouncing of a ball thereagainst. | 2009-08-06 |
| 20090194942 | THERMAL TARGET SYSTEM - A thermal signal generating device, including at least two parallel buss bars operable for carrying a current and a heating element having at least a first region and a second region. The heating element includes a plurality of horizontal traces and a plurality of vertical traces. Widths of each of the plurality of horizontal and vertical traces may be greater in a first region of the heating element than in a second region of the heating element, allowing for a gradient heat differential to be emitted by the heating element. | 2009-08-06 |
| 20090194943 | HIT SCORING TARGET OPERABLE BY AN ELECTROMAGNETIC SIGNATURE DETECTOR - A hit scoring target comprising a target panel connected to a hit scoring management unit. The hit scoring management unit comprises an electromagnetic signature sensor operatively associated with the target panel. The electromagnetic signature sensor may be a capacitance sensor, inductance sensor or magnetic field sensor. The hit scoring management unit further comprises a control unit operatively associated with the electromagnetic sensor. The control unit is arranged to count the number of detected changes in the electromagnetic signature of target panel, and invoke a predetermined action upon reaching a predefined number, wherein each change in the electromagnetic signature of the panel target is associated with a projectile passing through target panel. The action invoked may be tilting down the target panel or transmitting information relating to the hit scoring on the target panel. | 2009-08-06 |
| 20090194944 | Time Estimating Game - A game of estimating time can have multiple players competing against each other. The players can be provided with buzzers. The players are challenged to estimate a designated time interval. At the interval of time estimated by the person to be equal to the designated time interval the player actuates his buzzer. The buzzer can be signal-connected to a timer, which functions to display how close the estimated time interval of the player is to the designated time interval. Alternately a secret designated time interval is communicated to the players by the sounding of two buzzer sounds and the players have to estimate the length of the time interval that occurred between the buzzer sounds. | 2009-08-06 |
| 20090194945 | ENERGIZED COMPOSITE METAL TO METAL SEAL - An energized composite metal to metal seal. A sealing device includes a metal seal with a metal sealing surface facing radially outward, and another metal sealing surface facing radially inward; and a nonmetal seal including a nonmetal sealing surface positioned proximate one metal sealing surface and facing radially outward, and another nonmetal sealing surface positioned proximate the other metal sealing surface and facing radially inward. A method of sealing between a housing assembly and a closure member includes applying a pressure differential across the sealing device while the sealing device seals between the housing assembly and the closure member, and the pressure differential increasing contact pressure in a metal to metal seal between the housing assembly and a metal sealing surface on the metal seal, and increasing contact pressure in a metal to metal seal between the closure member and another metal sealing surface on the metal seal. | 2009-08-06 |
| 20090194946 | Sealing for ball-and-socket joints and use thereof - Sealing for ball-and-socket joints, where ball-and-socket joint is defined as the joint between a swivel sphere and a fixed part, and said fixed part is anchored to a structure on which the ball-and-socket joint is mounted. The sealing comprises a frame arranged around the circumference where the swivel sphere is joined to the fixed part, and a brush. The brush is made up of a set of threads or hair of a material that is natural or synthetic, and flexible. And frame and brush are stuck to the fixed part by means of an adhesive of the type that cures with the local application of heat. | 2009-08-06 |
| 20090194947 | Packer cup - A packer cup for sealing the interior of a pipe under pressure includes a first region of relatively soft material and a second region of relatively hard material. The region of the relatively softer material would begin at the lip of the cup and extend for at least one third the length of the cup up to the entire length of the cup. | 2009-08-06 |
| 20090194948 | Locking Joint Seal - A locking joint seal includes a ring-shaped body made from poly tetra fluoroethylene and having a first end and a second end. The first and second ends each include mutually engageable first and second locking features. The first locking feature including a first axially extending portion overlapping a second axially extending portion of the second locking feature in an assembled condition. | 2009-08-06 |
| 20090194949 | Shaft for viscous sealant systems - A sealing system for sealing between an aperture of a machine housing and a rotating machine-shaft protruding through the aperture, said sealing system comprising: (i) a stuffing box for encasing the aperture of the machine housing and a segment of said shaft and, (ii) a viscous fluid type sealant within said stuffing box, wherein the shaft is concentric about its axis of rotation and said segment has at least one variation in its effective external diameter thereby increasing the surface area thereof, in contact with the liquid sealant. | 2009-08-06 |
| 20090194950 | Pressure Balanced Shaft Seal Assembly - A pressure balanced shaft seal assembly that allows a seal to dynamically respond to angular or radial misalignment of a shaft is disclosed. The pressure balanced shaft seal assembly includes a fixed stator, a floating stator, and a labyrinth seal. In one embodiment, the floating stator and labyrinth seal are mounted within an annular groove formed in the fixed stator such that the floating stator and labyrinth seal may move a predetermined amount in the radial direction with respect to the fixed stator. A spherical interface between the labyrinth seal and floating stator may allow the labyrinth seal to pivot with respect to the floating stator during angular misalignment of a shaft around which the pressure balanced shaft seal assembly is mounted. A pressure balancing annular channel formed in the floating stator allows pressurized seal fluid to balance the axial pressure exerted on the floating stator by the process fluid. | 2009-08-06 |
| 20090194951 | Cooling system for injection sealant stuffing box - A conduit for a cooling liquid, said conduit for substantially contacting a viscous fluid type sealant within a stuffing box, thereby conducting heat away from said sealant within said stuffing box by flowing said cooling liquid though said conduit. | 2009-08-06 |
| 20090194952 | Multi-Directional Shaft Seal - A dynamic seal provides for the return of captured lubricant to the lubricant side regardless of the direction of rotation between the seal and the shaft. The seal uses bi-directional pumping elements to facilitate the hydrodynamic pumping of the captured lubricant in response to relative rotation. The seal includes a valve portion that can change a pumping rate of particular pumping elements such that more lubricant is pumped toward the lubricant side than the non-lubricant side. | 2009-08-06 |
| 20090194953 | RESIN BOOTS FOR CONSTANT VELOCITY UNIVERSAL JOINT - A resin boot for constant velocity universal joint, includes: a resin bellows including an approximately conical bellows-shaped portion with its inner hollow part, a small diameter end portion communicated with an inner space of the bellows-shaped portion and arranged at one end, and a large diameter side end portion communicated with the inner space of the bellows-shaped portion and arranged at the other end; a large thickness portion formed in an inner surface of a large diameter side end portion of the resin bellows in accordance with an injection molding, protruded in the vertical direction to the center of the large diameter side end portion and arranged in the circumferential direction at regular intervals; and a small thickness portion arranged between the large thickness portions and formed thinner in the diametrical direction compared with large thickness portion. | 2009-08-06 |
| 20090194954 | TRANSMISSION EXTENSION ADAPTER FOR POWER HAND TOOL - A transmission extension adapter for connection between a work head and the chuck of a power hand tool includes a cylindrical cap shell coupled to the power hand tool around the chuck and having radial through holes and a positioning member in each radial through hole. An axle sleeve is rotatably coupled to the cylindrical cap shell and has locating holes on the periphery thereof. A transmission axle is inserted through the axle sleeve and has a rear end connected to the chuck and a front end connected with a supplementary chuck for holding the work head. A front cap assembly is affixed to the front end of the axle sleeve to hold an automatic feeder for allowing rotation of the automatic feeder with the axle sleeve. A multi-angle positioning device is adapted for holding down the positioning members in the locating holes to lock the axle sleeve. | 2009-08-06 |
| 20090194955 | VEHICLE WITH TWO PARALLEL WHEELS - A vehicle with two parallel wheels according to the invention has split steps ( | 2009-08-06 |
| 20090194956 | Binding mechanism for board-type gliding devices - The invention relates to a binding mechanism ( | 2009-08-06 |
| 20090194957 | Multifuctional transport frame for the convertible assembly of various child transport devices or vehicles - Conventionally, prams and the classic first child vehicles were independent devices. The disclosed frame permits the production and operation of the series of vehicles used by children of the western world: pram, pushchair, walking learning aid, three-wheeler, go-kart and additional corresponding trailer or hand carts as a modular system. Essential components of said transport frame are of multiple or universal application. | 2009-08-06 |
| 20090194958 | Cart For Folding Chairs - A cart for folding chairs includes a frame having a base and a plurality of frame pieces. The base includes at least two racks having a plurality of notches. The notches on the racks are corresponding to each other. Legs of the folding chairs are received in the notches, thereby holding the folding chairs vertical and closely adjacent to and parallel to each other. The base may further include at least two grooves to receive the racks. Moreover, for the convenience of loading and unloading the folding chairs, at least one of the frame pieces in a lengthwise direction is configured as a removable piece. The opposing frame pieces in a widthwise direction include pads to prevent the folding chairs from bumping into the frame pieces. | 2009-08-06 |
| 20090194959 | MOBILE PLATFORM METHODS AND SYSTEM - A base for supporting the weight of a user, tools and a ladder is described. The base can be formed of a plurality of rigid plates, each plate having a top and a bottom side. The plates can be hingedly connected to fold together along a longitudinal axis with the bottom sides of the respective plates being positioned adjacent to each other. The base can include a plurality of wheels positioned around the bottom side and the periphery of each plate. The wheels can be positioned to oppose one another and the opposed wheels being positioned off center from each other when the plates are folded such that the wheels do not interfere with each other, the base when folded is adapted to be stored with the longitudinal axis in a substantially vertical direction. | 2009-08-06 |
