31st week of 2021 patent applcation highlights part 65 |
Patent application number | Title | Published |
20210242023 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM AND SUBSTRATE PROCESSING APPARATUS | 2021-08-05 |
20210242024 | MASK LAYOUT, SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD USING THE SAME | 2021-08-05 |
20210242025 | SILICIDATION OF SOURCE/DRAIN REGION OF VERTICAL FIELD EFFECT TRANSISTOR (VFET) STRUCTURE | 2021-08-05 |
20210242026 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, RECORDING MEDIUM, AND SUBSTRATE PROCESSING APPARATUS | 2021-08-05 |
20210242027 | SUBSTRATE PROCESSING METHOD, MODIFICATION DEVICE AND SUBSTRATE PROCESSING SYSTEM | 2021-08-05 |
20210242028 | METHOD FOR MANUFACTURING PILLAR-SHAPED SEMICONDUCTOR DEVICE | 2021-08-05 |
20210242029 | PATTERNING PLATINUM BY ALLOYING AND ETCHING PLATINUM ALLOY | 2021-08-05 |
20210242030 | PLASMA PROCESSING METHOD AND ETCHING APPARATUS | 2021-08-05 |
20210242031 | METHOD FOR USING ULTRA-THIN ETCH STOP LAYERS IN SELECTIVE ATOMIC LAYER ETCHING | 2021-08-05 |
20210242032 | METAL-CONTAINING PASSIVATION FOR HIGH ASPECT RATIO ETCH | 2021-08-05 |
20210242033 | GATE ELECTRODE AND METHOD FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING ARRAY SUBSTRATE | 2021-08-05 |
20210242034 | SINTERING METHOD USING A SACRIFICIAL LAYER ON THE BACKSIDE METALLIZATION OF A SEMICONDUCTOR DIE | 2021-08-05 |
20210242035 | METHODS FOR PROCESSING SEMICONDUCTOR WAFERS HAVING A POLYCRYSTALLINE FINISH | 2021-08-05 |
20210242036 | METHOD FOR ETCHING OXIDE SEMICONDUCTOR FILM AND PLASMA PROCESSING APPARATUS | 2021-08-05 |
20210242037 | METHOD FOR FABRICATING SEMICONDUCTOR INTERCONNECT STRUCTURE AND SEMICONDUCTOR STRUCTURE THEREOF | 2021-08-05 |
20210242038 | UNIVERSAL SEMICONDUCTOR PACKAGE MOLDS | 2021-08-05 |
20210242039 | SUBSTRATE PROCESSING SYSTEM AND METHOD TO REDUCE A NUMBER OF EXTERNAL CONNECTORS PROVIDED ON THE SYSTEM | 2021-08-05 |
20210242040 | DRYING MODULE, SUBSTRATE PROCESSING MODULE AND METHOD OF DRYING SUBSTRATE HOLDER | 2021-08-05 |
20210242041 | FIRST CLEANING APPARATUS, CLEANING EQUIPMENT INCLUDING THE SAME, AND CLEANING METHOD | 2021-08-05 |
20210242042 | PROCESSING APPARATUS | 2021-08-05 |
20210242043 | FULLY AUTOMATED WAFER DEBONDING SYSTEM AND METHOD THEREOF | 2021-08-05 |
20210242044 | SUBSTRATE BONDING DEVICE, CALCULATION DEVICE, SUBSTRATE BONDING METHOD, AND CALCULATION METHOD | 2021-08-05 |
20210242045 | FRAME FEEDER | 2021-08-05 |
20210242046 | CERAMIC HEATER | 2021-08-05 |
20210242047 | CERAMIC HEATER AND MANUFACTURING METHOD FOR SAME | 2021-08-05 |
20210242048 | CERAMIC HEATER | 2021-08-05 |
20210242049 | DETACHABLE THERMAL LEVELER | 2021-08-05 |
20210242050 | SEMICONDUCTOR DEVICE HAVING HYBRID BONDING INTERFACE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE ASSEMBLY | 2021-08-05 |
20210242051 | MOUNTING APPARATUS AND FILM SUPPLY APPARATUS | 2021-08-05 |
20210242052 | TRANSFER SYSTEM, TRANSFER METHOD, AND TRANSFER APPARATUS | 2021-08-05 |
20210242053 | CERAMIC HEATER | 2021-08-05 |
20210242054 | WAFER TEMPERATURE MEASUREMENT IN AN ION IMPLANTATION SYSTEM | 2021-08-05 |
20210242055 | CUTTING BLADE POSITION DETECTING METHOD | 2021-08-05 |
20210242056 | MASS TRANSFER METHOD AND MASS TRANSFER DEVICE THEREOF FOR MICRO LED DEVICE | 2021-08-05 |
20210242057 | AUTOMATED MATERIAL HANDLING SYSTEMS | 2021-08-05 |
20210242058 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING SYSTEM | 2021-08-05 |
20210242059 | System and Method for Semiconductor Device Print Check Alignment | 2021-08-05 |
20210242060 | OVERLAY METROLOGY ON BONDED WAFERS | 2021-08-05 |
20210242061 | PROCESSING APPARATUS | 2021-08-05 |
20210242062 | ELECTROSTATIC CHUCK HEATER AND MANUFACTURING METHOD THEREFOR | 2021-08-05 |
20210242063 | HELICAL PLUG FOR REDUCTION OR PREVENTION OF ARCING IN A SUBSTRATE SUPPORT | 2021-08-05 |
20210242064 | ELECTROSTATIC CHUCK HEATER | 2021-08-05 |
20210242065 | ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE | 2021-08-05 |
20210242066 | ELECTROSTATIC CHUCK AND SUBSTRATE FIXING DEVICE | 2021-08-05 |
20210242067 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2021-08-05 |
20210242068 | 3D SEMICONDUCTOR DEVICE AND STRUCTURE | 2021-08-05 |
20210242069 | WAFER CHUCK | 2021-08-05 |
20210242070 | DEPOSITION APPARATUS | 2021-08-05 |
20210242071 | MANUFACTURING PROCESS OF A STRUCTURED SUBSTRATE | 2021-08-05 |
20210242072 | THREE DIMENSIONAL MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | 2021-08-05 |
20210242073 | PLANARIZATION APPARATUS, PLANARIZATION PROCESS, AND METHOD OF MANUFACTURING AN ARTICLE | 2021-08-05 |
20210242074 | SELECTIVE DEPOSITION OF CONDUCTIVE CAP FOR FULLY-ALIGNED-VIA (FAV) | 2021-08-05 |
20210242075 | RADIO FREQUENCY SILICON ON INSULATOR STRUCTURE WITH SUPERIOR PERFORMANCE, STABILITY, AND MANUFACTURABILITY | 2021-08-05 |
20210242076 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE | 2021-08-05 |
20210242077 | PLANARIZATION STOP REGION FOR USE WITH LOW PATTERN DENSITY INTERCONNECTS | 2021-08-05 |
20210242078 | SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME | 2021-08-05 |
20210242079 | SEMICONDUCTOR DEVICE | 2021-08-05 |
20210242080 | Protection Structures for Bonded Wafers | 2021-08-05 |
20210242081 | Selective Hybrid Capping Layer for Metal Gates of Transistors | 2021-08-05 |
20210242082 | INTERCONNECT STRUCTURES WITH COBALT-INFUSED RUTHENIUM LINER AND A COBALT CAP | 2021-08-05 |
20210242083 | Processes for Reducing Leakage and Improving Adhesion | 2021-08-05 |
20210242084 | SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD | 2021-08-05 |
20210242085 | AUTOMATED TRANSFER AND DRYING TOOL FOR PROCESS CHAMBER | 2021-08-05 |
20210242086 | METHOD OF REMOVING SEMICONDUCTING LAYERS FROM A SEMICONDUCTING SUBSTRATE | 2021-08-05 |
20210242087 | METHOD FOR FABRICATING A DEVICE COMPRISING A PNP BIPOLAR TRANSISTOR AND NPN BIPOLAR TRANSISTOR FOR RADIOFREQUENCY APPLICATIONS | 2021-08-05 |
20210242088 | Methods for Forming Fin Field-Effect Transistors | 2021-08-05 |
20210242089 | LOCALIZED ETCH STOP LAYER | 2021-08-05 |
20210242090 | Etch Stop Layer Between Substrate and Isolation Structure | 2021-08-05 |
20210242091 | VERTICAL FIELD-EFFECT TRANSISTOR DEVICES AND METHODS OF FORMING THE SAME | 2021-08-05 |
20210242092 | Novel Structures for Tuning Threshold Voltage | 2021-08-05 |
20210242093 | Transistor Gates and Methods of Forming Thereof | 2021-08-05 |
20210242094 | VERTICAL TRANSISTOR DEVICE COMPRISING A TWO-DIMENSIONAL (2D) MATERIAL POSITIONED IN A CHANNEL REGION OF THE DEVICE AND METHODS OF MAKING SUCH VERTICAL TRANSISTOR DEVICES | 2021-08-05 |
20210242095 | SEMICONDUCTOR MANUFACTURING EQUIPMENT AND SEMICONDUCTOR MANUFACTURING METHOD | 2021-08-05 |
20210242096 | MOUNTING SUBSTRATE AND ELECTRONIC APPARATUS | 2021-08-05 |
20210242097 | Method of Packaging an Integrated Circuit | 2021-08-05 |
20210242098 | VARIABLE THICKNESS LID ADHESIVE | 2021-08-05 |
20210242099 | ELECTRONIC DEVICE MOUNTING BOARD, ELECTRONIC PACKAGE, AND ELECTRONIC MODULE | 2021-08-05 |
20210242100 | SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF | 2021-08-05 |
20210242101 | SEMICONDUCTOR PACKAGES HAVING A DAM STRUCTURE | 2021-08-05 |
20210242102 | UNDERFILL MATERIAL FOR INTEGRATED CIRCUIT (IC) PACKAGE | 2021-08-05 |
20210242103 | SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD | 2021-08-05 |
20210242104 | IC PACKAGE INCLUDING MULTI-CHIP UNIT WITH BONDED INTEGRATED HEAT SPREADER | 2021-08-05 |
20210242105 | PRINTED HEAT SPREADER STRUCTURES AND METHODS OF PROVIDING SAME | 2021-08-05 |
20210242106 | SATELLITE COMMUNICATION TRANSMITTER WITH IMPROVED THERMAL MANAGEMENT | 2021-08-05 |
20210242107 | SUBSTRATE WITH THERMAL INSULATION | 2021-08-05 |
20210242108 | TECHNOLOGIES FOR LIQUID COOLING SYSTEMS | 2021-08-05 |
20210242109 | Integrated Circuit and Manufacturing and Method Thereof | 2021-08-05 |
20210242110 | SEMICONDUCTOR STRUCTURE WITH AN AIR GAP | 2021-08-05 |
20210242111 | POWER SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A POWER SEMICONDUCTOR DEVICE | 2021-08-05 |
20210242112 | SEMICONDUCTOR DEVICE WITH FRAME HAVING ARMS AND RELATED METHODS | 2021-08-05 |
20210242113 | LAND STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD THEREFOR | 2021-08-05 |
20210242114 | Semiconductor Device Including an Extension Element for Air Cooling | 2021-08-05 |
20210242115 | ELECTRONICS UNIT WITH INTEGRATED METALLIC PATTERN | 2021-08-05 |
20210242116 | INTEGRATED CIRCUIT AND ELECTRONIC DEVICE COMPRISING A PLURALITY OF INTEGRATED CIRCUITS ELECTRICALLY COUPLED THROUGH A SYNCHRONIZATION SIGNAL ROUTED THROUGH THE INTEGRATED CIRCUIT | 2021-08-05 |
20210242117 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2021-08-05 |
20210242118 | WIRING BOARD AND ELECTRONIC DEVICE MODULE | 2021-08-05 |
20210242119 | SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2021-08-05 |
20210242120 | Circuit module consisting of a plurality of components interconnected in an electrically conductive manner, and a method for producing a circuit module of this kind | 2021-08-05 |
20210242121 | PACKAGE SUBSTRATE HAVING POWER TRACE PATTERN AND GROUND TRACE PATTERN, AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | 2021-08-05 |
20210242122 | CHIP PACKAGE WITH REDISTRIBUTION STRUCTURE | 2021-08-05 |