| 31st week of 2016 patent applcation highlights part 59 |
| Patent application number | Title | Published |
|---|
| 20160225598 | PULSED ION GUIDES FOR MASS SPECTROMETERS AND RELATED METHODS | 2016-08-04 |
| 20160225599 | ION OPTICS COMPONENTS AND METHOD OF MAKING THE SAME | 2016-08-04 |
| 20160225600 | ION SOURCE, AND MASS ANALYSIS APPARATUS INCLUDING SAME | 2016-08-04 |
| 20160225601 | Miniature Ion Source of Fixed Geometry | 2016-08-04 |
| 20160225602 | TIME-OF-FLIGHT MASS SPECTROMETRY USING MULTI-CHANNEL DETECTORS | 2016-08-04 |
| 20160225603 | ION EJECTION FROM A QUADRUPOLE ION TRAP | 2016-08-04 |
| 20160225604 | EXCIMER DISCHARGE LAMP | 2016-08-04 |
| 20160225605 | VIBRATION RESISTANT AUTOMOTIVE FRONT LIGHTING LAMP | 2016-08-04 |
| 20160225606 | METHOD OF CLEANING AND MICRO-ETCHING SEMICONDUCTOR WAFERS | 2016-08-04 |
| 20160225607 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS, AND RECORDING MEDIUM | 2016-08-04 |
| 20160225608 | PREPARING A SEMICONDUCTOR SURFACE FOR EPITAXIAL DEPOSITION | 2016-08-04 |
| 20160225609 | Semiconductor Heterostructures Having Reduced Dislocation Pile-Ups and Related Methods | 2016-08-04 |
| 20160225610 | System And Method For Photomask Particle Detection | 2016-08-04 |
| 20160225611 | COMPOUND FOR ENHANCING GENERATION OF CHEMICAL SPECIES | 2016-08-04 |
| 20160225612 | Bonding Pad Surface Damage Reduction in a Formation of Digital Pattern Generator | 2016-08-04 |
| 20160225613 | SUBSTRATE TREATMENT DEVICE, PEELING METHOD FOR LAMINATED SUBSTRATE, AND METHOD FOR REMOVING ADHESIVE | 2016-08-04 |
| 20160225614 | STEP COVERAGE DIELECTRIC | 2016-08-04 |
| 20160225615 | PRECURSORS FOR SILICON DIOXIDE GAP FILL | 2016-08-04 |
| 20160225616 | METHOD AND PRECURSORS FOR MANUFACTURING 3D DEVICES | 2016-08-04 |
| 20160225617 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SUBSTRATE PROCESSING APPARATUS AND RECORDING MEDIUM | 2016-08-04 |
| 20160225618 | REDUCING SUBSTRATE BOWING CAUSED BY HIGH PERCENTAGE SIGE LAYERS | 2016-08-04 |
| 20160225619 | METHOD AND APPARATUS FOR DEPOSITION OF A III-V SEMICONDUCTOR LAYER | 2016-08-04 |
| 20160225620 | OXIDE AND MANUFACTURING METHOD THEREOF | 2016-08-04 |
| 20160225621 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | 2016-08-04 |
| 20160225622 | SYSTEM AND METHOD FOR SUBSTRATE WAFER BACK SIDE AND EDGE CROSS SECTION SEALS | 2016-08-04 |
| 20160225623 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2016-08-04 |
| 20160225624 | METHOD OF MANUFACTURING SILICON CARBIDE SEMICONDUCTOR DEVICE | 2016-08-04 |
| 20160225625 | APPARATUS AND METHOD FOR BONDING SUBSTRATES | 2016-08-04 |
| 20160225626 | METHOD FOR PRODUCING A SEMICONDUCTOR | 2016-08-04 |
| 20160225627 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES | 2016-08-04 |
| 20160225628 | NITRIDATION ON HDP OXIDE BEFORE HIGH-K DEPOSITION TO PREVENT OXYGEN INGRESS | 2016-08-04 |
| 20160225629 | NITRIDATION ON HDP OXIDE BEFORE HIGH-K DEPOSITION TO PREVENT OXYGEN INGRESS | 2016-08-04 |
| 20160225630 | STRUCTURE AND FORMATION METHOD OF SEMICONDUCTOR DEVICE WITH METAL GATE STACK | 2016-08-04 |
| 20160225631 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME | 2016-08-04 |
| 20160225632 | METAL DOPING OF AMORPHOUS CARBON AND SILICON FILMS USED AS HARDMASKS IN SUBSTRATE PROCESSING SYSTEMS | 2016-08-04 |
| 20160225633 | SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME | 2016-08-04 |
| 20160225634 | METHOD FOR QUADRUPLE FREQUENCY FINFETS WITH SINGLE-FIN REMOVAL | 2016-08-04 |
| 20160225635 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2016-08-04 |
| 20160225636 | METHODS OF FORMING HARDMASK MATERIAL FILM | 2016-08-04 |
| 20160225637 | ETCHING METHOD AND STORAGE MEDIUM | 2016-08-04 |
| 20160225638 | GRASS REMOVAL IN PATTERNED CAVITY ETCHING | 2016-08-04 |
| 20160225639 | METHOD OF PROCESSING TARGET OBJECT | 2016-08-04 |
| 20160225640 | METHOD FOR INCREASING PATTERN DENSITY IN SELF-ALIGNED PATTERNING INTEGRATION SCHEMES | 2016-08-04 |
| 20160225641 | DEFECT REDUCTION IN III-V SEMICONDUCTOR EPITAXY THROUGH CAPPED HIGH TEMPERATURE ANNEALING | 2016-08-04 |
| 20160225642 | ELECTRONIC PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF | 2016-08-04 |
| 20160225643 | METHOD AND NOZZLE FOR HERMETICALLY SEALED PACKAGED DEVICES | 2016-08-04 |
| 20160225644 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | 2016-08-04 |
| 20160225645 | TEMPERATURE CONTROL MECHANISM, TEMPERATURE CONTROL METHOD AND SUBSTRATE PROCESSING APPARATUS | 2016-08-04 |
| 20160225646 | TRANSFER CHAMBERS WITH AN INCREASED NUMBER OF SIDES, SEMICONDUCTOR DEVICE MANUFACTURING PROCESSING TOOLS, AND PROCESSING METHODS | 2016-08-04 |
| 20160225647 | SUBSTRATE STORAGE CONTAINER | 2016-08-04 |
| 20160225648 | PURGING DEVICE AND PURGING METHOD | 2016-08-04 |
| 20160225649 | LOAD PORT AND METHOD FOR LOADING AND UNLOADING CASSETTE | 2016-08-04 |
| 20160225650 | SUBSTRATE HOLDING DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | 2016-08-04 |
| 20160225651 | HIGH TEMPERATURE CHUCK FOR PLASMA PROCESSING SYSTEMS | 2016-08-04 |
| 20160225652 | LOW TEMPERATURE CHUCK FOR PLASMA PROCESSING SYSTEMS | 2016-08-04 |
| 20160225653 | METHOD OF PROVIDING A FLEXIBLE SEMICONDUCTOR DEVICE AND FLEXIBLE SEMICONDUCTOR DEVICE THEREOF | 2016-08-04 |
| 20160225654 | CARRIER TAPE AND PACK | 2016-08-04 |
| 20160225655 | SUCTION STAGE, LAMINATION DEVICE, AND METHOD FOR MANUFACTURING LAMINATED SUBSTRATE | 2016-08-04 |
| 20160225656 | WAFER PROCESSING SYSTEM WITH CHUCK ASSEMBLY MAINTENANCE MODULE | 2016-08-04 |
| 20160225657 | LOCALIZED REGION OF ISOLATED SILICON OVER DIELECTRIC MESA | 2016-08-04 |
| 20160225658 | SEMICONDUCTOR DEVICES INCLUDING SUPPORTING PATTERNS IN GAP REGIONS BETWEEN CONDUCTIVE PATTERNS AND METHODS OF FABRICATING THE SAME | 2016-08-04 |
| 20160225659 | METHODS OF FORMING FIN ISOLATION REGIONS ON FINFET SEMICONDUCTOR DEVICES BY IMPLANTATION OF AN OXIDATION-RETARDING MATERIAL | 2016-08-04 |
| 20160225660 | FORMATION OF ISOLATION SURROUNDING WELL IMPLANTATION | 2016-08-04 |
| 20160225661 | METAL WIRING OF SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-08-04 |
| 20160225662 | METHOD FOR FABRICATING SEMICONDUCTOR DEVICE | 2016-08-04 |
| 20160225663 | SEMICONDUCTOR DEVICE HAVING STABLE STRUCTURE AND METHOD OF MANUFACTURING THE SAME | 2016-08-04 |
| 20160225664 | Semiconductor Device and Fabricating Process for the Same | 2016-08-04 |
| 20160225665 | INTERCONNECT WIRES INCLUDING RELATIVELY LOW RESISTIVITY CORES | 2016-08-04 |
| 20160225666 | FORMING MERGED LINES IN A METALLIZATION LAYER BY REPLACING SACRIFICIAL LINES WITH CONDUCTIVE LINES | 2016-08-04 |
| 20160225667 | SEMICONDUCTOR STRUCTURE HAVING SOURCE/DRAIN GOUGING IMMUNITY | 2016-08-04 |
| 20160225668 | TSV Formation Processes Using TSV-Last Approach | 2016-08-04 |
| 20160225669 | SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME | 2016-08-04 |
| 20160225670 | PEELING APPARATUS, PEELING SYSTEM, AND PEELING METHOD | 2016-08-04 |
| 20160225671 | Non-Planar I/O and Logic Semiconductor Devices having Different Workfunction on Common Substrate | 2016-08-04 |
| 20160225672 | IMPLANT PROFILING WITH RESIST | 2016-08-04 |
| 20160225673 | HIGH MOBILITY TRANSISTORS | 2016-08-04 |
| 20160225674 | METHODS OF FORMING NMOS AND PMOS FINFET DEVICES AND THE RESULTING PRODUCT | 2016-08-04 |
| 20160225675 | METHOD OF MULTI-WF FOR MULTI-VT AND THIN SIDEWALL DEPOSITION BY IMPLANTATION FOR GATE-LAST PLANAR CMOS AND FINFET TECHNOLOGY | 2016-08-04 |
| 20160225676 | METHODS OF FORMING FIN ISOLATION REGIONS UNDER TENSILE-STRAINED FINS ON FINFET SEMICONDUCTOR DEVICES | 2016-08-04 |
| 20160225677 | METHODS OF FORMING FIN ISOLATION REGIONS ON FINFET SEMICONDUCTOR DEVICES USING AN OXIDATION-BLOCKING LAYER OF MATERIAL AND BY PERFORMING A FIN-TRIMMING PROCESS | 2016-08-04 |
| 20160225678 | EMBEDDED SIGE EPITAXY TEST PAD | 2016-08-04 |
| 20160225679 | DFT STRUCTURE FOR TSVS IN 3D ICS WHILE MAINTAINING FUNCTIONAL PURPOSE | 2016-08-04 |
| 20160225680 | EXTRACTION OF RESISTANCE ASSOCIATED WITH LATERALLY DIFFUSED DOPANT PROFILES IN CMOS DEVICES | 2016-08-04 |
| 20160225681 | PLASMA PROCESSING APPARATUS, PLASMA PROCESSING METHOD AND PLASMA PROCESSING ANALYSIS METHOD | 2016-08-04 |
| 20160225682 | SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND STORAGE MEDIUM | 2016-08-04 |
| 20160225683 | SUBSTRATE LIQUID PROCESSING APPARATUS, SUBSTRATE LIQUID PROCESSING METHOD, AND COMPUTER-READABLE STORAGE MEDIUM | 2016-08-04 |
| 20160225684 | Semiconductor Package Structure and Manufacturing Method Thereof | 2016-08-04 |
| 20160225685 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2016-08-04 |
| 20160225686 | Repackaged integrated circuit and assembly method | 2016-08-04 |
| 20160225687 | PACKAGED ELECTRONIC DEVICE HAVING REDUCED PARASITIC EFFECTS AND METHOD | 2016-08-04 |
| 20160225688 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2016-08-04 |
| 20160225689 | Apparatus and Semiconductor Structure including a Multilayer Package Substrate | 2016-08-04 |
| 20160225690 | SEMICONDUCTOR DEVICE | 2016-08-04 |
| 20160225691 | SWAGED HEAT SINK AND HEAT SINK INTEGRATED POWER MODULE | 2016-08-04 |
| 20160225692 | SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF | 2016-08-04 |
| 20160225693 | DIRECT BONDED COPPER SEMICONDUCTOR PACKAGES AND RELATED METHODS | 2016-08-04 |
| 20160225694 | HIGH CONDUCTIVITY HIGH FREQUENCY VIA FOR ELECTRONIC SYSTEMS | 2016-08-04 |
| 20160225695 | UNIFORM BACK SIDE EXPOSURE OF THROUGH-SILICON VIAS | 2016-08-04 |
| 20160225696 | SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME | 2016-08-04 |
| 20160225697 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-08-04 |
