| 31st week of 2013 patent applcation highlights part 17 |
| Patent application number | Title | Published |
|---|
| 20130193556 | SEMICONDUCTOR DEVICE - A semiconductor device includes a semiconductor substrate having a capacitor region and a resistor region. A capacitor dielectric material and a capacitor electrode are sequentially stacked on an active region in the capacitor region of the semiconductor substrate. A resistor is provided on the resistor region of the semiconductor substrate. A protection pattern is provided on a top surface of the capacitor electrode. The protection pattern is spaced apart from the capacitor electrode. The protection pattern and the resistor include the same material and have the same thickness in a direction vertical to a surface of the semiconductor substrate. | 2013-08-01 |
| 20130193557 | Electronic Device and Method for Increasing Reliability of Bipolar Transistors Under High Voltage Conditions - The invention relates to an electronic device with a bipolar transistor having an emitter, a base and a collector. The base has a first region of a first concentration of the first dopant for forming an electrically active region of the base and a second region of a second concentration of the first dopant close to the surface of the base region. The first region is separated from the second region by a region of a third concentration of the first dopant and the third concentration is lower than the first and the second concentration. | 2013-08-01 |
| 20130193558 | METHOD FOR MANUFACTURING A GROUP III NITRIDE SUBSTRATE USING A CHEMICAL LIFT-OFF PROCESS - The non-polar or semi-polar group III nitride layer disclosed in a specific example of the present invention can be used for substrates for various electronic devices, wherein problems of conventional polar group III nitride substrates are mitigated or solved by using the nitride substrate of the invention, and further the nitride substrate can be manufactured by a chemical lift-off process. | 2013-08-01 |
| 20130193559 | CAST SILICON ingot prepared BY DIRECTIONAL SOLIDIFICATION - A cast silicon crystalline ingot comprises two major generally parallel surfaces, one of which is the front surface and the other of which is the back surface; a perimeter surface connecting the front surface and the back surface; and a bulk region between the front surface and the back surface; wherein the cast silicon crystalline ingot has no transverse dimension less than about five centimeters; the cast silicon crystalline ingot has a dislocation density of less than 1000 dislocations/cm | 2013-08-01 |
| 20130193560 | SEMICONDUCTOR SUBSTRATE HAVING DOT MARKS AND METHOD OF MANUFACTURING THE SAME - A semiconductor substrate having dot marks is provided. Particularly, a semiconductor substrate having dot marks having an improved reading rate is provided. In a semiconductor substrate having a plurality of dot marks formed of recess portions having an inverted frustum shape, the plurality of dot marks constitutes a two-dimensional code disposed in a rectangular region of 0.25 mm | 2013-08-01 |
| 20130193561 | Processes and structures for IC fabrication - The present invention discloses methods and apparatuses for the separations of IC fabrication and assembling of separated IC components to form complete IC structures. In an embodiment, the present fabrication separation of an IC structure into multiple discrete components can take advantages of dedicated IC fabrication facilities and achieve more cost effective products. In another embodiment, the present chip assembling provides high density interconnect wires between bond pads, enabling cost-effective assembling of small chip components. In an aspect, the present process provides multiple interconnect wires in the form of a ribbon between the bond pads, and then subsequently separates the ribbon into multiple individual interconnect wires. | 2013-08-01 |
| 20130193562 | STRUCTURE AND METHOD FOR TOPOGRAPHY FREE SOI INTEGRATION - A semiconductor structure is provided that includes a semiconductor oxide layer having features. The semiconductor oxide layer having the features is located between an active semiconductor layer and a handle substrate. The semiconductor structure includes a planarized top surface of the active semiconductor layer such that the semiconductor oxide layer is beneath the planarized top surface. The features within the semiconductor oxide layer are mated with a surface of the active semiconductor layer. | 2013-08-01 |
| 20130193563 | TRENCH CAPACITOR WITH SPACER-LESS FABRICATION PROCESS - A trench capacitor and method of fabrication are disclosed. The SOI region is doped such that a selective isotropic etch used for trench widening does not cause appreciable pullback of the SOI region, and no spacers are needed in the upper portion of the trench. | 2013-08-01 |
| 20130193564 | SEMICONDUCTOR STRUCTURE AND METHOD AND TOOL FOR FORMING THE SEMICONDUCTOR STRUCTURE - A method of forming a semiconductor structure includes forming a photoresist layer over a substrate. The photoresist layer includes a first material removable by a removal process. The first material at a guard band portion of the photoresist layer along an edge portion of the photoresist layer is converted to a second material. The second material is not removable by the removal process. Also, the first material at the edge portion of the photoresist layer is not converted to the second material. The guard band portion is farther from a periphery of the substrate than the edge portion. The removal process is performed to remove the first material after the conversion of the guard band portion. | 2013-08-01 |
| 20130193565 | SEMICONDUCTOR MASK BLANKS WITH A COMPATIBLE STOP LAYER - Provided is a method for creating a mask blank that include a stop layer. The stop layer is optically compatible and process compatible with other layers included as part of the mask blanks. Such blanks may include EUV, phase-shifting, or OMOG masks. The stop layer includes molybdenum, silicon, and nitride in a proportion that allows for compatibility and aids in detection by a residual gas analyzer. Provided is also a method for the patterning of mask blanks with a stop layer, particularly the method for removing semi-transparent residue defects that may occur due to problems in prior mask creation steps. The method involves the detect of included materials with a residual gas analyzer. Provided is also a mask blank structure which incorporates the compatible stop layer. | 2013-08-01 |
| 20130193566 | Integrated Circuit Shielding Film and Manufacturing Method Thereof - An integrated circuit shielding film and a manufacturing method thereof. The manufacturing method provides a plate. A stripping glue is coated on the plate. An integrated circuit is disposed on the stripping glue and the stripping glue is deposited on the surface of the integrated circuit. A shielding film is then formed on the integrated circuit by coating operations. | 2013-08-01 |
| 20130193567 | LEAD FRAME AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing a lead frame, includes forming a rectangular first dimple includes, first inclined side surfaces inclined to a depth direction, and arranged in two opposing sides in one direction, and standing side surfaces standing upright to a depth direction, and arranged in two opposing sides in other direction, on a backside of a die pad by a first stamping, and forming a second dimple having second inclined side surfaces inclined on the backside of the die pad by a second stamping, such that a second inclined side surfaces of the second dimple are arranged in side areas of the standing side surfaces of the first dimple, wherein the standing side surfaces are transformed into reversed inclined side surfaces inclined to a reversed direction to the first inclined side surfaces, and a front side of the die pad is semiconductor element mounting surface. | 2013-08-01 |
| 20130193568 | Terminal Box - A plurality of terminal plates are arranged in a row in the interior of a box body. Neighboring terminal plates are electrically connected by a diode. The diode is provided with a first terminal part that is laid on, soldered to, and electrically connected to the first terminal plate. A slit is provided formed along the outer perimeter of a region on which the first terminal part is laid on the first terminal plate. | 2013-08-01 |
| 20130193569 | Integrated Circuit Die And Method Of Fabricating - Integrated circuit dies and methods of fabricating the dies are disclosed. An embodiment of a method includes providing a die having a redistribution layer fabricated thereon. The redistribution layer has a surface located thereon that is free of any seed layers. An under bump metal layer is fabricated directly to the surface. | 2013-08-01 |
| 20130193570 | BUMPING PROCESS AND STRUCTURE THEREOF - A bumping process includes providing a silicon substrate; forming a titanium-containing metal layer on silicon substrate, the titanium-containing metal layer comprises a plurality of first areas and a plurality of second areas; forming a first photoresist layer on titanium-containing metal layer; patterning the first photoresist layer to form a plurality of first opening slots; forming a plurality of copper bumps within first opening slots, said copper bump comprises a first top surface and a first ring surface; removing the first photoresist layer; forming a second photoresist layer on titanium-containing metal layer; patterning the second photoresist layer to form a plurality of second opening slots; forming a plurality of bump isolation layers at spaces, the first top surfaces and the first ring surfaces; forming a plurality of connective layers on bump isolation layers; removing the second photoresist layer, removing the second areas to form an under bump metallurgy layer. | 2013-08-01 |
| 20130193571 | SEMICONDUCTOR PACKAGE AND METHOD AND SYSTEM FOR FABRICATING THE SAME - A fabrication method of a semiconductor package includes: disposing a first wafer on a substrate having at least a conductive pad; stacking a second wafer on the first wafer, wherein the second wafer has a pre-open area corresponding in position to the conductive pad of the substrate; forming a protection layer on the second wafer; embrittling the protection layer on the pre-open area of the second wafer; and removing the embrittled portion of the protection layer and portions of the second and first wafers so as to form an opening to expose the conductive pad, thereby preventing an adhesive layer from being attached to a cutting tool as in the prior art. | 2013-08-01 |
| 20130193572 | BALL GRID ARRAY PACKAGE SUBSTRATE WITH THROUGH HOLES AND METHOD OF FORMING SAME - In accordance with an embodiment, there is provided a substrate of a ball grid array package that includes a first layer including reinforcement fibers. The reinforcement fibers reinforce the first layer such that the first layer has a higher tensile strength relative to a layer in the ball grid array package that is free of reinforcement fibers. In an embodiment, the substrate comprises a second layer disposed adjacent to the first layer with the second layer being free of reinforcement fibers. In an embodiment, the substrate also includes a through hole penetrating each of the first layer and the second layer. The through hole penetrates each of the first layer and the second layer based on each of the first layer and the second layer having been drilled in accordance with a mechanical drilling process. | 2013-08-01 |
| 20130193573 | METHODS OF STRESS BALANCING IN GALLIUM ARSENIDE WAFER PROCESSING - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. To avoid warpage, the tensile stress of a conductive layer deposited onto a GaAs substrate can be offset by depositing a compensating layer having negative stress over the GaAs substrate. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 2013-08-01 |
| 20130193574 | 3D CHIP STACK HAVING ENCAPSULATED CHIP-IN-CHIP - A method of forming a three-dimensional (3D) chip is provided in which a second chip is present embedded within a first chip. In one embodiment, the method includes forming a first chip including first electrical devices and forming a recess extending from a surface of the first chip. A second chip is formed having second electrical devices. The second chip is then encapsulated within the recess of the first chip. Interconnects are then formed through the first chip into electrical communication with at least one of the second devices on the second chip. A three-dimensional (3D) chip is also provided in which a second chip is embedded within a first chip. | 2013-08-01 |
| 20130193575 | OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA - Systems, apparatuses, and methods related to the design, fabrication, and manufacture of gallium arsenide (GaAs) integrated circuits are disclosed. Copper can be used as the contact material for a GaAs integrated circuit. Metallization of the wafer and through-wafer vias can be achieved through copper plating processes disclosed herein. To improve the copper plating, a seed layer formed in the through-wafer vias can be modified to increase water affinity, rinsed to remove contaminants, and activated to facilitate copper deposition. GaAs integrated circuits can be singulated, packaged, and incorporated into various electronic devices. | 2013-08-01 |
| 20130193576 | ENCAPSULANT WITH COROSION INHIBITOR - A packaged electronic device including an electronic device, a conductive structure, and an encapsulant. The encapsulant has chlorides and a negatively-charged corrosion inhibitor for preventing corrosion of the conductive structure. | 2013-08-01 |
| 20130193577 | STRUCTURE OF ELECTRICAL CONTACT AND FABRICATION METHOD THEREOF - A method of fabricating an electrical contact comprises the following steps. A substrate having at least a silicon region is provided. At least an insulation layer is formed on the substrate, wherein the insulation layer comprises at least a contact hole which exposes the silicon region. A metal layer is formed on sidewalls and bottom of the contact hole. An annealing process is performed to form a first metal silicide layer in the silicon region nearby the bottom of the contact hole. A conductive layer covering the metal layer and filling up the contact hole is then formed, wherein the first metal silicide layer is transformed into a second metal silicide layer when the conductive layer is formed. | 2013-08-01 |
| 20130193578 | THROUGH-SILICON VIAS FOR SEMICONDCUTOR SUBSTRATE AND METHOD OF MANUFACTURE - A semiconductor component includes a semiconductor substrate having a top surface. An opening extends from the top surface into the semiconductor substrate. The opening includes an interior surface. A first dielectric liner having a first compressive stress is disposed on the interior surface of the opening. A second dielectric liner having a tensile stress is disposed on the first dielectric liner. A third dielectric liner having a second compressive stress disposed on the second dielectric liner. A metal barrier layer is disposed on the third dielectric liner. A conductive material is disposed on the metal barrier layer and fills the opening. | 2013-08-01 |
| 20130193579 | STRUCTURE FOR NANO-SCALE METALLIZATION AND METHOD FOR FABRICATING SAME - A method for forming structure aligned with features underlying an opaque layer is provided for an interconnect structure, such as an integrated circuit. In one embodiment, the method includes forming an opaque layer over a first layer, the first layer having a surface topography that maps to at least one feature therein, wherein the opaque layer is formed such that the surface topography is visible over the opaque layer. A second feature is positioned and formed in the opaque layer by reference to such surface topography. | 2013-08-01 |
| 20130193580 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A method of manufacturing a semiconductor device comprises a mounting step of mounting a semiconductor element having an Au—Sn layer on a substrate, wherein the mounting step includes a paste supplying step of supplying an Ag paste having an Ag nanoparticle onto the substrate, a device mounting step of mounting a side of the Au—Sn layer of the semiconductor element on the Ag paste, and a bonding step of alloying the Au—Sn layer and the Ag paste to bond the semiconductor element to the substrate, wherein the Au—Sn layer has a content rate of Au of 50 at % to 85 at %. | 2013-08-01 |
| 20130193581 | PACKAGED MICRODEVICES AND METHODS FOR MANUFACTURING PACKAGED MICRODEVICES - Microdevices and methods for packaging microdevices. One embodiment of a packaged microdevice includes a substrate having a mounting area, contacts in the mounting area, and external connectors electrically coupled to corresponding contacts. The microdevice also includes a die located across from the mounting area and spaced apart from the substrate by a gap. The die has an integrated circuit and pads electrically coupled to the integrated circuit. The microdevice further includes first and second conductive elements in the gap that form interconnects between the contacts of the substrate and corresponding pads of the die. The first conductive elements are electrically connected to contacts on the substrate, and the second conductive elements are electrically coupled to corresponding pads of the die. The first conductive elements are attached to the second conductive elements at corresponding interfaces such that the interconnects connect the contacts of the substrate directly to corresponding pads on the die within the gap. | 2013-08-01 |
| 20130193582 | METHOD AND APPARATUS FOR CONNECTING MEMORY DIES TO FORM A MEMORY SYSTEM - A method, system and apparatus for connecting multiple memory device dies | 2013-08-01 |
| 20130193583 | SEMICONDUCTOR DEVICE HAVING METAL LINES WITH SLITS - A semiconductor device including a semiconductor substrate, an integrated circuit on the semiconductor substrate, an insulation layer covering the integrated circuit, and a plurality of metal line patterns on the insulation layer. First and second adjacent metal line patterns of the plurality of metal line patterns are spaced apart from each other by a space, and each of the first and second adjacent metal line patterns has at least one slit. | 2013-08-01 |
| 20130193584 | ON-CHIP RADIAL CAVITY POWER DIVIDER/COMBINER - Disclosed is a chip with a power divider/combiner, a module incorporating the chip and associated methods. The divider/combiner comprises first and second metal layers on opposite sides of a substrate. Interconnects extend through the substrate and comprise: a first interconnect, second interconnects annularly arranged about the first interconnect and third interconnects annularly arranged about the second interconnects. Each interconnect comprises one or more through silicon vias lined/filled with a conductor. For a power divider, an opening in the first metal layer at the first interconnect comprises an input port for receiving power and openings in the first or second metal layer at the second interconnects comprise output ports for applying power to other devices. For a power combiner, openings in the first or second metal layer at the second interconnects comprise the input ports and an opening in the first metal layer at the first interconnect comprises an output port. | 2013-08-01 |
| 20130193585 | Fabrication method and structure of through silicon via - A method of fabricating a through silicon via (TSV) structure, in which, a patterned mask is formed on a substrate, the patterned mask has an opening, a spacer-shaped structure is formed on a sidewall of the opening, and a via hole having a relatively enlarged opening is formed by etching the spacer-shaped structure and the substrate through the opening after the spacer-shaped structure is formed. A TSV structure, in which, a via hole has an opening portion and a body portion, the opening portion is a relatively enlarged opening and has a tapered shape having an opening size of an upper portion greater than an opening size of a lower portion. | 2013-08-01 |
| 20130193586 | SEMICONDUCTOR DEVICE HAVING PLURALITY OF WIRING LAYERS AND DESIGNING METHOD THEREOF - A semiconductor device includes first and second wirings formed in a first wiring layer and extending parallel to an X direction, third and fourth wirings formed in a third wiring layer and extending parallel to a Y direction; fifth and sixth wirings formed in a second wiring layer positioned between the first and second wiring layers, a first contact conductor that connects the first wiring to the third wiring; and a second contact conductor that connects the second wiring to the fourth wiring. The first and second contact conductors are arranged in the X direction. Because the first and second contact conductors that connect wiring layers that are two or more layers apart are arranged in one direction, a prohibited area that is formed in the second wiring layer can be made narrower. | 2013-08-01 |
| 20130193587 | Semiconductor Package Having an Interposer Configured for Magnetic Signaling - There are disclosed herein various implementations of semiconductor packages having an interposer configured for magnetic signaling. One exemplary implementation includes a die transmit pad in an active die for transmitting a magnetic signal corresponding to a die electrical signal produced by the active die, and an interposer magnetic tunnel junction (MTJ) pad in the interposer for receiving the magnetic signal. A sensing circuit is coupled to the interposer MTJ pad for producing a receive electrical signal corresponding to the magnetic signal. In one implementation, the sensing circuit is configured to sense a resistance of the interposer MTJ pad and to produce the receive electrical signal according to the sensed resistance. | 2013-08-01 |
| 20130193588 | SEMICONDUCTOR PACKAGE - A semiconductor package includes first and second semiconductor elements electrically interconnected by a connection structure. The first and second semiconductor elements are joined by a protection structure that includes an adhesive layer surrounded by a retention layer. | 2013-08-01 |
| 20130193589 | PACKAGED INTEGRATED CIRCUIT USING WIRE BONDS - A semiconductor device includes an integrated circuit die on a substrate. A first subset of wire bonds is between the substrate and the die. A second subset of wire bonds is between the substrate and the die. A dielectric material coats the first subset of the wire bonds along a majority of length of the first subset of the wire bonds. A medium is in contact with the second subset of the wire bonds along a majority of length of the second subset of the wire bonds. | 2013-08-01 |
| 20130193590 | SEMICONDUCTOR DEVICE INCLUDING VOLTAGE CONVERTER CIRCUIT, AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE - A semiconductor device includes a first bonding pad, a second bonding pad, a wire bonded to a selected one of the first and second bonding pads, a power supply line electrically connected to the first bonding pad, and a voltage converter circuit coupled to the second bonding pad, the voltage converter circuit being activated when the wire is bonded to the second pad to produce an internal power voltage, which is different from a voltage received by the voltage converter circuit through the wire and the second bonding pad, and supply the internal power voltage to the power supply line, and the voltage converter circuit being deactivated when the wire is connected to the first bonding pad to allow the power supply line to receive a power voltage through the wire and the first bonding pad. | 2013-08-01 |
| 20130193591 | Power Semiconductor Module with Pressed Baseplate and Method for Producing a Power Semiconductor Module with Pressed Baseplate - A power semiconductor module includes a baseplate having a top side, an underside, and a depression formed in the baseplate. The depression extends into the baseplate proceeding from the top side. A thickness of the baseplate is locally reduced in a region of the depression. The power semiconductor module further includes a circuit carrier arranged above the depression on the top side of the baseplate such that the depression is interposed between the circuit carrier and the underside of the baseplate. | 2013-08-01 |
| 20130193592 | Coating Method for an Optoelectronic Chip-on-Board Module - A method is proposed for coating an optoelectronic chip-on-board module including a flat substrate populated with one or more optoelectronic components having at least one primary optical arrangement and optionally at least one secondary optical arrangement. The optoelectronic chip-on-board module is coated with a transparent, UV-resistant, and temperature-resistant coating made of silicone by the following steps: (a) casting a liquid silicone into a mold open towards the top and having outer dimensions corresponding to or exceeding outer dimensions of the substrate; (b) inserting the substrate into the mold, wherein the optoelectronic component(s) are immersed completely into the silicone and a surface of the substrate contacts the silicone completely or the substrate immerses into the silicone at least partially with full surface contact; (c) curing and cross-linking the silicone with the optoelectronic component(s) and the substrate; and (d) removing the substrate from the mold with the coating of cured silicone. | 2013-08-01 |
| 20130193593 | BUMP STRUCTURAL DESIGNS TO MINIMIZE PACKAGE DEFECTS - The mechanisms for forming bump structures enable forming bump structures between a chip and a substrate eliminating or reducing the risk of solder shorting, flux residue and voids in underfill. A lower limit can be established for a cc ratio, defined by dividing the total height of copper posts in a bonded bump structure divided by the standoff of the bonded bump structure, to avoid shorting. A lower limit may also be established for standoff the chip package to avoid flux residue and underfill void formation. Further, aspect ratio of a copper post bump has a lower limit to avoid insufficient standoff and a higher limit due to manufacturing process limitation. By following proper bump design and process guidelines, yield and reliability of chip packages may be increases. | 2013-08-01 |
| 20130193594 | GAS DELIVERY SYSTEM - A gas flow bubbler system for delivering a precursor gas to a production chamber, the bubbler system comprising: a bubbler for containing precursor molecules in a liquid phase; a cyclone separator for removing aerosol particles from the precursor gas; and a tube through which precursor gas generated in the bubbler flows to the cyclone separator. | 2013-08-01 |
| 20130193595 | BEVERAGE DISPENSER WITH WHIPPER ASSEMBLY - The invention concerns a beverage dispenser comprising: a frame ( | 2013-08-01 |
| 20130193596 | METHOD AND DEVICE FOR PRODUCING A LENS WAFER - A method and a device for producing a lens wafer which has a plurality of microlenses, as well as microlenses produced from the lens wafer. | 2013-08-01 |
| 20130193597 | REFLECTOR MOLDING APPARATUSES AND METHODS THEREOF - A reflector molding apparatus includes two pressure rollers with pressure surfaces of the rollers comprising convex teeth and concave teeth in mesh. The reflection film is put on the aluminum sheet as the unmolded material. The unmolded material goes to the pressure surfaces in mesh and is molded to be a reflector. The surface of the resulting reflector is corrugated shaped because of the pressure of the rollers. The shape of the reflector changes with the pressure surface of the rollers. | 2013-08-01 |
| 20130193598 | HIGH-TEMPERATURE SPRAY DRYING PROCESS AND APPARATUS - The process comprises delivering a spray solution comprising at least one solute in a solvent to a spray-drying apparatus, using a flash nozzle to atomize the spray solution into droplets within the spray-drying apparatus to remove at least a portion of the solvent from the droplets to form a plurality of particles, and collecting the particles. The spray solution is directed to a heat exchanger, thereby increasing the temperature of the spray solution to a temperature T | 2013-08-01 |
| 20130193599 | DUAL ACTION GYRATORY THERMOFORMING PRESS - Embodiments provide a dual action gyratory thermoforming press. The dual action gyratory thermoforming press can include a multiposition gyratory head. The multiposition gyratory head can include multiple forming vessels that can include a mold platform. The multiposition gyratory head can also be connected to a bottom platform. The dual action gyratory thermoforming press can be brought into configuration for forming by rotating the multiposition gyratory head such that a forming vessel is in a forming position, displacing the bottom platform to bring the multiposition gyratory head into a forming position, and displacing the mold platform into a forming position. | 2013-08-01 |
| 20130193600 | SIALON PHOSPHOR, PROCESS FOR PRODUCING THE SAME, AND ILLUMINATOR AND LUMINESCENT ELEMENT EMPLOYING THE SAME - Phosphor that can provide white LED that uses a blue LED or an ultraviolet LED as a light source and that has superior luminous efficiency. This phosphor includes, as a main component, α-type sialon represented by a general expression: (M1)x(M2)y(Si,Al) | 2013-08-01 |
| 20130193601 | Molding System with Blow Nozzle Cleaning - A blow molding system having a blow molding station with at least one mold assembly and method for forming a filled container therewith. The blow molding station including at least one blow nozzle coupled to a source of blowing medium and configured to discharge the blowing medium into the preform to simultaneously form and fill a container with the blowing medium, wherein the blowing medium is the product to be contained within the container. A blow-off nozzle is provided and oriented in a direction to discharge a stream of cleaning medium at the blow nozzle causing residual blowing medium to be removed from the blow nozzle. | 2013-08-01 |
| 20130193602 | IMPRINT APPARATUS AND METHOD OF MANUFACTURING ARTICLE - An imprint apparatus cures an imprint material, while a pattern formed on a mold is kept in contact with the imprint material, thereby transferring the pattern onto the imprint material. The apparatus includes a measurement unit which performs, in parallel, alignment measurement in which a relative position between the mold and a shot region on the substrate, to which the pattern is to be transferred, is measured so as to align the mold and the shot region, and overlay measurement in which a relative position between a first pattern already formed in another shot region on the substrate using the mold, and a second pattern underlying the first patter is measured. | 2013-08-01 |
| 20130193603 | INSPECTION APPARATUS, LITHOGRAPHY APPARATUS, IMPRINT APPARATUS, AND METHOD OF MANUFACTURING ARTICLE - A foreign substance inspection apparatus includes: an irradiation unit configured to irradiate a surface of an object to be inspected with inspection light; a detector configured to detect light scattered by the surface irradiated with the inspection light; a determination unit configured to determine, using data of a surface roughness of the object, and data of a size of the foreign substance, an irradiated region of the inspection light on the surface, that allows light scattered by the foreign substance to be discriminated from light scattered by the object due to the surface roughness of the object; and a controller configured to control the irradiation unit so as to irradiate the irradiated region determined by the determination unit with the inspection light. | 2013-08-01 |
| 20130193604 | PHENOLIC FOAM BOARD - A rigid insulating phenolic foam body ( | 2013-08-01 |
| 20130193605 | MELT-SHAPED BODY OF POLYIMIDE PRECURSOR AND PROCESS FOR PRODUCTION OF POLYIMIDE FOAM USING SAME - The object is to propose an improved process for the production of a polyimide foam by which a large-sized polyimide foam in a state of fine and homogeneous cells can be readily obtained by easy operations and convenient steps. A melt-shaped body of a polyimide precursor obtainable by melt-treating in a closed state a powder of a polyimide precursor including at least an aromatic tetracarboxylic acid ester component and an aromatic amine component. A process for the production of a polyimide foam including the steps of melt-shaping in a closed state a powder of a polyimide precursor including at least aromatic tetracarboxylic acid ester component and an aromatic amine component to give a melt-shaped body of the polyimide precursor, and foaming the melt-shaped body of the polyimide precursor by a heat treatment. | 2013-08-01 |
| 20130193606 | APPARATUS FOR PITCH DENSIFICATION - A pitch densification apparatus may be used to form a carbon-carbon composite material. In some examples, the apparatus is configured to pitch densify a material using one or more of a plurality of different pitch densification techniques. For example, the apparatus may densify a material with a selectable one of the resin transfer molding cycle, the vacuum-assisted resin transfer molding cycle, and/or the vacuum pressure infiltration cycle. The apparatus may respond to initial or changing properties of a material to be densified. In some additional examples, the apparatus includes a mold configured to receive a preform and a portion of solid pitch separate from the preform. The apparatus may include a heating source thermally coupled to the mold that is configured to heat the solid pitch above a melting temperature of the solid pitch. The apparatus may melt the pitch without external pitch melting equipment. | 2013-08-01 |
| 20130193607 | AUTOMATED MATERIAL DELIVERY SYSTEM - An automated material delivery system including a material handling assembly, a compaction member, a handling actuator, and a cutting actuator is provided. The material handling assembly is configured and arranged to guide material. The material handling assembly includes a tacking member that is configured and arranged to selectively press the material over a forming surface of a tool. The compaction member is spaced a select distance from the tacking member. The compaction member is further configured to selectively press the material over at least a portion of the forming surface of the tool. The handling actuator is coupled to selectively move at least one of the material handling assembly and the compaction member to move the material handling assembly in relation to the compaction member. The cutting assembly is positioned between the tacking member and the compaction member. The cutting assembly is configured and arranged to selectively cut the material. | 2013-08-01 |
| 20130193608 | Composition and Process for Preparing NIR Shielding Masterbatch and NIR Shielding Masterbatch and Application Thereof - Disclosed herein is a method for preparing a near infrared shielding fiber. The method includes the steps of preparing and compounding a composition, then pelletizing the compounded composition to obtain the near-infrared shielding masterbatch, and melt spinning the near-infrared shielding masterbatch into the near-infrared shielding fiber. The composition includes at least one metallic ionic compound powder in an amount of about 1-25 wt %, a cross-linking agent in an amount of about 0.1-2 wt %, a thermoplastic polymer in an amount of about 67-98.7 wt %, a cross-linking initiator in an amount of about 0.1-1 wt %, and a dispersing agent in an amount of about 0.1-2 wt %. | 2013-08-01 |
| 20130193609 | METHOD AND DEVICE FOR PRODUCING STRAND-SHAPED GOODS - The invention relates to a method and to a device for producing strand-shaped goods in the form of small bands, fiber strands, monofilaments, or films, which are extruded from a polymer melt. After cooling in a cooling bath, a thermal treatment occurs between rolling feed units, wherein the goods are brought into contact with a hot medium. In order to be able to perform an individual thermal treatment depending on the thermoplastic material, the hot medium is provided optionally in the form of hot air or hot water according to the invention. For this purpose, the heating apparatus is formed from a forced-air oven and a water bath apparatus, which can be optionally activated to thermally treat the goods. | 2013-08-01 |
| 20130193610 | ORTHOPAEDIC MOULDING ARRANGEMENT AND METHOD FOR PRODUCING AN ORTHOPAEDIC MOULDING - A method for producing a moulding, the shape of which is adapted to an initial mould, in which method a plurality of layers are deformably placed on top of one another such that said layers can be joined to each other by heat, the layers are deformed by being pressed onto the initial mould and in order to join the layers, heat is applied in the deformed state, characterized by the fact that in the arrangement made of layers, at least one converter element is introduced that transforms supplied energy into heat energy and with which at least parts of the layers are heated to join the layers. | 2013-08-01 |
| 20130193611 | Composite Polymeric Flowforming with X-Y Translating Mold Base - A system for forming an article from composite polymeric material reinforced with fibers and other additives utilizing an extrusion system to heat and deliver the molten composite polymeric material onto a lower mold body riding on an x-y controlled structure. The combination of the x-y control of a lower mold and a volumetrically controlled extrusion device allow a “near net shape” deposition of molten composite material into the cavities of the lower mold, which is then moved over a conveyance system to a press containing the upper mold half which is used to compress and form the composite material into a final part under moderate pressures. | 2013-08-01 |
| 20130193612 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING EQUIPMENT - A semiconductor device manufacturing method comprises: stacking semiconductor chips on a substrate, applying an underfill material around the semiconductor chips, inclining the substrate, heating the substrate to decrease the viscosity of the underfill material, and hardening the underfill material after gaps in the semiconductor chips have been filled with the underfill material. The method allows gaps in the semiconductor chips between chips and other chips and chips in the substrate to be filled with the underfill material, which may be, for example, a thermoset resin . The method allows the gaps to be filled quickly and without leaving unfilled voids in the semiconductor device that might adversely affect device performance. | 2013-08-01 |
| 20130193613 | MULTIPLE-COMPONENT INJECTION MOLD ASSEMBLY AND METHOD - An injection mold assembly for manufacturing multiple-component articles includes opposed first and second mold halves and mold cores carried by the first mold half. Each of the mold cores is mounted for rotation between a first position and a second position about an axis of rotation. The mold halves are mounted for movement in reciprocal directions along an axis of reciprocation between an open position and a closed position forming molding cavities between the mold cores and the second mold halves. The axes of rotation of the mold cores are different from one another. | 2013-08-01 |
| 20130193614 | USE OF POLYAMIDE FOR THE PREPARATION OF INJECTION-MOLDED ARTICLES AND RESULTING ARTICLES - The use of thermoplastic polymers for the preparation of injection-molded articles and the resulting articles are described. Also described, is the use of a lubricated polyamide, obtained by means of the addition of at least one lubricant during the polyamide polymerization method, for the preparation of injection-molded articles. | 2013-08-01 |
| 20130193615 | Bead-Forming Apparatus - A bead-forming apparatus and method for its use are described. The bead-forming apparatus includes a base with a pair of legs extending from a top surface. First ends of the legs couple to respective eccentric elements. The eccentric elements removeably and rotatably couple to a platen. Second ends of the legs are rotatably and slideably mated with a gear train disposed within the base. The legs are slideably translatable into the base and the gear train maintains a rotational orientation of the legs and the eccentric elements coupled thereto. The platen is thus moveable through a circular path defined by the rotation of the eccentric elements and legs. As such, a plug of moldable material placed between the base and the platen and in contact with the platen, is formed into a double-cone shape by movement of the platen through the circular path. | 2013-08-01 |
| 20130193616 | FORMING APPARATUS, HEATING STATION AND METHOD FOR HEATING SET PORTIONS - A forming apparatus for forming objects by forming a sheet of thermoformable material includes a thermal conditioning station including a kiln for heating the material to an operating temperature, and a heating station positioned downstream of the thermal conditioning station and including a heating arrangement to heat set portions of the material to a temperature near a softening temperature of the material. In order to reduce reject material at the restart of the apparatus following machine downtime, the kiln and the heating arrangement are positioned near one another in such a manner that a part of the material interposed between the thermal conditioning station and the heating station is heated by the heat generated by a kiln and/or by the heating arrangement. | 2013-08-01 |
| 20130193617 | SYSTEMS AND METHODS FOR SEPARATING NON-METALLIC MATERIALS - A non-metallic material is separated using a single laser beam that is converted into a scribe beam and a break beam. A system includes a single laser source for generating a laser beam and a beam separator for converting the laser beam into a scribe beam having a first average power and a break beam having second average power. The beam separator directs the scribe beam to a scribe line on a substrate and the break beam to the substrate at a location that is spaced apart from the scribe beam. The scribe beam rapidly heats the substrate along the scribe line. A quenching subsystem applies a stream of cooling fluid to the substrate to propagate a microcrack along the scribe line. The break beam rapidly reheats the substrate quenched by the stream of cooling fluid to separate the substrate along the microcrack. | 2013-08-01 |
| 20130193618 | Laser Machining System and Method for Machining Three-Dimensional Objects from a Plurality of Directions - Embodiments of the present disclosure are directed to systems ( | 2013-08-01 |
| 20130193619 | MICRO-DISPENSING MULTI-LAYERED 3D OBJECTS WITH CURING STEPS - A method of building a three dimensional (3D) structure includes micro-dispensing a layer comprising a material using a syringe-based micro-dispensing tool, curing the layer, and repeating the steps of micro-dispensing and curing a plurality of times in order to build the three-dimensional structure. The material may be loaded with nano to micron sized particles, tubes, or strings. | 2013-08-01 |
| 20130193620 | MULTI-DIMENSIONAL COMPONENT BUILD SYSTEM AND PROCESS - An example multi-dimensional component building system includes a first chamber having at least one base, a second chamber adjacent to and in fluid communication with the first chamber through a first door, and a third chamber adjacent to and in fluid communication with the second chamber through a second door. The second chamber is fluidly sealed from the first chamber if the first door is in a closed position. The second chamber includes a directed heat source, a build-up material and is configured to receive the at least one base if the fluid parameters of the first chamber and second chamber are approximately equal. The third chamber is fluidly sealed from the second chamber if the first door is in a closed position. The third chamber is configured to receive the at least one base, having a formed component disposed thereon, if the second door is in an open position. | 2013-08-01 |
| 20130193621 | SYSTEMS AND METHODS OF ON-DEMAND CUSTOMIZED MEDICAMENT DOSES BY 3D PRINTING - Systems and methods of fabricating a customized dose using a medication 3D printer are provided. According to one embodiment, a system is provided that includes a 3D printer that receives prescription dose instructions from a computer or mobile communication device via a network and assembles a customized medication dose according to the prescription dose instructions by selective application of materials stored in a medicament compound container having at least one reservoir containing the materials for assembly. The materials for assembly can be provided to the 3D printer by a master conduit connecting reservoirs in the medicament compound container to the 3D printer. The 3D printer accesses specified amounts of the materials, which include medicament compounds, via the master conduit, and assembles the customized medication dose according to the prescription dose instructions. | 2013-08-01 |
| 20130193622 | METHOD FOR FORMING A CONTAINER PROVIDED WITH AN IMPRINT ON AN OVERHEATED AREA - A method of manufacturing a container having a local recessed or relief impression, from a blank ( | 2013-08-01 |
| 20130193623 | Method and Equipment for Reinforcing a Substance or an Object with Continuous Filaments - The present invention provides a method of reinforcing a substance or an object with continuous filaments comprising the steps of (a) supplying a fiber strand from a source of fiber strands, (b) passing said fiber strand horizontally through a passageway ( | 2013-08-01 |
| 20130193624 | APPARATUS FOR SHAPING PLASTICS MATERIAL PRE-FORMS INTO PLASTICS MATERIAL CONTAINERS WITH PRESSURE PADS - An apparatus for forming plastic pre-forms into containers with a blow mould which has at least two movable blow mould parts which, when closed form a container-forming cavity. The first blow mould part is removably arranged on a first blow mould carrier shell part, and the second blow mould part is removably arranged on a second blow mould carrier shell part. The first blow mould carrier shell part is movable with respect to the second blow mould carrier shell part for opening the mould. A holding device holds at least one blow mould part on the respective blow mould carrier shell part. The holding device has an actuating member extending through an opening in a wall of the blow mould carrier shell part. The actuating member is movable relative to the wall, and a first holding element for holding the blow mould part is arranged on the actuating member. | 2013-08-01 |
| 20130193625 | Cabinet Installation Device - A method for installing objects such as cabinets on a vertical surface such as a wall includes the use of a novel support device having an adjustable leg and an upper portion including two vertically spaced support surfaces. Two of the support devices are first placed at a selected height at an angle to the wall for initially supporting the object on a first support surface. The support devices are then sequentially moved to extend between a front portion of the object and the floor so that the object rests on the second support surface thus freeing both hands of the installer. | 2013-08-01 |
| 20130193626 | ADJUSTABLE HEIGHT TURNTABLE DEVICE - An adjustable height turntable device includes a base unit having a mechanical pump and a release actuator, the base unit acting to position a telescoping shaft in a vertical orientation. An elongated, generally planar cake tray is removably secured to the top of the telescoping shaft, and a pneumatic lifting system positioned within the base unit acts to raise and lower the height of the cake tray. | 2013-08-01 |
| 20130193627 | Adjustable Clamping Device for Stair Assembly - An adjustable clamping device for use in temporarily securing together opposed stairway stringers about one or more stair tread members includes a body member having opposed upper and lower ends. A length adjustable first arm is connected to the body member upper end and a length adjustable second arm is connected to the body member lower end. The clamping device includes a pressure plate having a generally planar configuration and situated parallel to the body member. An actuator having a first portion is operatively coupled to the body member and to the pressure plate to selectively move the pressure plate between retracted and extended configurations. A user input is attached to a proximal end of the actuator by which a user may operate the actuator to move the pressure plate. | 2013-08-01 |
| 20130193628 | RECORDING MEDIUM POST-PROCESSING APPARATUS, PRINTER UNIT WITH THE SAME, RECORDING MEDIUM POST-PROCESSING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM STORING RECORDING MEDIUM POST-PROCESSING INSTRUCTIONS - A recording medium post-processing apparatus includes: a stacker which is stacked with a plurality of sheet-like recording media with images being recorded thereon; an receiving device which receives at least one of information regarding the images to be recorded on the recording media and information regarding the recording media; an alignment device which applies an external force to the recording media stacked on the stacker so as to align the recording media; a controller which sets, on the basis of the at least one information received by the receiving device, at least one of (i) stacked-sheet number that is the number of the recording media, and (ii) a magnitude of the external force that is applied to the recording media and which controls the alignment device on the basis of the setted at least one of the stacked-sheet number and the magnitude of the external force. | 2013-08-01 |
| 20130193629 | SHEET POST-PROCESSING APPARATUS THAT CARRIES OUT STAPLING PROCESS ON SHEET BUNDLE AND CONTROL METHOD THEREFOR - A sheet post-processing apparatus which is capable of preventing a stapling position and a folding position from being out of alignment when a stapling process is carried out. A sheet bundle, which is stacked in a housing guide, is stapled by a stapler using a staple at the stapling position. The sheet bundle is folded at a position of the staple after the stapling. After the stapling, the sheet bundle is moved from the stapling position to the folding position. During the movement, the staple is detected using a staple sensor disposed at a predetermined location between the stapling position and the folding position. Based on a moving distance of the sheet bundle before the staple is detected after the stapling process, a position of the sheet bundle with respect to the stapler for stapling on a subsequent sheet bundle is corrected. | 2013-08-01 |
| 20130193630 | SHEET POST-PROCESSING APPARATUS THAT PERFORMS BUFFER PROCESSING, AND IMAGE FORMING APPARATUS - A sheet post-processing apparatus for performing post-processing on a sheet having an image formed thereon. A stapling section or a scoring section performs processing on a sheet and a sheet bundle. The upper limit value of a sheet count of sheets processable at a time by the post-processing unit is equal to N (N is an integer). A buffer path performs buffer processing for retaining a conveyed sheet, placing the retained sheet and a sheet following the retained sheet one on the other, and conveying the superimposed sheets as a sheet bundle. A CPU controls the buffer path the stapling section or the scoring section such that when the processing is being performed on the sheet or the sheet bundle, the buffer processing is performed on a following sheet, and that the processing is performed on each sheet bundle having been subjected to the buffer processing. | 2013-08-01 |
| 20130193631 | SHEET TRANSPORT DEVICE AND IMAGE FORMING APPARATUS INCORPORATED WITH THE SAME - A sheet transport device has a housing member, a sheet tray, a transport path, a dispensing portion, a feeding portion, and a projecting member. Sheets are accommodated in the sheet tray. The sheet tray is detachably attached to the housing member, and is configured to be pulled out of the housing member in a first direction. The transport path is disposed in the housing member, and extends from the sheet tray in a second direction perpendicular to the first direction. The dispensing portion dispenses the sheets to the transport path. The feeding portion is rotated in contact with the sheet for feeding the sheet toward downstream of the transport path. The projecting member is configured to be projected and retracted with respect to the transport path near the imaginary line extending from a sheet nip portion in the first direction. | 2013-08-01 |
| 20130193632 | Sheet Conveyor Apparatus - A sheet conveyor apparatus may include a sheet support portion, a first roller that feeds sheets supported on the sheet support portion, and a second roller disposed downstream of the first roller and rotatable about a rotation axis. The apparatus further include a holder supported swingably about the rotation axis, a wall opposite the sheet support portion with the holder interposed therebetween, and a pressing member disposed between the wall and the holder to press the first roller toward the sheet support portion. The pressing member includes a holding member movably supported by the holder to contact the wall, and a spring disposed between the holding member and the holder to apply a biasing force causing the holding member and the holder to move away from each other while maintaining a state in which the holding member contacts the wall regardless of swing of the holder about the rotation axis. | 2013-08-01 |
| 20130193633 | SHEET FEEDING DEVICE AND IMAGE FORMING APPARATUS - A sheet feeding device includes drawing and conveying a sheet, applying negative pressure for sheet suction via a suction opening, moving a shutter member between a closing position where the suction opening in an upstream side in a sheet feeding direction is partially closed and an open position where the suction opening is opened, and controlling the shutter member to follow a preceding sheet that is drawn onto the suction conveyance member to move to the downstream side in the feeding direction to close the suction opening, and return to an open position at a predetermined timing to draw the sheets onto the suction conveyance member in a state where an upstream edge of the preceding sheet in the feeding direction and a downstream edge of the subsequent sheet in the feeding direction are overlaid by a predetermined amount. | 2013-08-01 |
| 20130193634 | MULTI-FUNCTION PERIPHERAL - A multi-function peripheral having an automatic document feeding device (ADF) suited for being configured in a body of an apparatus is provided. The apparatus has a first and second power sources to drive the ADF to transmit a paper in or out of the body. The ADF includes a limiting structure, a swinging member and a blocking member. The first and second power sources drive the limiting structure and the swinging member to swing respectively. The blocking member has a first end connected to the swinging member and a second end extending toward the limiting structure. When the limiting structure is at a second position and the swinging member swings toward a third position, the second end is trapped into the limiting space. When the limiting structure moves toward a first position and the swinging member swings toward the third position, the second end escapes from the limiting space. | 2013-08-01 |
| 20130193635 | FEEDING APPARATUS - A feeding apparatus which is capable of increasing the number of stacked sheets without increasing a size of an apparatus is provided. The feeding apparatus includes a stopper member which is in contact with a leading edge of a sheet placed on a sheet stacking plate and blocks the sheet from entering a separation unit, and an actuating member which presses the stopper member in conjunction with a rotation of a holding member, and a movement distance of the actuating member is longer than a movement distance of the holding member. | 2013-08-01 |
| 20130193636 | MEDIUM FEEDING APPARATUS AND IMAGE FORMING APPARATUS - A medium feeding apparatus includes an apparatus main body, and a medium cassette removably inserted into the apparatus main body. The medium cassette is configured to store a medium. The medium cassette includes a medium positioning unit for determining a position of the medium, and a locking unit that locks a movement of the medium positioning unit when the medium cassette is inserted into the apparatus main body and before the medium cassette reaches a predetermined position in the apparatus main body. | 2013-08-01 |
| 20130193637 | RECORDING MEDIUM DISCHARGE DEVICE AND IMAGE FORMING APPARATUS - A drive controlling unit causes an ascending and descending unit to lower a recording medium discharge tray, and then causes raising of the recording medium discharge tray until detection of the upper surface of the recording medium by an upper surface detection sensor. A determining unit determines whether a raising time of the recording medium discharge tray measured by a measuring unit is a predetermined abnormal time. When the raising time is determined by the determining unit not to be the abnormal time, the drive controlling unit causes the recording medium discharge unit to execute the subsequent recording medium discharge into the recording medium discharge tray. When the raising time is determined by the determining unit to be the abnormal time, the drive controlling unit causes the recording medium discharge unit to stop the subsequent recording medium discharge into the recording medium discharge tray. | 2013-08-01 |
| 20130193638 | IMAGE FORMING APPARATUS INCLUDING SKEW CORRECTION MECHANISM, CONTROL METHOD THEREFOR, MEDIUM - An image forming apparatus that can detect a leading edge of a tabbed sheet after skew correction with high accuracy and without increasing a size of the apparatus. A transfer unit transfers a toner image to the sheet, the skew of which having been corrected based on a detection result of a first skew detection unit, while the toner image is controlled to be synchronized with the sheet based on the detection result of the first skew detection unit and a detection result of a second skew detection unit. | 2013-08-01 |
| 20130193639 | SKEWED SHEET CORRECTING DEVICE AND IMAGE FORMING APPARATUS - A skewed sheet correcting device includes: first and second shutter members which move to a first position in which the first and second shutter members are pushed to be movable by a leading edge of a sheet, a second position which is disposed further downstream of the sheet conveyance direction than the first position to latch the leading edge of the sheet, and a third position which allows the sheet to pass; and a movement regulating member which, when one of the shutter members does not move to the second position, regulates the other shutter member in the second position, and, when both the first and second shutter members move to the second position, allows the first and second shutter members to move to the third position. | 2013-08-01 |
| 20130193640 | SHEET TRANSPORTING APPARATUS, IMAGE READING APPARATUS AND IMAGE PRINTING APPARATUS - A sheet transporting apparatus, whereby the level of a transporting error for a sheet, such as a document or a printing medium, can be appropriately determined and coped with, and an image reading apparatus and an image printing apparatus equipped with this sheet transporting apparatus, are provided. In the image reading apparatus, in order to transport a sheet of a document, the driving amount per unit time of a transporting roller is compared with a plurality of different threshold values, and the results obtained by comparison are employed to determine whether a transporting error is a service error or an operator error. | 2013-08-01 |
| 20130193641 | IMAGE FORMING APPARATUS, CONTROL METHOD FOR IMAGE FORMING APPARATUS, AND STORAGE MEDIUM - An image forming apparatus which performs image forming processing on sheets and outputs the sheets to a sheet stacking unit includes an instruction unit configured to issue an instruction for shutting down the image forming apparatus, an acquisition unit configured to acquire a remaining amount of sheets stacked in the sheet stacking unit, and a control unit configured to display, when the instruction unit receives the instruction, a warning indicating a shift to a state in which sheets are not extractable from the sheet stacking unit, based on the remaining amount of sheets acquired by the acquisition unit. | 2013-08-01 |
| 20130193642 | DEVICE AND METHOD FOR HANDLING, SHUFFLING, AND MOVING CARDS - Card-handling devices include a card-holding area and a card output shoe. The card output shoe includes a card-way for passage of cards from the card-holding area into a dealing-ready area. A movable gate is positioned between the card-way and the dealing-ready area to prevent cards in the dealing-ready area from re-entering the card-way. Card shufflers include a gate mounted to allow movement of randomized groups of cards from card-receiving compartments to proximate a terminal end plate of a card output shoe and to block movement of cards in an opposite direction. In related methods of moving cards, card movement through the card-way to the dealing-ready position is allowed by a movable gate and card movement from the dealing-ready position into the card-way is prevented by the movable gate. | 2013-08-01 |
| 20130193643 | Board Game - A game, including a game board having a path between homelessness and having a home, the path having a plurality of spaces; and a game piece for showing a player's position on said path. A method of playing a game, including: providing a game board having a path between homelessness and having a home, the path having a plurality of spaces; and a game piece for showing a player's position on said path; and moving said piece along said path. | 2013-08-01 |
| 20130193644 | SYSTEM AND METHOD FOR PROVIDING A TABLE GAME - A system and method for providing a table game are disclosed. According to one embodiment, an apparatus comprises a playing field, a ball launcher mechanism launching a ball into the playing field, and the ball launcher mechanism allows a first player to select one or more attributes affecting a ball trajectory. The apparatus further comprises a ball striker mechanism controlling a ball striker. The ball striker placed at a distance from the ball launcher mechanism in the playing field has a bat to hit a ball launched by the ball launcher mechanism and is controlled by a second player. One or more sensors are placed in predetermined locations in the playing field. The electrical signals generated by the one or more sensors are used to update a status of a game. | 2013-08-01 |
| 20130193645 | PROJECTILE TARGET SYSTEM - According to one aspect of the present invention, a projectile target is disclosed comprising a target having a substantially sealed chamber having a front face and a rear face with an enclosing side wall disposed intermediate. The front and rear faces are formed by membranes configured to allow a projectile to pass therethrough and then substantially seal to maintain the substantially sealed chamber. Pressure wave sensors are disposed within the chamber and are configured to detect pressure waves created by the projectile. A target controller receives signals from the pressure sensors indicative of the pressure sensed by the sensors and determines an impact point of the projectile on the front face of the target. | 2013-08-01 |
| 20130193646 | AFFIXABLE FIREARMS TARGET CAPABLE OF LEAVING A CUSTOM-SHAPED SILHOUETTE VISIBLE FROM AFAR UPON THE PROJECTILE'S IMPACT ON THE TARGET'S BULLSEYE - A “indicating” projectile impact target, or group of such, that can be affixed to the front of an existing thin walled projectile impact target, where the indicating target(s) “actuate”, upon being struck by a projectile at one of the indicating target's bullseye locations, to leave a custom silhouette in the indicating target and the existing target, in order to indicate the bulls eye strike to the shooter. | 2013-08-01 |
| 20130193647 | MAGNETIC FLUID SEAL DEVICE - A cartridge-type magnetic fluid seal device has a flanged sleeve fixed to an external peripheral surface of the radially inside member of two members and which rotates together with the inside member is provided facing a pair of magnetic pole members. A packing is disposed in an annular space formed by the radial inside of a magnetic source and the pair of magnetic pole members. The packing is provided in the annular space so as to slide on an external peripheral surface of the flanged sleeve, and a magnetic fluid seal part, the packing, and the flanged sleeve form a unit. | 2013-08-01 |
| 20130193648 | METHOD OF PRODUCING A PISTON RING HAVING EMBEDDED PARTICLES - A piston ring exhibiting particles capable of wear resistance on its shoulder is produced by producing a melt of the base materials of a metal material, adding ceramic particles to the melt, pouring the melt into a prefabricated mould and cooling the melt. During cooling, the mould is aligned such that the ceramic particles gather on at least one of the piston ring shoulders. | 2013-08-01 |
| 20130193649 | Shaft Seal, Especially Radial Shaft Seal - A shaft seal that is preferably a radial shaft seal has a sealing element of polyfluorocarbon that is provided with a sealing lip. The sealing element contacts a surface to be sealed under a radial force action acting in a radial direction of the shaft seal. An elastomer element is provided that is acting on the sealing lip and loads the sealing lip in a direction toward the surface to be sealed. The elastomer element supports the sealing element. The sealing element is resting flat on a face of the elastomer element, wherein the face is facing away from a medium side of the shaft seal. | 2013-08-01 |
| 20130193650 | METAL SEAL - A metal seal which can be fastened by low fastening force and can show sufficient sealing ability when receiving fluid pressure. The metal seal is composed a U-shaped metal thin seal and a reinforcing outer-fit member which receives side wall portions and a bottom wall portion of the thin seal from a back side. | 2013-08-01 |
| 20130193651 | GASKET WITH A COMPRESSION LIMITER - A multi-layer gasket including first and second functional layers, each having an opening. Each of the functional layers includes a compression bead, and the compression beads contact and seal against one another when the gasket is compressed between a cylinder head and an engine block. At least one of the functional layers includes a stopper disposed between the compression bead and the opening. The stopper has a gear-like shape including a plurality of circumferentially spaced teeth. Each tooth extends upwardly from a plane by a distance which is less than the combined height of the compression beads. When the gasket is compressed between the cylinder head and engine block, the stopper ensures that the compression beads remain elastically biased against one another and maintain a gas-tight seal. | 2013-08-01 |
| 20130193652 | CAM LOCK COUPLING GASKET - A cam lock quick coupling | 2013-08-01 |
| 20130193653 | Tool-Less Blade Clamping Apparatus for a Reciprocating Tool - Several preferred embodiments are disclosed for a tool-less blade clamping apparatus for a reciprocating tool of the type which has a reciprocating plunger which has a tool attachment receiving slot for receiving a tool attachment of the type that has a shank portion. The clamping apparatus has an unclamped position and a clamped position. In the unclamped position, a tool attachment can be easily inserted and when it is in its clamped position, the tool attachment is securely retained. The preferred embodiments have at least one spring biasing the apparatus toward the clamped position, a releasable retaining mechanism for holding the apparatus in its unclamped position after being placed in that position. When the blade shank portion is inserted into the slot a predetermined distance, the shoulders of the shank portion release the retaining mechanism to move it to its clamped position. When a blade is to be removed, the clamping apparatus needs only to be moved to its unclamped position by manually rotating the outer sleeve or collar, and the blade is normally ejected from the mechanism by contact with the blade shoulders as it reaches its unclamped position. | 2013-08-01 |
| 20130193654 | CHUCK - A chuck has a chuck body rotatable about an axis, a plurality of jaws radially displaceable on the body for gripping a workpiece, a chuck drive for rotating the chuck about the axis, and a center point axially shiftable in the body and axially engageable with the workpiece gripped by the jaws. An electric drive is coupled to the center point for axially shifting same. | 2013-08-01 |
| 20130193655 | Oscillating Tool Adapter - A clamp arrangement for securing an accessory to an oscillating power tool can include a clamp assembly including a first clamp member that moves relative to the accessory between a closed position wherein the clamp assembly retains the accessory and an open position wherein the first clamp is offset from the accessory permitting removal of the first accessory from the clamp assembly. The clamp assembly can further comprise a second clamp member having a first portion that opposes the first clamp member and cooperates with the first clamp member to clamp the accessory between the first and second clamp members. An attachment plate can carry the clamp assembly. The attachment plate can have a first mating detail formed thereon that is configured to selectively and removably mate with a complementary second mating detail on the power tool in an assembled position. | 2013-08-01 |
