30th week of 2016 patent applcation highlights part 52 |
Patent application number | Title | Published |
20160218043 | FIN FIELD EFFECT TRANSISTOR INCLUDING ASYMMETRIC RAISED ACTIVE REGIONS | 2016-07-28 |
20160218044 | Device Comprising a Ductile Layer and Method of Making the Same | 2016-07-28 |
20160218045 | GLASS FRIT WAFER BOND PROTECTIVE STRUCTURE | 2016-07-28 |
20160218046 | SEMICONDUCTOR DEVICE AND STRUCTURE | 2016-07-28 |
20160218047 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218048 | MICROFLUIDIC CHANNELS FOR THERMAL MANAGEMENT OF MICROELECTRONICS | 2016-07-28 |
20160218049 | Semiconductor Device and Method of Manufactures | 2016-07-28 |
20160218050 | POWER MODULE AND FABRICATION METHOD FOR THE SAME | 2016-07-28 |
20160218051 | LEAD FRAME | 2016-07-28 |
20160218052 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218053 | CHIP-ON-FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME | 2016-07-28 |
20160218054 | DC-DC CONVERTER HAVING TERMINALS OF SEMICONDUCTOR CHIPS DIRECTLY ATTACHABLE TO CIRCUIT BOARD | 2016-07-28 |
20160218055 | SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF | 2016-07-28 |
20160218056 | INTERMETALLIC COMPOUND FILLED VIAS | 2016-07-28 |
20160218057 | INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND MAGNETIC FIELDS | 2016-07-28 |
20160218058 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218059 | COMPOSITE CONTACT VIA STRUCTURE CONTAINING AN UPPER PORTION WHICH FILLS A CAVITY WITHIN A LOWER PORTION | 2016-07-28 |
20160218060 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF | 2016-07-28 |
20160218061 | SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, AND ELECTRONIC DEVICE | 2016-07-28 |
20160218062 | THIN FILM RESISTOR INTEGRATION IN COPPER DAMASCENE METALLIZATION | 2016-07-28 |
20160218063 | FAN -OUT WAFER LEVEL PACKAGING STRUCTURE | 2016-07-28 |
20160218064 | SEMICONDUCTOR PACKAGE WITH EMBEDDED COMPONENTS AND METHOD OF MAKING THE SAME | 2016-07-28 |
20160218065 | SEMICONDUCTOR PACKAGES AND PACKAGE MODULES USING THE SAME | 2016-07-28 |
20160218066 | Alignment Marks in Non-STI Isolation Formation and Methods of Forming the Same | 2016-07-28 |
20160218067 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218068 | SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218069 | SEMICONDUCTOR DEVICE, SEMICONDUCTOR WAFER AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218070 | MULTILAYER STRUCTURE IN AN INTEGRATED CIRCUIT FOR DAMAGE PREVENTION AND DETECTION AND METHODS OF CREATING THE SAME | 2016-07-28 |
20160218071 | SMART CARD AND METHOD OF MANUFACTURING SMART CARD | 2016-07-28 |
20160218072 | ANTENNA CAVITY STRUCTURE FOR INTEGRATED PATCH ANTENNA IN INTEGRATED FAN-OUT PACKAGING | 2016-07-28 |
20160218073 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218074 | SEMICONDUCTOR PACKAGES WITH AN INTERMETALLIC LAYER AND RELATED METHODS | 2016-07-28 |
20160218075 | Post-Passivation Interconnect Structure and Method of Forming Same | 2016-07-28 |
20160218076 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME | 2016-07-28 |
20160218077 | Composite Sheet for Resin Film Formation | 2016-07-28 |
20160218078 | ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT | 2016-07-28 |
20160218079 | DISPLAY DEVICE AND METHOD FOR ASSEMBLING THE SAME | 2016-07-28 |
20160218080 | Method of Thinning and Packaging a Semiconductor Chip | 2016-07-28 |
20160218081 | SEMICONDUCTOR PACKAGES INCLUDING AN INTERPOSER | 2016-07-28 |
20160218082 | DAMASCENE RE-DISTRIBUTION LAYER (RDL) IN FAN OUT SPLIT DIE APPLICATION | 2016-07-28 |
20160218083 | Semiconductor Device | 2016-07-28 |
20160218084 | HIGH SPEED, HIGH DENSITY, LOW POWER DIE INTERCONNECT SYSTEM | 2016-07-28 |
20160218085 | SEMICONDUCTOR DEVICE PACKAGES WITH IMPROVED THERMAL MANAGEMENT AND RELATED METHODS | 2016-07-28 |
20160218086 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218087 | PACKAGE STRUCTURE FOR POWER CONVERTER AND MANUFACTURE METHOD THEREOF | 2016-07-28 |
20160218088 | SUPPORT MOUNTED ELECTRICALLY INTERCONNECTED DIE ASSEMBLY | 2016-07-28 |
20160218089 | Semiconductor Device and Method of Forming WLCSP with Semiconductor Die Embedded Within Interconnect Structure | 2016-07-28 |
20160218090 | 3D Package With Through Substrate Vias | 2016-07-28 |
20160218091 | SEMICONDUCTOR PACKAGE INCLUDING EXPOSED CONNECTING STUBS | 2016-07-28 |
20160218092 | CHIP PACKAGE WITH EMBEDDED PASSIVE DEVICE | 2016-07-28 |
20160218093 | OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES | 2016-07-28 |
20160218094 | Package with SoC and Integrated Memory | 2016-07-28 |
20160218095 | COMPOSITE RESIN AND ELECTRONIC DEVICE | 2016-07-28 |
20160218096 | LED CHIP HAVING ESD PROTECTION | 2016-07-28 |
20160218097 | RADIATION-EMITTING SEMICONDUCTOR CHIP AND METHOD OF PRODUCING RADIATION-EMITTING SEMICONDUCTOR CHIPS | 2016-07-28 |
20160218098 | High-Performance Device for Protection from Electrostatic Discharge | 2016-07-28 |
20160218099 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218100 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218101 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218102 | SILICON NITRIDE FILL FOR PC GAP REGIONS TO INCREASE CELL DENSITY | 2016-07-28 |
20160218103 | SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THEREOF | 2016-07-28 |
20160218104 | BARRIER LAYER ABOVE ANTI-PUNCH THROUGH (APT) IMPLANT REGION TO IMPROVE MOBILITY OF CHANNEL REGION OF FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE | 2016-07-28 |
20160218105 | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | 2016-07-28 |
20160218106 | SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218107 | THREE-DIMENSIONAL SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218108 | SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF | 2016-07-28 |
20160218109 | SEMICONDUCTOR MEMORY DEVICE | 2016-07-28 |
20160218110 | Method Of Forming Self-Aligned Split-Gate Memory Cell Array With Metal Gates And Logic Devices | 2016-07-28 |
20160218111 | MEMORY DEVICE AND METHOD FOR FABRICATING THE SAME | 2016-07-28 |
20160218112 | NON-VOLATILE MEMORY (NVM) CELL AND DEVICE STRUCTURE INTEGRATION | 2016-07-28 |
20160218113 | Integrated Circuits with Non-Volatile Memory and Methods for Manufacture | 2016-07-28 |
20160218114 | THIN FILM TRANSISTOR ARRAY PANEL AND METHOD FOR MANUFACTURING THE SAME | 2016-07-28 |
20160218115 | PIXEL STRUCTURE | 2016-07-28 |
20160218116 | DISPLAY DEVICE AND MANUFACTURING METHOD THEREOF | 2016-07-28 |
20160218117 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-07-28 |
20160218118 | LIQUID CRYSTAL DISPLAY DEVICE AND METHOD FOR MANUFACTURING THE SAME | 2016-07-28 |
20160218119 | DISPLAY DEVICE | 2016-07-28 |
20160218120 | DISPLAY DEVICE | 2016-07-28 |
20160218121 | LIQUID CRYSTAL DISPLAY AND METHOD FOR MANUFACTURING THE SAME | 2016-07-28 |
20160218122 | DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME | 2016-07-28 |
20160218123 | METHOD OF MANUFACTURING DISPLAY DEVICE AND FORMING AN ALIGNMENT MARK HAVING CONCAVE AND CONVEX PORTIONS FORMED ALONG A FIRST PATTERN | 2016-07-28 |
20160218124 | THIN FILM TRANSISTOR DRIVING BACKPLANE AND MANUFACTURING METHOD THEREOF, AND DISPLAY PANEL | 2016-07-28 |
20160218125 | METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE | 2016-07-28 |
20160218126 | Backside Structure and Methods for BSI Image Sensors | 2016-07-28 |
20160218127 | SOLID-STATE IMAGE SENSOR AND CAMERA | 2016-07-28 |
20160218128 | Active Matrix Light Emitting Diode Array and Projector Display Comprising It | 2016-07-28 |
20160218129 | PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME | 2016-07-28 |
20160218130 | SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME | 2016-07-28 |
20160218131 | PHOTO DIODE AND METHOD OF FORMING THE SAME | 2016-07-28 |
20160218132 | STORAGE TRANSISTOR WITH OPTICAL ISOLATION | 2016-07-28 |
20160218133 | PHOTOSENSITIVE MODULE AND METHOD FOR FORMING THE SAME | 2016-07-28 |
20160218134 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS | 2016-07-28 |
20160218135 | SEMICONDUCTOR DEVICE, SOLID-STATE IMAGING DEVICE AND ELECTRONIC APPARATUS | 2016-07-28 |
20160218136 | IMAGE SENSOR PACKAGES AND METHODS OF FABRICATING THE SAME | 2016-07-28 |
20160218137 | SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SOLID-STATE IMAGING DEVICE, MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND ELECTRONIC DEVICE | 2016-07-28 |
20160218138 | SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING A SOLID-STATE IMAGE PICKUP DEVICE | 2016-07-28 |
20160218139 | Low Noise InGaAs Photodiode Array | 2016-07-28 |
20160218140 | MANUFACTURING METHOD OF SEMICONDUCTOR STRUCTURE | 2016-07-28 |
20160218141 | QUANTUM DOT LIGHT EMITTING DIODE AND MANUFACTURING METHOD THEREOF, DISPLAY DEVICE | 2016-07-28 |
20160218142 | DISPLAY DEVICE USING SEMICONDUCTOR LIGHT EMITTING DEVICES AND METHOD FOR MANUFACTURING THE SAME | 2016-07-28 |