30th week of 2018 patent applcation highlights part 73 |
Patent application number | Title | Published |
20180213606 | CARBON ALLOTROPE HEATERS WITH MULTIPLE INTERDIGITATED ELECTRODES - A heating element includes an electrode array having first and second interdigitated electrodes. The first electrode is configured to have a first polarity, and the second electrode is configured to have a second polarity. The electrode array substantially encloses a plurality of regions. The heating element further includes a heating surface including a layer of a carbon allotrope material having a first electrical resistance. The electrode array is in electrical communication with the carbon allotrope material. | 2018-07-26 |
20180213607 | CONNECTING THERMALLY-SPRAYED LAYER STRUCTURES OF HEATING DEVICES - A heating device for a domestic appliance includes a planar carrier having a carrier surface. Thermally sprayed onto the carrier surface is a layer structure, and a first solder volume is applied to the layer structure. The solder volume is an ultrasonically soldered-on solder volume. The layer structure can hereby be a heating conductor layer. | 2018-07-26 |
20180213608 | ELECTROSTATIC CHUCK WITH RADIO FREQUENCY ISOLATED HEATERS - A heater assembly for a substrate support assembly includes a flexible body. The heater assembly further includes one or more resistive heating elements disposed in the flexible body. The heater assembly further includes a first metal layer disposed on the top surface of the flexible body and extending at least partially onto an outer sidewall of the flexible body. The heater assembly further includes a second metal layer disposed on a bottom surface of the flexible body and extending at least partially onto the outer sidewall of the flexible body, wherein the second metal layer is coupled to the first metal layer at the outer sidewall of the flexible body such that the first metal layer and the second metal layer enclose, and form a continuous electrically conductive path around, the outer sidewall of the flexible body. | 2018-07-26 |
20180213609 | HEATING PLATE - An embodiment of the present invention discloses a heating plate comprising a cast iron blank, a heat generating tube and a heat insulating powder layer. Wherein the upper surface of the cast iron blank is provided with a recess for placing a heat generating tube. Thereof a heat-generating tube is pressing-fitted into the recess and is fitted with the recess, and both ends of the heat-generating tube are respectively provided with a leading pin perpendicular to the horizontal plane. And the upper surface of the heat-insulating powder layer where is provided two pin holes respectively connected with the heat generating tube leading pins, and the leading pins pass through the lead pin holes. And it is an object of the present invention to provide a heating plate with high efficiency and high reliability. | 2018-07-26 |
20180213610 | WINDSHIELD HEATING DEVICE FOR ONBOARD CAMERA - A windshield heating device for an on-board camera includes a PTC heater in the form of a sheet extending along an inner surface of a windshield in proximity to an on-board camera that takes an image of the front of a vehicle, and is configured to heat the windshield in a heated region in front of the camera. The PTC heater includes a first heating region and a second heating region which are adjacent to each other, the heating area of the second heating region is smaller than the heating area of the first heating region, and the calorific value per unit area of the second heating region is smaller than the calorific value per unit area of the first heating area. | 2018-07-26 |
20180213611 | INDUCTION HEATING EXTENSION CABLES INCLUDING CONTROL CONDUCTORS - Induction heating extension cables including control conductors are disclosed. An example cable assembly includes: a first plurality of conductors in a Litz cable arrangement; an outer protective layer configured to protect the plurality of conductors from physical damage; and a second plurality of conductors that are electrically isolated from the first plurality of conductors and are protected by the outer protective layer from physical damage. | 2018-07-26 |
20180213612 | INDUCTION HEATING ACCESSORIES - Induction heating accessories are disclosed. An example induction heating accessory comprises: a coupling circuit configured to be electromagnetically coupled to a cable carrying induction heating current; a power extraction circuit configured to extract power from the induction heating current via the coupling circuit; and circuitry configured to generate an output indicative of the induction heating current flowing through the cable based on receiving power via the induction coil. | 2018-07-26 |
20180213613 | INDUCTION COIL ASSEMBLY FOR AN INDUCTION COOKING HOB - The present invention relates to an induction coil assembly ( | 2018-07-26 |
20180213614 | Induction Coil with Dynamically Variable Coil Geometry - A solenoidal induction coil with dynamically variable coil geometry is provided for inductively welding or heating continuous or discontinuous workpieces passing through the solenoidal induction coil in a process line. The coil geometry can change, for example, as the outer dimension of the workpiece passing through the solenoidal induction coil changes or as non-continuous workpieces pass through the solenoidal induction coil in an induction heating or welding process line. | 2018-07-26 |
20180213615 | COVER BODY COMPONENT AND MICROWAVE OVEN - The present application provides a cover body component, applied to a microwave oven, the cover body component including: a cover body, wherein the cover body defines a hollow cavity with one opening end; and at least one water storage portion arranged on the cover body and used for storing water, wherein a vent hole is arranged on the at least one water storage portion, and the vent hole is connected to the hollow cavity. According to the cover body component provided by the present application, the cover body component provided with the water storage portion is deployed, water is accommodated in the water storage portion, the vent hole on the water storage portion is away from a normal water level line in the water storage portion, moreover the vent hole on the water storage portion is connected to the hollow cavity of the cover body. | 2018-07-26 |
20180213616 | ENHANCED CONTROL OF A MICROWAVE HEATING SYSTEM - A method for controlling a microwave heating system is provided. The method may be used with a system having a liquid-filled microwave heating chamber and includes measuring the value of one or more microwave system parameters. Suitable parameters can include, for example, net microwave power discharged, the temperature of the liquid in the microwave chamber, the flow rate of liquid through the microwave chamber, and the speed of the conveyance system disposed within the microwave chamber. The measured value of the selected parameter is then compared to a target value for that parameter in order to determine a difference. Based on the difference, one or more actions can be taken in order to start, stop, or alter the operation of the microwave heating system. | 2018-07-26 |
20180213617 | METHOD FOR OPERATING AN OPTOELECTRONIC ASSEMBLY AND OPTOELECTRONIC ASSEMBLY - A method for operating an optoelectronic assembly which includes at least one component string having at least one section, wherein the section includes at least one light emitting diode element, is provided. According to the method, the section is supplied with electrical energy, the supply of the section with electrical energy is interrupted, an input of the section is electrically coupled to an output of the section, wherein the section is short-circuited via the electrical coupling of the input to the output, a maximum value of an electrical discharge current which flows via the section is detected, and the fact of whether the section of the component string has a short circuit is determined depending on the detected maximum value. | 2018-07-26 |
20180213618 | POWER SUPPLY SYSTEM AND VOLTAGE OUTPUT MODULE - A power supply system includes at least a first power supply and a second power supply and a voltage output circuit. The first power supply provides a first set of signals while the second power supply provides a second set of signals. The voltage output circuit includes a first input terminal, a second input terminal, a first output terminal, a switch circuit and a control circuit. The first input terminal receives a first voltage signal of the first set of signals while the second input terminal receives a second voltage signal of the second set of signals, the switching circuit couples between the first and the second input terminal and the first output terminal, and the control circuit activates a first or second transistor according to a voltage difference between the first and second input terminal to generate a first output voltage signal on the first output terminal. | 2018-07-26 |
20180213619 | DEVICE FOR DRIVING THE ELECTRICAL POWER SUPPLY OF LIGHT SOURCES OF AN AUTOMOTIVE VEHICLE - The invention provides a device for driving the electrical power supply of at least one electronic circuit branch comprising at least one light source of an automotive vehicle. A converter circuit converts an input voltage V | 2018-07-26 |
20180213620 | DIRECT AC DRIVING CIRCUIT AND LUMINAIRE - The invention relates to a direct AC driving circuit and a luminaire for driving at least one LED, the driving circuit comprises a LED string ( | 2018-07-26 |
20180213621 | POWER REGULATION FOR LIGHTING FIXTURES - A device can include multiple light loads, where each light load includes at least one light source. The device can also include multiple switches coupled to the light loads. The device can further include a controller coupled to the switches, where the controller actively operates the switches multiple times within each cycle to control delivery of power to the light loads. Active operation of the switches by the controller is performed on a dynamic schedule, where the dynamic schedule is based on multiple environmental conditions, and where the controller bypasses a forward voltage of the light loads when actively operating the switches. | 2018-07-26 |
20180213622 | LED Driver for Providing Power to Parallel LEDs - An LED driver is provided. The LED driver has a constant current power source. In some embodiments, the constant current power source is an electrical input configured for connection to a source of power at a constant current. In some embodiments, the source of power is a constant current regulator. The LED driver also includes a switch electrically connected to the constant current power source. The switch has at least two outputs wherein the switch is configured to selectively connect the constant current power source to each of the at least two outputs. The switch is configured to connect each of the at least two outputs for a pre-determined period of time. | 2018-07-26 |
20180213623 | LIGHTING APPARATUS - A lighting apparatus includes first light emitting elements and second light emitting elements, and a control circuit. The first light emitting elements the second light emitting elements are dispersedly disposed in a predetermined region. The first light emitting elements are more densely disposed in a periphery portion than in a center portion of the predetermined region. The second light emitting elements are more densely disposed in the center portion than in the periphery portion of the predetermined region. | 2018-07-26 |
20180213624 | LIGHTING APPARATUS - A lighting apparatus includes: first light emitting elements; second light emitting elements having chromaticity values in a same chromaticity range as the first light emitting elements; and a control circuit including a mode switch for controlling the first light emitting elements and the second light emitting elements separately. The control circuit selectively executes a first mode which causes the first light emitting elements to emit light and a second mode which causes the first light emitting elements and the second light emitting elements to emit light. The mode switch switches between the first mode and the second mode. | 2018-07-26 |
20180213625 | Underwater LED Light With Replacement Indicator - Disclosed is a method of determining depreciation of a lumen output of an LED. More particularly, disclosed is a method of determining depreciation of a lumen output of an LED comprising monitoring, by a processing device, an operating characteristic of an AC power source operatively coupled to the LED; determining, by the processing device, whether a lumen output the LED depreciated beyond a specified lumen value based on the monitoring; and causing, by the processing device, an indicator to provide notification to a user based on determining the lumen output of the LED depreciated beyond the specified lumen value. | 2018-07-26 |
20180213626 | WIRELESS LIGHTING DEVICE WITH CHARGING PORT - A wireless lighting module is disclosed. The wireless lighting module may include a light source, a controller configured to control illumination of the light source, a connector configured to provide power to an external device, and a battery configured to supply power to the light source, controller and connector. | 2018-07-26 |
20180213627 | LIGHTING DEVICE - A lighting device includes a pedestal, a supporting column, a flexible touch panel, and a light source assembly. One end of the supporting column is connected to the pedestal, and the other end of the supporting column is connected to the light source assembly. The flexible touch panel is attached on an outside surface of the supporting column, the flexible touch panel is electrically connected with the light source assembly, and the flexible touch panel is operable to sense a touch action to control a luminous state of the light source assembly. The brightness, color temperature and the like of the luminous state of the light source assembly may be controlled by touching the flexible touch panel. The flexible touch panel is set on the supporting column for a user to touch and operate, which improves the user's operating experience. | 2018-07-26 |
20180213628 | LIGHTING CONTROL SYSTEM, LIGHTING CONTROL APPARATUS, INSTRUCTION VALUE SELECTION APPARATUS, INSTRUCTION VALUE SELECTION METHOD, AND INSTRUCTION VALUE SELECTION PROGRAM - A lighting control system of an embodiment includes a sensor which acquires person information indicating presence or absence of a person, a plurality of instruction value calculators which calculate light modulation rate instruction values based on the person information acquired by the sensor, and an instruction value selector which selects any one of instruction values transmitted from the plurality of instruction value calculators. | 2018-07-26 |
20180213629 | APPARATUS, METHODS AND SYSTEMS FOR PROVIDING LIGHTING AND COMMUNICATION - Provided are apparatus, methods and systems for providing lighting and communication. An apparatus may include a solid-state lighting panel including multiple solid-state light emitters and an input module that is configured to receive an input signal from a lighting panel group controller that is configured to collaboratively control multiple solid-state lighting panels. | 2018-07-26 |
20180213630 | LIGHT FIXTURE AS AN ACCESS POINT IN A COMMUNICATION NETWORK - A light fixture is described herein. The light fixture can include a housing having at least one wall that forms a cavity. The light fixture can also include a controller configured to control and communicate with at least one sensor located outside the housing. The light fixture can further include at least one light fixture component coupled to the controller and disposed within the cavity of the housing, where the controller further controls the at least one light fixture component. | 2018-07-26 |
20180213631 | STRUCTURE OF REMOVING STATIC ELECTRICITY IN LOW-HUMIDITY SPACE - There is provided a static electricity removal structure in a low-humidity space, in which static electricity can be removed with high efficiency in the low-humidity space by using a static electricity removal device. A low-humidity space is configured such that dehumidified air is supplied from one side of the low-humidity space into the low-humidity space through a blowout surface material in which ventilation pore is formed, and exhausting is performed from the other side of the low-humidity space, which opposes the blowout surface material. A static electricity removal device is disposed on a downstream side of the blowout surface material. | 2018-07-26 |
20180213632 | METHOD FOR DRIVING X-RAY SOURCE - Provided is a method for driving an X-ray source, which includes a cathode electrode, an electron source provided on the cathode electrode and configured to emit an electron beam, and an anode target including an electron beam irradiation surface with the electron beam irradiated thereto, the method including providing the electron beam in a plurality of main pulses, wherein each of the main pulses includes a plurality of short pulses having an idle time and a pulse time, and each of the idle time and the pulse time is shorter than a duration time of the main pulse, wherein applying the plurality of short pulses comprises irradiating the electron beam from the electron source towards the electron beam irradiation surface during the pulse time; and idling the electron beam during the idle time, wherein a duty cycle of the short pulse is 0.4 to 0.6, which is obtained by dividing the idle time by a sum of the pulse time and the idle time. | 2018-07-26 |
20180213633 | Heat Dissipator with Circuit Formed by Screen Printing or Spraying - A heat dissipator having a circuit formed by screen printing or spraying includes a circuit layer and an isolation layer. The circuit layer, which is on a surface of a heat dissipation part of the heat dissipator having the circuit formed by screen printing or spraying, is formed by screen printing or spraying a uniformly distributed plastic material and low electrical resistance conductive powder. The isolation layer is disposed on the circuit layer and the heat dissipation part. | 2018-07-26 |
20180213634 | Thermally Highly Conductive Coating on Base Structure Accommodating a Component - A component carrier has a base structure with a recess, a thermally highly conductive coating covering at least a part of a surface of the base structure, and a component in the recess. | 2018-07-26 |
20180213635 | RESIN COMPOSITION AND MULTILAYER SUBSTRATE - Provided is a resin composition which is capable of improving the bending property and the cutting processability of a B-stage film and which is capable of reducing the dielectric loss tangent of a cured product and improving the thermal dimensional stability of the cured product. The resin composition according to the present invention includes an epoxy compound, a curing agent and an inorganic filler, the epoxy compound containing a liquid epoxy compound having a viscosity of 500 mPa·s or less at 25° C., in an amount of 1% by weight or more and 10% by weight or less based on 100% by weight of the whole of the epoxy compound. | 2018-07-26 |
20180213636 | CROSSTALK REDUCTION BETWEEN SIGNAL LAYERS IN A MULTILAYERED PACKAGE BY VARIABLE-WIDTH MESH PLANE STRUCTURES - A computer system receives an initial multilayered ceramic package design. The computer system maintains a first selection of mesh line segments of the mesh line segments at a first width and adjusts a second selection of mesh line segments of the plurality of mesh line segments to a second width. The computer system controls fabrication of the multilayered ceramic package based on the modified multilayered ceramic package design. | 2018-07-26 |
20180213637 | PROCESS FOR PRODUCING WIRING SUBSTRATE - To provide a process for producing a wiring substrate with conduction failure in a hole formed in an electrical insulator layer suppressed even without conducting an etching treatment using metal sodium, and with unexpected deformation such as warpage suppressed even when the electrical insulator layer contains no woven fabric or non-woven fabric comprising reinforcing fibers. A process for producing a wiring substrate | 2018-07-26 |
20180213638 | DISPLAY DEVICE AND INTER-SUBSTRATE CONDUCTING STRUCTURE - According to one embodiment, a display device includes a first substrate including a first basement and a first terminal, a second substrate including a second basement including a first surface opposing the first terminal and a second surface on an opposite side to the first surface, a second terminal located on a side of the second surface, and a first hole, an organic insulating layer located between the first terminal and the second basement and including a second hole connecting to the first hole and a connecting material provided on the first hole to electrically connect the first terminal and the second terminal to each other, at least one of the first terminal and the second terminal including an oxide electrode in contact with the connecting material. | 2018-07-26 |
20180213639 | METHOD FOR PRODUCING A COMPOSITE MATERIAL - A method for producing a composite material comprising a planar base material to which an additional layer is applied on one side or both sides via a solder layer, characterised by: providing the base material, wherein the base material has a first surface on at least one side; providing the additional layer and arranging the solder layer between a second surface of the additional layer and the first surface such that when the additional layer is deposited on the first surface, the first surface of the base material is covered by the solder layer in a planar manner; wherein a thickness of the solder layer between the base material and the additional layer is smaller than 12 μm; heating the base material and the additional layer on the first surface to at least partially melt the solder layer and connecting the base material to the at least one additional layer. | 2018-07-26 |
20180213640 | CERAMIC CIRCUIT BOARD AND ELECTRONIC DEVICE - A ceramic circuit board includes an insulating substrate composed of stacked insulating layers of an alumina-based sintered body, internal leads containing Cu embedded in the insulating substrate, and one or a plurality of metal layers containing Cu embedded in the insulating substrate, at least one of the metal layers being located nearer than the internal leads to the surface of the insulating substrate in the stacking direction, wherein at least part of the metal layer overlaps the internal leads in plan view. | 2018-07-26 |
20180213641 | PROCESS FOR PRODUCING WIRING SUBSTRATE - To produce a wiring substrate having excellent electrical characteristics with conduction failure in a hole formed in a layer made of a fluororesin material sufficiently suppressed without conducting an etching treatment using metal sodium. A process for producing a wiring substrate | 2018-07-26 |
20180213642 | PRINTED CIRCUIT BOARD, MODULE USING PRINTED CIRCUIT BOARD, AND CAMERA MODULE USING PRINTED CIRCUIT BOARD - A printed circuit board includes a metal core substrate, an insulating layer formed on a surface of the metal core substrate, and a wiring pattern formed on the insulating layer. The metal core substrate includes a first metal layer made of a first metal material, and a second metal layer made of a second metal material differing from the first metal material, the second metal layer being laminated on the first metal layer. The elastic modulus of the second metal layer is lower than the elastic modulus of the first metal layer, and the thermal conductivity of the second metal layer is greater than the thermal conductivity of the first metal layer. | 2018-07-26 |
20180213643 | RESIN MULTILAYER SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A resin multilayer substrate includes a first resin layer including a thermoplastic resin as a main material, a second resin layer including the thermoplastic resin as a main material and superposed on the first resin layer, a first interlayer-connection conductor passing through the first resin layer in a thickness direction, and a first conductor pattern at an area including a region in which the first interlayer-connection conductor is exposed at the surface of the first resin layer between the first resin layer and the second resin layer. The first conductor pattern includes a portion in or at which a portion of the first interlayer-connection conductor is disposed. The first conductor pattern includes a first portion covering the region exposed at the surface of the first resin layer; and a second portion disposed surrounding the first portion. The first portion and the second portion have different thicknesses from each other. | 2018-07-26 |
20180213644 | PRINTED WIRING BOARD - A printed wiring board includes an interlayer resin insulating layer including resin and inorganic particles, a via conductor formed through the insulating layer, a first conductor layer formed on the first surface of the insulating layer and including a land portion of the via conductor on the first surface, and a second conductor layer formed on second surface of the insulating layer and connected to bottom of the via conductor. The bottom of the via conductor has diameter of 20 to 35 μm, the first conductor layer has thickness of 3 to 12 μm, the insulating layer has thickness of 1 to 15 μm, the second conductor layer has thickness of 1 to 12 μm, and the second conductor and insulating layers are formed such that T | 2018-07-26 |
20180213645 | METHOD AND APPARATUS FOR STRAIN RELIEVING SURFACE MOUNT ATTACHED CONNECTORS - An interconnect structure that includes a component circuit board containing a plurality of electrical components, and a wafer connector assembly. The wafer connector assembly includes a plurality of interconnect circuit boards that are in electrical connection with the components circuit board through a plurality of rows of solder joints, the plurality of interconnect circuit boards having a connection end including at least one contact. An adhesive is present structurally reinforcing at least a row of the solder joints that is proximate to the connection end of the plurality of interconnect circuit boards of the wafer assembly. | 2018-07-26 |
20180213646 | CONFIGURABLE, ENCAPSULATED SENSOR MODULE AND METHOD FOR MAKING SAME - A fingerprint sensor module includes a fingerprint sensor assembly with a circuit element attached. The fingerprint sensor assembly is electrically connected to a printed circuit board (PCB) substrate with a cutout to accommodate the circuit element. The entire fingerprint sensor assembly and at least part of the PCB are encapsulated in a encapsulating material to produce a structurally robust fingerprint sensor module suitable for integration into an electronics device such as a smartphone or other “Internet of Things” (IOT) electronic device. | 2018-07-26 |
20180213647 | Solid-State Transition Piece Being Transferable Into an Adhesive State for Embedding a Component in a Component Carrier - An auxiliary structure for embedding a component in a component carrier is disclosed. The auxiliary structure has a solid state transition piece for at least partially, in particular substantially fully circumferentially, enclosing the component, wherein the solid-state transition piece consists of a material being or becoming adhesive in a liquid state and being liquefiable by heat and/or pressure so as to fill a gap between the component and surrounding component carrier material by applying heat and/or pressure. | 2018-07-26 |
20180213648 | MANUFACTURING METHOD OF FLEXIBLE ARRAY SUBSTRATE - The invention provides a manufacturing method for flexible array substrate. The method comprises: adhering the flexible substrate to the rigid support plate to manufacture the back side driver circuit and the protective layer on the back side driver circuit; peeling the flexible substrate off, turning the flexible substrate over and then adhering again to the rigid supporting plate to manufacture the protecting layer and the adhesive layer; forming holes, front side driver circuit and display circuit on the flexible substrate, the back side driver circuit electrically connected to the display circuit and the back side driver circuit electrically connected to the display circuit through the holes to obtain a flexible array substrate with double-sided circuit structure. By distributing the circuit structure of the non-active area to both sides of flexible substrate, the width of the non-active area is reduced to realize an ultra-narrow border or borderless display. | 2018-07-26 |
20180213649 | FABRICATION METHOD OF FLEXIBLE ELECTRONIC DEVICE - A fabrication method of a flexible electronic device is provided. A flexible substrate is placed directly on a rigid substrate. A portion of an edge of the flexible substrate is heated, such that the heated portion of the edge of the flexible substrate constitutes a melted edge. An electronic element is formed on the flexible substrate and located in an area region surrounded by the melted edge. A separation process is performed, such that the melted edge is separated from the flexible substrate to form a flexible electronic device. | 2018-07-26 |
20180213650 | MANUFACTURING METHODS OF FLEXIBLE SUBSTRATES AND FLEXIBLE PANELS BY SCREEN PRINTING MACHINES - A manufacturing method of flexible substrates via a screen printing machine includes moving the back-ink blade and the scraper, the scraper is above the back-ink blade, and the back-ink blade is configured to coat the adhesive material on the opening; moving the back-ink blade and the scraper along an opposite direction, the scraper is lowered down to a position below the back-ink blade, the scraper prints the adhesive material from the opening to the substrate so as to form a flexible substrate thin-film corresponding to the opening area on the substrate; and applying a baking process on the flexible substrate thin-film to obtain a cured flexible substrate. The screen printing machine forms the flexible substrate thin-film corresponding to the opening of the screen printing machine to so as to obtain the flexible substrate having a predetermined dimension, which simplifies the manufacturing process and saves the manufacturing cost. | 2018-07-26 |
20180213651 | ELECTRONIC PRODUCT AND MANUFACTURING METHOD THEREOF - A manufacturing method of an electronic product is provided. The manufacturing method includes following steps. Firstly, a conductive circuit is formed on a film, wherein the conductive circuit is made of a conductive metal layer, the conductive metal layer is a metal foil and the conductive metal layer is patterned to form the conductive circuit. Then, an electronic element is disposed on the conductive circuit of the film, and the electronic element is electrically connected to the conductive circuit. Then, the film and a supporting structure are combined by an out-mold forming technology or an in-mold forming technology, such that the electronic element is wrapped between the film and the supporting structure. | 2018-07-26 |
20180213652 | ELECTRICALLY ISOLATED ASSEMBLY AND METHOD FOR THE ELECTRICAL ISOLATION OF AN ASSEMBLY - Electrically isolating an electrical or electronic assembly having a carrier and one or more electrical or electronic components mechanically and electrically connected with the carrier, includes coating the carrier or at least one of the components or both entirely or partially with powder. The powder includes powder particles of electrically isolating material that have an average particle diameter of less than 1000 micrometers. | 2018-07-26 |
20180213653 | RESIN SUBSTRATE, COMPONENT MOUNTED RESIN SUBSTRATE, AND METHOD OF MANUFACTURING COMPONENT MOUNTED RESIN SUBSTRATE - A resin substrate includes a thermoplastic resin base body, a mounting land conductor on a surface of the resin base body to be connected to a component, first and second reinforcement conductor patterns, and first interlayer connection conductors. The first and second reinforcement conductor patterns are each embedded in the resin base body and have a planar shape that includes a position overlapping the mounting land conductor when viewing the resin base body in plan view. The first interlayer connection conductors connect the first and second reinforcement conductor patterns in a thickness direction of the resin base body. The first interlayer connection conductors are arranged at positions different from the mounting land conductor when viewing the resin base body in plan view. | 2018-07-26 |
20180213654 | ELECTRONIC DEVICE WITH INTEGRATED CIRCUIT CHIP PROVIDED WITH AN EXTERNAL ELECTRICAL CONNECTION NETWORK - An electronic device includes a substrate having an external surface, and an integrated circuit over the external surface of the substrate. The substrate is provided with an electrical connection network including electrical links for linking the integrated circuit to another electrical device. Some of the electrical links include an impedance-compensating inductor on an external surface of the substrate. | 2018-07-26 |
20180213655 | ELECTRICAL INTERCONNECT FORMED THROUGH BUILDUP PROCESS - This disclosure relates generally to an electronic chip package that can include a die and a buildup layer substantially enveloping the die. Electrical interconnects can be electrically coupled to the die and passing, at least in part, through the buildup layer. An optical emitter can be electrically coupled to the die with a first one of the electrical interconnects and configured to emit light from a first major surface of the electronic chip package. A solder bump can be electrically coupled to the die with a second one of the electrical interconnects and positioned on a second major surface of the electronic chip package different from the first major surface. | 2018-07-26 |
20180213656 | DECOMPRESSION CONTAINER, PROCESSING APPARATUS, PROCESSING SYSTEM, AND METHOD OF PRODUCING FLAT PANEL DISPLAY - A decompression container includes an outer wall including a first member. The first member includes a first base portion and a first rib portion. The first base portion includes a first surface having a quadrilateral shape. The first rib portion being disposed on the first surface. The first rib portion includes a first rib surrounding a center of the first surface, a plurality of second ribs connected to the first rib and extending toward sides of the quadrilateral shape of the first surface, and a plurality of third ribs that are respectively disposed to oppose respective corners of the quadrilateral shape of the first surface, extend toward respective pairs of sides forming the respective corners of the quadrilateral shape of the first surface, and are apart from one another. | 2018-07-26 |
20180213657 | Modular Flexible Convex Display System and Methods - Display modules have a plurality of light emitting elements arranged in a predetermined pattern and providing a highly uniform visual effect. Methods are provided to support a plurality of flexible display modules in an adjustable curved arrangement. Alignment and complementary alignment features enable the alignment of adjacent display modules and the creation of large displays from a plurality of aligned display modules. Features to couple to and retain a support frame are provided. Flexible and durable weather resistance features are provided. A system of modular support frames works cooperatively with the display modules, adapting to different mounting environments, and thereby providing large modular displays with desirable properties. | 2018-07-26 |
20180213658 | ELECTRONIC APPARATUS UNIT - A second seal material is coated on an annular seal surface constituted by a partition wall of a connector housing and a three-sided outer peripheral surface of a cover, and is joined with an annular base outer peripheral surface on the base, and the cover and the base are integrated with fastening screws at the four corners, and hold the three sides of a circuit board therebetween. Fastening surfaces of the base are embossed with a first depth so that bending strength is reinforced whereby a stable seal gap is generated, and corner outer walls and a connection outer wall are disposed at four corners and one side of the cover, so as to generate a retention gap to prevent outflow of the second seal material. | 2018-07-26 |
20180213659 | MAKING A HYDROPHOBIC SURFACE FOR AN OBJECT - Various examples provide a method of making a hydrophobic surface for an object. According to the method, a hydrophobic coating may be applied to an original surface of the object. A microstructure may be formed on the original surface of the object. The hydrophobic surface of the object may be obtained with the microstructure submerged by the hydrophobic coating. The microstructure may be a rough structure including micro-sired portions, and may have greater hardness than the hydrophobic coating. | 2018-07-26 |
20180213660 | SPATIAL COMPOSITES - A housing of an electronic device includes a substrate defining an external surface and internal surface of the housing, at least one sidewall extending from the substrate, and abrasion-resistant members at least partly embedded in the substrate and extending beyond the external surface. The abrasion-resistant members may be formed from metal or ceramic. The substrate comprises a moldable matrix. The abrasion-resistant members are harder than the moldable matrix. | 2018-07-26 |
20180213661 | ASSEMBLY STRUCTURE FOR CASING OF ELECTRONIC DEVICE, AND ELECTRONIC DEVICE - An opening is formed in a top plate, and an opening is formed in a side plate which is approximately orthogonal to the top plate. A wall extending from a part of an edge part of the opening part and recessed toward the internal side of a casing includes an inclined surface inclined radially from the internal side of the casing to an edge part of the opening part and facing the opening part and the opening part. | 2018-07-26 |
20180213662 | FASTENERS FOR USE IN DISPLAY STRUCTURES - A fastener is disclosed for use in a display structure that includes a bracket defining a detent, a pin that is rotatably received by the bracket, and a latch, e.g., a helical spring, that is in engagement with the pin such that rotation of the pin causes corresponding rotation of the latch. The latch is configured, dimensioned, and positioned for engagement with the detent during movement of the fastener between first (unlocked) and second (locked) positions. During movement of the fastener between the first and second positions, the latch traverses the detent to provide a perceptible indication, e.g., an audible and/or tactile indication, that the fastener has been moved between the first and second positions. | 2018-07-26 |
20180213663 | CAPPING MEMBER, HOUSING ASSEMBLY, AND ELECTRONIC - A capping member is provided. The capping member is adapted to a flexible display panel. The capping member includes a first side wall, a second side wall opposite to the first side wall, a plurality of holes located between the first side wall and the second side wall. The first side wall is configured to be coupled to a side of the flexible display panel. The first side wall and the second side wall are bendable with the side of the flexible display panel and a configuration of each of the plurality of holes are changeable during bending the first side wall and the second side wall. A housing assembly and an electronic device are also provided. | 2018-07-26 |
20180213664 | SUPPORT FOR A MOBILE ELECTRONIC DEVICE - A support for a mobile electronic device which includes a rigid elongated base strip approximately a length of a mobile electronic device. The base strip is longer than wide and has a first end, a second end, an upper surface, and a lower surface. An elongated layer of material, having upwardly projecting micro-suction cups, is secured to the upper surface of the base strip. According to a first aspect, a rigid support member is provided that, when in an operative position, extends substantially vertically from the upper surface at the second end of the base strip. According to a second aspect, an attachment band is provided that enables the base strip to be mounted to a human hand. | 2018-07-26 |
20180213665 | ELECTRICAL BUSHING WITH CONTACT ELEMENT AND METHOD FOR THE PRODUCTION - One aspect relates to an electrical bushing for a medically implantable device, including an electrically insulating base body and an electrical conducting element. The conducting element includes a cermet, and the base body and the conducting element are connected by a sintered bond with a hermetic seal against the base body. The conducting element extends from a first surface of the base body through the base body to a second surface of the base body. The conducting element has first and second electrically conductive areas, and at least one of the electrically conductive areas is at least partially superimposed by a layer-like contact element, including a metal, so that the conducting element is connected in an electroconductive manner via the contact element. The contact element is an electrochemically created layer, such that it has a porous structure, wherein the porosity of the contact element is not more than 20%. | 2018-07-26 |
20180213666 | ELECTRONICS HOUSING FOR ELECTRONICS IN A MOTOR VEHICLE - An electronics housing is specified for electronics in a motor vehicle. The electronics housing has a first housing shell with a first base plate and a first side wall as well as a second housing shell with a second base plate and a second side wall. The first side wall is embodied here with double walls either completely or at least in one section, with the result that a groove-shaped wall intermediate space is formed between an outer partial wall and an inner partial wall of the first side wall. In an assembled state of the housing, the second side wall dips into this wall intermediate space. | 2018-07-26 |
20180213667 | METHOD AND SYSTEM FOR ENVIRONMENTAL SEALING OF ELECTRICAL ENCLOSURES - As described herein, an electrical enclosure is sealed against environmental contamination. An enclosure cabinet has an interior space. The interior space is accessible through an opening. A door or cover selectively closes the opening. The enclosure cabinet is manufactured of numerous parts and has holes, joints, gaps, seams and/or fasteners. Electrical control devices are mounted in the cabinet. A thick-film elastomeric coating is on an outer surface of the cabinet. The coating has a thickness of at least 0.6 mm to provide a monolithic bridging layer over holes, joints, gaps, seams and/or fasteners to prevent environmental contamination from penetrating the cabinet. | 2018-07-26 |
20180213668 | SEAL RING AND METHOD FOR MANUFACTURING SEAL RING - This seal ring ( | 2018-07-26 |
20180213669 | MICRO DATA CENTER (MDC) IN A BOX SYSTEM AND METHOD THEREOF - The various embodiments of the present invention disclose a Micro Data Center (MDC) system, wherein the system comprising a rack mountable box ( | 2018-07-26 |
20180213670 | Protective Cabinet for Storage and Protection of Equipment in General - “PROTECTIVE CABINET FOR STORAGE AND PROTECTION OF EQUIPMENT IN GENERAL”, said cabinet being configured by protective cabinet ( | 2018-07-26 |
20180213671 | Configurable Data Center Platform - A configurable data center platform includes an enclosure configured to affix to a support structure, the enclosure configured for housing one or more processing systems that form a data center, one or more transceivers configured to enable the one or more processing systems to communicate with one or more remote devices, one or more sensors; and an electrical power distribution subsystem configured to condition a received electrical current to one or more conditioned electrical currents that power the one or more processing systems and the one or more sensors, wherein the enclosure comprises a cooling system that removes heat from the one or more processing systems and the one or more sensors. | 2018-07-26 |
20180213672 | ENHANCED RACK/CABINET MOBILITY AND STABILITY FOR A SERVER RACK - A mobility apparatus. The mobility apparatus may include a continuous fixed-length rail attached horizontally to a bottom structural member of the front or the rear of a server rack. The continuous fixed-length rail exceeds a width of the server rack by an equal amount on either side of the server rack. The mobility apparatus also includes a lower rail portion attached to a lower edge of the continuous fixed-length rail; a raised rail portion attached to an extended length of each portion of the continuous fixed-length rail; and at least one wheel attached to an underside of each end of the extended length of the continuous fixed-length rail. | 2018-07-26 |
20180213673 | ENHANCED RACK/CABINET MOBILITY AND STABILITY FOR A SERVER RACK - A mobility apparatus. The mobility apparatus may include a continuous fixed-length rail attached horizontally to a bottom structural member of the front or the rear of a server rack. The continuous fixed-length rail exceeds a width of the server rack by an equal amount on either side of the server rack. The mobility apparatus also includes a lower rail portion attached to a lower edge of the continuous fixed-length rail; a raised rail portion attached to an extended length of each portion of the continuous fixed-length rail; and at least one wheel attached to an underside of each end of the extended length of the continuous fixed-length rail. | 2018-07-26 |
20180213674 | ELECTRONIC EQUIPMENT DATA CENTER OR CO-LOCATION FACILITY DESIGNS AND METHODS OF MAKING AND USING THE SAME - The present invention relates to electronic equipment data center or co-location facility designs and methods of making and using the same in an environmentally aware manner, and generally provides apparatus and methods for using novel support bracket structures, and thermal panels associated with the same, that allow for distinct partitioning of air flowing in hot aisles and cold aisles, as well as for holding wiring above cabinets that are used to store electronic equipment in the facility. | 2018-07-26 |
20180213675 | Multi-Channel Power Source - A multi-channel power source includes at least one first power conversion unit, at least one second power conversion unit and a heat dissipation device. The first power conversion unit has a plurality of first subsidiary units. The first subsidiary units are electrically connected with each other. Each of the first subsidiary units has at least one first heating element. The second power conversion unit has a plurality of second subsidiary units. The second subsidiary units are electrically connected with each other. Each of the second subsidiary units has at least one second heating element. The heat dissipation device is configured to dissipate a heat generated by the first heating elements and the second heating elements along at least one heat dissipation medium direction. The first subsidiary units and the second subsidiary units are arranged in an at least partially staggered manner along the heat dissipation medium direction. | 2018-07-26 |
20180213676 | STACKED POWER MODULE WITH INTEGRATED THERMAL MANAGEMENT - A power module including a plurality of power die layers including power electronic components; a plurality of heat sink components operatively connected to multiple sides of each power electronic component; a plurality of electrically conductive layers contacting the plurality of heat sink components, wherein a power die layer and an electrically conductive layer sequentially alternate to form a stacked structure such that both ends of the stacked structure includes an end electrically conductive layer. A cooling path is integrated with each layer in the stacked structure. A housing unit houses the stacked structure. The power electronic components may include heat-producing electronic devices. The cooling path may accommodate any of a fluid and solid to liquid phase change materials. The fluid comes into direct contact with the power die layers, heat sink components, and electrically conductive layers. | 2018-07-26 |
20180213677 | LIQUID-COOLING HEAT DISSIPATION DEVICE - A liquid-cooling heat dissipation device includes a thermally conductive base and a covering structure. The thermally conductive base has a bottom surface and a top surface opposed to the bottom surface. The bottom surface is in contact with a heat source. A heat dissipation structure is formed on the top surface. The thermally conductive base is covered by the covering structure. An input chamber and an output chamber are defined by the thermally conductive base and the covering structure collaboratively. The input chamber is disposed over the heat dissipation structure and has an entrance. The output chamber has an exit. The input chamber is a tapered space. A vertical height of the input chamber is gradually decreased in a direction from the entrance toward the exit. Consequently, liquid flowing into the input chamber through the entrance is guided to the heat dissipation structure. | 2018-07-26 |
20180213678 | WATER COOLING HEAT DISSIPATION STRUCTURE - A water cooling heat dissipation structure includes a first and a second plate, a water cooling heat dissipation body, which is composed of a plurality of stacked heat dissipation members. The first plate, the heat dissipation members, and the second plate are in sequence stacked up into one and another to integrally form the water cooling heat dissipation structure by heat treatment. The water cooling heat dissipation body has a top side attached to one side of the first plate and a bottom side thereof attached to the second plate, so as to secure two sides of a flow passage of the water cooling heat dissipation body. A first and a second connecting portion is respectively provided on two sides of the first plate or the water cooling heat dissipation body, and the first and the second connecting portion is communicable with the flow passage. | 2018-07-26 |
20180213679 | HEAT DISSIPATION UNIT - A heat dissipation unit includes an integrally formed main body. The main body is divided into a first chamber and at least one second chamber. The first and second chambers are adjacent to each other without communicating with each other. A first working fluid is filled in the first chamber. The first chamber is defined as a first heat dissipation section. A second working fluid is filled in the second chamber. The second chamber is defined as a second heat dissipation section. The first heat dissipation section is correspondingly connected with the second heat dissipation section. The heat dissipation unit can achieve both large-area heat dissipation effect and remote-end heat conduction effect. Also, the heat dissipation unit is manufactured at greatly lowered cost. | 2018-07-26 |
20180213680 | INTERLACED HEAT DISSIPATION STRUCTURE OF ADDIN CARD - An interlaced heat dissipation structure of an addin card generally includes an addin card, a plurality of heat dissipation fins arranged on the addin card, at least one receiving space defined between the heat dissipation fins, a plurality of cooling pipes extending through the heat dissipation fins, and a plurality of heat dissipative elements arranged in the receiving space in a manner of being interlaced with the cooling pipes. As such, the heat dissipation fins, the cooling pipes, and the heat dissipative elements help cool down the addin card to keep the operation of the addin card stable. The interlaced arrangement of the cooling pipes and the heat dissipative elements in the receiving space defined between the heat dissipation fins makes it possible to maximize the total effective heat dissipation area. | 2018-07-26 |
20180213681 | HEAT RADIATING SHEET - Provided is a flexible heat radiating sheet with high thermal conductivity. The heat radiating sheet includes a resin material and a heat radiating member that extends in the planar direction and has a required thickness. The heat radiating member is bent such that in portions of a thin plate member between adjacent slit rows, projecting portions and recess portions are alternately repeated in the X-axis direction, and a projecting portion and a recess portion that are adjacent in the Y-axis direction are located facing each other. The heat radiating member is entirely buried in the resin material excluding apexes of the projecting portions and the recess portions. | 2018-07-26 |
20180213682 | SECURING MECHANISM AND ELECTRONIC DEVICE WITH SAME - A securing mechanism is provided for facilitating attaching a heat dissipation element. The securing mechanism includes a first fixing part, a second fixing part, a first arm and a second arm. The first arm and the second arm are connected with the first fixing part and the second fixing part. A first bent structure is protruded from the first arm and toward the second arm. A second bent structure is protruded from the second arm and toward the first arm. The securing mechanism is fixed on the heat dissipation element through the first fixing part and the second fixing part. The heat dissipation element is pressed by the first bent structure and the second bent structure. Consequently, the heat dissipation element is attached on the heat source. | 2018-07-26 |
20180213683 | Enhanced Cooling Design for Computing Device - Enhanced cooling for electronic components within a computing device is provided. Blowers are preferably leveraged as air movers, and an airflow deflection surface (preferably configured as a ramp) is disposed within a plenum to guide airflow under an electronic component (such as a hard disk drive or solid state drive), the electronic component being placed in an inverted alignment whereby a surface having a higher heat transfer rate is facing down (toward the blower), and then into an intake of the blower. Air output from the blower may then pass into a downstream plenum formed at least in part by the blower, an inverted downstream electronic component, and a support member thereof, thus providing serial cooling of the downstream component. Anti-recirculation flaps are preferably disposed at the air output of the blower. | 2018-07-26 |
20180213684 | FAIL-ON COOLING SYSTEM - One technique for improving cooling system efficiency is to operate cooling for a data center with a dynamic and distributed cooling system. A distributed cooling system may include multiple compressors operating cooperatively for cooling the data center. A dynamic cooling system may adjust operation of the compressors based on one or more parameters, such as inside temperature, outdoor temperature, inside humidity, outside humidity, and load on the data center. A dynamic cooling system may operate in a fail-on mode, adjusting the load placed on independent refrigeration circuits of an air handler system to compensate for a failure of one or more refrigeration circuits. By appropriately controlling speeds of the compressors, the power efficiency of the cooling system may be improved by ensuring that all activated compressors are operating within their efficient operating range. | 2018-07-26 |
20180213685 | PROVISIONING COOLING ELEMENTS FOR CHILLERLESS DATA CENTERS - Systems and methods for cooling include one or more computing structures, a heat rejection system configured to cool coolant, and one or more heat exchangers configured to selectively transfer heat from coolant in the intra-structure cooling system to coolant in the heat rejection system. Each computing structure includes one or more cooled servers and an intra-structure cooling system configured to selectively provide coolant to the one or more cooled servers. A controller is configured to adjust cooling of the coolant in accordance with ambient temperature information, to decrease cooling of the coolant if the coolant temperature falls below a first coolant threshold temperature by disengaging one or more heat exchangers, and to turn on additional servers if the coolant temperature is below the first cool and threshold and all heat exchangers have been disengaged. | 2018-07-26 |
20180213686 | ASSEMBLY STRUCTURE FOR MOTOR DRIVE UNIT - Disclosed herein is an assembly structure for a motor drive unit. An assembly structure for a motor drive unit is disclosed. The assembly structure does not require the time for rotating, laying down, or fastening the components during processes of producing it, so that the time required for production can be shortened. In addition, since no separate fastening part is required, the assembly structure can be simplified and the production costs can be reduced. | 2018-07-26 |
20180213687 | POWER SUPPLY APPARATUS - A power supply apparatus includes a case, a circuit board, at least one heating element, and at least one internal liquid cooling heat-dissipation structure. The heating element is disposed in the case and electrically connected to the circuit board. The internal liquid cooling heat-dissipation structure is disposed in the case and located in at least one of manners which include being located between the case and the circuit board and being located between the case and the heating element. The internal liquid cooling heat-dissipation structure includes a tank and a heat conducting sheet. The tank includes an internal pipe. A working fluid is adapted to be filled in the internal pipe. The heat conducting sheet is assembled to the tank. The heat generated by the heat element is transmitted to the tank through the heat conducting sheet and dissipated by the working fluid circulating in the internal pipe. | 2018-07-26 |
20180213688 | Substrate and Carbon Fiber Laminate Generating a Low Frequency Oscillating Electromagnetic Energy Field - An EM structure to emit a low frequency oscillating electromagnetic energy field has a nonpolar substrate, carbon fiber and an epoxy mixture to adhere the carbon fiber to a substrate, such as Kydex. The polarity changes from nonpolar to polar upon application of direct heat. When the EM structure is configured with two opposing sides that have the same flex modulus, the EM structure is reactive to external materials. The electromagnetic field changes the structure, or energy level, of the unprocessed material to a positive, reinforcing energy while processed foods remain in a negative, draining state. | 2018-07-26 |
20180213689 | ELECTROMAGNETIC INTERFERENCE SPLICE SHIELD - A splice device for electromagnetically sealing a junction or bond between a plurality of cables is provided. A first and second cable each has a conductive core wire, an inner insulation, a braided sleeve, and an insulating cover. The junction or bond fixes and electrically connects the core wire of the second cable to the core wire of the first cable. A plurality of ferrules overlays the braided sleeve and the insulating cover of the first cable and the braided sleeve and the insulating cover of the second cable. A plurality of ring collars overlays the plurality of ferrules and is fixed to the plurality of ferrules. A splice cover or shield overlays the first cable, second cable, plurality of ferrules, and plurality of ring collars and electromagnetically seals the junction/bond between the core wires of the first cable and the second cable. | 2018-07-26 |
20180213690 | TAPE FEEDER - A cassette type tape feeder including a tape feeding device that feeds a component supply tape to a component pickup position from a reel; a cover tape drawing-in device that peels off a cover tape from the component supply tape forward of the component suction position in accordance with a feeding operation of the component supply tape, and draws in the cover tape in a direction opposite to a feeding direction of the component supply tape; and a cover tape collection case that collects the cover tape drawn in by the cover tape drawing-in device. The cover tape collection case is configured of a fixing case section fixed to a cassette case, and a movable case section which expands capacity of the cover tape collection case by being displaced in a direction of the vacant space in the reel corresponding to an increase in collection amount of the cover tape. The movable case section is biased in a reducing direction by a torsion coil spring. | 2018-07-26 |
20180213691 | Prunus rootstock 'WRM-2' - A new and novel | 2018-07-26 |
20180213692 | Nectarine tree named 'NJN103' - A new and distinct nectarine variety of | 2018-07-26 |
20180213693 | Nectarine tree named 'NJN102' - A new and distinct nectarine variety of | 2018-07-26 |
20180213694 | Peach tree named 'NJ359' - A new and distinct peach variety of | 2018-07-26 |
20180213695 | Peach tree named 'NJ358' - A new and distinct peach variety of | 2018-07-26 |
20180213696 | Peach tree named 'NJ357' - A new and distinct peach variety of | 2018-07-26 |
20180213697 | Strawberry plant named 'ALLEGRO' - A new and distinct cultivar of Strawberry plant named ‘Allegro’, characterized by its compact and upright plant habit; moderately vigorous to vigorous growth habit; uniform and early fruit ripening; medium-sized ovoid fruits that are moderately glossy and red in color; pleasant fruit aroma and taste; excellent fruit postharvest longevity; and moderate resistance to | 2018-07-26 |
20180213698 | Syzygium Plant Named 'SAN01' - A new and distinct | 2018-07-26 |
20180213699 | Veronica plant named 'Perfectly Picasso' - The new and distinct cultivar of ornamental spike speedwell plant, | 2018-07-26 |
20180213700 | Lagerstromia plant named 'Bubble Tea' - The new and distinct crape myrtle plant named | 2018-07-26 |
20180213701 | Lagerstroemia plant named 'Spiced Plum' - The new and distinct crape myrtle plant named | 2018-07-26 |
20180213702 | Origanum plant named 'ALL120506' - A new and distinct cultivar of | 2018-07-26 |
20180213703 | Dianthus plant named ' Cherry Vanilla' - A new and unique plant cultivar of perennial carnation or pinks, | 2018-07-26 |
20180213704 | Chrysanthemum Plant Named `CIFZ0053' - A new garden type | 2018-07-26 |
20180213705 | X Heurechella plant named `Pumpkin Spice' - The new hybrid X | 2018-07-26 |