30th week of 2019 patent applcation highlights part 57 |
Patent application number | Title | Published |
20190228990 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING SUBSTRATE PROCESSING APPARATUS | 2019-07-25 |
20190228991 | SUBSTRATE CLEANING BRUSH AND SUBSTRATE CLEANING APPARATUS | 2019-07-25 |
20190228992 | SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING SYSTEM | 2019-07-25 |
20190228993 | GAS PHASE ETCHING DEVICE AND GAS PHASE ETCHING APPARATUS | 2019-07-25 |
20190228994 | FLATTENING METHOD AND FLATTENING APPARATUS | 2019-07-25 |
20190228995 | DEVICE AND METHOD FOR BONDING OF TWO SUBSTRATES | 2019-07-25 |
20190228996 | UNDERFILL SOLUTION SUPPLYING DEVICE FOR A DISPENSER, DISPENSER INCLUDING THE SAME, AND METHOD OF MANUFACTURING A SEMICONDUCTOR MODULE USING THE SAME | 2019-07-25 |
20190228997 | METHODS AND APPARATUS FOR WAFER TEMPERATURE MEASUREMENT | 2019-07-25 |
20190228998 | METHOD AND DEVICE FOR MANUFACTURING A DISPLAY APPARATUS, AND COMPUTER-READABLE STORAGE MEDIUM | 2019-07-25 |
20190228999 | MASK TRANSMISSION EQUIPMENT | 2019-07-25 |
20190229000 | FRONT OPENING UNIFIED POD | 2019-07-25 |
20190229001 | CHIP TRANSFERRING METHOD AND THE APPARATUS THEREOF | 2019-07-25 |
20190229002 | MICRO-STRUCTURE TRANSFER SYSTEM | 2019-07-25 |
20190229003 | Overhead Transportation System for Transporting Objects between Multiple Work Stations | 2019-07-25 |
20190229004 | DYNAMIC LEVELING PROCESS HEATER LIFT | 2019-07-25 |
20190229005 | CUTTING METHOD OF WORKPIECE | 2019-07-25 |
20190229006 | SEMICONDUCTOR MANUFACTURING APPARATUS AND FILM FORMATION METHOD FOR A SEMICONDUCTOR DEVICE | 2019-07-25 |
20190229007 | PROCESS KIT FOR A SUBSTRATE SUPPORT | 2019-07-25 |
20190229008 | HYBRID LIFT PIN | 2019-07-25 |
20190229009 | SUBSTRATE PLACING TABLE | 2019-07-25 |
20190229010 | FINFET DEVICES AND METHODS OF FORMING THE SAME | 2019-07-25 |
20190229011 | SEMICONDUCTOR DEVICE INCLUDING ISOLATION LAYERS AND METHOD OF MANUFACTURING THE SAME | 2019-07-25 |
20190229012 | Interlayer Dielectric Film in Semiconductor Devices | 2019-07-25 |
20190229013 | Semiconductor Device Including First and Second Contact Layers and Manufacturing Method | 2019-07-25 |
20190229014 | METHOD FOR FABRICATING A SEMICONDUCTOR STRUCTURE | 2019-07-25 |
20190229015 | SEMICONDUCTOR INTERCONNECT STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-07-25 |
20190229016 | METAL WIRING LAYER FORMING METHOD, METAL WIRING LAYER FORMING APPARATUS AND RECORDING MEDIUM | 2019-07-25 |
20190229017 | TFT SUBSTRATE AND MANUFACTURING METHOD THEREOF AND MANUFACTURING METHOD OF OLED PANEL | 2019-07-25 |
20190229018 | PROCESSING APPARATUS | 2019-07-25 |
20190229019 | CONTACT STRUCTURES | 2019-07-25 |
20190229020 | DUAL CHANNEL SILICON/SILICON GERMANIUM COMPLEMENTARY METAL OXIDE SEMICONDUCTOR PERFORMANCE WITH INTERFACE ENGINEERING | 2019-07-25 |
20190229021 | STACKED FIELD-EFFECT TRANSISTORS (FETS) WITH SHARED AND NON-SHARED GATES | 2019-07-25 |
20190229022 | CMOS IMPLEMENTATION OF GERMANIUM AND III-V NANOWIRES AND NANORIBBONS IN GATE-ALL-AROUND ARCHITECTURE | 2019-07-25 |
20190229023 | WAFER MEASUREMENT APPARATUS, WAFER MEASUREMENT SYSTEM, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME | 2019-07-25 |
20190229024 | METHOD FOR EVALUATING STABILITY OF SEMICONDUCTOR MANUFACTURING PROCESS | 2019-07-25 |
20190229025 | HIGH RELIABILITY WAFER LEVEL SEMICONDUCTOR PACKAGING | 2019-07-25 |
20190229026 | Ceramic- based Fan - Out Wafer Level Packaging | 2019-07-25 |
20190229027 | CIRCUIT MODULE | 2019-07-25 |
20190229028 | Reduction of Cross Talk in WLCSP's Through Laser Drilled Technique | 2019-07-25 |
20190229029 | SEMICONDUCTOR DEVICE | 2019-07-25 |
20190229030 | POWER MODULE AND METHOD FOR PRODUCING A POWER MODULE | 2019-07-25 |
20190229031 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THEREOF | 2019-07-25 |
20190229032 | Semiconductor Device | 2019-07-25 |
20190229033 | POWER MODULE AND METHOD FOR MANUFACTURING THE SAME | 2019-07-25 |
20190229034 | THERMAL CONDUCTIVE SHEET | 2019-07-25 |
20190229035 | HIGHLY COMPLIANT NON-SILICONE PUTTIES AND THERMAL INTERFACE MATERIALS INCLUDING THE SAME | 2019-07-25 |
20190229036 | SOLID-STATE STORAGE DEVICE | 2019-07-25 |
20190229037 | MULTI-LAYER COOLING STRUCTURE INCLUDING THROUGH-SILICON VIAS THROUGH A PLURALITY OF DIRECTLY-BONDED SUBSTRATES AND METHODS OF MAKING THE SAME | 2019-07-25 |
20190229038 | Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Cooling Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems | 2019-07-25 |
20190229039 | SEMICONDUCTOR DEVICES HAVING CONDUCTIVE VIAS AND METHODS OF FORMING THE SAME | 2019-07-25 |
20190229040 | SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME | 2019-07-25 |
20190229041 | HOUSING FOR AN ELECTRONIC COMPONENT, IN PARTICULAR A SEMICONDUCTOR CHIP | 2019-07-25 |
20190229042 | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE | 2019-07-25 |
20190229043 | Chip Package Assembly And Method For Manufacturing The Same | 2019-07-25 |
20190229044 | LEAD FRAME WITH PLATED LEAD TIPS | 2019-07-25 |
20190229045 | BALL GRID ARRAY AND LAND GRID ARRAY ASSEMBLIES FABRICATED USING TEMPORARY RESIST | 2019-07-25 |
20190229046 | Heterogeneous Fan-Out Structure and Method of Manufacture | 2019-07-25 |
20190229047 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-07-25 |
20190229048 | PACKAGE WITH METAL-INSULATOR-METAL CAPACITOR AND METHOD OF MANUFACTURING THE SAME | 2019-07-25 |
20190229049 | SUBSTRATE, ELECTRONIC DEVICE, AND DESIGN SUPPORT METHOD OF SUBSTRATE | 2019-07-25 |
20190229050 | SEMICONDUCTOR DEVICE WITH REDISTRIBUTION LAYERS ON PARTIAL ENCAPSULATION AND NON-PHOTOSENSITIVE PASSIVATION LAYERS | 2019-07-25 |
20190229051 | INTERCONNECT VIA WITH GROWN GRAPHITIC MATERIAL | 2019-07-25 |
20190229052 | SEMICONDUCTOR PACKAGE AND RELATED METHODS | 2019-07-25 |
20190229053 | METAL-INSULATOR-METAL CAPACITOR STRUCTURE AND MANUFACTURING METHOD THEREOF | 2019-07-25 |
20190229054 | PACKAGE DEVICE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE PACKAGE DEVICE | 2019-07-25 |
20190229055 | FAN-OUT SENSOR PACKAGE | 2019-07-25 |
20190229056 | BRIDGE DIE DESIGN FOR HIGH BANDWIDTH MEMORY INTERFACE | 2019-07-25 |
20190229057 | OVERPASS DICE STACKS AND METHODS OF USING SAME | 2019-07-25 |
20190229058 | DIE INTERCONNECT STRUCTURES AND METHODS | 2019-07-25 |
20190229059 | METHODS OF PATTERNING DIELECTRIC LAYERS FOR METALLIZATION AND RELATED STRUCTURES | 2019-07-25 |
20190229060 | ELECTRONIC COMPONENT PACKAGE AND MANUFACTURING METHOD OF THE SAME | 2019-07-25 |
20190229061 | SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME | 2019-07-25 |
20190229062 | SEMICONDUCTOR DEVICE | 2019-07-25 |
20190229063 | SEMICONDUCTOR STRUCTURE WITH SUBSTANTIALLY STRAIGHT CONTACT PROFILE | 2019-07-25 |
20190229064 | LASER COLOR MARKING METHOD FOR A SEMICONDUCTOR PACKAGE | 2019-07-25 |
20190229065 | SEMICONDUCTOR CHIPS AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME | 2019-07-25 |
20190229066 | DISPLAY PANEL | 2019-07-25 |
20190229067 | Carbide, Nitride And Silicide Enhancers For Laser Absorption | 2019-07-25 |
20190229068 | MAGNETIC SHIELDING OF STT-MRAM IN MULTICHIP PACKAGING AND METHOD OF MANUFACTURING THE SAME | 2019-07-25 |
20190229069 | Semiconductor Wafer and Method for Forming Semiconductor | 2019-07-25 |
20190229070 | FAN-OUT SEMICONDUCTOR PACKAGE | 2019-07-25 |
20190229071 | SEMICONDUCTOR PACKAGE | 2019-07-25 |
20190229072 | Ultra-Thin Semiconductor Component Fabrication Using a Dielectric Skeleton Structure | 2019-07-25 |
20190229073 | ELECTRONIC CHIP WITH PROTECTED REAR FACE | 2019-07-25 |
20190229074 | Zero Capacitance Electrostatic Discharge Devices | 2019-07-25 |
20190229075 | COMPENSATING FOR MEMORY INPUT CAPACITANCE | 2019-07-25 |
20190229076 | MEMORY PACKAGES AND RELATED SEMICONDUCTOR PACKAGES | 2019-07-25 |
20190229077 | Packaged RF Power Amplifier Having a High Power Density | 2019-07-25 |
20190229078 | SEMICONDUCTOR PACKAGE | 2019-07-25 |
20190229079 | BOND PADS WITH SURROUNDING FILL LINES | 2019-07-25 |
20190229080 | DIRECT C4 TO C4 BONDING WITHOUT SUBSTRATE | 2019-07-25 |
20190229081 | SEMICONDUCTOR DEVICES | 2019-07-25 |
20190229082 | CIRCUIT DEVICE WITH MONOLAYER BONDING BETWEEN SURFACE STRUCTURES | 2019-07-25 |
20190229083 | HYBRID BONDING MATERIALS COMPRISING BALL GRID ARRAYS AND METAL INVERSE OPAL BONDING LAYERS, AND POWER ELECTRONICS ASSEMBLIES INCORPORATING THE SAME | 2019-07-25 |
20190229084 | BONDING TOOLS FOR BONDING MACHINES, BONDING MACHINES FOR BONDING SEMICONDUCTOR ELEMENTS, AND RELATED METHODS | 2019-07-25 |
20190229085 | METHOD AND SYSTEM FOR BONDING A CHIP TO A SUBSTRATE | 2019-07-25 |
20190229086 | DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARATUS UTILIZING DEHT | 2019-07-25 |
20190229087 | SUBSTRATE STRUCTURE WITH SELECTIVE SURFACE FINISHES FOR FLIP CHIP ASSEMBLY | 2019-07-25 |
20190229088 | SEMICONDUCTOR DEVICE | 2019-07-25 |
20190229089 | SEMICONDUCTOR DEVICE WITH AN ELECTRICALLY-COUPLED PROTECTION MECHANISM AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS | 2019-07-25 |