30th week of 2020 patent applcation highlights part 56 |
Patent application number | Title | Published |
20200234853 | ELECTRIC VEHICLE CHARGING CABLE - The present invention relates to an electric vehicle charging cable capable of effectively cooling heat, which is generated therein during charging of an electric vehicle, using a cooling fluid, preventing damage to internal components thereof due to heat, and minimizing a diameter of the cable. | 2020-07-23 |
20200234854 | CABLING APPARATUS FOR HIGH RESISTANCE APPLICATIONS - A telecommunications cable for making high resistance measurements comprising a plurality of bundles, each comprising a twisted pair of Category | 2020-07-23 |
20200234855 | CABLE AND PRODUCING METHOD THEREFOR - A cable is composed of a linear shape conductor, a first electrical insulating member coating a periphery of the conductor, a shield made of a plating layer coating a surface of the first electrical insulating member, a second electrical insulating member coating a surface of the shield, and an exposed shield portion provided in at least one end portion of the cable with the second electrical insulating member being removed therefrom and the shield being exposed therein during termination. An adhesion strength between the shield and the second electrical insulating member in the exposed shield portion is lower than an adhesion strength between the shield and the second electrical insulating member in an other part of the surface of the shield. | 2020-07-23 |
20200234856 | THERMISTOR ELEMENT AND MANUFACTURING METHOD THEREFOR - A thermistor element includes an element body made of ceramic and including first and second end surfaces opposite to each other and a peripheral surface located between the first end surface and the second end surface, first and second external electrodes respectively covering the first and second end surfaces and portion of the peripheral surface adjacent to the respective first and second end surfaces. The first and second external electrodes include electrode layers including an underlayer and a metal plating layer, the underlayer of the first external electrode includes, adjacent to or in a vicinity of the second external electrode, two second external electrode side corner portions that are thin and adjacent to each other, and the underlayer of the second external electrode includes, adjacent to or in a vicinity of the first external electrode, two first external electrode side corner portions that are thin and adjacent to each other. | 2020-07-23 |
20200234857 | PPTC COMPOSITION AND DEVICE HAVING LOW SWITCH TEMPERATURE AND SHARP CRYSTALLIZATION BEHAVIOUR - A PPTC device is provided. The PPTC device may include a first electrode and a second electrode, disposed opposite the first electrode. The PPTC device may include a PPTC layer, disposed between the first electrode and the second electrode, the PPTC layer comprising a polymer matrix formed from a thermoplastic polyurethane (TPU) material. | 2020-07-23 |
20200234858 | ISOTOPE ENRICHMENT FOR IMPROVED MAGNETIC MATERIALS - A method for producing a magnetic material includes: selecting a mixture of isotopes of a chemical element having a desired magnetic characteristic; identifying an isotope in the mixture of isotopes meeting a selection criterion; removing the identified isotope from the mixture of isotopes using an isotope separation device to produce an enriched mixture of isotopes having a decreased concentration of the identified isotope; wherein the enriched mixture of isotopes is the magnetic material. | 2020-07-23 |
20200234859 | OIL-BASED MAGNETIC INK - An oil-based magnetic ink having an improved long-term storage stability is provided. The oil-based magnetic ink contains ferrite particles, a dispersant, a petroleum-based hydrocarbon solvent, a fatty acid ester-based solvent, and at least one selected from the group consisting of a glycol ether-based solvent and an alkanediol-based solvent, wherein the glycol ether-based solvent is a compound represented by R | 2020-07-23 |
20200234860 | COILED ELECTRONIC COMPONENT, COIL COMPONENT, MANUFACTURING METHOD OF COIL COMPONENT, INDUCTANCE ELEMENT, T-TYPE FILTER, OSCILLATION CIRCUIT, AND MANUFACTURING METHOD OF INDUCTANCE ELEMENT - A coiled electronic component includes: an electronic component body which includes a coil portion having a spiral structure and formed of an electrically conductive material, and electrically conductive connection portions arranged on both ends of the coil portion; and a pair of electrodes for respectively connecting the electrically conductive connection portions to assembly portions arranged on an assembly object. The electrode includes a pair of pinching pieces for pinching the electrically conductive connection portion, and the pair of pinching pieces is opened in a manner that the electrically conductive connection portion is received and fitted therebetween. | 2020-07-23 |
20200234861 | INDUCTOR - An inductor includes: a body including a coil and a magnetic material, and external electrodes disposed on an outer surface of the body. The coil is supported by a support member, and the support member may also support an insulating wall including an open-hole pattern having a shape corresponding to a pattern of the coil. An insulating ribbon formed so that a length thereof is greater than a width thereof may be additionally disposed on at least a portion of an upper surface of the insulating wall. | 2020-07-23 |
20200234862 | ELECTRONIC COMPONENT SURFACE-MOUNTABLE ON CIRCUIT BOARD - One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board. | 2020-07-23 |
20200234863 | Magnetic Potential Energy Barrier - Theoretical and practical constraints disallow direct determination of the structure of the atomic nucleus. Contained herein is a magnet model of the atomic nucleus, derived from considerations of charge density, RMS charge radii, magnetic moments, and nucleon binding energy. These physical properties point to a sequential, alternating up and down quark structure modeled in the present invention by an array of magnets alternating in polarity. The summation of the pull forces of the two magnet poles is unequal, and when two such magnet arrays are placed opposite one another in magnetic potential energy barrier assembly, the two arrays repel at a distance and attract when near one another. In one embodiment, the ratio of the maximum attractive force to the maximum repulsive force very closely approximates the strong force constant 137. This invention serves as a demonstration of the Coulomb barrier for the student, and a potentially useful model for probing the forces and structure of the atomic nucleus. | 2020-07-23 |
20200234864 | HIGH Q-FACTOR INDUCTOR - Described is a high Q-factor inductor. The inductor is formed as a unit cell coil, which is copied twice for a dual-coil inductor and copied four times for a quad-coil inductor. For each copy of the unit cell coil, the coil is rotated a subsequent substantially 90 degrees or substantially −90 degrees. The rotation enables the terminals of the inductor to be routed equal-distant to a circuit that is placed in the line of symmetry between the two coils. | 2020-07-23 |
20200234865 | LAMINATED ELECTRONIC COMPONENT - A laminated electronic component includes an element body and a pair of conductors. The element body is formed by laminating a plurality of element-body layers in a first direction. The pair of conductors is formed by laminating a plurality of conductor layers in the first direction. The pair of conductors is provided to the element body in such a way as to be separated from each other in a second direction orthogonal to the first direction. At a cross section orthogonal to the first direction, the pair of conductors has an uneven portion and the element body has an uneven portion engaged with the uneven portion of the pair of conductors. | 2020-07-23 |
20200234866 | MAGNETIC CORE, INDUCTOR AND EMI FILTER COMPRISING SAME - An inductor according to one embodiment of the present invention comprised: a magnetic core; and a coil wound around the magnetic core, wherein the magnetic core includes a plurality of stacked sub-magnetic cores, each sub-magnetic core includes a first magnetic body and a second magnetic body, the first magnetic body and the second magnetic core are different materials, the second magnetic body is arranged on a surface of the first magnetic body, each sub-magnetic core has a toroidal shape, and a permeability of the first magnetic body differs from a permeability of the second magnetic body. | 2020-07-23 |
20200234867 | Integrated Magnetic Component - An integrated magnetic component comprises a common mode inductance and a differential mode inductance. The common mode inductance is formed by a common mode core surrounding a winding window and at least two windings wound around the common mode core and through the winding window. The differential mode inductance is formed by the at least two windings and a differential mode core being spaced from the common mode core by a gap. The differential mode core comprises at least one surface being adjacent to each of the at least two windings. Further, a filter for attenuating electromagnetic interference comprises an integrated magnetic component according to the invention. Even further, the integrated magnetic component according to the invention is used for attenuating electromagnetic interference, preferably in a vehicle, a data center, or a telecommunication unit. A method for manufacturing an integrated magnetic component according to the invention comprises two steps. One step comprises providing a common mode inductance formed by a common mode core surrounding a winding window, and at least two windings wound around the core and through the winding window. Another step comprises providing a differential mode core and spacing it from the common mode core by a gap, such that at least one surface of the differential mode core is adjacent to each of the least two windings. | 2020-07-23 |
20200234868 | Packaged Inductive Component - According to the invention a packaged inductive component comprises an inductive element and an electrically insulating packaging enclosing the inductive element. The packaging comprises a first area consisting of a thermally conductive material and a second area consisting of a thermally insulating material. The first area has a first surface being an outside surface of the packaged inductive component. The outer surfaces of the packaged inductive component are free of any electrical potential. The packaged inductive component allows for an improved heat dissipation. In particular, heat generated by power losses in the inductive element dissipates through the first area of the packaging to an outside surface of the packaged inductive component. This leads to an affordable packaged inductive component. The inductive element can be for example an inductor or a transformer. | 2020-07-23 |
20200234869 | POWER CONVERTER - A power converter performs DC power conversion between a pair of first DC terminals and a pair of second DC terminals. DC nodes of n DC/AC converters are connected in parallel or in series between the first DC terminals. A multiple transformer has n primary windings and n secondary windings. An AC node of each DC/AC converter is connected to its corresponding primary winding. An AC node of each AC/DC converter is connected to its corresponding secondary winding. DC nodes of n AC/DC converters are connected in series or in parallel between the second DC terminals. The multiple transformer is configured such that a magnetic path is shared among the n primary windings and a magnetic path is shared among the n secondary windings. | 2020-07-23 |
20200234870 | CORE SHEET AND METHOD OF MANUFACTURING SAME - Disclosed are a core sheet and a manufacturing method thereof. The core sheet has an annular core back portion and a plurality of tooth portions extending from the core back portion toward a radial center thereof. The core sheet is obtained by performing a blanking step, a rolling step and a removing step. In the removing step, an insulation coating, which is on a region of a grain-oriented magnetic steel sheet for forming a band-shaped core back portion, on a band-shaped core back portion of a sheet piece or on the core back portion of the core sheet, is at least partially removed. | 2020-07-23 |
20200234871 | INDUCTOR AND TRANSFORMER - An inductor includes a plurality of wires disposed about an axis, a first electrode connected to a first end of each of the plurality of wires, and a second electrode connected to a second end of each of the plurality of wires. Each of the wires includes an outer-winding helical portion shifting in an axial direction while gradually increasing a radius thereof, an inner-winding helical portion shifting in the axial direction while gradually reducing a radius thereof, and an outer circumference connection portion that connects an end of the outer-winding helical portion and an end of the inner-winding helical portion at different positions in the axial direction. | 2020-07-23 |
20200234872 | ELECTROSTATIC SHIELDING OF PLANAR MAGNETIC DEVICES OF ELECTROSURGICAL GENERATORS - An electronic device includes: a multilayered dielectric substrate including a plurality of dielectric layers; a planar magnetic device disposed on at least one internal dielectric layer of the plurality of dielectric layers; and an overlapping shield assembly including a first shield layer and a second shield layer separated by at least one of the plurality of dielectric layers. | 2020-07-23 |
20200234873 | MULTILAYER COIL COMPONENT - A multilayer coil component | 2020-07-23 |
20200234874 | MULTILAYER COIL COMPONENT - A multilayer coil component | 2020-07-23 |
20200234875 | ASSEMBLY FOR CONNECTING TO A HIGH-VOLTAGE GRID - An assembly for connecting to a high-voltage grid includes a plurality of single-phase transformers, each of which has a transformer tank that is filled with a fluid and is equipped with a core with at least one coil. The coils of the single-phase transformers are at least partly connected together, thereby forming a neutral or star point. In order to permit the assembly to be quickly assembled in situ while at the same time providing a reliable current path for compensation and grounding currents, the coils are connected together by a neutral or star point conductor or rail in order to form the neutral or star point. The neutral or star point conductor or rail is retained in an insulated manner on the transformer tank. | 2020-07-23 |
20200234876 | METHOD FOR MANUFACTURING POWDER MAGNETIC CORE, AND METHOD FOR MANUFACTURING ELECTROMAGNETIC COMPONENT - A method for manufacturing a powder magnetic core includes: a step of preparing a soft magnetic powder and an oxide powder and preparing, as a raw material powder, a mixed powder of the soft magnetic powder and the oxide powder, the soft magnetic powder containing composite soft magnetic particles containing pure iron and an Fe-α alloy having an element α more oxidizable than Fe, the composite soft magnetic particles each having a core-shell structure where a core is made of one of pure iron and the Fe-α alloy and a shell is made of the other, the oxide powder containing oxide particles containing at least one selected from Fe and an element β that forms an oxide having higher electrical resistance than Fe | 2020-07-23 |
20200234877 | METHOD OF MANUFACTURING LAMINATED COIL COMPONENT - A method of manufacturing a laminated coil component is a method of manufacturing a laminated coil component provided with a laminate obtained by laminating a coil conductor forming a spiral coil and an insulator layer. The method of manufacturing a laminated coil component includes a step of providing a conductor pattern configured to become a coil conductor on a green sheet configured to become an insulator layer, and a step of laminating a plurality of green sheets provided with the conductor pattern. The conductor pattern includes a pair of first side surfaces opposed to each other in an orthogonal direction orthogonal to a laminating direction of the green sheet. At the step of laminating a plurality of green sheets, a depression is formed on at least one of the pair of first side surfaces. | 2020-07-23 |
20200234878 | INDUCTOR CHOKE COIL WIRE INTERFERENCE PREVENTION STRUCTURE - An inductor choke coil wire interference prevention structure includes a choke coil having a flat body portion wound into a continuous electrical coil portion, two end portions respectively downwardly extending from two opposite ends of the flat body portion and respectively bent into a respective soldering electrode. An extension tip is located on a distal end of each end portion remote from the flat body portion, and a layer of insulating film covers a contact surface of the end portion or an adjacent contact surface of the electrical coil portion to allow direct contact between the electrical coil portion and the contact surface of the end portion without causing electrical conduction or shorting. | 2020-07-23 |
20200234879 | MULTI-LAYER CERAMIC CAPACITOR AND METHOD OF PRODUCING THE SAME - A multi-layer ceramic capacitor includes a ceramic multi-layer chip, a side margin, and a bonding portion. The ceramic multi-layer chip includes a capacitance forming unit including internal electrodes, the internal electrodes being laminated in a first direction and including a base metal material as a main component, positions of end portions of the internal electrodes in a second direction orthogonal to the first direction being aligned with one another within a range of 0.5 μm in the second direction, and a cover that is disposed outside the capacitance forming unit in the first direction and includes ceramics as a main component. The side margin includes ceramics as a main component and covers the ceramic multi-layer chip in the second direction. The bonding portion is disposed on a bonding surface and includes an oxide including the base metal material, the bonding surface being bonded to the side margin on the cover. | 2020-07-23 |
20200234880 | MULTILAYER CAPACITOR AND MANUFACTURING METHOD FOR THE SAME - A multilayer capacitor includes a capacitor body including first and sixth surfaces; including an active region including a plurality of dielectric layers and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween, and cover regions disposed on an upper surface and a lower surface of the active region; and having one end of each of the first and second internal electrodes exposed through the third and fourth surfaces, respectively; and first and second external electrodes respectively disposed on the third and fourth surfaces of the capacitor body. Each of the cover regions has a plurality of holes. | 2020-07-23 |
20200234881 | COMPOSITE PIEZOELECTRIC CAPACITOR - A circuit element. In some embodiments, the circuit element includes a first terminal, a second terminal, and a layered structure. The layered structure may include a first conductive layer connected to the first terminal, a first piezoelectric layer on the first conductive layer, a second piezoelectric layer on the first piezoelectric layer, and a second conductive layer connected to the second terminal. The first piezoelectric layer may have a first piezoelectric tensor and a first permittivity tensor, and the second piezoelectric layer may have a second piezoelectric tensor and a second permittivity tensor, one or both of the second piezoelectric tensor and a second permittivity tensor differing, respectively, from the first piezoelectric tensor and the first permittivity tensor. | 2020-07-23 |
20200234882 | CERAMIC CAPACITOR HAVING METAL OR METAL OXIDE IN SIDE MARGIN PORTINS, AND METHOD OF MANUFACTURING THE SAME - A multilayer ceramic capacitor includes: a ceramic body including dielectric layers and having first and second surfaces opposing each other, third and fourth surfaces connecting the first and second surfaces to each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a plurality of internal electrodes disposed in the ceramic body, each exposed to the first and second surfaces and having one ends exposed to the third or fourth surface; and a first side margin portion and a second side margin portion disposed, respectively, on the first and second surfaces of the ceramic body, wherein a metal or a metal oxide is disposed in each of the first and second side margin portions, and a ratio of a diameter of the metal or the metal oxide to a thickness of the dielectric layer is 0.8 or less. | 2020-07-23 |
20200234883 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. A ratio of min to max is not less than about 36% and not more than about 90%, where A | 2020-07-23 |
20200234884 | CAPACITOR COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A capacitor component includes: a body including a plurality of dielectric layers and a plurality of internal electrodes stacked opposingly in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the body and connected to the plurality of internal electrodes. The second surface includes a plurality of convex portions spaced apart from each other. | 2020-07-23 |
20200234885 | CERAMIC ELECTRONIC DEVICE AND MANUFACTURING METHOD OF THE SAME - A ceramic electronic device includes: a multilayer chip in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked, the multilayer chip having a rectangular parallelepiped shape, the plurality of internal electrode layers being alternately exposed to a first end face and a second end face of the multilayer chip, the first end face facing with the second end face, a first external electrode provided on the first end face; a second external electrode provided on the second end face; and an organic compound that is adhered to at least a part of a region including a surface of the multilayer chip where neither the first external electrode nor the second external electrode is formed and surfaces of the first external electrode and the second external electrode, and has a siloxane bonding. | 2020-07-23 |
20200234886 | MULTI-LAYER CERAMIC CAPACITOR - A multi-layer ceramic capacitor includes a ceramic body and external electrodes. The ceramic body includes ceramic layers laminated in a first direction, first and second internal electrodes between the ceramic layers, a facing portion in which the internal electrodes face in the first direction, and a cover that covers the facing portion in the first direction. The facing portion includes a first region including at least one element of manganese, a rare-earth element, or magnesium and having a flat distribution of a concentration of the element along the first direction, and a second region disposed between the cover and the first region and having an increasing concentration of the element from the first region toward the cover. The ceramic layers include a capacitance forming layer between the first and second internal electrodes, and a dummy layer between the first or second internal electrodes and across the first and second regions. | 2020-07-23 |
20200234887 | MULTILAYER CERAMIC CAPACITOR - A multilayer ceramic capacitor includes a stacked body and external electrodes. The stacked body includes stacked dielectric layers and internal electrodes. The external electrodes are disposed on lateral surfaces of the stacked body and are connected to the internal electrodes. The dielectric layers include outer layer portions and an effective layer portion. Each outer layer portion is adjacent to a corresponding main surface of the stacked body. Each outer layer portion is a dielectric layer located between a corresponding main surface and an internal electrode closest to the main surface. A ratio of a dimension of the effective layer portion in a stacking direction to a dimension of the stacked body in the stacking direction is not less than about 53% and not more than about 83%. | 2020-07-23 |
20200234888 | CERAMIC ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME AND ELECTRONIC DEVICE - A method of manufacturing a ceramic electronic component includes forming a dielectric layer including a plurality of ceramic nanosheets on a first electrode, treating the dielectric layer with an acid, and forming a second electrode on the dielectric layer, a ceramic electronic component, and an electronic device. | 2020-07-23 |
20200234889 | ELECTROLYTIC CAPACITOR - An electrolytic capacitor includes an anode body with a dielectric layer; a solid electrolyte layer in contact with the dielectric layer; and an electrolytic solution. The solid electrolyte layer includes a π-conjugated conductive polymer and a first sulfonic acid. The electrolytic solution includes a solvent and an acid component. The solvent includes a glycol compound. And a proportion of the glycol compound in the solvent is equal to or more than 50% by mass. | 2020-07-23 |
20200234890 | SELF-CHARGING SUPERCAPACITOR - A self-charging supercapacitor is provided which includes a supercapacitor first electrode, a supercapacitor second electrode, a first electrolyte, and a metal electrode. The supercapacitor first electrode and the supercapacitor second electrode are parallel to and spaced apart front each other. The metal electrode and the supereapacitor second electrode form an Ohmic contact, the metal electrode is spaced apart from and opposite to the supercapacitor first electrode. | 2020-07-23 |
20200234891 | SELF-CHARGING SUPERCAPACITOR - A self-charging supercapacitor is provided which includes a supercapacitor first electrode, a supercapacitor second electrode, a first electrolyte, and a metal electrode. The supercapacitor first electrode and the supercapacitor second electrode are parallel to and spaced apart from each other. A part of the metal electrode is Ohmic contacted with a surface of the supercapacitor second electrode, and another part of the metal electrode is disposed opposite to the supercapacitor first electrode. | 2020-07-23 |
20200234892 | METHOD FOR CHARGING SELF-CHARGING SUPERCAPACITOR - A method for charging self-charging supercapacitor includes: providing a self-charging supercapacitor which includes a supercapacitor first electrode, a supercapacitor second electrode, a first electrolyte, and a metal electrode; the metal electrode and the supercapacitor second electrode form an Ohmic contact, the metal electrode is spaced apart from and opposite to the supercapacitor first electrode. Electrically connecting the metal electrode and the supercapacitor first electrode with a second electrolyte. | 2020-07-23 |
20200234893 | NEGATIVE ELECTRODE OF POWER STORAGE DEVICE AND POWER STORAGE DEVICE - A mixture of amorphous PAHs and at least one of a carrier ion storage metal, a Sn compound, a carrier ion storage alloy, a metal compound, Si, Sb, and SiO | 2020-07-23 |
20200234894 | CONTROL KEY ASSEMBLY - A control key assembly including a button cover and a weight member is provided. The button cover has a first top surface, a bottom surface and a first assembling structure, wherein the first assembling structure is located on the bottom surface. The weight member has an arc surface and a second assembling structure, the arc surface and the second assembling structure are located on opposite sides of the weight member, wherein the second assembling structure is assembled with the first assembling structure, and the weight of the weight member is greater than the weight of the button cover. | 2020-07-23 |
20200234895 | SWITCH - The problem to be addressed is to provide a highly safe and compact switch that is adapted to improvements in portability, weight reduction and size reduction of machines, or the like. An operating part has a button covering the upper part of a cylindrical housing that receives a downward pushing operation and a rotational operation. A contact unit part has contacts which open by being coupled to the downward pushing operation of the button. A twisting coil spring is disposed on the interior of the button, one end being joined to the housing, and the other end being joined to the button. A latch part disposed to the interior of the twisting coil spring, has a plunger coil spring that expands and contracts in a direction perpendicular to the direction of the downward pushing operation, and when a downward pushing operation is performed on the button, causes a sliding rod to slide along an inner wall of the housing while being displaced in the direction of the downward pushing operation. | 2020-07-23 |
20200234896 | PRESSURE SWITCH - A pressure switch system provides a safety mechanism for equipment at a well site environment to prevent the opening or release of certain components when an unsafe condition exists. A pressure switch assembly of the system includes a diaphragm that transitions to an extended position as pressure of a pressurized fluid is flowed through a fluid pathway of the assembly. The diaphragm couples to a pin that transitions along with a dart based on the pressure at the diaphragm. When pressure reaches or exceeds a threshold, the dart is transitioned to a location proximate to a sensor. The sensor triggers actuation of a switch to prevent release or opening of a remote connector of a hydraulics unit until the pressure is at or falls below the threshold. The threshold is set to a pressure based on the unsafe condition. | 2020-07-23 |
20200234897 | CONTROLLER AND INFORMATION PROCESSING SYSTEM - To provide a controller and an information processing system capable of providing a click feeling and an operation sound with a simpler mechanism. The controller includes a hollow portion, a freely movable first magnet placed in the hollow portion, a second magnet fixed to an outer side of the hollow portion, and a bottom surface having a tilted shape with respect to a ground surface. | 2020-07-23 |
20200234898 | BREAKER AND SAFETY CIRCUIT EQUIPPED WITH THE SAME - A breaker has a movable piece which has an elastic part elastically deformable and a moving contact in one end portion of the elastic part, and which presses the moving contact against the fixed contact so that the moving contact contacts with the fixed contact; a thermally-actuated element deforming with a change in the temperature to actuate the movable piece so that the moving contact is separated from the fixed contact; a case housing the movable piece and the thermally-actuated element; and a terminal piece to be connected to an external circuit. The case has a side wall extending along a longitudinal direction of the elastic part. The terminal piece has a protruding portion which protrudes from the side wall toward the outside of the case. The side wall is provided, in its neighboring portion of the protruding portion, with a concave portion which dents inwardly of the case. | 2020-07-23 |
20200234899 | ELECTROMAGNETIC RELAY UNIT AND ELECTROMAGNETIC RELAY SYSTEM - An electromagnetic relay unit according to the present disclosure includes a first contact device, a second contact device, a first electromagnet device, a second electromagnet device, and a housing accommodating a first contact accommodation part and a second contact accommodation part. A first thermal conduction member is provided between the housing and the first contact accommodation part. A second thermal conduction member is provided between the housing and the second contact accommodation part. | 2020-07-23 |
20200234900 | Electromagnetic Relay - An electromagnetic relay includes a base having a receiving space, an electromagnetic unit disposed outside of the receiving space, a magnetically attractive member magnetically attractable by the electromagnet unit, a first stationary contact disposed in the receiving space, a second stationary contact, a movable terminal member and a movable contact. When the electromagnetic unit is energized, the movable terminal member is pushed by the magnetically attractive member and the movable contact contacts one of the first and second stationary contacts. When the electromagnetic unit is de-energized, the movable contact contacts the other one of the first and second stationary contacts. | 2020-07-23 |
20200234901 | ELECTROMAGNETIC RELAY AND A METHOD OF MAKING THE SAME - An electromagnetic relay includes a base, an electromagnet disposed on the base, an armature unit having a magnetically attractive member magnetically attractable by the electromagnet, a movable terminal unit mounted on the armature unit and including a first terminal member and a first contact, and a stationary terminal member mounted on the base. The first terminal member is a two-piece structure composed of a spring plate and a first leg. A ratio of the thickness of the first leg to the thickness of the spring plate ranges from 2 to 4. When the electromagnet is energized and de-energized, the first contact contacts andmoves away from the second contact, respectively. A method of making the electromagnetic relay is also disclosed. | 2020-07-23 |
20200234902 | CONTACTOR WITH ARC SUPPRESSOR - A contactor includes a housing having an outer wall defining a cavity, fixed contacts and a movable contact within the cavity, and a coil assembly in the cavity operated to move the movable contact between an unmated position and a mating position with the fixed contacts. The contactor includes an arc suppressor in the cavity including a first magnet located in the cavity on a first side of the movable contact and a second magnet located in the cavity on a second side of the movable contact. The first magnet is arranged in the cavity such that a north B-field of the first magnet faces outward toward the outer wall of the housing. The second magnet is arranged in the cavity such that a north B-field of the second magnet faces outward toward the outer wall of the housing. | 2020-07-23 |
20200234903 | HIGH-INSULATION SMALL-SIZED HINGED ELECTROMAGNETIC RELAY - A high-insulation small-sized hinged electromagnetic relay, includes a bobbin, coil terminals, an iron core and a fixed contact block. The bobbin has a cylindrical portion for winding a coil, and the iron core includes a mandrel and a magnetic pole portion arranged on the upper end of the mandrel; the mandrel of the iron core is fitted into the central hole of the cylindrical portion of the bobbin, the coil terminals is assembled on the lower flange of the bobbin and positioned on one side in the width direction of the bobbin, and the fixed contact block is interposed in the upper flange and the lower flange of the bobbin and positioned on the other side in the width direction of the bobbin; the cylindrical portion is offset. | 2020-07-23 |
20200234904 | SYSTEM, APPARATUS, AND METHOD FOR GROUNDING AND PROVIDING AN ELECTRICAL SAFETY CIRCUIT - An apparatus is disclosed. The apparatus has a decorative assembly stand including an assembly supporting a movable assembly, the movable assembly having a cavity, a decorative assembly member that is configured to be removably received in the cavity, a coating that coats a surface of the decorative assembly member, a first fastener, and a second fastener configured to be removably electrically connected to the first fastener. The second fastener is electrically connected to the movable assembly. The first fastener is configured to be received in an aperture of the movable assembly and cut through the coating of the decorative assembly member and contact the surface of the decorative assembly member when the decorative assembly member is received in the cavity of the movable assembly. | 2020-07-23 |
20200234905 | ELECTRIC-POWER CONVERSION APPARATUS - There is provided an electric-power conversion apparatus in which smoke emission, a burnout, and short-circuiting can be suppressed even when a fuse portion is melted by an excessive current and in which it is made possible that heat generated in the fuse portion is less likely to be transferred to the electric power semiconductor device. The electric-power conversion apparatus includes a fuse portion formed in an electrode wiring member, a fuse resin member that covers the fuse portion, and a sealing resin member that seals an electric power semiconductor device and the fuse portion in a case. Along a current-flowing direction, the fuse portion includes an upstream-side first step portion whose cross-sectional area is smaller than that of the portion at the upstream side thereof, a second step portion whose cross-sectional area is smaller than that of the upstream-side first step portion, and a downstream-side first step portion whose cross-sectional area is larger than that of the second step portion but is smaller than that of the portion at the downstream side thereof. | 2020-07-23 |
20200234906 | FUSES AND METHODS OF FORMING FUSES - Exemplary embodiments of the present disclosure of a fuse may include a fuse body having a first portion and a second portion. The first and second portions may be configured to mate together thereby forming an internal cavity. A first inner termination and a second inner termination may be at least partially attachable to the first and second portions of the fuse body at respective first and second ends. A fusible element may be disposed in the cavity of the fuse body and extendable from the first inner termination at the first end of the fuse body to the second inner termination at the second end of the fuse body. The fusible element may be attachable to the first inner termination at a first connection and the second inner termination at a second connection. The first and second connections may be inspectable when the fuse is in an assembled state. | 2020-07-23 |
20200234907 | CHARGED PARTICLE BEAM SOURCE AND A METHOD FOR ASSEMBLING A CHARGED PARTICLE BEAM SOURCE - A charged particle beam source that may include an emitter that has a tip for emitting charged particles; a socket; electrodes; a filament that is connected to the electrodes and to the emitter; electrodes for providing electrical signals to the filament; a support element that is connected to the emitter; and a support structure that comprises one or more interfaces for contacting only a part of the support element while supporting the support element. | 2020-07-23 |
20200234908 | THREE-DIMENSIONAL BEAM FORMING X-RAY SOURCE - X-ray target element is comprised of a planar wafer. The planar wafer element includes a target layer and a substrate layer. The target layer is comprised of an element having a relatively high atomic number and the substrate layer is comprised of diamond. The substrate layer is configured to support the target layer and facilitate transfer of thermal energy away from the target layer. | 2020-07-23 |
20200234909 | Boron X-Ray Window - An x-ray window can include a thin film that comprises boron. The thin film can be relatively thin, such as for example ≤200 nm. This x-ray window can be strong; can have high x-ray transmissivity; can be impervious to gas, visible light, and infrared light; can be easy of manufacture; can be made of materials with low atomic numbers, or combinations thereof. The thin film can include an aluminum layer. A support structure can provide additional support to the thin film. The support structure can include a support frame encircling an aperture and support ribs extending across the aperture with gaps between the support ribs. The support structure can also include boron ribs aligned with the support ribs. | 2020-07-23 |
20200234910 | LOW EMISSION CLADDING AND ION IMPLANTER - An ion implanter. The ion implanter may include a beamline, the beamline defining an inner wall, surrounding a cavity, the cavity arranged to conduct an ion beam. The ion implanter may also include a low emission insert, disposed on the inner wall, and further comprising a | 2020-07-23 |
20200234911 | INTERFEROMETRIC STAGE POSITIONING APPARATUS - A stage apparatus for an e-beam inspection apparatus comprising: an object table ( | 2020-07-23 |
20200234912 | METHODS AND APPARATUSES FOR ADJUSTING BEAM CONDITION OF CHARGED PARTICLES - Apparatus and methods for adjusting beam condition of charged particles are disclosed. According to certain embodiments, the apparatus includes one or more first multipole lenses displaced above an aperture, the one or more first multipole lenses being configured to adjust a beam current of a charged-particle beam passing through the aperture. The apparatus also includes one or more second multipole lenses displaced below the aperture, the one or more second multipole lenses being configured to adjust at least one of a spot size and a spot shape of the beam. | 2020-07-23 |
20200234913 | METHOD OF OPERATING A PARTICLE BEAM SYSTEM, PARTICLE BEAM SYSTEM AND COMPUTER PROGRAM PRODUCT - A method of operating a particle beam microscope includes repeating a sequence to move a particle beam across a surface of an object. The surface of the object has a region defined by a closed boundary line. The sequence includes moving the particle beam from an entry location of the present sequence to an exit location of the present sequence along a scan path. The entry location of the present sequence and the exit location of the present sequence are located on the boundary line. The scan path is located entirely inside the region of the surface of the object. The sequence also includes moving the particle beam from the exit location of the present sequence to an entry location of the next sequence along a return path. The entry location of the next sequence is located on the boundary line. The return path is located entirely outside the region of the surface of the object. | 2020-07-23 |
20200234914 | LOW VOLTAGE SCANNING ELECTRON MICROSCOPE AND METHOD FOR SPECIMEN OBSERVATION - A low voltage scanning electron microscope is disclosed, which includes: an electron source configured to generate an electron beam; an electron beam accelerator configured to accelerate the electron beam; a compound objective lens configured to converge the electron beams accelerated by the electron beam accelerator; a deflection device arranged between the inner wall of the magnetic lens and the optical axis of the electron beam and configured to deflect the electron beam; a detection device comprising a first sub-detection device for receiving secondary and backscattered electrons from the specimen, a second sub-detection device for receiving backscattered electrons, and a control device for changing the trajectories of the secondary electrons and the backscattered electrons; an electrostatic lens comprising the second sub-detection device, a specimen stage, and a control electrode for reducing the moving speed of the electron beam and changing the moving directions of the secondary and the backscattered electrons. | 2020-07-23 |
20200234915 | IMAGE CONTRAST ENHANCEMENT IN SAMPLE INSPECTION - Disclosed herein is a method comprising: depositing a first amount of electric charges into a region of a sample, during a first time period; depositing a second amount of electric charges into the region, during a second time period; while scanning a probe spot generated on the sample by a beam of charged particles, recording from the probe spot signals representing interactions of the beam of charged particles and the sample; wherein an average rate of deposition during the first time period and an average rate of deposition during the second time period are different. | 2020-07-23 |
20200234916 | SCANNING ELECTRON MICROSCOPE AND CALCULATION METHOD FOR THREE-DIMENSIONAL STRUCTURE DEPTH - To measure a depth of a three-dimensional structure, for example, a hole or a groove, formed in a sample without preparing information for each pattern or calibration in advance. The invention provides an electron microscope including a detection unit that detects, among emitted electrons generated from a sample by irradiating the sample with a primary electron beam, emitted electrons of which an emission angle is in a predetermined range, the emission angle being an angle formed between an axial direction of the primary electron beam and an emission direction of the emitted electrons from the sample, and outputs a detection signal corresponding to the number of the emitted electrons which are detected. In the electron microscope, an emission angle distribution of a detection signal is obtained based on a plurality of detection signals output by the detection unit, the detection signals being obtained by detecting the emitted electrons having emission angles in each of the plurality of set ranges of emission angles and generated by irradiating a bottom portion of the three-dimensional structure with the primary electron beam, and an opening angle is obtained based on a change point of the emission angle distribution, the opening angle being an angle formed between an optical axis direction of the primary electron beam and a straight line that passes through an upper end of a side wall of the three-dimensional structure from a position irradiated with the primary electron beam in the bottom portion of the three-dimensional structure. | 2020-07-23 |
20200234917 | LOW EMISSION CLADDING AND ION IMPLANTER - An ion implanter. The ion implanter may include a beamline, the beamline defining an inner wall, surrounding a cavity, the cavity arranged to conduct an ion beam. The ion implanter may also include a low emission insert, disposed on the inner wall, and further comprising a | 2020-07-23 |
20200234918 | NOVEL APPARATUS AND TECHNIQUES FOR GENERATING BUNCHED ION BEAM - An apparatus may include a first grounded drift tube, arranged to accept a continuous ion beam, at least two AC drift tubes, arranged in series, downstream to the first grounded drift tube, and a second grounded drift tube, downstream to the at least two AC drift tubes. The apparatus may include an AC voltage assembly, electrically coupled to at least two AC drift tubes. The AC voltage assembly may include a first AC voltage source, coupled to deliver a first AC voltage signal at a first frequency to a first AC drift tube of at least two AC drift tubes. The AC voltage assembly may further include a second AC voltage source, coupled to deliver a second AC voltage signal at a second frequency to a second AC drift tube of the at least two AC drift tubes, wherein the second frequency comprises an integral multiple of the first frequency. | 2020-07-23 |
20200234919 | MULTIPLE ELECTRON BEAM IRRADIATION APPARATUS, MULTIPLE ELECTRON BEAM INSPECTION APPARATUS, AND MULTIPLE ELECTRON BEAM IRRADIATION METHOD - A multiple electron beam irradiation apparatus includes a first region setting circuit which sets a first frame region of a plurality of first frame regions which can be irradiated with remaining beams after excluding beams in one row and one column at end; a second region setting circuit which sets a second frame region of a plurality of second frame regions each having four corners equivalent to an irradiation position of the defective beam by using normal beams; and an electron beam irradiation mechanism which performs the first multiple electron beam irradiation processing for the each of the plurality of first frame regions of the target object by using the normal beams, and perform second multiple electron beam irradiation processing for each of the plurality of second frame regions by using at least beams at the four corners. | 2020-07-23 |
20200234920 | COIL AND WINDOW FOR PLASMA PROCESSING SYSTEM - An apparatus for processing substrates is provided. A plasma processing chamber is provided. At least one substrate support for supporting at least one substrate is in the plasma processing chamber. At least one gas inlet is provided for flowing gas into the plasma processing chamber. A dielectric window forms a cover for the plasma processing chamber. The dielectric window comprises an outer dielectric window ring with a central aperture and an inner concaved dielectric window extending across the central aperture, wherein the inner concaved dielectric window forms a volume in fluid communication with an interior of the plasma processing chamber, and wherein the at least one gas inlet flows gas into the volume of the inner concaved dielectric window. An outer coil assembly is adjacent to the outer dielectric window ring. An inner coil assembly surrounds the inner concaved dielectric window. | 2020-07-23 |
20200234921 | Feedback loop for controlling a pulsed voltage waveform - Embodiments of this disclosure describe a feedback loop that can be used to maintain a nearly constant sheath voltage and thus creating a mono-energetic IEDF at the surface of the substrate. The system described herein consequently enables a precise control over the shape of IEDF and the profile of the features formed in the surface of the substrate. | 2020-07-23 |
20200234922 | APPARATUS AND METHOD OF GENERATING A PULSED WAVEFORM - Embodiments of this disclosure describe a feedback loop that can be used to maintain a nearly constant sheath voltage and thus creating a mono-energetic IEDF at the surface of the substrate. The system described herein consequently enables a precise control over the shape of IEDF and the profile of the features formed in the surface of the substrate. | 2020-07-23 |
20200234923 | APPARATUS AND METHOD OF FORMING PLASMA USING A PULSED WAVEFORM - Embodiments of this disclosure describe a feedback loop that can be used to maintain a nearly constant sheath voltage and thus creating a mono-energetic IEDF at the surface of the substrate. The system described herein consequently enables a precise control over the shape of IEDF and the profile of the features formed in the surface of the substrate. | 2020-07-23 |
20200234924 | PLASMA PROCESSING APPARATUS - A plasma processing apparatus with improved yield, adapted to include a vacuum container, a processing chamber disposed inside thereof, and in which a plasma is formed, a sample table disposed in the processing chamber and on which a sample is placed, two electrodes which have a film shape, disposed within the sample table, and to which power for attracting the sample is supplied so that different polarities are formed, a coiled portion in which two power supply lines are wound in parallel around the same axis, and a bypass line which connects the two power supply lines between the coiled portion and the two electrodes and has a capacitor. | 2020-07-23 |
20200234925 | PLASMA PROCESSING APPARATUS AND PLASMA PROCESSING METHOD - A plasma processing apparatus according to an exemplary embodiment includes a chamber, a substrate support, an upper electrode, a radio frequency power source, and a direct-current power source device. The substrate support includes a lower electrode. The lower electrode is provided in the chamber. The upper electrode is provided above the substrate support. The radio frequency power source generates a plasma in the chamber. The direct-current power source device is electrically connected to the upper electrode. The direct-current power source device is configured to periodically generate a pulsed negative direct-current voltage. An output voltage of the direct-current power source device is alternately switched between a negative direct-current voltage and zero volts. | 2020-07-23 |
20200234926 | IMPEDANCE MATCHING NETWORK AND METHOD - In one embodiment, the present disclosure may be directed to a matching network coupled to an RF source and a plasma chamber and including an electronically variable capacitor (EVC) and a control circuit. The control circuit receives parameter signals and determines corresponding parameter values. For each parameter value, the control circuit determines whether the parameter value is relevant to the matching activity and whether the parameter value is relevant to a second activity of the matching network. The matching network carries out the matching activity based on the parameter values determined to be relevant to the matching activity, and carries out the second activity based on the parameter values determined to be relevant to the second activity. | 2020-07-23 |
20200234927 | IMPEDANCE MATCHING NETWORK AND METHOD - In one embodiment, the present disclosure is directed to a method for impedance matching. The RF source provides at least two repeating, non-zero pulse levels, including a high-priority pulse level and a low-priority pulse level. The matching network comprises at least one EVC, which comprises discrete capacitors configured to switch in and out to provide a plurality of match configurations. Each EVC has a switching limit comprising a predetermined number of switches in or out of the EVC's discrete capacitors in a prior time interval. Upon determining that switching to a new match configuration would cause an EVC to reach the switching limit, the method determines whether the new match configuration is for the low- or high-priority pulse level. If for the low-priority pulse level, the method prevents the switching of the EVC. If for the high-priority pulse level, the method switches the EVC to the new match configuration. | 2020-07-23 |
20200234928 | SEMICONDUCTOR PLASMA PROCESSING EQUIPMENT WITH WAFER EDGE PLASMA SHEATH TUNING ABILITY - Embodiments of the disclosure generally include methods and apparatuses that improve the etch rate uniformity across a surface of a substrate by controlling the shape of a plasma sheath formed across a substrate, such as a semiconductor wafer, during plasma processing. Embodiments of the disclosure will include the adjustment of one or more plasma processing variables and/or the adjustment of the configuration of process kit hardware that is in close proximity to a substrate and/or supports the substrate during processing. Furthermore, embodiments of the disclosure will include replacement of only a small number of consumable parts within the process kit hardware while the remaining parts of the process kit hardware are reused for long periods of time without venting the process chamber. The replacement of the consumable parts can be completed using an automated method of swapping used parts without venting process chamber. | 2020-07-23 |
20200234929 | PLASMA PROCESSING APPARATUS AND METHOD FOR MEASURING MISALIGNMENT OF RING MEMBER - A mounting table has a first surface for mounting jigs one by one and a second surface for mounting a ring member. An acquisition unit acquires a gap dimension between the second surface and a facing portion of the mounted jig. A measurement unit measures a lifted distance of the ring member at each of circumferential multiple locations when an upper surface of the ring member is in contact with the facing portion. A thickness calculation unit calculates, for each of the multiple locations, thickness at each of different radial positions of the ring member based on the gap dimension and the lifted distance. A misalignment calculation unit specifies a characteristic position of the ring member for each of the multiple locations based on the calculated thickness and calculate a misalignment amount between a center of a circle passing through the characteristic positions and a center of the first surface. | 2020-07-23 |
20200234930 | UPPER ELECTRODE AND PLASMA PROCESSING APPARATUS - An upper electrode for a plasma processing apparatus, includes an electrode having a gas discharge hole, a gas plate having a gas flow path formed at a position facing the gas discharge hole to supply a processing gas to the gas discharge hole, an electrostatic attraction part interposed between the electrode and the gas plate and having a contact surface that is in contact with a lower surface of the gas plate and an attraction surface that attracts an upper surface of the electrode, and a shield that shields radicals or gas moving from the gas discharge hole to a gap between the electrode and the gas plate. | 2020-07-23 |
20200234931 | Method for Controlling Electrostatic Attractor and Plasma Processing Apparatus - A method for controlling an electrostatic attractor, which attracts an electrode to a gas plate provided in an upper portion of a plasma processing apparatus, includes, among a plasma generation period in which plasma is generated by the plasma processing apparatus and an idle period in which no plasma is generated by the plasma processing apparatus, applying voltages having polarities different from each other to first and second electrodes of the electrostatic attractor in at least the idle period. | 2020-07-23 |
20200234932 | HEATED PEDESTAL DESIGN FOR IMPROVED HEAT TRANSFER AND TEMPERATURE UNIFORMITY - Embodiments of the present disclosure generally relate to a pedestal for increasing temperature uniformity in a substrate supported thereon. The pedestal comprises a body having a heater embedded therein. The body comprises a patterned surface that includes a first region having a first plurality of posts extending from a base surface of the body at a first height, and a second region surrounding the central region having a second plurality of posts extending from the base surface at a second height that is greater than the first height, wherein an upper surface of each of the first plurality of posts and the second plurality of posts are substantially coplanar and define a substrate receiving surface. | 2020-07-23 |
20200234933 | GAS SUPPLY DEVICE - A gas supply device according to an embodiment comprises a first gas supplier connected to a process chamber processing a substrate, and incorporating therein first and second electrodes each generating a process gas to be supplied to the process chamber. A first pipe is interposed between the first electrode and the process chamber. A second pipe is interposed between the first electrode and a discharging part. A third pipe is interposed between the second electrode and the process chamber. A fourth pipe is interposed between the second electrode and the discharging part. A second gas supplier is connectable to the second and fourth pipes. | 2020-07-23 |
20200234934 | INTERCHANGEABLE MAGNET PACK - An apparatus includes a target, wherein the target includes a nonuniform erosion profile. The apparatus also includes a number of interchangeable magnetic and non-magnetic inserts. The interchangeable magnetic and non-magnetic inserts are configured to control a pass through flux based on the nonuniform erosion profile. | 2020-07-23 |
20200234935 | TRANSMISSIVE PHOTOCATHODE AND ELECTRON TUBE - A transmissive photocathode includes a light transmitting substrate that has a first surface on which light is incident and a second surface which emits light incident from a side of the first surface, a photoelectric conversion layer that is provided on the second surface side of the light transmitting substrate and converts the light emitted from the second surface into photoelectrons, a light transmitting conductive layer that is provided between the light transmitting substrate and the photoelectric conversion layer and is composed of a single-layered graphene, and a thermal stress alleviation layer that is provided between the photoelectric conversion layer and the light transmitting conductive layer and has light transmissivity. A thermal expansion coefficient of the thermal stress alleviation layer is smaller than a thermal expansion coefficient of the photoelectric conversion layer and larger than a thermal expansion coefficient of the graphene. | 2020-07-23 |
20200234936 | Dynamic Equilibration Time Calculation to Improve MS/MS Dynamic Range - Dynamic skimmer pulsing and dynamic equilibration times are used for MS and MS/MS scans. A target percentage transmission of the ion beam is calculated based on a previous percentage transmission and a previous TIC or a previous highest intensity of a previous cycle time. An equilibration time is calculated based on the current percentage transmission and the target percentage transmission. A skimmer of a tandem mass spectrometer is controlled to attenuate the ion beam to the target percentage transmission to prevent saturation of a detector of the tandem mass spectrometer and to increase the dynamic range of the tandem mass spectrometer. The tandem mass spectrometer is controlled to perform an MS scan or an MS/MS scan after the calculated equilibration time to reduce the cycle time. | 2020-07-23 |
20200234937 | INTERACTIVE ANALYSIS OF MASS SPECTROMETRY DATA - This invention relates to graphical user-interactive analysis of data, including in particular, mass spectrographic data analysis, as well as methods and software for generating and using such. One aspect provides user-customizable reports, including methods and apparatuses for generating customizable pivot tables and graphs specific to mass spectrographic data. | 2020-07-23 |
20200234938 | TECHNIQUES OF MASS SPECTROMETRY FOR ISOTOPOMER ANALYSIS AND RELATED SYSTEMS AND METHODS - According to some aspects, a spectrometer is provided, the spectrometer configured to receive molecules of a plurality of metabolites including one or more molecules of a first metabolite, filter the received molecules to retain molecules of the first metabolite including a plurality of different mass isotopomers of the first metabolite, fragment molecules of a first mass isotopmer of the retained molecules to produce a first plurality of daughter ions, measure abundances of the first plurality of daughter ions as a function of daughter ion mass, fragment molecules of a second istopomer, different from the first mass isotopmer, of the retained molecules to produce a second plurality of daughter ions, and measure abundances of the second plurality of daughter ions as a function of the daughter ion mass. | 2020-07-23 |
20200234939 | MASS SPECTROMETER COMPONENTS INCLUDING PROGRAMMABLE ELEMENTS AND DEVICES AND SYSTEMS USING THEM - Certain configurations of mass spectrometer components are described herein that comprise one or more mass spectrometer programmable elements. In some instances, the mass spectrometer programmable element can be configured as an electrode that can function independently of any underlying substrate or component. Ion guides, lenses, ion switches, mass analyzers and other components of a mass spectrometer are described which comprise one or more mass spectrometer programmable elements. | 2020-07-23 |
20200234940 | ESI SPRAYER AND IONIZER - An ESI sprayer | 2020-07-23 |
20200234941 | ULTRAVIOLET STERILIZER - The present invention has as its object the provision of an ultraviolet sterilizer that can reduce ultraviolet light in a wavelength region of 230 to 300 nm, which is harmful to the human body, and can output effective light in a wavelength region of 200 to 230 nm with high emission intensity. | 2020-07-23 |
20200234942 | INFRARED DEVICE - The invention relates to an infrared device comprising a resistive element suspended in a cavity formed in a main element, and capable of transmitting infrared radiation when it is fed with an electric current. In particular, the main element is at least partly covered on the outer surface thereof and/or the inner surface thereof with a reflective coating. The use of the reflective coating makes it possible to at least partly contain infrared radiation transmitted by the resistive element in the cavity. | 2020-07-23 |
20200234943 | Methods For Depositing Blocking Layers On Metal Surfaces - Methods of enhancing selective deposition are described. In some embodiments, a blocking layer is deposited on a metal surface before deposition of a dielectric. In some embodiments, a metal surface is functionalized to enhance or decrease its reactivity. | 2020-07-23 |
20200234944 | METHOD FOR FABRICATING HETEROEPITAXIAL SEMICONDUCTOR MATERIAL ON A MICA SHEET - A method for fabricating heteroepitaxial semiconductor material on a mica sheet is disclosed. Firstly, a mica substrate is provided. Then, at least one semiconductor film is deposited on the mica substrate to form a flexible substrate whose flexibility is applied to various applications, such as wearable devices, portable photoelectric equipment, or improving the speed and bandwidth of commercial and military systems, such that the flexible substrate has the competitiveness in the market. | 2020-07-23 |
20200234945 | POLYCRYSTALLINE CERAMIC SUBSTRATE AND METHOD OF MANUFACTURE - A method of fabricating a ceramic substrate structure includes providing a ceramic substrate, encapsulating the ceramic substrate in a barrier layer, and forming a bonding layer coupled to the barrier layer. The method further includes removing a portion of the bonding layer to expose at least a portion of the barrier layer and define fill regions, and depositing a second bonding layer on the at least a portion of the exposed barrier layer and the fill regions. | 2020-07-23 |
20200234946 | SEMICONDUCTOR DEVICE HAVING A PLANAR III-N SEMICONDUCTOR LAYER AND FABRICATION METHOD - A semiconductor device having a planar III-N semiconductor layer, comprising a substrate comprising a wafer ( | 2020-07-23 |
20200234947 | METHOD OF FORMING MASK PATTERN AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME - A method of forming a mask pattern and a method of fabricating a semiconductor device, the method of forming a mask pattern including providing a substrate including a plurality of patterns thereon; forming a mask material solution layer such that the mask material solution layer covers the patterns on the substrate; and applying a liquid material to remove an upper portion of the mask material solution layer, wherein the mask material solution layer includes a fluorine additive concentrated at the upper portion of the mask material solution layer. | 2020-07-23 |
20200234948 | LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PRODUCING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD - A lithographic printing plate precursor including an image recording layer containing an infrared absorber represented by Formula I, on a support, and a method of producing a lithographic printing plate and a lithographic printing method using the lithographic printing plate precursor. | 2020-07-23 |
20200234949 | FORMING HIGH CARBON CONTENT FLOWABLE DIELECTRIC FILM WITH LOW PROCESSING DAMAGE - A method of fabricating a dielectric film includes depositing a first precursor on a substrate. The first precursor includes a cyclic carbosiloxane group comprising a six-membered ring. The method also includes depositing a second precursor on the substrate. The first precursor and the second precursor form a preliminary film on the substrate, and the second precursor includes silicon, carbon, and hydrogen. The method further includes exposing the preliminary film to energy from an energy source to form a porous dielectric film. | 2020-07-23 |
20200234950 | Methods For Selective Deposition On Silicon-Based Dielectrics - Methods of selectively depositing a film on a hydroxide terminated surface relative to a hydrogen terminated surface are described. The hydrogen terminated surface is exposed to a nitriding agent to form an amine terminated surface which is exposed to a blocking molecule to form a blocking layer on the surface. A film can then be selectively deposited on the hydroxide terminated surface. | 2020-07-23 |
20200234951 | METHOD FOR DEPOSITING AN INSULATING MATERIAL INTO A VIA - A method for depositing a layer of a material onto a substrate, comprising: one gas-phase injection of a first chemical species with a precursor of such insulating material, into a deposition chamber of a chemical vapor deposition reactor, through a first injection path, according to a first pulse sequence; one gas-phase injection of a second chemical species with a reactant adapted to react with such precursor, into the deposition chamber, through a second injection path, according to a second pulse sequence which is phase-shifted relative to the first pulse sequence; one sequential generation of a plasma of the first chemical species and/or the second chemical species during at least one pulse of at least one of the first and second sequences, with such plasma being generated from a high frequency (HF) plasma source and a low frequency (LF) plasma source applied to the first and second injection paths, the low frequency (LF) plasma source power on the high frequency (HF) plasma source power ratio being above 1. | 2020-07-23 |
20200234952 | SEMICONDUCTOR DEVICES HAVING HETEROJUNCTIONS OF AN ALUMINUM GALLIUM NITRIDE TERNARY ALLOY LAYER AND A SECOND III NITRIDE TERNARY ALLOY LAYER - A method for forming a semiconductor device having a heterojunction of a first III-nitride ternary alloy layer arranged on a second III-nitride ternary alloy layer is provided. A range of concentrations of III-nitride elements for the first and second III-nitride ternary alloy layers is determined so that the absolute value of the polarization difference at the interface of the heterojunction of the first and second III-nitride ternary alloy layers is less than or equal to 0.007 C/m | 2020-07-23 |