Inventors list
Assignees list
Classification tree browser
Top 100 Inventors
Top 100 Assignees
29th week of 2020 patent applcation highlights part 58
Patent application number
Title
Published
20200227338
MULTILAYERED THERMAL INTERFACE MATERIAL (TIM) WITH REDUCED THERMAL RESISTANCE
2020-07-16
20200227339
Interface Material Having a Polymer Ceramic
2020-07-16
20200227340
SEMICONDUCTOR PACKAGE STRUCTURE AND A METHOD OF MANUFACTURING THE SAME
2020-07-16
20200227341
DIRECT LIQUID MICRO JET (DLMJ) STRUCTURES FOR ADDRESSING THERMAL PERFORMANCE AT LIMITED FLOW RATE CONDITIONS
2020-07-16
20200227342
SEMICONDUCTOR STRUCTURE
2020-07-16
20200227343
SEMICONDUCTOR DEVICE PACKAGE
2020-07-16
20200227344
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
2020-07-16
20200227345
SEMICONDUCTOR DEVICE
2020-07-16
20200227346
SUBSTRATE STRUCTURE WITH HIGH-DENSITY WIRING AND MANUFACTURING METHOD THEREOF
2020-07-16
20200227347
SEMICONDUCTOR MEMORY DEVICE
2020-07-16
20200227348
MULTIPLE LAYER METAL-INSULATOR-METAL (MIM) STRUCTURE
2020-07-16
20200227349
DEVICES AND METHODS OF VERTICAL INTEGRATIONS OF SEMICONDUCTOR CHIPS, MAGNETIC CHIPS, AND LEAD FRAMES
2020-07-16
20200227350
DUMMY FILL SCHEME FOR USE WITH PASSIVE DEVICES
2020-07-16
20200227351
INTEGRATED CIRCUIT CHIP
2020-07-16
20200227352
SEMICONDUCTOR DEVICE
2020-07-16
20200227353
POWER ISLAND SEGMENTATION FOR SELECTIVE BOND-OUT
2020-07-16
20200227354
SEMICONDUCTOR DEVICE AND METHOD TO FABRICATE THE SEMICONDUCTOR DEVICE
2020-07-16
20200227355
Through-Core Via
2020-07-16
20200227356
Very Thin Embedded Trace Substrate-System in Package (SIP)
2020-07-16
20200227357
Method of Forming Semiconductor Device
2020-07-16
20200227358
ELECTROMAGNETIC WAVE ATTENUATOR AND ELECTRONIC DEVICE
2020-07-16
20200227359
INTEGRATED CIRCUIT CHIP, INTEGRATED CIRCUIT PACKAGE AND DISPLAY APPARATUS INCLUDING THE INTEGRATED CIRCUIT CHIP
2020-07-16
20200227360
WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE SHIELDING
2020-07-16
20200227361
SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
2020-07-16
20200227362
REFLOWABLE GRID ARRAY WITH HIGH SPEED FLEX CABLES
2020-07-16
20200227363
SEMICONDUCTOR DEVICE, HIGH-FREQUENCY POWER AMPLIFIER, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2020-07-16
20200227364
METHODS RELATED TO DUAL-SIDED MODULE WITH LAND-GRID ARRAY (LGA) FOOTPRINT
2020-07-16
20200227365
SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME
2020-07-16
20200227366
MICROELECTRONIC DEVICES WITH HIGH FREQUENCY COMMUNICATION MODULES HAVING COMPOUND SEMICONDUCTOR DEVICES INTEGRATED ON A PACKAGE FABRIC
2020-07-16
20200227368
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
2020-07-16
20200227369
STRUCTURES FOR BONDING A GROUP III-V DEVICE TO A SUBSTRATE BY STACKED CONDUCTIVE BUMPS
2020-07-16
20200227370
BUMP STRUCTURES FOR HIGH DENSITY FLIP CHIP INTERCONNECTION
2020-07-16
20200227371
SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THEREOF
2020-07-16
20200227372
METHODS RELATED TO MANAGING PARASITIC CAPACITANCE AND VOLTAGE HANDLING OF STACKED RADIO FREQUENCY DEVICES
2020-07-16
20200227373
LIGHT EMITTING DEVICE PACKAGE
2020-07-16
20200227374
FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
2020-07-16
20200227375
MICROELECTRONIC DEVICE HAVING PROTECTED CONNECTIONS AND MANUFACTURING PROCESS THEREOF
2020-07-16
20200227376
FOWBCSP CHIP MODULE WITH PACKAGING STRUCTURE AND MANUFACTURING METHOD OF THE SAME
2020-07-16
20200227377
MICROELECTRONIC ASSEMBLIES
2020-07-16
20200227378
METHOD OF MANUFACTURING AN ELECTRONIC DEVICE AND ELECTRONIC DEVICE MANUFACTURED THEREBY
2020-07-16
20200227379
METHOD AND APPARATUS FOR BONDING SEMICONDUCTOR SUBSTRATE
2020-07-16
20200227380
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2020-07-16
20200227381
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
2020-07-16
20200227382
METHOD FOR FORMING AN ELECTRICAL CONNECTION BETWEEN AN ELECTRONIC CHIP AND A CARRIER SUBSTRATE AND ELECTRONIC DEVICE
2020-07-16
20200227383
Semiconductor Device and Method of Using a Standardized Carrier to Form Embedded Wafer Level Chip Scale Packages
2020-07-16
20200227384
MICROELECTRONIC ASSEMBLIES
2020-07-16
20200227385
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
2020-07-16
20200227386
DUAL RDL STACKED DIE PACKAGE USING VERTICAL WIRE
2020-07-16
20200227387
POWER ENHANCED STACKED CHIP SCALE PACKAGE SOLUTION WITH INTEGRATED DIE ATTACH FILM
2020-07-16
20200227388
Semiconductor Packages, and Methods for Forming Semiconductor Packages
2020-07-16
20200227389
3D PROCESSOR
2020-07-16
20200227390
METHOD FOR FABRICATING ELECTRONIC PACKAGE WITH CONDUCTIVE PILLARS
2020-07-16
20200227391
ELECTRONIC DEVICE
2020-07-16
20200227392
LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
2020-07-16
20200227393
SYSTEM IN PACKAGE WITH INTERCONNECTED MODULES
2020-07-16
20200227394
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
2020-07-16
20200227395
LED DEVICE AND LIGHT EMITTING APPARATUS INCLUDING THE SAME
2020-07-16
20200227396
MULTI-LAYER SILICON/GALLIUM NITRIDE SEMICONDUCTOR
2020-07-16
20200227397
SEMICONDUCTOR DIE STACKING USING VERTICAL INTERCONNECTION BY THROUGH-DIELECTRIC VIA STRUCTURES AND METHODS FOR MAKING THE SAME
2020-07-16
20200227398
SEMICONDUCTOR MEMORY DEVICE
2020-07-16
20200227399
METHOD OF FABRICATING A PLURALITY OF LINEAR ARRAYS WITH SUBMICRON Y-AXIS ALIGNMENT
2020-07-16
20200227400
ASSEMBLING OF CHIPS BY STACKING WITH ROTATION
2020-07-16
20200227401
MICROELECTRONIC ASSEMBLIES
2020-07-16
20200227402
ZENER DIODES AND METHODS OF MANUFACTURE
2020-07-16
20200227403
DOUBLE-INTEGRATED SILICON CONTROL RECTIFIER TRANSISTOR AND RELATED METHODS
2020-07-16
20200227404
VERTICAL RESISTOR ADJACENT INACTIVE GATE OVER TRENCH ISOLATION
2020-07-16
20200227405
SEMICONDUCTOR DEVICE
2020-07-16
20200227406
SEMICONDUCTOR DEVICE
2020-07-16
20200227407
INTEGRATION OF III-N TRANSISTORS AND POLYSILICON RESISTORS
2020-07-16
20200227408
TRACKING TEMPERATURE COMPENSATION OF AN X/Y STRESS INDEPENDENT RESISTOR
2020-07-16
20200227409
SEMICONDUCTOR DEVICE
2020-07-16
20200227410
SEMICONDUCTOR DEVICE
2020-07-16
20200227411
TRANSISTOR AND LOGIC GATE
2020-07-16
20200227412
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
2020-07-16
20200227413
FIN PATTERNING FOR ADVANCED INTEGRATED CIRCUIT STRUCTURE FABRICATION
2020-07-16
20200227414
SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME
2020-07-16
20200227415
Memory Device Having Electrically Floating Body Transistor
2020-07-16
20200227416
3D 1T1C STACKED DRAM STRUCTURE AND METHOD TO FABRICATE
2020-07-16
20200227417
Integrated Assemblies Having Threshold-Voltage-Inducing-Structures Proximate Gated-Channel-Regions, and Methods of Forming Integrated Assemblies
2020-07-16
20200227418
SEMICONDUCTOR MEMORY DEVICES
2020-07-16
20200227419
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
2020-07-16
20200227420
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
2020-07-16
20200227421
INTEGRATED CIRCUIT DEVICE INCLUDING FIELD ISOLATION LAYER AND METHOD OF MANUFACTURING THE SAME
2020-07-16
20200227422
CONDUCTIVE LAYERS WITH DIFFERENT THICKNESSES
2020-07-16
20200227423
Ferroelectric Devices and Methods of Forming Ferroelectric Devices
2020-07-16
20200227424
MULTIPLE-TIME PROGRAMMABLE (MTP) MEMORY DEVICE WITH A WRAP-AROUND CONTROL GATE
2020-07-16
20200227425
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING
2020-07-16
20200227426
BOUNDARY STRUCTURE FOR EMBEDDED MEMORY
2020-07-16
20200227427
SEMICONDUCTOR DEVICES AND METHODS OF FABRICATION
2020-07-16
20200227428
DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS
2020-07-16
20200227429
VERTICAL STRING DRIVER WITH EXTENDED GATE JUNCTION STRUCTURE
2020-07-16
20200227430
VERTICAL SEMICONDUCTOR DEVICE
2020-07-16
20200227431
SEMICONDUCTOR MEMORY DEVICE
2020-07-16
20200227432
CRENELLATED CHARGE STORAGE STRUCTURES FOR 3D NAND
2020-07-16
20200227433
METHODS AND APPARATUS FOR THREE-DIMENSIONAL NAND STRUCTURE FABRICATION
2020-07-16
20200227434
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE AND METHOD OF MANUFACTURING THE SAME
2020-07-16
20200227435
SEMICONDUCTOR DEVICE
2020-07-16
20200227436
METHOD OF FORMING A MEMORY DEVICE
2020-07-16
20200227437
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
2020-07-16
20200227438
THREE-DIMENSIONAL SEMICONDUCTOR MEMORY DEVICE
2020-07-16